High performance Regulators for PCs Switching Regulator Controller for Graphic Chip Cores BD9560MUV No.10030ECT10 Description BD9560MUV is a switching regulator controller with high output current which can achieve low output voltage (0.412V ~ 1.2875V) from a wide input voltage range (4.5V ~ 25V). The setting of output voltage depends on DAC built in. High efficiency for the switching regulator can be realized by utilizing an external N-MOSFET power transistor. SLLM (Simple Light Load Mode) technology is also integrated to improve efficiency in light load mode, providing high efficiency over a wide load range. For protection and ease of use, the soft start function, variable frequency function, short circuit protection function with timer latch, over voltage protection, over current protection and power good function are all built in. This switching regulator is specially designed for GMCH. Features 1) Switching Regulator Controller 2) Light Load Mode and Continuous Mode Changeable 3) Thermal Shut Down circuit built-in (TSD) 4) Under Voltage Lockout circuit built-in (UVLO) 5) Over Current Protection circuit built-in (OCP) 6) Over Voltage Protection circuit built-in (OVP) 7) Short circuit protection with timer-latch built-in 8) Power good circuit built-in 9) Soft start function to minimize rush current during startup 10) Switching Frequency Variable (f=200 KHz ~ 600 KHz) 11) VQFN032V5050 package Applications Laptop PC, Desktop PC, Digital Components Maximum Absolute Ratings (Ta=25) Parameter Input voltage 1 Input voltage 2 Input voltage 3 BOOT voltage BOOT-SW voltage HG-SW voltage LG voltage VREF voltage VRON input voltage Logic input voltage Logic output voltage 1 Logic output voltage 2 Power dissipation1 Power dissipation2 Operating Temperature Range Storage Temperature Range Junction Temperature Symbol VCC PVCC VIN BOOT BOOT-SW HG-SW LG VREF VRON CL/SCP/SS/TON/SLLM/VID4-0/PWRGD_C/DAC_C PWRGD SUS_OUT Pd1 Pd2 Topr Tstg Tjmax Ratings *1*2 7 7 *1*2 35 *1*2 35 *1*2 7 *1*2 7 *1*2 PVCC VCC 7 *1 VCC 7 VCC 0.38*3 0.88*4 -10 ~ +100 -55 ~ +150 +150 Unit V V V V V V V V V V V V W W *1 Not to exceed Pd.. *2 Maximum voltage that can be proof against instantaneous applied voltage such as serge, back electromotive voltage or continuous pulse applied voltage (Duty ratio : less than 10%) *3 Reduced by 3.0mW for each increase in Ta of 1 over 25 (when don't mounted on a heat radiation board ) *4 Reduced by 7.0mW for increase in Ta of 1 over 25. (when mounted on a board 70.0mmx70mmx1.6mm Glass-epoxy PCB.) www.rohm.com (c) 2010 ROHM Co., Ltd. All rights reserved. 1/21 2010.04 - Rev.C Technical Note BD9560MUV Operating Conditions (Ta=25) Parameter Ratings Symbol Min. Max. Unit Input voltage 1 VCC 4.5 5.5 V Input voltage 2 PVCC 4.5 5.5 V Input voltage 3 VIN 4.5 25 V BOOT voltage BOOT 4.5 30 V SW voltage SW -2 25 V BOOT-SW 4.5 5.5 V VRON input voltage VRON -0.3 5.5 V Logic input voltage BOOT-SW voltage CL/SCP/SS/TON/SLLM/VID4-0/PWRGD_C/DAC_C -0.3 VCC+0.3 V Logic output voltage 1 PWRGD - 5.5 V Logic output voltage 2 SUS_OUT -0.3 VCC V *This product should not be used in a radioactive environment. ELECTRICAL CHARACTERISTICS (Unless otherwise noted, Ta=25, VCC=5V,VIN=12V, VRON=5V,VDAC=1.2811V,SLLM=0V) Limits Parameter Symbol Unit MIN. TYP. MAX. Conditions [Total block] VCC bias current ICC_VCC - 4 10 mA VCC=5V VIN bias current ICC_VIN - 20 50 A VIN=12V VCC shut down mode current IST_VCC - 0 10 A VRON=0V VIN shut down mode current IST_VIN - 0 10 A VRON=0V VRON low voltage VRON_L GND - 0.8 V VRON high voltage VRON_H 2.3 - 5.5 V VRON bias current IVRON - 10 20 A VRON=5V Reference output voltage VREF 2.475 2.500 2.525 V IREF=0 to 100A Maximum source current [Reference voltage block] IREF_source 0.5 - - mA Line regulation Reg.l - 0.1 0.3 %/V VCC=4.5 to 5.5V Load regulation Reg.L - 5 20 mV IREF=0 to 0.5mA Threshold voltage VOVPL 1.400 1.500 1.600 V Hysterisys voltage VOVPH 50 150 250 mV VCC input threshold voltage VCC_UVLO 4.0 4.1 4.2 V VCC hysterics voltage dVCC_UVLO 50 100 200 mV [Over voltage protection block] [Under voltage lock-out block] VCC: Sweep up VCC: Sweep down [VID block] VID input high voltage VVID_H 2.0 - VCC V VID input low voltage VVID_L GND - 0.8 V VID bias current IVID - 0 1 A DAC delay charge current IDAC+ 90 170 250 A VVID=3.3V DAC output voltage VDAC 1.2683 1.2811 1.2939 V VFB VDAC-0.5% VDAC VDAC+0.5% V Current limit threshold1 Ilim 22 30 38 mV CL=0.48V CL adjustment range CL bias current VCL ICL 0.2 - 0 1.5 1 V A CL=5V VID[0:4]=0V [Error amplifier block] Output feedback voltage [Current limit protection block] www.rohm.com (c) 2010 ROHM Co., Ltd. All rights reserved. 