MIL SPECS IcR H0001e5 0001313 T B MIL-S-19590/245F AMENDMENT 1 14 May 1985 MILITARY SPECIFICATION SEMICONDUCTOR DEVICE, DIQDE, SILICON, POWER RECTIFIER TYPES 1N3239, 13291, 1N3293, 1N3294, 113295, AND R TYPES, JAN, JANTX, AND JANTXV This amendaent forns a part of Military Specification MIL-S-19500/246F, dated 14 December 1984, and is approved for use by all epartments and Agencies of the Department Defense. PAGE TABLE I1, Subgroup 2, Hernetic seal, Gross leak, Corditions column: Delete Test condition C, step 2? or test condition Dd". PASE 7 TABLE L1, Subgroup 7, LTPO column: Add 20". PAGE 3 TABLE III, Subgroup 2, Hermetic seal, Gross leak, Conditions column: Delete Test condition , step 2, or test condition 1". Custodians Prenaring activity: Army - ER Army - ER Navy - EC Air Force - 17 (Project 5941-9988) Raview actvities: Aray - 4R, il Air Force - 11, 19, 85, 99 OLA - ES User activities: Army - SM Navy - AS, CG, OS, SH Agent: DLA - ES 1 of 1 FS 59461MIL SPECS Ich g0001e5 0001314 1 i AIL s-rostos2acr 14 December 1984 a MIL-S-19500/246E 4 February 1983 MILITARY SPECIFICATION SEMICONDUCTOR DEVICE, DIODE, SILICON, POWER RECTIFIER, TYPES 1N3289, 1N3291, 1N3293, 1N3294, 1N3295, AND R TYPES, JAN, JANTX, JANTXV This specification is approved for use by all De- partments and Agencies of the Department of Defense. 1. SCOPE 1.1 Scope. This specification covers the detail requirements for silicon power rectifiers. Three lavels of product assurance are provided for each device type as specified in MIL-S-19500. 1.2 Normal and reverse types (reverse types, suffix R). Reverse and normal types are identical except the normal types have the cathode connected to the stud and the reverse types have the anode connected to the stud. Oesignated values are applicable to both types. 1.3 Physical dimensions. See figure 1 (DO-205AA - formerly 00-8). 1.4 Ratings and characteristics. T TO | | | { Ig i Ig | | | Ty I | | | | 3. 5. | Barometric | | | Type | Vpsq | Vaym [Tc = 150C | Tc = 134 | Ipsq | pressure | and | \ | I | | ! ) ! (reduced) ! | | | | | 1/120s STG | | | | | | | | | | | | | | T | ly | ! ! V- (pk) ! V_(pk) ! A_de ! A de | A (pk) mm Hg ! Ct | 1n3289 | 240 | 200 | 75 | 100 i 1600 | ~-- {| -65 | | | | | | | | | | | 1n3291 | 480 [| 400 | 75 | 100 } 1600 | 8 | | | | | | | | | | to | 1N3293 720 ! 600 75 | 100 ! 1600 | 8 ! | 1N3294 | 960 {| 800 | 75 | 100 i 1600 ! 15 +200 | | { I l | | | | 1N3295 | 1200 | 1000 | 75 | 100 1 1600 | 15 | | | | | | | | t | | | | | | | | | | | 1/ Derate linearly 1.5 A de/C for Tc > 134C. 1.5 Thermal resistance characteristic: Rgjc = 0.4CM. Beneficial comments (recommendations, additions, deletions) and any pertinent data which { may be of use in improving this document should be addressed to: U.S. Army Electronics Research and Development Command, ATTN: DELET-R-S, Fort Monmouth, Nd 07703, by using the self-addressed Standardization Document Improvement Proposal (DD Form 1426) appearing at the end of this document or by letter. ' FSC 5961MIL SPECS ICM O0001e5 O001315 3 5 MIL-S-19500/246F 2. APPLICABLE DOCUMENTS 2.1 Government specifications and standards. Unless otherwise specified, the following specifi- cation and standard, of the Tssue T?sted in that issue of the Department of Defense Index of Spec- ifications and Standards specified in the solicitation, form a part of this specification to the extent specified herein. SPECIFICATION MILITARY MIL-S-19500 - Semiconductor Devices, General Specification for. STANDARD MILITARY MIL-STD-750 - Test Methods for Semiconductor Devices. (Copies of specifications, standards, handbooks, drawings, and publications required by manufacturers in connection with specific acquisition functions should be obtained from the contracting activity or as directed by the contracting officer.) 