2011-2012 Microchip Technology Inc. Preliminary DS61168E-page 1
PIC32MX1XX/2XX
Operating Conditions
2.3V to 3.6V, -40ºC to +105ºC, DC to 40 MHz
2.3V to 3.6V, -40ºC to +85ºC, DC to 50 MHz
Core: 50 MHz/83 DMIPS MIPS32® M4K®
MIPS16e® mode for up to 40% smaller code size
Code-efficient (C and Assembly) architecture
Single-cycle (MAC) 32x16 and two-cycle 32x32 multiply
Clock Management
0.9% internal oscillator
Programmable PLLs and oscillator clock sources
Fail-Safe Clock Monitor (FSCM)
Independent Watchdog Timer
Fast wake-up and start-up
Power Management
Low-power management modes (Sleep, Idle)
Integrated Power-on Reset and Brown-out Reset
0.5 mA/MHz dynamic current (typical)
•20 μA IPD current (typical)
Audio Interface Features
Data communication: I2S, LJ, RJ, DSP modes
Control interface: SPI and I2C™
Master clock:
- Generation of fractional clock frequencies
- Can be synchronized with USB clock
- Can be tuned in run-time
Advanced Analog Features
ADC Module:
- 10-bit 1.1 Msps rate with one S&H
- Up to 10 analog inputs on 28-pin devices and 13
analog inputs on 44-pin devices
Flexible and independent ADC trigger sources
Charge Time Measurement Unit (CTMU):
- Supports mTouch™ capacitive touch sensing
- Provides high-resolution time measurement (1 ns)
- On-chip temperature measurement capability
Comparators:
- Up to three Analog Comparator modules
- Programmable references with 32 voltage points
Timers/Output Compare/Input Capture
Five General Purpose Timers:
- Five 16-bit and up to two 32-bit Timers/Counters
Five Output Compare (OC) modules
Five Input Capture (IC) modules
Peripheral Pin Select (PPS) to allow function remap
Real-Time Clock and Calendar (RTCC) module
Communication Interfaces
USB 2.0-compliant Full-speed OTG controller
Two UART modules (12.5 Mbps)
- Supports LIN 2.0 protocols and IrDA® support
Two 4-wire SPI modules (25 Mbps)
•Two I
2C modules (up to 1 Mbaud) with SMBus support
Peripheral Pin Select (PPS) to allow function remap
Parallel Master Port (PMP)
Direct Memory Access (DMA)
Four channels of hardware DMA with automatic data
size detection
Two additional channels dedicated for USB
Programmable Cyclic Redundancy Check (CRC)
Input/Output
10 mA source/sink on all I/O pins and up to 14 mA on
non-standard VOH
5V-tolerant pins
Selectable open drain, pull-ups, and pull-downs
External interrupts on all I/O pins
Qualification and Class B Support
AEC-Q100 REVG (Grade 2 -40ºC to +105ºC) planned
Class B Safety Library, IEC 60730
Debugger Development Support
In-circuit and in-application programming
•4-wire MIPS
® Enhanced JTAG interface
Unlimited program and six complex data breakpoints
IEEE 1149.2-compatible (JTAG) boundary scan
Packages
Type SOIC SSOP SPDIP QFN VTLA TQFP
Pin Count 28 28 28 28 44 36 44 44
I/O Pins (up to) 21 21 21 21 34 25 34 34
Contact/Lead Pitch 1.27 0.65 0.100'' 0.65 0.65 0.50 0.50 0.80
Dimensions 17.90x7.50x2.65 10.2x5.3x2 1.365''x.285''x.135'' 6x6x0.9 8x8x0.9 5x5x0.9 6x6x0.9 10x10x1
Note: All dimensions are in millimeters (mm) unless specified.
32-bit Micr ocontr ollers (up to 128 KB Flash and 32 KB SRAM) with
Audio and Graphics Interfaces, USB, and Advanced Analog
PIC32MX1XX/2XX
DS61168E-page 2 Preliminary 2011-2012 Microchip Technology Inc.
TABLE 1: PIC32MX1XX GENERAL PURPOSE FAMILY FEATURES
Device
Pins
Program Memory (KB)(1)
Data Memory (KB)
Remappable Peripherals
Analog Comparators
USB On-The-Go (OTG)
I2C™
PMP
DMA Channels
(Programmable/Dedicated)
CTMU
10-bit 1 Msps ADC (Channels)
RTCC
I/O Pins
JTAG
Packages
Remappable Pins
Timers(2)/Capture/Compare
UART
SPI/I2S
External Interrupts(3)
PIC32MX110F016B 28 16+3 4 20 5/5/5 2253N2Y4/0Y10Y21Y
SOIC,
SSOP,
SPDIP,
QFN
PIC32MX110F016C 36 16+3 4 24 5/5/5 2253N2Y4/0Y12Y25YVTLA
PIC32MX110F016D 44 16+3 4 32 5/5/5 2253N2Y4/0Y13Y34Y
VTLA,
TQFP,
QFN
PIC32MX120F032B 28 32+3 8 20 5/5/5 2253N2Y4/0Y10Y21Y
SOIC,
SSOP,
SPDIP,
QFN
PIC32MX120F032C 36 32+3 8 24 5/5/5 2253N2Y4/0Y12Y25YVTLA
PIC32MX120F032D 44 32+3 8 32 5/5/5 2253N2Y4/0Y13Y34Y
VTLA,
TQFP,
QFN
PIC32MX130F064B 28 64+3 16 20 5/5/5 2253N2Y4/0Y10Y21Y
SOIC,
SSOP,
SPDIP,
QFN
PIC32MX130F064C 36 64+3 16 24 5/5/5 2253N2Y4/0Y12Y25YVTLA
PIC32MX130F064D 44 64+3 16 32 5/5/5 2253N2Y4/0Y13Y34Y
VTLA,
TQFP,
QFN
PIC32MX150F128B 28 128+3 32 20 5/5/5 2253N2Y4/0Y10Y21Y
SOIC,
SSOP,
SPDIP,
QFN
PIC32MX150F128C 36 128+3 32 24 5/5/5 2253N2Y4/0Y12Y25YVTLA
PIC32MX150F128D 44 128+3 32 32 5/5/5 2253N2Y4/0Y13Y34Y
VTLA,
TQFP,
QFN
Note 1: This device features 3 KB of boot Flash memory.
2: Four out of five timers are remappable.
3: Four out of five external interrupts are remappable.
2011-2012 Microchip Technology Inc. Preliminary DS61168E-page 3
PIC32MX1XX/2XX
TABLE 2: PIC32MX2XX USB FAMILY FEATURES
Device
Pins
Program Memory (KB)(1)
Data Memory (KB)
Remappable Peripherals
Analog Comparators
USB On-The-Go (OTG)
I2C™
PMP
DMA Channels
(Programmable/Dedicated)
CTMU
10-bit 1 Msps ADC (Channels)
RTCC
I/O Pins
JTAG
Packages
Remappable Pins
Timers(2)/Capture/Compare
UART
SPI/I2S
External Interrupts(3)
PIC32MX210F016B 28 16+3 4 19 5/5/5 2253Y2Y4/2Y9Y19Y
SOIC,
SSOP,
SPDIP,
QFN
PIC32MX210F016C 36 16+3 4 23 5/5/5 2253Y2Y4/2Y12Y23YVTLA
PIC32MX210F016D 44 16+3 4 31 5/5/5 2253Y2Y4/2Y13Y33Y
VTLA,
TQFP,
QFN
PIC32MX220F032B 28 32+3 8 19 5/5/5 2253Y2Y4/2Y9Y19Y
SOIC,
SSOP,
SPDIP,
QFN
PIC32MX220F032C 36 32+3 8 23 5/5/5 2253Y2Y4/2Y12Y23YVTLA
PIC32MX220F032D 44 32+3 8 31 5/5/5 2253Y2Y4/2Y13Y33Y
VTLA,
TQFP,
QFN
PIC32MX230F064B 28 64+3 16 19 5/5/52253Y2Y4/2Y9Y19Y
SOIC,
SSOP,
SPDIP,
QFN
PIC32MX230F064C 36 64+3 16 23 5/5/52253Y2Y4/2Y12Y23YVTLA
PIC32MX230F064D 44 64+3 16 31 5/5/52253Y2Y4/2Y13Y33Y
VTLA,
TQFP,
QFN
PIC32MX250F128B 28 128+3 32 19 5/5/52253Y2Y4/2Y9Y19Y
SOIC,
SSOP,
SPDIP,
QFN
PIC32MX250F128C 36 128+3 32 23 5/5/52253Y2Y4/2Y12Y23YVTLA
PIC32MX250F128D 44 128+3 32 31 5/5/52253Y2Y4/2Y13Y33Y
VTLA,
TQFP,
QFN
Note 1: This device features 3 KB of boot Flash memory.
2: Four out of five timers are remappable.
3: Four out of five external interrupts are remappable.
PIC32MX1XX/2XX
DS61168E-page 4 Preliminary 2011-2012 Microchip Technology Inc.
Pin Diagrams
Note 1: The RPn pins can be used by remappable peripherals. See Tabl e 1 for the available peripherals and Section 11.3 “Peripheral
Pin Select” for restrictions.
2: Every I/O port pin (RAx-RCx) can be used as a change notification pin (CNAx-CNCx). See Section 11.0 “I/O Ports” for more
information.
VREF+/CVREF+/AN0/C3INC/RPA0/CTED1/RA0
VREF-/CVREF-/AN1/RPA1/CTED2/RA1 AN9/C3INA/RPB15/SCK2/CTED6/PMCS1/RB15
PGED1/AN2/C1IND/C2INB/C3IND/RPB0/RB0 CVREFOUT/AN10/C3INB/RPB14/SCK1/CTED5/PMWR/RB14
PGEC1/AN3/C1INC/C2INA/RPB1/CTED12/RB1 AN11/RPB13/CTPLS/PMRD/RB13
AN4/C1INB/C2IND/RPB2/SDA2/CTED13/RB2 AN12/PMD0/RB12
PGEC2/TMS/RPB11/PMD1/RB11
VSS PGED2/RPB10/CTED11/PMD2/RB10
OSC1/CLKI/RPA2/RA2
OSC2/CLKO/RPA3/PMA0/RA3 VSS
SOSCI/RPB4/RB4 TDO/RPB9/SDA1/CTED4/PMD3/RB9
SOSCO/RPA4/T1CK/CTED9/PMA1/RA4 TCK/RPB8/SCL1/CTED10/PMD4/RB8
VDD TDI/RPB7/CTED3/PMD5/INT0/RB7
PGEC3/RPB6/PMD6/RB6
AVDD
AVSS
AN5/C1INA/C2INC/RTCC/RPB3/SCL2/RB3
28-Pin SOIC, SPDIP, SSOP(1,2) = Pins are up to 5V tolerant
MCLR
VCAP
PGED3/RPB5/PMD7/RB5
MCLR 128AVDD
PGED3/V
REF
+/CV
REF
+/AN0/C3INC/RPA0/CTED1/PMD7/RA0
227AVSS
PGEC3/VREF-/CVREF-/AN1/RPA1/CTED2/PMD6/RA1 3 26 AN9/C3INA/RPB15/SCK2/CTED6/PMCS1/RB15
PGED1/AN2/C1IND/C2INB/C3IND/RPB0/PMD0/RB0 4 25 CVREFOUT/AN10/C3INB/RPB14/VBUSON/SCK1/CTED5/RB14
PGEC1/AN3/C1INC/C2INA/RPB1/CTED12/PMD1/RB1 5 24 AN11/RPB13/CTPLS/PMRD/RB13
AN4/C1INB/C2IND/RPB2/SDA2/CTED13/PMD2/RB2 6 23 VUSB3V3
AN5/C1INA/C2INC/RTCC/RPB3/SCL2/PMWR/RB3 7 22 PGEC2/RPB11/D-/RB11
VSS 8 21 PGED2/RPB10/D+/CTED11/RB10
OSC1/CLKI/RPA2/RA2 9 20 VCAP
OSC2/CLKO/RPA3/PMA0/RA3 10 19 VSS
SOSCI/RPB4/RB4 11 18 TDO/RPB9/SDA1/CTED4/PMD3/RB9
SOSCO/RPA4/T1CK/CTED9/PMA1/RA4 12 17 TCK/RPB8/SCL1/CTED10/PMD4/RB8
VDD 13 16 TDI/RPB7/CTED3/PMD5/INT0/RB7
TMS/RPB5/USBID/RB5 14 15 VBUS
PIC32MX210F016B
PIC32MX220F032B
128
227
326
425
524
623
722
821
920
10 19
11 18
12 17
13 16
14 15
PIC32MX110F016B
PIC32MX120F032B
PIC32MX130F064B
PIC32MX150F128B PIC32MX230F064B
PIC32MX250F128B
2011-2012 Microchip Technology Inc. Preliminary DS61168E-page 5
PIC32MX1XX/2XX
Pin Diagrams (Continued)
28-Pin QFN(1,2,3) = Pins are up to 5V tolerant
Note 1: The RPn pins can be used by remappable peripherals. See Table 1 for the available peripherals and Section 11.3 “Peripheral
Pin Select” for restrictions.
2: Every I/O port pin (RAx-RCx) can be used as a change notification pin (CNAx-CNCx). See Section 11.0 “I/O Ports” for more
information.
3: The metal plane at the bottom of the device is not connected to any pins and is recommended to be connected to VSS externally.
VREF-/CVREF-/AN1/RPA1/CTED2/RA1
VREF+/CVREF+/AN0/C3INC/RPA0/CTED1/RA0
MCLR
AVDD
AVSS
AN9/C3INA/RPB15/SCK2/CTED6/PMCS1/RB15
CVREFOUT/AN10/C3INB/RPB14/SCK1/CTED5/PMWR/RB14
28
27
26
25
24
23
22
PGED1/AN2/C1IND/C2INB/C3IND/RPB0/RB0 121AN11/RPB13/CTPLS/PMRD/RB13
PGEC1/AN3/C1INC/C2INA/RPB1/CTED12/RB1 220AN12/PMD0/RB12
AN4/C1INB/C2IND/RPB2/SDA2/CTED13/RB2 319PGEC2/TMS/RPB11/PMD1/RB11
AN5/C1INA/C2INC/RTCC/RPB3/SCL2/RB3 4
PIC32MX110F016B
18 PGED2/RPB10/CTED11/PMD2/RB10
VSS 517VCAP
OSC1/CLKI/RPA2/RA2 616VSS
OSC2/CLKO/RPA3/PMA0/RA3 715TDO/RPB9/SDA1/CTED4/PMD3/RB9
8
9
10
11
12
13
14
SOSCI/RPB4/RB4
SOSCO/RPA4/T1CK/CTED9/PMA1/RA4
VDD
PGED3/RPB5/PMD7/RB5
PGEC3/RPB6/PMD6/RB6
TDI/RPB7/CTED3/PMD5/INT0/RB7
TCK/RPB8/SCL1/CTED10/PMD4/RB8
PIC32MX120F032B
PIC32MX130F064B
PIC32MX150F128B
PIC32MX1XX/2XX
DS61168E-page 6 Preliminary 2011-2012 Microchip Technology Inc.
Pin Diagrams (Continued)
28-Pin QFN(1,2,3) = Pins are up to 5V tolerant
PGEC3/VREF-/CVREF-/AN1/RPA1/CTED2/PMD6/RA1
PGED3/VREF+/CVREF+/AN0/C3INC/RPA0/CTED1/PMD7/RA0
MCLR
AVDD
AVSS
AN9/C3INA/RPB15/SCK2/CTED6/PMCS1/RB15
CVREFOUT/AN10/C3INB/RPB14/VBUSON/SCK1/CTED5/RB14
28
27
26
25
24
23
22
PGED1/AN2/C1IND/C2INB/C3IND/RPB0/PMD0/RB0 121AN11/RPB13/CTPLS/PMRD/RB13
PGEC1/AN3/C1INC/C2INA/RPB1/CTED12/PMD1/RB1 220VUSB3V3
AN4/C1INB/C2IND/RPB2/SDA2/CTED13/PMD2/RB2 319PGEC2/RPB11/D-/RB11
AN5/C1INA/C2INC/RTCC/RPB3/SCL2/PMWR/RB3 4PIC32MX210F016B 18 PGED2/RPB10/D+/CTED11/RB10
VSS 517VCAP
OSC1/CLKI/RPA2/RA2 616VSS
OSC2/CLKO/RPA3/PMA0/RA3 715TDO/RPB9/SDA1/CTED4/PMD3/RB9
8
9
10
11
12
13
14
SOSCI/RPB4/RB4
SOSCO/RPA4/T1CK/CTED9/PMA1/RA4
VDD
TMS/RPB5/USBID/RB5
VBUS
TDI/RPB7/CTED3/PMD5/INT0/RB7
TCK/RPB8/SCL1/CTED10/PMD4/RB8
PIC32MX220F032B
Note 1: The RPn pins can be used by remappable peripherals. See Table 1 for the available peripherals and Section 11.3 “Peripheral
Pin Select” for restrictions.
2: Every I/O port pin (RAx-RCx) can be used as a change notification pin (CNAx-CNCx). See Section 11.0 “I/O Ports” for more
information.
3: The metal plane at the bottom of the device is not connected to any pins and is recommended to be connected to VSS externally.
PIC32MX230F064B
PIC32MX250F128B
2011-2012 Microchip Technology Inc. Preliminary DS61168E-page 7
PIC32MX1XX/2XX
Pin Diagrams (Continued)
36-Pin VTLA(1,2,3) = Pins are up to 5V tolerant
Note 1: The RPn pins can be used by remappable peripherals. See Table 1 for the available peripherals and Section 1 1.3 “Peripheral Pin
Select” for restrictions.
2: Every I/O port pin (RAx-RCx) can be used as a change notification pin (CNAx-CNCx). See Section 11.0 “I/O Ports” for more
information.
3: The metal plane at the bottom of the device is not connected to any pins and is recommended to be connected to VSS externally.
4: This pin function is available on PIC32MX130F064C and PIC32MX150F128C devices only.
PIC32MX120F032C
1
PIC32MX110F016C
10
33 32 31 30 29 28
2
3
4
5
6
24
23
22
21
20
19
11 12 13 14 15
7
8
9
34
35
36
16 17 18
27
26
25
PGEC1/AN3/C1INC/C2INA/RPB1/CTED12/RB1
PGED1/AN2/C1IND/C2INB/C3IND/RPB0/RB0
VREF-/CVREF-/AN1/RPA1/CTED2/RA1
VREF+/CVREF+/AN0/C3INC/RPA0/CTED1/RA0
MCLR
AVDD
AVSS
AN9/C3INA/RPB15/SCK2/CTED6/PMCS1/RB15
CVREFOUT/AN10/C3INB/RPB14/SCK1/CTED5/PMWR/RB14
AN4/C1INB/C2IND/RPB2/SDA2/CTED13/RB2
AN11/RPB13/CTPLS/PMRD/RB13
AN5/C1INA/C2INC/RTCC/RPB3/SCL2/RB3
AN12/PMD0/RB12
PGED(4)/AN6/RPC0/RC0
PGEC2/TMS/RPB11/PMD1/RB11
PGEC(4)/AN7/RPC1/RC1
PGED2/RPB10/CTED11/PMD2/RB10
VDD
VDD
VSS
VCAP
OSC1/CLKI/RPA2/RA2
VSS
OSC2/CLKO/RPA3/PMA0/RA3
RPC9/CTED7/RC9
SOSCI/RPB4/RB4
TDO/RPB9/SDA1/CTED4/PMD3/RB9
SOSCO/RPA4/T1CK/CTED9/PMA1/RA4
RPC3/RC3
VSS
VDD
VDD
PGED3/RPB5/PMD7/RB5
PGEC3/RPB6/PMD6/RB6
TDI/RPB7/CTED3/PMD5/INT0/RB7
TCK/RPB8/SCL1/CTED10/PMD4/RB8
PIC32MX130F064C
PIC32MX150F128C
PIC32MX1XX/2XX
DS61168E-page 8 Preliminary 2011-2012 Microchip Technology Inc.
Pin Diagrams (Continued)
36-Pin VTLA(1,2,3) = Pins are up to 5V tolerant
Note 1: The RPn pins can be used by remappable peripherals. See Table 1 for the available peripherals and Section 11.3 “Peripheral
Pin Select” for restrictions.
2: Every I/O port pin (RAx-RCx) can be used as a change notification pin (CNAx-CNCx). See Section 11.0 “I/O Ports” for more
information.
3: The metal plane at the bottom of the device is not connected to any pins and is recommended to be connected to VSS externally.
4: This pin function is available on PIC32MX230F064C and PIC32MX250F128C devices only.
PIC32MX220F032C
1
PIC32MX210F016C
10
33 32 31 30 29 28
2
3
4
5
6
24
23
22
21
20
19
11 12 13 14 15
7
8
9
34
35
36
16 17 18
27
26
25
PGEC1/AN3/C1INC/C2INA/RPB1/CTED12/PMD1/RB1
PGED1/AN2/C1IND/C2INB/C3IND/RPB0/PMD0/RB0
PGEC3/VREF-/CVREF-/AN1/RPA1/CTED2/PMD6/RA1
PGED3/VREF+/CVREF+/AN0/C3INC/RPA0/CTED1/PMD7/RA0
MCLR
AVDD
AVSS
AN9/C3INA/RPB15/SCK2/CTED6/PMCS1/RB15
CVREFOUT/AN10/C3INB/RPB14/VBUSON/SCK1/CTED5/RB14
AN4/C1INB/C2IND/RPB2/SDA2/CTED13/PMD2/RB2
AN11/RPB13/CTPLS/PMRD/RB13
AN5/C1INA/C2INC/RTCC/RPB3/SCL2/PMWR/RB3
VUSB3V3
PGED4(4)/AN6/RPC0/RC0
PGEC2/RPB11/D-/RB11
PGEC4(4)/AN7/RPC1/RC1
PGED2/RPB10/D+/CTED11/RB10
VDD
VCAP
OSC1/CLKI/RPA2/RA2
VSS
OSC2/CLKO/RPA3/PMA0/RA3
RPC9/CTED7/RC9
SOSCI/RPB4/RB4
TDO/RPB9/SDA1/CTED4/PMD3/RB9
SOSCO/RPA4/T1CK/CTED9/PMA1/RA4
AN12/RPC3/RC3
VSS
VDD
VDD
TMS/RPB5/USBID/RB5
VBUS
TDI/RPB7/CTED3/PMD5/INT0/RB7
TCK/RPB8/SCL1/CTED10/PMD4/RB8
VDD
VSS
PIC32MX230F064C
PIC32MX250F128C
2011-2012 Microchip Technology Inc. Preliminary DS61168E-page 9
PIC32MX1XX/2XX
Pin Diagrams (Continued)
44-Pin QFN(1,2,3) = Pins are up to 5V tolerant
Note 1: The RPn pins can be used by remappable peripherals. See Table 1 for the available peripherals and Section 11.3 “Peripheral
Pin Select” for restrictions.
2: Every I/O port pin (RAx-RCx) can be used as a change notification pin (CNAx-CNCx). See Section 11.0 “I/O Ports” for more
information.
3: The metal plane at the bottom of the device is not connected to any pins and is recommended to be connected to VSS externally.
4: This pin function is available on PIC32MX130F064D and PIC32MX150F128D devices only.
RPB8/SCL1/CTED10/PMD4/RB8
RPB7/CTED3/PMD5/INT0/RB7
PGEC3/RPB6/PMD6/RB6
PGED3/RPB5/PMD7/RB5
VDD
VSS
RPC5/PMA3/RC5
RPC4/PMA4/RC4
RPC3/RC3
TDI/RPA9/PMA9/RA9
SOSCO/RPA4/T1CK/CTED9/RA4
44
43
42
41
40
39
38
37
36
35
34
RPB9/SDA1/CTED4/PMD3/RB9 1 33 SOSCI/RPB4/RB4
RPC6/PMA1/RC6 2 32 TDO/RPA8/PMA8/RA8
RPC7/PMA0/RC7 3 31 OSC2/CLKO/RPA3/RA3
RPC8/PMA5/RC8 4 30 OSC1/CLKI/RPA2/RA2
RPC9/CTED7/PMA6/RC9 5 29 VSS
VSS 6
PIC32MX110F016D
28 VDD
VCAP 7 27 AN8/RPC2/PMA2/RC2
PGED2/RPB10/CTED11/PMD2/RB10 8 26 AN7/RPC1/RC1
PGEC2/RPB11/PMD1/RB11 9 25 AN6/RPC0/RC0
AN12/PMD0/RB12 10 24 AN5/C1INA/C2INC/RTCC/RPB3/SCL2/RB3
AN11/RPB13/CTPLS/PMRD/RB13 11 23 AN4/C1INB/C2IND/RPB2/SDA2/CTED13/RB2
12
13
14
15
16
17
18
19
20
21
22
PGED4(4)/TMS/PMA10/RA10
PGEC(4)/TCK/CTED8/PMA7/RA7
CVREFOUT/AN10/C3INB/RPB14/SCK1/CTED5/PMWR/RB14
AN9/C3INA/RPB15/SCK2/CTED6/PMCS1/RB15
AVSS
AVDD
MCLR
VREF+/CVREF+/AN0/C3INC/RPA0/CTED1/RA0
VREF-/CVREF-/AN1/RPA1/CTED2/RA1
PGED1/AN2/C1IND/C2INB/C3IND/RPB0/RB0
PGEC1/AN3/C1INC/C2INA/RPB1/CTED12/RB1
PIC32MX120F032D
PIC32MX130F064D
PIC32MX150F128D
PIC32MX1XX/2XX
DS61168E-page 10 Preliminary 2011-2012 Microchip Technology Inc.
Pin Diagrams (Continued)
44-Pin QFN(1,2,3) = Pins are up to 5V tolerant
Note 1: The RPn pins can be used by remappable peripherals. See Table 1 for the available peripherals and Section 11.3 “Peripheral
Pin Select” for restrictions.
2: Every I/O port pin (RAx-RCx) can be used as a change notification pin (CNAx-CNCx). See Section 11.0 “I/O Ports” for more
information.
3: The metal plane at the bottom of the device is not connected to any pins and is recommended to be connected to VSS externally.
4: This pin function is available on PIC32MX230F064D and PIC32MX250F128D devices only.
RPB8/SCL1/CTED10/PMD4/RB8
RPB7/CTED3/PMD5/INT0/RB7
VBUS
RPB5/USBID/RB5
VDD
VSS
RPC5/PMA3/RC5
RPC4/PMA4/RC4
AN12/RPC3/RC3
TDI/RPA9/PMA9/RA9
SOSCO/RPA4/T1CK/CTED9/RA4
44
43
42
41
40
39
38
37
36
35
34
1 33 SOSCI/RPB4/RB4
RPC6/PMA1/RC6 2 32 TDO/RPA8/PMA8/RA8
RPC7/PMA0/RC7 3 31 OSC2/CLKO/RPA3/RA3
RPC8/PMA5/RC8 4 30 OSC1/CLKI/RPA2/RA2
RPC9/CTED7/PMA6/RC9 5 29 VSS
VSS 6
PIC32MX210F016D
28 VDD
VCAP 7 27 AN8/RPC2/PMA2/RC2
8 26 AN7/RPC1/RC1
PGEC2/RPB11/D-/RB11 9 25 AN6/RPC0/RC0
VUSB3V310 24
AN5/C1INA/C2INC/RTCC/RPB3/SCL2/PMWR/CNB3/RB3
AN11/RPB13/CTPLS/PMRD/RB13 11 23
AN4/C1INB/C2IND/RPB2/SDA2/CTED13/PMD2/CNB2/RB2
12
13
14
15
16
17
18
19
20
21
22
PGED(4)/TMS/PMA10/RA10
PGEC(4)/TCK/CTED8/PMA7/RA7
CVREFOUT/AN10/C3INB/RPB14/VBUSON/SCK1/CTED5/RB14
AN9/C3INA/RPB15/SCK2/CTED6/PMCS1/RB15
AVSS
AVDD
MCLR
PGED3/VREF+/CVREF+/AN0/C3INC/RPA0/CTED1/PMD7/RA0
PGEC3/VREF-/CVREF-/AN1/RPA1/CTED2/PMD6/RA1
PGED1/AN2/C1IND/C2INB/C3IND/RPB0/PMD0/RB0
PGEC1/AN3/C1INC/C2INA/RPB1/CTED12/PMD1/RB1
PGED2/RPB10/D+/CTED11/RB10
RPB9/SDA1/CTED4/PMD3/RB9
PIC32MX220F032D
PIC32MX230F064D
PIC32MX250F128D
2011-2012 Microchip Technology Inc. Preliminary DS61168E-page 11
PIC32MX1XX/2XX
Pin Diagrams (Continued)
44-Pin TQFP(1,2,3) = Pins are up to 5V tolerant
Note 1: The RPn pins can be used by remappable peripherals. See Table 1 for the available peripherals and Section 11.3 “Peripheral
Pin Select” for restrictions.
2: Every I/O port pin (RAx-RCx) can be used as a change notification pin (CNAx-CNCx). See Section 11.0 “I/O Ports” for more
information.
3: The metal plane at the bottom of the device is not connected to any pins and is recommended to be connected to VSS externally.
4: This pin function is available on PIC32MX130F064D and PIC32MX150F128D devices only.
RPB8/SCL1/CTED10/PMD4/RB8
RPB7/CTED3/PMD5/INT0/RB7
PGEC3/RPB6/PMD6/RB6
PGED3/RPB5/PMD7/RB5
VDD
VSS
RPC5/PMA3/RC5
RPC4/PMA4/RC4
RPC3/RC3
TDI/RPA9/PMA9/RA9
SOSCO/RPA4/T1CK/CTED9/RA4
44
43
42
41
40
39
38
37
36
35
34
RPB9/SDA1/CTED4/PMD3/RB9 1 33 SOSCI/RPB4/RB4
RPC6/PMA1/RC6 2 32 TDO/RPA8/PMA8/RA8
RPC7/PMA0/RC7 3 31 OSC2/CLKO/RPA3/RA3
RPC8/PMA5/RC8 4 30 OSC1/CLKI/RPA2/RA2
RPC9/CTED7/PMA6/RC9 5 29 VSS
VSS 6
PIC32MX110F016D
28 VDD
VCAP 7 27 AN8/RPC2/PMA2/RC2
PGED2/RPB10/CTED11/PMD2/RB10 8 26 AN7/RPC1/RC1
PGEC2/RPB11/PMD1/RB11 9 25 AN6/RPC0/RC0
AN12/PMD0/RB12 10 24 AN5/C1INA/C2INC/RTCC/RPB3/SCL2/RB3
AN11/RPB13/CTPLS/PMRD/RB13 11 23 AN4/C1INB/C2IND/RPB2/SDA2/CTED13/RB2
12
13
14
15
16
17
18
19
20
21
22
PGED(4)/TMS/PMA10/RA10
PGEC(4)/TCK/CTED8/PMA7/RA7
CVREFOUT/AN10/C3INB/RPB14/SCK1/CTED5/PMWR/RB14
AN9/C3INA/RPB15/SCK2/CTED6/PMCS1/RB15
AVSS
AVDD
MCLR
VREF+/CVREF+/AN0/C3INC/RPA0/CTED1/RA0
VREF-/CVREF-/AN1/RPA1/CTED2/RA1
PGED1/AN2/C1IND/C2INB/C3IND/RPB0/RB0
PGEC1/AN3/C1INC/C2INA/RPB1/CTED12/RB1
PIC32MX120F032D
PIC32MX130F064D
PIC32MX150F128D
PIC32MX1XX/2XX
DS61168E-page 12 Preliminary 2011-2012 Microchip Technology Inc.
Pin Diagrams (Continued)
44-Pin VTLA(1,2,3) = Pins are up to 5V tolerant
Note 1: The RPn pins can be used by remappable peripherals. See Table 1 for the available peripherals and Section 11.3 “Peripheral
Pin Select” for restrictions.
2: Every I/O port pin (RAx-RCx) can be used as a change notification pin (CNAx-CNCx). See Section 11.0 “I/O Ports” for more
information.
3: The metal plane at the bottom of the device is not connected to any pins and is recommended to be connected to VSS externally.
4: This pin function is available on PIC32MX130F064D and PIC32MX150F128D devices only.
RPB8/SCL1/CTED10/PMD4/RB8
RPB7/CTED3/PMD5/INT0/RB7
PGEC3/RPB6/PMD6/RB6
PGED3/RPB5/PMD7/RB5
VDD
VSS
RPC5/PMA3/RC5
RPC4/PMA4/RC4
RPC3/RC3
TDI/RPA9/PMA9/RA9
SOSCO/RPA4/T1CK/CTED9/RA4
RPB9/SDA1/CTED4/PMD3/RB9
SOSCI/RPB4/RB4
RPC6/PMA1/RC6
TDO/RPA8/PMA8/RA8
RPC7/PMA0/RC7
OSC2/CLKO/RPA3/RA3
RPC8/PMA5/RC8
OSC1/CLKI/RPA2/RA2
RPC9/CTED7/PMA6/RC9
VSS
VSS
PIC32MX110F016D VDD
VCAP
AN8/RPC2/PMA2/RC2
PGED2/RPB10/CTED11/PMD2/RB10
AN7/RPC1/RC1
PGEC2/RPB11/PMD1/RB11
AN6/RPC0/RC0
AN12/PMD0/RB12
AN5/C1INA/C2INC/RTCC/RPB3/SCL2/RB3
AN4/C1INB/C2IND/RPB2/SDA2/CTED13/RB2
PGEC(4)/TCK/CTED8/PMA7/RA7
CVREFOUT/AN10/C3INB/RPB14/SCK1/CTED5/PMWR/RB14
AN9/C3INA/RPB15/SCK2/CTED6/PMCS1/RB15
AVSS
AVDD
MCLR
VREF+/CVREF+/AN0/C3INC/RPA0/CTED1/RA0
VREF-/CVREF-/AN1/RPA1/CTED2/RA1
PGED1/AN2/C1IND/C2INB/C3IND/RPB0/RB0
PIC32MX120F032D
1
10
33
32
31
30
29
28
2
3
4
5
6
24
23
2221201911 12 13 14 15
7
8
9
343536
16 17 18
27
26
25
3738394041424344
PGEC1/AN3/C1INC/C2INA/RPB1/CTED12/RB1
AN11/RPB13/CTPLS/PMRD/RB13
PIC32MX130F064D
PIC32MX150F128D
PGED(4)/TMS/PMA10/RA10
2011-2012 Microchip Technology Inc. Preliminary DS61168E-page 13
PIC32MX1XX/2XX
Pin Diagrams (Continued)
44-Pin TQFP(1,2,3) = Pins are up to 5V tolerant
Note 1: The RPn pins can be used by remappable peripherals. See Table 1 for the available peripherals and Section 11.3 “Peripheral
Pin Select” for restrictions.
2: Every I/O port pin (RAx-RCx) can be used as a change notification pin (CNAx-CNCx). See Section 11.0 “I/O Ports” for more
information.
3: The metal plane at the bottom of the device is not connected to any pins and is recommended to be connected to VSS externally.
4: This pin function is available on PIC32MX230F064D and PIC32MX250F128D devices only.
RPB8/SCL1/CTED10/PMD4/RB8
RPB7/CTED3/PMD5/INT0/RB7
VBUS
RPB5/USBID/RB5
VDD
VSS
RPC5/PMA3/RC5
RPC4/PMA4/RC4
AN12/RPC3/RC3
TDI/RPA9/PMA9/RA9
SOSCO/RPA4/T1CK/CTED9/RA4
44
43
42
41
40
39
38
37
36
35
34
1 33 SOSCI/RPB4/RB4
RPC6/PMA1/RC6 2 32 TDO/RPA8/PMA8/RA8
RPC7/PMA0/RC7 3 31 OSC2/CLKO/RPA3/RA3
RPC8/PMA5/RC8 4 30 OSC1/CLKI/RPA2/RA2
RPC9/CTED7/PMA6/RC9 5 29 VSS
VSS 6
PIC32MX210F016D
28 VDD
VCAP 7 27 AN8/RPC2/PMA2/RC2
8 26 AN7/RPC1/RC1
PGEC2/RPB11/D-/RB11 9 25 AN6/RPC0/RC0
VUSB3V310 24
AN5/C1INA/C2INC/RTCC/RPB3/SCL2/PMWR/CNB3/RB3
AN11/RPB13/CTPLS/PMRD/RB13 11 23
AN4/C1INB/C2IND/RPB2/SDA2/CTED13/PMD2/CNB2/RB2
12
13
14
15
16
17
18
19
20
21
22
PGED(4)/TMS/PMA10/RA10
PGEC(4)/TCK/CTED8/PMA7/RA7
CVREFOUT/AN10/C3INB/RPB14/VBUSON/SCK1/CTED5/RB14
AN9/C3INA/RPB15/SCK2/CTED6/PMCS1/RB15
AVSS
AVDD
MCLR
PGED3/VREF+/CVREF+/AN0/C3INC/RPA0/CTED1/PMD7/RA0
PGEC3/VREF-/CVREF-/AN1/RPA1/CTED2/PMD6/RA1
PGED1/AN2/C1IND/C2INB/C3IND/RPB0/PMD0/RB0
PGEC1/AN3/C1INC/C2INA/RPB1/CTED12/PMD1/RB1
PGED2/RPB10/D+/CTED11/RB10
RPB9/SDA1/CTED4/PMD3/RB9
PIC32MX220F032D
PIC32MX230F064D
PIC32MX250F128D
PIC32MX1XX/2XX
DS61168E-page 14 Preliminary 2011-2012 Microchip Technology Inc.
Pin Diagrams (Continued)
44-Pin VTLA(1,2,3) = Pins are up to 5V tolerant
Note 1: The RPn pins can be used by remappable peripherals. See Table 1 for the available peripherals and Section 11.3 “Peripheral
Pin Select” for restrictions.
2: Every I/O port pin (RAx-RCx) can be used as a change notification pin (CNAx-CNCx). See Section 11.0 “I/O Ports” for more
information.
3: The metal plane at the bottom of the device is not connected to any pins and is recommended to be connected to VSS externally.
4: This pin function is available on PIC32MX230F064D and PIC32MX250F128D devices only.
RPB8/SCL1/CTED10/PMD4/RB8
RPB7/CTED3/PMD5/INT0/RB7
V
BUS
RPB5/USBID/RB5
V
DD
V
SS
RPC5/PMA3/RC5
RPC4/PMA4/RC4
AN12/RPC3/RC3
TDI/RPA9/PMA9/RA9
SOSCO/RPA4/T1CK/CTED9/RA4
SOSCI/RPB4/RB4
RPC6/PMA1/RC6
TDO/RPA8/PMA8/RA8
RPC7/PMA0/RC7
OSC2/CLKO/RPA3/RA3
RPC8/PMA5/RC8
OSC1/CLKI/RPA2/RA2
RPC9/CTED7/PMA6/RC9
V
SS
V
SS
V
DD
V
CAP
AN8/RPC2/PMA2/RC2
AN7/RPC1/RC1
PGEC2/RPB11/D-/RB11
AN6/RPC0/RC0
V
USB
3V3
AN5/C1INA/C2INC/RTCC/RPB3/SCL2/PMWR/CNB3/RB3
AN11/RPB13/CTPLS/PMRD/RB13
AN4/C1INB/C2IND/RPB2/SDA2/CTED13/PMD2/CNB2/RB2
PGED
(4)
/TMS/PMA10/RA10
PGEC
(4)
/TCK/CTED8/PMA7/RA7
C
VREFOUT
/AN10/C3INB/RPB14/VBUSON/SCK1/CTED5/RB14
AN9/C3INA/RPB15/SCK2/CTED6/PMCS1/RB15
AV
SS
AV
DD
MCLR
PGED3/V
REF
+/CV
REF
+/AN0/C3INC/RPA0/CTED1/PMD7/RA0
PGEC3/V
REF
-/CV
REF
-/AN1/RPA1/CTED2/PMD6/RA1
PGED1/AN2/C1IND/C2INB/C3IND/RPB0/PMD0/RB0
PGEC1/AN3/C1INC/C2INA/RPB1/CTED12/PMD1/RB1
PGED2/RPB10/D+/CTED11/RB10
RPB9/SDA1/CTED4/PMD3/RB9
PIC32MX210F016D
PIC32MX220F032D
1
10
33
32
31
30
29
28
2
3
4
5
6
24
23
2221201911 12 13 14 15
7
8
9
343536
16 17 18
27
26
25
3738394041424344
PIC32MX230F064D
PIC32MX250F128D
2011-2012 Microchip Technology Inc. Preliminary DS61168E-page 15
PIC32MX1XX/2XX
Table of Contents
1.0 Device Overview ........................................................................................................................................................................ 19
2.0 Guidelines for Getting Started with 32-bit MCUs........................................................................................................................ 27
3.0 CPU............................................................................................................................................................................................ 31
4.0 Memory Organization ................................................................................................................................................................. 35
5.0 Flash Program Memory.............................................................................................................................................................. 77
6.0 Resets ........................................................................................................................................................................................ 81
7.0 Interrupt Controller ..................................................................................................................................................................... 85
8.0 Oscillator Configuration .............................................................................................................................................................. 93
9.0 Direct Memory Access (DMA) Controller ................................................................................................................................. 103
10.0 USB On-The-Go (OTG)............................................................................................................................................................ 119
11.0 I/O Ports ................................................................................................................................................................................... 141
12.0 Timer1 ...................................................................................................................................................................................... 149
13.0 Timer2/3, Timer4/5 ................................................................................................................................................................... 153
14.0 Input Capture............................................................................................................................................................................ 157
15.0 Output Compare....................................................................................................................................................................... 161
16.0 Serial Peripheral Interface (SPI)............................................................................................................................................... 163
17.0 Inter-Integrated Circuit™ (I2C™).............................................................................................................................................. 171
18.0 Universal Asynchronous Receiver Transmitter (UART) ........................................................................................................... 177
19.0 Parallel Master Port (PMP)....................................................................................................................................................... 183
20.0 Real-Time Clock and Calendar (RTCC)................................................................................................................................... 191
21.0 10-bit Analog-to-Digital Converter (ADC) ................................................................................................................................. 201
22.0 Comparator .............................................................................................................................................................................. 209
23.0 Comparator Voltage Reference (CVREF) ................................................................................................................................. 213
24.0 Charge Time Measurement Unit (CTMU) ............................................................................................................................... 215
25.0 Power-Saving Features ........................................................................................................................................................... 219
26.0 Special Features ...................................................................................................................................................................... 223
27.0 Instruction Set .......................................................................................................................................................................... 237
28.0 Development Support............................................................................................................................................................... 239
29.0 Electrical Characteristics .......................................................................................................................................................... 243
30.0 50 MHz Electrical Characteristics............................................................................................................................................. 285
30.0 DC and AC Device Characteristics Graphs.............................................................................................................................. 291
31.0 Packaging Information.............................................................................................................................................................. 295
The Microchip Web Site ..................................................................................................................................................................... 323
Customer Change Notification Service .............................................................................................................................................. 323
Customer Support.............................................................................................................................................................................. 323
Reader Response .............................................................................................................................................................................. 324
Product Identification System ............................................................................................................................................................ 325
PIC32MX1XX/2XX
DS61168E-page 16 Preliminary 2011-2012 Microchip Technology Inc.
TO OUR VALUED CUSTOMERS
It is our intention to provide our valued customers with the best documentation possible to ensure successful use of your Microchip
products. To this end, we will continue to improve our publications to better suit your needs. Our publications will be refined and
enhanced as new volumes and updates are introduced.
If you have any questions or comments regarding this publication, please contact the Marketing Communications Department
via E-mail at docerrors@microchip.com or fax the Reader Response Form in the back of this data sheet to (480) 792-4150.
We welcome your feedback.
Most Current Data Sheet
To obtain the most up-to-date version of this data sheet, please register at our Worldwide Web site at:
http://www.microchip.com
You can determine the version of a data sheet by examining its literature number found on the bottom outside corner of any page.