2/21 2010.04 - Rev.C Technical Note BD9560MUV ELECTRICAL CHARACTERISTICS (Unless otherwise noted, Ta=25, VCC=5V,VIN=12V, VRON=5V,VDAC=1.2811V,SLLM=0V) Limits Unit Parameter Symbol MIN. TYP. MAX. Conditions [Load slope setup block] Offset voltage VLS TBD 0 TBD mV Delay time TSS - 65 - s SS Delay charge current ISS 1.5 2.0 2.5 A Delay time TSCP - 60 - s SCP Delay charge current ISCP 1.5 2.0 2.5 A [Soft start block] Css=100pF [Short circuit Protection] Cscp=100pF [SLLM block] Continuous mode threshold Vthcon GND - 0.5 V VthSL2M VCC-0.5 - VCC V Fosc - 300 - kHz TON=1V On time pulse width Fosc 250 350 450 ns TON=1V TON adjustment voltage VTON 0.2 - 2.0 V TON bias current ITON - 0 1 A MinOff 0.25 0.5 1.0 s HG high side ON resistor RonHGH - 1 2 HG low side ON resistor RonHGL - 1 2 LG high side ON resistor RonLGH - 1 2 LG high side ON resistor RonLGL - 0.5 1 PWRGD Low threshold voltage PGDLow VDAC-0.4 VDAC-0.3 VDAC-0.2 V PWRGD High threshold voltage PGDHigh VDAC+0.1 VDAC+0.2 VDAC+0.3 V PWRGD Output voltage VPWRGD - - 0.4 V IPRGD=4mA PWRGD Output leakage current PGDLeak - - 10 A PWRGD=3.6V PWRGD_C Delay charge current IPD 1.5 2.0 2.5 A SLLM threshold [Operating frequency] Switching frequency [On time pulse width] TON=5V [OFF time width] Min off time [Driver block] [Power good block] www.rohm.com (c) 2010 ROHM Co., Ltd. All rights reserved. 3/21 2010.04 - Rev.C Technical Note BD9560MUV DAC code table Render Suspend States Render Performance States State VRON VID4 VID3 VID2 VID1 VID0 VCCGFX 1 0 0 0 0 0 1.28750V 1.2811V 0 1 0 0 0 0 1 1.26175V 1.2554V 0 1 0 0 0 1 0 1.23600V 1.2298V 0 1 0 0 0 1 1 1.21025V 1.2042V 0 1 0 0 1 0 0 1.18450V 1.1786V 0 1 0 0 1 0 1 1.15875V 1.1530V 0 1 0 0 1 1 0 1.13300V 1.1273V 0 1 0 0 1 1 1 1.10725V 1.1017V 0 1 0 1 0 0 0 1.08150V 1.0761V 0 1 0 1 0 0 1 1.05575V 1.0505V 0 1 0 1 0 1 0 1.03000V 1.0249V 0 1 0 1 0 1 1 1.00425V 0.9992V 0 1 0 1 1 0 0 0.97850V 0.9736V 0 1 0 1 1 0 1 0.95275V 0.9480V 0 1 0 1 1 1 0 0.92700V 0.9224V 0 1 0 1 1 1 1 0.90125V 0.8967V 0 1 1 0 0 0 0 0.87550V 0.8711V 0 1 1 0 0 0 1 0.84975V 0.8455V 0 1 1 0 0 1 0 0.82400V 0.8199V 1 1 1 0 0 1 1 0.79825V 0.7943V 1 1 1 0 1 0 0 0.77250V 0.7686V 1 1 1 0 1 0 1 0.74675V 0.7430V 1 1 1 0 1 1 0 0.72100V 0.7174V 1 1 1 0 1 1 1 0.69525V 0.6918V 1 1 1 1 0 0 0 0.66950V 0.6662V 1 1 1 1 0 0 1 0.64375V 0.6405V 1 1 1 1 0 1 0 0.61800V 0.6149V 1 1 1 1 0 1 1 0.59225V 0.5893V 1 1 1 1 1 0 0 0.56650V 0.5637V 1 1 1 1 1 0 1 0.54075V 0.5380V 1 1 1 1 1 1 0 0.51500V 0.5124V 1 1 1 1 1 1 1 0.41200V 0.4099V 1 0 x x x x x 0.000V x 1 www.rohm.com (c) 2010 ROHM Co., Ltd. All rights reserved. 4/21 VDAC SUS OUT 2010.04 - Rev.C Technical Note BD9560MUV 3 3 2.5 2.5 2.5 2 2 2 1.5 RON[] 3 RON[] RON[] Reference Data 1.5 1 1 1 0.5 0.5 0.5 0 -10 10 30 50 Ta() 70 0 -10 90 Fig.1 HG high side ON resistance 10 30 50 Ta() 70 0 -10 90 1 1.35 10 30 50 Ta() 70 90 Fig.3 LG high side ON resistance Fig.2 HG low side ON resistance 1000 V IN=5V V IN=12V 0.9 V IN=21V DAC=0.412V setup voltage+2% 0.8 800 setup voltage-2% 1.3 0.7 DAC=0.84975V V nom+5% V nom-5% 0.6 0.5 0.4 DAC=1.2875V on time[ns] VCC_CORE[V] RON[] 1.5 1.25 600 400 0.3 1.2 0.2 200 0.1 0 -10 10 30 50 Ta( ) 70 1.15 90 0 0 2 4 6 8 10 0 Io[A] Fig.4 LG low side ON resistance 4ch IL (5A/div) 4ch IL (5A/div) 2ch HG (10V/div) Fig.8(VIN=12V) Switching wave form (Iout=0A) 4ch IL (5A/div) 4ch IL (5A/div) 1ch Vout (20mV/div) 3ch LG (5V/div) 3ch LG (5V/div) 2ch HG (10V/div) 2ch HG (5V/div) Fig.10 (VIN=5V) Switching wave form (Iout=10A) www.rohm.com (c) 2010 ROHM Co., Ltd. All rights reserved. Fig.11(VIN=12V) Switching wave form (Iout=10A) 5/21 5 1ch Vout (20mV/div) 3ch LG (5V/div) 1ch Vout (20mV/div) 4 1ch Vout (20mV/div) 3ch LG (5V/div) Fig.7 (VIN=5V) Switching wave form (Iout=0A) 3 Fig.6 Ton_On time 4ch IL (5A/div) 2ch HG (5V/div) 2 TON[V] Fig.5 Load slope 1ch Vout (20mV/div) 1 3ch LG (5V/div) 2ch HG (10V/div) Fig.9 (VIN=21V) Switching wave form (Iout=0A) 4ch IL (5A/div) 1ch Vout (20mV/div) 3ch LG (5V/div) 2ch HG (10V/div) Fig.12 (VIN=21V) Switching wave form (Iout=10A) 2010.04 - Rev.C Technical Note BD9560MUV Reference Data 4ch Iout (5A/div) 4ch Iout (5A/div) 4ch Iout (5A/div) 3ch Vout (50mV/div) 3ch Vout (50mV/div) 2ch LG (5V/div) 2ch LG (5V/div) 2ch LG (5V/div) 1ch HG (5V/div) 1ch HG (5V/div) 1ch HG (10V/div) Fig.13 Transient Response (VIN=5V) VOUT=1.2875V, IOUT=0A10A Fig.14 Transient Response (VIN=12V) VOUT=1.2875V, IOUT=0A10A 3ch Vout (50mV/div) Fig.15 Transient Response (VIN=21V) VOUT=1.2875V, IOUT=0A10A 3ch Vout (50mV/div) 3ch Vout (50mV/div) 4ch Iout (5A/div) 4ch Iout (5A/div) 4ch Iout (5A/div) 2ch LG (5V/div) 2ch LG (5V/div) 2ch LG (5V/div) 1ch HG (5V/div) 1ch HG (5V/div) 1ch HG (10V/div) 3ch Vout (50mV/div) Fig.16 Transient Response (VIN=5V) VOUT=1.2875V, IOUT=10A0A Fig.17 Transient Response (VIN=12V) VOUT=1.2875V, IOUT=10A0A VR_ON VR_ON VR_ON 2V/div Fig.18 Transient Response (VIN=21V) VOUT=1.2875V, IOUT=10A0A 2V/div 2V/div VOUT 200mV/div VOUT VOUT 200mV/div 200mV/div IL 5A/div Fig.19 Wakeup wave form VOUT=1.2875V,VIN=12V, IOUT=0A VR_ON 2V/div Fig.20 