2.2 Order of precedence. In the event of a conflict between the text of this specification and the references cited herein, the text of this specification shall take precedence. 3. REQUIREMENTS 3.1 Detail specification. The individual item requirements shall be in accordance with MIL-S-19500 and as specified herein. 3.2 Abbreviations, symbols, and definitions. The abbreviations, symbols, and definitions used herein are defined in MIL-S-19500. 3.3 Design, construction, and physical dimensions. The design, construction, and physical dimensions shal? be as specified fn MIL-S-19500, and figure 1 herein. 3.4 Marking. Marking shall be in accordance with MIL-S-19500. 4. QUALITY ASSURANCE PROVISIONS 4.1 Sampling and inspection. Sampling and inspection shall be in accordance with MIL-S-19500, and as specified herein. 4.2 Qualification inspection. Qualification inspection shall be in accordance with MIL-S-19500. 4.3 Screening (JANTX and JANTXV levels only). Screening shall be in accordance with MIL-S-19500 (table TI), and as specified herein. Measurements required by the applicable screening steps of MIL-S-19500 are as follows, with the limits in accordance with table I herein. TSceren I Measurement i I(see table II ] lof MIL-STD-19500) | JANTX and JANTXV levels [ l pened aus may be used Tn Tieu of 2074 for compression bonded devices ony | 4 19900G; Performed prior to Installation of external lead. qT | | 10 hot applicable. il Ret and Veq of subgroup 2 of table I herein. 12 poened 1038, condition A; Vay = Vpyy rated (see 1.4), Te = 150C; f = 60 Mme | 13 [Subgroup 2 of table I herein: Alpmy = 40.5 mA (pk} or 100% of Initial I ! mM = 40.1 V (pk). ! Ivalue whichever fs greater. AVFMIL SPECS > IC O000L25 WUUL3Ib SE MIL-S-19500/246F . Nb $0 FLEXIBLE LEAD TERM. { 2 W f To @M SEATING~ H PLANE Dimensions Inches Millimeters SYMBOL [Win | Max Min Max | NOTES A 1.1740 28.96 b -670 17.02 c , 050 .120 1.27 3.05 9) 625 | 1.000 15.88 25.40 PD, 500 12.70 E 1.031 | 1.063 26.19 27.00 F 125 500 3.18 12.70 5 H 4.300 | 5.065 109.22 | 128.65 I, .300 .450 7.62 17.43 6 gM .343 .373 8.71 9.47 3 N .605 .645 15.37 16.38 Q 1.750 44.45 ot .250 .310 6.35 7.87 W 4 NOTES: 1. Dimensions are in inches. 2. Metric equivalents are given for general information only. 3. Complete threads to extend to within 2-1/2 threads of seating plane. 4. .375-24 UNF-2A. Maximum pitch diameter of plated threads shall be basic pitch diameter (.3479 (8.837 mm) inches) reference. 5. A chamfer or undercut on one or both ends of hexagonal portions is optional. 6. Minimum flat. . 7. For marking see 3.4. x y FIGURE 1.- Physical dimensions.MIL SPECS IC@ O0001e5 0001317? 7 a MIL -S-19590/246F 4.4 Quality conformance inspection. Quality conformance inspection shall be in accordance with MIL-S-19500. 