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High performance Regulators for PCs
Switching Regulator Controller
for Graphic Chip Cores
BD9560MUV
Description
BD9560MUV is a switching regulator controller with high output current which can achieve low output voltage (0.412V ~
1.2875V) from a wide input voltage range (4.5V ~ 25V). The setting of output voltage depends on DAC built in. High
efficiency for the switching regulator can be realized by utilizing an external N-MOSFET power transistor. SLLM (Simple
Light Load Mode) technology is also integrated to improve efficiency in light load mode, providing high efficiency over a wide
load range. For protection and ease of use, the soft start function, variable frequency function, short circuit protection
function with timer latch, over voltage protection, over current protection and power good function are all built in. This
switching regulator is specially designed for GMCH.
Features
1) Switching Regulator Controller
2) Light Load Mode and Continuous Mode Changeable
3) Thermal Shut Down circuit built-in (TSD)
4) Under Voltage Lockout circuit built-in (UVLO)
5) Over Current Protection circuit built-in (OCP)
6) Over Voltage Protection circuit built-in (OVP)
7) Short circuit protection with timer-latch built-in
8) Power good circuit built-in
9) Soft start function to minimize rush current during startup
10) Switching Frequency Variable (f=200 KHz ~ 600 KHz)
11) VQFN032V5050 package
Applications
Laptop PC, Desktop PC, Digital Components
Maximum Absolute Ratings (Ta=25)
Parameter Symbol Ratings Unit
Input voltage 1 VCC 7 *1*2 V
Input voltage 2 PVCC 7 *1*2 V
Input voltage 3 VIN 35 *1*2 V
BOOT voltage BOOT 35 *1*2 V
BOOT-SW voltage BOOT-SW 7 *1*2 V
HG-SW voltage HG-SW 7 *1*2 V
LG voltage LG PVCC V
VREF voltage VREF VCC V
VRON input voltage VRON 7 *1 V
Logic input voltage CL/SCP/SS/TON/SLLM/VID4-0/PWRGD_C/DAC_C VCC V
Logic output voltage 1 PWRGD 7 V
Logic output voltage 2 SUS_OUT VCC V
Power dissipation1 Pd1 0.38*3 W
Power dissipation2 Pd2 0.88*4 W
Operating Temperature Range Topr -10 ~ +100
Storage Temperature Range Tstg -55 ~ +150
Junction Temperature Tjmax +150
*1 Not to exceed Pd..
*2 Maximum voltage that can be proof against instantaneous applied voltage such as serge, back electromotive voltage or continuous pulse applied voltage
(Duty ratio : less than 10%)
*3 Reduced by 3.0mW for each increase in Ta of 1 over 25 (when don’t mounted on a heat radiation board )
*4 Reduced by 7.0mW for increase in Ta of 1 over 25. (when mounted on a board 70.0mm×70mm×1.6mm Glass-epoxy PCB.)
No.10030ECT10
Technical Note
BD9560MUV
2/21
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Operating Conditions (Ta=25)
Parameter Symbol
Ratings Unit
Min. Max.
Input voltage 1 VCC 4.5 5.5 V
Input voltage 2 PVCC 4.5 5.5 V
Input voltage 3 VIN 4.5 25 V
BOOT voltage BOOT 4.5 30 V
SW voltage SW -2 25 V
BOOT-SW voltage BOOT-SW 4.5 5.5 V
VRON input voltage VRON -0.3 5.5 V
Logic input voltage CL/SCP/SS/TON/SLLM/VID4-0/PWRGD_C/DAC_C -0.3 VCC+0.3 V
Logic output voltage 1 PWRGD - 5.5 V
Logic output voltage 2 SUS_OUT -0.3 VCC V
*This product should not be used in a radioactive environment.
ELECTRICAL CHARACTERISTICS
(Unless otherwise noted, Ta=25, VCC=5V,VIN=12V, VRON=5V,VDAC=1.2811V,SLLM=0V)
Parameter Symbol Limits Unit Conditions
MIN. TYP. MAX.
[Total block]
VCC bias current ICC_VCC - 4 10 mA VCC=5V
VIN bias current ICC_VIN - 20 50 µA VIN=12V
VCC shut down mode current IST_VCC - 0 10 µA VRON=0V
VIN shut down mode current IST_VIN - 0 10 µA VRON=0V
VRON low voltage VRON_L GND - 0.8 V
VRON high voltage VRON_H 2.3 - 5.5 V
VRON bias current IVRON - 10 20 µA VRON=5V
[Reference voltage block]
Reference output voltage VREF 2.475 2.500 2.525 V IREF=0 to 100µA
Maximum source current IREF_source 0.5 - - mA
Line regulation Reg.l - 0.1 0.3 %/V VCC=4.5 to 5.5V
Load regulation Reg.L - 5 20 mV IREF=0 to 0.5mA
[Over voltage protection block]
Threshold voltage VOVPL 1.400 1.500 1.600 V
Hysterisys voltage VOVPH 50 150 250 mV
[Under voltage lock-out block]
VCC input threshold voltage VCC_UVLO 4.0 4.1 4.2 V VCC: Sweep up
VCC hysterics voltage dVCC_UVLO 50 100 200 mV VCC: Sweep down
[VID block]
VID input high voltage VVID_H 2.0 - VCC V
VID input low voltage VVID_L GND - 0.8 V
VID bias current IVID - 0 1 µA VVID=3.3V
DAC delay charge current IDAC+ 90 170 250 µA
DAC output voltage VDAC 1.2683 1.2811 1.2939 V VID[0:4]=0V
[Error amplifier block]
Output feedback voltage VFB VDAC-0.5% VDAC VDAC+0.5% V
[Current limit protection block]
Current limit threshold1 Ilim 22 30 38 mV CL=0.48V
CL adjustment range VCL 0.2 - 1.5 V
CL bias current ICL - 0 1 µA CL=5V
Technical Note
BD9560MUV
3/21
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ELECTRICAL CHARACTERISTICS
(Unless otherwise noted, Ta=25, VCC=5V,VIN=12V, VRON=5V,VDAC=1.2811V,SLLM=0V)
Parameter Symbol Limits Unit Conditions
MIN. TYP. MAX.