The last character of the literature number is the version number, (e.g., DS30000A is version A of document DS30000).
Errata
An errata sheet, describing minor operational differences from the data sheet and recommended workarounds, may exist for current
devices. As device/documentation issues become known to us, we will publish an errata sheet. The errata will specify the revision
of silicon and revision of document to which it applies.
To determine if an errata sheet exists for a particular device, please check with one of the following:
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When contacting a sales office, please specify which device, revision of silicon and data sheet (include literature number) you are
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Register on our web site at www.microchip.com to receive the most current information on all of our products.
2011-2012 Microchip Technology Inc. Preliminary DS61168E-page 17
PIC32MX1XX/2XX
Referenced Sources
This device data sheet is based on the following
individual chapters of the “PIC32 Family Reference
Manual”. These documents should be considered as
the general reference for the operation of a particular
module or device feature.
Section 1. “Introduction” (DS61127)
Section 2. “CPU” (DS61113)
Section 3. “Memory Organization” (DS61115)
Section 5. “Flash Program Memory” (DS61121)
Section 6. “Oscillator Configuration (DS61112)
Section 7. “Resets” (DS61118)
Section 8. “Interrupt Controller” (DS61108)
Section 9. “Watchdog Timer and Power-up Timer” (DS61114)
Section 10. “Power-Saving Features” (DS61130)
Section 12. “I/O Ports” (DS61120)
Section 13. “Parallel Master Port (PMP)” (DS61128)
Section 14. “Timers” (DS61105)
Section 15. “Input Capture” (DS61122)
Section 16. “Output Compare” (DS61111)
Section 17. “10-bit Analog-to-Digital Converter (ADC)” (DS61104)
Se c t i o n 1 9 . “Comparator” (DS61110)
Section 20. “Comparator Voltage Reference (CVREF)” (DS61109)
Section 21. “Universal Asynchronous Rece iver Transmitter (UART)” (DS61107)
Section 23. “Serial Peripheral Interface (SPI)” (DS61106)
Section 24. “Inter-Integrated Circuit™ (I2C™)” (DS61116)
Section 27. “USB On-The-Go (OTG)” (DS61126)
Section 29. “Real-Time Clock and Calendar (RTCC)” (DS61125)
Section 31. “Direct Memory Access (DMA) Controller” (DS61117)
Section 32. “Configuration” (DS61124)
Section 33. “Programming and Diagnostics” (DS61129)
Section 37. “Charge Time Measurement Unit (CTMU)” (DS61167)
Note: To access the documents listed below,
browse to the documentation section of
the Microchip web site
(www.microchip.com).
PIC32MX1XX/2XX
DS61168E-page 18 Preliminary 2011-2012 Microchip Technology Inc.
NOTES:
2011-2012 Microchip Technology Inc. Preliminary DS61168E-page 19
PIC32MX1XX/2XX
1.0 DEVICE OVERVIEW This document contains device-specific information for
PIC32MX1XX/2XX devices.
Figure 1-1 illustrates a general block diagram of the
core and peripheral modules in the PIC32MX1XX/2XX
family of devices.
Table 1-1 lists the functions of the various pins shown
in the pinout diagrams.
FIGURE 1-1: BLOCK DIAGRAM
Note 1: This data sheet summarizes the features
of the PIC32MX1XX/2XX family of
devices. It is not intended to be a
comprehensive reference source. To
complement the information in this data
sheet, refer to the related section of the
“PIC32 Family Reference Manual”, which
is available from the Microchip web site
(www.microchip.com/PIC32).
2: Some registers and associated bits
described in this section may not be
available on all devices. Refer to
Section 4.0 “Memory Organization” in
this data sheet for device-specific register
and bit information.
Note: Some features are not available on all devices. Refer to the family features tables (Table 1 and Ta bl e 2) for availability.
UART1-2
Comparators 1-3
PORTA
Remappable
PORTB
CTMU
JTAG Priority
DMAC
ICD
MIPS32® M4K®
IS DS
EJTAG INT
Bus Matrix
Data RAM Peripheral Bridge
32
32-bit Wide
Flash
32 32
32 32
Peripheral Bus Clocked by PBCLK
Program Flash Memory
Controller
32
32 32
Interrupt
Controller
BSCAN
PORTC
PMP
I2C1-2
SPI1-2
IC1-5
PWM
OC1-5
OSC1/CLKI
OSC2/CLKO
VDD, VSS
Timing
Generation
MCLR
Power-up
Timer
Oscillator
Start-up Timer
Power-on
Reset
Watchdog
Timer
Brown-out
Reset
Precision
Reference
Band Gap
FRC/LPRC
Oscillators Regulator
Voltage
VCAP
OSC/SOSC
Oscillators
PLL
Dividers
SYSCLK
PBCLK
Peripheral Bus Clocked by SYSCLK
USB
PLL-USB USBCLK
32
RTCC
10-bit ADC
Timer1-5
32
32
CPU Core
Pins
PIC32MX1XX/2XX
DS61168E-page 20 Preliminary 2011-2012 Microchip Technology Inc.
TABLE 1-1: PINOUT I/O DESCRIPTIONS
Pin Name
Pin Number(1)
Pin
Type Buffer
Type Description
28-pin
QFN
28-pin
SSOP/
SPDIP/
SOIC
36-pin
VTLA
44-pin
QFN/
TQFP/
VTLA
AN0 27 2 33 19 I Analog Analog input channels.
AN1 28 3 34 20 I Analog
AN2 1 4 35 21 I Analog
AN3 2 5 36 22 I Analog
AN4 3 6 1 23 I Analog
AN5 4 7 2 24 I Analog
AN6 3 25 I Analog
AN7 4 26 I Analog
AN8 27 I Analog
AN9 23262915IAnalog
AN10 22 25 28 14 I Analog
AN11 21 24 27 11 I Analog
AN12 20(2) 23(2) 26(2) 10(2)
IAnalog
11(3) 36(3)
CLKI 6 9 7 30 I ST/CMOS External clock source input. Always
associated with OSC1 pin function.
CLKO 7 10 8 31 O Oscillator crystal output. Connects to
crystal or resonator in Crystal Oscillator
mode. Optionally functions as CLKO in
RC and EC modes. Always associated
with OSC2 pin function.
OSC1 6 9 7 30 I ST/CMOS Oscillator crystal input. ST buffer when
configured in RC mode; CMOS
otherwise.
OSC2 7 10 8 31 I/O Oscillator crystal output. Connects to
crystal or resonator in Crystal Oscillator
mode. Optionally functions as CLKO in
RC and EC modes.
SOSCI 8 11 9 33 I ST/CMOS 32.768 kHz low-power oscillator crystal
input; CMOS otherwise.
SOSCO 9 12 10 34 O 32.768 kHz low-power oscillator crystal
output.
REFCLKI PPS PPS PPS PPS I ST Reference Input Clock
REFCLKO PPS PPS PPS PPS O Reference Output Clock
IC1 PPS PPS PPS PPS I ST Capture Inputs 1-5
IC2 PPS PPS PPS PPS I ST
IC3 PPS PPS PPS PPS I ST
IC4 PPS PPS PPS PPS I ST
IC5 PPS PPS PPS PPS I ST
Legend: CMOS = CMOS compatible input or output Analog = Analog input P = Power
ST = Schmitt Trigger input with CMOS levels O = Output I = Input
TTL = TTL input buffer PPS = Peripheral Pin Select — = N/A
Note 1: Pin numbers are provided for reference only. See the Pin Diagrams section for device pin availability.
2: Pin number for PIC32MX1XX devices only.
3: Pin number for PIC32MX2XX devices only.
2011-2012 Microchip Technology Inc. Preliminary DS61168E-page 21
PIC32MX1XX/2XX
OC1 PPS PPS PPS PPS O Output Compare Output 1
OC2 PPS PPS PPS PPS O Output Compare Output 2
OC3 PPS PPS PPS PPS O Output Compare Output 3
OC4 PPS PPS PPS PPS O Output Compare Output 4
OC5 PPS PPS PPS PPS O Output Compare Output 5
OCFA PPS PPS PPS PPS I ST Output Compare Fault A Input
OCFB PPS PPS PPS PPS I ST Output Compare Fault B Input
INT0 13 16 17 43 I ST External Interrupt 0
INT1 PPS PPS PPS PPS I ST External Interrupt 1
INT2 PPS PPS PPS PPS I ST External Interrupt 2
INT3 PPS PPS PPS PPS I ST External Interrupt 3
INT4 PPS PPS PPS PPS I ST External Interrupt 4
RA0 27 2 33 19 I/O ST PORTA is a bidirectional I/O port
RA1 28 3 34 20 I/O ST
RA2 6 9 7 30 I/O ST
RA3 7 10 8 31 I/O ST
RA4 9 12 10 34 I/O ST
RA7 13 I/O ST
RA8 32 I/O ST
RA9 35 I/O ST
RA10 12 I/O ST
RB0 1 4 35 21 I/O ST PORTB is a bidirectional I/O port
RB1 2 5 36 22 I/O ST
RB2 3 6 1 23 I/O ST
RB3 4 7 2 24 I/O ST
RB4 8 11 9 33 I/O ST
RB5 11141541I/OST
RB6 12(2) 15(2) 16(2) 42(2) I/O ST
RB7 13161743I/OST
RB8 14171844I/OST
RB9 15 18 19 1 I/O ST
RB10 18 21 24 8 I/O ST
RB11 19 22 25 9 I/O ST
RB12 20(2) 23(2) 26(2) 10(2) I/O ST
RB13 21 24 27 11 I/O ST
RB14 22 25 28 14 I/O ST
RB15 23 26 29 15 I/O ST
TABLE 1-1: PINOUT I/O DESCRIPTIONS (CONTINUED)
Pin Name
Pin Number(1)
Pin
Type Buffer
Type Description
28-pin
QFN
28-pin
SSOP/
SPDIP/
SOIC
36-pin
VTLA
44-pin
QFN/
TQFP/
VTLA
Legend: CMOS = CMOS compatible input or output Analog = Analog input P = Power
ST = Schmitt Trigger input with CMOS levels O = Output I = Input
TTL = TTL input buffer PPS = Peripheral Pin Select — = N/A
Note 1: Pin numbers are provided for reference only. See the Pin Diagrams section for device pin availability.
2: Pin number for PIC32MX1XX devices only.
3: Pin number for PIC32MX2XX devices only.
PIC32MX1XX/2XX
DS61168E-page 22 Preliminary 2011-2012 Microchip Technology Inc.
RC0 3 25 I/O ST PORTC is a bidirectional I/O port
RC1 4 26 I/O ST
RC2 27 I/O ST
RC3 11 36 I/O ST
RC4 37 I/O ST
RC5 38 I/O ST
RC6 2 I/O ST
RC7 3 I/O ST
RC8 4 I/O ST
RC9 20 5 I/O ST
T1CK 9 12 10 34 I ST Timer1 external clock input
T2CK PPS PPS PPS PPS I ST Timer2 external clock input
T3CK PPS PPS PPS PPS I ST Timer3 external clock input
T4CK PPS PPS PPS PPS I ST Timer4 external clock input
T5CK PPS PPS PPS PPS I ST Timer5 external clock input
U1CTS PPS PPS PPS PPS I ST UART1 clear to send
U1RTS PPS PPS PPS PPS O UART1 ready to send
U1RX PPS PPS PPS PPS I ST UART1 receive
U1TX PPS PPS PPS PPS O UART1 transmit
U2CTS PPS PPS PPS PPS I ST UART2 clear to send
U2RTS PPS PPS PPS PPS O UART2 ready to send
U2RX PPS PPS PPS PPS IST
UART2 receive
U2TX PPS PPS PPS PPS O—
UART2 transmit
SCK1 22 25 28 14 I/O ST Synchronous serial clock input/output for
SPI1
SDI1 PPS PPS PPS PPS IST
SPI1 data in
SDO1 PPS PPS PPS PPS O—
SPI1 data out
SS1 PPS PPS PPS PPS I/O ST SPI1 slave synchronization or frame
pulse I/O
SCK2 23 26 29 15 I/O ST Synchronous serial clock input/output for
SPI2
SDI2 PPS PPS PPS PPS IST
SPI2 data in
SDO2 PPS PPS PPS PPS O—
SPI2 data out
SS2 PPS PPS PPS PPS I/O ST SPI2 slave synchronization or frame
pulse I/O
SCL1 14 17 18 44 I/O ST Synchronous serial clock input/output for
I2C1
TABLE 1-1: PINOUT I/O DESCRIPTIONS (CONTINUED)
Pin Name
Pin Number(1)
Pin
Type Buffer
Type Description
28-pin
QFN
28-pin
SSOP/
SPDIP/
SOIC
36-pin
VTLA
44-pin
QFN/
TQFP/
VTLA
Legend: CMOS = CMOS compatible input or output Analog = Analog input P = Power
ST = Schmitt Trigger input with CMOS levels O = Output I = Input
TTL = TTL input buffer PPS = Peripheral Pin Select — = N/A
Note 1: Pin numbers are provided for reference only. See the Pin Diagrams section for device pin availability.
2: Pin number for PIC32MX1XX devices only.
3: Pin number for PIC32MX2XX devices only.
2011-2012 Microchip Technology Inc. Preliminary DS61168E-page 23
PIC32MX1XX/2XX
SDA1 15 18 19 1 I/O ST Synchronous serial data input/output for
I2C1
SCL2 4 7 2 24 I/O ST Synchronous serial clock input/output for
I2C2
SDA2 3 6 1 23 I/O ST Synchronous serial data input/output for
I2C2
TMS 19(2) 22(2) 25(2)
12 I ST JTAG Test mode select pin
11(3) 14(3) 15(3)
TCK 14 17 18 13 I ST JTAG test clock input pin
TDI 13 16 17 35 O JTAG test data input pin
TDO 15 18 19 32 O JTAG test data output pin
RTCC 4 7 2 24 I ST Real-Time Clock alarm output
CVREF- 28 3 34 20 I Analog Comparator Voltage Reference (low)
CVREF+ 27 2 33 19 I Analog Comparator Voltage Reference (high)
CVREFOUT 22 25 28 14 O Analog Comparator Voltage Reference output
C1INA 4 7 2 24 I Analog Comparator Inputs
C1INB 3 6 1 23 I Analog
C1INC 2 5 36 22 I Analog
C1IND 1 4 35 21 I Analog
C2INA 2 5 36 22 I Analog
C2INB 1 4 35 21 I Analog
C2INC 4 7 2 24 I Analog
C2IND 3 6 1 23 I Analog
C3INA 23262915IAnalog
C3INB 22252814IAnalog
C3INC 27 2 33 19 I Analog
C3IND 1 4 35 21 I Analog
C1OUT PPS PPS PPS PPS O Comparator Outputs
C2OUT PPS PPS PPS PPS O
C3OUT PPS PPS PPS PPS O
TABLE 1-1: PINOUT I/O DESCRIPTIONS (CONTINUED)
Pin Name
Pin Number(1)
Pin
Type Buffer
Type Description
28-pin
QFN
28-pin
SSOP/
SPDIP/
SOIC
36-pin
VTLA
44-pin
QFN/
TQFP/
VTLA
Legend: CMOS = CMOS compatible input or output Analog = Analog input P = Power
ST = Schmitt Trigger input with CMOS levels O = Output I = Input
TTL = TTL input buffer PPS = Peripheral Pin Select — = N/A
Note 1: Pin numbers are provided for reference only. See the Pin Diagrams section for device pin availability.
2: Pin number for PIC32MX1XX devices only.
3: Pin number for PIC32MX2XX devices only.
PIC32MX1XX/2XX
DS61168E-page 24 Preliminary 2011-2012 Microchip Technology Inc.
PMA0 7 10 8 3 I/O TTL/ST Parallel Master Port Address bit 0 input
(Buffered Slave modes) and output
(Master modes)
PMA1 9 12 10 2 I/O TTL/ST Parallel Master Port Address bit 1 input
(Buffered Slave modes) and output
(Master modes)
PMA2 27 O Parallel Master Port address
(Demultiplexed Master modes)
PMA3 38 O
PMA4 37 O
PMA5 4 O
PMA6 5 O
PMA7 13 O
PMA8 32 O
PMA9 35 O
PMA10 12 O
PMCS1 23 26 29 15 O Parallel Master Port Chip Select 1 strobe
PMD0 20(2) 23(2) 26(2) 10(2)
I/O TTL/ST Parallel Master Port data (Demultiplexed
Master mode) or address/data
(Multiplexed Master modes)
1(3) 4(3) 35(3) 21(3)
PMD1 19(2) 22(2) 25(2) 9(2)
I/O TTL/ST
2(3) 5(3) 36(3) 22(3)
PMD2 18(2) 21(2) 24(2) 8(2)
I/O TTL/ST
3(3) 6(3) 1(3) 23(3)
PMD3 15 18 19 1 I/O TTL/ST
PMD4 14 17 18 44 I/O TTL/ST
PMD5 13 16 17 43 I/O TTL/ST
PMD6 12(2) 15(2) 16(2) 42(2)
I/O TTL/ST
28(3) 3(3) 34(3) 20(3)
PMD7 11(2) 14(2) 15(2) 41(2)
I/O TTL/ST
27(3) 2(3) 33(3) 19(3)
PMRD 21 24 27 11 O Parallel Master Port read strobe
PMWR 22(2) 25(2) 28(2) 14(2)
O Parallel Master Port write strobe
4(3) 7(3) 2(3) 24(3)
VBUS 12 15 16 42 I Analog USB bus power monitor
VUSB3V320 23 26 10 P USB internal transceiver supply. If the
USB module is not used, this pin must be
connected to VDD.
VBUSON 22 25 28 14 O USB Host and OTG bus power control
output
D+ 18 21 24 8 I/O Analog USB D+
D- 19 22 25 9 I/O Analog USB D-
TABLE 1-1: PINOUT I/O DESCRIPTIONS (CONTINUED)
Pin Name
Pin Number(1)
Pin
Type Buffer
Type Description
28-pin
QFN
28-pin
SSOP/
SPDIP/
SOIC
36-pin
VTLA
44-pin
QFN/
TQFP/
VTLA
Legend: CMOS = CMOS compatible input or output Analog = Analog input P = Power
ST = Schmitt Trigger input with CMOS levels O = Output I = Input
TTL = TTL input buffer PPS = Peripheral Pin Select — = N/A
Note 1: Pin numbers are provided for reference only. See the Pin Diagrams section for device pin availability.
2: Pin number for PIC32MX1XX devices only.
3: Pin number for PIC32MX2XX devices only.
2011-2012 Microchip Technology Inc. Preliminary DS61168E-page 25
PIC32MX1XX/2XX
USBID 11 14 15 41 I ST USB OTG ID detect
CTED1 27 2 33 19 I ST CTMU External Edge Input
CTED2 28 3 34 20 I ST
CTED313161743IST
CTED4 15 18 19 1 I ST
CTED522252814IST
CTED623262915IST
CTED7 20 5 I ST
CTED8 13 I ST
CTED9 9 12 10 34 I ST
CTED10 14 17 18 44 I ST
CTED11 18 21 24 8 I ST
CTED12 2 5 36 22 I ST
CTED13 3 6 1 23 I ST
CTPLS 21 24 27 11 O CTMU Pulse Output
PGED1 1 4 35 21 I/O ST Data I/O pin for Programming/Debugging
Communication Channel 1
PGEC1 2 5 36 22 I ST Clock input pin for
Programming/Debugging
Communication Channel 1
PGED2 18 21 24 8 I/O ST Data I/O pin for Programming/Debugging
Communication Channel 2
PGEC2 19 22 25 9 I ST Clock input pin for
Programming/Debugging
Communication Channel 2
PGED3 11(2) 14(2) 15(2) 41(2)
I/O ST Data I/O pin for Programming/Debugging
Communication Channel 3
27(3) 2(3) 33(3) 19(3)
PGEC3 12(2) 15(2) 16(2) 42(2)
IST
Clock input pin for Programming/
Debugging Communication Channel 3
28(3) 3(3) 34(3) 20(3)
PGED4 3 12 I/O ST Data I/O pin for Programming/Debugging
Communication Channel 4
PGEC4 4 13 IST
Clock input pin for Programming/
Debugging Communication Channel 4
TABLE 1-1: PINOUT I/O DESCRIPTIONS (CONTINUED)
Pin Name
Pin Number(1)
Pin
Type Buffer
Type Description
28-pin
QFN
28-pin
SSOP/
SPDIP/
SOIC
36-pin
VTLA
44-pin
QFN/
TQFP/
VTLA
Legend: CMOS = CMOS compatible input or output Analog = Analog input P = Power
ST = Schmitt Trigger input with CMOS levels O = Output I = Input
TTL = TTL input buffer PPS = Peripheral Pin Select — = N/A
Note 1: Pin numbers are provided for reference only. See the Pin Diagrams section for device pin availability.
2: Pin number for PIC32MX1XX devices only.
3: Pin number for PIC32MX2XX devices only.
PIC32MX1XX/2XX
DS61168E-page 26 Preliminary 2011-2012 Microchip Technology Inc.
MCLR 26 1 32 18 I/P ST Master Clear (Reset) input. This pin is an
active-low Reset to the device.
AVDD 25 28 31 17 P Positive supply for analog modules. This
pin must be connected at all times.
AVSS 24 27 30 16 P Ground reference for analog modules
VDD 10 13 5, 13, 14,
23
28, 40 P Positive supply for peripheral logic and
I/O pins
VCAP 17 20 22 7 P CPU logic filter capacitor connection
VSS 5, 16 8, 19 6, 12, 21 6, 29, 39 P Ground reference for logic and I/O pins.
This pin must be connected at all times.
VREF+ 27 2 33 19 I Analog Analog voltage reference (high) input
VREF- 28 3 34 20 I Analog Analog voltage reference (low) input
TABLE 1-1: PINOUT I/O DESCRIPTIONS (CONTINUED)
Pin Name
Pin Number(1)
Pin
Type Buffer
Type Description
28-pin
QFN
28-pin
SSOP/
SPDIP/
SOIC
36-pin
VTLA
44-pin
QFN/
TQFP/
VTLA
Legend: CMOS = CMOS compatible input or output Analog = Analog input P = Power
ST = Schmitt Trigger input with CMOS levels O = Output I = Input
TTL = TTL input buffer PPS = Peripheral Pin Select — = N/A
Note 1: Pin numbers are provided for reference only. See the Pin Diagrams section for device pin availability.
2: Pin number for PIC32MX1XX devices only.
3: Pin number for PIC32MX2XX devices only.
2011-2012 Microchip Technology Inc. Preliminary DS61168E-page 27
PIC32MX1XX/2XX
2.0 GUIDELINES FOR GETTING
STARTED WITH 32-BIT MCUS
2.1 Basic Connection Requirements
Getting started with the PIC32MX1XX/2XX family of
32-bit Microcontrollers (MCUs) requires attention to a
minimal set of device pin connections before proceed-
ing with development. The following is a list of pin
names, which must always be connected:
All VDD and VSS pins (see 2.2 “Decoupling
Capacitors”)
All AVDD and AVSS pins, even if the ADC module is
not used (see 2.2 “Decoupling Capacitors”)
•V
CAP pin (see 2.3 “Capacitor on Internal Voltage
Regulator (VCAP)”)
•MCLR
pin (see 2.4 “Master Clear (MCLR) Pin”)
PGECx/PGEDx pins, used for In-Circuit Serial
Programming (ICSP™) and debugging purposes
(see 2.5 “ICSP Pins”)
OSC1 and OSC2 pins, when external oscillator
source is used (see 2.7 “External Oscillator Pins”)
The following pin may be required, as well:
•V
REF+/VREF- pins – used when external voltage
reference for the ADC module is implemented.
2.2 Decoupling Capacitors
The use of decoupling capacitors on power supply
pins, such as VDD, VSS, AVDD and AVSS is required.
See Figure 2-1.
Consider the following criteria when using decoupling
capacitors:
Value and type of capacitor: A value of 0.1 µF
(100 nF), 10-20V is recommended. The capacitor
should be a low Equivalent Series Resistance (low-
ESR) capacitor and have resonance frequency in
the range of 20 MHz and higher. It is further
recommended that ceramic capacitors be used.
Placement on the printed circuit board: The
decoupling capacitors should be placed as close to
the pins as possible. It is recommended that the
capacitors be placed on the same side of the board
as the device. If space is constricted, the capacitor
can be placed on another layer on the PCB using a
via; however, ensure that the trace length from the
pin to the capacitor is within one-quarter inch
(6 mm) in length.
Handling high freque nc y nois e : If the board is
experiencing high frequency noise, upward of tens
of MHz, add a second ceramic-type capacitor in par-
allel to the above described decoupling capacitor.
The value of the second capacitor can be in the
range of 0.01 µF to 0.001 µF. Place this second
capacitor next to the primary decoupling capacitor.
In high-speed circuit designs, consider implement-
ing a decade pair of capacitances as close to the
power and ground pins as possible. For example,
0.1 µF in parallel with 0.001 µF.
Maximizing performance: On the board layout
from the power supply circuit, run the power and
return traces to the decoupling capacitors first, and
then to the device pins. This ensures that the decou-
pling capacitors are first in the power chain. Equally
important is to keep the trace length between the
capacitor and the power pins to a minimum thereby
reducing PCB track inductance.
FIGURE 2-1: RECOMMENDED
MINIMUM CONNECTION
2.2.1 BULK CAPACITORS
The use of a bulk capacitor is recommended to improve
power supply stability. Typical values range from 4.7 µF
to 47 µF. This capacitor should be located as close to
the device as possible.
Note 1: This data sheet summarizes the features
of the PIC32MX1XX/2XX family of
devices. It is not intended to be a
comprehensive reference source. To
complement the information in this data
sheet, refer to the related section of the
“PIC32 Family Reference Manual”, which
is available from the Microchip web site
(www.microchip.com/PIC32).
2: Some registers and associated bits
described in this section may not be
available on all devices. Refer to
Section 4.0 “Memory Organization” in
this data sheet for device-specific register
and bit information.
Note: The AVDD and AVSS pins must be
connected, regardless of ADC use and
the ADC voltage reference source.
PIC32
VDD
VSS
VDD
VSS
VSS
VDD
AVDD
AVSS
VDD
VSS
C
R
VDD
MCLR
0.1 µF
Ceramic
VCAP
10
R1
CBP
0.1 µF
Ceramic
CBP
0.1 µF
Ceramic
CBP
0.1 µF
Ceramic
CBP
0.1 µF
Ceramic
CBP
CEFC
VUSB3V3(1)
Note 1: If the USB module is not used, this pin must be
connected to VDD.
PIC32MX1XX/2XX
DS61168E-page 28 Preliminary 2011-2012 Microchip Technology Inc.
2.3 Capacitor on Internal Voltage
Regulator (VCAP)
2.3.1 INTERNAL REGULATOR MODE
A low-ESR (1 ohm) capacitor is required on the VCAP
pin, which is used to stabilize the internal voltage regu-
lator output. The VCAP pin must not be connected to
VDD, and must have a CEFC capacitor, with at least a
6V rating, connected to ground. The type can be
ceramic or tantalum. Refer to Section 29.0 “Electric al
Characteristics” for additional information on CEFC
specifications.
2.4 Master Clear (MCLR) Pin
The MCLR pin provides for two specific device
functions:
Device Reset
Device programming and debugging
Pulling The MCLR pin low generates a device Reset.
Figure 2-2 illustrates a typical MCLR circuit. During
device programming and debugging, the resistance
and capacitance that can be added to the pin must
be considered. Device programmers and debuggers
drive the MCLR pin. Consequently, specific voltage
levels (VIH and VIL) and fast signal transitions must
not be adversely affected. Therefore, specific values
of R and C will need to be adjusted based on the
application and PCB requirements.
For example, as illustrated in Figure 2-2, it is
recommended that the capacitor C, be isolated from
the MCLR pin during programming and debugging
operations.
Place the components illustrated in Figure 2-2 within
one-quarter inch (6 mm) from the MCLR pin.
FIGURE 2-2: MCLR PIN CONNECTIONS
2.5 ICSP Pins
The PGECx and PGEDx pins are used for In-Circuit
Serial Programming™ (ICSP™) and debugging pur-
poses. It is recommended to keep the trace length
between the ICSP connector and the ICSP pins on the
device as short as possible. If the ICSP connector is
expected to experience an ESD event, a series resistor
is recommended, with the value in the range of a few
tens of Ohms, not to exceed 100 Ohms.
Pull-up resistors, series diodes and capacitors on the
PGECx and PGEDx pins are not recommended as they
will interfere with the programmer/debugger communi-
cations to the device. If such discrete components are
an application requirement, they should be removed
from the circuit during programming and debugging.
Alternatively, refer to the AC/DC characteristics and
timing requirements information in the respective
device Flash programming specification for information
on capacitive loading limits and pin input voltage high
(VIH) and input low (VIL) requirements.
Ensure that the “Communication Channel Select” (i.e.,
PGECx/PGEDx pins) programmed into the device
matches the physical connections for the ICSP to
MPLAB® ICD 3 or MPLAB REAL ICE™.
For more information on ICD 3 and REAL ICE
connection requirements, refer to the following
documents that are available on the Microchip web
site.
“Using MPLAB® ICD 3” (poster) DS51765
“MPLAB® ICD 3 Design Advisory” DS51764
“MPLAB® REAL ICE™ In-Circuit Debugger
User’s Guide” DS51616
“Using MPLAB® REAL ICE™ Emulator” (poster)
DS51749
2.6 JTAG
The TMS, TDO, TDI and TCK pins are used for testing
and debugging according to the Joint Test Action
Group (JTAG) standard. It is recommended to keep the
trace length between the JTAG connector and the
JTAG pins on the device as short as possible. If the
JTAG connector is expected to experience an ESD
event, a series resistor is recommended, with the value
in the range of a few tens of Ohms, not to exceed 100
Ohms.
Pull-up resistors, series diodes and capacitors on the
TMS, TDO, TDI and TCK pins are not recommended
as they will interfere with the programmer/debugger
communications to the device. If such discrete compo-
nents are an application requirement, they should be
removed from the circuit during programming and
debugging. Alternatively, refer to the AC/DC character-
istics and timing requirements information in the
respective device Flash programming specification for
information on capacitive loading limits and pin input
voltage high (VIH) and input low (VIL) requirements.
Note 1: R 10 k is recommended. A suggested
starting value is 10 k. Ensure that the MCLR
pin VIH and VIL specifications are met.
2: R1 470 will limit any current flowing into
MCLR from the external capacitor C, in the
event of MCLR pin breakdown, due to
Electrostatic Discharge (ESD) or Electrical
Overstress (EOS). Ensure that the MCLR pin
VIH and VIL specifications are met.
3: The capacitor can be sized to prevent uninten-
tional Resets from brief glitches or to extend
the device Reset period during POR.
C(3)
R1(2)
R(1)
VDD
MCLR
PIC32
JP
2011-2012 Microchip Technology Inc. Preliminary DS61168E-page 29
PIC32MX1XX/2XX
2.7 External Oscillator Pins
Many MCUs have options for at least two oscillators: a
high-frequency primary oscillator and a low-frequency
secondary oscillator (refer to Section 8.0 “Oscillator
Configuration” for details).
The oscillator circuit should be placed on the same side
of the board as the device. Also, place the oscillator cir-
cuit close to the respective oscillator pins, not exceed-
ing one-half inch (12 mm) distance between them. The
load capacitors should be placed next to the oscillator
itself, on the same side of the board. Use a grounded
copper pour around the oscillator circuit to isolate them
from surrounding circuits. The grounded copper pour
should be routed directly to the MCU ground. Do not
run any signal traces or power traces inside the ground
pour. Also, if using a two-sided board, avoid any traces
on the other side of the board where the crystal is
placed. A suggested layout is illustrated in Figure 2-3.
FIGURE 2-3: SUGGESTED OSCILLATOR
CIRCUIT PLACEMENT
2.8 Unused I/Os
Unused I/O pins should not be allowed to float as
inputs. They can be configured as outputs and driven
to a logic-low state.
Alternatively, inputs can be reserved by connecting the
pin to VSS through a 1k to 10k resistor and configuring
the pin as an input.
Main Oscillator
Guard Ring
Guard Trace
Secondary
Oscillator
PIC32MX1XX/2XX
DS61168E-page 30 Preliminary 2011-2012 Microchip Technology Inc.
2.9 Typical Application Connection
Examples
Examples of typical application connections are shown
in Figure 2-4 and Figure 2-5.
FIGURE 2-4: CAPACITIVE TOUCH SENSING WITH GRAPHICS APPLICATION
FIGURE 2-5: AUDIO PLAYBACK APPLICATION
CTMU
Current Source
ADC
Microchip
mTouch™
Library
User
Application
Microchip
Graphics
Library
Read the Touch Sensors
Process Samples
Display Data
Parallel
Master
Port
LCD Controller
Frame
Buffer
Display
Controller
PMPD<7:0>
LCD
Panel
PIC32MX120F032D
To AN6 To AN7 To AN8 To AN11
C1
R3
C2
R2
R3
R1
C5
C5
C5
C1
R1 R1 R1
C3
R2
C3
R2
C1
R2
C2
R3
C2
R3
C3
AN0
AN1
AN11
To AN 0
To AN 1
To A N5
AN9
PMPWR
To AN 9
R1
C4
R2
C4
R3
C4
Audio
Codec
Display
PMP
I2S
SPI
USB
USB
PMPD<7:0>
3
3
Stereo Headphones
Speaker
PIC32MX220F032D
Host
PMPWR
MMC SD
3
SDI
2011-2012 Microchip Technology Inc. Preliminary DS61168E-page 31
PIC32MX1XX/2XX
3.0 CPU
The the MIPS32® M4K® Processor Core is the heart of
the PIC32MX1XX/2XX family processor. The CPU
fetches instructions, decodes each instruction, fetches
source operands, executes each instruction and writes
the results of instruction execution to the proper
destinations.
3.1 Features
5-stage pipeline
32-bit address and data paths
MIPS32® Enhanced Architecture (Release 2)
- Multiply-accumulate and multiply-subtract
instructions
- Targeted multiply instruction
- Zero/One detect instructions
-WAIT instruction
- Conditional move instructions (MOVN, MOVZ)
- Vectored interrupts
- Programmable exception vector base
- Atomic interrupt enable/disable
- Bit field manipulation instructions
MIPS16e® code compression
- 16-bit encoding of 32-bit instructions to improve
code density
- Special PC-relative instructions for efficient load-
ing of addresses and constants
-SAVE and RESTORE macro instructions for setting
up and tearing down stack frames within subrou-
tines
- Improved support for handling 8 and 16-bit data
types
Simple Fixed Mapping Translation (FMT)
mechanism
Simple dual bus interface
- Independent 32-bit address and data busses
- Transactions can be aborted to improve interrupt
latency
Autonomous multiply/divide unit
- Maximum issue rate of one 32x16 multiply per
clock
- Maximum issue rate of one 32x32 multiply every
other clock
- Early-in iterative divide. Minimum 11 and maxi-
mum 33 clock latency (dividend (rs) sign exten-
sion-dependent)
Power control
- Minimum frequency: 0 MHz
- Low-Power mode (triggered by WAIT instruction)
- Extensive use of local gated clocks
EJTAG debug and instruction trace
- Support for single stepping
- Virtual instruction and data address/value
- Breakpoints
FIGURE 3-1: MIPS32® M4K® PROCESSOR CORE BLOCK DIAGRAM
Note 1: This data sheet summarizes the features
of the PIC32MX1XX/2XX family of
devices. It is not intended to be a
comprehensive reference source. To
complement the information in this data
sheet, refer to Section 2. “CPU”
(DS61113) in the “PIC32 Family
Reference Manual”, which is available
from the Microchip web site
(www.microchip.com/PIC32). Resources
for the MIPS32® M4K® Processor Core
are available at: www.mips.com.
2: Some registers and associated bits
described in this section may not be
available on all devices. Refer to
Section 4.0 “Memory Organization” in
this data sheet for device-specific register
and bit information.
CPU
MDU
Execution Core
(RF/ALU/Shift) FMT
TAP
EJTAG
Bus Interface
Power
Management
System
Co-processor
Off-chip Debug Interface
Bus Matrix
Dual Bus Interface
PIC32MX1XX/2XX
DS61168E-page 32 Preliminary 2011-2012 Microchip Technology Inc.
3.2 Architecture Overview
The MIPS32® M4K® processor core contains several
logic blocks working together in parallel, providing an
efficient high-performance computing engine. The
following blocks are included with the core:
Execution Unit
Multiply/Divide Unit (MDU)
System Control Coprocessor (CP0)
Fixed Mapping Translation (FMT)
Dual Internal Bus interfaces
Power Management
MIPS16e Support
Enhanced JTAG (EJTAG) Controller
3.2.1 EXECUTION UNIT
The MIPS32® M4K® processor core execution unit
implements a load/store architecture with single-cycle
ALU operations (logical, shift, add, subtract) and an
autonomous multiply/divide unit. The core contains
thirty-two 32-bit General Purpose Registers (GPRs)
used for integer operations and address calculation.
The register file consists of two read ports and one
write port and is fully bypassed to minimize operation
latency in the pipeline.
The execution unit includes:
32-bit adder used for calculating the data address
Address unit for calculating the next instruction
address
Logic for branch determination and branch target
address calculation
Load aligner
Bypass multiplexers used to avoid stalls when
executing instruction streams where data
producing instructions are followed closely by
consumers of their results
Leading Zero/One detect unit for implementing
the CLZ and CLO instructions
Arithmetic Logic Unit (ALU) for performing bitwise
logical operations
Shifter and store aligner
3.2.2 MULTIPLY/DIVIDE UNIT (MDU)
The MIPS32® M4K® processor core includes a Multi-
ply/Divide Unit (MDU) that contains a separate pipeline
for multiply and divide operations. This pipeline oper-
ates in parallel with the Integer Unit (IU) pipeline and
does not stall when the IU pipeline stalls. This allows
MDU operations to be partially masked by system stalls
and/or other integer unit instructions.
The high-performance MDU consists of a 32x16 booth
recoded multiplier, result/accumulation registers (HI
and LO), a divide state machine, and the necessary
multiplexers and control logic. The first number shown
(‘32’ of 32x16) represents the rs operand. The second
number (‘16’ of 32x16) represents the rt operand. The
PIC32 core only checks the value of the latter (rt) oper-
and to determine how many times the operation must
pass through the multiplier. The 16x16 and 32x16
operations pass through the multiplier once. A 32x32
operation passes through the multiplier twice.
The MDU supports execution of one 16x16 or 32x16
multiply operation every clock cycle; 32x32 multiply
operations can be issued every other clock cycle.
Appropriate interlocks are implemented to stall the
issuance of back-to-back 32x32 multiply operations.
The multiply operand size is automatically determined
by logic built into the MDU.
Divide operations are implemented with a simple 1 bit
per clock iterative algorithm. An early-in detection
checks the sign extension of the dividend (rs) operand.
If rs is 8 bits wide, 23 iterations are skipped. For a 16-bit
wide rs, 15 iterations are skipped and for a 24-bit wide
rs, 7 iterations are skipped. Any attempt to issue a sub-
sequent MDU instruction while a divide is still active
causes an IU pipeline stall until the divide operation is
completed.
Table 3-1 lists the repeat rate (peak issue rate of cycles
until the operation can be reissued) and latency (num-
ber of cycles until a result is available) for the PIC32
core multiply and divide instructions. The approximate
latency and repeat rates are listed in terms of pipeline
clocks.
TABLE 3-1: MIPS32® M4K® PROCESSOR CORE HIGH-PERFORMANCE INTEGER
MULTIPLY/DIVIDE UNIT LATENCIES AND REPEAT RATES
Opcode Operand Size (mul rt) (div rs) Latency Repeat Rate
MULT/MULTU, MADD/MADDU,
MSUB/MSUBU 16 bits 1 1
32 bits 2 2
MUL 16 bits 2 1
32 bits 3 2
DIV/DIVU 8 bits 12 11
16 bits 19 18
24 bits 26 25
32 bits 33 32
2011-2012 Microchip Technology Inc. Preliminary DS61168E-page 33
PIC32MX1XX/2XX
The MIPS architecture defines that the result of a
multiply or divide operation be placed in the HI and LO
registers. Using the Move-From-HI (MFHI) and Move-
From-LO (MFLO) instructions, these values can be
transferred to the General Purpose Register file.
In addition to the HI/LO targeted operations, the
MIPS32® architecture also defines a multiply instruc-
tion, MUL, which places the least significant results in
the primary register file instead of the HI/LO register
pair. By avoiding the explicit MFLO instruction required
when using the LO register, and by supporting multiple
destination registers, the throughput of multiply-inten-
sive operations is increased.
Two other instructions, Multiply-Add (MADD) and
Multiply-Subtract (MSUB), are used to perform the
multiply-accumulate and multiply-subtract operations.
The MADD instruction multiplies two numbers and then
adds the product to the current contents of the HI and
LO registers. Similarly, the MSUB instruction multiplies
two operands and then subtracts the product from the
HI and LO registers. The MADD and MSUB operations
are commonly used in DSP algorithms.
3.2.3 SYSTEM CONTROL
COPROCESSOR (CP0)
In the MIPS architecture, CP0 is responsible for the
virtual-to-physical address translation, the exception
control system, the processor’s diagnostics capability,
the operating modes (Kernel, User and Debug) and
whether interrupts are enabled or disabled. Configura-
tion information, such as presence of options like
MIPS16e, is also available by accessing the CP0
registers, listed in Tab l e 3 - 2.
TABLE 3-2: COPROCESSOR 0 REGISTERS
Register
Number Register
Name Function
0-6 Reserved Reserved in the PIC32MX1XX/2XX family core.
7 HWREna Enables access via the RDHWR instruction to selected hardware registers.
8 BadVAddr(1) Reports the address for the most recent address-related exception.
9 Count(1) Processor cycle count.
10 Reserved Reserved in the PIC32MX1XX/2XX family core.
11 Compare(1) Timer interrupt control.
12 Status(1) Processor status and control.
12 IntCtl(1) Interrupt system status and control.
12 SRSCtl(1) Shadow register set status and control.
12 SRSMap(1) Provides mapping from vectored interrupt to a shadow set.
13 Cause(1) Cause of last general exception.
14 EPC(1) Program counter at last exception.
15 PRId Processor identification and revision.
15 EBASE Exception vector base register.
16 Config Configuration register.
16 Config1 Configuration Register 1.
16 Config2 Configuration Register 2.
16 Config3 Configuration Register 3.
17-22 Reserved Reserved in the PIC32MX1XX/2XX family core.
23 Debug(2) Debug control and exception status.
24 DEPC(2) Program counter at last debug exception.
25-29 Reserved Reserved in the PIC32MX1XX/2XX family core.
30 ErrorEPC(1) Program counter at last error.
31 DESAVE(2) Debug handler scratchpad register.
Note 1: Registers used in exception processing.
2: Registers used during debug.
PIC32MX1XX/2XX
DS61168E-page 34 Preliminary 2011-2012 Microchip Technology Inc.
Coprocessor 0 also contains the logic for identifying
and managing exceptions. Exceptions can be caused
by a variety of sources, including alignment errors in
data, external events or program errors. Table 3-3 lists
the exception types in order of priority.
TABLE 3-3: MIPS32® M4K® PROCESSOR CORE EXCEPTION TYPES
3.3 Power Management
The MIPS® M4K® processor core offers a number of
power management features, including low-power
design, active power management and power-down
modes of operation. The core is a static design that
supports slowing or Halting the clocks, which reduces
system power consumption during Idle periods.
3.3.1 INSTRUCTION-CONTROLLED
POWER MANAGEMENT
The mechanism for invoking Power-Down mode is
through execution of the WAIT instruction. For more
information on power management, see Section 25.0
“Power-Saving Features”.