Wakeup wave form VOUT=1.2875V,VIN=12V, RVOUT=120m VOUT VCC_CORE 200mV/div Fig.21 Wakeup wave form VOUT=0.84975V,VIN=12V, IOUT=0A VR_ON VR_ON 2V/div 2V/div VOUT 100mV/div VOUT 100mV/div IL Fig.22 Wakeup wave from VOUT=0.84975V,VIN=12V, RVOUT=80m www.rohm.com (c) 2010 ROHM Co., Ltd. All rights reserved. IL 5A/div 5A/div Fig.23 Wakeup wave form VOUT=0.412V,VIN=12V, IOUT=0A 6/21 Fig.24 Wakeup wave form VOUT=0.412V,VIN=12V, RVOUT=40m 2010.04 - Rev.C Technical Note BD9560MUV Block Diagram, Application circuit VRON VCC 25 VREF 14 GND VIN 13 Refernce Block V_3 32 VID(3) VID(2) VID(1) VID(0) VSS_SNS VID4 VID3 VID2 VID1 VID0 SGND 1.5V 7 5bit DAC Delay VDAC DAC_C VDAC UVLO OVP TSD ILIM SCP 6 5 11 SUS_OUT 23 VDAC UVLO VR_ON SS BOOT 31 30 R Controller 29 Q Driver Logic S 28 27 SS VDAC 21 19 20 Short Circuit ILIM 18 17 SCP ISM 3 VOUT PVCC LG FB LSM LSP ISM ISP UVLO Delay SCP HG SW PGND 26 TSD Thermal Protection 10 Delay OVP Over Voltage Protect 9 8 2 VIN VDAC ISM ISM VID(4) 1 UVLO Under Voltage Lock out VREF PWRGD PWRGD_C 12 22 24 TON 4 16 SLLM CL SS Soft Start Block SS Pin Configuration VQFN032V5050 (Unit : mm) Pin Function Table Pin No. Pin name Pin No. Pin name 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 PWRGD_C PWRGD SCP SS VID0 VID1 VID2 VID3 VID4 DAC_C SGND GND VCC VREF NC CL 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 ISP ISM LSM LSP FB TON SUS_OUT SLLM VRON PGND LG PVCC SW HG BOOT VIN www.rohm.com (c) 2010 ROHM Co., Ltd. All rights reserved. 7/21 2010.04 - Rev.C Technical Note BD9560MUV Pin Descriptions VCC This is the power supply pin for IC internal circuits, except the FET driver. The input supply voltage range is 4.5V to 5.5V. It is recommended that a 1uF bypass capacitor be put in this pin. VRON When VRON pin voltage at least 2.3V, the status of this switching regulator become active. Conversely, the status switches off when VRON pin voltage goes lower than 0.8V and circuit current becomes 10A or less. VREF This is the reference voltage output pin. The voltage is 2.5V, with 100A current ability. It is recommended that a 0.1uF capacitor be established between VREF and GND. CL BD9560MUV detects the voltage between ISP pin and ISM pin and limits the output current (OCP) voltage equivalent to 1/16 of the CL voltage drop of external current sense resistor. A very low current sense resistor or inductor DCR can also be used for this platform. SS This is the adjustment pin to set the soft start time. SS voltage is low during shutdown status. When VRON is the status of high, the soft start time can be determined by the SS charge current and capacitor between SS and GND. Until SS reaches DAC output voltage, the output voltage VOUT is equivalent to SS voltage. SCP This is the pin to adjust the timer latch time for short circuit protection. The timer circuit is active when the output voltage VOUT becomes 70% of DAC output voltage, and the output switches OFF (HG=L, LG=L) and is latched after the specified time. When the UVLO circuit is active or VRON is low, this latch function is cancelled. VIN Since the VIN line is also the input voltage of switching regulator, stability depends in the impedance of the voltage supply. It is recommended to establish a bypass capacitor or CR filter suitable for the actual application. TON This is the adjustment pin to set the ON time. On time is determined by the applied voltage to TON pin. ISP, ISM These pins are connected to both sides of the current sense resistor detect output current. The voltage drop between ISP and ISM is compared with the voltage equivalent to 1/16 of CL voltage. When this voltage drop hits the specified voltage level, the output voltage is OFF. And these are the pins returned output voltage for Power Good block, SCP block and OVP block. BOOT This is the voltage supply to drive the high side FET. The maximum absolute ratings are 35V (from GND) and 7V (from SW). BOOT voltage swings between (VIN+VCC) and VCC during active operation. HG This is the voltage supply to drive the Gate of the high side. This voltage swings between BOOT and SW. High-speed Gate driving for the high side FET is achieved due to the low on-resistance (1.5 ohm when HG is high, 1.0 ohm when HG is low) driver. SW This is the source pin for the high side FET. The maximum absolute ratings are 30V (from GND). SW voltage swings between VIN and GND. PVCC This is the power supply to drive the low side FET Gate. It is recommended that a 10uF bypass capacitor be established to compensate for rush current during the FET ON/OFF transition. LG This is the voltage supply to drive the Gate of the low side FET. This voltage swings between PVCC and PGND. High-speed Gate driving for the low side FET is achieved due to the low on-resistance (1.5 ohm when LG is high, 0.5 ohm when LG is low) driver. PGND This is the power ground pin