4.4.1 Group A inspection. Group A inspection shall be conducted in accordance with MIL-S-19500, and table IT herein. Electrical measurements shall be in accordance with the applicable steps of table IV herein. 4.4.2 Group B inspection. Group B inspection shall be conducted in accordance with the conditions specified for subgroup testing in table IVb of MIL-S-19500, and table II herein. Electrical measurements (end points) and delta requirements shall be in accordance with the applicable steps of table IV herein. 4.4.3 Group C inspection. Group C inspection shall be conducted in accordance with the conditions specified for subgroup testing in table V of MIL-S-19500, and table III herein. Electrical measurements (end points) shall be in accordance with the applicable steps of table IV herein. 4.5 Methods of inspection. Methods of inspection shall be as specified in the appropriate tables and as follows: 4.5.1 Power cycling. One complete test shall be as follows: First, heat the case to the maximum temperature specified by passing the specified amount of forward current through the diode under test. Then, remove the applied current and allow the case temperature to cool to the minimum case temperature specified. No time limit is applicable to any one cycle, but the cycling shall be continuous until the required number of cycles have been completed. 5. PACKAGING 5.1 Packaging requirements. The requirements for packaging shall be in accordance with MIL-S-19500. 6. NOTES 6.1 Notes. The notes specified in MIL-S-19500 are applicable to this specification. 6.2 Changes from previous issue. Asterisks are not used in this revision to identify changes with respect to the previous issue due to the extensiveness of the changes. Custodians: Preparing activity: Army - ER Army ~- ER Navy - EC Air Force - 17 Review activities: (Project 5961-0946) Army - AR, MI Air Force - 11, 19, 85, 99 DLA - ES User activities: Army - SM Navy - AS, CG, OS, SH Agent: DLA - ESMIL SPECS TCff 0o00125 O001318 9 & MIL~S-19500/246F TABLE I. Group A inspection. { T WIL=STO=750 t i tcimits 1 i I Inspection | |LTPD [Symbol | { Unit | [Method Conditions 1/ | lin Max { l I I I T | | | | Subgroup bot ee | Visual and mechanical | 2071 | | | | | | | 1 inspection { | | I l | | f o> | | | | | | l | | Subgroup 2 { | | | | | | { | | | | | I | { | | Forward voltage } 4011 | Pulse method: | [Vem1 [e-- [1.551V (pk) | | | | Ipm = 310 A (pk); i | | | | { | | { pulse width = 8.3 ms | | | | | | | | | max; | | | | { i | \ ! duty cycle = 2% max ! |! | ! | | Reverse current 4016 | AC method: ! RM | | | | \ { | 1N3289 | | Vpm = 200 V (pk) | | j--- | 10 [mA (pk) | 1N3291 | | Vay = 400 V (pk) | | [--- | 10 {mA (pk) | | 1N3293 | Vpm = 600 V (pk) | | [--- | 10 {mA (pk) | | 1N3294 { i Vay = 900 V (pk) | | j--- | 10 ImA (pk)] { 1N3295 Vay = 1000 V (pk) I--- | 10 ink (pk) | l | | | Reverse current at | 4016 | AC method: | IIpme | | | | ! peak reverse voltage | ! | { | | | { | 1N3289 | | Vey = 240 V (pk) | | j--- | 40 [mA (pk) | 1N3291 | | Vay = 480 V (pk) | | J--- | 40 {mA (pk) | | 1N3293 | | Vpq = 720 V (pk) | | [--- | 40 [mA (pk) | | 1N3294 | | Vem = 960 V (pk) | | |--- [| 40 ImA (pk) | { 1N3295 l | Voy = 1200 V (pk) no 40 Ima (ok) | { | | Sberow Pot | High temperature | | Te = 200C | | | | | I | operation: | | | | | | | | l | | | | | | | Reverse current 4016 AC method: (Tres ! | | 1N3289 | Vay = 200 V (pk) | | j--- | 30 |mA (pk)| | 1N3291 | | Vem = 400 V (pk) | | j--- { 30 ImA (pk)| | 1N3293 | Vem = 600 V (pk) | | [--- | 30 |mA (pk)| | 1N3294 | | Vpm = 800 V (pk) | | j--- | 30 ImA (pk) I ! 