3.4 EJTAG Debug Support
The MIPS® M4K® processor core provides for an
Enhanced JTAG (EJTAG) interface for use in the soft-
ware debug of application and kernel code. In addition
to standard User mode and Kernel modes of operation,
the M4K® core provides a Debug mode that is entered
after a debug exception (derived from a hardware
breakpoint, single-step exception, etc.) is taken and
continues until a Debug Exception Return (DERET)
instruction is executed. During this time, the processor
executes the debug exception handler routine.
The EJTAG interface operates through the Test Access
Port (TAP), a serial communication port used for trans-
ferring test data in and out of the core. In addition to the
standard JTAG instructions, special instructions
defined in the EJTAG specification define which
registers are selected and how they are used.
Exception Description
Reset Assertion MCLR or a Power-on Reset (POR).
DSS EJTAG debug single step.
DINT EJTAG debug interrupt. Caused by the assertion of the external EJ_DINT input or by setting the
EjtagBrk bit in the ECR register.
NMI Assertion of NMI signal.
Interrupt Assertion of unmasked hardware or software interrupt signal.
DIB EJTAG debug hardware instruction break matched.
AdEL Fetch address alignment error.
Fetch reference to protected address.
IBE Instruction fetch bus error.
DBp EJTAG breakpoint (execution of SDBBP instruction).
Sys Execution of SYSCALL instruction.
Bp Execution of BREAK instruction.
RI Execution of a reserved instruction.
CpU Execution of a coprocessor instruction for a coprocessor that is not enabled.
CEU Execution of a CorExtend instruction when CorExtend is not enabled.
Ov Execution of an arithmetic instruction that overflowed.
Tr Execution of a trap (when trap condition is true).
DDBL/DDBS EJTAG Data Address Break (address only) or EJTAG data value break on store (address + value).
AdEL Load address alignment error.
Load reference to protected address.
AdES Store address alignment error.
Store to protected address.
DBE Load or store bus error.
DDBL EJTAG data hardware breakpoint matched in load data compare.
2011-2012 Microchip Technology Inc. Preliminary DS61168E-page 35
PIC32MX1XX/2XX
4.0 MEMORY ORGANIZATION
PIC32MX1XX/2XX microcontrollers provide 4 GB of
unified virtual memory address space. All memory
regions, including program, data memory, SFRs and
Configuration registers, reside in this address space at
their respective unique addresses. The program and
data memories can be optionally partitioned into user
and kernel memories. In addition, the data memory can
be made executable, allowing PIC32MX1XX/2XX
devices to execute from data memory.
Key features include:
32-bit native data width
Separate User (KUSEG) and Kernel
(KSEG0/KSEG1) mode address space
Flexible program Flash memory partitioning
Flexible data RAM partitioning for data and
program space
Separate boot Flash memory for protected code
Robust bus exception handling to intercept
runaway code
Simple memory mapping with Fixed Mapping
Translation (FMT) unit
Cacheable (KSEG0) and non-cacheable (KSEG1)
address regions
4.1 PIC32MX1XX/2XX Memory Layout
PIC32MX1XX/2XX microcontrollers implement two
address schemes: virtual and physical. All hardware
resources, such as program memory, data memory
and peripherals, are located at their respective physical
addresses. Virtual addresses are exclusively used by
the CPU to fetch and execute instructions as well as
access peripherals. Physical addresses are used by
bus master peripherals, such as DMA and the Flash
controller, that access memory independently of the
CPU.
The memory maps for the PIC32MX1XX/2XX devices
are illustrated in Figure 4-1 and Figure 4-2.
Note: This data sheet summarizes the features
of the PIC32MX1XX/2XX family of
devices. It is not intended to be a
comprehensive reference source.For
detailed information, refer to Section 3.
“Memory Organization” (DS61115) in
the “PIC32 Family Reference Manual,
which is available from the Microchip
web site (www.microchip.com/PIC32).
PIC32MX1XX/2XX
DS61168E-page 36 Preliminary 2011-2012 Microchip Technology Inc.
FIGURE 4-1: MEMORY MAP ON RESET FOR PIC32MX11X/21X DEVICES
Virtual
Memory Map(1) Physical
Memory Map(1)
0xFFFFFFFF Reserved
Reserved
0xFFFFFFFF
0xBFC00C00
0xBFC00BFF Device
Configuration
Registers
0xBFC00BF0
0xBFC00BEF
Boot Flash
0xBFC00000
Reserved
0xBF900000
0xBF8FFFFF
SFRs
0xBF800000
Reserved
0xBD004000
0xBD003FFF
Program Flash(2)
0xBD000000
Reserved
0xA0001000
0xA0000FFF
RAM(2)
0xA0000000 0x1FC00C00
Reserved Device
Configuration
Registers
0x1FC00BFF
0x9FC00C00
0x9FC00BFF Device
Configuration
Registers
0x1FC00BF0
Boot Flash
0x1FC00BEF
0x9FC00BF0
0x9FC00BEF
Boot Flash
0x1FC00000
Reserved
0x9FC00000 0x1F900000
Reserved SFRs
0x1F8FFFFF
0x9D004000 0x1F800000
0x9D003FFF
Program Flash(2) Reserved
0x9D000000 0x1D004000
Reserved Program Flash(2) 0x1D003FFF
0x80001000
0x80000FFF
RAM(2) 0x1D000000
Reserved
0x80000000 0x00001000
Reserved RAM(2) 0x00000FFF
0x00000000 0x00000000
Note 1: Memory areas are not shown to scale.
2: The size of this memory region is programmable (see Section 3. “Memory Organization”
(DS61115) in the “PIC32 Family Reference Manual”) and can be changed by initialization
code provided by end user development tools (refer to the specific development tool
documentation for information).
KSEG1KSEG0
2011-2012 Microchip Technology Inc. Preliminary DS61168E-page 37
PIC32MX1XX/2XX
FIGURE 4-2: MEMORY MAP ON RESET FOR PIC32MX12X/22X DEVICES
Virtual
Memory Map(1) Physical
Memory Map(1)
0xFFFFFFFF Reserved
Reserved
0xFFFFFFFF
0xBFC00C00
0xBFC00BFF Device
Configuration
Registers
0xBFC00BF0
0xBFC00BEF
Boot Flash
0xBFC00000
Reserved
0xBF900000
0xBF8FFFFF
SFRs
0xBF800000
Reserved
0xBD008000
0xBD007FFF
Program Flash(2)
0xBD000000
Reserved
0xA0002000
0xA0001FFF
RAM(2)
0xA0000000 0x1FC00C00
Reserved Device
Configuration
Registers
0x1FC00BFF
0x9FC00C00
0x9FC00BFF Device
Configuration
Registers
0x1FC00BF0
Boot Flash
0x1FC00BEF
0x9FC00BF0
0x9FC00BEF
Boot Flash
0x1FC00000
Reserved
0x9FC00000 0x1F900000
Reserved SFRs
0x1F8FFFFF
0x9D008000 0x1F800000
0x9D007FFF
Program Flash(2) Reserved
0x9D000000 0x1D008000
Reserved Program Flash(2) 0x1D007FFF
0x80002000
0x80001FFF
RAM(2) 0x1D000000
Reserved
0x80000000 0x00002000
Reserved RAM(2) 0x00001FFF
0x00000000 0x00000000
Note 1: Memory areas are not shown to scale.
2: The size of this memory region is programmable (see Section 3. “Memory Organization”
(DS61115) in the “PIC32 Family Reference Manual”) and can be changed by initialization
code provided by end user development tools (refer to the specific development tool
documentation for information).
KSEG1KSEG0
PIC32MX1XX/2XX
DS61168E-page 38 Preliminary 2011-2012 Microchip Technology Inc.
FIGURE 4-3: MEMORY MAP ON RESET FOR PIC32MX13X/23X DEVICES
Virtual
Memory Map(1) Physical
Memory Map(1)
0xFFFFFFFF Reserved
Reserved
0xFFFFFFFF
0xBFC00C00
0xBFC00BFF Device
Configuration
Registers
0xBFC00BF0
0xBFC00BEF
Boot Flash
0xBFC00000
Reserved
0xBF900000
0xBF8FFFFF
SFRs
0xBF800000
Reserved
0xBD010000
0xBD00FFFF
Program Flash(2)
0xBD000000
Reserved
0xA0004000
0xA0003FFF
RAM(2)
0xA0000000 0x1FC00C00
Reserved Device
Configuration
Registers
0x1FC00BFF
0x9FC00C00
0x9FC00BFF Device
Configuration
Registers
0x1FC00BF0
Boot Flash
0x1FC00BEF
0x9FC00BF0
0x9FC00BEF
Boot Flash
0x1FC00000
Reserved
0x9FC00000 0x1F900000
Reserved SFRs
0x1F8FFFFF
0x9D010000 0x1F800000
0x9D00FFFF
Program Flash(2) Reserved
0x9D000000 0x1D010000
Reserved Program Flash(2) 0x1D00FFFF
0x80004000
0x80003FFF
RAM(2) 0x1D000000
Reserved
0x80000000 0x00004000
Reserved RAM(2) 0x00003FFF
0x00000000 0x00000000
Note 1: Memory areas are not shown to scale.
2: The size of this memory region is programmable (see Section 3. “Memory Organization”
(DS61115) in the “PIC32 Family Reference Manual”) and can be changed by initialization
code provided by end user development tools (refer to the specific development tool
documentation for information).
KSEG1KSEG0
2011-2012 Microchip Technology Inc. Preliminary DS61168E-page 39
PIC32MX1XX/2XX
FIGURE 4-4: MEMORY MAP ON RESET FOR PIC32MX15X/25X DEVICES
Virtual
Memory Map(1) Physical
Memory Map(1)
0xFFFFFFFF Reserved
Reserved
0xFFFFFFFF
0xBFC00C00
0xBFC00BFF Device
Configuration
Registers
0xBFC00BF0
0xBFC00BEF
Boot Flash
0xBFC00000
Reserved
0xBF900000
0xBF8FFFFF
SFRs
0xBF800000
Reserved
0xBD020000
0xBD01FFFF
Program Flash(2)
0xBD000000
Reserved
0xA0008000
0xA0007FFF
RAM(2)
0xA0000000 0x1FC00C00
Reserved Device
Configuration
Registers
0x1FC00BFF
0x9FC00C00
0x9FC00BFF Device
Configuration
Registers
0x1FC00BF0
Boot Flash
0x1FC00BEF
0x9FC00BF0
0x9FC00BEF
Boot Flash
0x1FC00000
Reserved
0x9FC00000 0x1F900000
Reserved SFRs
0x1F8FFFFF
0x9D020000 0x1F800000
0x9D01FFFF
Program Flash(2) Reserved
0x9D000000 0x1D020000
Reserved Program Flash(2) 0x1D01FFFF
0x80008000
0x80007FFF
RAM(2) 0x1D000000
Reserved
0x80000000 0x00008000
Reserved RAM(2) 0x00007FFF
0x00000000 0x00000000
Note 1: Memory areas are not shown to scale.
2: The size of this memory region is programmable (see Section 3. “Memory Organization”
(DS61115) in the “PIC32 Family Reference Manual”) and can be changed by initialization
code provided by end user development tools (refer to the specific development tool
documentation for information).
KSEG1KSEG0
PIC32MX1XX/2XX
DS61168E-page 40 Preliminary 2011-2012 Microchip Technology Inc.
4.2 Special Function Registers
Table 4-1 through Tab le 4-27 contain the Special Function Register (SFR) maps for the PIC32MX1XX/2XX devices.
TABLE 4-1: BUS MATRIX REGISTER MAP
Virtual Address
(BF88_#)
Register
Name
Bit Rang e
Bits
All
Resets
31/15 30/14 29/13 28/12 27/11 26/10 25/9 24/8 23/7 22/6 21/5 20/4 19/3 18/2 17/1 16/0
2000 BMXCON(1) 31:16 BMXERRIXI BMXERRICD BMXERRDMA BMXERRDS BMXERRIS 001F
15:0 —BMXWSDRM BMXARB<2:0> 0041
2010 BMXDKPBA(1) 31:16 0000
15:0 BMXDKPBA<15:0> 0000
2020 BMXDUDBA(1) 31:16 0000
15:0 BMXDUDBA<15:0> 0000
2030 BMXDUPBA(1) 31:16 0000
15:0 BMXDUPBA<15:0> 0000
2040 BMXDRMSZ 31:16 BMXDRMSZ<31:0> xxxx
15:0 xxxx
2050 BMXPUPBA(1) 31:16 BMXPUPBA<19:16> 0000
15:0 BMXPUPBA<15:0> 0000
2060 BMXPFMSZ 31:16 BMXPFMSZ<31:0> xxxx
15:0 xxxx
2070 BMXBOOTSZ 31:16 BMXBOOTSZ<31:0> 0000
15:0 0C00
Legend: x = unknown value on Reset; — = unimplemented, read as ‘0’. Reset values are shown in hexadecimal.
Note 1: This register has corresponding CLR, SET and INV registers at its virtual address, plus an offset of 0x4, 0x8 and 0xC, respectively. See Section 11.2 “CLR, S ET and INV Registers for more information.
2011-2012 Microchip Technology Inc. Preliminary DS61168E-page 41
PIC32MX1XX/2XX
TABLE 4-2: INTERRUPT REGISTER MAP
Virtual Address
(BF88_#)
Register
Name(1)
Bit Rang e
Bits
All
Resets
31/15 30/14 29/13 28/12 27/11 26/10 25/9 24/8 23/7 22/6 21/5 20/4 19/3 18/2 17/1 16/0
1000 INTCON 31:16 SS0 0000
15:0 MVEC —TPC<2:0> INT4EP INT3EP INT2EP INT1EP INT0EP 0000
1010 INTSTAT(3) 31:16 0000
15:0 —SRIPL<2:0>—VEC<5:0>0000
1020 IPTMR 31:16 IPTMR<31:0> 0000
15:0 0000
1030 IFS0 31:16 FCEIF RTCCIF FSCMIF AD1IF OC5IF IC5IF IC5EIF T5IF INT4IF OC4IF IC4IF IC4EIF T4IF INT3IF OC3IF IC3IF 0000
15:0 IC3EIF T3IF INT2IF OC2IF IC2IF IC2EIF T2IF INT1IF OC1IF IC1IF IC1EIF T1IF INT0IF CS1IF CS0IF CTIF 0000
1040 IFS1 31:16 DMA3IF DMA2IF DMA1IF DMA0IF CTMUIF I2C2MIF I2C2SIF I2C2BIF U2TXIF U2RXIF U2EIF SPI2TXIF SPI2RXIF SPI2EIF PMPEIF PMPIF 0000
15:0 CNCIF CNBIF CNAIF I2C1MIF I2C1SIF I2C1BIF U1TXIF U1RXIF U1EIF SPI1TXIF SPI1RXIF SPI1EIF USBIF(2) CMP3IF CMP2IF CMP1IF 0000
1060 IEC0 31:16 FCEIE RTCCIE FSCMIE AD1IE OC5IE IC5IE IC5EIE T5IE INT4IE OC4IE IC4IE IC4EIE T4IE INT3IE OC3IE IC3IE 0000
15:0 IC3EIE T3IE INT2IE OC2IE IC2IE IC2EIE T2IE INT1IE OC1IE IC1IE IC1EIE T1IE INT0IE CS1IE CS0IE CTIE 0000
1070 IEC1 31:16 DMA3IE DMA2IE DMA1IE DMA0IE CTMUIE I2C2MIE I2C2SIE I2C2BIE U2TXIE U2RXIE U2EIE SPI2TXIE SPI2RXIE SPI2EIE PMPEIE PMPIE 0000
15:0 CNCIE CNBIE CNAIE I2C1MIE I2C1SIE I2C1BIE U1TXIE U1RXIE U1EIE SPI1TXIE SPI1RXIE SPI1EIE USBIE(2) CMP3IE CMP2IE CMP1IE 0000
1090 IPC0 31:16 INT0IP<2:0> INT0IS<1:0> CS1IP<2:0> CS1IS<1:0> 0000
15:0 CS0IP<2:0> CS0IS<1:0> —CTIP<2:0>CTIS<1:0>0000
10A0 IPC1 31:16 INT1IP<2:0> INT1IS<1:0> OC1IP<2:0> OC1IS<1:0> 0000
15:0 IC1IP<2:0> IC1IS<1:0> T1IP<2:0> T1IS<1:0> 0000
10B0 IPC2 31:16 INT2IP<2:0> INT2IS<1:0> OC2IP<2:0> OC2IS<1:0> 0000
15:0 IC2IP<2:0> IC2IS<1:0> T2IP<2:0> T2IS<1:0> 0000
10C0 IPC3 31:16 INT3IP<2:0> INT3IS<1:0> OC3IP<2:0> OC3IS<1:0> 0000
15:0 IC3IP<2:0> IC3IS<1:0> T3IP<2:0> T3IS<1:0> 0000
10D0 IPC4 31:16 INT4IP<2:0> INT4IS<1:0> OC4IP<2:0> OC4IS<1:0> 0000
15:0 IC4IP<2:0> IC4IS<1:0> T4IP<2:0> T4IS<1:0> 0000
10E0 IPC5 31:16 AD1IP<2:0> AD1IS<1:0> OC5IP<2:0> OC5IS<1:0> 0000
15:0 IC5IP<2:0> IC5IS<1:0> T5IP<2:0> T5IS<1:0> 0000
10F0 IPC6 31:16 CMP1IP<2:0> CMP1IS<1:0> FCEIP<2:0> FCEIS<1:0> 0000
15:0 RTCCIP<2:0> RTCCIS<1:0> FSCMIP<2:0> FSCMIS<1:0> 0000
1100 IPC7 31:16 SPI1IP<2:0> SPI1IS<1:0> USBIP<2:0>(2) USBIS<1:0>(2) 0000
15:0 CMP3IP<2:0> CMP3IS<1:0> CMP2IP<2:0> CMP2IS<1:0> 0000
Legend: x = unknown value on Reset; — = unimplemented, read as ‘0’. Reset values are shown in hexadecimal.
Note 1: With the exception of those noted, all registers in this table have corresponding CLR, SET and INV registers at their virtual addresses, plus offsets of 0x4 0x8 and 0xC, respectively. See Section 11.2 “CLR,
SET and INV Registers” for more information.
2: These bits are not available on PIC32MX1XX devices.
3: This register does not have associated CLR, SET, INV registers.
PIC32MX1XX/2XX
DS61168E-page 42 Preliminary 2011-2012 Microchip Technology Inc.
1110 IPC8 31:16 PMPIP<2:0> PMPIS<1:0> CNIP<2:0> CNIS<1:0> 0000
15:0 I2C1IP<2:0> I2C1IS<1:0> —U1IP<2:0>U1IS<1:0>0000
1120 IPC9 31:16 CTMUIP<2:0> CTMUIS<1:0> I2C2IP<2:0> I2C2IS<1:0> 0000
15:0 U2IP<2:0> U2IS<1:0> SPI2IP<2:0> SPI2IS<1:0> 0000
1130 IPC10 31:16 DMA3IP<2:0> DMA3IS<1:0> DMA2IP<2:0> DMA2IS<1:0> 0000
15:0 DMA1IP<2:0> DMA1IS<1:0> DMA0IP<2:0> DMA0IS<1:0> 0000
TABLE 4-2: INTERRUPT REGISTER MAP (CONTINUED)
Virtual Address
(BF88_#)
Register
Name(1)
Bit Range
Bits
All
Resets
31/15 30/14 29/13 28/12 27/11 26/10 25/9 24/8 23/7 22/6 21/5 20/4 19/3 18/2 17/1 16/0
Legend: x = unknown value on Reset; — = unimplemented, read as ‘0’. Reset values are shown in hexadecimal.
Note 1: With the exception of those noted, all registers in this table have corresponding CLR, SET and INV registers at their virtual addresses, plus offsets of 0x4 0x8 and 0xC, respectively. See Section 11.2 “CLR,
SET and INV Registers” for more information.
2: These bits are not available on PIC32MX1XX devices.
3: This register does not have associated CLR, SET, INV registers.
2011-2012 Microchip Technology Inc. Preliminary DS61168E-page 43
PIC32MX1XX/2XX
TABLE 4-3: TIMER1-TIMER5 REGISTER MAP
Virtual Address
(BF80_#)
Register
Name(1)
Bit Range
Bits
All Resets
31/15 30/14 29/13 28/12 27/11 26/10 25/9 24/8 23/7 22/6 21/5 20/4 19/3 18/2 17/1 16/0
0600 T1CON 31:16 ————————————————0000
15:0 ON SIDL TWDIS TWIP —TGATE—TCKPS<1:0>—TSYNCTCS 0000
0610 TMR1 31:16 ————————————————0000
15:0 TMR1<15:0> 0000
0620 PR1 31:16 ———————————————0000
15:0 PR1<15:0> FFFF
0800 T2CON 31:16 ————————————————0000
15:0 ON —SIDL TGATE TCKPS<2:0> T32 —TCS0000
0810 TMR2 31:16 ————————————————0000
15:0 TMR2<15:0> 0000
0820 PR2 31:16 ———————————————0000
15:0 PR2<15:0> FFFF
0A00 T3CON 31:16 ——————————————0000
15:0 ON —SIDL TGATE TCKPS<2:0> —TCS0000
0A10 TMR3 31:16 ————————————————0000
15:0 TMR3<15:0> 0000
0A20 PR3 31:16 ————————————————0000
15:0 PR3<15:0> FFFF
0C00 T4CON 31:16 ————————————————0000
15:0 ON —SIDL TGATE TCKPS<2:0> T32 —TCS0000
0C10 TMR4 31:16 ————————————————0000
15:0 TMR4<15:0> 0000
0C20 PR4 31:16 ————————————————0000
15:0 PR4<15:0> FFFF
0E00 T5CON 31:16 ——————————————0000
15:0 ON —SIDL TGATE TCKPS<2:0> —TCS0000
0E10 TMR5 31:16 ————————————————0000
15:0 TMR5<15:0> 0000
0E20 PR5 31:16 ————————————————0000
15:0 PR5<15:0> FFFF
Legend: x = unknown value on Reset; — = unimplemented, read as ‘0’. Reset values are shown in hexadecimal.
Note 1: All registers in this table have corresponding CLR, SET and INV registers at their virtual addresses, plus offsets of 0x4, 0x8 and 0xC, respectively. See Section 11.2 “CLR, SET and INV Registers” for
more information.
PIC32MX1XX/2XX
DS61168E-page 44 Preliminary 2011-2012 Microchip Technology Inc.
TABLE 4-4: INPUT CAPTURE 1-INPUT CAPTURE 5 REGISTER MAP
Virtual Address
(BF80_#)
Register
Name
Bit Range
Bits
All Resets
31/15 30/14 29/13 28/12 27/11 26/10 25/9 24/8 23/7 22/6 21/5 20/4 19/3 18/2 17/1 16/0
2000 IC1CON(1) 31:16 0000
15:0 ON —SIDL FEDGE C32 ICTMR ICI<1:0> ICOV ICBNE ICM<2:0> 0000
2010 IC1BUF 31:16 IC1BUF<31:0> xxxx
15:0 xxxx
2200 IC2CON(1) 31:16 0000
15:0 ON —SIDL FEDGE C32 ICTMR ICI<1:0> ICOV ICBNE ICM<2:0> 0000
2210 IC2BUF 31:16 IC2BUF<31:0> xxxx
15:0 xxxx
2400 IC3CON(1) 31:16 0000
15:0 ON —SIDL FEDGE C32 ICTMR ICI<1:0> ICOV ICBNE ICM<2:0> 0000
2410 IC3BUF 31:16 IC3BUF<31:0> xxxx
15:0 xxxx
2600 IC4CON(1) 31:16 0000
15:0 ON —SIDL FEDGE C32 ICTMR ICI<1:0> ICOV ICBNE ICM<2:0> 0000
2610 IC4BUF 31:16 IC4BUF<31:0> xxxx
15:0 xxxx
2800 IC5CON(1) 31:16 0000
15:0 ON —SIDL FEDGE C32 ICTMR ICI<1:0> ICOV ICBNE ICM<2:0> 0000
2810 IC5BUF 31:16 IC5BUF<31:0> xxxx
15:0 xxxx
Legend: x = unknown value on Reset; — = unimplemented, read as ‘0’. Reset values are shown in hexadecimal.
Note 1: This register has corresponding CLR, SET and INV registers at its virtual address, plus an offset of 0x4, 0x8 and 0xC, respectively. See Section 11.2 “CLR, SET and INV Registers” for more information.
2011-2012 Microchip Technology Inc. Preliminary DS61168E-page 45
PIC32MX1XX/2XX
TABLE 4-5: OUTPUT COMPARE 1-OUTPUT COMPARE 5 REGISTER MAP
Virtual Address
(BF80_#)
Register
Name(1)
Bit Range
Bits
All Resets
31/15 30/14 29/13 28/12 27/11 26/10 25/9 24/8 23/7 22/6 21/5 20/4 19/3 18/2 17/1 16/0
3000 OC1CON 31:16 ————————————————0000
15:0 ON —SIDL—————— OC32 OCFLT OCTSEL OCM<2:0> 0000
3010 OC1R 31:16 OC1R<31:0> xxxx
15:0 xxxx
3020 OC1RS 31:16 OC1RS<31:0> xxxx
15:0 xxxx
3200 OC2CON 31:16 ————————————————0000
15:0 ON —SIDL—————— OC32 OCFLT OCTSEL OCM<2:0> 0000
3210 OC2R 31:16 OC2R<31:0> xxxx
15:0 xxxx
3220 OC2RS 31:16 OC2RS<31:0> xxxx
15:0 xxxx
3400 OC3CON 31:16 ————————————————0000
15:0 ON —SIDL—————— OC32 OCFLT OCTSEL OCM<2:0> 0000
3410 OC3R 31:16 OC3R<31:0> xxxx
15:0 xxxx
3420 OC3RS 31:16
15:0 OC3RS<31:0> xxxx
xxxx
3600 OC4CON 31:16 ————————————————0000
15:0 ON —SIDL—————— OC32 OCFLT OCTSEL OCM<2:0> 0000
3610 OC4R 31:16 OC4R<31:0> xxxx
15:0 xxxx
3620 OC4RS 31:16
15:0 OC4RS<31:0> xxxx
xxxx
3800 OC5CON 31:16 ————————————————0000
15:0 ON —SIDL—————— OC32 OCFLT OCTSEL OCM<2:0> 0000
3810 OC5R 31:16 OC5R<31:0> xxxx
15:0 xxxx
3820 OC5RS 31:16 OC5RS<31:0> xxxx
15:0 xxxx
Legend: x = unknown value on Reset; — = unimplemented, read as ‘0’. Reset values are shown in hexadecimal.
Note 1: All registers in this table have corresponding CLR, SET and INV registers at their virtual addresses, plus offsets of 0x4, 0x8 and 0xC, respectively. See Section 11.2 “CLR, SET and INV Registers” for
more information.
PIC32MX1XX/2XX
DS61168E-page 46 Preliminary 2011-2012 Microchip Technology Inc.
TABLE 4-6: I2C1 AND I2C2 REGISTER MAP
Virtual Address
(BF80_#)
Register
Name(1)
Bit Range
Bits
All Resets
31/15 30/14 29/13 28/12 27/11 26/10 25/9 24/8 23/7 22/6 21/5 20/4 19/3 18/2 17/1 16/0
5000 I2C1CON 31:16 ————————————————0000
15:0 ON SIDL SCLREL STRICT A10M DISSLW SMEN GCEN STREN ACKDT ACKEN RCEN PEN RSEN SEN 1000
5010 I2C1STAT 31:16 ————————————————0000
15:0 ACKSTAT TRSTAT —— BCL GCSTAT ADD10 IWCOL I2COV D/A P S R/W RBF TBF 0000
5020 I2C1ADD 31:16 ————————————————0000
15:0 ————— Address Register 0000
5030 I2C1MSK 31:16 ————————————————0000
15:0 ————— Address Mask Register 0000
5040 I2C1BRG 31:16 ————————————————0000
15:0 ——— Baud Rate Generator Register 0000
5050 I2C1TRN 31:16 ———————————————0000
15:0 ——————— Transmit Register 0000
5060 I2C1RCV 31:16 ————————————————0000
15:0 ——————— Receive Register 0000
5100 I2C2CON 31:16 ————————————————0000
15:0 ON SIDL SCLREL STRICT A10M DISSLW SMEN GCEN STREN ACKDT ACKEN RCEN PEN RSEN SEN 1000
5110 I2C2STAT 31:16 ————————————————0000
15:0 ACKSTAT TRSTAT —— BCL GCSTAT ADD10 IWCOL I2COV D/A P S R/W RBF TBF 0000
5120 I2C2ADD 31:16 ————————————————0000
15:0 ————— Address Register 0000
5130 I2C2MSK 31:16 ————————————————0000
15:0 ————— Address Mask Register 0000
5140 I2C2BRG 31:16 ————————————————0000
15:0 ——— Baud Rate Generator Register 0000
5150 I2C2TRN 31:16 ———————————————0000
15:0 ——————— Transmit Register 0000
5160 I2C2RCV 31:16 ————————————————0000
15:0 ——————— Receive Register 0000
Legend: x = unknown value on Reset; — = unimplemented, read as ‘0’. Reset values are shown in hexadecimal.
Note 1: All registers in this table except I2CxRCV have corresponding CLR, SET and INV registers at their virtual addresses, plus offsets of 0x4, 0x8 and 0xC, respectively. See Section 11.2 “CLR, SET and INV
Registers” for more information.
2011-2012 Microchip Technology Inc. Preliminary DS61168E-page 47
PIC32MX1XX/2XX
TABLE 4-7: UART1 AND UART2 REGISTER MAP
Virtual Address
(BF80_#)
Register
Name
Bit Range
Bits
All Resets
31/15 30/14 29/13 28/12 27/11 26/10 25/9 24/8 23/7 22/6 21/5 20/4 19/3 18/2 17/1 16/0
6000 U1MODE(1) 31:16 ————————————————0000
15:0 ON —SIDLIRENRTSMD UEN<1:0> WAKE LPBACK ABAUD RXINV BRGH PDSEL<1:0> STSEL 0000
6010 U1STA(1) 31:16 —————— ADM_EN ADDR<7:0> 0000
15:0 UTXISEL<1:0> UTXINV URXEN UTXBRK UTXEN UTXBF TRMT URXISEL<1:0> ADDEN RIDLE PERR FERR OERR URXDA 0110
6020 U1TXREG 31:16 ————————————————0000
15:0 —————— TX8 Transmit Register 0000
6030 U1RXREG 31:16 ————————————————0000
15:0 —————— RX8 Receive Register 0000
6040 U1BRG(1) 31:16 ————————————————0000
15:0 Baud Rate Generator Prescaler 0000
6200 U2MODE(1) 31:16
15:0
————————————————0000
ON —SIDLIRENRTSMD UEN<1:0> WAKE LPBACK ABAUD RXINV BRGH PDSEL<1:0> STSEL 0000
6210 U2STA(1) 31:16 —————— ADM_EN ADDR<7:0> 0000
15:0 UTXISEL<1:0> UTXINV URXEN UTXBRK UTXEN UTXBF TRMT URXISEL<1:0> ADDEN RIDLE PERR FERR OERR URXDA 0110
6220 U2TXREG 31:16 ————————————————0000
15:0 —————— TX8 Transmit Register 0000
6230 U2RXREG 31:16 ————————————————0000
15:0 —————— RX8 Receive Register 0000
6240 U2BRG(1) 31:16 ————————————————0000
15:0 Baud Rate Generator Prescaler 0000
Legend: x = unknown value on Reset; — = unimplemented, read as ‘0’. Reset values are shown in hexadecimal.
Note 1: This register has corresponding CLR, SET and INV registers at its virtual address, plus an offset of 0x4, 0x8 and 0xC, respectively. See Section 1 1.2 “CLR, SET and INV Registers” for more information.
PIC32MX1XX/2XX
DS61168E-page 48 Preliminary 2011-2012 Microchip Technology Inc.
TABLE 4-8: SPI1 AND SPI2 REGISTER MAP
Virtual Address
(BF80_#)
Register
Name(1)
Bit Range
Bits
All Resets
31/15 30/14 29/13 28/12 27/11 26/10 25/9 24/8 23/7 22/6 21/5 20/4 19/3 18/2 17/1 16/0
5800 SPI1CON 31:16 FRMEN FRMSYNC FRMPOL MSSEN FRMSYPW FRMCNT<2:0> MCLKSEL ———— SPIFE ENHBUF 0000
15:0 ON SIDL DISSDO MODE32 MODE16 SMP CKE SSEN CKP MSTEN DISSDI STXISEL<1:0> SRXISEL<1:0> 0000
5810 SPI1STAT 31:16 RXBUFELM<4:0> TXBUFELM<4:0> 0000
15:0 FRMERR SPIBUSY SPITUR SRMT SPIROV SPIRBE —SPITBE—SPITBFSPIRBF0008
5820 SPI1BUF 31:16 DATA<31:0> 0000
15:0 0000
5830 SPI1BRG 31:16 0000
15:0 BRG<12:0> 0000
5840 SPI1CON2
31:16 0000
15:0 SPI
SGNEXT FRM
ERREN
SPI
ROVEN
SPI
TUREN IGNROV IGNTUR AUDEN ———AUD-
MONO AUDMOD<1:0> 0000
5A00 SPI2CON 31:16 FRMEN FRMSYNC FRMPOL MSSEN FRMSYPW FRMCNT<2:0> MCLKSEL ———— SPIFE ENHBUF 0000
15:0 ON SIDL DISSDO MODE32 MODE16 SMP CKE SSEN CKP MSTEN DISSDI STXISEL<1:0> SRXISEL<1:0> 0000
5A10 SPI2STAT 31:16 RXBUFELM<4:0> TXBUFELM<4:0> 0000
15:0 FRMERR SPIBUSY SPITUR SRMT SPIROV SPIRBE —SPITBE—SPITBFSPIRBF0008
5A20 SPI2BUF 31:16 DATA<31:0> 0000
15:0 0000
5A30 SPI2BRG 31:16 0000
15:0 BRG<12:0> 0000
5A40 SPI2CON2
31:16 0000
15:0 SPI
SGNEXT FRM
ERREN
SPI
ROVEN
SPI
TUREN IGNROV IGNTUR AUDEN ———AUD
MONO AUDMOD<1:0> 0000
Legend: x = unknown value on Reset; — = unimplemented, read as ‘0’. Reset values are shown in hexadecimal.
Note 1: All registers in this table except SPIxBUF have corresponding CLR, SET and INV registers at their virtual addresses, plus offsets of 0x4, 0x8 and 0xC, respectively. See Section 1 1.2 “CLR, SET and INV
Registers” for more information.
2011-2012 Microchip Technology Inc. Preliminary DS61168E-page 49
PIC32MX1XX/2XX
TABLE 4-9: ADC REGISTER MAP
Virtual Address
(BF80_#)
Register
Name
Bit Range
Bits
All Resets
31/15 30/14 29/13 28/12 27/11 26/10 25/9 24/8 23/7 22/6 21/5 20/4 19/3 18/2 17/1 16/0
9000 AD1CON1(1) 31:16 0000
15:0 ON —SIDL FORM<2:0> SSRC<2:0> CLRASAM —ASAMSAMPDONE0000
9010 AD1CON2(1) 31:16 0000
15:0 VCFG<2:0> OFFCAL CSCNA —BUFS—SMPI<3:0>BUFMALTS0000
9020 AD1CON3(1) 31:16 0000
15:0 ADRC SAMC<4:0> ADCS<7:0> 0000
9040 AD1CHS(1) 31:16 CH0NB CH0SB<3:0> CH0NA CH0SA<3:0> 0000
15:0 0000
9050 AD1CSSL(1) 31:16 0000
15:0 CSSL15 CSSL14 CSSL13 CSSL12 CSSL11 CSSL10 CSSL9 CSSL8 CSSL7 CSSL6 CSSL5 CSSL4 CSSL3 CSSL2 CSSL1 CSSL0 0000
9070 ADC1BUF0 31:16 ADC Result Word 0 (ADC1BUF0<31:0>) 0000
15:0 0000
9080 ADC1BUF1 31:16 ADC Result Word 1 (ADC1BUF1<31:0>) 0000
15:0 0000
9090 ADC1BUF2 31:16 ADC Result Word 2 (ADC1BUF2<31:0>) 0000
15:0 0000
90A0 ADC1BUF3 31:16 ADC Result Word 3 (ADC1BUF3<31:0>) 0000
15:0 0000
90B0 ADC1BUF4 31:16 ADC Result Word 4 (ADC1BUF4<31:0>) 0000
15:0 0000
90C0 ADC1BUF5 31:16 ADC Result Word 5 (ADC1BUF5<31:0>) 0000
15:0 0000
90D0 ADC1BUF6 31:16 ADC Result Word 6 (ADC1BUF6<31:0>) 0000
15:0 0000
90E0 ADC1BUF7 31:16 ADC Result Word 7 (ADC1BUF7<31:0>) 0000
15:0 0000
90F0 ADC1BUF8 31:16 ADC Result Word 8 (ADC1BUF8<31:0>) 0000
15:0 0000
9100 ADC1BUF9 31:16 ADC Result Word 9 (ADC1BUF9<31:0>) 0000
15:0 0000
9110 ADC1BUFA 31:16 ADC Result Word A (ADC1BUFA<31:0>) 0000
15:0 0000
9120 ADC1BUFB 31:16 ADC Result Word B (ADC1BUFB<31:0>) 0000
15:0 0000
9130 ADC1BUFC 31:16 ADC Result Word C (ADC1BUFC<31:0>) 0000
15:0 0000
9140 ADC1BUFD 31:16 ADC Result Word D (ADC1BUFD<31:0>) 0000
15:0 0000
Legend: x = unknown value on Reset; — = unimplemented, read as ‘0’. Reset values are shown in hexadecimal.
Note 1: This register has corresponding CLR, SET and INV registers at its virtual address, plus offsets of 0x4, 0x8 and 0xC, respectively. See Section 11.2 “CLR, SET and INV Registers” for details.
PIC32MX1XX/2XX
DS61168E-page 50 Preliminary 2011-2012 Microchip Technology Inc.
9150 ADC1BUFE 31:16 ADC Result Word E (ADC1BUFE<31:0>) 0000
15:0 0000
9160 ADC1BUFF 31:16 ADC Result Word F (ADC1BUFF<31:0>) 0000
15:0 0000
TABLE 4-9: ADC REGISTER MAP (CONTINUED)
Virtual Address
(BF80_#)
Register
Name
Bit Range
Bits
All Resets
31/15 30/14 29/13 28/12 27/11 26/10 25/9 24/8 23/7 22/6 21/5 20/4 19/3 18/2 17/1 16/0
Legend: x = unknown value on Reset; — = unimplemented, read as ‘0’. Reset values are shown in hexadecimal.
Note 1: This register has corresponding CLR, SET and INV registers at its virtual address, plus offsets of 0x4, 0x8 and 0xC, respectively. See Section 11.2 “CLR, SET and INV Registers” for details.
2011-2012 Microchip Technology Inc. Preliminary DS61168E-page 51
PIC32MX1XX/2XX
TABLE 4-10: DMA GLOBAL REGISTER MAP
Virtual Address
(BF88_#)
Register
Name(1)
Bit Range
Bits
All Resets
31/15 30/14 29/13 28/12 27/11 26/10 25/9 24/8 23/7 22/6 21/5 20/4 19/3 18/2 17/1 16/0
3000 DMACON 31:16 0000
15:0 ON SUSPEND DMABUSY 0000
3010 DMASTAT 31:16 0000
15:0 RDWR DMACH<2:0>(2) 0000
3020 DMAADDR 31:16 DMAADDR<31:0> 0000
15:0 0000
Legend: x = unknown value on Reset; — = unimplemented, read as ‘0’. Reset values are shown in hexadecimal.
Note 1: All registers in this table have corresponding CLR, SET and INV registers at its virtual address, plus an offset of 0x4, 0x8 and 0xC, respectively. See Section 1 1.2 “CLR, SET and INV Registers” for more
information.
TABLE 4-11: DMA CRC REGISTER MAP
Virtual Address
(BF88_#)
Register
Name(1)
Bit Range
Bits
All Resets
31/15 30/14 29/13 28/12 27/11 26/10 25/9 24/8 23/7 22/6 21/5 20/4 19/3 18/2 17/1 16/0
3030 DCRCCON 31:16 BYTO<1:0> WBO —BITO————————0000
15:0 —— PLEN<4:0> CRCEN CRCAPP CRCTYP CRCCH<2:0> 0000
3040 DCRCDATA 31:16 DCRCDATA<31:0> 0000
15:0 0000
3050 DCRCXOR 31:16 DCRCXOR<31:0> 0000
15:0 0000
Legend: x = unknown value on Reset; — = unimplemented, read as ‘0’. Reset values are shown in hexadecimal.
Note 1: All registers in this table have corresponding CLR, SET and INV registers at their virtual addresses, plus offsets of 0x4, 0x8 and 0xC, respectively. See Section 11.2 “CLR, SET and INV Registers” for
more information.
PIC32MX1XX/2XX
DS61168E-page 52 Preliminary 2011-2012 Microchip Technology Inc.
TABLE 4-12: DMA CHANNELS 0-3 REGISTER MAP
Virtual Address
(BF88_#)
Register
Name(1)
Bit Range
Bits
All Resets
31/15 30/14 29/13 28/12 27/11 26/10 25/9 24/8 23/7 22/6 21/5 20/4 19/3 18/2 17/1 16/0
3060 DCH0CON 31:16 ————————————————0000
15:0 CHBUSY ——————CHCHNS CHEN CHAED CHCHN CHAEN CHEDET CHPRI<1:0> 0000
3070 DCH0ECON 31:16 ———————— CHAIRQ<7:0> 00FF
15:0 CHSIRQ<7:0> CFORCE CABORT PATEN SIRQEN AIRQEN FF00
3080 DCH0INT 31:16 ————————CHSDIE CHSHIE CHDDIE CHDHIE CHBCIE CHCCIE CHTAIE CHERIE 0000
15:0 ————————CHSDIF CHSHIF CHDDIF CHDHIF CHBCIF CHCCIF CHTAIF CHERIF 0000
3090 DCH0SSA 31:16 CHSSA<31:0> 0000
15:0 0000
30A0 DCH0DSA 31:16 CHDSA<31:0> 0000
15:0 0000
30B0 DCH0SSIZ 31:16 ————————————————0000
15:0 CHSSIZ<15:0> 0000
30C0 DCH0DSIZ 31:16 ————————————————0000
15:0 CHDSIZ<15:0> 0000
30D0 DCH0SPTR 31:16 ————————————————0000
15:0 CHSPTR<15:0> 0000
30E0 DCH0DPTR 31:16 ————————————————0000
15:0 CHDPTR<15:0> 0000
30F0 DCH0CSIZ 31:16 ————————————————0000
15:0 CHCSIZ<15:0> 0000
3100 DCH0CPTR 31:16 ————————————————0000
15:0 CHCPTR<15:0> 0000
3110 DCH0DAT 31:16 ————————————————0000
15:0 ———————— CHPDAT<7:0> 0000
3120 DCH1CON 31:16 ————————————————0000
15:0 CHBUSY ——————CHCHNS CHEN CHAED CHCHN CHAEN CHEDET CHPRI<1:0> 0000
3130 DCH1ECON 31:16 ———————— CHAIRQ<7:0> 00FF
15:0 CHSIRQ<7:0> CFORCE CABORT PATEN SIRQEN AIRQEN FF00
3140 DCH1INT 31:16 ————————CHSDIE CHSHIE CHDDIE CHDHIE CHBCIE CHCCIE CHTAIE CHERIE 0000
15:0 ————————CHSDIF CHSHIF CHDDIF CHDHIF CHBCIF CHCCIF CHTAIF CHERIF 0000
3150 DCH1SSA 31:16 CHSSA<31:0> 0000
15:0 0000
3160 DCH1DSA 31:16 CHDSA<31:0> 0000
15:0 0000
Legend: x = unknown value on Reset; — = unimplemented, read as ‘0’. Reset values are shown in hexadecimal.