connected to the source of the low side FET. PWRGD This is the Power Good output pin with open drain. When VOUT range is (VDAC-300mV) to (VDAC+200mV), the status is high, and when it is in out of range, the status is low. PWRGD_C This is the pin to adjust the delay time of Power Good. When the status of the output voltage is Power Good, the delay time is determined by the capacitor connected between the fixed current for internal IC and PWRGD_C-GND. SLLM This is the adjustment pin to set the control mode. When SLLM pin voltage goes lower than 0.5V, the status is continuous mode. Conversely the status is SLLM (Simple Light Load Mode) when SLLM pin voltage is at least (VCC-0.5). VID[0:4] This is the logic input pin for 5bit DAC. LSP, LSM This is the input pin for the amplifier to set the load slope. SUS_OUT The output is SUS_OUT="H" in performance states, is SUS_OUT="L" in sleep states. www.rohm.com (c) 2010 ROHM Co., Ltd. All rights reserved. 8/21 2010.04 - Rev.C Technical Note BD9560MUV Timing Chart Soft Start Function Soft start is exercised with the VRON pin set high. Current control takes effect at startup, enabling a moderate output voltage "ramping start." Soft start timing and incoming current are calculated with formulas (1) and (2) below. VRON TSS SS Soft start time Tss= VDACxCss [sec] (1) 2A(typ) VOUT Incoming current IIN= IIN CoxVOUT Tss [A] (2) (Css: Soft start capacitor; Co: Output capacitor) Timer Latch Type Short Circuit Protection VDACx0.7 Short protection kicks in when output falls to or below (VDAC X0.7). When the programmed time period elapses, output is latched OFF to prevent destruction of the IC. Output voltage can be restored either by reconnecting the VRON pin or disabling UVLO. Short Circuit Protection timing is calculated with formulas (3) below. VOUT TSCP SCP Short Circuit Protection time VRON/UVLO Tscp= 1.2(V)xCSCP [sec] (3) 2A(typ) Output Over Voltage Circuit Protection VOUT 1.5V Over voltage protection kicks and low side FET is the status of full ON in when output is up to 1.5V or more LG=HighHG=Low. It is operated ordinary with falling of output. HG LG Switching Power good function VOUT Power good function kicks in when output is from (VOUT-300mV) to (VOUT+200mV). After setting, power good pin is the status of high. (Pull up the resistance outside) Delay timing of power good is calculated with formulas (4) below. VOUT-300mV TPWRGD Power good delay time PWRGD_C TPWRGD = PWRGD www.rohm.com (c) 2010 ROHM Co., Ltd. All rights reserved. 1.2(V)xCPWRGD_C 2A(typ) [sec] (4) (CPWRGD : PWRGD_C pin capacitor) 9/21 2010.04 - Rev.C Technical Note BD9560MUV External Component Selection 1. Inductor (L) selection The inductor value is a major influence on the output ripple current. As formula (5) below indicates, the greater the inductor or the switching frequency, the lower the ripple current. IL IL= (VIN-VOUT)xVOUT [A](5) LxVINxf The proper output ripple current setting is about 30% of maximum output current. VIN IL IL=0.3xIOUTmax. [A](6) VOUT L L= Co (VIN-VOUT)xVOUT LxVINxf [H](7) (IL: output ripple current; f: switch frequency) Output ripple current Passing a current larger than the inductor's rated current will cause magnetic saturation in the inductor and decrease system efficiency. In selecting the inductor, be sure to allow enough margin to assure that peak current does not exceed the inductor rated current value. To minimize possible inductor damage and maximize efficiency, choose a inductor with a low (DCR, ACR) resistance. 2. Output Capacitor (CO) Selection VIN When determining the proper output capacitor, be sure to factor in the equivalent series resistance required to smooth out ripple volume and maintain a stable output voltage range. Output ripple voltage is determined as in formula (8) below. VOUT L ESR VOUT=ILxESR [V](8) Co (IL: Output ripple current; ESR: CO equivalent series resistance) In selecting a capacitor, make sure the capacitor rating allows sufficient margin relative to output voltage. Note that a lower ESR can minimize output ripple voltage. Output Capacitor Please give due consideration to the conditions in formula (9) below for output capacity, bearing in mind that output rise time must be established within the soft start time frame. Tssx(Limit-IOUT) Co VOUT (9) Tss: Soft start time Limit: Over current detection 2A(Typ) Note: Improper capacitor may cause startup malfunctions. 3. Input Capacitor (Cin) Selection The input capacitor selected must have low enough ESR resistance to fully support large ripple output, in order to prevent extreme over current. The formula for ripple current IRMS is given in (10) below. VIN Cin VOUT L IRMS=IOUTx VCC(VCC-VOUT) Co [A](10) VCC Where VCC=2xVOUT, IRMS= IOUT 2 Input Capacitor A low ESR capacitor is recommended to reduce ESR loss and maximize efficiency. www.rohm.com (c) 2010 ROHM Co., Ltd. All rights reserved. 