[Load slope setup block]
Offset voltage VLS TBD 0 TBD mV
[Soft start block]
Delay time TSS - 65 - µs Css=100pF
SS Delay charge current ISS 1.5 2.0 2.5 µA
[Short circuit Protection]
Delay time TSCP - 60 - µs Cscp=100pF
SCP Delay charge current ISCP 1.5 2.0 2.5 µA
[SLLM block]
Continuous mode threshold Vthcon GND - 0.5 V
SLLM threshold VthSL2M VCC-0.5 - VCC V
[Operating frequency]
Switching frequency Fosc - 300 - kHz TON=1V
[On time pulse width]
On time pulse width Fosc 250 350 450 ns TON=1V
TON adjustment voltage VTON 0.2 - 2.0 V
TON bias current ITON - 0 1 µA TON=5V
[OFF time width]
Min off time MinOff 0.25 0.5 1.0 µs
[Driver block]
HG high side ON resistor RonHGH - 1 2
HG low side ON resistor RonHGL - 1 2
LG high side ON resistor RonLGH - 1 2
LG high side ON resistor RonLGL - 0.5 1
[Power good block]
PWRGD Low threshold voltage PGDLow VDAC-0.4 VDAC-0.3 VDAC-0.2 V
PWRGD High threshold voltage PGDHigh VDAC+0.1 VDAC+0.2 VDAC+0.3 V
PWRGD Output voltage VPWRGD - - 0.4 V IPRGD=4mA
PWRGD Output leakage current PGDLeak - - 10 µA PWRGD=3.6V
PWRGD_C Delay charge current IPD 1.5 2.0 2.5 µA
Technical Note
BD9560MUV
4/21
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DAC code table
State VRON VID4 VID3 VID2 VID1 VID0 VCCGFX VDAC SUS OUT
Render Performance States
1 0 0 0 0 0 1.28750V 1.2811V 0
1 0 0 0 0 1 1.26175V 1.2554V 0
1 0 0 0 1 0 1.23600V 1.2298V 0
1 0 0 0 1 1 1.21025V 1.2042V 0
1 0 0 1 0 0 1.18450V 1.1786V 0
1 0 0 1 0 1 1.15875V 1.1530V 0
1 0 0 1 1 0 1.13300V 1.1273V 0
1 0 0 1 1 1 1.10725V 1.1017V 0
1 0 1 0 0 0 1.08150V 1.0761V 0
1 0 1 0 0 1 1.05575V 1.0505V 0
1 0 1 0 1 0 1.03000V 1.0249V 0
1 0 1 0 1 1 1.00425V 0.9992V 0
1 0 1 1 0 0 0.97850V 0.9736V 0
1 0 1 1 0 1 0.95275V 0.9480V 0
1 0 1 1 1 0 0.92700V 0.9224V 0
1 0 1 1 1 1 0.90125V 0.8967V 0
1 1 0 0 0 0 0.87550V 0.8711V 0
1 1 0 0 0 1 0.84975V 0.8455V 0
Render Suspend States
1 1 0 0 1 0 0.82400V 0.8199V 1
1 1 0 0 1 1 0.79825V 0.7943V 1
1 1 0 1 0 0 0.77250V 0.7686V 1
1 1 0 1 0 1 0.74675V 0.7430V 1
1 1 0 1 1 0 0.72100V 0.7174V 1
1 1 0 1 1 1 0.69525V 0.6918V 1
1 1 1 0 0 0 0.66950V 0.6662V 1
1 1 1 0 0 1 0.64375V 0.6405V 1
1 1 1 0 1 0 0.61800V 0.6149V 1
1 1 1 0 1 1 0.59225V 0.5893V 1
1 1 1 1 0 0 0.56650V 0.5637V 1
1 1 1 1 0 1 0.54075V 0.5380V 1
1 1 1 1 1 0 0.51500V 0.5124V 1
1 1 1 1 1 1 0.41200V 0.4099V 1
0 × × × × × 0.000V × 1
Technical Note
BD9560MUV
5/21
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Reference Data
0
0.5
1
1.5
2
2.5
3
-101030 507090
Ta()
RON[Ω]
Fig.1 HG high side ON resistance
0
0.5
1
1.5
2
2.5
3
-101030507090
Ta()
RON[Ω]
Fig.2 HG low side ON resistance
0
0.5
1
1.5
2
2.5
3
-101030507090
Ta()
RON[Ω]
Fig.3 LG high side ON resistance
0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1
-101030507090
Ta()
RON[Ω]
Fig.4 LG low side ON resistance
1.15
1.2
1.25
1.3
1.35
024 6810
Io[A]
VCC_CORE[V]
V IN =5V
V IN =12V
V IN =21V
setup voltage+2%
setup voltage-2%
Vnom+5%
Vnom-5%
Fig.5 Load slope
0
200
400
600
800
1000
012345
TON[V]
on time[ns]
DAC=0.412V
DAC=0.84975V
DAC=1.2875V
Fig.6 Ton_On time
1ch Vout
(20mV/div)
2ch HG
(5V/div)
3ch LG
(5V/div)
4ch IL
(5A/div)
1ch Vout
(20mV/div)
2ch HG
(10V/div)
3ch LG
(5V/div)
4ch IL
(5A/div)
1ch Vout
(20mV/div)
2ch HG
(10V/div)
3ch LG
(5V/div)
4ch IL
(5A/div)
Fig.7 (VIN=5V)
Switching wave form (Iout=0A)
Fig.8(VIN=12V)
Switching wave form (Iout=0A)
Fig.9 (VIN=21V)
Switching wave form (Iout=0A)
1ch Vout
(20mV/div)
2ch HG
(5V/div)
3ch LG
(5V/div)
4ch IL
(5A/div)
1ch Vout
(20mV/div)
2ch HG
(10V/div)
3ch LG
(5V/div)
4ch IL
(5A/div)
1ch Vout
(20mV/div)
2ch HG
(10V/div)
3ch LG
(5V/div)
4ch IL
(5A/div)
Fig.10 (VIN=5V)
Switching wave form (Iout=10A) Fig.11(VIN=12V)
Switching wave form (Iout=10A)
Fig.12 (VIN=21V)
Switching wave form (Iout=10A)
Technical Note
BD9560MUV
6/21
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Reference Data
200mV/div
2V/div 2V/div
200mV/div
5A/div
2V/div
200mV/div
VCC_CORE
VR_ON
5A/di
v
Fig.22 Wakeup wave from
VOUT=0.84975V,VIN=12V, RVOUT=80m
Fig.23 Wakeup wave form
VOUT=0.412V,VIN=12V, IOUT=0A
Fig.24 Wakeup wave form
VOUT=0.412V,VIN=12V, RVOUT=40m
2V/di
v
100mV/div
2V/div 100mV/div
5A/div
1ch HG
(5V/div)
2ch LG
(5V/div)
3ch Vout
(50mV/div)
4ch Iout
(5A/div)
1ch HG
(5V/div)
2ch LG
(5V/div)
3ch Vout
(50mV/div)
4ch Iout
(5A/div)
1ch HG
(10V/div)
2ch LG
(5V/div)
3ch Vout
(50mV/div)
4ch Iout
(5A/div)
Fig.13 Transient Response (VIN=5V)