Note 1: All registers in this table have corresponding CLR, SET and INV registers at their virtual addresses, plus offsets of 0x4, 0x8 and 0xC, respectively. See Section 11.2 “CLR, SET and INV Registers” for
more information.
2011-2012 Microchip Technology Inc. Preliminary DS61168E-page 53
PIC32MX1XX/2XX
3170 DCH1SSIZ 31:16 ————————————————0000
15:0 CHSSIZ<15:0> 0000
3180 DCH1DSIZ 31:16 ————————————————0000
15:0 CHDSIZ<15:0> 0000
3190 DCH1SPTR 31:16 ————————————————0000
15:0 CHSPTR<15:0> 0000
31A0 DCH1DPTR 31:16 ————————————————0000
15:0 CHDPTR<15:0> 0000
31B0 DCH1CSIZ 31:16 ————————————————0000
15:0 CHCSIZ<15:0> 0000
31C0 DCH1CPTR 31:16 ————————————————0000
15:0 CHCPTR<15:0> 0000
31D0 DCH1DAT 31:16 ————————————————0000
15:0 ———————— CHPDAT<7:0> 0000
31E0 DCH2CON 31:16 ————————————————0000
15:0 CHBUSY ——————CHCHNS CHEN CHAED CHCHN CHAEN CHEDET CHPRI<1:0> 0000
31F0 DCH2ECON 31:16 ———————— CHAIRQ<7:0> 00FF
15:0 CHSIRQ<7:0> CFORCE CABORT PATEN SIRQEN AIRQEN FF00
3200 DCH2INT 31:16 ————————CHSDIE CHSHIE CHDDIE CHDHIE CHBCIE CHCCIE CHTAIE CHERIE 0000
15:0 ————————CHSDIF CHSHIF CHDDIF CHDHIF CHBCIF CHCCIF CHTAIF CHERIF 0000
3210 DCH2SSA 31:16 CHSSA<31:0> 0000
15:0 0000
3220 DCH2DSA 31:16 CHDSA<31:0> 0000
15:0 0000
3230 DCH2SSIZ 31:16 ————————————————0000
15:0 CHSSIZ<15:0> 0000
3240 DCH2DSIZ 31:16 ————————————————0000
15:0 CHDSIZ<15:0> 0000
3250 DCH2SPTR 31:16 ————————————————0000
15:0 CHSPTR<15:0> 0000
3260 DCH2DPTR 31:16 ————————————————0000
15:0 CHDPTR<15:0> 0000
3270 DCH2CSIZ 31:16 ————————————————0000
15:0 CHCSIZ<15:0> 0000
TABLE 4-12: DMA CHANNELS 0-3 REGISTER MAP (CONTINUED)
Virtual Address
(BF88_#)
Register
Name(1)
Bit Range
Bits
All Resets
31/15 30/14 29/13 28/12 27/11 26/10 25/9 24/8 23/7 22/6 21/5 20/4 19/3 18/2 17/1 16/0
Legend: x = unknown value on Reset; — = unimplemented, read as ‘0’. Reset values are shown in hexadecimal.
Note 1: All registers in this table have corresponding CLR, SET and INV registers at their virtual addresses, plus offsets of 0x4, 0x8 and 0xC, respectively. See Section 11.2 “CLR, SET and INV Registers” for
more information.
PIC32MX1XX/2XX
DS61168E-page 54 Preliminary 2011-2012 Microchip Technology Inc.
3280 DCH2CPTR 31:16 ————————————————0000
15:0 CHCPTR<15:0> 0000
3290 DCH2DAT 31:16 ————————————————0000
15:0 ———————— CHPDAT<7:0> 0000
32A0 DCH3CON 31:16 ————————————————0000
15:0 CHBUSY ——————CHCHNS CHEN CHAED CHCHN CHAEN CHEDET CHPRI<1:0> 0000
32B0 DCH3ECON 31:16 ———————— CHAIRQ<7:0> 00FF
15:0 CHSIRQ<7:0> CFORCE CABORT PATEN SIRQEN AIRQEN FF00
32C0 DCH3INT 31:16 ————————CHSDIE CHSHIE CHDDIE CHDHIE CHBCIE CHCCIE CHTAIE CHERIE 0000
15:0 ————————CHSDIF CHSHIF CHDDIF CHDHIF CHBCIF CHCCIF CHTAIF CHERIF 0000
32D0 DCH3SSA 31:16 CHSSA<31:0> 0000
15:0 0000
32E0 DCH3DSA 31:16 CHDSA<31:0> 0000
15:0 0000
32F0 DCH3SSIZ 31:16 ————————————————0000
15:0 CHSSIZ<15:0> 0000
3300 DCH3DSIZ 31:16 ————————————————0000
15:0 CHDSIZ<15:0> 0000
3310 DCH3SPTR 31:16 ————————————————0000
15:0 CHSPTR<15:0> 0000
3320 DCH3DPTR 31:16 ————————————————0000
15:0 CHDPTR<15:0> 0000
3330 DCH3CSIZ 31:16 ————————————————0000
15:0 CHCSIZ<15:0> 0000
3340 DCH3CPTR 31:16 ————————————————0000
15:0 CHCPTR<15:0> 0000
3350 DCH3DAT 31:16 ————————————————0000
15:0 ———————— CHPDAT<7:0> 0000
TABLE 4-12: DMA CHANNELS 0-3 REGISTER MAP (CONTINUED)
Virtual Address
(BF88_#)
Register
Name(1)
Bit Range
Bits
All Resets
31/15 30/14 29/13 28/12 27/11 26/10 25/9 24/8 23/7 22/6 21/5 20/4 19/3 18/2 17/1 16/0
Legend: x = unknown value on Reset; — = unimplemented, read as ‘0’. Reset values are shown in hexadecimal.
Note 1: All registers in this table have corresponding CLR, SET and INV registers at their virtual addresses, plus offsets of 0x4, 0x8 and 0xC, respectively. See Section 11.2 “CLR, SET and INV Registers” for
more information.
2011-2012 Microchip Technology Inc. Preliminary DS61168E-page 55
PIC32MX1XX/2XX
TABLE 4-13: COMPARATOR REGISTER MAP
Virtual Address
(BF80_#)
Register
Name(1)
Bit Range
Bits
All Resets
31/15 30/14 29/13 28/12 27/11 26/10 25/9 24/8 23/7 22/6 21/5 20/4 19/3 18/2 17/1 16/0
A000 CM1CON 31:16 ————————————————0000
15:0 ON COE CPOL ————COUTEVPOL<1:0> CREF CCH<1:0> 00C3
A010 CM2CON 31:16 ————————————————0000
15:0 ON COE CPOL ————COUTEVPOL<1:0> CREF CCH<1:0> 00C3
A020 CM3CON 31:16 ————————————————0000
15:0 ON COE CPOL ————COUTEVPOL<1:0> CREF CCH<1:0> 00C3
A060 CMSTAT 31:16 ————————————————0000
15:0 —SIDL————————— C3OUT C2OUT C1OUT 0000
Legend: x = unknown value on Reset; — = unimplemented, read as ‘0’. Reset values are shown in hexadecimal.
Note 1: All registers in this table have corresponding CLR, SET and INV registers at their virtual addresses, plus offsets of 0x4, 0x8 and 0xC, respectively. See Section 1 1.2 “CLR, SET and INV Registers” for
more information.
TABLE 4-14: COMPARATOR VOLTAGE REFERENCE REGISTER MAP
Virtual Address
(BF80_#)
Register
Name(1)
Bit Range
Bits
All Resets
31/15 30/14 29/13 28/12 27/11 26/10 25/9 24/8 23/7 22/6 21/5 20/4 19/3 18/2 17/1 16/0
9800 CVRCON 31:16 0000
15:0 ON CVROE CVRR CVRSS CVR<3:0> 0000
Legend: x = unknown value on Reset; — = unimplemented, read as ‘0’. Reset values are shown in hexadecimal.
Note 1: All registers in this table have corresponding CLR, SET and INV registers at their virtual addresses, plus offsets of 0x4, 0x8 and 0xC, respectively. See Section 1 1.2 “CLR, SET and INV Registers” for
more information.
PIC32MX1XX/2XX
DS61168E-page 56 Preliminary 2011-2012 Microchip Technology Inc.
TABLE 4-15: FLASH CONTROLLER REGISTER MAP
Virtual Address
(BF80_#)
Register
Name
Bit Range
Bits
All Resets
31/15 30/14 29/13 28/12 27/11 26/10 25/9 24/8 23/7 22/6 21/5 20/4 19/3 18/2 17/1 16/0
F400 NVMCON(1) 31:16 0000
15:0 WR WREN WRERR LVDERR LVDSTAT NVMOP<3:0> 0000
F410 NVMKEY 31:16 NVMKEY<31:0> 0000
15:0 0000
F420
NVMADDR
(1) 31:16 NVMADDR<31:0> 0000
15:0 0000
F430 NVMDATA 31:16 NVMDATA<31:0> 0000
15:0 0000
F440 NVMSRCADDR 31:16 NVMSRCADDR<31:0> 0000
15:0 0000
Legend: x = unknown value on Reset; — = unimplemented, read as ‘0’. Reset values are shown in hexadecimal.
Note 1: This register has corresponding CLR, SET and INV registers at its virtual address, plus offsets of 0x4, 0x8 and 0xC, respectively. See Section 11.2 “CLR, SET and INV Registers” for more information.
2011-2012 Microchip Technology Inc. Preliminary DS61168E-page 57
PIC32MX1XX/2XX
TABLE 4-16: SYSTEM CONTROL REGISTER MAP
Virtual Address
(BF80_#)
Register
Name(1)
Bit Range
Bits
All Resets
31/15 30/14 29/13 28/12 27/11 26/10 25/9 24/8 23/7 22/6 21/5 20/4 19/3 18/2 17/1 16/0
F000 OSCCON 31:16 PLLODIV<2:0> FRCDIV<2:0> SOSCRDY PBDIVRDY PBDIV<1:0> PLLMULT<2:0> x1xx(2)
15:0 COSC<2:0> NOSC<2:0> CLKLOCK ULOCK(4) SLOCK SLPEN CF UFRCEN(4) SOSCEN OSWEN xxxx(2)
F010 OSCTUN 31:16 0000
15:0 —TUN<5:0>0000
F020 REFOCON 31:16 RODIV<14:0> 0000
15:0 ON —SIDL OERSLP DIVSWEN ACTIVE ROSEL<3:0> 0000
F030 REFOTRIM 31:16 ROTRIM<8:0> 0000
15:0 0000
0000 WDTCON 31:16 0000
15:0 ON SWDTPS<4:0> WDTWINEN WDTCLR 0000
F600 RCON 31:16 0000
15:0 CMR VREGS EXTR SWR WDTO SLEEP IDLE BOR POR xxxx(2)
F610 RSWRST 31:16 0000
15:0 —SWRST0000
F200 CFGCON 31:16 0000
15:0 —IOLOCKPMDLOCK —JTAGEN TDOEN 000B
F230 SYSKEY(3) 31:16 SYSKEY<31:0> 0000
15:0 0000
F240 PMD1 31:16 0000
15:0 —CVRMD———CTMUMD —AD1MD0000
F250 PMD2 31:16 0000
15:0 CMP3MD CMP2MD CMP1MD 0000
F260 PMD3 31:16 OC5MD OC4MD OC3MD OC2MD OC1MD 0000
15:0 IC5MD IC4MD IC3MD IC2MD IC1MD 0000
F270 PMD4 31:16 0000
15:0 T5MD T4MD T3MD T2MD T1MD 0000
F280 PMD5 31:16 USB1MD I2C1MD I2C1MD 0000
15:0 SPI2MD SPI1MD —U2MDU1MD0000
F290 PMD6 31:16 PMPMD 0000
15:0 —REFOMDRTCCMD0000
Legend: x = unknown value on Reset; — = unimplemented, read as ‘0’. Reset values are shown in hexadecimal.
Note 1: With the exception of those noted, all registers in this table have corresponding CLR, SET and INV registers at their virtual addresses, plus offsets of 0x4, 0x8 and 0xC, respectively. See Section 11.2
“CLR, SET and INV Registers” for more information.
2: Reset values are dependent on the DEVCFGx Configuration bits and the type of reset.
3: This register does not have associated CLR, SET, INV registers.
4: This bit is available on PIC32MX2XX devices only.
PIC32MX1XX/2XX
DS61168E-page 58 Preliminary 2011-2012 Microchip Technology Inc.
TABLE 4-17: DEVCFG: DEVICE CONFIGURATION WORD SUMMARY
Virtual Address
(BFC0_#)
Register
Name
Bit Range
Bits
All Resets
31/15 30/14 29/13 28/12 27/11 26/10 25/9 24/8 23/7 22/6 21/5 20/4 19/3 18/2 17/1 16/0
2FF0 DEVCFG3 31:16 FVBUSONIO FUSBIDIO IOL1WAY PMDL1WAY xxxx
15:0 USERID<15:0> xxxx
2FF4 DEVCFG2 31:16 FPLLODIV<2:0> xxxx
15:0
UPLLEN
(1)
UPLLIDIV<2:0>(1) —FPLLMUL<2:0> FPLLIDIV<2:0> xxxx
2FF8 DEVCFG1 31:16 FWDTWINSZ<1:0> FWDTEN WINDIS WDTPS<4:0> xxxx
15:0 FCKSM<1:0> FPBDIV<1:0> OSCIOFNC POSCMOD<1:0> IESO FSOSCEN —FNOSC<2:0>xxxx
2FFC DEVCFG0 31:16 —CP —BWP —PWP<6>xxxx
15:0 PWP<5:0> ICESEL<1:0> JTAGEN DEBUG<1:0> xxxx
Legend: x = unknown value on Reset; — = unimplemented, read as ‘0’. Reset values are shown in hexadecimal.
Note 1: This bit is available on PIC32MX2XX devices only.
TABLE 4-18: DEVICE AND REVISION ID SUMMARY
Virtual Address
(BF80_#)
Register
Name
Bit Range
Bits
All Resets (1)
31/15 30/14 29/13 28/12 27/11 26/10 25/9 24/8 23/7 22/6 21/5 20/4 19/3 18/2 17/1 16/0
F220 DEVID 31:16 VER<3:0> DEVID<27:16> xxxx
15:0 DEVID<15:0> xxxx
Legend: x = unknown value on Reset; — = unimplemented, read as ‘0’. Reset values are shown in hexadecimal.
Note 1: Reset values are dependent on the device variant.
2011-2012 Microchip Technology Inc. Preliminary DS61168E-page 59
PIC32MX1XX/2XX
TABLE 4-19: PORTA REGISTER MAP
Virtual Address
(BF88_#)
Register
Name(1)
Bit Range
Bits
All Resets
31/15 30/14 29/13 28/12 27/11 26/10 25/9 24/8 23/7 22/6 21/5 20/4 19/3 18/2 17/1 16/0
6000 ANSELA 31:16 0000
15:0 ANSA1 ANSA0 0003
6010 TRISA 31:16 0000
15:0 —————TRISA10
(2) TRISA9(2) TRISA8(2) TRISA7(2) TRISA4 TRISA3 TRISA2 TRISA1 TRISA0 079F
6020 PORTA 31:16 0000
15:0 —————RA10
(2) RA9(2) RA8(2) RA7(2) RA4 RA3 RA2 RA1 RA0 xxxx
6030 LATA 31:16 0000
15:0 —————LATA10
(2) LATA9(2) LATA8(2) LATA7(2) LATA4 LATA3 LATA2 LATA1 LATA0 xxxx
6040 ODCA 31:16 0000
15:0 ———— ODCA10(2) ODCA9(2) ODCA8(2) ODCA7(2) 0000
6050 CNPUA 31:16 0000
15:0 ———— CNPUA10(2) CNPUA9(2) CNPUA8(2) CNPUA7(2) CNPUA4 CNPUA3 CNPUA2 CNPUA1 CNPUA0 0000
6060 CNPDA 31:16 0000
15:0 ———— CNPDA10(2) CNPDA9(2) CNPDA8(2) CNPDA7(2) CNPDA4 CNPDA3 CNPDA2 CNPDA1 CNPDA0 0000
6070 CNCONA 31:16 0000
15:0 ON —SIDL 0000
6080 CNENA 31:16 0000
15:0 ———— CNIEA10(2) CNIEA9(2) CNIEA8(2) CNIEA7(2) CNIEA4 CNIEA3 CNIEA2 CNIEA1 CNIEA0 0000
6090 CNSTATA 31:16 0000
15:0 ———— CNSTATA10(2) CNSTATA9(2) CNSTATA8(2) CNSTATA7(2) CNSTATA4 CNSTATA3 CNSTATA2 CNSTATA1 CNSTATA0 0000
Legend: x = unknown value on Reset; — = unimplemented, read as ‘0’. Reset values are shown in hexadecimal.
Note 1: All registers in this table have corresponding CLR, SET and INV registers at their virtual addresses, plus offsets of 0x4, 0x8 and 0xC, respectively. See Section 11.2 “CLR, SET and INV Registers” for
more information.
2: This bit is available on 44-pin devices only.
PIC32MX1XX/2XX
DS61168E-page 60 Preliminary 2011-2012 Microchip Technology Inc.
TABLE 4-20: PORTB REGISTER MAP
Virtual Address
(BF88_#)
Register
Name
Bit Range
Bits
All Resets
31/15 30/14 29/13 28/12 27/11 26/10 25/9 24/8 23/7 22/6 21/5 20/4 19/3 18/2 17/1 16/0
6100 ANSELB 31:16 0000
15:0 ANSB15 ANSB14 ANSB13 ANSB12(2) ANSB3 ANSB2 ANSB1 ANSB0 E00F
6110 TRISB 31:16 0000
15:0 TRISB15 TRISB14 TRISB13 TRISB12(2) TRISB11 TRISB10 TRISB9 TRISB8 TRISB7 TRISB6(2) TRISB5 TRISB4 TRISB3 TRISB2 TRISB1 TRISB0 FFFF
6120 PORTB 31:16 0000
15:0 RB15 RB14 RB13 RB12(2) RB11 RB10 RB9 RB8 RB7 RC6(2) RB5 RB4 RB3 RB2 RB1 RB0 xxxx
6130 LATB 31:16 0000
15:0 LATB15 LATB14 LATB13 LATB12(2) LATB11 LATB10 LATB9 LATB8 LATB7 LATB6(2) LATB5 LATB4 LATB3 LATB2 LATB1 LATB0 xxxx
6140 ODCB 31:16 0000
15:0 ——— ODCB11 ODCB10 ODCB9 ODCB8 ODCB7 ODCB6 ODCB5 ODCB4 0000
6150 CNPUB 31:16 0000
15:0 CNPUB15 CNPUB14 CNPUB13 CNPUB12(2) CNPUB11 CNPUB10 CNPUB9 CNPUB8 CNPUB7 CNPUB6(2) CNPUB5 CNPUB4 CNPUB3 CNPUB2 CNPUB1 CNPUB0 0000
6160 CNPDB 31:16 0000
15:0 CNPDB15 CNPDB14 CNPDB13 CNPDB12(2) CNPDB11 CNPDB10 CNPDB9 CNPDB8 CNPDB7 CNPDB6(2) CNPDB5 CNPDB4 CNPDB3 CNPDB2 CNPDB1 CNPDB0 0000
6170 CNCONB 31:16 0000
15:0 ON —SIDL 0000
6180 CNENB 31:16 0000
15:0 CNIEB15 CNIEB14 CNIEB13 CNIEB11(2) CNIEB11 CNIEB10 CNIEB9 CNIEB8 CNIEB7 CNIEB6(2) CNIEB5 CNIEB4 CNIEB3 CNIEB2 CNIEB1 CNIEB0 0000
6190 CNSTATB
31:16 0000
15:0 CN
STATB15
CN
STATB14
CN
STATB13
CN
STATB12(2) CN
STATB11
CN
STATB10
CN
STATB9
CN
STATB8
CN
STATB7
CN
STATB6(2) CN
STATB5
CN
STATB4
CN
STATB3
CN
STATB2
CN
STATB1
CN
STATB0 0000
Legend: x = unknown value on Reset; — = unimplemented, read as ‘0’. Reset values are shown in hexadecimal.
Note 1: All registers in this table have corresponding CLR, SET and INV registers at their virtual addresses, plus offsets of 0x4, 0x8 and 0xC, respectively. See Section 11.2 “CLR, SET and INV Registers” for
more information.
2: This bit is not available on PIC32MX2XX devices. The reset value for the TRISB register when this bit is not available is 0x0000EFBF.
2011-2012 Microchip Technology Inc. Preliminary DS61168E-page 61
PIC32MX1XX/2XX
TABLE 4-21: PORTC REGISTER MAP
Virtual Address
(BF88_#)
Register
Name(1,2)
Bit Range
Bits
All Resets
31/15 30/14 29/13 28/12 27/11 26/10 25/9 24/8 23/7 22/6 21/5 20/4 19/3 18/2 17/1 16/0
6200 ANSELC 31:16 0000
15:0 ANSC3 ANSC2(3) ANSC1 ANSC0 000F
6210 TRISC 31:16 0000
15:0 ——————TRISC9TRISC8
(3) TRISC7(3) TRISC6(3) TRISC5(3) TRISC4(3) TRISC3 TRISC2(3) TRISC1 TRISC0 03FF
6220 PORTC 31:16 0000
15:0 ————— RC9 RC8(3) RC7(3) RC6(3) RC5(3) RC4(3) RC3 RC2(3) RC1 RC0 xxxx
6230 LATC 31:16 0000
15:0 ——————LATC9LATC8
(3) LATC7(3) LATC6(3) LATC5(3) LATC4(3) LATC3 LATC2(3) LATC1 LATC0 xxxx
6240 ODCC 31:16 0000
15:0 ————— ODCC9 ODCC8(3) ODCC7(3) ODCC6(3) ODCC5(3) ODCC4(3) 0000
6250 CNPUC 31:16 0000
15:0 ————— CNPUC9 CNPUC8(3) CNPUC7(3) CNPUC6(3) CNPUC5(3) CNPUC4(3) CNPUC3 CNPUC2(3) CNPUC1 CNPUC0 0000
6260 CNPDC 31:16 0000
15:0 ————— CNPDC9 CNPDC8(3) CNPDC7(3) CNPDC6(3) CNPDC5(3) CNPDC4(3) CNPDC3 CNPDC2(3) CNPDC1 CNPDC0 0000
6270 CNCONC 31:16 0000
15:0 ON —SIDL 0000
6280 CNENC 31:16 0000
15:0 ————— CNIEC9 CNIEC8(3) CNIEC7(3) CNIEC6(3) CNIEC5(3) CNIEC4(3) CNIEC3 CNIEC2(3) CNIEC1 CNIEC0 0000
6290 CNSTATC 31:16 0000
15:0 ————— CNSTATC9 CNSTATC8(3) CNSTATC7(3) CNSTATC6(3) CNSTATC5(3) CNSTATC4(3) CNSTATC3 CNSTATC2(3) CNSTATC1 CNSTATC0 0000
Legend: x = unknown value on Reset; — = unimplemented, read as ‘0’. Reset values are shown in hexadecimal.
Note 1: All registers in this table have corresponding CLR, SET and INV registers at their virtual addresses, plus offsets of 0x4, 0x8 and 0xC, respectively. See Section 11.2 “CLR, SET and INV Registers” for
more information.
2: PORTC is not available on 28-pin devices.
3: This bit is available on 44-pin devices only.
PIC32MX1XX/2XX
DS61168E-page 62 Preliminary 2011-2012 Microchip Technology Inc.
TABLE 4-22: PERIPHERAL PIN SELECT INPUT REGISTER MAP
Virtual Address
(BF80_#)
Register
Name
Bit Range
Bits
All Resets
31/15 30/14 29/13 28/12 27/11 26/10 25/9 24/8 23/7 22/6 21/5 20/4 19/3 18/2 17/1 16/0
FA04 INT1R
31:16 0000
15:0 —INT1R<3:0>0000
FA08 INT2R
31:16 0000
15:0 —INT2R<3:0>0000
FA0C INT3R
31:16 0000
15:0 —INT3R<3:0>0000
FA10 INT4R
31:16 0000
15:0 —INT4R<3:0>0000
FA18 T2CKR
31:16 0000
15:0 —T2CKR<3:0>0000
FA1C T3CKR
31:16 0000
15:0 —T3CKR<3:0>0000
FA20 T4CKR
31:16 0000
15:0 —T4CKR<3:0>0000
FA24 T5CKR
31:16 0000
15:0 —T5CKR<3:0>0000
FA28 IC1R
31:16 0000
15:0 —IC1R<3:0>0000
FA2C IC2R
31:16 0000
15:0 —IC2R<3:0>0000
FA30 IC3R
31:16 0000
15:0 —IC3R<3:0>0000
FA34 IC4R 31:16 0000
15:0 —IC4R<3:0>0000
FA38 IC5R 31:16 0000
15:0 —IC5R<3:0>0000
FA48 OCFAR 31:16 0000
15:0 —OCFAR<3:0>0000
FA4C OCFBR 31:16 0000
15:0 —OCFBR<3:0>0000
FA50 U1RXR 31:16 0000
15:0 —U1RXR<3:0>0000
2011-2012 Microchip Technology Inc. Preliminary DS61168E-page 63
PIC32MX1XX/2XX
FA54 U1CTSR 31:16 0000
15:0 U1CTSR<3:0> 0000
FA58 U2RXR 31:16 0000
15:0 —U2RXR<3:0>0000
FA5C U2CTSR 31:16 0000
15:0 U2CTSR<3:0> 0000
FA84 SDI1R 31:16 0000
15:0 —SDI1R<3:0>0000
FA88 SS1R 31:16 0000
15:0 SS1R<3:0> 0000
FA90 SDI2R 31:16 0000
15:0 —SDI2R<3:0>0000
FA94 SS2R 31:16 0000
15:0 SS2R<3:0> 0000
FAB8 REFCLKIR 31:16 0000
15:0 REFCLKIR<3:0> 0000
TABLE 4-22: PERIPHERAL PIN SELECT INPUT REGISTER MAP (CONTINUED)
Virtual Address
(BF80_#)
Register
Name
Bit Range
Bits
All Resets
31/15 30/14 29/13 28/12 27/11 26/10 25/9 24/8 23/7 22/6 21/5 20/4 19/3 18/2 17/1 16/0
PIC32MX1XX/2XX
DS61168E-page 64 Preliminary 2011-2012 Microchip Technology Inc.
TABLE 4-23: PERIPHERAL PIN SELECT OUTPUT REGISTER MAP
Virtual Address
(BF80_#)
Register
Name
Bit Range
Bits
All Resets
31/15 30/14 29/13 28/12 27/11 26/10 25/9 24/8 23/7 22/6 21/5 20/4 19/3 18/2 17/1 16/0
FB00 RPA0R 31:16 0000
15:0 RPA0<3:0> 0000
FB04 RPA1R 31:16 0000
15:0 RPA1<3:0> 0000
FB08 RPA2R 31:16 0000
15:0 RPA2<3:0> 0000
FB0C RPA3R 31:16 0000
15:0 RPA3<3:0> 0000
FB10 RPA4R 31:16 0000
15:0 RPA4<3:0> 0000
FB20 RPA8R(1) 31:16 0000
15:0 RPA8<3:0> 0000
FB24 RPA9R(1) 31:16 0000
15:0 RPA9<3:0> 0000
FB2C RPB0R 31:16 0000
15:0 RPB0<3:0> 0000
FB30 RPB1R 31:16 0000
15:0 RPB1<3:0> 0000
FB34 RPB2R 31:16 0000
15:0 RPB2<3:0> 0000
FB38 RPB3R 31:16 0000
15:0 RPB3<3:0> 0000
FB3C RPB4R 31:16 0000
15:0 RPB4<3:0> 0000
FB40 RPB5R 31:16 0000
15:0 RPB5<3:0> 0000
FB44 RPB6R(2) 31:16 0000
15:0 RPB6<3:0> 0000
FB48 RPB7R 31:16 0000
15:0 RPB7<3:0> 0000
FB4C RPB8R 31:16 0000
15:0 RPB8<3:0> 0000
Legend: x = unknown value on Reset; — = unimplemented, read as ‘0’. Reset values are shown in hexadecimal.
Note 1: This register is only available on 44-pin devices.
2: This register is only available on PIC32MX1XX devices.
3: This register is only available on 36-pin and 44-pin devices.
2011-2012 Microchip Technology Inc. Preliminary DS61168E-page 65
PIC32MX1XX/2XX
FB50 RPB9R 31:16 0000
15:0 RPB9<3:0> 0000
FB54 RPB10R 31:16 0000
15:0 RPB10<3:0> 0000
FB58 RPB11R 31:16 0000
15:0 —RPB11<3:0>0000
FB60 RPB13R 31:16 0000
15:0 RPB13<3:0> 0000
FB64 RPB14R 31:16 0000
15:0 RPB14<3:0> 0000
FB68 RPB15R 31:16 0000
15:0 RPB15<3:0> 0000
FB6C RPC0R(3) 31:16 0000
15:0 RPC0<3:0> 0000
FB70 RPC1R(3) 31:16 0000
15:0 RPC1<3:0> 0000
FB74 RPC2R(1) 31:16 0000
15:0 RPC2<3:0> 0000
FB78 RPC3R(3) 31:16 0000
15:0 RPC3<3:0> 0000
FB7C RPC4R(1) 31:16 0000
15:0 RPC4<3:0> 0000
FB80 RPC5R(1) 31:16 0000
15:0 RPC5<3:0> 0000
FB84 RPC6R(1) 31:16 0000
15:0 RPC6<3:0> 0000
FB88 RPC7R(1) 31:16 0000
15:0 RPC7<3:0> 0000
FB8C RPC8R(1) 31:16 0000
15:0 RPC8<3:0> 0000
FB90 RPC9R(3) 31:16 0000
15:0 RPC9<3:0> 0000
TABLE 4-23: PERIPHERAL PIN SELECT OUTPUT REGISTER MAP (CONTINUED)
Virtual Address
(BF80_#)
Register
Name
Bit Range
Bits
All Resets
31/15 30/14 29/13 28/12 27/11 26/10 25/9 24/8 23/7 22/6 21/5 20/4 19/3 18/2 17/1 16/0
Legend: x = unknown value on Reset; — = unimplemented, read as ‘0’. Reset values are shown in hexadecimal.
Note 1: This register is only available on 44-pin devices.
2: This register is only available on PIC32MX1XX devices.
3: This register is only available on 36-pin and 44-pin devices.
PIC32MX1XX/2XX
DS61168E-page 66 Preliminary 2011-2012 Microchip Technology Inc.
TABLE 4-24: PARALLEL MASTER PORT REGISTER MAP
Virtual Address
(BF80_#)
Register
Name(1)
Bit Range
Bits
All Resets
31/15 30/14 29/13 28/12 27/11 26/10 25/9 24/8 23/7 22/6 21/5 20/4 19/3 18/2 17/1 16/0
7000 PMCON 31:16 ————————————————0000
15:0 ON SIDL ADRMUX<1:0> PMPTTL PTWREN PTRDEN CSF<1:0> ALP —CS1P WRSP RDSP 0000
7010 PMMODE 31:16 ————————————————0000
15:0 BUSY IRQM<1:0> INCM<1:0> MODE<1:0> WAITB<1:0> WAITM<3:0> WAITE<1:0> 0000
7020 PMADDR 31:16 ————————————————0000
15:0
CS1
ADDR<10:0> 0000
7030 PMDOUT 31:16 DATAOUT<31:0> 0000
15:0 0000
7040 PMDIN 31:16 DATAIN<31:0> 0000
15:0 0000
7050 PMAEN 31:16 ————————————————0000
15:0
PTEN14
PTEN<10:0> 0000
7060 PMSTAT 31:16 ————————————————0000
15:0 IBF IBOV IB3F IB2F IB1F IB0F OBE OBUF OB3EOB2EOB1EOB0E008F
Legend: x = unknown value on Reset; — = unimplemented, read as ‘0’. Reset values are shown in hexadecimal.
Note 1: All registers in this table have corresponding CLR, SET and INV registers at their virtual addresses, plus offsets of 0x4, 0x8 and 0xC, respectively. See Section 11. 2 “CLR, SET and INV Registers” for
more information.
2011-2012 Microchip Technology Inc. Preliminary DS61168E-page 67
PIC32MX1XX/2XX
TABLE 4-25: RTCC REGISTER MAP
Virtual Address
(BF80_#)
Register
Name(1)
Bit Range
Bits
All Resets
31/15 30/14 29/13 28/12 27/11 26/10 25/9 24/8 23/7 22/6 21/5 20/4 19/3 18/2 17/1 16/0
0200 RTCCON 31:16 CAL<9:0> 0000
15:0 ON —SIDL RTSECSEL RTCCLKON RTCWREN RTCSYNC HALFSEC RTCOE 0000
0210 RTCALRM 31:16 0000
15:0 ALRMEN CHIME PIV ALRMSYNC AMASK<3:0> ARPT<7:0> 0000
0220 RTCTIME 31:16 HR10<3:0> HR01<3:0> MIN10<3:0> MIN01<3:0> xxxx
15:0 SEC10<3:0> SEC01<3:0> xx00
0230 RTCDATE 31:16 YEAR10<3:0> YEAR01<3:0> MONTH10<3:0> MONTH01<3:0> xxxx
15:0 DAY10<3:0> DAY01<3:0> WDAY01<3:0> xx00
0240 ALRMTIME 31:16 HR10<3:0> HR01<3:0> MIN10<3:0> MIN01<3:0> xxxx
15:0 SEC10<3:0> SEC01<3:0> xx00
0250 ALRMDATE 31:16 ——— ——— MONTH10<3:0> MONTH01<3:0> 00xx
15:0 DAY10<3:0> DAY01<3:0> WDAY01<3:0> xx0x
Legend: x = unknown value on Reset; — = unimplemented, read as ‘0’. Reset values are shown in hexadecimal.
Note 1: All registers in this table have corresponding CLR, SET and INV registers at its virtual address, plus an offset of 0x4, 0x8 and 0xC, respectively. See Section 1 1.2 “CLR, SET and INV Registers for more
information.
TABLE 4-26: CTMU REGISTER MAP
Virtual Address
(BF80_#)
Register
Name(1)
Bit Range
Bits
All Resets
31/15 30/14 29/13 28/12 27/11 26/10 25/9 24/8 23/7 22/6 21/5 20/4 19/3 18/2 17/1 16/0
A200 CTMUCON 31:16 EDG1MOD EDG1POL EDG1SEL<3:0> EDG2STAT EDG1STAT EDG2MOD EDG2POL EDG2SEL<3:0> 0000
15:0 ON CTMUSIDL TGEN EDGEN EDGSEQEN IDISSEN CTTRIG ITRIM<5:0> IRNG<1:0> 0000
Legend: x = unknown value on Reset; — = unimplemented, read as ‘0’. Reset values are shown in hexadecimal.
Note 1: All registers in this table have corresponding CLR, SET and INV registers at its virtual address, plus an offset of 0x4, 0x8 and 0xC, respectively. See Section 11.2 “CLR, SET and INV Registers” for more
information.
PIC32MX1XX/2XX
DS61168E-page 68 Preliminary 2011-2012 Microchip Technology Inc.
TABLE 4-27: USB REGISTER MAP
Virtual Address
(BF88_#)
Register
Name(1)
Bit Range
Bits
All Resets
31/15 30/14 29/13 28/12 27/11 26/10 25/9 24/8 23/7 22/6 21/5 20/4 19/3 18/2 17/1 16/0
5040 U1OTGIR(2) 31:16 0000
15:0 —————— IDIF T1MSECIF LSTATEIF ACTVIF SESVDIF SESENDIF VBUSVDIF 0000
5050 U1OTGIE 31:16 0000
15:0 —————— IDIE T1MSECIE LSTATEIE ACTVIE SESVDIE SESENDIE VBUSVDIE 0000
5060 U1OTGSTAT(3) 31:16 0000
15:0 ———————ID —LSTATE SESVD SESEND VBUSVD 0000
5070 U1OTGCON 31:16 0000
15:0 —————— DPPULUP DMPULUP DPPULDWN DMPULDWN VBUSON OTGEN VBUSCHG VBUSDIS 0000
5080 U1PWRC 31:16 0000
15:0 ———————UACTPND
(4) USLPGRD USBBUSY USUSPEND USBPWR 0000
5200 U1IR(2) 31:16 0000
15:0 —————— STALLIF ATTACHIF RESUMEIF IDLEIF TRNIF SOFIF UERRIF URSTIF 0000
DETACHIF 0000
5210 U1IE
31:16 0000
15:0 —————— STALLIE ATTACHIE RESUMEIE IDLEIE TRNIE SOFIE UERRIE URSTIE 0000
DETACHIE 0000
5220 U1EIR(2) 31:16 0000
15:0 —————— BTSEF BMXEF DMAEF BTOEF DFN8EF CRC16EF CRC5EF PIDEF 0000
EOFEF 0000
5230 U1EIE
31:16 0000
15:0 —————— BTSEE BMXEE DMAEE BTOEE DFN8EE CRC16EE CRC5EE PIDEE 0000
EOFEE 0000
5240 U1STAT(3) 31:16 0000
15:0 —————— ENDPT<3:0> DIR PPBI 0000
5250 U1CON
31:16 0000
15:0 —————— JSTATE SE0 PKTDIS USBRST HOSTEN RESUME PPBRST USBEN 0000
TOKBUSY SOFEN 0000
5260 U1ADDR 31:16 0000
15:0 —————— LSPDEN DEVADDR<6:0> 0000
5270 U1BDTP1 31:16 0000
15:0 —————— BDTPTRL<7:1> 0000
Legend: x = unknown value on Reset; — = unimplemented, read as ‘0’. Reset values are shown in hexadecimal.
Note 1: With the exception of those noted, all registers in this table (except as noted) have corresponding CLR, SET and INV registers at their virtual address, plus an offset of 0x4, 0x8 and 0xC respectively. See
Section 11.2 “CLR, SET and INV Registers” for more information.
2: This register does not have associated SET and INV registers.
3: This register does not have associated CLR, SET and INV registers.
4: Reset value for this bit is undefined.
2011-2012 Microchip Technology Inc. Preliminary DS61168E-page 69
PIC32MX1XX/2XX
5280 U1FRML(3) 31:16 0000
15:0 —————— FRML<7:0> 0000
5290 U1FRMH(3) 31:16 0000
15:0 —FRMH<2:0>0000
52A0 U1TOK 31:16 0000
15:0 —————— PID<3:0> EP<3:0> 0000
52B0 U1SOF 31:16 0000
15:0 —————— CNT<7:0> 0000
52C0 U1BDTP2 31:16 0000
15:0 —————— BDTPTRH<7:0> 0000
52D0 U1BDTP3 31:16 0000
15:0 —————— BDTPTRU<7:0> 0000
52E0 U1CNFG1 31:16 0000
15:0 —————— UTEYE UOEMON USBSIDL UASUSPND 0001
5300 U1EP0 31:16 0000
15:0 —————— LSPD RETRYDIS EPCONDIS EPRXEN EPTXEN EPSTALL EPHSHK 0000
5310 U1EP1 31:16 0000
15:0 EPCONDIS EPRXEN EPTXEN EPSTALL EPHSHK 0000
5320 U1EP2 31:16 0000
15:0 EPCONDIS EPRXEN EPTXEN EPSTALL EPHSHK 0000
5330 U1EP3 31:16 0000
15:0 EPCONDIS EPRXEN EPTXEN EPSTALL EPHSHK 0000
5340 U1EP4 31:16 0000
15:0 EPCONDIS EPRXEN EPTXEN EPSTALL EPHSHK 0000
5350 U1EP5 31:16 0000
15:0 EPCONDIS EPRXEN EPTXEN EPSTALL EPHSHK 0000
5360 U1EP6 31:16 0000
15:0 EPCONDIS EPRXEN EPTXEN EPSTALL EPHSHK 0000
5370 U1EP7 31:16 0000
15:0 EPCONDIS EPRXEN EPTXEN EPSTALL EPHSHK 0000
5380 U1EP8 31:16 0000
15:0 EPCONDIS EPRXEN EPTXEN EPSTALL EPHSHK 0000
TABLE 4-27: USB REGISTER MAP (CONTINUED)
Virtual Address
(BF88_#)
Register
Name(1)
Bit Range
Bits
All Resets
31/15 30/14 29/13 28/12 27/11 26/10 25/9 24/8 23/7 22/6 21/5 20/4 19/3 18/2 17/1 16/0
Legend: x = unknown value on Reset; — = unimplemented, read as ‘0’. Reset values are shown in hexadecimal.
Note 1: With the exception of those noted, all registers in this table (except as noted) have corresponding CLR, SET and INV registers at their virtual address, plus an offset of 0x4, 0x8 and 0xC respectively. See
Section 11.2 “CLR, SET and INV Registers” for more information.
2: This register does not have associated SET and INV registers.
3: This register does not have associated CLR, SET and INV registers.
4: Reset value for this bit is undefined.
PIC32MX1XX/2XX
DS61168E-page 70 Preliminary 2011-2012 Microchip Technology Inc.
5390 U1EP9 31:16 0000
15:0 EPCONDIS EPRXEN EPTXEN EPSTALL EPHSHK 0000
53A0 U1EP10 31:16 0000
15:0 EPCONDIS EPRXEN EPTXEN EPSTALL EPHSHK 0000
53B0 U1EP11 31:16 0000
15:0 EPCONDIS EPRXEN EPTXEN EPSTALL EPHSHK 0000
53C0 U1EP12 31:16 0000
15:0 EPCONDIS EPRXEN EPTXEN EPSTALL EPHSHK 0000
53D0 U1EP13 31:16 0000
15:0 EPCONDIS EPRXEN EPTXEN EPSTALL EPHSHK 0000
53E0 U1EP14 31:16 0000
15:0 EPCONDIS EPRXEN EPTXEN EPSTALL EPHSHK 0000
53F0 U1EP15 31:16 0000
15:0 EPCONDIS EPRXEN EPTXEN EPSTALL EPHSHK 0000
TABLE 4-27: USB REGISTER MAP (CONTINUED)
Virtual Address
(BF88_#)
Register
Name(1)
Bit Range
Bits
All Resets
31/15 30/14 29/13 28/12 27/11 26/10 25/9 24/8 23/7 22/6 21/5 20/4 19/3 18/2 17/1 16/0
Legend: x = unknown value on Reset; — = unimplemented, read as ‘0’. Reset values are shown in hexadecimal.
Note 1: With the exception of those noted, all registers in this table (except as noted) have corresponding CLR, SET and INV registers at their virtual address, plus an offset of 0x4, 0x8 and 0xC respectively. See
Section 11.2 “CLR, SET and INV Registers” for more information.
2: This register does not have associated SET and INV registers.
3: This register does not have associated CLR, SET and INV registers.
4: Reset value for this bit is undefined.
2011-2012 Microchip Technology Inc. Preliminary DS61168E-page 71
PIC32MX1XX/2XX
4.3 Control Registers
Register 4-1 through Register 4-8 are used for setting
the RAM and Flash memory partitions for data and
code.