10/21 2010.04 - Rev.C Technical Note BD9560MUV 4. MOSFET Selection Loss on the main MOSFET Pmain=PRON+PGATE+PTRAN VIN main switch = VOUT L VOUT VIN xRONxIOUT2+CissxfxVDD+ 2 VIN xCrssxIOUTxf IDRIVE (11) (Ron: On-resistance of FET; Ciss: FET gate capacity; f: Switching frequency Crss: FET inverse transfer function; IDRIVE: Gate bottom current) Co Loss on the synchronous MOSFET synchronous switch Psyn=PRON+PGATE = VIN-VOUT VIN xRONxIOUT2+CissxfxVDD (12) 5. Setting Detection Resistance VIN The over current protection function detects the output ripple current bottom value. This parameter (setting value) is determined as in formula (13) below. R L VOUT ILMIT= IL VCLx1/16 R Co [A](13) (VILIM: ILIM voltage; R: Detection resistance) Current limit VIN When it detect the over current protection from DCR of "the coil L", this parameter (setting value) is determined as in formula (14) below. IL L RL r C VOUT Co ILMIT=VCLx1/16x (RL= L rxC rxC L [A](14) ) (VCL:CL voltage RL:DCR value of the coil) Current limit 6. Setting Load Line Slope VIN HG IL RSENSE VOUT FB = R2 R1 = (1+ LG xRSENSExIL+ RSENSExIL+VOUT R2 R1 ) x RSENSExIL+VOUT So that, SS VDAC Amplifier for setting Load slope R2 ) x RSENSE LSP R1 SLOPELL = (1+ LSM R1 (SLOPELL : Load Line Slope) R1 FB R2 www.rohm.com (c) 2010 ROHM Co., Ltd. All rights reserved. 11/21 2010.04 - Rev.C Technical Note BD9560MUV I/O Equivalent Circuit 1pin(PWRGD_C) 2pin(PWRGD) 3pin(SCP) PWRGD SCP PWRGD_C GND 4pin(SS) 5pin(VID0) ~ 9pin(VID4) SS 10pin(DAC_C) VID[0:4] 14pin(VREF) DAC_C 16pin(CL),17pin(ISP) 18pin(ISM) ISM VREF CL ISP 19pin(LSM),20pin(LSP),22pin(TON) 21pin(FB) 23pin(SUS_OUT) VCC VCC SUS_OUT LSM LSP TON FB 24pin(SLLM) VCC 25pin(VRON) 27pin(LG) VDD VR_ON SLLM LG 29pin(SW) BOOT SW 30pin(HG) BOOT HG 31pin(BOOT) 32pin(VIN) BOOT BOOT VIN HG HG www.rohm.com (c) 2010 ROHM Co., Ltd. All rights reserved. 12/21 SW 2010.04 - Rev.C Technical Note BD9560MUV Evaluation Board Circuit(Application for POS CAP) 3.3V VCC R0 VIN VIN R2 VCC_CORE R1 VIN_IC 32 SW1 R3 VIN C1 P_MON 15 R41 C19 C18 P_MON C20 C21 C22 C23 C24 Vcc R26 SW2 R4 SW3 R5 SW4 R6 25 5 6 SW5 R7 SW6 R8 VRON VID0 PVCC BTS VCC 3.3V VID4 2 PWRGD R10 LG PGND R12 16 CL VREF CL 14 VIN_IC VREF R15 C_TON R16 VREF 22 Vcc C6 C7 C8 Vcc TON DAC R19 13 27 VCC_CORE R33 R34 Tr1a PGND 26 LSM LSP SGND VCC SLLM 12 C13 R43 Tr1b R31 D1 R29 R30 PULSE_I N R32 R42 Tr3A Tr3B R28 17 18 R27 VIN_IC R24 21 R25 R22 19 R21 C25 20 R23 R20 11 VCC C11 GND GND C9 R44 ISM FB 1 PWRGD_C 3 SCP 4 SS 10 C5 ISP VCC CORE R36 L1 C12 R14 C4 Tr2a 29 R35 R13 C3 C16 R37 R11 C2 VREF HG SW R9 C15 C14 30 VIN_FET VIN_FET R39 31 R38 VID3 PVCC C17 VIN D2 VID1 VID2 9 R40 28 GND SUS_OUT R18 24 23 R17 SW7 C10 R45 www.rohm.com (c) 2010 ROHM Co., Ltd. All rights reserved. 13/21 2010.04 - Rev.C Technical Note BD9560MUV Evaluation Board Parts List Part No Value Company Part name Part No Value Company Part name R0 0 ROHM MCR03 Series R41 - - - R1 - - - R42 - - - R2 - - - R43 - - - R3 0 ROHM MCR03 Series R44 - - - R4 0 ROHM MCR03 Series R45 0 ROHM MCR03 Series R5 0 ROHM MCR03 Series C1 0.01uF MURATA GMR18 Series R6 0 ROHM MCR03 Series C2 - - - R7 0 ROHM MCR03 Series C3 - - - R8 0 ROHM MCR03 Series C4 0.1uF MURATA GMR18 Series R9 - - - C5 0.01uF MURATA GMR18 Series R10 20k ROHM MCR03 Series C6 0.01uF MURATA GMR18 Series R11 - - - C7 0.01uF MURATA GMR18 Series R12 300k ROHM MCR03 Series C8 2200pF MURATA GMR18 Series R13 47k ROHM MCR03 Series C9 1uF MURATA GMR18 Series R14 0 ROHM MCR03 Series C10 - - - R15 560k ROHM MCR03 Series C11 - - - R16 62k ROHM MCR03 Series C12 - - - R17 - - - C13 - - - R18 0 ROHM MCR03 Series C14 0.22uF MURATA GMR18 Series R19 10 ROHM MCR03 Series C15 10uF KYOCERA CM32X7R106M25A R20 - - - C16 - - - R21 1k ROHM MCR03 Series C17 10uF MURATA GMR21 Series R22 1k ROHM MCR03 Series C18 - - - R23 1M ROHM MCR03 Series C19 - - - R24 3k ROHM MCR03 Series C20 R25 1M ROHM MCR03 Series C21 R27 0 ROHM MCR03 Series C22 - - - R28 0 ROHM MCR03 Series C23 330uF Panasonic EEFSX0D331XE R29 - - - C24 - - - R30 - - - C25 - - - R31 0 ROHM MCR03 Series C-Ton - - - R32 0 ROHM MCR03 Series R33 - - - L1 0.7uH TDK VLM10055T-R70M120 R34 0 ROHM MCR03 Series D1 - - - D2 Diode ROHM RB521S-30 10uFx8 KYOCERA - - CM21B106M06A - R35 0 ROHM MCR03 Series R36 2 ROHM PMR100 R37 0 ROHM MCR03 Series TR1A FET NEC uPA2702 R38 0 ROHM MCR03 Series TR2A FET NEC uPA2702 R39 0 ROHM MCR03 Series TR3A - - - R40 10 ROHM MCR03 Series TR3B - - - www.rohm.com (c) 2010 ROHM Co., Ltd. All rights reserved. 