VOUT=1.2875V, IOUT=0A10A
Fig.14 Transient Response (VIN=12V)
VOUT=1.2875V, IOUT=0A10A
Fig.15 Transient Response (VIN=21V)
VOUT=1.2875V, IOUT=0A10A
1ch HG
(5V/div)
2ch LG
(5V/div)
3ch Vout
(50mV/div)
4ch Iout
(5A/div)
Fig.16 Transient Response (VIN=5V)
VOUT=1.2875V, IOUT=10A0A
1ch HG
(5V/div)
2ch LG
(5V/div)
3ch Vout
(50mV/div)
4ch Iout
(5A/div)
Fig.17 Transient Response (VIN=12V)
VOUT=1.2875V, IOUT=10A0A
1ch HG
(10V/div)
2ch LG
(5V/div)
3ch Vout
(50mV/div)
4ch Iout
(5A/div)
Fig.18 Transient Response (VIN=21V)
VOUT=1.2875V, IOUT=10A0A
Fig.19 Wakeup wave form
VOUT=1.2875V,VIN=12V, IOUT=0A
Fig.20 Wakeup wave form
VOUT=1.2875V,VIN=12V, RVOUT=120m
Fig.21 Wakeup wave form
VOUT=0.84975V,VIN=12V, IOUT=0A
VR_ON VR_ON VR_ON
2V/div
VR_ON VR_ON
VOUT
VOUT
VOUT
VOUT
VOUT
VOUT
200mV/div
IL
IL IL
Technical Note
BD9560MUV
7/21
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Block Diagram, Application circuit
Pin Configuration
Pin Function Table
Pin No. Pin name Pin No. Pin name
1 PWRGD_C 17 ISP
2 PWRGD 18 ISM
3 SCP 19 LSM
4 SS 20 LSP
5 VID0 21 FB
6 VID1 22 TON
7 VID2 23 SUS_OUT
8 VID3 24 SLLM
9 VID4 25 VRON
10 DAC_C 26 PGND
11 SGND 27 LG
12 GND 28 PVCC
13 VCC 29 SW
14 VREF 30 HG
15 NC 31 BOOT
16 CL 32 VIN
Refernce
Block
Delay
Driver
Logic
R Q
S
Controller
Delay
Thermal
Protection
5bit
DAC Delay
VREF
VID4
VID3
VID2
VID1
VID0
SGND
DAC_C
TSD
SCP
Short
Circuit
VDAC
ISM
SCP
UVLO
VR_ON
SS
VDAC
VRON VCC GND
ISM OVP
Over Voltage
Protect
VDAC
TON CL
ILIM
SS
Soft Start
Block
SS
UVLO
ISP
ISM
LSP
LSM
FB
LG
PGND
PVCC
BOOT
HG
SW
PWRGD
PWRGD_C
VDAC
ISM
SS
VDAC
UVLO
OVP
TSD
ILIM
SCP
Under
Voltage
Lock out
VREF
UVLO
VIN
VIN
V_3
SLLM
VID(4)
VID(3)
VID(2)
VID(1)
VID(0)
VSS_SNS
25 13 32 12 1 2
31
30
29
28
27
26
21
19
20
18
17
4
16
24
23
SUS_OUT
223
10
11
5
6
7
8
9
14
1.5V VOUT
(Unit : mm)
VQFN032V5050
Technical Note
BD9560MUV
8/21
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Pin Descriptions
VCC
This is the power supply pin for IC internal circuits, except the FET driver. The input supply voltage range is 4.5V to 5.5V.
It is recommended that a 1uF bypass capacitor be put in this pin.
VRON
When VRON pin voltage at least 2.3V, the status of this switching regulator become active. Conversely, the status
switches off when VRON pin voltage goes lower than 0.8V and circuit current becomes 10µA or less.
VREF
This is the reference voltage output pin. The voltage is 2.5V, with 100µA current ability. It is recommended that a 0.1uF
capacitor be established between VREF and GND.
CL
BD9560MUV detects the voltage between ISP pin and ISM pin and limits the output current (OCP) voltage equivalent to 1/16 of
the CL voltage drop of external current sense resistor. A very low current sense resistor or inductor DCR can also be used for this
platform.
SS
This is the adjustment pin to set the soft start time. SS voltage is low during shutdown status. When VRON is the status
of high, the soft start time can be determined by the SS charge current and capacitor between SS and GND. Until SS
reaches DAC output voltage, the output voltage VOUT is equivalent to SS voltage.
SCP
This is the pin to adjust the timer latch time for short circuit protection. The timer circuit is active when the output voltage
VOUT becomes 70% of DAC output voltage, and the output switches OFF (HG=L, LG=L) and is latched after the
specified time. When the UVLO circuit is active or VRON is low, this latch function is cancelled.
VIN
Since the VIN line is also the input voltage of switching regulator, stability depends in the impedance of the voltage
supply. It is recommended to establish a bypass capacitor or CR filter suitable for the actual application.
TON
This is the adjustment pin to set the ON time. On time is determined by the applied voltage to TON pin.
ISP, ISM
These pins are connected to both sides of the current sense resistor detect output current. The voltage drop between ISP and
ISM is compared with the voltage equivalent to 1/16 of CL voltage. When this voltage drop hits the specified voltage level, the
output voltage is OFF. And these are the pins returned output voltage for Power Good block, SCP block and OVP block.
BOOT
This is the voltage supply to drive the high side FET. The maximum absolute ratings are 35V (from GND) and 7V (from
SW). BOOT voltage swings between (VIN+VCC) and VCC during active operation.