REGISTER 4-1: BMXCON: BUS MATRIX CONFIGURATION REGISTER
Bit
Range Bit
31/23/15/7 Bit
30/22/14/6 Bit
29/21/13/5 Bit
28/20/12/4 Bit
27/19/11/3 Bit
26/18/10/2 Bit
25/17/9/1 Bit
24/16/8/0
31:24 U-0 U-0 U-0 U-0 U-0 U-0 U-0 U-0
23:16
U-0 U-0 U-0 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1
BMX
ERRIXI
BMX
ERRICD
BMX
ERRDMA
BMX
ERRDS
BMX
ERRIS
15:8 U-0 U-0 U-0 U-0 U-0 U-0 U-0 U-0
7:0
U-0 R/W-1 U-0 U-0 U-0 R/W-0 R/W-0 R/W-1
BMX
WSDRM BMXARB<2:0>
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared
bit 31-21 Unimplemented: Read as ‘0
bit 20 BMXERRIXI: Enable Bus Error from IXI bit
1= Enable bus error exceptions for unmapped address accesses initiated from IXI shared bus
0= Disable bus error exceptions for unmapped address accesses initiated from IXI shared bus
bit 19 BMXERRICD: Enable Bus Error from ICD Debug Unit bit
1= Enable bus error exceptions for unmapped address accesses initiated from ICD
0= Disable bus error exceptions for unmapped address accesses initiated from ICD
bit 18 BMXERRDMA: Bus Error from DMA bit
1= Enable bus error exceptions for unmapped address accesses initiated from DMA
0= Disable bus error exceptions for unmapped address accesses initiated from DMA
bit 17 BMXERRDS: Bus Error from CPU Data Access bit (disabled in Debug mode)
1= Enable bus error exceptions for unmapped address accesses initiated from CPU data access
0= Disable bus error exceptions for unmapped address accesses initiated from CPU data access
bit 16 BMXERRIS: Bus Error from CPU Instruction Access bit (disabled in Debug mode)
1= Enable bus error exceptions for unmapped address accesses initiated from CPU instruction access
0= Disable bus error exceptions for unmapped address accesses initiated from CPU instruction access
bit 15-7 Unimplemented: Read as ‘0
bit 6 BMXWSDRM: CPU Instruction or Data Access from Data RAM Wait State bit
1= Data RAM accesses from CPU have one wait state for address setup
0= Data RAM accesses from CPU have zero wait states for address setup
bit 5-3 Unimplemented: Read as ‘0
bit 2-0 BMXARB<2:0>: Bus Matrix Arbitration Mode bits
111 = Reserved (using these Configuration modes will produce undefined behavior)
011 = Reserved (using these Configuration modes will produce undefined behavior)
010 = Arbitration Mode 2
001 = Arbitration Mode 1 (default)
000 = Arbitration Mode 0
PIC32MX1XX/2XX
DS61168E-page 72 Preliminary 2011-2012 Microchip Technology Inc.
REGISTER 4-2: BMXDKPBA: DATA RAM KERNEL PROGRAM BASE ADDRESS REGISTER
Bit
Range Bit
31/23/15/7 Bit
30/22/14/6 Bit
29/21/13/5 Bit
28/20/12/4 Bit
27/19/11/3 Bit
26/18/10/2 Bit
25/17/9/1 Bit
24/16/8/0
31:24 U-0 U-0 U-0 U-0 U-0 U-0 U-0 U-0
23:16 U-0 U-0 U-0 U-0 U-0 U-0 U-0 U-0
15:8 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R-0 R-0
BMXDKPBA<15:8>
7:0 R-0 R-0 R-0 R-0 R-0 R-0 R-0 R-0
BMXDKPBA<7:0>
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 31-16 Unimplemented: Read as ‘0
bit 15-10 BMXDKPBA<15:10>: DRM Kernel Program Base Address bits
When non-zero, this value selects the relative base address for kernel program space in RAM
bit 9-0 BMXDKPBA<9:0>: Read-Only bits
Value is always ‘0’, which forces 1 KB increments
Note 1: At Reset, the value in this register is forced to zero, which causes all of the RAM to be allocated to Kernal
mode data usage.
2: The value in this register must be less than or equal to BMXDRMSZ.
2011-2012 Microchip Technology Inc. Preliminary DS61168E-page 73
PIC32MX1XX/2XX
REGISTER 4-3: BMXDUDBA: DATA RAM USER DATA BASE ADDRESS REGISTER
Bit
Range Bit
31/23/15/7 Bit
30/22/14/6 Bit
29/21/13/5 Bit
28/20/12/4 Bit
27/19/11/3 Bit
26/18/10/2 Bit
25/17/9/1 Bit
24/16/8/0
31:24 U-0 U-0 U-0 U-0 U-0 U-0 U-0 U-0
23:16 U-0 U-0 U-0 U-0 U-0 U-0 U-0 U-0
15:8 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R-0 R-0
BMXDUDBA<15:8>
7:0 R-0 R-0 R-0 R-0 R-0 R-0 R-0 R-0
BMXDUDBA<7:0>
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 31-16 Unimplemented: Read as ‘0
bit 15-10 BMXDUDBA<15:10>: DRM User Data Base Address bits
When non-zero, the value selects the relative base address for User mode data space in RAM, the value
must be greater than BMXDKPBA.
bit 9-0 BMXDUDBA<9:0>: Read-Only bits
Value is always ‘0’, which forces 1 KB increments
Note 1: At Reset, the value in this register is forced to zero, which causes all of the RAM to be allocated to Kernal
mode data usage.
2: The value in this register must be less than or equal to BMXDRMSZ.
PIC32MX1XX/2XX
DS61168E-page 74 Preliminary 2011-2012 Microchip Technology Inc.
REGISTER 4-4: BMXDUPBA: DATA RAM USER PROGRAM BASE ADDRESS REGISTER
Bit
Range Bit
31/23/15/7 Bit
30/22/14/6 Bit
29/21/13/5 Bit
28/20/12/4 Bit
27/19/11/3 Bit
26/18/10/2 Bit
25/17/9/1 Bit
24/16/8/0
31:24 U-0 U-0 U-0 U-0 U-0 U-0 U-0 U-0
23:16 U-0 U-0 U-0 U-0 U-0 U-0 U-0 U-0
15:8 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R-0 R-0
BMXDUPBA<15:8>
7:0 R-0 R-0 R-0 R-0 R-0 R-0 R-0 R-0
BMXDUPBA<7:0>
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 31-16 Unimplemented: Read as ‘0
bit 15-10 BMXDUPBA<15:10>: DRM User Program Base Address bits
When non-zero, the value selects the relative base address for User mode program space in RAM,
BMXDUPBA must be greater than BMXDUDBA.
bit 9-0 BMXDUPBA<9:0>: Read-Only bits
Value is always ‘0’, which forces 1 KB increments
Note 1: At Reset, the value in this register is forced to zero, which causes all of the RAM to be allocated to Kernal
mode data usage.
2: The value in this register must be less than or equal to BMXDRMSZ.
2011-2012 Microchip Technology Inc. Preliminary DS61168E-page 75
PIC32MX1XX/2XX
REGISTER 4-5: BMXDRMSZ: DATA RAM SIZE REGISTER
Bit
Range Bit
31/23/15/7 Bit
30/22/14/6 Bit
29/21/13/5 Bit
28/20/12/4 Bit
27/19/11/3 Bit
26/18/10/2 Bit
25/17/9/1 Bit
24/16/8/0
31:24 RRRRR R R R
BMXDRMSZ<31:24>
23:16 RRRRR R R R
BMXDRMSZ<23:16>
15:8 RRRRR R R R
BMXDRMSZ<15:8>
7:0 RRRRR R R R
BMXDRMSZ<7:0>
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 31-0 BMXDRMSZ<31:0>: Data RAM Memory (DRM) Size bits
Static value that indicates the size of the Data RAM in bytes:
0x00001000 = device has 4 KB RAM
0x00002000 = device has 8 KB RAM
0x00004000 = device has 16 KB RAM
0x00008000 = device has 32 KB RAM
REGISTER 4-6: BMXPUPBA: PROGRAM FLASH (PFM) USER PROGRAM BASE ADDRESS
REGISTER
Bit
Range Bit
31/23/15/7 Bit
30/22/14/6 Bit
29/21/13/5 Bit
28/20/12/4 Bit
27/19/11/3 Bit
26/18/10/2 Bit
25/17/9/1 Bit
24/16/8/0
31:24 U-0 U-0 U-0 U-0 U-0 U-0 U-0 U-0
23:16 U-0 U-0 U-0 U-0 R/W-0 R/W-0 R/W-0 R/W-0
—— BMXPUPBA<19:16>
15:8 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R-0 R-0 R-0
BMXPUPBA<15:8>
7:0 R-0 R-0 R-0 R-0 R-0 R-0 R-0 R-0
BMXPUPBA<7:0>
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 31-20 Unimplemented: Read as ‘0
bit 19-11 BMXPUPBA<19:11>: Program Flash (PFM) User Program Base Address bits
bit 10-0 BMXPUPBA<10:0>: Read-Only bits
Value is always ‘0’, which forces 2 KB increments
Note 1: At Reset, the value in this register is forced to zero, which causes all of the RAM to be allocated to Kernal
mode data usage.
2: The value in this register must be less than or equal to BMXPFMSZ.
PIC32MX1XX/2XX
DS61168E-page 76 Preliminary 2011-2012 Microchip Technology Inc.
REGISTER 4-7: BMXPFMSZ: PROGRAM FLASH (PFM) SIZE REGISTER
Bit
Range Bit
31/23/15/7 Bit
30/22/14/6 Bit
29/21/13/5 Bit
28/20/12/4 Bit
27/19/11/3 Bit
26/18/10/2 Bit
25/17/9/1 Bit
24/16/8/0
31:24 RRRRR R R R
BMXPFMSZ<31:24>
23:16 RRRRR R R R
BMXPFMSZ<23:16>
15:8 RRRRR R R R
BMXPFMSZ<15:8>
7:0 RRRRR R R R
BMXPFMSZ<7:0>
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 31-0 BMXPFMSZ<31:0>: Program Flash Memory (PFM) Size bits
Static value that indicates the size of the PFM in bytes:
0x00004000 = device has 16 KB Flash
0x00008000 = device has 32 KB Flash
0x00010000 = device has 64 KB Flash
0x00020000 = device has 128 KB Flash
REGISTER 4-8: BMXBOOTSZ: BOOT FLASH (IFM) SIZE REGISTER
Bit
Range Bit
31/23/15/7 Bit
30/22/14/6 Bit
29/21/13/5 Bit
28/20/12/4 Bit
27/19/11/3 Bit
26/18/10/2 Bit
25/17/9/1 Bit
24/16/8/0
31:24 RRRRR R R R
BMXBOOTSZ<31:24>
23:16 RRRRR R R R
BMXBOOTSZ<23:16>
15:8 RRRRR R R R
BMXBOOTSZ<15:8>
7:0 RRRRR R R R
BMXBOOTSZ<7:0>
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 31-0 BMXBOOTSZ<31:0>: Boot Flash Memory (BFM) Size bits
Static value that indicates the size of the Boot PFM in bytes:
0x00000C00 = device has 3 KB boot Flash
2011-2012 Microchip Technology Inc. Preliminary DS61168E-page 77
PIC32MX1XX/2XX
5.0 FLASH PROGRAM MEMORY
PIC32MX1XX/2XX devices contain an internal Flash
program memory for executing user code. There are
three methods by which the user can program this
memory:
Run-Time Self-Programming (RTSP)
EJTAG Programming
In-Circuit Serial Programming™ (ICSP™)
RTSP is performed by software executing from either
Flash or RAM memory. Information about RTSP
techniques is available in Sec tion 5. “Flash Pro gram
Memory” (DS61121) in the “PIC32 Family Reference
Manual”.
EJTAG is performed using the EJTAG port of the
device and an EJTAG capable programmer.
ICSP is performed using a serial data connection to the
device and allows much faster programming times than
RTSP.
The EJTAG and ICSP methods are described in the
PIC32 Flash Programming Specification” (DS61145),
which can be downloaded from the Microchip web site.
Note 1: This data sheet summarizes the features
of the PIC32MX1XX/2XX family of
devices. It is not intended to be a
comprehensive reference source. To
complement the information in this data
sheet, refer to Section 5. “Flash
Program Memory” (DS61121) in the
“PIC32 Family Reference Manual”, which
is available from the Microchip web site
(www.microchip.com/PIC32).
2: Some registers and associated bits
described in this section may not be
available on all devices. Refer to
Section 4.0 “Memory Organization” in
this data sheet for device-specific register
and bit information.
Note: The Flash page size on
PIC32MX1XX/2XX devices is 1 KB and
the row size is 128 bytes (256 IW and 32
IW, respectively).
PIC32MX1XX/2XX
DS61168E-page 78 Preliminary 2011-2012 Microchip Technology Inc.
REGISTER 5-1: NVMCON: PROGRAMMING CONTROL REGISTER
Bit
Range Bit
31/23/15/7 Bit
30/22/14/6 Bit
29/21/13/5 Bit
28/20/12/4 Bit
27/19/11/3 Bit
26/18/10/2 Bit
25/17/9/1 Bit
24/16/8/0
31:24 U-0 U-0 U-0 U-0 U-0 U-0 U-0 U-0
23:16 U-0 U-0 U-0 U-0 U-0 U-0 U-0 U-0
15:8 R/W-0 R/W-0 R-0 R-0 R-0 U-0 U-0 U-0
WR WREN WRERR(1) LVDERR(1) LVDSTAT(1)
7:0 U-0 U-0 U-0 U-0 R/W-0 R/W-0 R/W-0 R/W-0
—— NVMOP<3:0>
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 31-16 Unimplemented: Read as ‘0
bit 15 WR: Write Control bit
This bit is writable when WREN = 1 and the unlock sequence is followed.
1 = Initiate a Flash operation. Hardware clears this bit when the operation completes
0 = Flash operation complete or inactive
bit 14 WREN: Write Enable bit
1 = Enable writes to WR bit and enables LVD circuit
0 = Disable writes to WR bit and disables LVD circuit
This is the only bit in this register reset by a device Reset.
bit 13 WRERR: Write Error bit(1)
This bit is read-only and is automatically set by hardware.
1 = Program or erase sequence did not complete successfully
0 = Program or erase sequence completed normally
bit 12 LVDERR: Low-Voltage Detect Error bit (LVD circuit must be enabled)(1)
This bit is read-only and is automatically set by hardware.
1 = Low-voltage detected (possible data corruption, if WRERR is set)
0 = Voltage level is acceptable for programming
bit 11 LVDSTAT : Low-Voltage Detect Status bit (LVD circuit must be enabled)(1)
This bit is read-only and is automatically set, and cleared, by hardware.
1 = Low-voltage event active
0 = Low-voltage event NOT active
bit 10-4 Unimplemented: Read as ‘0
bit 3-0 NVMOP<3:0>: NVM Operation bits
These bits are writable when WREN = 0.
1111 = Reserved
0111 = Reserved
0110 = No operation
0101 = Program Flash (PFM) erase operation: erases PFM, if all pages are not write-protected
0100 = Page erase operation: erases page selected by NVMADDR, if it is not write-protected
0011 = Row program operation: programs row selected by NVMADDR, if it is not write-protected
0010 = No operation
0001 = Word program operation: programs word selected by NVMADDR, if it is not write-protected
0000 = No operation
Note 1: This bit is cleared by setting NVMOP == 0000b, and initiating a Flash operation (i.e., WR).
2011-2012 Microchip Technology Inc. Preliminary DS61168E-page 79
PIC32MX1XX/2XX
REGISTER 5-2: NVMKEY: PROGRAMMING UNLOCK REGISTER
Bit
Range Bit
31/23/15/7 Bit
30/22/14/6 Bit
29/21/13/5 Bit
28/20/12/4 Bit
27/19/11/3 Bit
26/18/10/2 Bit
25/17/9/1 Bit
24/16/8/0
31:24 W-0 W-0 W-0 W-0 W-0 W-0 W-0 W-0
NVMKEY<31:24>
23:16 W-0 W-0 W-0 W-0 W-0 W-0 W-0 W-0
NVMKEY<23:16>
15:8 W-0 W-0 W-0 W-0 W-0 W-0 W-0 W-0
NVMKEY<15:8>
7:0 W-0 W-0 W-0 W-0 W-0 W-0 W-0 W-0
NVMKEY<7:0>
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 31-0 NVMKEY<31:0>: Unlock Register bits
These bits are write-only, and read as ‘0’ on any read
Note: This register is used as part of the unlock sequence to prevent inadvertent writes to the PFM.
REGISTER 5-3: NVMADDR: FLASH ADDRESS REGISTER
Bit
Range Bit
31/23/15/7 Bit
30/22/14/6 Bit
29/21/13/5 Bit
28/20/12/4 Bit
27/19/11/3 Bit
26/18/10/2 Bit
25/17/9/1 Bit
24/16/8/0
31:24 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
NVMADDR<31:24>
23:16 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
NVMADDR<23:16>
15:8 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
NVMADDR<15:8>
7:0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
NVMADDR<7:0>
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 31-0 NVMADDR<31:0>: Flash Address bits
Bulk/Chip/PFM Erase: Address is ignored.
Page Erase: Address identifies the page to erase.
Row Program: Address identifies the row to program.
Word Program: Address identifies the word to program.
PIC32MX1XX/2XX
DS61168E-page 80 Preliminary 2011-2012 Microchip Technology Inc.
REGISTER 5-4: NVMDATA: FLASH PROGRAM DATA REGISTER
Bit
Range Bit
31/23/15/7 Bit
30/22/14/6 Bit
29/21/13/5 Bit
28/20/12/4 Bit
27/19/11/3 Bit
26/18/10/2 Bit
25/17/9/1 Bit
24/16/8/0
31:24 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
NVMDATA<31:24>
23:16 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
NVMDATA<23:16>
15:8 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
NVMDATA<15:8>
7:0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
NVMDATA<7:0>
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 31-0 NVMDATA<31:0>: Flash Programming Data bits
Note: The bits in this register are only reset by a Power-on Reset (POR).
REGISTER 5-5: NVMSRC ADDR : SOU RCE DATA ADDRESS REGISTER
Bit
Range Bit
31/23/15/7 Bit
30/22/14/6 Bit
29/21/13/5 Bit
28/20/12/4 Bit
27/19/11/3 Bit
26/18/10/2 Bit
25/17/9/1 Bit
24/16/8/0
31:24 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
NVMSRCADDR<31:24>
23:16 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
NVMSRCADDR<23:16>
15:8 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
NVMSRCADDR<15:8>
7:0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
NVMSRCADDR<7:0>
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 31-0 NVMSRCADDR<31:0>: Source Data Address bits
The system physical address of the data to be programmed into the Flash when the NVMOP<3:0> bits
(NVMCON<3:0>) are set to perform row programming.
2011-2012 Microchip Technology Inc. Preliminary DS61168E-page 81
PIC32MX1XX/2XX
6.0 RESETS The Reset module combines all Reset sources and
controls the device Master Reset signal, SYSRST. The
following is a list of device Reset sources:
POR: Power-on Reset
•MCLR
: Master Clear Reset pin
SWR: Software Reset
WDTR: Watchdog Timer Reset
BOR: Brown-out Reset
CMR: Configuration Mismatch Reset
A simplified block diagram of the Reset module is
illustrated in Figure 6-1.
FIGURE 6-1: SYSTEM RESET BLOCK DIAGRAM
Note 1: This data sheet summarizes the features
of the PIC32MX1XX/2XX family of
devices. It is not intended to be a
comprehensive reference source. To
complement the information in this data
sheet, refer to Section 7. “Resets”
(DS61118) in the “PIC32 Family
Reference Manual”, which is available
from the Microchip web site
(www.microchip.com/PIC32).
2: Some registers and associated bits
described in this section may not be
available on all devices. Refer to
Section 4.0 “Memory Organization” in
this data sheet for device-specific register
and bit information.
MCLR
VDD
VDD Rise
Detect
POR
Sleep or Idle
Brown-out
Reset
WDT
Time-out
Glitch Filter
BOR
Configuration
SYSRST
Software Reset
Power-up
Timer
Voltage
Enabled
Reset
WDTR
SWR
CMR
MCLR
Mismatch
Regulator
PIC32MX1XX/2XX
DS61168E-page 82 Preliminary 2011-2012 Microchip Technology Inc.
REGISTER 6-1: RCON: RESET CONTROL REGISTER
Bit
Range Bit
31/23/15/7 Bit
30/22/14/6 Bit
29/21/13/5 Bit
28/20/12/4 Bit
27/19/11/3 Bit
26/18/10/2 Bit
25/17/9/1 Bit
24/16/8/0
31:24 U-0 U-0 U-0 U-0 U-0 U-0 U-0 U-0
23:16 U-0 U-0 U-0 U-0 U-0 U-0 U-0 U-0
15:8 U-0 U-0 U-0 U-0 U-0 U-0 R/W-0, HS R/W-0
CMR VREGS
7:0 R/W-0, HS R/W-0, HS U-0 R/W-0, HS R/W-0, HS R/W-0, HS R/W-1, HS R/W-1, HS
EXTR SWR WDTO SLEEP IDLE BOR(1) POR(1)
Legend: HS = Set by hardware
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 31-10 Unimplemented: Read as ‘0
bit 9 CMR: Configuration Mismatch Reset Flag bit
1 = Configuration mismatch Reset has occurred
0 = Configuration mismatch Reset has not occurred
bit 8 VREGS: Voltage Regulator Standby Enable bit
1 = Regulator is enabled and is on during Sleep mode
0 = Regulator is disabled and is off during Sleep mode
bit 7 EXTR: External Reset (MCLR) Pin Flag bit
1 = Master Clear (pin) Reset has occurred
0 = Master Clear (pin) Reset has not occurred
bit 6 SWR: Software Reset Flag bit
1 = Software Reset was executed
0 = Software Reset as not executed
bit 5 Unimplemented: Read as ‘0
bit 4 WDTO: Watchdog Timer Time-out Flag bit
1 = WDT Time-out has occurred
0 = WDT Time-out has not occurred
bit 3 SLEEP: Wake From Sleep Flag bit
1 = Device was in Sleep mode
0 = Device was not in Sleep mode
bit 2 IDLE: Wake From Idle Flag bit
1 = Device was in Idle mode
0 = Device was not in Idle mode
bit 1 BOR: Brown-out Reset Flag bit(1)
1 = Brown-out Reset has occurred
0 = Brown-out Reset has not occurred
bit 0 POR: Power-on Reset Flag bit(1)
1 = Power-on Reset has occurred
0 = Power-on Reset has not occurred
Note 1: User software must clear this bit to view next detection.
2011-2012 Microchip Technology Inc. Preliminary DS61168E-page 83
PIC32MX1XX/2XX
REGISTER 6-2: RSW RST: SOFTWARE RESET REGISTER
Bit
Range Bit
31/23/15/7 Bit
30/22/14/6 Bit
29/21/13/5 Bit
28/20/12/4 Bit
27/19/11/3 Bit
26/18/10/2 Bit
25/17/9/1 Bit
24/16/8/0
31:24 U-0 U-0 U-0 U-0 U-0 U-0 U-0 U-0
23:16 U-0 U-0 U-0 U-0 U-0 U-0 U-0 U-0
15:8 U-0 U-0 U-0 U-0 U-0 U-0 U-0 U-0
7:0 U-0 U-0 U-0 U-0 U-0 U-0 U-0 W-0, HC
—SWRST
(1)
Legend: HC = Cleared by hardware
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 31-1 Unimplemented: Read as ‘0
bit 0 SWRST: Software Reset Trigger bit(1)
1 = Enable software Reset event
0 = No effect
Note 1: The system unlock sequence must be performed before the SWRST bit can be written. Refer to Section
6. “Oscillator” (DS61112) in the “PIC32 Family Reference Manual” for details.
PIC32MX1XX/2XX
DS61168E-page 84 Preliminary 2011-2012 Microchip Technology Inc.
NOTES:
2011-2012 Microchip Technology Inc. Preliminary DS61168E-page 85
PIC32MX1XX/2XX
7.0 INTERRUPT CONTROLLER
PIC32MX1XX/2XX devices generate interrupt requests
in response to interrupt events from peripheral modules.
The interrupt control module exists externally to the CPU
logic and prioritizes the interrupt events before
presenting them to the CPU.
The PIC32MX1XX/2XX interrupt module includes the
following features:
Up to 64 interrupt sources
Up to 44 interrupt vectors
Single and multi-vector mode operations
Five external interrupts with edge polarity control
Interrupt proximity timer
Seven user-selectable priority levels for each
vector
Four user-selectable subpriority levels within each
priority
Software can generate any interrupt
User-configurable interrupt vector table location
User-configurable interrupt vector spacing
FIGURE 7-1: INTERRUPT CONTROLLER MODULE BLOCK DIAGRAM
Note 1: This data sheet summarizes the features
of the PIC32MX1XX/2XX family of
devices. It is not intended to be a
comprehensive reference source. To
complement the information in this data
sheet, refer to Section 8. “Interrupt
Controller” (DS61108) in the “PIC32
Family Reference Manual”, which is
available from the Microchip web site
(www.microchip.com/PIC32).
2: Some registers and associated bits
described in this section may not be
available on all devices. Refer to
Section 4.0 “Memory Organization” in
this data sheet for device-specific register
and bit information. Note: On PIC32MX1XX/2XX devices, the
dedicated shadow set is not present.
Interrupt Controller
Interrupt Requests
Vector Number
CPU Core
Priority Level
PIC32MX1XX/2XX
DS61168E-page 86 Preliminary 2011-2012 Microchip Technology Inc.
TABLE 7-1: INTERRUPT IRQ, VECTOR AND BIT LOCATION
Interrupt Source(1) IRQ
#Vector
#
Interrupt Bit Location Persistent
Interrupt
Flag Enable Priority Sub-priority
Highest Natural Order Priority
CT – Core Timer Interrupt 0 0 IFS0<0> IEC0<0> IPC0<4:2> IPC0<1:0> No
CS0 – Core Software Interrupt 0 1 1 IFS0<1> IEC0<1> IPC0<12:10> IPC0<9:8> No
CS1 – Core Software Interrupt 1 2 2 IFS0<2> IEC0<2> IPC0<20:18> IPC0<17:16> No
INT0 – External Interrupt 3 3 IFS0<3> IEC0<3> IPC0<28:26> IPC0<25:24> No
T1 – Timer1 4 4 IFS0<4> IEC0<4> IPC1<4:2> IPC1<1:0> No
IC1E – Input Capture 1 Error 5 5 IFS0<5> IEC0<5> IPC1<12:10> IPC1<9:8> Yes
IC1 – Input Capture 1 6 5 IFS0<6> IEC0<6> IPC1<12:10> IPC1<9:8> Yes
OC1 – Output Compare 1 7 6 IFS0<7> IEC0<7> IPC1<20:18> IPC1<17:16> No
INT1 – External Interrupt 1 8 7 IFS0<8> IEC0<8> IPC1<28:26> IPC1<25:24> No
T2 – Timer2 9 8 IFS0<9> IEC0<9> IPC2<4:2> IPC2<1:0> No
IC2E – Input Capture 2 10 9 IFS0<10> IEC0<10> IPC2<12:10> IPC2<9:8> Yes
IC2 – Input Capture 2 11 9 IFS0<11> IEC0<11> IPC2<12:10> IPC2<9:8> Yes
OC2 – Output Compare 2 12 10 IFS0<12> IEC0<12> IPC2<20:18> IPC2<17:16> No
INT2 – External Interrupt 2 13 11 IFS0<13> IEC0<13> IPC2<28:26> IPC2<25:24> No
T3 – Timer3 14 12 IFS0<14> IEC0<14> IPC3<4:2> IPC3<1:0> No
IC3E – Input Capture 3 15 13 IFS0<15> IEC0<15> IPC3<12:10> IPC3<9:8> Yes
IC3 – Input Capture 3 16 13 IFS0<16> IEC0<16> IPC3<12:10> IPC3<9:8> Yes
OC3 – Output Compare 3 17 14 IFS0<17> IEC0<17> IPC3<20:18> IPC3<17:16> No
INT3 – External Interrupt 3 18 15 IFS0<18> IEC0<18> IPC3<28:26> IPC3<25:24> No
T4 – Timer4 19 16 IFS0<19> IEC0<19> IPC4<4:2> IPC4<1:0> No
IC4E – Input Capture 4 Error 20 17 IFS0<20> IEC0<20> IPC4<12:10> IPC4<9:8> Yes
IC4 – Input Capture 4 21 17 IFS0<21> IEC0<21> IPC4<12:10> IPC4<9:8> Yes
OC4 – Output Compare 4 22 18 IFS0<22> IEC0<22> IPC4<20:18> IPC4<17:16> No
INT4 – External Interrupt 4 23 19 IFS0<23> IEC0<23> IPC4<28:26> IPC4<25:24> No
T5 – Timer5 24 20 IFS0<24> IEC0<24> IPC5<4:2> IPC5<1:0> No
IC5E – Input Capture 5 Error 25 21 IFS0<25> IEC0<25> IPC5<12:10> IPC5<9:8> Yes
IC5 – Input Capture 5 26 21 IFS0<26> IEC0<26> IPC5<12:10> IPC5<9:8> Yes
OC5 – Output Compare 5 27 22 IFS0<27> IEC0<27> IPC5<20:18> IPC5<17:16> No
AD1 – ADC1 Convert done 28 23 IFS0<28> IEC0<28> IPC5<28:26> IPC5<25:24> Yes
FSCM – Fail-Safe Clock Monitor 29 24 IFS0<29> IEC0<29> IPC6<4:2> IPC6<1:0> No
RTCC – Real-Time Clock and
Calendar
30 25 IFS0<30> IEC0<30> IPC6<12:10> IPC6<9:8> No
FCE – Flash Control Event 31 26 IFS0<31> IEC0<31> IPC6<20:18> IPC6<17:16> No
CMP1 – Comparator Interrupt 32 27 IFS1<0> IEC1<0> IPC6<28:26> IPC6<25:24> No
CMP2 – Comparator Interrupt 33 28 IFS1<1> IEC1<1> IPC7<4:2> IPC7<1:0> No
CMP3 – Comparator Interrupt 34 29 IFS1<2> IEC1<2> IPC7<12:10> IPC7<9:8> No
USB – USB Interrupts 35 30 IFS1<3> IEC1<3> IPC7<20:18> IPC7<17:16> Yes
SPI1E – SPI1 Fault 36 31 IFS1<4> IEC1<4> IPC7<28:26> IPC7<25:24> Yes
SPI1RX – SPI1 Receive Done 37 31 IFS1<5> IEC1<5> IPC7<28:26> IPC7<25:24> Yes
SPI1TX – SPI1 Transfer Done 38 31 IFS1<6> IEC1<6> IPC7<28:26> IPC7<25:24> Yes
Note 1: Not all interrupt sources are available on all devices. See TABLE 1: “PIC32MX1XX General Purpose
Family Features” and TABLE 2: “PIC32MX2XX US B Fa mily Features” for the lists of available
peripherals.
2011-2012 Microchip Technology Inc. Preliminary DS61168E-page 87
PIC32MX1XX/2XX
U1E – UART1 Fault 39 32 IFS1<7> IEC1<7> IPC8<4:2> IPC8<1:0> Yes
U1RX – UART1 Receive Done 40 32 IFS1<8> IEC1<8> IPC8<4:2> IPC8<1:0> Yes
U1TX – UART1 Transfer Done 41 32 IFS1<9> IEC1<9> IPC8<4:2> IPC8<1:0> Yes
I2C1B – I2C1 Bus Collision Event 42 33 IFS1<10> IEC1<10> IPC8<12:10> IPC8<9:8> Yes
I2C1S – I2C1 Slave Event 43 33 IFS1<11> IEC1<11> IPC8<12:10> IPC8<9:8> Yes
I2C1M – I2C1 Master Event 44 33 IFS1<12> IEC1<12> IPC8<12:10> IPC8<9:8> Yes
CNA – PORTA Input Change
Interrupt
45 34 IFS1<13> IEC1<13> IPC8<20:18> IPC8<17:16> Yes
CNB – PORTB Input Change
Interrupt
46 34 IFS1<14> IEC1<14> IPC8<20:18> IPC8<17:16> Yes
CNC – PORTC Input Change
Interrupt
47 34 IFS1<15> IEC1<15> IPC8<20:18> IPC8<17:16> Yes
PMP – Parallel Master Port 48 35 IFS1<16> IEC1<16> IPC8<28:26> IPC8<25:24> Yes
PMPE – Parallel Master Port Error 49 35 IFS1<17> IEC1<17> IPC8<28:26> IPC8<25:24> Yes
SPI2E – SPI2 Fault 50 36 IFS1<18> IEC1<18> IPC9<4:2> IPC9<1:0> Yes
SPI2RX – SPI2 Receive Done 51 36 IFS1<19> IEC1<19> IPC9<4:2> IPC9<1:0> Yes
SPI2TX – SPI2 Transfer Done 52 36 IFS1<20> IEC1<20> IPC9<4:2> IPC9<1:0> Yes
U2E – UART2 Error 53 37 IFS1<21> IEC1<21> IPC9<12:10> IPC9<9:8> Yes
U2RX – UART2 Receiver 54 37 IFS1<22> IEC1<22> IPC9<12:10> IPC9<9:8> Yes
U2TX – UART2 Transmitter 55 37 IFS1<23> IEC1<23> IPC9<12:10> IPC9<9:8> Yes
I2C2B – I2C2 Bus Collision Event 56 38 IFS1<24> IEC1<24> IPC9<20:18> IPC9<17:16> Yes
I2C2S – I2C2 Slave Event 57 38 IFS1<25> IEC1<25> IPC9<20:18> IPC9<17:16> Yes
I2C2M – I2C2 Master Event 58 38 IFS1<26> IEC1<26> IPC9<20:18> IPC9<17:16> Yes
CTMU – CTMU Event 59 39 IFS1<27> IEC1<27> IPC9<28:26> IPC9<25:24> Yes
DMA0 – DMA Channel 0 60 40 IFS1<28> IEC1<28> IPC10<4:2> IPC10<1:0> No
DMA1 – DMA Channel 1 61 41 IFS1<29> IEC1<29> IPC10<12:10> IPC10<9:8> No
DMA2 – DMA Channel 2 62 42 IFS1<30> IEC1<30> IPC10<20:18> IPC10<17:16> No
DMA3 – DMA Channel 3 63 43 IFS1<31> IEC1<31> IPC10<28:26> IPC10<25:24> No
Lowest Natural Order Priority
TABLE 7-1: INTERRUPT IRQ, VECTOR AND BIT LOCATION (CONTINUED)
Interrupt Source(1) IRQ
#Vector
#
Interrupt Bit Location Persistent
Interrupt
Flag Enable Priority Sub-priority
Note 1: Not all interrupt sources are available on all devices. See TABLE 1: “PIC32MX1XX General Purpose
Family Features” and TABLE 2: “PIC32 MX2 XX USB Family Features for the lists of available
peripherals.
PIC32MX1XX/2XX
DS61168E-page 88 Preliminary 2011-2012 Microchip Technology Inc.
REGISTER 7-1: INTCON: INTERRUP T CONTROL REGISTER
Bit
Range Bit
31/23/15/7 Bit
30/22/14/6 Bit
29/21/13/5 Bit
28/20/12/4 Bit
27/19/11/3 Bit
26/18/10/2 Bit
25/17/9/1 Bit
24/16/8/0
31:24 U-0 U-0 U-0 U-0 U-0 U-0 U-0 U-0
23:16 U-0 U-0 U-0 U-0 U-0 U-0 U-0 R/W-0
—SS0
15:8 U-0 U-0 U-0 R/W-0 U-0 R/W-0 R/W-0 R/W-0
MVEC —TPC<2:0>
7:0 U-0 U-0 U-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
INT4EP INT3EP INT2EP INT1EP INT0EP
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 31-17 Unimplemented: Read as ‘0
bit 16 SS0: Single Vector Shadow Register Set bit
1 = Single vector is presented with a shadow register set
0 = Single vector is not presented with a shadow register set
bit 15-13 Unimplemented: Read as ‘0
bit 12 MVEC: Multi Vector Configuration bit
1 = Interrupt controller configured for multi vectored mode
0 = Interrupt controller configured for single vectored mode
bit 11 Unimplemented: Read as ‘0
bit 10-8 TPC<2:0>: Interrupt Proximity Timer Control bits
111 = Interrupts of group priority 7 or lower start the Interrupt Proximity timer
110 = Interrupts of group priority 6 or lower start the Interrupt Proximity timer
101 = Interrupts of group priority 5 or lower start the Interrupt Proximity timer
100 = Interrupts of group priority 4 or lower start the Interrupt Proximity timer
011 = Interrupts of group priority 3 or lower start the Interrupt Proximity timer
010 = Interrupts of group priority 2 or lower start the Interrupt Proximity timer
001 = Interrupts of group priority 1 start the Interrupt Proximity timer
000 = Disables Interrupt Proximity timer
bit 7-5 Unimplemented: Read as ‘0
bit 4 INT4EP: External Interrupt 4 Edge Polarity Control bit
1 = Rising edge
0 = Falling edge
bit 3 INT3EP: External Interrupt 3 Edge Polarity Control bit
1 = Rising edge
0 = Falling edge
bit 2 INT2EP: External Interrupt 2 Edge Polarity Control bit
1 = Rising edge
0 = Falling edge
bit 1 INT1EP: External Interrupt 1 Edge Polarity Control bit
1 = Rising edge
0 = Falling edge
bit 0 INT0EP: External Interrupt 0 Edge Polarity Control bit
1 = Rising edge
0 = Falling edge
2011-2012 Microchip Technology Inc. Preliminary DS61168E-page 89
PIC32MX1XX/2XX
REGISTER 7-2: INTSTAT: INTERRUPT STATUS REGISTER
Bit
Range Bit
31/23/15/7 Bit
30/22/14/6 Bit
29/21/13/5 Bit
28/20/12/4 Bit
27/19/11/3 Bit
26/18/10/2 Bit
25/17/9/1 Bit
24/16/8/0
31:24 U-0 U-0 U-0 U-0 U-0 U-0 U-0 U-0
23:16 U-0 U-0 U-0 U-0 U-0 U-0 U-0 U-0
15:8 U-0 U-0 U-0 U-0 U-0 R/W-0 R/W-0 R/W-0
—SRIPL<2:0>
(1)
7:0 U-0 U-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
VEC<5:0>(1)
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 31-11 Unimplemented: Read as ‘0
bit 10-8 SRIPL<2:0>: Requested Priority Level bits(1)
000-111 = The priority level of the latest interrupt presented to the CPU
bit 7-6 Unimplemented: Read as ‘0
bit 5-0 VEC<5:0>: Interrupt Vector bits(1)
00000-11111 = The interrupt vector that is presented to the CPU
Note 1: This value should only be used when the interrupt controller is configured for Single Vector mode.
REGISTER 7-3: IPTMR: INTERRUPT PROXIMITY TIMER REGISTER
Bit
Range Bit
31/23/15/7 Bit
30/22/14/6 Bit
29/21/13/5 Bit
28/20/12/4 Bit
27/19/11/3 Bit
26/18/10/2 Bit
25/17/9/1 Bit
24/16/8/0
31:24 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
IPTMR<31:24>
23:16 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
IPTMR<23:16>
15:8 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
IPTMR<15:8>
7:0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
IPTMR<7:0>
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 31-0 IPTMR<31:0>: Interrupt Proximity Timer Reload bits
Used by the Interrupt Proximity Timer as a reload value when the Interrupt Proximity timer is triggered by
an interrupt event.
PIC32MX1XX/2XX
DS61168E-page 90 Preliminary 2011-2012 Microchip Technology Inc.
REGISTER 7-4: IFSx: INTERRUPT FLAG STATUS REGISTER
Bit
Range Bit
31/23/15/7 Bit
30/22/14/6 Bit
29/21/13/5 Bit
28/20/12/4 Bit
27/19/11/3 Bit
26/18/10/2 Bit
25/17/9/1 Bit
24/16/8/0
31:24 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
IFS31 IFS30 IFS29 IFS28 IFS27 IFS26 IFS25 IFS24
23:16 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
IFS23 IFS22 IFS21 IFS20 IFS19 IFS18 IFS17 IFS16
15:8 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
IFS15 IFS14 IFS13 IFS12 IFS11 IFS10 IFS09 IFS08
7:0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
IFS07 IFS06 IFS05 IFS04 IFS03 IFS02 IFS01 IFS00
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 31-0 IFS31-IFS00: Interrupt Flag Status bits
1 = Interrupt request has occurred
0 = No interrupt request has occurred
Note: This register represents a generic definition of the IFSx register. Refer to Ta ble 7- 1 for the exact bit
definitions.
REGISTER 7-5: IECx: INTERRUPT ENABLE CONTROL REGISTER
Bit
Range Bit
31/23/15/7 Bit
30/22/14/6 Bit
29/21/13/5 Bit
28/20/12/4 Bit
27/19/11/3 Bit
26/18/10/2 Bit
25/17/9/1 Bit
24/16/8/0
31:24 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
IEC31 IEC30 IEC29 IEC28 IEC27 IEC26 IEC25 IEC24
23:16 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
IEC23 IEC22 IEC21 IEC20 IEC19 IEC18 IEC17 IEC16
15:8 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
IEC15 IEC14 IEC13 IEC12 IEC11 IEC10 IEC09 IEC08
7:0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
IEC07 IEC06 IEC05 IEC04 IEC03 IEC02 IEC01 IEC00
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 31-0 IEC31-IEC00: Interrupt Enable bits
1 = Interrupt is enabled
0 = Interrupt is disabled
Note: This register represents a generic definition of the IECx register. Refer to Ta b le 7-1 for the exact bit
definitions.
2011-2012 Microchip Technology Inc. Preliminary DS61168E-page 91
PIC32MX1XX/2XX
REGISTER 7-6: IPCx: INTERRUPT PRIORITY CONTROL REGISTER
Bit
Range Bit
31/23/15/7 Bit
30/22/14/6 Bit
29/21/13/5 Bit
28/20/12/4 Bit
27/19/11/3 Bit
26/18/10/2 Bit
25/17/9/1 Bit
24/16/8/0
31:24 U-0 U-0 U-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
IP03<2:0> IS03<1:0>
23:16 U-0 U-0 U-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
IP02<2:0> IS02<1:0>
15:8 U-0 U-0 U-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
IP01<2:0> IS01<1:0>
7:0 U-0 U-0 U-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
IP00<2:0> IS00<1:0>
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 31-29 Unimplemented: Read as ‘0
bit 28-26 IP03<2:0>: Interrupt Priority bits
111 = Interrupt priority is 7
010 = Interrupt priority is 2
001 = Interrupt priority is 1
000 = Interrupt is disabled
bit 25-24 IS03<1:0>: Interrupt Subpriority bits
11 = Interrupt subpriority is 3
10 = Interrupt subpriority is 2
01 = Interrupt subpriority is 1
00 = Interrupt subpiority is 0
bit 23-21 Unimplemented: Read as ‘0
bit 20-18 IP02<2:0>: Interrupt Priority bits
111 = Interrupt priority is 7
010 = Interrupt priority is 2
001 = Interrupt priority is 1
000 = Interrupt is disabled
bit 17-16 IS02<1:0>: Interrupt Subpriority bits
11 = Interrupt subpriority is 3
10 = Interrupt subpriority is 2
01 = Interrupt subpriority is 1
00 = Interrupt subpriority is 0
bit 15-13 Unimplemented: Read as ‘0
bit 12-10 IP01<2:0>: Interrupt Priority bits
111 = Interrupt priority is 7
010 = Interrupt priority is 2
001 = Interrupt priority is 1
000 = Interrupt is disabled
Note: This register represents a generic definition of the IPCx register. Refer to Ta b le 7-1 for the exact bit
definitions.
PIC32MX1XX/2XX
DS61168E-page 92 Preliminary 2011-2012 Microchip Technology Inc.
bit 9-8 IS01<1:0>: Interrupt Subpriority bits
11 = Interrupt subpriority is 3
10 = Interrupt subpriority is 2
01 = Interrupt subpriority is 1
00 = Interrupt subpriority is 0
bit 7-5 Unimplemented: Read as ‘0
bit 4-2 IP00<2:0>: Interrupt Priority bits
111 = Interrupt priority is 7
010 = Interrupt priority is 2
001 = Interrupt priority is 1
000 = Interrupt is disabled
bit 1-0 IS00<1:0>: Interrupt Subpriority bits
11 = Interrupt subpriority is 3
10 = Interrupt subpriority is 2
01 = Interrupt subpriority is 1
00 = Interrupt subpriority is 0
REGISTER 7-6: IPCx: INTERRUPT PRIORITY CONTROL REGISTER (CONTINUED)
Note: This register represents a generic definition of the IPCx register. Refer to Ta b le 7-1 for the exact bit
definitions.