1N3295 ! Vpm = 1000 Vv (pk) ! ! In-- 30 Ina (pk) | Low-temperature | | Te = -65C | { | | | | | operation: | | | | l | | | | | | | i | \ | l | Forward voltage | 4011 | Pulse method: | \Vemp I--- 11.451V (pk) | | | | Ipy = 310 A (pk); { | | | | | | | | pulse width = 8.3 ms | | | | | | | l | max; | \ \ | | | | | | duty cycle = 2% max | | | | | | { | | i | | I | | | Reverse current } 4016 | AC method: | lIpma | | | ! | | I { | | | | | 1N3289 | | Vem = 200 V (pk) | | |--- | 40 Ima pk) | | 1N3291 | I Vp = 400 (pk) | | J--- | 40 ImA (pk) | 1N3293 | | Yam = 600 V (pk) | | l--- | 40 |mA (pk) | | 1N3294 | | Vpy = 800 V (pk) | | [--- | 40 |mA (pk)I | 1N3295 \ | Vem = 1000 V (pk) | l |--- | 40 ImA (pk) | | | | | | I | | l See footnotes at end of table.MIL SPECS Ic oo000125 0001315 a i MIL-S-19500/246F TABLE I. Group A inspection - continued. a. Fine Teak Test condition C, step 2 or test condition 0 b. Gross leak | Electrical See table IV, steps 1 and 2 | measurements | T MIL=STD-750 T [Cimits T | | Inspection | JLTPD [Symbol | | Unit | | [Method | TondttTons Ti/ | [Min Max | | | | | { { | | | | | i | | | | | dT | i Subgroup 4 { l | | i { | | | I { | | | | | | | Not applicable | | | | 1 | | | | . | | | | | I | | | | i | | i | | | i Subgroup 5 | | { i | | | i | | { | | { l | | | Not applicable | | | ] | | | | | | | | | | | | | | | | | | | | | | | Subgroup 6 | | | | | | | | | | | | | | | { | | Surge current | 4066 | Te = 150C; | | | | { | | | | Ipsy = 1600 A (pk); | | | | | | | | | Ig = 75 A de; | | { | | { l | | ten 1/120 s | | | | i | i | | surges; | | | | | | { | { 1 surge/minute | { | | | I | 1 Vem = Vem | | { | | { | | (see 1.4) { | | { | | | | | { | \ | | | Electrical | | See table IV, | I | | | | | measurements I | steps 1 and 2 | | | | I | I | | | | | I | | | [ | | | | | i | jae ane [ Not applicable | | | | | | | l \ i | | | | | | 1 | | { | | | | I l | | | { | | | | 1/ For LTPD values, see MIL-S-19500. TABLE II. Group B inspection. ] MIL-STD-750 | | Inspection | TL-STD-7 | LTPD iethod Conditions ! i/ | | | | ! Subgroup 1 ! [Resistance to solvents| 1022 ! | | | I | Subgroup 2 ! ! | | Thermal shock {1051 | | (temperature cycling) | ! | ! Hermetic seal ! 1071 ! ! | | | | | i | | | | | | | | | | | { | | | | i 1 \ | See footnotes at end of table.MIL SPECS TABLE II. 4Sroup B inspection - continued. MIL-S-19500/246F IcJfoooo12s ooo1ae0 7? & (nonoperating) life Electrical measurements Subgroup 7 Power cycling Electrical measurements See table IV, steps 1 and 2 See 4.5.1, Ig = 75 4 des Tc, (low) = 40C; Te (high) = 5000 cycles 150C; See table IV, steps 1, 2, and 3 | | ~STD- [ | Inspection | MIL~STD-750 { LTPO | [Method | Conditions | | | | | | | 1 | ! Subgroup 3 ! ! | Blocking life | --- | Te = 200C; Vawm = VRM | | | | (see 1.4); | | | | = 03 half-sine wave, | I | | 63 Hz; t = 340 hours | { | { | | Electrical { | See table IV, steps 1 and 2 { | measurements | | (step 2 should be performed before | | | i step 1) | | I | \ | | | { Subgroup 4 | i | Decap internal visual! 