HG
This is the voltage supply to drive the Gate of the high side. This voltage swings between BOOT and SW. High-speed Gate driving
for the high side FET is achieved due to the low on-resistance (1.5 ohm when HG is high, 1.0 ohm when HG is low) driver.
SW
This is the source pin for the high side FET. The maximum absolute ratings are 30V (from GND). SW voltage swings between
VIN and GND.
PVCC
This is the power supply to drive the low side FET Gate. It is recommended that a 10uF bypass capacitor be established
to compensate for rush current during the FET ON/OFF transition.
LG
This is the voltage supply to drive the Gate of the low side FET. This voltage swings between PVCC and PGND.
High–speed Gate driving for the low side FET is achieved due to the low on-resistance (1.5 ohm when LG is high, 0.5
ohm when LG is low) driver.
PGND
This is the power ground pin connected to the source of the low side FET.
PWRGD
This is the Power Good output pin with open drain. When VOUT range is (VDAC-300mV) to (VDAC+200mV), the status
is high, and when it is in out of range, the status is low.
PWRGD_C
This is the pin to adjust the delay time of Power Good. When the status of the output voltage is Power Good, the delay
time is determined by the capacitor connected between the fixed current for internal IC and PWRGD_C-GND.
SLLM
This is the adjustment pin to set the control mode. When SLLM pin voltage goes lower than 0.5V, the status is continuous
mode. Conversely the status is SLLM (Simple Light Load Mode) when SLLM pin voltage is at least (VCC-0.5).
VID[0:4]
This is the logic input pin for 5bit DAC.
LSP, LSM
This is the input pin for the amplifier to set the load slope.
SUS_OUT
The output is SUS_OUT=”H” in performance states, is SUS_OUT=”L” in sleep states.
Technical Note
BD9560MUV
9/21
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Timing Chart
Soft Start Function
Timer Latch Type Short Circuit Protection
Output Over Voltage Circuit Protection
Power good function
Soft start time
Tss= VDAC×Css
2μA(typ)
[sec]
Incoming current
IIN= Co×VOUT
Tss
[A]
Soft start is exercised with the VRON pin set high.
Current control takes effect at startup, enabling a
moderate output voltage “ramping start.” Soft star
t
timing and incoming current are calculated with
formulas (1) and (2) below.
(Css: Soft start capacitor; Co: Output capacitor)
・・・(1)
・・・(2)
VOUT
SCP
VRON/UVLO
TSCP
VDAC×0.7 Short protection kicks in when output falls to or belo
w
(VDAC X0.7).
When the programmed time period elapses, output is
latched OFF to prevent destruction of the IC. Outpu
t
voltage can be restored either by reconnecting the
VRON pin or disabling UVLO. Short Circuit Protection
timing is calculated with formulas (3) below.
Short Circuit Protection time
Tscp= 1.2(V)×CSCP
2μA(typ)
[sec] ・・・(3)
VOUT
HG
LG
1.5V
Switching
Over voltage protection kicks and low side FET is the
status of full ON in when output is up to 1.5V or more
LG=HighHG=Low. It is operated ordinary with
falling of output.
VOUT-300mV
VOUT
TPWRGD
PWRGD_C
PWRGD
Power good function kicks in when output is from
(VOUT-300mV) to (VOUT+200mV). After setting, powe
r
good pin is the status of high. (Pull up the resistance
outside) Delay timing of power good is calculated with
formulas (4) below.
Power good delay time
TPWRGD =1.2(V)×CPWRGD_C
2μA(typ)
[sec] ・・・(4)
(CPWRGD : PWRGD_C pin capacitor)
VRON
SS
VOUT
IIN
TSS
Technical Note
BD9560MUV
10/21
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© 2010 ROHM Co., Ltd. All rights reserved.
External Component Selection
1. Inductor (L) selection
Passing a current larger than the inductor’s rated current will cause magnetic saturation in the inductor and decrease
system efficiency. In selecting the inductor, be sure to allow enough margin to assure that peak current does not exceed
the inductor rated current value.
To minimize possible inductor damage and maximize efficiency, choose a inductor with a low (DCR, ACR) resistance.
2. Output Capacitor (CO) Selection
Please give due consideration to the conditions in formula (9) below for output capacity, bearing in mind that output rise
time must be established within the soft start time frame.
Note: Improper capacitor may cause startup malfunctions.
3. Input Capacitor (Cin) Selection
A low ESR capacitor is recommended to reduce ESR loss and maximize efficiency.
The inductor value is a major influence on the output ripple current.
A
s formula (5) below indicates, the greater the inductor or the
switching frequency, the lower the ripple current.
ΔIL=
(VIN-VOUT)×VOUT
L×VIN×f
[
A
]
・・・
(
5
)
The proper output ripple current setting is about 30% of
maximum output current.
ΔIL=0.3×IOUTmax. [A]・・・(6)
L=
(VIN-VOUT)×VOUT
L×VIN×f
H
・・・
(
7
)
(ΔIL: output ripple current; f: switch frequency)
When determining the proper output capacitor, be sure to factor in the
equivalent series resistance required to smooth out ripple volume and maintain
a stable output voltage range.
Output ripple voltage is determined as in formula (8) below.
ΔVOUT=ΔIL×ESR [V]・・・(8)
(ΔIL: Output ripple current; ESR: CO equivalent series resistance)
In selecting a capacitor, make sure the capacitor rating allows sufficient
margin relative to output voltage. Note that a lower ESR can minimize output
ripple voltage.
Co Tss×(Limit-IOUT)
VOUT ・・・
(
9
)
Tss: Soft start time
Limit: Over current detection 2A(Typ)
Input Capacitor
The input capacitor selected must have low enough ESR resistance to fully
support large ripple output, in order to prevent extreme over current.
The formula for ripple current IRMS is given in (10) below.
IRMS=IOUT×VCC
(
VCC-VOUT
)
VCC
[
A
]
・・・
(
10
)
Where VCC=2×VOUT, IRMS= IOUT
2
ΔIL
VIN
IL
L
Co
VOUT
Output ripple current
VIN
L
Co
VOUT
ESR
Output Capacitor
VIN
L Co
VOUT
Cin
Technical Note
BD9560MUV
11/21
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© 2010 ROHM Co., Ltd. All rights reserved.