14/21 2010.04 - Rev.C Technical Note BD9560MUV Evaluation Board Circuit(Application for ceramic capacitor) 3.3V VCC R0 VIN VIN R2 VCC_CORE R1 VIN_IC 32 SW1 C1 R3 VIN P_MON 15 R41 C19 C18 P_MON C20 C21 C22 C23 C24 Vcc R26 SW2 R4 SW3 R5 SW4 R6 VRON VID0 R7 R8 VID2 8 9 VID4 2 PWRGD PGND R12 16 CL 14 VIN_IC VREF R15 C_TON R16 VREF 22 Vcc C6 C7 C8 Vcc R19 TON DAC 13 GND GND C9 R44 ISM FB 1 PWRGD_C 3 SCP 4 SS 10 C5 ISP 12 LSM LSP SGND C16 Tr2a VCC CORE 27 R36 L1 29 R35 VCC_CORE R33 R34 Tr1a C13 R43 Tr1b PGND 26 PULSE_IN R30 D1 R29 R31 R32 Tr3A Tr3B R42 R28 17 C12 R14 C4 CL C15 R37 R13 C3 VREF LG R11 C2 30 VIN_FET VIN_FET R39 31 R38 C14 HG PVCC C17 VIN D2 BTS SW R9 R40 28 VID3 R10 VREF PVCC VID1 7 SW6 3.3V 5 6 SW5 VCC 25 18 R27 VIN_IC R24 21 R25 R22 19 R21 C25 20 R23 R20 11 VCC C11 VCC GND SLLM SUS_OUT R18 24 23 R17 SW7 C10 R45 www.rohm.com (c) 2010 ROHM Co., Ltd. All rights reserved. 15/21 2010.04 - Rev.C Technical Note BD9560MUV Evaluation Board Parts List Part No Value Company Part name R0 0 ROHM MCR03 Series R1 1k ROHM R2 - - R3 0 R4 Part No Value Company Part name R41 - - - MCR03 Series R42 - - - - R43 - - - ROHM MCR03 Series R44 - - - 0 ROHM MCR03 Series R45 0 ROHM MCR03 Series R5 0 ROHM MCR03 Series C1 0.01uF MURATA GMR18 Series R6 0 ROHM MCR03 Series C2 - - - R7 0 ROHM MCR03 Series C3 - - - R8 0 ROHM MCR03 Series C4 0.1uF MURATA GMR18 Series R9 - - - C5 0.01uF MURATA GMR18 Series R10 20k ROHM MCR03 Series C6 0.01uF MURATA GMR18 Series R11 - - - C7 0.01uF MURATA GMR18 Series R12 300k ROHM MCR03 Series C8 2200pF MURATA GMR18 Series R13 47k ROHM MCR03 Series C9 1uF MURATA GMR18 Series R14 0 ROHM MCR03 Series C10 - - - R15 560k ROHM MCR03 Series C11 - - - R16 62k ROHM MCR03 Series C12 - - - R17 - - - C13 - - - R18 0 ROHM MCR03 Series C14 0.47uF MURATA GMR21 Series R19 10 ROHM MCR03 Series C15 10uF KYOCERA CM32X7R106M25A R20 - - - C16 - - - R21 1k ROHM MCR03 Series C17 10uF MURATA GMR21 Series R22 1k ROHM MCR03 Series C18 - - R23 1M ROHM MCR03 Series C19 47uFx4 KYOCERA CM32B476M06A R24 3k ROHM MCR03 Series C20 47uFx4 KYOCERA CM32B476M06A R25 1M ROHM MCR03 Series C21 - - - R27 0 ROHM MCR03 Series C22 - - - R28 0 ROHM MCR03 Series C23 - - - R29 - - - C24 - - - R30 - - - C25 - - - R31 0 ROHM MCR03 Series C-Ton - - - R32 0 ROHM MCR03 Series R33 - - - L1 0.7uH Panasonic ETQP2H0R7BFA R34 0 ROHM MCR03 Series D1 - - - R35 0 ROHM MCR03 Series D2 Diode ROHM RB521S-30 R36 2 ROHM PMR100 R37 0 ROHM MCR03 Series TR1A FET NEC uPA2702 R38 0 ROHM MCR03 Series TR2A FET NEC uPA2702 R39 0 ROHM MCR03 Series TR3A - - - R40 10 ROHM MCR03 Series TR3B - - - www.rohm.com (c) 2010 ROHM Co., Ltd. All rights reserved. 16/21 - 2010.04 - Rev.C Technical Note BD9560MUV Evaluation Board Circuit(Application for VIN UVLO OFF) 3.3V R0 VCC R2 VCC_CORE VCC 32 SW1 R3 VIN C1 P_MON 15 R41 C19 C18 P_MON C20 C21 C22 C23 C24 Vcc R26 SW2 25 R4 SW3 R5 SW4 R6 SW5 R7 SW6 R8 5 6 VRON VID0 VID1 31 VCC R9 2 VID4 HG SW LG R11 C2 PGND R12 16 CL ISP CL VREF 14 VIN VREF R15 Vcc C5 C6 C7 C8 22 VREF TON R16 C_TON Vcc R19 GND GND C9 1 PWRGD_C 3 SCP 4 10 SS DAC 29 R35 27 R34 Tr2a VCC CORE R36 L1 VCC_CORE Tr1a R33 C13 R43 Tr1b PGND 26 D1 PULSE_IN R29 R31 R30 R32 Tr3A Tr3B R42 R28 17 IS R27 18 V IN_IC M 21 FB LSM LSP SGND R24 R25 R22 19 R21 C25 20 R23 R20 11 VCC C11 13 VCC SLLM 12 GND R44 C15 C16 R37 C12 R14 C4 30 R13 C3 PVCC VIN_FET VIN_FET R39 R38 C14 PWRGD R10 VREF C17 VIN BTS 8 VID3 9 R40 28 D2 7 VID2 3.3V PVCC SUS_OUT R18 24 23 R17 SW7 C10 R45 www.rohm.com (c) 2010 ROHM Co., Ltd. All rights reserved. 17/21 2010.04 - Rev.C Technical Note BD9560MUV Evaluation Board Parts List Part No Value Company Part name R0 0 ROHM MCR03 Series R1 1k ROHM R2 - - R3 0 R4 Part No Value Company Part name R41 - - - MCR03 Series R42 - - - - R43 - - - ROHM MCR03 Series R44 - - - 0 ROHM MCR03 Series R45 0 ROHM MCR03 Series R5 0 ROHM MCR03 Series C1 0.01uF MURATA GMR18 Series R6 0 ROHM MCR03 Series C2 - - - R7 0 ROHM MCR03 Series C3 - - - R8 0 ROHM MCR03 Series C4 0.1uF MURATA GMR18 Series R9 - - - C5 0.01uF MURATA GMR18 Series R10 20k ROHM MCR03 Series C6 0.01uF MURATA GMR18 Series R11 - - - C7 0.01uF MURATA GMR18 Series R12 300k ROHM MCR03 Series C8 2200pF MURATA GMR18 Series R13 47k ROHM MCR03 Series C9 1uF MURATA GMR18 Series R14 0 ROHM MCR03 Series C10 - - - R15 560k ROHM MCR03 Series C11 - - - R16 62k ROHM MCR03 Series C12 - - - R17 - - - C13 - - - R18 0 ROHM MCR03 Series C14 0.22uF MURATA GMR18 Series R19 10 ROHM MCR03 Series C15 10uF KYOCERA CM32X7R106M25A R20 - - - C16 - - - R21 1k ROHM MCR03 Series C17 10uF MURATA GMR21 Series R22 1k ROHM MCR03 Series C18 - - - R23 1M ROHM MCR03 Series C19 - - - R24 3k ROHM MCR03 Series C20 R25 1M ROHM MCR03 Series C21 R27 0 ROHM MCR03 Series C22 - - - R28 0 ROHM MCR03 Series C23 330uF Panasonic EEFSX0D331XE R29 - - - C24 - - - R30 - - - C25 - - - R31 0 ROHM MCR03 Series C-Ton - - - R32 0 ROHM MCR03 Series R33 - - - L1 0.7uH TDK VLM10055T-R70M120 R34 0 ROHM MCR03 Series D1 - - - R35 0 ROHM MCR03 Series D2 Diode ROHM RB521S-30 R36 2 ROHM MCR03 Series R37 0 ROHM MCR03 Series TR1A FET NEC uPA2702 R38 0 ROHM MCR03 Series TR2A FET NEC uPA2702 R39 0 ROHM MCR03 Series TR3A - - - R40 10 ROHM MCR03 Series TR3B - - - www.rohm.com (c) 2010 ROHM Co., Ltd. All rights reserved. 