2011-2012 Microchip Technology Inc. Preliminary DS61168E-page 93
PIC32MX1XX/2XX
8.0 OSCILLATOR
CONFIGURATION
The PIC32MX1XX/2XX oscillator system has the
following modules and features:
A Total of four external and internal oscillator
options as clock sources
On-Chip PLL with user-selectable input divider,
multiplier and output divider to boost operating
frequency on select internal and external
oscillator sources
On-Chip user-selectable divisor postscaler on
select oscillator sources
Software-controllable switching between
various clock sources
A Fail-Safe Clock Monitor (FSCM) that detects
clock failure and permits safe application recovery
or shutdown
Dedicated On-Chip PLL for USB peripheral
A block diagram of the oscillator system is provided in
Figure 8-1.
Note 1: This data sheet summarizes the features
of the PIC32MX1XX/2XX family of
devices. It is not intended to be a
comprehensive reference source. To
complement the information in this data
sheet, refer to Section 6. “Oscillator
Configuration” (DS61112) in the
“PIC32 Family Reference Manual”, which
is available from the Microchip web site
(www.microchip.com/PIC32).
2: Some registers and associated bits
described in this section may not be
available on all devices. Refer to
Section 4.0 “Memory Organization” in
this data sheet for device-specific register
and bit information.
PIC32MX1XX/2XX
DS61168E-page 94 Preliminary 2011-2012 Microchip Technology Inc.
FIGURE 8-1: OSCILLATOR DIAGRAM
Timer1, RTCC
Clock Control Logic
Fail-Safe
Clock
Monitor
FSCM INT
FSCM Event
COSC<2:0>
NOSC<2:0>
OSWEN
FSCMEN<1:0>
PLL
Secondary Oscill ator (SOSC)
SOSCEN and FSOSCEN
SOSCO
SOSCI
Primary Oscill ator
POSC (XT, HS, EC)
CPU and Select Peripherals
Peripherals
FRCDIV<2:0>
WDT, PWRT
8 MHz typical
FRC
31.25 kHz typical
FRC
Oscillator
LPRC
Oscillator
SOSC
LPRC
FRCDIV
TUN<5:0>
div 16
Postscaler
FPLLIDIV<2:0>
PBDIV<1:0>
FRC/16
Postscaler
COSC<2:0>
FIN
div x
div y
PLLODIV<2:0>
div x
32.768 kHz
PLLMULT<2:0>
PBCLK (TPB)
UFIN 4 MHz
PLL x24
USB Clock (48 MHz)
div 2
UPLLEN
UFRCEN
div x
UPLLIDIV<2:0>
UFIN
4 MHz FIN 5 MHz
C1
(3)
C2
(3)
XTAL
R
S
(1)
Enable
Notes: 1. A series resistor, RS, may be required for AT strip cut crystals or eliminate clipping. Alternately, to increase oscillator circuit gain,
add a parallel resistor, RP, with a value of 1 M
2. The internal feedback resistor, RF, is typically in the range of 2 to 10 M
3. Refer to Section 6. “Oscillator Conf igu ra tion” (DS61112) in the “PIC32 Family Reference Manual” for help in determining the
best oscillator components.
4. PBCLK out is available on the OSC2 pin in certain clock modes.
5. USB PLL is available on PIC32MX2XX devices only.
OSC2(4)
OSC1
R
F
(2)
To Internal
Logic
USB PLL(5)
(POSC)
div 2
To AD C
SYSCLK
REFCLKI
REFCLKO
OE
To SPI
ROSEL<3:0>
POSC
FRC
LPRC
SOSC
PBCLK
SYSCLK
XTPLL, HSPLL,
ECPLL, FRCPLL
2N
M
512
----------+


RODIV<4:0>
(N)
ROTRIM<8:0>
(M)
R
P
(1)
2011-2012 Microchip Technology Inc. Preliminary DS61168E-page 95
PIC32MX1XX/2XX
REGISTER 8-1: OS CCON: OSCILLATOR CONTROL REGISTER
Bit
Range Bit
31/23/15/7 Bit
30/22/14/6 Bit
29/21/13/5 Bit
28/20/12/4 Bit
27/19/11/3 Bit
26/18/10/2 Bit
25/17/9/1 Bit
24/16/8/0
31:24 U-0 U-0 R/W-y R/W-y R/W-y R/W-0 R/W-0 R/W-1
PLLODIV<2:0> FRCDIV<2:0>
23:16 U-0 R-0 R-1 R/W-y R/W-y R/W-y R/W-y R/W-y
SOSCRDY PBDIVRDY PBDIV<1:0> PLLMULT<2:0>
15:8 U-0 R-0 R-0 R-0 U-0 R/W-y R/W-y R/W-y
COSC<2:0> NOSC<2:0>
7:0 R/W-0 R-0 R-0 R/W-0 R/W-0 R/W-0 R/W-y R/W-0
CLKLOCK ULOCK(1) SLOCK SLPEN CF UFRCEN(1) SOSCEN OSWEN
Legend: y = Value set from Configuration bits on POR
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 31-30 Unimplemented: Read as ‘0
bit 29-27 PLLODIV<2:0>: Output Divider for PLL
111 = PLL output divided by 256
110 = PLL output divided by 64
101 = PLL output divided by 32
100 = PLL output divided by 16
011 = PLL output divided by 8
010 = PLL output divided by 4
001 = PLL output divided by 2
000 = PLL output divided by 1
bit 26-24 FRCDIV<2:0>: Internal Fast RC (FRC) Oscillator Clock Divider bits
111 = FRC divided by 256
110 = FRC divided by 64
101 = FRC divided by 32
100 = FRC divided by 16
011 = FRC divided by 8
010 = FRC divided by 4
001 = FRC divided by 2 (default setting)
000 = FRC divided by 1
bit 23 Unimplemented: Read as ‘0
bit 22 SOSCRDY: Secondary Oscillator (SOSC) Ready Indicator bit
1 = Indicates that the Secondary Oscillator is running and is stable
0 = Secondary Oscillator is still warming up or is turned off
bit 21 PBDIVRDY: Peripheral Bus Clock (PBCLK) Divisor Ready bit
1 = PBDIV<1:0> bits can be written
0 = PBDIV<1:0> bits cannot be written
bit 20-19 PBDIV<1:0>: Peripheral Bus Clock (PBCLK) Divisor bits
11 = PBCLK is SYSCLK divided by 8 (default)
10 = PBCLK is SYSCLK divided by 4
01 = PBCLK is SYSCLK divided by 2
00 = PBCLK is SYSCLK divided by 1
Note 1: This bit is available on PIC32MX2XX devices only.
Note: Writes to this register require an unlock sequence. Refer to Section 6. “Oscillator” (DS61112) in the
“PIC32 Family Reference Manual” for details.
PIC32MX1XX/2XX
DS61168E-page 96 Preliminary 2011-2012 Microchip Technology Inc.
bit 18-16 PLLMULT<2:0>: Phase-Locked Loop (PLL) Multiplier bits
111 = Clock is multiplied by 24
110 = Clock is multiplied by 21
101 = Clock is multiplied by 20
100 = Clock is multiplied by 19
011 = Clock is multiplied by 18
010 = Clock is multiplied by 17
001 = Clock is multiplied by 16
000 = Clock is multiplied by 15
bit 15 Unimplemented: Read as ‘0
bit 14-12 COSC<2:0>: Current Oscillator Selection bits
111 = Internal Fast RC (FRC) Oscillator divided by OSCCON<FRCDIV> bits
110 = Internal Fast RC (FRC) Oscillator divided by 16
101 = Internal Low-Power RC (LPRC) Oscillator
100 = Secondary Oscillator (SOSC)
011 = Primary Oscillator (POSC) with PLL module (XTPLL, HSPLL or ECPLL)
010 = Primary Oscillator (POSC) (XT, HS or EC)
001 = Internal Fast RC Oscillator with PLL module via Postscaler (FRCPLL)
000 = Internal Fast RC (FRC) Oscillator
bit 11 Unimplemented: Read as ‘0
bit 10-8 NOSC<2:0>: New Oscillator Selection bits
111 = Internal Fast RC Oscillator (FRC) divided by OSCCON<FRCDIV> bits
110 = Internal Fast RC Oscillator (FRC) divided by 16
101 = Internal Low-Power RC (LPRC) Oscillator
100 = Secondary Oscillator (SOSC)
011 = Primary Oscillator with PLL module (XTPLL, HSPLL or ECPLL)
010 = Primary Oscillator (XT, HS or EC)
001 = Internal Fast Internal RC Oscillator with PLL module via Postscaler (FRCPLL)
000 = Internal Fast Internal RC Oscillator (FRC)
On Reset, these bits are set to the value of the FNOSC Configuration bits (DEVCFG1<2:0>).
bit 7 CLKLOCK: Clock Selection Lock Enable bit
If clock switching and monitoring is disabled (FCKSM<1:0> = 1x):
1 = Clock and PLL selections are locked
0 = Clock and PLL selections are not locked and may be modified
If clock switching and monitoring is enabled (FCKSM<1:0> = 0x):
Clock and PLL selections are never locked and may be modified.
bit 6 ULOCK: USB PLL Lock Status bit(1)
1 = Indicates that the USB PLL module is in lock or USB PLL module start-up timer is satisfied
0 = Indicates that the USB PLL module is out of lock or USB PLL module start-up timer is in progress or
USB PLL is disabled
bit 5 SLOCK: PLL Lock Status bit
1 = PLL module is in lock or PLL module start-up timer is satisfied
0 = PLL module is out of lock, PLL start-up timer is running or PLL is disabled
bit 4 SLPEN: Sleep Mode Enable bit
1 = Device will enter Sleep mode when a WAIT instruction is executed
0 = Device will enter Idle mode when a WAIT instruction is executed
REGISTER 8-1: OS CCON: OSCILLATOR CONTROL REGISTER
Note 1: This bit is available on PIC32MX2XX devices only.
Note: Writes to this register require an unlock sequence. Refer to Section 6. “Oscillator” (DS61112) in the
“PIC32 Family Reference Manual” for details.
2011-2012 Microchip Technology Inc. Preliminary DS61168E-page 97
PIC32MX1XX/2XX
bit 3 CF: Clock Fail Detect bit
1 = FSCM has detected a clock failure
0 = No clock failure has been detected
bit 2 UFRCEN: USB FRC Clock Enable bit(1)
1 = Enable FRC as the clock source for the USB clock source
0 = Use the Primary Oscillator or USB PLL as the USB clock source
bit 1 SOSCEN: Secondary Oscillator (SOSC) Enable bit
1 = Enable Secondary Oscillator
0 = Disable Secondary Oscillator
bit 0 OSWEN: Oscillator Switch Enable bit
1 = Initiate an oscillator switch to selection specified by NOSC<2:0> bits
0 = Oscillator switch is complete
REGISTER 8-1: OS CCON: OSCILLATOR CONTROL REGISTER
Note 1: This bit is available on PIC32MX2XX devices only.
Note: Writes to this register require an unlock sequence. Refer to Section 6. “Oscillator” (DS61112) in the
“PIC32 Family Reference Manual” for details.
PIC32MX1XX/2XX
DS61168E-page 98 Preliminary 2011-2012 Microchip Technology Inc.
REGISTER 8-2: OS CTUN: FRC TUN ING REGISTER
Bit
Range Bit
31/23/15/7 Bit
30/22/14/6 Bit
29/21/13/5 Bit
28/20/12/4 Bit
27/19/11/3 Bit
26/18/10/2 Bit
25/17/9/1 Bit
24/16/8/0
31:24 U-0 U-0 U-0 U-0 U-0 U-0 U-0 U-0
————————
23:16 U-0 R-0 U-0 U-0 U-0 U-0 U-0 U-0
————————
15:8 U-0 R-0 U-0 U-0 U-0 U-0 U-0 U-0
————————
7:0 U-0 U-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
TUN<5:0>(1)
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 31-6 Unimplemented: Read as ‘0
bit 5-0 TUN<5:0>: FRC Oscillator Tuning bits(1)
100000 = Center frequency -12.5%
100001 =
111111 =
000000 = Center frequency. Oscillator runs at minimal frequency (8 MHz)
000001 =
011110 =
011111 = Center frequency +12.5%
Note 1: OSCTUN functionality has been provided to help customers compensate for temperature effects on the
FRC frequency over a wide range of temperatures. The tuning step size is an approximation, and is neither
characterized, nor tested.
Note: Writes to this register require an unlock sequence. Refer to Section 6. “Oscillator” (DS61112) in the
“PIC32 Family Reference Manual” for details.
2011-2012 Microchip Technology Inc. Preliminary DS61168E-page 99
PIC32MX1XX/2XX
REGISTER 8-3: REFOCON: REFERENCE OSCILLATOR CONTROL REGISTER
Bit
Range Bit
31/23/15/7 Bit
30/22/14/6 Bit
29/21/13/5 Bit
28/20/12/4 Bit
27/19/11/3 Bit
26/18/10/2 Bit
25/17/9/1 Bit
24/16/8/0
31:24
U-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
RODIV<14:8>(3)
23:16
R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
RODIV<7:0>(3)
15:8
R/W-0 U-0 R/W-0 R/W-0 R/W-0 U-0 R/W-0, HC R-0, HS, HC
ON —SIDLOE
RSLP(2) DIVSWEN ACTIVE
7:0
U-0 U-0 U-0 U-0 R/W-0 R/W-0 R/W-0 R/W-0
ROSEL<3:0>(1)
Legend: HC = Hardware Clearable HS = Hardware Settable
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 31 Unimplemented: Read as ‘0
bit 30-16 RODIV<14:0> Reference Clock Divider bits(1)
The value selects the reference clock divider bits. See Figure 8-1 for information.
bit 15 ON: Output Enable bit
1 = Reference Oscillator Module enabled
0 = Reference Oscillator Module disabled
bit 14 Unimplemented: Read as ‘0
bit 13 SIDL: Peripheral Stop in Idle Mode bit
1 = Discontinue module operation when device enters Idle mode
0 = Continue module operation in Idle mode
bit 12 OE: Reference Clock Output Enable bit
1 = Reference clock is driven out on REFCLKO pin
0 = Reference clock is not driven out on REFCLKO pin
bit 11 RSLP: Reference Oscillator Module Run in Sleep bit(2)
1 = Reference Oscillator Module output continues to run in Sleep
0 = Reference Oscillator Module output is disabled in Sleep
bit 10 Unimplemented: Read as ‘0
bit 9 DIVSWEN: Divider Switch Enable bit
1 = Divider switch is in progress
0 = Divider switch is complete
bit 8 ACTIVE: Reference Clock Request Status bit
1 = Reference clock request is active
0 = Reference clock request is not active
bit 7-4 Unimplemented: Read as ‘0
Note 1: The ROSEL and RODIV bits should not be written while the ACTIVE bit is ‘1’, as undefined behavior may
result.
2: This bit is ignored when the ROSEL<3:0> bits = 0000 or 0001.
3: While the ON bit is set to ‘1’, writes to these bits do not take effect until the DIVSWEN bit is also set to ’1’.
PIC32MX1XX/2XX
DS61168E-page 100 Preliminary 2011-2012 Microchip Technology Inc.
bit 3-0 ROSEL<3:0>: Reference Clock Source Select bits(1)
1111 = Reserved; do not use
1001 = Reserved; do not use
1000 = REFCLKI
0111 = System PLL output
0110 = USB PLL output
0101 =S
OSC
0100 =LPRC
0011 =FRC
0010 =P
OSC
0001 = PBCLK
0000 = SYSCLK
REGISTER 8-3: REFOCON: REFERENCE OSCILLATOR CONTROL REGISTER
Note 1: The ROSEL and RODIV bits should not be written while the ACTIVE bit is ‘1’, as undefined behavior may
result.
2: This bit is ignored when the ROSEL<3:0> bits = 0000 or 0001.
3: While the ON bit is set to ‘1’, writes to these bits do not take effect until the DIVSWEN bit is also set to ’1’.
2011-2012 Microchip Technology Inc. Preliminary DS61168E-page 101
PIC32MX1XX/2XX
REGISTER 8-4: REFOTR IM: REFERE NCE OSCILLATOR TRIM REGISTER
Bit
Range Bit
31/23/15/7 Bit
30/22/14/6 Bit
29/21/13/5 Bit
28/20/12/4 Bit
27/19/11/3 Bit
26/18/10/2 Bit
25/17/9/1 Bit
24/16/8/0
31:24 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
ROTRIM<8:1>
23:16 R/W-0 R-0 U-0 U-0 U-0 U-0 U-0 U-0
ROTRIM<0> ———————
15:8 U-0 R-0 U-0 U-0 U-0 U-0 U-0 U-0
7:0 U-0 U-0 U-0 U-0 U-0 U-0 U-0 U-0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 31-23 ROTRIM<8:0>: Reference Oscillator Trim bits
111111111 = 511/512 divisor added to RODIV value
111111110 = 510/512 divisor added to RODIV value
100000000 = 256/512 divisor added to RODIV value
000000010 = 2/512 divisor added to RODIV value
000000001 = 1/512 divisor added to RODIV value
000000000 = 0/512 divisor added to RODIV value
bit 22-0 Unimplemented: Read as ‘0
Note: While the ON bit (REFOCON<15>) is ‘1’, writes to this register do not take effect until the DIVSWEN bit is
also set to ‘1’.
PIC32MX1XX/2XX
DS61168E-page 102 Preliminary 2011-2012 Microchip Technology Inc.
NOTES:
2011-2012 Microchip Technology Inc. Preliminary DS61168E-page 103
PIC32MX1XX/2XX
9.0 DIRECT MEMORY ACCESS
(DMA) CONTROLLER
The PIC32 Direct Memory Access (DMA) controller is a
bus master module useful for data transfers between
different devices without CPU intervention. The source
and destination of a DMA transfer can be any of the
memory mapped modules existent in the PIC32 (such
as Peripheral Bus (PBUS) devices: SPI, UART, PMP,
etc.) or memory itself.
Following are some of the key features of the DMA
controller module:
Four identical channels, each featuring:
- Auto-increment source and destination
address registers
- Source and destination pointers
- Memory to memory and memory to
peripheral transfers
Automatic word-size detection:
- Transfer granularity, down to byte level
- Bytes need not be word-aligned at source
and destination
Fixed priority channel arbitration
Flexible DMA channel operating modes:
- Manual (software) or automatic (interrupt)
DMA requests
- One-Shot or Auto-Repeat Block Transfer
modes
- Channel-to-channel chaining
Flexible DMA requests:
- A DMA request can be selected from any of
the peripheral interrupt sources
- Each channel can select any (appropriate)
observable interrupt as its DMA request
source
- A DMA transfer abort can be selected from
any of the peripheral interrupt sources
- Pattern (data) match transfer termination
Multiple DMA channel status interrupts:
- DMA channel block transfer complete
- Source empty or half empty
- Destination full or half full
- DMA transfer aborted due to an external
event
- Invalid DMA address generated
DMA debug support features:
- Most recent address accessed by a DMA
channel
- Most recent DMA channel to transfer data
CRC Generation module:
- CRC module can be assigned to any of the
available channels
- CRC module is highly configurable
FIGURE 9-1: DMA BLOCK DIAGRAM
Note 1: This data sheet summarizes the features
of the PIC32MX1XX/2XX family of
devices. It is not intended to be a
comprehensive reference source. To
complement the information in this data
sheet, refer to Section 31. “Direct
Memory Access (DMA) Controller”
(DS61117) in the “PIC32 Family
Reference Manual”, which is available
from the Microchip web site
(www.microchip.com/PIC32).
2: Some registers and associated bits
described in this section may not be
available on all devices. Refer to
Section 4.0 “Memory Organization” in
this data sheet for device-specific register
and bit information.
Address Decoder Channel 0 Control
Channel 1 Control
Channel n Control
Global Control
(DMACON)
Bus Interface
Channel Priority
Arbitration
SEL
SEL
Y
I0
I1
I2
In
System IRQINT Controller
Device Bus + Bus Arbitration
Peripheral Bus
PIC32MX1XX/2XX
DS61168E-page 104 Preliminary 2011-2012 Microchip Technology Inc.
REGISTER 9-1: DMACON: DMA CONTROLLER CONTROL REGISTER
Bit
Range Bit
31/23/15/7 Bit
30/22/14/6 Bit
29/21/13/5 Bit
28/20/12/4 Bit
27/19/11/3 Bit
26/18/10/2 Bit
25/17/9/1 Bit
24/16/8/0
31:24 U-0 U-0 U-0 U-0 U-0 U-0 U-0 U-0
23:16 U-0 U-0 U-0 U-0 U-0 U-0 U-0 U-0
15:8 R/W-0 U-0 U-0 R/W-0 R/W-0 U-0 U-0 U-0
ON(1) SUSPEND DMABUSY
7:0 U-0 U-0 U-0 U-0 U-0 U-0 U-0 U-0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 31-16 Unimplemented: Read as ‘0
bit 15 ON: DMA On bit(1)
1 = DMA module is enabled
0 = DMA module is disabled
bit 14-13 Unimplemented: Read as ‘0
bit 12 SUSPEND: DMA Suspend bit
1 = DMA transfers are suspended to allow CPU uninterrupted access to data bus
0 = DMA operates normally
bit 11 DMABUSY: DMA Module Busy bit
1 = DMA module is active
0 = DMA module is disabled and not actively transferring data
bit 10-0 Unimplemented: Read as ‘0
Note 1: When using 1:1 PBCLK divisor, the user’s software should not read/write the peripheral’s SFRs in the
SYSCLK cycle immediately following the instruction that clears the module’s ON bit.
2011-2012 Microchip Technology Inc. Preliminary DS61168E-page 105
PIC32MX1XX/2XX
REGISTER 9-2: DMASTAT: DMA STATUS REGISTER
Bit
Range Bit
31/23/15/7 Bit
30/22/14/6 Bit
29/21/13/5 Bit
28/20/12/4 Bit
27/19/11/3 Bit
26/18/10/2 Bit
25/17/9/1 Bit
24/16/8/0
31:24 U-0 U-0 U-0 U-0 U-0 U-0 U-0 U-0
23:16 U-0 U-0 U-0 U-0 U-0 U-0 U-0 U-0
15:8 U-0 U-0 U-0 U-0 U-0 U-0 U-0 U-0
7:0 U-0 U-0 U-0 U-0 R-0 R-0 R-0 R-0
RDWR DMACH<2:0>
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 31-4 Unimplemented: Read as ‘0
bit 3 RDWR: Read/Write Status bit
1 = Last DMA bus access was a read
0 = Last DMA bus access was a write
bit 2-0 DMACH<2:0>: DMA Channel bits
These bits contain the value of the most recent active DMA channel.
REGISTER 9-3: DMAAD DR: DMA ADDRESS REGISTER
Bit
Range Bit
31/23/15/7 Bit
30/22/14/6 Bit
29/21/13/5 Bit
28/20/12/4 Bit
27/19/11/3 Bit
26/18/10/2 Bit
25/17/9/1 Bit
24/16/8/0
31:24 R-0 R-0 R-0 R-0 R-0 R-0 R-0 R-0
DMAADDR<31:24>
23:16 R-0 R-0 R-0 R-0 R-0 R-0 R-0 R-0
DMAADDR<23:16>
15:8 R-0 R-0 R-0 R-0 R-0 R-0 R-0 R-0
DMAADDR<15:8>
7:0 R-0 R-0 R-0 R-0 R-0 R-0 R-0 R-0
DMAADDR<7:0>
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 31-0 DMAADDR<31:0>: DMA Module Address bits
These bits contain the address of the most recent DMA access.
PIC32MX1XX/2XX
DS61168E-page 106 Preliminary 2011-2012 Microchip Technology Inc.
REGISTER 9-4: DCR CCON: DMA CRC CON TROL REGISTER
Bit
Range Bit
31/23/15/7 Bit
30/22/14/6 Bit
29/21/13/5 Bit
28/20/12/4 Bit
27/19/11/3 Bit
26/18/10/2 Bit
25/17/9/1 Bit
24/16/8/0
31:24 U-0 U-0 R/W-0 R/W-0 R/W-0 U-0 U-0 R/W-0
—BYTO<1:0>WBO
(1) —BITO
23:16 U-0 U-0 U-0 U-0 U-0 U-0 U-0 U-0
15:8 U-0 U-0 U-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
PLEN<4:0>
7:0 R/W-0 R/W-0 R/W-0 U-0 U-0 R/W-0 R/W-0 R/W-0
CRCEN CRCAPP(1) CRCTYP CRCCH<2:0>
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 31-30 Unimplemented: Read as ‘0
bit 29-28 BYTO<1:0>: CRC Byte Order Selection bits
11 = Endian byte swap on half-word boundaries (i.e., source half-word order with reverse source byte order
per half-word)
10 = Swap half-words on word boundaries (i.e., reverse source half-word order with source byte order per
half-word)
01 = Endian byte swap on word boundaries (i.e., reverse source byte order)
00 = No swapping (i.e., source byte order)
bit 27 WBO: CRC Write Byte Order Selection bit(1)
1 = Source data is written to the destination re-ordered as defined by BYTO<1:0>
0 = Source data is written to the destination unaltered
bit 26-25 Unimplemented: Read as ‘0
bit 24 BITO: CRC Bit Order Selection bit
When CRCTYP (DCRCCON<15>) = 1 (CRC module is in IP Header mode):
1 = The IP header checksum is calculated Least Significant bit (LSb) first (i.e., reflected)
0 = The IP header checksum is calculated Most Significant bit (MSb) first (i.e., not reflected)
When CRCTYP (DCRCCON<15>) = 0 (CRC module is in LFSR mode):
1 = The LFSR CRC is calculated Least Significant bit first (i.e., reflected)
0 = The LFSR CRC is calculated Most Significant bit first (i.e., not reflected)
bit 23-13 Unimplemented: Read as ‘0
bit 12-8 PLEN<4:0>: Polynomial Length bits
When CRCTYP (DCRCCON<15>) = 1 (CRC module is in IP Header mode):
These bits are unused.
When CRCTYP (DCRCCON<15>) = 0 (CRC module is in LFSR mode):
Denotes the length of the polynomial – 1.
bit 7 CRCEN: CRC Enable bit
1 = CRC module is enabled and channel transfers are routed through the CRC module
0 = CRC module is disabled and channel transfers proceed normally
Note 1: When WBO = 1, unaligned transfers are not supported and the CRCAPP bit cannot be set.
2011-2012 Microchip Technology Inc. Preliminary DS61168E-page 107
PIC32MX1XX/2XX
bit 6 CRCAPP: CRC Append Mode bit(1)
1 = The DMA transfers data from the source into the CRC but NOT to the destination. When a block transfer
completes the DMA writes the calculated CRC value to the location given by CHxDSA
0 = The DMA transfers data from the source through the CRC obeying WBO as it writes the data to the
destination
bit 5 CRCTYP: CRC Type Selection bit
1 = The CRC module will calculate an IP header checksum
0 = The CRC module will calculate a LFSR CRC
bit 4-3 Unimplemented: Read as ‘0
bit 2-0 CRCCH<2:0>: CRC Channel Select bits
111 = CRC is assigned to Channel 7
110 = CRC is assigned to Channel 6
101 = CRC is assigned to Channel 5
100 = CRC is assigned to Channel 4
011 = CRC is assigned to Channel 3
010 = CRC is assigned to Channel 2
001 = CRC is assigned to Channel 1
000 = CRC is assigned to Channel 0
REGISTER 9-4: DCRCCON: DMA CRC CONTROL REGISTER (CONTINUED)
Note 1: When WBO = 1, unaligned transfers are not supported and the CRCAPP bit cannot be set.
PIC32MX1XX/2XX
DS61168E-page 108 Preliminary 2011-2012 Microchip Technology Inc.
REGISTER 9-5: DCR CDATA: DMA CRC DATA REGISTER
Bit
Range Bit
31/23/15/7 Bit
30/22/14/6 Bit
29/21/13/5 Bit
28/20/12/4 Bit
27/19/11/3 Bit
26/18/10/2 Bit
25/17/9/1 Bit
24/16/8/0
31:24 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
DCRCDATA<31:24>
23:16 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
DCRCDATA<23:16>
15:8 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
DCRCDATA<15:8>
7:0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
DCRCDATA<7:0>
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 31-0 DCRCDATA<31:0>: CRC Data Register bits
Writing to this register will seed the CRC generator. Reading from this register will return the current value of
the CRC. Bits greater than PLEN will return ‘0’ on any read.
When CRCTYP (DCRCCON<15>) = 1 (CRC module is in IP Header mode):
Only the lower 16 bits contain IP header checksum information. The upper 16 bits are always ‘0’. Data written
to this register is converted and read back in 1’s complement form (i.e., current IP header checksum value).
When CRCTYP (DCRCCON<15>) = 0 (CRC module is in LFSR mode):
Bits greater than PLEN will return ‘0’ on any read.
REGISTER 9-6: DCR CXOR: DMA CRCXOR ENABLE REGISTER
Bit
Range Bit
31/23/15/7 Bit
30/22/14/6 Bit
29/21/13/5 Bit
28/20/12/4 Bit
27/19/11/3 Bit
26/18/10/2 Bit
25/17/9/1 Bit
24/16/8/0
31:24 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
DCRCXOR<31:24>
23:16 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
DCRCXOR<23:16>
15:8 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
DCRCXOR<15:8>
7:0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
DCRCXOR<7:0>
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 31-0 DCRCXOR<31:0>: CRC XOR Register bits
When CRCTYP (DCRCCON<15>) = 1 (CRC module is in IP Header mode):
This register is unused.
When CRCTYP (DCRCCON<15>) = 0 (CRC module is in LFSR mode):
1 = Enable the XOR input to the Shift register
0 = Disable the XOR input to the Shift register; data is shifted in directly from the previous stage in
the register
2011-2012 Microchip Technology Inc. Preliminary DS61168E-page 109
PIC32MX1XX/2XX
REGISTER 9-7: DCHxCON: DMA CHANNEL ‘x’ CONTROL REGISTER
Bit
Range Bit
31/23/15/7 Bit
30/22/14/6 Bit
29/21/13/5 Bit
28/20/12/4 Bit
27/19/11/3 Bit
26/18/10/2 Bit
25/17/9/1 Bit
24/16/8/0
31:24 U-0 U-0 U-0 U-0 U-0 U-0 U-0 U-0
23:16 U-0 U-0 U-0 U-0 U-0 U-0 U-0 U-0
15:8 R/W-0 U-0 U-0 U-0 U-0 U-0 U-0 R/W-0
CHBUSY CHCHNS(1)
7:0 R/W-0 R/W-0 R/W-0 R/W-0 U-0 R-0 R/W-0 R/W-0
CHEN(2) CHAED CHCHN CHAEN CHEDET CHPRI<1:0>
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 31-16 Unimplemented: Read as ‘0
bit 15 CHBUSY: Channel Busy bit
1 = Channel is active or has been enabled
0 = Channel is inactive or has been disabled
bit 14-9 Unimplemented: Read as ‘0
bit 8 CHCHNS: Chain Channel Selection bit(1)
1 = Chain to channel lower in natural priority (CH1 will be enabled by CH2 transfer complete)
0 = Chain to channel higher in natural priority (CH1 will be enabled by CH0 transfer complete)
bit 7 CHEN: Channel Enable bit(2)
1 = Channel is enabled
0 = Channel is disabled
bit 6 CHAED: Channel Allow Events If Disabled bit
1 = Channel start/abort events will be registered, even if the channel is disabled
0 = Channel start/abort events will be ignored if the channel is disabled
bit CHCHN: Channel Chain Enable bit
1 = Allow channel to be chained
0 = Do not allow channel to be chained
bit 4 CHAEN: Channel Automatic Enable bit
1 = Channel is continuously enabled, and not automatically disabled after a block transfer is complete
0 = Channel is disabled on block transfer complete
bit 3 Unimplemented: Read as ‘0
bit 2 CHEDET: Channel Event Detected bit
1 = An event has been detected
0 = No events have been detected
bit 1-0 CHPRI<1:0>: Channel Priority bits
11 = Channel has priority 3 (highest)
10 = Channel has priority 2
01 = Channel has priority 1
00 = Channel has priority 0
Note 1: The chain selection bit takes effect when chaining is enabled (i.e., CHCHN = 1).
2: When the channel is suspended by clearing this bit, the user application should poll the CHBUSY bit (if
available on the device variant) to see when the channel is suspended, as it may take some clock cycles
to complete a current transaction before the channel is suspended.
PIC32MX1XX/2XX
DS61168E-page 110 Preliminary 2011-2012 Microchip Technology Inc.
REGISTER 9-8: DCHxECON: DMA CHANNEL ‘x’ EVENT CONTROL REGISTER
Bit
Range Bit
31/23/15/7 Bit
30/22/14/6 Bit
29/21/13/5 Bit
28/20/12/4 Bit
27/19/11/3 Bit
26/18/10/2 Bit
25/17/9/1 Bit
24/16/8/0
31:24 U-0 U-0 U-0 U-0 U-0 U-0 U-0 U-0
23:16 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1
CHAIRQ<7:0>(1)
15:8 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1
CHSIRQ<7:0>(1)
7:0 S-0 S-0 R/W-0 R/W-0 R/W-0 U-0 U-0 U-0
CFORCE CABORT PATEN SIRQEN AIRQEN
Legend: S = Settable bit
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 31-24 Unimplemented: Read as ‘0
bit 23-16 CHAIRQ<7:0>: Channel Transfer Abort IRQ bits(1)
11111111 = Interrupt 255 will abort any transfers in progress and set CHAIF flag
00000001 = Interrupt 1 will abort any transfers in progress and set CHAIF flag
00000000 = Interrupt 0 will abort any transfers in progress and set CHAIF flag
bit 15-8 CHSIRQ<7:0>: Channel Transfer Start IRQ bits(1)
11111111 = Interrupt 255 will initiate a DMA transfer
00000001 = Interrupt 1 will initiate a DMA transfer
00000000 = Interrupt 0 will initiate a DMA transfer
bit 7 CFORCE: DMA Forced Transfer bit
1 = A DMA transfer is forced to begin when this bit is written to a ‘1
0 = This bit always reads ‘0
bit 6 CABORT: DMA Abort Transfer bit
1 = A DMA transfer is aborted when this bit is written to a ‘1
0 = This bit always reads ‘0
bit 5 PATEN: Channel Pattern Match Abort Enable bit
1 = Abort transfer and clear CHEN on pattern match
0 = Pattern match is disabled
bit 4 SIRQEN: Channel Start IRQ Enable bit
1 = Start channel cell transfer if an interrupt matching CHSIRQ occurs
0 = Interrupt number CHSIRQ is ignored and does not start a transfer
bit 3 AIRQEN: Channel Abort IRQ Enable bit
1 = Channel transfer is aborted if an interrupt matching CHAIRQ occurs
0 = Interrupt number CHAIRQ is ignored and does not terminate a transfer
bit 2-0 Unimplemented: Read as ‘0
Note 1: See Table 7-1: “Interrupt IRQ, Vector and Bit Location” for the list of available interrupt IRQ sources.
2011-2012 Microchip Technology Inc. Preliminary DS61168E-page 111
PIC32MX1XX/2XX
REGISTER 9-9: DCH xINT: DMA CHANNEL ‘x’ INTERRUPT CONTROL REGISTER
Bit
Range Bit
31/23/15/7 Bit
30/22/14/6 Bit
29/21/13/5 Bit
28/20/12/4 Bit
27/19/11/3 Bit
26/18/10/2 Bit
25/17/9/1 Bit
24/16/8/0
31:24 U-0 U-0 U-0 U-0 U-0 U-0 U-0 U-0
23:16 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
CHSDIE CHSHIE CHDDIE CHDHIE CHBCIE CHCCIE CHTAIE CHERIE
15:8 U-0 U-0 U-0 U-0 U-0 U-0 U-0 U-0
7:0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
CHSDIF CHSHIF CHDDIF CHDHIF CHBCIF CHCCIF CHTAIF CHERIF
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 31-24 Unimplemented: Read as ‘0
bit 23 CHSDIE: Channel Source Done Interrupt Enable bit
1 = Interrupt is enabled
0 = Interrupt is disabled
bit 22 CHSHIE: Channel Source Half Empty Interrupt Enable bit
1 = Interrupt is enabled
0 = Interrupt is disabled
bit 21 CHDDIE: Channel Destination Done Interrupt Enable bit
1 = Interrupt is enabled
0 = Interrupt is disabled
bit 20 CHDHIE: Channel Destination Half Full Interrupt Enable bit
1 = Interrupt is enabled
0 = Interrupt is disabled
bit 19 CHBCIE: Channel Block Transfer Complete Interrupt Enable bit
1 = Interrupt is enabled
0 = Interrupt is disabled
bit 18 CHCCIE: Channel Cell Transfer Complete Interrupt Enable bit
1 = Interrupt is enabled
0 = Interrupt is disabled
bit 17 CHTAIE: Channel Transfer Abort Interrupt Enable bit
1 = Interrupt is enabled
0 = Interrupt is disabled
bit 16 CHERIE: Channel Address Error Interrupt Enable bit
1 = Interrupt is enabled
0 = Interrupt is disabled
bit 15-8 Unimplemented: Read as ‘0
bit 7 CHSDIF: Channel Source Done Interrupt Flag bit
1 = Channel Source Pointer has reached end of source (CHSPTR = CHSSIZ)
0 = No interrupt is pending
bit 6 CHSHIF: Channel Source Half Empty Interrupt Flag bit
1 = Channel Source Pointer has reached midpoint of source (CHSPTR = CHSSIZ/2)
0 = No interrupt is pending
bit 5 CHDDIF: Channel Destination Done Interrupt Flag bit
1 = Channel Destination Pointer has reached end of destination (CHDPTR = CHDSIZ)
0 = No interrupt is pending
PIC32MX1XX/2XX
DS61168E-page 112 Preliminary 2011-2012 Microchip Technology Inc.
bit 4 CHDHIF: Channel Destination Half Full Interrupt Flag bit
1 = Channel Destination Pointer has reached midpoint of destination (CHDPTR = CHDSIZ/2)
0 = No interrupt is pending
bit 3 CHBCIF: Channel Block Transfer Complete Interrupt Flag bit
1 = A block transfer has been completed (the larger of CHSSIZ/CHDSIZ bytes has been transferred), or a
pattern match event occurs
0 = No interrupt is pending
bit 2 CHCCIF: Channel Cell Transfer Complete Interrupt Flag bit
1 = A cell transfer has been completed (CHCSIZ bytes have been transferred)
0 = No interrupt is pending
bit 1 CHTAIF: Channel Transfer Abort Interrupt Flag bit
1 = An interrupt matching CHAIRQ has been detected and the DMA transfer has been aborted
0 = No interrupt is pending
bit 0 CHERIF: Channel Address Error Interrupt Flag bit
1 = A channel address error has been detected
Either the source or the destination address is invalid.
0 = No interrupt is pending
REGISTER 9-9: DCH xINT: DMA CHANNEL ‘x’ INTERRUPT CONTROL REGISTER (CONTINUED)
2011-2012 Microchip Technology Inc. Preliminary DS61168E-page 113
PIC32MX1XX/2XX
REGISTER 9-10: DCHxSSA: DMA CHANNEL ‘x’ SOURCE START ADDRESS REGISTER
Bit Range Bit
31/23/15/7 Bit
30/22/14/6 Bit
29/21/13/5 Bit
28/20/12/4 Bit
27/19/11/3 Bit
26/18/10/2 Bit
25/17/9/1 Bit
24/16/8/0
31:24 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
CHSSA<31:24>
23:16 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
CHSSA<23:16>
15:8 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
CHSSA<15:8>
7:0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
CHSSA<7:0>
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 31-0 CHSSA<31:0> Channel Source Start Address bits
Channel source start address.
Note: This must be the physical address of the source.
REGISTER 9-11: DCHxDSA: DMA CHANNEL ‘x’ DESTINATION START ADDRESS REGISTER
Bit
Range Bit
31/23/15/7 Bit
30/22/14/6 Bit
29/21/13/5 Bit
28/20/12/4 Bit
27/19/11/3 Bit
26/18/10/2 Bit
25/17/9/1 Bit
24/16/8/0
31:24 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
CHDSA<31:24>
23:16 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
CHDSA<23:16>
15:8 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
CHDSA<15:8>
7:0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
CHDSA<7:0>
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 31-0 CHDSA<31:0>: Channel Destination Start Address bits
Channel destination start address.
Note: This must be the physical address of the destination.
PIC32MX1XX/2XX
DS61168E-page 114 Preliminary 2011-2012 Microchip Technology Inc.
REGISTER 9-12: DCHxSSIZ: DMA CHANNEL ‘x’ SOURCE SIZE REGISTER
Bit
Range Bit
31/23/15/7 Bit
30/22/14/6 Bit
29/21/13/5 Bit
28/20/12/4 Bit
27/19/11/3 Bit
26/18/10/2 Bit
25/17/9/1 Bit
24/16/8/0
31:24 U-0 U-0 U-0 U-0 U-0 U-0 U-0 U-0
23:16 U-0 U-0 U-0 U-0 U-0 U-0 U-0 U-0
15:8 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
CHSSIZ<15:8>
7:0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
CHSSIZ<7:0>
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 31-16 Unimplemented: Read as ‘0
bit 15-0 CHSSIZ<15:0>: Channel Source Size bits
1111111111111111 = 65,535 byte source size
0000000000000010 = 2 byte source size
0000000000000001 = 1 byte source size
0000000000000000 = 65,536 byte source size
REGISTER 9-13: DCHxDSIZ: DMA CHANNEL ‘x’ DESTINATION SIZE REGI STE R
Bit
Range Bit
31/23/15/7 Bit
30/22/14/6 Bit
29/21/13/5 Bit
28/20/12/4 Bit
27/19/11/3 Bit
26/18/10/2 Bit
25/17/9/1 Bit
24/16/8/0
31:24 U-0 U-0 U-0 U-0 U-0 U-0 U-0 U-0
23:16 U-0 U-0 U-0 U-0 U-0 U-0 U-0 U-0
15:8 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
CHDSIZ<15:8>
7:0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
CHDSIZ<7:0>
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 31-16 Unimplemented: Read as ‘0
bit 15-0 CHDSIZ<15:0>: Channel Destination Size bits
1111111111111111 = 65,535 byte destination size
0000000000000010 = 2 byte destination size
0000000000000001 = 1 byte destination size
0000000000000000 = 65,536 byte destination size
2011-2012 Microchip Technology Inc. Preliminary DS61168E-page 115
PIC32MX1XX/2XX
REGISTER 9-14: DCHxSPTR: DMA CHANNEL ‘x’ SOURCE POINTER REGISTER
Bit
Range Bit
31/23/15/7 Bit
30/22/14/6 Bit
29/21/13/5 Bit
28/20/12/4 Bit
27/19/11/3 Bit
26/18/10/2 Bit
25/17/9/1 Bit
24/16/8/0
31:24 U-0 U-0 U-0 U-0 U-0 U-0 U-0 U-0
23:16 U-0 U-0 U-0 U-0 U-0 U-0 U-0 U-0
15:8 R-0 R-0 R-0 R-0 R-0 R-0 R-0 R-0
CHSPTR<15:8>
7:0 R-0 R-0 R-0 R-0 R-0 R-0 R-0 R-0
CHSPTR<7:0>
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 31-16 Unimplemented: Read as ‘0
bit 15-0 CHSPTR<15:0>: Channel Source Pointer bits
1111111111111111 = Points to byte 65,535 of the source
0000000000000001 = Points to byte 1 of the source
0000000000000000 = Points to byte 0 of the source
Note: When in Pattern Detect mode, this register is reset on a pattern detect.