4. MOSFET Selection
5. Setting Detection Resistance
6. Setting Load Line Slope
Pmain=PRON+PGATE+PTRAN
Psyn=PRON+PGATE
The over current protection function detects the output ripple current
bottom value. This parameter (setting value) is determined as in formula
(13) below.
VIN
L
Co
VOUT
synchronous switch
main switch
VIN
L
Co
VOUT
Current limit
IL
R
Loss on the main MOSFET
(Ron: On-resistance of FET; Ciss: FET gate capacity;
f: Switching frequency Crss: FET inverse transfer function;
IDRIVE: Gate bottom current)
Loss on the synchronous MOSFET
VIN-VOUT
VIN
×RON×IOUT2+Ciss×f×VDD
=・・・(12)
VOUT
VIN
A
mplifier for setting
Load slope
R1
SS
VDAC
R1
R2
LSM
LSP
LG
HG IL
RSENSE
FB
R2
R1
×RSENSE×IL+ RSENSE×IL+VOUT
FB =
= (1+
R2
R1 ) × RSENSE×IL+VOUT
So that,
SLOPELL = (1+
R2
R1 ) × RSENSE
(SLOPELL : Load Line Slope)
VOUT
VIN
×RON×IOUT2+Ciss×f×VDD+
=
VIN2×Crss×IOUT×f
IDRIVE ・・・(11)
When it detect the over current protection from DCR of “the coil L”,
this parameter (setting value) is determined as in formula (14) below.
(VCL:CL voltage RL:DCR value of the coil)
[A]・・・(14)
ILMIT=VCL×1/16×
r×C
L
L
r×C
(RL= )
(VILIM: ILIM voltage; R: Detection resistance)
[A]・・・(13)
VCL×1/16
R
ILMIT=
VIN
L
Co
VOUT
Current limit
IL
RL
r C
Technical Note
BD9560MUV
12/21
www.rohm.com 2010.04 - Rev.C
© 2010 ROHM Co., Ltd. All rights reserved.
I/O Equivalent Circuit
1pin(PWRGD_C) 2pin(PWRGD) 3pin(SCP)
4pin(SS) 5pin(VID0) ~ 9pin(VID4) 10pin(DAC_C)
14pin(VREF) 16pin(CL),17pin(ISP) 18pin(ISM)
19pin(LSM),20pin(LSP),22pin(TON) 21pin(FB) 23pin(SUS_OUT)
24pin(SLLM) 25pin(VRON) 27pin(LG)
29pin(SW) 30pin(HG) 31pin(BOOT) 32pin(VIN)
VR_ON
VIN
VREF
SS
PWRGD_C
PWRGD
GND
SLLM
VCC
CL
ISP
SCP
SUS_OUT
VCC
ISM
BOOT HG
SW
VDD
LG
BOOT BOOT
HG
BOOT
S
W
HG
VID[0:4]
LSM
LSP
TON
DAC_C
FB
VCC
Technical Note
BD9560MUV
13/21
www.rohm.com 2010.04 - Rev.C
© 2010 ROHM Co., Ltd. All rights reserved.
Evaluation Board Circuit(Application for POS CAP)
R20
C17
VIN
VRON
VIN
VCC
VID0
VID4
VID2
VID1
VID3
Vcc Vcc
GND
VCC
VREF
SW6
SW1
SW2
SW3
SW4
SW5
R8
R3
R4
R6
R7
R1
C1
PWRGD
VREF
TON
PWRGD_C
SCP
SS
DAC
VCC
GND
C4
C2
C5 C6 C7 C8
C9
R14
R11
R15
R16
Vcc
VIN
R38
R37
R34
R28
R27
R22
R21
R24 R25
R29
R33
R31 R32
R36
C14
D2
Tr2a
L1
Tr1a Tr1b
PGND
VCC CORE
VIN_IC
VIN_IC
VCC
PVCC
BTS
HG
SW
LG
PGND
ISP
ISM
FB
LSM
LSP
SGND
SLLM
SUS_OUT
1
3
4
5
6
9
10 11
12
13
14
2
21
19
20
22
23
24
25
26
28
29
18
17
27
30
32
31
VREF
CL
C3 R13
16
PVCC
VIN
P_MON
15
P_MON
PULSE_I
N
VCC_CORE
VREF
CL
3.3V
3.3V
VCC_CORE
R2
R9
R10
R12
R17
R18
C10
SW7
C11
C12
R39
R40
R41
C13
D1
C16
C18 C19 C20 C21 C22 C23
R0
C24
R42
R43
Tr3B
GND
R19
R45R44
Tr3A
R30
VIN_IC
C15
R23
C25
R35
R26
VIN_FET VIN_FET
C_TON
R5
Technical Note
BD9560MUV
14/21
www.rohm.com 2010.04 - Rev.C
© 2010 ROHM Co., Ltd. All rights reserved.
Evaluation Board Parts List
Part No Value Company Part name Part No Value Company Part name
R0 0 ROHM MCR03 Series R41 - - -
R1 - - - R42 - - -
R2 - - - R43 - - -
R3 0 ROHM MCR03 Series R44 - - -
R4 0 ROHM MCR03 Series R45 0 ROHM MCR03 Series
R5 0 ROHM MCR03 Series C1 0.01uF MURATA GMR18 Series
R6 0 ROHM MCR03 Series C2 - - -
R7 0 ROHM MCR03 Series C3 - - -
R8 0 ROHM MCR03 Series C4 0.1uF MURATA GMR18 Series
R9 - - - C5 0.01uF MURATA GMR18 Series
R10 20k ROHM MCR03 Series C6 0.01uF MURATA GMR18 Series
R11 - - - C7 0.01uF MURATA GMR18 Series
R12 300k ROHM MCR03 Series C8 2200pF MURATA GMR18 Series
R13 47k ROHM MCR03 Series C9 1uF MURATA GMR18 Series
R14 0 ROHM MCR03 Series C10 - - -
R15 560k ROHM MCR03 Series C11 - - -
R16 62k ROHM MCR03 Series C12 - - -
R17 - - - C13 - - -
R18 0 ROHM MCR03 Series C14 0.22uF MURATA GMR18 Series
R19 10 ROHM MCR03 Series C15 10uF KYOCERA CM32X7R106M25A
R20 - - - C16 - - -
R21 1k ROHM MCR03 Series C17 10uF MURATA GMR21 Series
R22 1k ROHM MCR03 Series C18 - - -
R23 1M ROHM MCR03 Series C19 - - -
R24 3k ROHM MCR03 Series C20 10uF×8 KYOCERA CM21B106M06A
R25 1M ROHM MCR03 Series C21 - - -
R27 0 ROHM MCR03 Series C22 - - -
R28 0 ROHM MCR03 Series C23 330uF Panasonic EEFSX0D331XE
R29 - - - C24 - - -
R30 - - - C25 - - -
R31 0 ROHM MCR03 Series C-Ton - - -
R32 0 ROHM MCR03 Series
R33 - - - L1 0.7uH TDK VLM10055T-R70M120
R34 0 ROHM MCR03 Series D1 - - -
R35 0 ROHM MCR03 Series D2 Diode ROHM RB521S-30
R36 2 ROHM PMR100
R37 0 ROHM MCR03 Series TR1A FET NEC uPA2702
R38 0 ROHM MCR03 Series TR2A FET NEC uPA2702
R39 0 ROHM MCR03 Series TR3A - - -
R40 10 ROHM MCR03 Series TR3B - - -
Technical Note
BD9560MUV
15/21
www.rohm.com 2010.04 - Rev.C
© 2010 ROHM Co., Ltd. All rights reserved.