18/21 10uFx8 KYOCERA - - CM21B106M06A - 2010.04 - Rev.C Technical Note BD9560MUV Operation Notes and Precautions 1. This integrated circuit is a monolithic IC, which (as shown in the figure below), has P isolation in the P substrate and between the various pins. A P-N junction is formed from this P layer and N layer of each pin, with the type of junction depending on the relation between each potential, as follows: When GND element A element B, the P-N junction is a diode. When element BGND element A, the P-N junction operates as a parasitic transistor. Parasitic diodes inevitably occur in the structure of the IC. The operation of parasitic diodes can result in mutual interference among circuits, as well as operating malfunctions and physical damage. Therefore, be careful to avoid methods by which parasitic diodes operate, such as applying a voltage lower than the GND (P substrate) voltage to an input pin. Transistor (NPN) Resistance ( Pin A) ( Pin A) B ( Pin B) C E Parasitic transistor GND N P+ P P+ P+ P N N P GND P+ ( Pin B) N N N N B P substrate Parasitic pin C E GND Parasitic pin GND Other pins in close proxiity GND Parasitic transistor 2. In some modes of operation, power supply voltage and pin voltage are reversed, giving rise to possible internal circuit damage. For example, when the external capacitor is charged, the electric charge can cause a VCC short circuit to the GND. In order to avoid these problems, inserting a VCC series countercurrent prevention diode or bypass diode between the various pins and the VCC is recommended. Bypass diode Countercurrent prevention diode VCC Pin 3. Absolute maximum rating Although the quality of this IC is rigorously controlled, the IC may be destroyed when applied voltage or operating temperature exceeds its absolute maximum rating. Because short mode or open mode cannot be specified when the IC is destroyed, it is important to take physical safety measures such as fusing if a special mode in excess of absolute rating limits is to be implemented. 4.GND potential Make sure the potential for the GND pin is always kept lower than the potentials of all other pins, regardless of the operating mode. 5. Thermal design In order to build sufficient margin into the thermal design, give proper consideration to the allowable loss (Power Dissipation) in actual operation. 6. Short-circuits between pins and incorrect mounting position When mounting the IC onto the circuit board, be extremely careful about the orientation and position of the IC. The IC may be destroyed if it is incorrectly positioned for mounting. Do not short-circuit between any output pin and supply pin or ground, or between the output pins themselves. Accidental attachment of small objects on these pins will cause shorts and may damage the IC. www.rohm.com (c) 2010 ROHM Co., Ltd. All rights reserved. 19/21 2010.04 - Rev.C Technical Note BD9560MUV 7. Operation in strong electromagnetic fields Use in strong electromagnetic fields may cause malfunctions. Use extreme caution with electromagnetic fields. 8. Thermal shutdown circuit This IC is provided with a built-in thermal shutdown (TSD) circuit, which is activated when the operating temperature reaches 175 (standard value), and has a hysteresis range of 15 (standard). When the IC chip temperature rises to the threshold, all the inputs automatically turn OFF. Note that the TSD circuit is provided for the exclusive purpose shutting down the IC in the presence of extreme heat, and is not designed to protect the IC per se or guarantee performance when or after extreme heat conditions occur. Therefore, do not operate the IC with the expectation of continued use or subsequent operation once the TSD is activated. 9. Capacitor between output and GND When a larger capacitor is connected between the output and GND, Vcc or VIN shorted with the GND or 0V line - for any reason - may cause the charged capacitor current to flow to the output, possibly destroying the IC. Do not connect a capacitor larger than 1000uF between the output and GND. 10. Precautions for board inspection Connecting low-impedance capacitors to run inspections with the board may produce stress on the IC. Therefore, be certain to use proper discharge procedure before each process of the operation. To prevent electrostatic accumulation and discharge in the assembly process, thoroughly ground yourself and any equipment that could sustain ESD damage, and continue observing ESD-prevention procedures in all handling, transfer and storage operations. Before attempting to connect components to the test setup, make certain that the power supply is OFF. Likewise, be sure the power supply is OFF before removing any component connected to the test setup. 