REGISTER 9-15: DCHxDPTR: DMA CHANNEL ‘x’ DESTINATION POINTER REGISTER
Bit
Range Bit
31/23/15/7 Bit
30/22/14/6 Bit
29/21/13/5 Bit
28/20/12/4 Bit
27/19/11/3 Bit
26/18/10/2 Bit
25/17/9/1 Bit
24/16/8/0
31:24 U-0 U-0 U-0 U-0 U-0 U-0 U-0 U-0
23:16 U-0 U-0 U-0 U-0 U-0 U-0 U-0 U-0
15:8 R-0 R-0 R-0 R-0 R-0 R-0 R-0 R-0
CHDPTR<15:8>
7:0 R-0 R-0 R-0 R-0 R-0 R-0 R-0 R-0
CHDPTR<7:0>
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 31-16 Unimplemented: Read as ‘0
bit 15-0 CHDPTR<15:0>: Channel Destination Pointer bits
1111111111111111 = Points to byte 65,535 of the destination
0000000000000001 = Points to byte 1 of the destination
0000000000000000 = Points to byte 0 of the destination
PIC32MX1XX/2XX
DS61168E-page 116 Preliminary 2011-2012 Microchip Technology Inc.
REGISTER 9-16: DCHxCSIZ: DMA CHANNEL ‘x’ CELL-SIZE REGISTER
Bit
Range Bit
31/23/15/7 Bit
30/22/14/6 Bit
29/21/13/5 Bit
28/20/12/4 Bit
27/19/11/3 Bit
26/18/10/2 Bit
25/17/9/1 Bit
24/16/8/0
31:24 U-0 U-0 U-0 U-0 U-0 U-0 U-0 U-0
23:16 U-0 U-0 U-0 U-0 U-0 U-0 U-0 U-0
15:8 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
CHCSIZ<15:8>
7:0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
CHCSIZ<7:0>
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 31-16 Unimplemented: Read as ‘0
bit 15-0 CHCSIZ<15:0>: Channel Cell-Size bits
1111111111111111 = 65,535 bytes transferred on an event
0000000000000010 = 2 bytes transferred on an event
0000000000000001= 1 byte transferred on an event
0000000000000000 = 65,536 bytes transferred on an event
REGISTER 9-17: DCHxCPTR: DMA CHANNEL ‘x’ CELL POINTER REGISTER
Bit
Range Bit
31/23/15/7 Bit
30/22/14/6 Bit
29/21/13/5 Bit
28/20/12/4 Bit
27/19/11/3 Bit
26/18/10/2 Bit
25/17/9/1 Bit
24/16/8/0
31:24 U-0 U-0 U-0 U-0 U-0 U-0 U-0 U-0
23:16 U-0 U-0 U-0 U-0 U-0 U-0 U-0 U-0
15:8 R-0 R-0 R-0 R-0 R-0 R-0 R-0 R-0
CHCPTR<15:8>
7:0 R-0 R-0 R-0 R-0 R-0 R-0 R-0 R-0
CHCPTR<7:0>
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 31-16 Unimplemented: Read as ‘0
bit 15-0 CHCPTR<7:0>: Channel Cell Progress Pointer bits
1111111111111111 = 65,535 bytes have been transferred since the last event
0000000000000001 = 1 byte has been transferred since the last event
0000000000000000 = 0 bytes have been transferred since the last event
Note: When in Pattern Detect mode, this register is reset on a pattern detect.
2011-2012 Microchip Technology Inc. Preliminary DS61168E-page 117
PIC32MX1XX/2XX
REGISTER 9-18: DCHxDAT: DMA CHANNEL ‘x’ PATTERN DATA REGISTER
Bit
Range Bit
31/23/15/7 Bit
30/22/14/6 Bit
29/21/13/5 Bit
28/20/12/4 Bit
27/19/11/3 Bit
26/18/10/2 Bit
25/17/9/1 Bit
24/16/8/0
31:24 U-0 U-0 U-0 U-0 U-0 U-0 U-0 U-0
23:16 U-0 U-0 U-0 U-0 U-0 U-0 U-0 U-0
15:8 U-0 U-0 U-0 U-0 U-0 U-0 U-0 U-0
7:0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
CHPDAT<7:0>
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 31-8 Unimplemented: Read as ‘0
bit 7-0 CHPDAT<7:0>: Channel Data Register bits
Pattern Terminate mode:
Data to be matched must be stored in this register to allow terminate on match.
All other modes:
Unused.
PIC32MX1XX/2XX
DS61168E-page 118 Preliminary 2011-2012 Microchip Technology Inc.
NOTES:
2011-2012 Microchip Technology Inc. Preliminary DS61168E-page 119
PIC32MX1XX/2XX
10.0 USB ON-THE-GO (OTG)
The Universal Serial Bus (USB) module contains
analog and digital components to provide a USB 2.0
full-speed and low-speed embedded host, full-speed
device or OTG implementation with a minimum of
external components. This module in Host mode is
intended for use as an embedded host and therefore
does not implement a UHCI or OHCI controller.
The USB module consists of the clock generator, the
USB voltage comparators, the transceiver, the Serial
Interface Engine (SIE), a dedicated USB DMA control-
ler, pull-up and pull-down resistors, and the register
interface. A block diagram of the PIC32 USB OTG
module is presented in Figure 10-1.
The clock generator provides the 48 MHz clock
required for USB full-speed and low-speed communi-
cation. The voltage comparators monitor the voltage on
the VBUS pin to determine the state of the bus. The
transceiver provides the analog translation between
the USB bus and the digital logic. The SIE is a state
machine that transfers data to and from the endpoint
buffers and generates the hardware protocol for data
transfers. The USB DMA controller transfers data
between the data buffers in RAM and the SIE. The inte-
grated pull-up and pull-down resistors eliminate the
need for external signaling components. The register
interface allows the CPU to configure and
communicate with the module.
The PIC32 USB module includes the following
features:
USB Full-speed support for host and device
Low-speed host support
USB OTG support
Integrated signaling resistors
Integrated analog comparators for VBUS
monitoring
Integrated USB transceiver
Transaction handshaking performed by hardware
Endpoint buffering anywhere in system RAM
Integrated DMA to access system RAM and Flash
Note 1: This data sheet summarizes the features
of the PIC32MX1XX/2XX family of
devices. It is not intended to be a
comprehensive reference source. To
complement the information in this data
sheet, refer to Section 27. “USB On-
The-Go (OTG)” (DS61126) in the “PIC32
Family Reference Manual”, which is
available from the Microchip web site
(www.microchip.com/PIC32).
2: Some registers and associated bits
described in this section may not be
available on all devices. Refer to
Section 4.0 “Memory Organization” in
this data sheet for device-specific register
and bit information.
Note: The implementation and use of the USB
specifications, as well as other third party
specifications or technologies, may
require licensing; including, but not limited
to, USB Implementers Forum, Inc., also
referred to as USB-IF (www.usb.org). The
user is fully responsible for investigating
and satisfying any applicable licensing
obligations.
PIC32MX1XX/2XX
DS61168E-page 120 Preliminary 2011-2012 Microchip Technology Inc.
FIGURE 10-1: PIC32MX1XX/2XX FAMILY USB INTERFACE DIAGRAM
OSC1
OSC2
Primary Oscillator
8MHzTypical
FRC
Oscillator
TUN<5:0>(3)
PLL
48 MHz USB Clock(6)
Div x
UPLLEN(5) UFRCEN(2)
(POSC)
UPLLIDIV(5)
UFIN(4)
Div 2
VUSB3V3
D+(1)
D-(1)
ID(1)
Bus
Transceiver
SIE
VBUSON(1)
Comparators
USB
SRP Charge
SRP Discharge
Registers
and
Control
Interface
Transceiver Power 3.3V
USB Module
Voltage
System
RAM
Full Speed Pull-up
Host Pull-down
Low Speed Pull-up
Host Pull-down
ID Pull-up
DMA
Note 1: Pins can be used as digital input/output when USB is not enabled.
2: This bit field is contained in the OSCCON register.
3: This bit field is contained in the OSCTRM register.
4: USB PLL UFIN requirements: 4 MHz.
5: This bit field is contained in the DEVCFG2 register.
6: A 48 MHz clock is required for proper USB operation.
2011-2012 Microchip Technology Inc. Preliminary DS61168E-page 121
PIC32MX1XX/2XX
REGISTER 10-1: U1OTGIR: USB OTG INTERRUPT STATUS REGISTER
Bit
Range Bit
31/23/15/7 Bit
30/22/14/6 Bit
29/21/13/5 Bit
28/20/12/4 Bit
27/19/11/3 Bit
26/18/10/2 Bit
25/17/9/1 Bit
24/16/8/0
31:24 U-0 U-0 U-0 U-0 U-0 U-0 U-0 U-0
23:16 U-0 U-0 U-0 U-0 U-0 U-0 U-0 U-0
15:8 U-0 U-0 U-0 U-0 U-0 U-0 U-0 U-0
7:0
R/WC-0, HS R/WC-0, HS R/WC-0, HS R/WC-0, HS R/WC-0, HS R/WC-0, HS U-0 R/WC-0, HS
IDIF T1MSECIF LSTATEIF ACTVIF SESVDIF SESENDIF VBUSVDIF
Legend: WC = Write ‘1’ to clear HS = Hardware Settable bit
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 31-8 Unimplemented: Read as ‘0
bit 7 IDIF: ID State Change Indicator bit
1 = Change in ID state detected
0 = No change in ID state detected
bit 6 T1MSECIF: 1 Millisecond Timer bit
1 = 1 millisecond timer has expired
0 = 1 millisecond timer has not expired
bit 5 LSTATEIF: Line State Stable Indicator bit
1 = USB line state has been stable for 1 ms, but different from last time
0 = USB line state has not been stable for 1 ms
bit 4 ACTVIF: Bus Activity Indicator bit
1 = Activity on the D+, D-, ID or VBUS pins has caused the device to wake-up
0 = Activity has not been detected
bit 3 SESVDIF: Session Valid Change Indicator bit
1 =V
BUS voltage has dropped below the session end level
0 =V
BUS voltage has not dropped below the session end level
bit 2 SESENDIF: B-Device VBUS Change Indicator bit
1 = A change on the session end input was detected
0 = No change on the session end input was detected
bit 1 Unimplemented: Read as ‘0
bit 0 VBUSVDIF: A-Device VBUS Change Indicator bit
1 = Change on the session valid input detected
0 = No change on the session valid input detected
PIC32MX1XX/2XX
DS61168E-page 122 Preliminary 2011-2012 Microchip Technology Inc.
REGISTER 10-2: U1OTGIE: USB OTG INTERRUPT ENABLE REGISTER
Bit
Range Bit
31/23/15/7 Bit
30/22/14/6 Bit
29/21/13/5 Bit
28/20/12/4 Bit
27/19/11/3 Bit
26/18/10/2 Bit
25/17/9/1 Bit
24/16/8/0
31:24 U-0 U-0 U-0 U-0 U-0 U-0 U-0 U-0
23:16 U-0 U-0 U-0 U-0 U-0 U-0 U-0 U-0
15:8 U-0 U-0 U-0 U-0 U-0 U-0 U-0 U-0
7:0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 U-0 R/W-0
IDIE T1MSECIE LSTATEIE ACTVIE SESVDIE SESENDIE VBUSVDIE
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 31-8 Unimplemented: Read as ‘0
bit 7 IDIE: ID Interrupt Enable bit
1 = ID interrupt enabled
0 = ID interrupt disabled
bit 6 T1MSECIE: 1 Millisecond Timer Interrupt Enable bit
1 = 1 millisecond timer interrupt enabled
0 = 1 millisecond timer interrupt disabled
bit 5 LSTATEIE: Line State Interrupt Enable bit
1 = Line state interrupt enabled
0 = Line state interrupt disabled
bit 4 ACTVIE: Bus Activity Interrupt Enable bit
1 = Activity interrupt enabled
0 = Activity interrupt disabled
bit 3 SESVDIE: Session Valid Interrupt Enable bit
1 = Session valid interrupt enabled
0 = Session valid interrupt disabled
bit 2 SESENDIE: B-Device Session End Interrupt Enable bit
1 = B-Device session end interrupt enabled
0 = B-Device session end interrupt disabled
bit 1 Unimplemented: Read as ‘0
bit 0 VBUSVDIE: A-Device VBUS Valid Interrupt Enable bit
1 =A-Device VBUS valid interrupt enabled
0 =A-Device V
BUS valid interrupt disabled
2011-2012 Microchip Technology Inc. Preliminary DS61168E-page 123
PIC32MX1XX/2XX
REGISTER 10-3: U1OTGSTAT: USB OTG STATUS REGISTER
Bit
Range Bit
31/23/15/7 Bit
30/22/14/6 Bit
29/21/13/5 Bit
28/20/12/4 Bit
27/19/11/3 Bit
26/18/10/2 Bit
25/17/9/1 Bit
24/16/8/0
31:24 U-0 U-0 U-0 U-0 U-0 U-0 U-0 U-0
23:16 U-0 U-0 U-0 U-0 U-0 U-0 U-0 U-0
15:8 U-0 U-0 U-0 U-0 U-0 U-0 U-0 U-0
7:0 R-0 U-0 R-0 U-0 R-0 R-0 U-0 R-0
ID —LSTATE SESVD SESEND VBUSVD
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 31-8 Unimplemented: Read as ‘0
bit 7 ID: ID Pin State Indicator bit
1 = No cable is attached or a type B cable has been plugged into the USB receptacle
0 = A “type A” OTG cable has been plugged into the USB receptacle
bit 6 Unimplemented: Read as ‘0
bit 5 LSTATE: Line State Stable Indicator bit
1 = USB line state (SE0 bit (U1CON<6>) and JSTATE bit (U1CON<7>) has been stable for previous 1 ms
0 = USB line state (SE0 and JSTATE) has not been stable for previous 1 ms
bit 4 Unimplemented: Read as ‘0
bit 3 SESVD: Session Valid Indicator bit
1 =V
BUS voltage is above Session Valid on the A or B device
0 =V
BUS voltage is below Session Valid on the A or B device
bit 2 SESEND: B-Device Session End Indicator bit
1 =VBUS voltage is below Session Valid on the B device
0 =VBUS voltage is above Session Valid on the B device
bit 1 Unimplemented: Read as ‘0
bit 0 VBUSVD: A-Device VBUS Valid Indicator bit
1 =V
BUS voltage is above Session Valid on the A device
0 =V
BUS voltage is below Session Valid on the A device
PIC32MX1XX/2XX
DS61168E-page 124 Preliminary 2011-2012 Microchip Technology Inc.
REGISTER 10-4: U1OTGCON: USB OTG CONTROL REGISTER
Bit
Range Bit
31/23/15/7 Bit
30/22/14/6 Bit
29/21/13/5 Bit
28/20/12/4 Bit
27/19/11/3 Bit
26/18/10/2 Bit
25/17/9/1 Bit
24/16/8/0
31:24 U-0 U-0 U-0 U-0 U-0 U-0 U-0 U-0
23:16 U-0 U-0 U-0 U-0 U-0 U-0 U-0 U-0
15:8 U-0 U-0 U-0 U-0 U-0 U-0 U-0 U-0
7:0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
DPPULUP DMPULUP DPPULDWN DMPULDWN VBUSON OTGEN VBUSCHG VBUSDIS
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 31-8 Unimplemented: Read as ‘0
bit 7 DPPULUP: D+ Pull-Up Enable bit
1 = D+ data line pull-up resistor is enabled
0 = D+ data line pull-up resistor is disabled
bit 6 DMPULUP: D- Pull-Up Enable bit
1 = D- data line pull-up resistor is enabled
0 = D- data line pull-up resistor is disabled
bit 5 DPPULDWN: D+ Pull-Down Enable bit
1 = D+ data line pull-down resistor is enabled
0 = D+ data line pull-down resistor is disabled
bit 4 DMPULDWN: D- Pull-Down Enable bit
1 = D- data line pull-down resistor is enabled
0 = D- data line pull-down resistor is disabled
bit 3 VBUSON: VBUS Power-on bit
1 =V
BUS line is powered
0 =V
BUS line is not powered
bit 2 OTGEN: OTG Functionality Enable bit
1 = DPPULUP, DMPULUP, DPPULDWN and DMPULDWN bits are under software control
0 = DPPULUP, DMPULUP, DPPULDWN and DMPULDWN bits are under USB hardware control
bit 1 VBUSCHG: VBUS Charge Enable bit
1 =VBUS line is charged through a pull-up resistor
0 =V
BUS line is not charged through a resistor
bit 0 VBUSDIS: VBUS Discharge Enable bit
1 =VBUS line is discharged through a pull-down resistor
0 =V
BUS line is not discharged through a resistor
2011-2012 Microchip Technology Inc. Preliminary DS61168E-page 125
PIC32MX1XX/2XX
REGISTER 10-5: U1PWRC: USB POWER CONTROL REGISTER
Bit
Range Bit
31/23/15/7 Bit
30/22/14/6 Bit
29/21/13/5 Bit
28/20/12/4 Bit
27/19/11/3 Bit
26/18/10/2 Bit
25/17/9/1 Bit
24/16/8/0
31:24 U-0 U-0 U-0 U-0 U-0 U-0 U-0 U-0
23:16 U-0 U-0 U-0 U-0 U-0 U-0 U-0 U-0
15:8 U-0 U-0 U-0 U-0 U-0 U-0 U-0 U-0
7:0 R-0 U-0 U-0 R/W-0 R/W-0 U-0 R/W-0 R/W-0
UACTPND USLPGRD USBBUSY(1) USUSPEND USBPWR
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set 0’ = Bit is cleared x = Bit is unknown
bit 31-8 Unimplemented: Read as ‘0
bit 7 UACTPND: USB Activity Pending bit
1 = USB bus activity has been detected; but an interrupt is pending, it has not been generated yet
0 = An interrupt is not pending
bit 6-5 Unimplemented: Read as ‘0
bit 4 USLPGRD: USB Sleep Entry Guard bit
1 = Sleep entry is blocked if USB bus activity is detected or if a notification is pending
0 = USB module does not block Sleep entry
bit 3 USBBUSY: USB Module Busy bit(1)
1 = USB module is active or disabled, but not ready to be enabled
0 = USB module is not active and is ready to be enabled
bit 2 Unimplemented: Read as ‘0
bit 1 USUSPEND: USB Suspend Mode bit
1 = USB module is placed in Suspend mode
(The 48 MHz USB clock will be gated off. The transceiver is placed in a low-power state.)
0 = USB module operates normally
bit 0 USBPWR: USB Operation Enable bit
1 = USB module is turned on
0 = USB module is disabled
(Outputs held inactive, device pins not used by USB, analog features are shut down to reduce power
consumption.)
Note 1: When USBPWR = 0 and USBBUSY = 1, status from all other registers is invalid and writes to all USB
module registers produce undefined results.
PIC32MX1XX/2XX
DS61168E-page 126 Preliminary 2011-2012 Microchip Technology Inc.
REGISTER 10-6: U1IR: USB INTERRUPT REGISTER
Bit
Range Bit
31/23/15/7 Bit
30/22/14/6 Bit
29/21/13/5 Bit
28/20/12/4 Bit
27/19/11/3 Bit
26/18/10/2 Bit
25/17/9/1 Bit
24/16/8/0
31:24 U-0 U-0 U-0 U-0 U-0 U-0 U-0 U-0
23:16 U-0 U-0 U-0 U-0 U-0 U-0 U-0 U-0
15:8 U-0 U-0 U-0 U-0 U-0 U-0 U-0 U-0
7:0
R/WC-0, HS R/WC-0, HS R/WC-0, HS R/WC-0, HS R/WC-0, HS R/WC-0, HS R-0 R/WC-0, HS
STALLIF ATTACHIF(1) RESUMEIF(2) IDLEIF TRNIF(3) SOFIF UERRIF(4) URSTIF(5)
DETACHIF(6)
Legend: WC = Write ‘1’ to clear HS = Hardware Settable bit
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 31-8 Unimplemented: Read as ‘0
bit 7 STALLIF: STALL Handshake Interrupt bit
1 = In Host mode a STALL handshake was received during the handshake phase of the transaction
In Device mode a STALL handshake was transmitted during the handshake phase of the transaction
0 = STALL handshake has not been sent
bit 6 ATTACHIF: Peripheral Attach Interrupt bit(1)
1 = Peripheral attachment was detected by the USB module
0 = Peripheral attachment was not detected
bit 5 RESUMEIF: Resume Interrupt bit(2)
1 = K-State is observed on the D+ or D- pin for 2.5 µs
0 = K-State is not observed
bit 4 IDLEIF: Idle Detect Interrupt bit
1 = Idle condition detected (constant Idle state of 3 ms or more)
0 = No Idle condition detected
bit 3 TRNIF: Token Processing Complete Interrupt bit(3)
1 = Processing of current token is complete; a read of the U1STAT register will provide endpoint information
0 = Processing of current token not complete
bit 2 SOFIF: SOF Token Interrupt bit
1 = SOF token received by the peripheral or the SOF threshold reached by the host
0 = SOF token was not received nor threshold reached
bit 1 UERRIF: USB Error Condition Interrupt bit(4)
1 = Unmasked error condition has occurred
0 = Unmasked error condition has not occurred
bit 0 URSTIF: USB Reset Interrupt bit (Device mode)(5)
1 = Valid USB Reset has occurred
0 = No USB Reset has occurred
DETACHIF: USB Detach Interrupt bit (Host mode)(6)
1 = Peripheral detachment was detected by the USB module
0 = Peripheral detachment was not detected
Note 1: This bit is valid only if the HOSTEN bit is set (see Register 10-11), there is no activity on the USB for
2.5 µs, and the current bus state is not SE0.
2: When not in Suspend mode, this interrupt should be disabled.
3: Clearing this bit will cause the STAT FIFO to advance.
4: Only error conditions enabled through the U1EIE register will set this bit.
5: Device mode.
6: Host mode.
2011-2012 Microchip Technology Inc. Preliminary DS61168E-page 127
PIC32MX1XX/2XX
REGISTER 10-7: U1IE: USB INTERRUPT ENABLE REGISTER
Bit
Range Bit
31/23/15/7 Bit
30/22/14/6 Bit
29/21/13/5 Bit
28/20/12/4 Bit
27/19/11/3 Bit
26/18/10/2 Bit
25/17/9/1 Bit
24/16/8/0
31:24 U-0 U-0 U-0 U-0 U-0 U-0 U-0 U-0
23:16 U-0 U-0 U-0 U-0 U-0 U-0 U-0 U-0
15:8 U-0 U-0 U-0 U-0 U-0 U-0 U-0 U-0
7:0
R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
STALLIE ATTACHIE RESU-
MEIE IDLEIE TRNIE SOFIE UERRIE(1) URSTIE(2)
DETACHIE(3)
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 31-8 Unimplemented: Read as ‘0
bit 7 STALLIE: STALL Handshake Interrupt Enable bit
1 = STALL interrupt enabled
0 = STALL interrupt disabled
bit 6 ATTACHIE: ATTACH Interrupt Enable bit
1 = ATTACH interrupt enabled
0 = ATTACH interrupt disabled
bit 5 RESUMEIE: RESUME Interrupt Enable bit
1 = RESUME interrupt enabled
0 = RESUME interrupt disabled
bit 4 IDLEIE: Idle Detect Interrupt Enable bit
1 = Idle interrupt enabled
0 = Idle interrupt disabled
bit 3 TRNIE: Token Processing Complete Interrupt Enable bit
1 = TRNIF interrupt enabled
0 = TRNIF interrupt disabled
bit 2 SOFIE: SOF Token Interrupt Enable bit
1 = SOFIF interrupt enabled
0 = SOFIF interrupt disabled
bit 1 UERRIE: USB Error Interrupt Enable bit(1)
1 = USB Error interrupt enabled
0 = USB Error interrupt disabled
bit 0 URSTIE: USB Reset Interrupt Enable bit(2)
1 = URSTIF interrupt enabled
0 = URSTIF interrupt disabled
DETACHIE: USB Detach Interrupt Enable bit(3)
1 = DATTCHIF interrupt enabled
0 = DATTCHIF interrupt disabled
Note 1: For an interrupt to propagate USBIF, the UERRIE bit (U1IE<1>) must be set.
2: Device mode.
3: Host mode.
PIC32MX1XX/2XX
DS61168E-page 128 Preliminary 2011-2012 Microchip Technology Inc.
REGISTER 10-8: U1EIR: USB ERROR INTERRUPT STATUS REGISTER
Bit
Range Bit
31/23/15/7 Bit
30/22/14/6 Bit
29/21/13/5 Bit
28/20/12/4 Bit
27/19/11/3 Bit
26/18/10/2 Bit
25/17/9/1 Bit
24/16/8/0
31:24 U-0 U-0 U-0 U-0 U-0 U-0 U-0 U-0
——————
23:16 U-0 U-0 U-0 U-0 U-0 U-0 U-0 U-0
——————
15:8 U-0 U-0 U-0 U-0 U-0 U-0 U-0 U-0
——————
7:0
R/WC-0, HS R/WC-0, HS R/WC-0, HS R/WC-0, HS R/WC-0, HS R/WC-0, HS R/WC-0, HS R/WC-0, HS
BTSEF BMXEF DMAEF(1) BTOEF(2) DFN8EF CRC16EF CRC5EF(4)
PIDEF
EOFEF(3,5)
Legend: WC = Write ‘1’ to clear HS = Hardware Settable bit
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 31-8 Unimplemented: Read as ‘0
bit 7 BTSEF: Bit Stuff Error Flag bit
1 = Packet rejected due to bit stuff error
0 = Packet accepted
bit 6 BMXEF: Bus Matrix Error Flag bit
1 = The base address, of the BDT, or the address of an individual buffer pointed to by a BDT entry, is invalid.
0 = No address error
bit 5 DMAEF: DMA Error Flag bit(1)
1 = USB DMA error condition detected
0 =No DMA error
bit 4 BTOEF: Bus Turnaround Time-Out Error Flag bit(2)
1 = Bus turnaround time-out has occurred
0 = No bus turnaround time-out
bit 3 DFN8EF: Data Field Size Error Flag bit
1 = Data field received is not an integral number of bytes
0 = Data field received is an integral number of bytes
bit 2 CRC16EF: CRC16 Failure Flag bit
1 = Data packet rejected due to CRC16 error
0 = Data packet accepted
Note 1: This type of error occurs when the module’s request for the DMA bus is not granted in time to service the
module’s demand for memory, resulting in an overflow or underflow condition, and/or the allocated buffer
size is not sufficient to store the received data packet causing it to be truncated.
2: This type of error occurs when more than 16-bit-times of Idle from the previous End-of-Packet (EOP)
has elapsed.
3: This type of error occurs when the module is transmitting or receiving data and the SOF counter has
reached zero.
4: Device mode.
5: Host mode.
2011-2012 Microchip Technology Inc. Preliminary DS61168E-page 129
PIC32MX1XX/2XX
bit 1 CRC5EF: CRC5 Host Error Flag bit(4)
1 = Token packet rejected due to CRC5 error
0 = Token packet accepted
EOFEF: EOF Error Flag bit(3,5)
1 = EOF error condition detected
0 = No EOF error condition
bit 0 PIDEF: PID Check Failure Flag bit
1 = PID check failed
0 = PID check passed
REGISTER 10-8: U1EIR: USB ERROR INTERRUPT STATUS REGISTER (CONTIN UED)
Note 1: This type of error occurs when the module’s request for the DMA bus is not granted in time to service the
module’s demand for memory, resulting in an overflow or underflow condition, and/or the allocated buffer
size is not sufficient to store the received data packet causing it to be truncated.
2: This type of error occurs when more than 16-bit-times of Idle from the previous End-of-Packet (EOP)
has elapsed.
3: This type of error occurs when the module is transmitting or receiving data and the SOF counter has
reached zero.
4: Device mode.
5: Host mode.
PIC32MX1XX/2XX
DS61168E-page 130 Preliminary 2011-2012 Microchip Technology Inc.
REGISTER 10-9: U1EIE: USB ERROR INTERRUPT ENABLE REGISTER
Bit
Range Bit
31/23/15/7 Bit
30/22/14/6 Bit
29/21/13/5 Bit
28/20/12/4 Bit
27/19/11/3 Bit
26/18/10/2 Bit
25/17/9/1 Bit
24/16/8/0
31:24 U-0 U-0 U-0 U-0 U-0 U-0 U-0 U-0
————————
23:16 U-0 U-0 U-0 U-0 U-0 U-0 U-0 U-0
————————
15:8 U-0 U-0 U-0 U-0 U-0 U-0 U-0 U-0
————————
7:0
R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
BTSEE BMXEE DMAEE BTOEE DFN8EE CRC16EE CRC5EE(1) PIDEE
EOFEE(2)
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 31-8 Unimplemented: Read as ‘0
bit 7 BTSEE: Bit Stuff Error Interrupt Enable bit
1 = BTSEF interrupt enabled
0 = BTSEF interrupt disabled
bit 6 BMXEE: Bus Matrix Error Interrupt Enable bit
1 = BMXEF interrupt enabled
0 = BMXEF interrupt disabled
bit 5 DMAEE: DMA Error Interrupt Enable bit
1 = DMAEF interrupt enabled
0 = DMAEF interrupt disabled
bit 4 BTOEE: Bus Turnaround Time-out Error Interrupt Enable bit
1 = BTOEF interrupt enabled
0 = BTOEF interrupt disabled
bit 3 DFN8EE: Data Field Size Error Interrupt Enable bit
1 = DFN8EF interrupt enabled
0 = DFN8EF interrupt disabled
bit 2 CRC16EE: CRC16 Failure Interrupt Enable bit
1 = CRC16EF interrupt enabled
0 = CRC16EF interrupt disabled
bit 1 CRC5EE: CRC5 Host Error Interrupt Enable bit(1)
1 = CRC5EF interrupt enabled
0 = CRC5EF interrupt disabled
EOFEE: EOF Error Interrupt Enable bit(2)
1 = EOF interrupt enabled
0 = EOF interrupt disabled
bit 0 PIDEE: PID Check Failure Interrupt Enable bit
1 = PIDEF interrupt enabled
0 = PIDEF interrupt disabled
Note 1: Device mode.
2: Host mode.
Note: For an interrupt to propagate the USBIF register, the UERRIE bit (U1IE<1>) must be set.
2011-2012 Microchip Technology Inc. Preliminary DS61168E-page 131
PIC32MX1XX/2XX
REGISTER 10-10: U1STAT: USB STATUS REGISTER
Bit
Range Bit
31/23/15/7 Bit
30/22/14/6 Bit
29/21/13/5 Bit
28/20/12/4 Bit
27/19/11/3 Bit
26/18/10/2 Bit
25/17/9/1 Bit
24/16/8/0
31:24 U-0 U-0 U-0 U-0 U-0 U-0 U-0 U-0
————————
23:16 U-0 U-0 U-0 U-0 U-0 U-0 U-0 U-0
————————
15:8 U-0 U-0 U-0 U-0 U-0 U-0 U-0 U-0
————————
7:0 R-x R-x R-x R-x R-x R-x U-0 U-0
ENDPT<3:0> DIR PPBI
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 31-8 Unimplemented: Read as ‘0
bit 7-4 ENDPT<3:0>: Encoded Number of Last Endpoint Activity bits
(Represents the number of the BDT, updated by the last USB transfer.)
1111 = Endpoint 15
1110 = Endpoint 14
0001 =Endpoint 1
0000 =Endpoint 0
bit 3 DIR: Last BD Direction Indicator bit
1 = Last transaction was a transmit transfer (TX)
0 = Last transaction was a receive transfer (RX)
bit 2 PPBI: Ping-Pong BD Pointer Indicator bit
1 = The last transaction was to the ODD BD bank
0 = The last transaction was to the EVEN BD bank
bit 1-0 Unimplemented: Read as ‘0
Note: The U1STAT register is a window into a 4-byte FIFO maintained by the USB module. U1STAT value is only
valid when U1IR<TRNIF> is active. Clearing the U1IR<TRNIF> bit advances the FIFO. Data in register is
invalid when U1IR<TRNIF> = 0.
PIC32MX1XX/2XX
DS61168E-page 132 Preliminary 2011-2012 Microchip Technology Inc.
REGISTER 10-11: U1CON: USB CONTROL REGISTER
Bit
Range Bit
31/23/15/7 Bit
30/22/14/6 Bit
29/21/13/5 Bit
28/20/12/4 Bit
27/19/11/3 Bit
26/18/10/2 Bit
25/17/9/1 Bit
24/16/8/0
31:24 U-0 U-0 U-0 U-0 U-0 U-0 U-0 U-0
23:16 U-0 U-0 U-0 U-0 U-0 U-0 U-0 U-0
15:8 U-0 U-0 U-0 U-0 U-0 U-0 U-0 U-0
7:0
R-x R-x R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
JSTATE SE0 PKTDIS(4)
USBRST HOSTEN(2) RESUME(3) PPBRST USBEN(4)
TOKBUSY(1,5) SOFEN(5)
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 31-8 Unimplemented: Read as ‘0
bit 7 JSTATE: Live Differential Receiver JSTATE flag bit
1 = JSTATE detected on the USB
0 = No JSTATE detected
bit 6 SE0: Live Single-Ended Zero flag bit
1 = Single Ended Zero detected on the USB
0 = No Single Ended Zero detected
bit 5 PKTDIS: Packet Transfer Disable bit(4)
1 = Token and packet processing disabled (set upon SETUP token received)
0 = Token and packet processing enabled
TOKBUSY: Token Busy Indicator bit(1,5)
1 = Token being executed by the USB module
0 = No token being executed
bit 4 USBRST: Module Reset bit(5)
1 = USB reset generated
0 = USB reset terminated
bit 3 HOSTEN: Host Mode Enable bit(2)
1 = USB host capability enabled
0 = USB host capability disabled
bit 2 RESUME: RESUME Signaling Enable bit(3)
1 = RESUME signaling activated
0 = RESUME signaling disabled
Note 1: Software is required to check this bit before issuing another token command to the U1TOK register (see
Register 10-15).
2: All host control logic is reset any time that the value of this bit is toggled.
3: Software must set RESUME for 10 ms if the part is a function, or for 25 ms if the part is a host, and then
clear it to enable remote wake-up. In Host mode, the USB module will append a low-speed EOP to the
RESUME signaling when this bit is cleared.
4: Device mode.
5: Host mode.
2011-2012 Microchip Technology Inc. Preliminary DS61168E-page 133
PIC32MX1XX/2XX
bit 1 PPBRST: Ping-Pong Buffers Reset bit
1 = Reset all Even/Odd buffer pointers to the EVEN BD banks
0 = Even/Odd buffer pointers not being Reset
bit 0 USBEN: USB Module Enable bit(4)
1 = USB module and supporting circuitry enabled
0 = USB module and supporting circuitry disabled
SOFEN: SOF Enable bit(5)
1 = SOF token sent every 1 ms
0 = SOF token disabled
REGISTER 10-11: U1CON: USB CONTROL REGISTER (CONTINUED)
Note 1: Software is required to check this bit before issuing another token command to the U1TOK register (see
Register 10-15).
2: All host control logic is reset any time that the value of this bit is toggled.
3: Software must set RESUME for 10 ms if the part is a function, or for 25 ms if the part is a host, and then
clear it to enable remote wake-up. In Host mode, the USB module will append a low-speed EOP to the
RESUME signaling when this bit is cleared.
4: Device mode.
5: Host mode.
PIC32MX1XX/2XX
DS61168E-page 134 Preliminary 2011-2012 Microchip Technology Inc.
REGISTER 10-12: U1ADDR: USB ADDRESS REGISTER
Bit
Range Bit
31/23/15/7 Bit
30/22/14/6 Bit
29/21/13/5 Bit
28/20/12/4 Bit
27/19/11/3 Bit
26/18/10/2 Bit
25/17/9/1 Bit
24/16/8/0
31:24 U-0 U-0 U-0 U-0 U-0 U-0 U-0 U-0
23:16 U-0 U-0 U-0 U-0 U-0 U-0 U-0 U-0
15:8 U-0 U-0 U-0 U-0 U-0 U-0 U-0 U-0
7:0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
LSPDEN DEVADDR<6:0>
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 31-8 Unimplemented: Read as ‘0
bit 7 LSPDEN: Low Speed Enable Indicator bit
1 = Next token command to be executed at Low Speed
0 = Next token command to be executed at Full Speed
bit 6-0 DEVADDR<6:0>: 7-bit USB Device Address bits
REGISTER 10-13: U1FRML: USB FRAME NUMBER LOW REGISTER
Bit
Range Bit
31/23/15/7 Bit
30/22/14/6 Bit
29/21/13/5 Bit
28/20/12/4 Bit
27/19/11/3 Bit
26/18/10/2 Bit
25/17/9/1 Bit
24/16/8/0
31:24 U-0 U-0 U-0 U-0 U-0 U-0 U-0 U-0
23:16 U-0 U-0 U-0 U-0 U-0 U-0 U-0 U-0
15:8 U-0 U-0 U-0 U-0 U-0 U-0 U-0 U-0
7:0 R-0 R-0 R-0 R-0 R-0 R-0 R-0 R-0
FRML<7:0>
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 31-8 Unimplemented: Read as ‘0
bit 7-0 FRML<7:0>: The 11-bit Frame Number Lower bits
The register bits are updated with the current frame number whenever a SOF TOKEN is received.
2011-2012 Microchip Technology Inc. Preliminary DS61168E-page 135
PIC32MX1XX/2XX
REGISTER 10-14: U1FRMH: USB FRAME NUMBER HIGH REGISTER
Bit
Range Bit
31/23/15/7 Bit
30/22/14/6 Bit
29/21/13/5 Bit
28/20/12/4 Bit
27/19/11/3 Bit
26/18/10/2 Bit
25/17/9/1 Bit
24/16/8/0
31:24 U-0 U-0 U-0 U-0 U-0 U-0 U-0 U-0
23:16 U-0 U-0 U-0 U-0 U-0 U-0 U-0 U-0
15:8 U-0 U-0 U-0 U-0 U-0 U-0 U-0 U-0
7:0 U-0 U-0 U-0 U-0 U-0 R-0 R-0 R-0
FRMH<2:0>
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 31-3 Unimplemented: Read as ‘0
bit 2-0 FRMH<2:0>: The Upper 3 bits of the Frame Numbers bits
The register bits are updated with the current frame number whenever a SOF TOKEN is received.
REGISTER 10-15: U1TOK: USB TOKEN REGISTER
Bit
Range Bit
31/23/15/7 Bit
30/22/14/6 Bit
29/21/13/5 Bit
28/20/12/4 Bit
27/19/11/3 Bit
26/18/10/2 Bit
25/17/9/1 Bit
24/16/8/0
31:24 U-0 U-0 U-0 U-0 U-0 U-0 U-0 U-0
23:16 U-0 U-0 U-0 U-0 U-0 U-0 U-0 U-0
15:8 U-0 U-0 U-0 U-0 U-0 U-0 U-0 U-0
7:0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
PID<3:0>(1) EP<3:0>
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 31-8 Unimplemented: Read as ‘0
bit 7-4 PID<3:0>: Token Type Indicator bits(1)
0001 = OUT (TX) token type transaction
1001 = IN (RX) token type transaction
1101 = SETUP (TX) token type transaction
Note: All other values are reserved and must not be used.
bit 3-0 EP<3:0>: Token Command Endpoint Address bits
The four bit value must specify a valid endpoint.
Note 1: All other values are reserved and must not be used.
PIC32MX1XX/2XX
DS61168E-page 136 Preliminary 2011-2012 Microchip Technology Inc.
REGISTER 10-16: U1SOF: USB SOF THRESHOLD REGISTER
Bit
Range Bit
31/23/15/7 Bit
30/22/14/6 Bit
29/21/13/5 Bit
28/20/12/4 Bit
27/19/11/3 Bit
26/18/10/2 Bit
25/17/9/1 Bit
24/16/8/0
31:24 U-0 U-0 U-0 U-0 U-0 U-0 U-0 U-0
23:16 U-0 U-0 U-0 U-0 U-0 U-0 U-0 U-0
15:8 U-0 U-0 U-0 U-0 U-0 U-0 U-0 U-0
7:0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
CNT<7:0>
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 31-8 Unimplemented: Read as ‘0
bit 7-0 CNT<7:0>: SOF Threshold Value bits
Typical values of the threshold are:
01001010 = 64-byte packet
00101010 = 32-byte packet
00011010 = 16-byte packet
00010010 = 8-byte packet
REGISTER 10-17: U1BDTP1: USB BDT PAGE 1 REGISTER
Bit
Range Bit
31/23/15/7 Bit
30/22/14/6 Bit
29/21/13/5 Bit
28/20/12/4 Bit
27/19/11/3 Bit
26/18/10/2 Bit
25/17/9/1 Bit
24/16/8/0
31:24 U-0U-0U-0U-0U-0U-0U-0U-0
————————
23:16 U-0U-0U-0U-0U-0U-0U-0U-0
————————
15:8 U-0U-0U-0U-0U-0U-0U-0U-0
————————
7:0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 U-0
BDTPTRL<15:9>
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 31-8 Unimplemented: Read as ‘0
bit 7-1 BDTPTRL<15:9>: BDT Base Address bits
This 7-bit value provides address bits 15 through 9 of the BDT base address, which defines the starting
location of the BDT in system memory.
The 32-bit BDT base address is 512-byte aligned.
bit 0 Unimplemented: Read as ‘0
2011-2012 Microchip Technology Inc. Preliminary DS61168E-page 137
PIC32MX1XX/2XX
REGISTER 10-18: U1BDTP2: USB BDT PAGE 2 REGISTER
Bit
Range Bit
31/23/15/7 Bit
30/22/14/6 Bit
29/21/13/5 Bit
28/20/12/4 Bit
27/19/11/3 Bit
26/18/10/2 Bit
25/17/9/1 Bit
24/16/8/0
31:24 U-0 U-0 U-0 U-0 U-0 U-0 U-0 U-0
————————
23:16 U-0 U-0 U-0 U-0 U-0 U-0 U-0 U-0
————————
15:8 U-0 U-0 U-0 U-0 U-0 U-0 U-0 U-0
————————
7:0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
BDTPTRH<23:16>
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 31-8 Unimplemented: Read as ‘0
bit 7-0 BDTPTRH<23:16>: BDT Base Address bits
This 8-bit value provides address bits 23 through 16 of the BDT base address, which defines the starting
location of the BDT in system memory.
The 32-bit BDT base address is 512-byte aligned.
REGISTER 10-19: U1BDTP3: USB BDT PAGE 3 REGISTER
Bit
Range Bit
31/23/15/7 Bit
30/22/14/6 Bit
29/21/13/5 Bit
28/20/12/4 Bit
27/19/11/3 Bit
26/18/10/2 Bit
25/17/9/1 Bit
24/16/8/0
31:24 U-0 U-0 U-0 U-0 U-0 U-0 U-0 U-0
23:16 U-0 U-0 U-0 U-0 U-0 U-0 U-0 U-0
15:8 U-0 U-0 U-0 U-0 U-0 U-0 U-0 U-0
7:0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
BDTPTRU<31:24>
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 31-8 Unimplemented: Read as ‘0
bit 7-0 BDTPTRU<31:24>: BDT Base Address bits
This 8-bit value provides address bits 31 through 24 of the BDT base address, defines the starting location
of the BDT in system memory.
The 32-bit BDT base address is 512-byte aligned.
PIC32MX1XX/2XX
DS61168E-page 138 Preliminary 2011-2012 Microchip Technology Inc.