Evaluation Board Circuit(Application for ceramic capacitor)
R20
C17
VIN
VRON
VIN
VCC
VID0
VID4
VID2
VID1
VID3
Vcc Vcc
GND
VCC
VREF
SW6
SW1
SW2
SW3
SW4
SW5
R8
R3
R4
R6
R7
R1
C1
PWRGD
VREF
TON
PWRGD_C
SCP
SS
DAC
VCC
GND
C4
C2
C5 C6 C7 C8
C9
R14
R11
R15
R16
Vcc
VIN
R38
R37
R34
R28
R27
R22
R21
R24
R25
R29
R33
R31
R32
R36
C14
D2
Tr2a
L1
Tr1a Tr1b
PGND
VCC CORE
VIN_IC
VIN_IC
VCC
PVCC
BTS
HG
SW
LG
PGND
ISP
ISM
FB
LSM
LSP
SGND
SLLM
SUS_OUT
1
3
4
5
6
7
8
9
10 11
12
13
14
2
21
19
20
22
23
24
25
26
28
29
18
17
27
30
32
31
VREF
CL
C3 R13
16
PVCC
VIN
P_MON
15
P_MON
PULSE_IN
VCC_CORE
VREF
CL
3.3V
3.3V
VCC_CORE
R2
R9
R10
R12
R17
R18
C10
SW7
C11
C12
R39
R40
R41
C13
D1
C16
C18 C19 C20 C21 C22 C23
R0
C24
R42
R43
Tr3B
GND
R19
R45R44
Tr3A
R30
VIN_IC
C15
R23
C25
R35
R26
VIN_FET VIN_FET
C_TON
R5
Technical Note
BD9560MUV
16/21
www.rohm.com 2010.04 - Rev.C
© 2010 ROHM Co., Ltd. All rights reserved.
Evaluation Board Parts List
Part No Value Company Part name Part No Value Company Part name
R0 0 ROHM MCR03 Series R41 - - -
R1 1k ROHM MCR03 Series R42 - - -
R2 - - - R43 - - -
R3 0 ROHM MCR03 Series R44 - - -
R4 0 ROHM MCR03 Series R45 0 ROHM MCR03 Series
R5 0 ROHM MCR03 Series C1 0.01uF MURATA GMR18 Series
R6 0 ROHM MCR03 Series C2 - - -
R7 0 ROHM MCR03 Series C3 - - -
R8 0 ROHM MCR03 Series C4 0.1uF MURATA GMR18 Series
R9 - - - C5 0.01uF MURATA GMR18 Series
R10 20k ROHM MCR03 Series C6 0.01uF MURATA GMR18 Series
R11 - - - C7 0.01uF MURATA GMR18 Series
R12 300k ROHM MCR03 Series C8 2200pF MURATA GMR18 Series
R13 47k ROHM MCR03 Series C9 1uF MURATA GMR18 Series
R14 0 ROHM MCR03 Series C10 - - -
R15 560k ROHM MCR03 Series C11 - - -
R16 62k ROHM MCR03 Series C12 - - -
R17 - - - C13 - - -
R18 0 ROHM MCR03 Series C14 0.47uF MURATA GMR21 Series
R19 10 ROHM MCR03 Series C15 10uF KYOCERA CM32X7R106M25A
R20 - - - C16 - - -
R21 1k ROHM MCR03 Series C17 10uF MURATA GMR21 Series
R22 1k ROHM MCR03 Series C18 - - -
R23 1M ROHM MCR03 Series C19 47uF×4 KYOCERA CM32B476M06A
R24 3k ROHM MCR03 Series C20 47uF×4 KYOCERA CM32B476M06A
R25 1M ROHM MCR03 Series C21 - - -
R27 0 ROHM MCR03 Series C22 - - -
R28 0 ROHM MCR03 Series C23 - - -
R29 - - - C24 - - -
R30 - - - C25 - - -
R31 0 ROHM MCR03 Series C-Ton - - -
R32 0 ROHM MCR03 Series
R33 - - - L1 0.7uH Panasonic ETQP2H0R7BFA
R34 0 ROHM MCR03 Series D1 - - -
R35 0 ROHM MCR03 Series D2 Diode ROHM RB521S-30
R36 2 ROHM PMR100
R37 0 ROHM MCR03 Series TR1A FET NEC uPA2702
R38 0 ROHM MCR03 Series TR2A FET NEC uPA2702
R39 0 ROHM MCR03 Series TR3A - - -
R40 10 ROHM MCR03 Series TR3B - - -
Technical Note
BD9560MUV
17/21
www.rohm.com 2010.04 - Rev.C
© 2010 ROHM Co., Ltd. All rights reserved.