11. GND wiring pattern When both a small-signal GND and high current GND are present, single-point grounding (at the set standard point) is recommended, in order to separate the small-signal and high current patterns, and to be sure the voltage change stemming from the wiring resistance and high current does not cause any voltage change in the small-signal GND. In the same way, care must be taken to avoid wiring pattern fluctuations in any connected external component GND. Power Dissipation [mW] 1000 880mW 70mmx70mmx1.6mm ja=142.0/W Power Dissipation [Pd] 800 Glass-epoxy PCB 600 With no heat sink j-a=328.9/W 380mW 400 200 0 25 50 75 100 125 150 [] Ambient Temperature [Ta] www.rohm.com (c) 2010 ROHM Co., Ltd. All rights reserved. 20/21 2010.04 - Rev.C Technical Note BD9560MUV Ordering part number B D 9 Part No. 5 6 0 M Part No. U V - Package MUV : VQFN032V5050 E 2 Packaging and forming specification E2: Embossed tape and reel VQFN032V5050 5.0 0.1 5.00.1 1.0MAX 3.40.1 0.4 0.1 1 8 9 32 16 25 24 0.75 0.5 2500pcs E2 The direction is the 1pin of product is at the upper left when you hold ) (0.22) ( reel on the left hand and you pull out the tape on the right hand 3.4 0.1 +0.03 0.02 -0.02 S C0.2 Embossed carrier tape Quantity Direction of feed 1PIN MARK 0.08 S Tape 17 +0.05 0.25 -0.04 1pin Reel (Unit : mm) www.rohm.com (c) 2010 ROHM Co., Ltd. All rights reserved. 21/21 Direction of feed Order quantity needs to be multiple of the minimum quantity. 2010.04 - Rev.C Notice Notes No copying or reproduction of this document, in part or in whole, is permitted without the consent of ROHM Co.,Ltd. The content specified herein is subject to change for improvement without notice. The content specified herein is for the purpose of introducing ROHM's products (hereinafter "Products"). If you wish to use any such Product, please be sure to refer to the specifications, which can be obtained from ROHM upon request. Examples of application circuits, circuit constants and any other information contained herein illustrate the standard usage and operations of the Products. The peripheral conditions must be taken into account when designing circuits for mass production. Great care was taken in ensuring the accuracy of the information specified in this document. However, should you incur any damage arising from any inaccuracy or misprint of such information, ROHM shall bear no responsibility for such damage. The technical information specified herein is intended only to show the typical functions of and examples of application circuits for the Products. ROHM does not grant you, explicitly or implicitly, any license to use or exercise intellectual property or other rights held by ROHM and other parties. ROHM shall bear no responsibility whatsoever for any dispute arising from the use of such technical information. The Products specified in this document are intended to be used with general-use electronic equipment or devices (such as audio visual equipment, office-automation equipment, communication devices, electronic appliances and amusement devices). The Products specified in this document are not designed to be radiation tolerant. While ROHM always makes efforts to enhance the quality and reliability of its Products, a Product may fail or malfunction for a variety of reasons. Please be sure to implement in your equipment using the Products safety measures to guard against the possibility of physical injury, fire or any other damage caused in the event of the failure of any Product, such as derating, redundancy, fire control and fail-safe designs. ROHM shall bear no responsibility whatsoever for your use of any Product outside of the prescribed scope or not in accordance with the instruction manual. The Products are not designed or manufactured to be used with any equipment, device or system which requires an extremely high level of reliability the failure or malfunction of which may result in a direct threat to human life or create a risk of human injury (such as a medical instrument, transportation equipment, aerospace machinery, nuclear-reactor controller, fuelcontroller or other safety device). ROHM shall bear no responsibility in any way for use of any of the Products for the above special purposes. If a Product is intended to be used for any such special purpose, please contact a ROHM sales representative before purchasing. If you intend to export or ship overseas any Product or technology specified herein that may be controlled under the Foreign Exchange and the Foreign Trade Law, you will be required to obtain a license or permit under the Law. Thank you for your accessing to ROHM product informations. More detail product informations and catalogs are available, please contact us. ROHM Customer Support System http://www.rohm.com/contact/ www.rohm.com (c) 2010 ROHM Co., Ltd. All rights reserved. R1010A