2075 | | | design verification | | { | | | | | | | | | | | | ! Subgroup 5 ! ! | Thermal resistance 3151 Rego = 0-4C/M | | { \ | | ! Subgroup 6 ! ! ! High temperature | 1032 Ta = 200C l | | \ | | | | | | | | | | | | | | | { | { | | \ | | | | | | | { | | | | l | | | | | | | | | { | | | | | | | | | | | | { | / For LTPD values, see MIL-S-19500.MIL SPECS iC ooo01e5 0001321 9 MIL-S-19500/246F TABLE IIT. Group C inspection. i MIL-STD-750 l { Inspection | LTPD 1/ | | IMethod | Conditions | | | | | T Subgroup 1 | Physical dimensions ! | See figure 1 2066 ~ Subgroup 2 | | ( i | | | | | | | ! (glass strain) ! | | | [ | | | | | and Y2 orientations See table IV, steps 1 and 2 Electrical measurements | | | | i | | | i | | | i | I | | | | | | | [ | i | Thermal shock 1056 Test condition B | | | Terminal strength 2036 | Tension (lead) | Test condition A; i | | i weight = 109 1b; | | I lt=+15 435 | | | | | | | Torque (terminal) | | Test condition Di, i | i j | 10 Tb-in; | | ! | t=15 435 ! | | Torque (stud) | | Test condition 02; | | | | | 125 Ib-in; | | i | ft=15 43 5 | | i i i | I ! Hermetic seal ! 1071 ! ! i a. Fine leak | | | | | I | | | | b. Gross leak | | Test condition C, | [ | | | step 2, or test | | condition D ! | Moisture resistance ! 1021 ! ! | | Visual and mechanical{ 2071 | I | | inspection | i | | | | | I | | | | | i | Electrical | | See table IV, steps 1 | | | measurements | | and 2 | | | | | | | | | | | ! Subgroup 3 ! ! ! | Shock 1 2016 { 500G; t = 1 ms; | | I | | 5 blows each | | | | | orientation: { I ! X1, Yl, and Y2 | ! | Vibration, variable | 2056 | 10 G, nonoperating [ | frequency | Constant acceleration| 2006 ! 5,000 G; X1, Yl, ! ! | | | | | | | | | | i | i | | | [ | | { | | | | | See footnotes at end of table.(change) _ MIL SPECS Icffooo0125 ooo1z22 o & MIL~-S-19500/245F TABLE III. Group C inspection - continued. TT T T MIL=STD-750 T T { Inspection l | | LTPp 1/ | | [Method | Condittons | | | | | | | | 1 | | i ! Subgroup 4 ! ! ! | Salt atmosphere | 1046 | Test condition B | i | (corrosion) | | | | | | | | i ! Subgroup 5 ! ! | Barometric {| 1901 | t = 60s | | | pressure, reduced { | | | | (altitude operation) | ! | ! 1N3291, 1N3293 ! Pressure = 8 mm Hg | ] 1N3294, 1N3295 | | Pressure = 15 mm Hg | | | { { | Measurement | | See table IV, step 2 | | | during test { { | | | | | | | i Subgroup 6 | | | l | | | | | | Blocking life | --- | Te = 200 C; | | | | 1 Vawa = Vem | i | | | (see 1.4); | | I | | Ip = 0; half-sine | | { | | wave; f = 60 Hz; | | | ! t = 1000 hrs | | Electrical | | See table IV, steps 1 | | | measurements | ] and 2 (step 2 shall be | | ! | | performed before step 1) | | | 1/ For LTPD values, see MIL-S-19500. TABLE IV. Groups A, 8, and C end-point electrical measurements. T ] t MIL-STD~750 | | Limits | | {Step | Inspection | 1 Symbol | | Unit | | ! Method! Conditions | in Max | I | | | | | I i | 1. {Forward voltage! 4011 |Pulse method: | Vem |--- |1.551V (pk) | | | | [Ipy = 310 A (pk); | | | | | | { | Ipulse width = 8.3 ms max; | { { i | { | | Jduty cycle = 2% max | | | | | | | l | | \ { | { 2. {Reverse current! 4016 IAC method: ! TpM1 ! ! ! | l 1N3289 | IVpq = 200 V (pk) | J--- | 10 mA (pk)l | | 1N3291 | IVpq = 400 V (pk) { j--- | 10 [mA (pk) | l | 1N3293 { lVpm = 600 V (pk) | j--- 1.10 ImA (pk)| | | 1N3294 | IVpq = 800 V (pk) { j--- 1 10 ImA (pk)| ! 1N3295 IRM = 1000 V (pk) I--- ! 10 |mA (Pk) | | | | | | | | | ! 3. |Forward voltagel 4011 eM = 310 A (pk) AVEM |--- 1+0.11V (pk) \ | | | \