Evaluation Board Circuit(Application for VIN UVLO OFF)
R20
C17
VIN
VRON
VCC
VID0
VID4
VID2
VID1
VID3
Vcc Vcc
GND
VCC
VREF
SW6
SW1
SW2
SW3
SW4
SW5
R8
R3
R4
R6
R7
C1
PWRGD
VREF
TON
PWRGD_C
SCP
SS
DAC
VCC
GND
C4
C2
C5 C6 C7 C8
C9
R14
R11
R15
R16
Vcc
VIN
R38
R37
R34
R28
R27
R22
R21
R24 R25
R29
R33
R31 R32
R36
C14
D2
Tr2a
L1
Tr1a Tr1b
PGND
VCC CORE
VIN_IC
VIN
VCC
PVCC
BTS
HG
SW
LG
PGND
ISP
IS
M
FB
LSM
LSP
SGND
SLLM
SUS_OUT
1
3
4
5
6
7
8
9
10 11
12
13
14
2
21
19
20
22
23
24
25
26
28
29
18
17
27
30
32
31
VREF
CL
C3 R13
16
PVCC
P_MON
15
P_MON
PULSE_IN
VCC_CORE
VREF
CL
3.3V
3.3V
VCC_CORE
R2
R9
R10
R12
R17
R18
C10
SW7
C11
C12
R39
R40
R41
C13
D1
C15 C16
C18 C19 C20 C21 C22 C23
R0
C24
R42
R43
Tr3B
GND
R19
R45R44
Tr3A
R30
VCC
R23
C25
R35
R26
VIN_FET VIN_FET
C_TON
R5
Technical Note
BD9560MUV
18/21
www.rohm.com 2010.04 - Rev.C
© 2010 ROHM Co., Ltd. All rights reserved.
Evaluation Board Parts List
Part No Value Company Part name Part No Value Company Part name
R0 0 ROHM MCR03 Series R41 - - -
R1 1k ROHM MCR03 Series R42 - - -
R2 - - - R43 - - -
R3 0 ROHM MCR03 Series R44 - - -
R4 0 ROHM MCR03 Series R45 0 ROHM MCR03 Series
R5 0 ROHM MCR03 Series C1 0.01uF MURATA GMR18 Series
R6 0 ROHM MCR03 Series C2 - - -
R7 0 ROHM MCR03 Series C3 - - -
R8 0 ROHM MCR03 Series C4 0.1uF MURATA GMR18 Series
R9 - - - C5 0.01uF MURATA GMR18 Series
R10 20k ROHM MCR03 Series C6 0.01uF MURATA GMR18 Series
R11 - - - C7 0.01uF MURATA GMR18 Series
R12 300k ROHM MCR03 Series C8 2200pF MURATA GMR18 Series
R13 47k ROHM MCR03 Series C9 1uF MURATA GMR18 Series
R14 0 ROHM MCR03 Series C10 - - -
R15 560k ROHM MCR03 Series C11 - - -
R16 62k ROHM MCR03 Series C12 - - -
R17 - - - C13 - - -
R18 0 ROHM MCR03 Series C14 0.22uF MURATA GMR18 Series
R19 10 ROHM MCR03 Series C15 10uF KYOCERA CM32X7R106M25A
R20 - - - C16 - - -
R21 1k ROHM MCR03 Series C17 10uF MURATA GMR21 Series
R22 1k ROHM MCR03 Series C18 - - -
R23 1M ROHM MCR03 Series C19 - - -
R24 3k ROHM MCR03 Series C20 10uF×8 KYOCERA CM21B106M06A
R25 1M ROHM MCR03 Series C21 - - -
R27 0 ROHM MCR03 Series C22 - - -
R28 0 ROHM MCR03 Series C23 330uF Panasonic EEFSX0D331XE
R29 - - - C24 - - -
R30 - - - C25 - - -
R31 0 ROHM MCR03 Series C-Ton - - -
R32 0 ROHM MCR03 Series
R33 - - - L1 0.7uH TDK VLM10055T-R70M120
R34 0 ROHM MCR03 Series D1 - - -
R35 0 ROHM MCR03 Series D2 Diode ROHM RB521S-30
R36 2 ROHM MCR03 Series
R37 0 ROHM MCR03 Series TR1A FET NEC uPA2702
R38 0 ROHM MCR03 Series TR2A FET NEC uPA2702
R39 0 ROHM MCR03 Series TR3A - - -
R40 10 ROHM MCR03 Series TR3B - - -
Technical Note
BD9560MUV
19/21
www.rohm.com 2010.04 - Rev.C
© 2010 ROHM Co., Ltd. All rights reserved.
Operation Notes and Precautions
1. This integrated circuit is a monolithic IC, which (as shown in the figure below), has P isolation in the P substrate and
between the various pins. A P-N junction is formed from this P layer and N layer of each pin, with the type of junction
depending on the relation between each potential, as follows:
When GND element A element B, the P-N junction is a diode.
When element BGND element A, the P-N junction operates as a parasitic transistor.
Parasitic diodes inevitably occur in the structure of the IC. The operation of parasitic diodes can result in mutual interference
among circuits, as well as operating malfunctions and physical damage. Therefore, be careful to avoid methods by which
parasitic diodes operate, such as applying a voltage lower than the GND (P substrate) voltage to an input pin.
2. In some modes of operation, power supply voltage and pin voltage are reversed, giving rise to possible internal circuit
damage. For example, when the external capacitor is charged, the electric charge can cause a VCC short circuit to the
GND. In order to avoid these problems, inserting a VCC series countercurrent prevention diode or bypass diode between
the various pins and the VCC is recommended.
3. Absolute maximum rating
Although the quality of this IC is rigorously controlled, the IC may be destroyed when applied voltage or operating
temperature exceeds its absolute maximum rating. Because short mode or open mode cannot be specified when the IC is
destroyed, it is important to take physical safety measures such as fusing if a special mode in excess of absolute rating
limits is to be implemented.
4.GND potential
Make sure the potential for the GND pin is always kept lower than the potentials of all other pins, regardless of the
operating mode.
5. Thermal design
In order to build sufficient margin into the thermal design, give proper consideration to the allowable loss (Power
Dissipation) in actual operation.
6. Short-circuits between pins and incorrect mounting position
When mounting the IC onto the circuit board, be extremely careful about the orientation and position of the IC. The IC may
be destroyed if it is incorrectly positioned for mounting. Do not short-circuit between any output pin and supply pin or
ground, or between the output pins themselves. Accidental attachment of small objects on these pins will cause shorts and
may damage the IC.
VCC
Pin
Countercurrent
prevention diode
Bypass diode
GND
(Pin A)
P+ P+
N N
N
P
P Parasitic pin
GND
Resistance
GND
Parasitic pin
P substrate
N
P
N
C
(Pin B) B
E
P+ P+
N
N
Transistor (NPN)
(Pin B)
C
E
B
GND
Parasitic
transistor
Other pins in close
proxiity
(Pin A)
Parasitic
transistor
GND
Technical Note
BD9560MUV
20/21
www.rohm.com 2010.04 - Rev.C
© 2010 ROHM Co., Ltd. All rights reserved.
7. Operation in strong electromagnetic fields
Use in strong electromagnetic fields may cause malfunctions. Use extreme caution with electromagnetic fields.
8. Thermal shutdown circuit
This IC is provided with a built-in thermal shutdown (TSD) circuit, which is activated when the operating temperature
reaches 175 (standard value), and has a hysteresis range of 15 (standard). When the IC chip temperature rises to
the threshold, all the inputs automatically turn OFF. Note that the TSD circuit is provided for the exclusive purpose shutting
down the IC in the presence of extreme heat, and is not designed to protect the IC per se or guarantee performance when
or after extreme heat conditions occur. Therefore, do not operate the IC with the expectation of continued use or
subsequent operation once the TSD is activated.
9. Capacitor between output and GND
When a larger capacitor is connected between the output and GND, Vcc or VIN shorted with the GND or 0V line – for any
reason – may cause the charged capacitor current to flow to the output, possibly destroying the IC. Do not connect a
capacitor larger than 1000uF between the output and GND.
10. Precautions for board inspection
Connecting low-impedance capacitors to run inspections with the board may produce stress on the IC. Therefore, be
certain to use proper discharge procedure before each process of the operation. To prevent electrostatic accumulation and
discharge in the assembly process, thoroughly ground yourself and any equipment that could sustain ESD damage, and
continue observing ESD-prevention procedures in all handling, transfer and storage operations. Before attempting to
connect components to the test setup, make certain that the power supply is OFF. Likewise, be sure the power supply is
OFF before removing any component connected to the test setup.
11. GND wiring pattern
When both a small-signal GND and high current GND are present, single-point grounding (at the set standard point) is
recommended, in order to separate the small-signal and high current patterns, and to be sure the voltage change
stemming from the wiring resistance and high current does not cause any voltage change in the small-signal GND. In the
same way, care must be taken to avoid wiring pattern fluctuations in any connected external component GND.
Power Dissipation
Ambient Temperature [Ta]
Power Dissi
p
ation
[
Pd
]
1501251007550 25 0
200
400
600
800
1000
[]
[mW]
880mW
380mW
70mm×70mm×1.6mm Glass-epoxy PCB
θja=142.0/W
With no heat sink θj-a=328.9/W
Technical Note
BD9560MUV
21/21
www.rohm.com 2010.04 - Rev.C
© 2010 ROHM Co., Ltd. All rights reserved.
Ordering part number
B D 9 5 6 0 M U V - E 2
Part No. Part No.
Package
MUV : VQFN032V5050
Packaging and forming specification
E2: Embossed tape and reel
(Unit : mm)
VQFN032V5050
0.08 S
S
1.0MAX
(0.22)
0.02+0.03
-
0.02
24
81
9
32
16
25 17
0.5
0.75
0.4±0.1
3.4±0.1
3.4±0.1
0.25 +0.05
-
0.04
C0.2
5.0±0.1
5.0±0.1
1PIN MARK
Order quantity needs to be multiple of the minimum quantity.
<Tape and Reel information>
Embossed carrier tapeTape
Quantity
Direction
of feed
The direction is the 1pin of product is at the upper left when you hold
reel on the left hand and you pull out the tape on the right hand
2500pcs
E2
()
Direction of feed
Reel 1pin
R1010
A
www.rohm.com
© 2010 ROHM Co., Ltd. All rights reserved.
Notice
ROHM Customer Support System
http://www.rohm.com/contact/
Thank you for your accessing to ROHM product informations.
More detail product informations and catalogs are available, please contact us.
Notes
No copying or reproduction of this document, in part or in whole, is permitted without the
consent of ROHM Co.,Ltd.
The content specied herein is subject to change for improvement without notice.
The content specied herein is for the purpose of introducing ROHM's products (hereinafter
"Products"). If you wish to use any such Product, please be sure to refer to the specications,
which can be obtained from ROHM upon request.
Examples of application circuits, circuit constants and any other information contained herein
illustrate the standard usage and operations of the Products. The peripheral conditions must
be taken into account when designing circuits for mass production.
Great care was taken in ensuring the accuracy of the information specied in this document.
However, should you incur any damage arising from any inaccuracy or misprint of such
information, ROHM shall bear no responsibility for such damage.
The technical information specied herein is intended only to show the typical functions of and
examples of application circuits for the Products. ROHM does not grant you, explicitly or
implicitly, any license to use or exercise intellectual property or other rights held by ROHM and
other parties. ROHM shall bear no responsibility whatsoever for any dispute arising from the
use of such technical information.
The Products specied in this document are intended to be used with general-use electronic
equipment or devices (such as audio visual equipment, ofce-automation equipment, commu-
nication devices, electronic appliances and amusement devices).
The Products specied in this document are not designed to be radiation tolerant.
While ROHM always makes efforts to enhance the quality and reliability of its Products, a
Product may fail or malfunction for a variety of reasons.
Please be sure to implement in your equipment using the Products safety measures to guard
against the possibility of physical injury, re or any other damage caused in the event of the
failure of any Product, such as derating, redundancy, re control and fail-safe designs. ROHM
shall bear no responsibility whatsoever for your use of any Product outside of the prescribed
scope or not in accordance with the instruction manual.
The Products are not designed or manufactured to be used with any equipment, device or
system which requires an extremely high level of reliability the failure or malfunction of which
may result in a direct threat to human life or create a risk of human injury (such as a medical
instrument, transportation equipment, aerospace machinery, nuclear-reactor controller, fuel-
controller or other safety device). ROHM shall bear no responsibility in any way for use of any
of the Products for the above special purposes. If a Product is intended to be used for any
such special purpose, please contact a ROHM sales representative before purchasing.
If you intend to export or ship overseas any Product or technology specied herein that may
be controlled under the Foreign Exchange and the Foreign Trade Law, you will be required to
obtain a license or permit under the Law.