REGISTER 10-20: U1CNFG1: USB CONFIGURATION 1 REGISTER
Bit
Range Bit
31/23/15/7 Bit
30/22/14/6 Bit
29/21/13/5 Bit
28/20/12/4 Bit
27/19/11/3 Bit
26/18/10/2 Bit
25/17/9/1 Bit
24/16/8/0
31:24 U-0 U-0 U-0 U-0 U-0 U-0 U-0 U-0
———————
23:16 U-0 U-0 U-0 U-0 U-0 U-0 U-0 U-0
———————
15:8 U-0 U-0 U-0 U-0 U-0 U-0 U-0 U-0
———————
7:0
R/W-0 R/W-0 U-0 R/W-0 U-0 U-0 U-0 R/W-0
UTEYE UOEMON USBSIDL —— UASUSPND
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 31-8 Unimplemented: Read as ‘0
bit 7 UTEYE: USB Eye-Pattern Test Enable bit
1 = Eye-Pattern Test enabled
0 = Eye-Pattern Test disabled
bit 6 UOEMON: USB OE Monitor Enable bit
1 = OE signal active; it indicates intervals during which the D+/D- lines are driving
0 = OE signal inactive
bit 5 Unimplemented: Read as ‘0
bit 4 USBSIDL: Stop in Idle Mode bit
1 = Discontinue module operation when device enters Idle mode
0 = Continue module operation in Idle mode
bit 3-1 Unimplemented: Read as ‘0
bit 0 UASUSPND: Automatic Suspend Enable bit
1 = USB module automatically suspends upon entry to Sleep mode. See the USUSPEND bit
(U1PWRC<1>) in Register 10-5.
0 = USB module does not automatically suspend upon entry to Sleep mode. Software must use the
USUSPEND bit (U1PWRC<1>) to suspend the module, including the USB 48 MHz clock
2011-2012 Microchip Technology Inc. Preliminary DS61168E-page 139
PIC32MX1XX/2XX
REGISTER 10-21: U1EP0-U1EP15: USB ENDPOINT CONTROL REGISTER
Bit
Range Bit
31/23/15/7 Bit
30/22/14/6 Bit
29/21/13/5 Bit
28/20/12/4 Bit
27/19/11/3 Bit
26/18/10/2 Bit
25/17/9/1 Bit
24/16/8/0
31:24 U-0 U-0 U-0 U-0 U-0 U-0 U-0 U-0
————————
23:16 U-0 U-0 U-0 U-0 U-0 U-0 U-0 U-0
————————
15:8 U-0 U-0 U-0 U-0 U-0 U-0 U-0 U-0
————————
7:0 R/W-0 R/W-0 U-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
LSPD RETRYDIS EPCONDIS EPRXEN EPTXEN EPSTALL EPHSHK
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 31-8 Unimplemented: Read as ‘0
bit 7 LSPD: Low-Speed Direct Connection Enable bit (Host mode and U1EP0 only)
1 = Direct connection to a low-speed device enabled
0 = Direct connection to a low-speed device disabled; hub required with PRE_PID
bit 6 RETRYDIS: Retry Disable bit (Host mode and U1EP0 only)
1 = Retry NAK’d transactions disabled
0 = Retry NAK’d transactions enabled; retry done in hardware
bit 5 Unimplemented: Read as ‘0
bit 4 EPCONDIS: Bidirectional Endpoint Control bit
If EPTXEN = 1 and EPRXEN = 1:
1 = Disable Endpoint n from Control transfers; only TX and RX transfers allowed
0 = Enable Endpoint n for Control (SETUP) transfers; TX and RX transfers also allowed
Otherwise, this bit is ignored.
bit 3 EPRXEN: Endpoint Receive Enable bit
1 = Endpoint n receive enabled
0 = Endpoint n receive disabled
bit 2 EPTXEN: Endpoint Transmit Enable bit
1 = Endpoint n transmit enabled
0 = Endpoint n transmit disabled
bit 1 EPSTALL: Endpoint Stall Status bit
1 = Endpoint n was stalled
0 = Endpoint n was not stalled
bit 0 EPHSHK: Endpoint Handshake Enable bit
1 = Endpoint Handshake enabled
0 = Endpoint Handshake disabled (typically used for isochronous endpoints)
PIC32MX1XX/2XX
DS61168E-page 140 Preliminary 2011-2012 Microchip Technology Inc.
NOTES:
2011-2012 Microchip Technology Inc. Preliminary DS61168E-page 141
PIC32MX1XX/2XX
11.0 I/O PORTS General purpose I/O pins are the simplest of peripher-
als. They allow the PIC® MCU to monitor and control
other devices. To add flexibility and functionality, some
pins are multiplexed with alternate function(s). These
functions depend on which peripheral features are on
the device. In general, when a peripheral is functioning,
that pin may not be used as a general purpose I/O pin.
Following are some of the key features of this module:
Individual output pin open-drain enable/disable
Individual input pin weak pull-up and pull-down
Monitor selective inputs and generate interrupt
when change in pin state is detected
Operation during CPU Sleep and Idle modes
Fast bit manipulation using CLR, SET and INV
registers
Figure 11-1 illustrates a block diagram of a typical
multiplexed I/O port.
FIGURE 11-1: BLOCK DIAGRAM OF A TYPICAL MULTIPLEXED PORT STRUCTURE
Note 1: This data sheet summarizes the features
of the PIC32MX1XX/2XX family of
devices. It is not intended to be a
comprehensive reference source. To
complement the information in this data
sheet, refer to Section 12. “I/O Ports”
(DS61120) in the “PIC32 Family
Reference Manual”, which is available
from the Microchip web site
(www.microchip.com/PIC32).
2: Some registers and associated bits
described in this section may not be
available on all devices. Refer to
Section 4.0 “Memory Organization” in
this data sheet for device-specific register
and bit information.
Peripheral Output Data
Peripheral Module
Peripheral Output Enable
PIO Module
Peripheral Module Enable
WR LAT
I/O Pin
WR PORT
Data Bus
RD LAT
RD PORT
RD TRIS
WR TRIS
0
1
RD ODC
SYSCLK
QD
CK
EN Q
QD
CK
EN Q
QD
CK
EN Q
QD
CK
Q
QD
CK
Q
0
1
SYSCLK
WR ODC
ODC
TRIS
LAT
Sleep
1
0
1
0
Output Multiplexers
I/O Cell
Synchronization
R
Peripheral Input
Legend: R = Peripheral input buffer types may vary. Refer to Ta bl e 1 -1 for peripheral details.
Note: This block diagram is a general representation of a shared port/peripheral structure for illustration purposes only. The actual structure
for any specific port/peripheral combination may be different than it is shown here.
Peripheral Input Buffer
PIC32MX1XX/2XX
DS61168E-page 142 Preliminary 2011-2012 Microchip Technology Inc.
11.1 Parallel I/O (PIO) Ports
All port pins have ten registers directly associated with
their operation as digital I/O. The data direction register
(TRISx) determines whether the pin is an input or an
output. If the data direction bit is a ‘1’, then the pin is an
input. All port pins are defined as inputs after a Reset.
Reads from the latch (LATx) read the latch. Writes to
the latch write the latch. Reads from the port (PORTx)
read the port pins, while writes to the port pins write the
latch.
11.1.1 OPEN-DRAIN CONFIGURATION
In addition to the PORTx, LATx, and TRISx registers for
data control, some port pins can also be individually
configured for either digital or open-drain output. This is
controlled by the Open-Drain Control register, ODCx,
associated with each port. Setting any of the bits con-
figures the corresponding pin to act as an open-drain
output.
The open-drain feature allows the generation of out-
puts higher than VDD (e.g., 5V) on any desired 5V-tol-
erant pins by using external pull-up resistors. The
maximum open-drain voltage allowed is the same as
the maximum VIH specification.
See the “Pin Diagrams” section for the available pins
and their functionality.
11.1.2 CONFIGURING ANALOG AND
DIGITAL PORT PINS
The ANSELx register controls the operation of the
analog port pins. The port pins that are to function as
analog inputs must have their corresponding ANSEL
and TRIS bits set. In order to use port pins for I/O
functionality with digital modules, such as Timers,
UARTs, etc., the corresponding ANSELx bit must be
cleared.
The ANSELx register has a default value of 0xFFFF;
therefore, all pins that share analog functions are
analog (not digital) by default.
If the TRIS bit is cleared (output) while the ANSELx bit
is set, the digital output level (VOH or VOL) is converted
by an analog peripheral, such as the ADC module or
Comparator module.
When the PORT register is read, all pins configured as
analog input channels are read as cleared (a low level).
Pins configured as digital inputs do not convert an
analog input. Analog levels on any pin defined as a
digital input (including the ANx pins) can cause the
input buffer to consume current that exceeds the
device specifications.
11.1.3 I/O PORT WRITE/READ TIMING
One instruction cycle is required between a port
direction change or port write operation and a read
operation of the same port. Typically this instruction
would be an NOP.
11.1.4 INPUT CHANGE NOTIFICATION
The input change notification function of the I/O ports
allows the PIC32MX1XX/2XX devices to generate
interrupt requests to the processor in response to a
change-of-state on selected input pins. This feature can
detect input change-of-states even in Sleep mode,
when the clocks are disabled. Every I/O port pin can be
selected (enabled) for generating an interrupt request
on a change-of-state.
Five control registers are associated with the CN func-
tionality of each I/O port. The CNENx registers contain
the CN interrupt enable control bits for each of the input
pins. Setting any of these bits enables a CN interrupt
for the corresponding pins.
The CNSTATx register indicates whether a change
occurred on the corresponding pin since the last read
of the PORTx bit.
Each I/O pin also has a weak pull-up and a weak
pull-down connected to it. The pull-ups act as a
current source or sink source connected to the pin,
and eliminate the need for external resistors when
push-button or keypad devices are connected. The
pull-ups and pull-downs are enabled separately using
the CNPUx and the CNPDx registers, which contain
the control bits for each of the pins. Setting any of
the control bits enables the weak pull-ups and/or
pull-downs for the corresponding pins.
An additional control register (CNCONx) is shown in
Register 11-3.
11.2 CLR, SET and INV Registers
Every I/O module register has a corresponding CLR
(clear), SET (set) and INV (invert) register designed to
provide fast atomic bit manipulations. As the name of
the register implies, a value written to a SET, CLR or
INV register effectively performs the implied operation,
but only on the corresponding base register and only
bits specified as ‘1’ are modified. Bits specified as ‘0
are not modified.
Reading SET, CLR and INV registers returns undefined
values. To see the affects of a write operation to a SET,
CLR or INV register, the base register must be read.
Note: Pull-ups and pull-downs on change notifi-
cation pins should always be disabled
when the port pin is configured as a digital
output.
2011-2012 Microchip Technology Inc. Preliminary DS61168E-page 143
PIC32MX1XX/2XX
11.3 Peripheral Pin Select
A major challenge in general purpose devices is provid-
ing the largest possible set of peripheral features while
minimizing the conflict of features on I/O pins. The chal-
lenge is even greater on low pin-count devices. In an
application where more than one peripheral needs to
be assigned to a single pin, inconvenient workarounds
in application code or a complete redesign may be the
only option.
Peripheral pin select configuration provides an
alternative to these choices by enabling peripheral set
selection and their placement on a wide range of I/O
pins. By increasing the pinout options available on a
particular device, users can better tailor the device to
their entire application, rather than trimming the
application to fit the device.
The peripheral pin select configuration feature oper-
ates over a fixed subset of digital I/O pins. Users may
independently map the input and/or output of most dig-
ital peripherals to these I/O pins. Peripheral pin select
is performed in software and generally does not require
the device to be reprogrammed. Hardware safeguards
are included that prevent accidental or spurious
changes to the peripheral mapping once it has been
established.
11.3.1 AVAILABLE PINS
The number of available pins is dependent on the
particular device and its pin count. Pins that support the
peripheral pin select feature include the designation
“RPn” in their full pin designation, where “RP”
designates a remappable peripheral and “n” is the
remappable port number.
11.3.2 AVAILABLE PERIPHERALS
The peripherals managed by the peripheral pin select
are all digital-only peripherals. These include general
serial communications (UART and SPI), general pur-
pose timer clock inputs, timer-related peripherals (input
capture and output compare) and interrupt-on-change
inputs.
In comparison, some digital-only peripheral modules
are never included in the peripheral pin select feature.
This is because the peripheral’s function requires spe-
cial I/O circuitry on a specific port and cannot be easily
connected to multiple pins. These modules include I2C
among others. A similar requirement excludes all mod-
ules with analog inputs, such as the Analog-to-Digital
Converter (ADC).
A key difference between remappable and non-remap-
pable peripherals is that remappable peripherals are
not associated with a default I/O pin. The peripheral
must always be assigned to a specific I/O pin before it
can be used. In contrast, non-remappable peripherals
are always available on a default pin, assuming that the
peripheral is active and not conflicting with another
peripheral.
When a remappable peripheral is active on a given I/O
pin, it takes priority over all other digital I/O and digital
communication peripherals associated with the pin.
Priority is given regardless of the type of peripheral that
is mapped. Remappable peripherals never take priority
over any analog functions associated with the pin.
11.3.3 CONTROLLING PERIPHERAL PIN
SELECT
Peripheral pin select features are controlled through
two sets of SFRs: one to map peripheral inputs, and
one to map outputs. Because they are separately con-
trolled, a particular peripheral’s input and output (if the
peripheral has both) can be placed on any selectable
function pin without constraint.
The association of a peripheral to a peripheral-select-
able pin is handled in two different ways, depending on
whether an input or output is being mapped.
11.3.4 INPUT MAPPING
The inputs of the peripheral pin select options are
mapped on the basis of the peripheral. That is, a control
register associated with a peripheral dictates the pin it
will be mapped to. The [pin name]R registers, where [pin
name] refers to the peripheral pins listed in Table 11-1,
are used to configure peripheral input mapping (see
Register 11-1). Each register contains sets of 4 bit
fields. Programming these bit fields with an appropriate
value maps the RPn pin with the corresponding value to
that peripheral. For any given device, the valid range of
values for any bit field is shown in Table 11-1.
For example, Figure 11-2 illustrates the remappable
pin selection for the U1RX input.
FIGURE 11-2: REMAPPABLE INPUT
EXAMPLE FOR U1RX
RPA2
RPB6
RPA4
0
1
2U1RX input
U1RXR<3:0>
to peripheral
RPn
n
Note: For input only, peripheral pin select functionality
does not have priority over TRISx settings.
Therefore, when configuring RPn pin for input,
the corresponding bit in the TRISx register must
also be configured for input (set to ‘1’).
PIC32MX1XX/2XX
DS61168E-page 144 Preliminary 2011-2012 Microchip Technology Inc.
TABLE 11-1: INPUT PIN SELECTION
Peripheral Pin [pin name]R SFR [pin name]R bits [pin name]R Value to
RPn Pin Selection
INT4 INT4R INT4R<3:0> 0000 = RPA0
0001 = RPB3
0010 = RPB4
0011 = RPB15
0100 = RPB7
0101 = RPC7
0110 = RPC0
0111 = RPC5
1000 = Reserved
1111 = Reserved
T2CK T2CKR T2CKR<3:0>
IC4 IC4R IC4R<3:0>
SS1 SS1R SS1R<3:0>
REFCLKI REFCLKIR REFCLKIR<3:0>
INT3 INT3R INT3R<3:0> 0000 = RPA1
0001 = RPB5
0010 = RPB1
0011 = RPB11
0100 = RPB8
0101 = RPA8
0110 = RPC8
0111 = RPA9
1000 = Reserved
1111 = Reserved
T3CK T3CKR T3CKR<3:0>
IC3 IC3R IC3R<3:0>
U1CTS U1CTSR U1CTSR<3:0>
U2RX U2RXR U2RXR<3:0>
SDI1 SDI1R SDI1R<3:0>
INT2 INT2R INT2R<3:0> 0000 = RPA2
0001 = RPB6
0010 = RPA4
0011 = RPB13
0100 = RPB2
0101 = RPC6
0110 = RPC1
0111 = RPC3
1000 = Reserved
1111 = Reserved
T4CK T4CKR T4CKR<3:0>
IC1 IC1R IC1R<3:0>
IC5 IC5R IC5R<3:0>
U1RX U1RXR U1RXR<3:0>
U2CTS U2CTSR U2CTSR<3:0>
SDI2 SDI2R SDI2R<3:0>
OCFB OCFBR OCFBR<3:0>
INT1 INT1R INT1R<3:0> 0000 = RPA3
0001 = RPB14
0010 = RPB0
0011 = RPB10
0100 = RPB9
0101 = RPC9
0110 = RPC2
0111 = RPC4
1000 = Reserved
1111 = Reserved
T5CK T5CKR T5CKR<3:0>
IC2 IC2R IC2R<3:0>
SS2 SS2R SS2R<3:0>
OCFA OCFAR OCFAR<3:0>
2011-2012 Microchip Technology Inc. Preliminary DS61168E-page 145
PIC32MX1XX/2XX
11.3.5 OUTPUT MAPPING
In contrast to inputs, the outputs of the peripheral pin
select options are mapped on the basis of the pin. In
this case, a control register associated with a
particular pin dictates the peripheral output to be
mapped. The RPnR registers (Register 11-2) are
used to control output mapping. Like the [pin name]R
registers, each register contains sets of 4 bit fields.
The value of the bit field corresponds to one of the
peripherals, and that peripheral’s output is mapped
to the pin (see Table 11-2 and Figure 11-3).
A null output is associated with the output register reset
value of ‘0’. This is done to ensure that remappable
outputs remain disconnected from all output pins by
default.
FIGURE 11-3: EXAMPLE OF
MULTIPLEXING OF
REMAPPABLE OUTPUT
FOR RPA0
11.3.6 CONTROLLING CONFIGURATION
CHANGES
Because peripheral remapping can be changed during
run time, some restrictions on peripheral remapping
are needed to prevent accidental configuration
changes. PIC32 devices include two features to
prevent alterations to the peripheral map:
Control register lock sequence
Configuration bit select lock
11.3.6.1 Control Register Lock
Under normal operation, writes to the RPnR and [pin
name]R registers are not allowed. Attempted writes
appear to execute normally, but the contents of the
registers remain unchanged. To change these regis-
ters, they must be unlocked in hardware. The regis-
ter lock is controlled by the IOLOCK Configuration bit
(CFGCON<13>). Setting IOLOCK prevents writes to
the control registers; clearing IOLOCK allows writes.
To set or clear the IOLOCK bit, an unlock sequence
must be executed. Refer to Section 6. “Oscillator”
(DS61112) in the “PIC32 Family Reference Manual” for
details.
11.3.6.2 Configuration Bit Select Lock
As an additional level of safety, the device can be
configured to prevent more than one write session to
the RPnR and [pin name]R registers. The IOL1WAY
Configuration bit (DEVCFG3<29>) blocks the IOLOCK
bit from being cleared after it has been set once. If
IOLOCK remains set, the register unlock procedure
does not execute, and the peripheral pin select control
registers cannot be written to. The only way to clear the
bit and re-enable peripheral remapping is to perform a
device Reset.
In the default (unprogrammed) state, IOL1WAY is set,
restricting users to one write session.
RPA0R<3:0>
0
15
1
Default
U1TX Output
U1RTS Output 2
14
Output Data
RPA0
PIC32MX1XX/2XX
DS61168E-page 146 Preliminary 2011-2012 Microchip Technology Inc.
TABLE 11-2: OUTPUT PIN SELECTION
RPn Port Pin RPnR SFR RPnR bits RPnR Value to Peripheral
Selection
RPA0 RPA0R RPA0R<3:0> 0000 = No Connect
0001 = U1TX
0010 = U2RTS
0011 = SS1
0100 = Reserved
0101 = OC1
0110 = Reserved
0111 = C2OUT
1000 = Reserved
1111 = Reserved
RPB3 RPB3R RPB3R<3:0>
RPB4 RPB4R RPB4R<3:0>
RPB15 RPB15R RPB15R<3:0>
RPB7 RPB7R RPB7R<3:0>
RPC7 RPC7R RPC7R<3:0>
RPC0 RPC0R RPC0R<3:0>
RPC5 RPC5R RPC5R<3:0>
RPA1 RPA1R RPA1R<3:0> 0000 = No Connect
0001 = Reserved
0010 = Reserved
0011 = SDO1
0100 = SDO2
0101 = OC2
0110 = Reserved
0111 = C3OUT
1111 = Reserved
RPB5 RPB5R RPB5R<3:0>
RPB1 RPB1R RPB1R<3:0>
RPB11 RPB11R RPB11R<3:0>
RPB8 RPB8R RPB8R<3:0>
RPA8 RPA8R RPA8R<3:0>
RPC8 RPC8R RPC8R<3:0>
RPA9 RPA9R RPA9R<3:0>
RPA2 RPA2R RPA2R<3:0> 0000 = No Connect
0001 = Reserved
0010 = Reserved
0011 = SDO1
0100 = SDO2
0101 = OC4
0110 = OC5
0111 = REFCLKO
1000 = Reserved
1111 = Reserved
RPB6 RPB6R RPB6R<3:0>
RPA4 RPA4R RPA4R<3:0>
RPB13 RPB13R RPB13R<3:0>
RPB2 RPB2R RPB2R<3:0>
RPC6 RPC6R RPC6R<3:0>
RPC1 RPC1R RPC1R<3:0>
RPC3 RPC3R RPC3R<3:0>
RPA3 RPA3R RPA3R<3:0> 0000 = No Connect
0001 = U1RTS
0010 = U2TX
0011 = Reserved
0100 = SS2
0101 = OC3
0110 = Reserved
0111 = C1OUT
1000 = Reserved
1111 = Reserved
RPB14 RPB14R RPB14R<3:0>
RPB0 RPB0R RPB0R<3:0>
RPB10 RPB10R RPB10R<3:0>
RPB9 RPB9R RPB9R<3:0>
RPC9 RPC9R RPC9R<3:0>
RPC2 RPC2R RPC2R<3:0>
RPC4 RPC4R RPC4R<3:0>
2011-2012 Microchip Technology Inc. Preliminary DS61168E-page 147
PIC32MX1XX/2XX
REGISTER 11-1: [pin name]R: PERIPHERAL PIN SELECT INPUT REGISTER
Bit
Range Bit
31/23/15/7 Bit
30/22/14/6 Bit
29/21/13/5 Bit
28/20/12/4 Bit
27/19/11/3 Bit
26/18/10/2 Bit
25/17/9/1 Bit
24/16/8/0
31:24 U-0 U-0 U-0 U-0 U-0 U-0 U-0 U-0
23:16 U-0 U-0 U-0 U-0 U-0 U-0 U-0 U-0
15:8 U-0 U-0 U-0 U-0 U-0 U-0 U-0 U-0
7:0 U-0 U-0 U-0 U-0 R/W-0 R/W-0 R/W-0 R/W-0
———[pin name]R<3:0>
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 31-4 Unimplemented: Read as ‘0
bit 3-0 [pin name]R<3:0>: Peripheral Pin Select Input bits
Where [pin name] refers to the pins that are used to configure peripheral input mapping. See Table 11-1 for
input pin selection values.
Note: Register values can only be changed if the IOLOCK Configuration bit (CFGCON<13>) = 0.
REGISTER 11-2: RPnR: PERIPHERAL PIN SELECT OUTPUT REGISTER
Bit
Range Bit
31/23/15/7 Bit
30/22/14/6 Bit
29/21/13/5 Bit
28/20/12/4 Bit
27/19/11/3 Bit
26/18/10/2 Bit
25/17/9/1 Bit
24/16/8/0
31:24 U-0 U-0 U-0 U-0 U-0 U-0 U-0 U-0
23:16 U-0 U-0 U-0 U-0 U-0 U-0 U-0 U-0
15:8 U-0 U-0 U-0 U-0 U-0 U-0 U-0 U-0
7:0 U-0 U-0 U-0 U-0 R/W-0 R/W-0 R/W-0 R/W-0
———RPnR<3:0>
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 31-4 Unimplemented: Read as ‘0
bit 3-0 RPnR<3:0>: Peripheral Pin Select Output bits
See Table 11 - 2 for output pin selection values.
Note: Register values can only be changed if the IOLOCK Configuration bit (CFGCON<13>) = 0.
PIC32MX1XX/2XX
DS61168E-page 148 Preliminary 2011-2012 Microchip Technology Inc.
REGISTER 11-3: CNCONx: CHANGE NOTICE CONTROL FOR PORTx REGISTER (x = A, B, C)
Bit
Range Bit
31/23/15/7 Bit
30/22/14/6 Bit
29/21/13/5 Bit
28/20/12/4 Bit
27/19/11/3 Bit
26/18/10/2 Bit
25/17/9/1 Bit
24/16/8/0
31:24 U-0 U-0 U-0 U-0 U-0 U-0 U-0 U-0
23:16 U-0 U-0 U-0 U-0 U-0 U-0 U-0 U-0
15:8 R/W-0 U-0 R/W-0 U-0 U-0 U-0 U-0 U-0
ON —SIDL
7:0 U-0 U-0 U-0 U-0 U-0 U-0 U-0 U-0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 31-16 Unimplemented: Read as ‘0
bit 15 ON: Change Notice (CN) Control ON bit
1 = CN is enabled
0 = CN is disabled
bit 14 Unimplemented: Read as ‘0
bit 13 SIDL: Stop in Idle Control bit
1 = CPU Idle Mode halts CN operation
0 = CPU Idle does not affect CN operation
bit 12-0 Unimplemented: Read as ‘0
2011-2012 Microchip Technology Inc. Preliminary DS61168E-page 149
PIC32MX1XX/2XX
12.0 TIMER1 This family of PIC32 devices features one
synchronous/asynchronous 16-bit timer that can operate
as a free-running interval timer for various timing applica-
tions and counting external events. This timer can also
be used with the Low-Power Secondary Oscillator
(SOSC) for Real-Time Clock (RTC) applications. The
following modes are supported:
Synchronous Internal Timer
Synchronous Internal Gated Timer
Synchronous External Timer
Asynchronous External Timer
12.1 Additional Supported Features
Selectable clock prescaler
Timer operation during CPU Idle and Sleep mode
Fast bit manipulation using CLR, SET and INV
registers
Asynchronous mode can be used with the SOSC
to function as a Real-Time Clock (RTC)
FIGURE 12-1: TIMER 1 BLOCK DIAGRAM
Note 1: This data sheet summarizes the features
of the PIC32MX1XX/2XX family of
devices. It is not intended to be a
comprehensive reference source. To
complement the information in this data
sheet, refer to Section 14. “Timers”
(DS61105) in the “PIC32 Family
Reference Manual”, which is available
from the Microchip web site
(www.microchip.com/PIC32).
2: Some registers and associated bits
described in this section may not be
available on all devices. Refer to
Section 4.0 “Memory Organization” in
this data sheet for device-specific register
and bit information.
ON
Sync
SOSCI
SOSCO/T1CK
PR1
T1IF
Equal 16-bit Comparator
TMR1
Reset
SOSCEN
Event Flag
1
0
TSYNC
TGATE
TGATE
PBCLK
1
0
TCS
Gate
Sync
TCKPS<1:0>
Prescaler
2
1, 8, 64, 256
x 1
1 0
0 0
Q
QD
Note: The default state of the SOSCEN bit (OSCCON<1>) during a device Reset is controlled by the
FSOSCEN bit in Configuration Word, DEVCFG1.
PIC32MX1XX/2XX
DS61168E-page 150 Preliminary 2011-2012 Microchip Technology Inc.
REGISTER 12-1: T1CON: TYPE A TIMER CONTROL REGISTER
Bit
Range Bit
31/23/15/7 Bit
30/22/14/6 Bit
29/21/13/5 Bit
28/20/12/4 Bit
27/19/11/3 Bit
26/18/10/2 Bit
25/17/9/1 Bit
24/16/8/0
31:24 U-0 U-0 U-0 U-0 U-0 U-0 U-0 U-0
23:16 U-0 U-0 U-0 U-0 U-0 U-0 U-0 U-0
15:8 R/W-0 U-0 R/W-0 R/W-0 R-0 U-0 U-0 U-0
ON(1) SIDL TWDIS TWIP
7:0 R/W-0 U-0 R/W-0 R/W-0 U-0 R/W-0 R/W-0 U-0
TGATE TCKPS<1:0> TSYNC TCS
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 31-16 Unimplemented: Read as ‘0
bit 15 ON: Timer On bit(1)
1 = Timer is enabled
0 = Timer is disabled
bit 14 Unimplemented: Read as ‘0
bit 13 SIDL: Stop in Idle Mode bit
1 = Discontinue operation when device enters Idle mode
0 = Continue operation even in Idle mode
bit 12 TWDIS: Asynchronous Timer Write Disable bit
1 = Writes to TMR1 are ignored until pending write operation completes
0 = Back-to-back writes are enabled (Legacy Asynchronous Timer functionality)
bit 11 TWIP: Asynchronous Timer Write in Progress bit
In Asynchronous Timer mode:
1 = Asynchronous write to TMR1 register in progress
0 = Asynchronous write to TMR1 register complete
In Synchronous Timer mode:
This bit is read as ‘0’.
bit 10-8 Unimplemented: Read as ‘0
bit 7 TGATE: Timer Gated Time Accumulation Enable bit
When TCS = 1:
This bit is ignored.
When TCS = 0:
1 = Gated time accumulation is enabled
0 = Gated time accumulation is disabled
bit 6 Unimplemented: Read as ‘0
bit 5-4 TCKPS<1:0>: Timer Input Clock Prescale Select bits
11 = 1:256 prescale value
10 = 1:64 prescale value
01 = 1:8 prescale value
00 = 1:1 prescale value
Note 1: When using 1:1 PBCmLK divisor, the user’s software should not read/write the peripheral SFRs in the
SYSCLK cycle immediately following the instruction that clears the module’s ON bit.
2011-2012 Microchip Technology Inc. Preliminary DS61168E-page 151
PIC32MX1XX/2XX
bit 3 Unimplemented: Read as ‘0
bit 2 TSYNC: Timer External Clock Input Synchronization Selection bit
When TCS = 1:
1 = External clock input is synchronized
0 = External clock input is not synchronized
When TCS = 0:
This bit is ignored.
bit 1 TCS: Timer Clock Source Select bit
1 = External clock from TxCKI pin
0 = Internal peripheral clock
bit 0 Unimplemented: Read as ‘0
REGISTER 12-1: T1CON: TYPE A TIMER CONTROL REGISTER (CONTINUED)
Note 1: When using 1:1 PBCmLK divisor, the user’s software should not read/write the peripheral SFRs in the
SYSCLK cycle immediately following the instruction that clears the module’s ON bit.
PIC32MX1XX/2XX
DS61168E-page 152 Preliminary 2011-2012 Microchip Technology Inc.
NOTES:
2011-2012 Microchip Technology Inc. Preliminary DS61168E-page 153
PIC32MX1XX/2XX
13.0 TIMER2/3, T IMER4/5
This family of PIC32 devices features four synchronous
16-bit timers (default) that can operate as a free-
running interval timer for various timing applications
and counting external events. The following modes are
supported:
Synchronous internal 16-bit timer
Synchronous internal 16-bit gated timer
Synchronous external 16-bit timer
Two 32-bit synchronous timers are available by
combining Timer2 with Timer3 and Timer4 with Timer5.
The 32-bit timers can operate in three modes:
Synchronous internal 32-bit timer
Synchronous internal 32-bit gated timer
Synchronous external 32-bit timer
13.1 Additional Supported Features
Selectable clock prescaler
Timers operational during CPU idle
Time base for Input Capture and Output Compare
modules (Timer2 and Timer3 only)
ADC event trigger (Timer3 only)
Fast bit manipulation using CLR, SET and INV
registers
FIGURE 13-1: TIMER 2-T IMER5 BLOCK DIAGRAM (16-BIT)
Note 1: This data sheet summarizes the features
of the PIC32MX1XX/2XX family of
devices. It is not intended to be a
comprehensive reference source. To
complement the information in this data
sheet, refer to Section 14. “Timers”
(DS61105) of the “PIC32 Family
Reference Manual”, which is available
from the Microchip web site
(www.microchip.com/PIC32).
2: Some registers and associated bits
described in this section may not be
available on all devices. Refer to
Section 4.0 “Memory Organization” in
this data sheet for device-specific register
and bit information.
Note: In this chapter, references to registers,
TxCON, TMRx and PRx, use ‘x’ to
represent Timer2 through Timer5 in 16-bit
modes. In 32-bit modes, ‘x’ represents
Timer2 or Timer4 and ‘y’ represents
Timer3 or Timer5.
Sync
PRx
TxIF
Equal Comparator x 16
TMRx
Reset
Event Flag
Q
QD
TGATE
1
0
Gate
TxCK
Sync
ON
TGATE
TCS
TCKPS
Prescaler
3
1, 2, 4, 8, 16,
32, 64, 256
x 1
1 0
0 0
PBCLK
Trigger(1)
ADC Event
Note 1: ADC event trigger is available on Timer3 only.
PIC32MX1XX/2XX
DS61168E-page 154 Preliminary 2011-2012 Microchip Technology Inc.
FIGURE 13-2: TIMER2/3, 4/5 BLOCK DIAGRAM (32-BIT)
TMRy(1) TMRx(1)
TyIF Event
Equal 32-bit Comparator
PRy PRx
Reset
LS Half Word
MS Half Word
Flag
Note 1: In this diagram, the use of ‘x’ in registers, TxCON, TMRx, PRx and TxCK, refers to either Timer2 or Timer4; the
use of ‘y’ in registers, TyCON, TMRy, PRy, TyIF, refers to either Timer3 or Timer5.
2: ADC event trigger is available only on the Timer2/3 pair.
TGATE
0
1
PBCLK
Gate
TxCK
Sync
Sync
ADC Event
Trigger(2)
ON
TGATE
TCS
TCKPS
Prescaler
3
1, 2, 4, 8, 16,
32, 64, 256
1 0
0 0
Q
QD
x 1
2011-2012 Microchip Technology Inc. Preliminary DS61168E-page 155
PIC32MX1XX/2XX
REGISTER 13-1: TXCON: TYPE B TIMER CONTROL REGISTER
Bit
Range Bit
31/23/15/7 Bit
30/22/14/6 Bit
29/21/13/5 Bit
28/20/12/4 Bit
27/19/11/3 Bit
26/18/10/2 Bit
25/17/9/1 Bit
24/16/8/0
31:24 U-0 U-0 U-0 U-0 U-0 U-0 U-0 U-0
23:16 U-0 U-0 U-0 U-0 U-0 U-0 U-0 U-0
15:8 R/W-0 U-0 R/W-0 U-0 U-0 U-0 U-0 U-0
ON(1,3) —SIDL
(4)
7:0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 U-0 R/W-0 U-0
TGATE(3) TCKPS<2:0>(3) T32(2) —TCS
(3)
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 31-16 Unimplemented: Read as ‘0
bit 15 ON: Timer On bit(1,3)
1 = Module is enabled
0 = Module is disabled
bit 14 Unimplemented: Read as ‘0
bit 13 SIDL: Stop in Idle Mode bit(4)
1 = Discontinue operation when device enters Idle mode
0 = Continue operation even in Idle mode
bit 12-8 Unimplemented: Read as ‘0
bit 7 TGATE: Timer Gated Time Accumulation Enable bit(3)
When TCS = 1:
This bit is ignored and is read as ‘0’.
When TCS = 0:
1 = Gated time accumulation is enabled
0 = Gated time accumulation is disabled
bit 6-4 TCKPS<2:0>: Timer Input Clock Prescale Select bits(3)
111 = 1:256 prescale value
110 = 1:64 prescale value
101 = 1:32 prescale value
100 = 1:16 prescale value
011 = 1:8 prescale value
010 = 1:4 prescale value
001 = 1:2 prescale value
000 = 1:1 prescale value
Note 1: When using 1:1 PBCLK divisor, the user’s software should not read/write the peripheral SFRs in the
SYSCLK cycle immediately following the instruction that clears the module’s ON bit.
2: This bit is available only on even numbered timers (Timer2 and Timer4).
3: While operating in 32-bit mode, this bit has no effect for odd numbered timers (Timer1, Timer3, and
Timer5). All timer functions are set through the even numbered timers.
4: While operating in 32-bit mode, this bit must be cleared on odd numbered timers to enable the 32-bit timer
in Idle mode.
PIC32MX1XX/2XX
DS61168E-page 156 Preliminary 2011-2012 Microchip Technology Inc.
bit 3 T32: 32-Bit Timer Mode Select bit(2)
1 = Odd numbered and even numbered timers form a 32-bit timer
0 = Odd numbered and even numbered timers form a separate 16-bit timer
bit 2 Unimplemented: Read as ‘0
bit 1 TCS: Timer Clock Source Select bit(3)
1 = External clock from TxCK pin
0 = Internal peripheral clock
bit 0 Unimplemented: Read as ‘0
REGISTER 13-1: TXCON: TYPE B TIMER CONTROL REGISTER (CONTINUED)
Note 1: When using 1:1 PBCLK divisor, the user’s software should not read/write the peripheral SFRs in the
SYSCLK cycle immediately following the instruction that clears the module’s ON bit.
2: This bit is available only on even numbered timers (Timer2 and Timer4).
3: While operating in 32-bit mode, this bit has no effect for odd numbered timers (Timer1, Timer3, and
Timer5). All timer functions are set through the even numbered timers.
4: While operating in 32-bit mode, this bit must be cleared on odd numbered timers to enable the 32-bit timer
in Idle mode.
2011-2012 Microchip Technology Inc. Preliminary DS61168E-page 157
PIC32MX1XX/2XX
14.0 INPUT CAPTURE
The Input Capture module is useful in applications
requiring frequency (period) and pulse measurement.
The Input Capture module captures the 16-bit or 32-bit
value of the selected Time Base registers when an
event occurs at the ICx pin. The following events cause
capture events:
Simple capture event modes
- Capture timer value on every rising and falling
edge of input at ICx pin
Capture timer value on every edge (rising and
falling)
Capture timer value on every edge (rising and
falling), specified edge first.
Prescaler capture event modes
- Capture timer value on every 4th rising edge of
input at ICx pin
- Capture timer value on every 16th rising edge of
input at ICx pin
Each input capture channel can select between one of
two 16-bit timers (Timer2 or Timer3) for the time base,
or two 16-bit timers (Timer2 and Timer3) together to
form a 32-bit timer. The selected timer can use either
an internal or external clock.
Other operational features include:
Device wake-up from capture pin during CPU
Sleep and Idle modes
Interrupt on input capture event
4-word FIFO buffer for capture values (interrupt
optionally generated after 1, 2, 3 or 4 buffer
locations are filled)
Input capture can also be used to provide
additional sources of external interrupts
FIGURE 14-1: INPUT CAPTURE BLOCK DIAGRAM
Note 1: This data sheet summarizes the features
of the PIC32MX1XX/2XX family of
devices. It is not intended to be a
comprehensive reference source. To
complement the information in this data
sheet, refer to Section 15. “Input
Capture” (DS61122) of the “PIC32
Family Reference Manual”, which is
available from the Microchip web site
(www.microchip.com/PIC32).
2: Some registers and associated bits
described in this section may not be
available on all devices. Refer to
Section 4.0 “Memory Organization” in
this data sheet for device-specific register
and bit information.
Note: An ‘x’ in a signal, register or bit name denotes the number of the capture channel.
FIFO CONTROL
ICxBUF
TMR2 TMR3
CaptureEvent
/N
FIFO
ICI<1:0>
ICM<2:0>
ICM<2:0>
101
100
011
010
001
001
111
To CPU
Set Flag ICxIF
(In IFSx Register)
Rising Edge Mode
Prescaler Mode
(4th Rising Edge)
Falling Edge Mode
Edge Detection
Prescaler Mode
(16th Rising Edge)
Sleep/Idle
Wake-up Mode
C32/ICTMR
ICx pin
Mode
110
Specified/Every
Edge Mode
FEDGE
PIC32MX1XX/2XX
DS61168E-page 158 Preliminary 2011-2012 Microchip Technology Inc.
REGISTER 14-1: ICXCON: INPUT CAPTURE ‘x’ CONTROL REGISTER
Bit Range Bit
31/23/15/7 Bit
30/22/14/6 Bit
29/21/13/5 Bit
28/20/12/4 Bit
27/19/11/3 Bit
26/18/10/2 Bit
25/17/9/1 Bit
24/16/8/0
31:24 U-0 U-0 U-0 U-0 U-0 U-0 U-0 U-0
23:16 U-0 U-0 U-0 U-0 U-0 U-0 U-0 U-0
15:8 R/W-0 U-0 R/W-0 U-0 U-0 U-0 R/W-0 R/W-0
ON(1) —SIDL —FEDGEC32
7:0 R/W-0 R/W-0 R/W-0 R-0 R-0 R/W-0 R/W-0 R/W-0
ICTMR ICI<1:0> ICOV ICBNE ICM<2:0>
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit
-n = Bit Value at POR: (‘0’, ‘1’, x = unknown) P = Programmable bit r = Reserved bit
bit 31-16 Unimplemented: Read as ‘0
bit 15 ON: Input Capture Module Enable bit(1)
1= Module enabled
0= Disable and reset module, disable clocks, disable interrupt generation and allow SFR modifications
bit 14 Unimplemented: Read as ‘0
bit 13 SIDL: Stop in Idle Control bit
1= Halt in CPU Idle mode
0= Continue to operate in CPU Idle mode
bit 12-10 Unimplemented: Read as ‘0
bit 9 FEDGE: First Capture Edge Select bit (only used in mode 6, ICM<2:0> = 110)
1= Capture rising edge first
0= Capture falling edge first
bit 8 C32: 32-bit Capture Select bit
1= 32-bit timer resource capture
0= 16-bit timer resource capture
bit 7 ICTMR: Timer Select bit (Does not affect timer selection when C32 (ICxCON<8>) is ‘1’)
0= Timer3 is the counter source for capture
1= Timer2 is the counter source for capture
bit 6-5 ICI<1:0>: Interrupt Control bits
11 = Interrupt on every fourth capture event
10 = Interrupt on every third capture event
01 = Interrupt on every second capture event
00 = Interrupt on every capture event
bit 4 ICOV: Input Capture Overflow Status Flag bit (read-only)
1= Input capture overflow occurred
0= No input capture overflow occurred
bit 3 ICBNE: Input Capture Buffer Not Empty Status bit (read-only)
1= Input capture buffer is not empty; at least one more capture value can be read
0= Input capture buffer is empty
Note 1: When using 1:1 PBCLK divisor, the user’s software should not read/write the peripheral’s SFRs in the
SYSCLK cycle immediately following the instruction that clears the module’s ON bit.
2011-2012 Microchip Technology Inc. Preliminary DS61168E-page 159
PIC32MX1XX/2XX
bit 2-0 ICM<2:0>: Input Capture Mode Select bits
111 = Interrupt-Only mode (only supported while in Sleep mode or Idle mode)
110 = Simple Capture Event mode – every edge, specified edge first and every edge thereafter
101 = Prescaled Capture Event mode – every sixteenth rising edge
100 = Prescaled Capture Event mode – every fourth rising edge
011 = Simple Capture Event mode – every rising edge
010 = Simple Capture Event mode – every falling edge
001 = Edge Detect mode – every edge (rising and falling)
000 = Input Capture module is disabled
REGISTER 14-1: ICXCON: INPUT CAPTURE ‘x’ CONTROL REGISTER (CONTINUED)
Note 1: When using 1:1 PBCLK divisor, the user’s software should not read/write the peripheral’s SFRs in the
SYSCLK cycle immediately following the instruction that clears the module’s ON bit.
PIC32MX1XX/2XX
DS61168E-page 160 Preliminary 2011-2012 Microchip Technology Inc.
NOTES:
2011-2012 Microchip Technology Inc. Preliminary DS61168E-page 161
PIC32MX1XX/2XX
15.0 OUTPUT COMPARE The Output Compare module (OCMP) is used to gen-
erate a single pulse or a train of pulses in response to
selected time base events. For all modes of operation,
the OCMP module compares the values stored in the
OCxR and/or the OCxRS registers to the value in the
selected timer. When a match occurs, the OCMP
module generates an event based on the selected
mode of operation.
The following are some of the key features:
Multiple Output Compare Modules in a device
Programmable interrupt generation on compare
event
Single and Dual Compare modes
Single and continuous output pulse generation
Pulse-Width Modulation (PWM) mode
Hardware-based PWM Fault detection and
automatic output disable
Programmable selection of 16-bit or 32-bit time
bases
Can operate from either of two available 16-bit
time bases or a single 32-bit time base
FIGURE 15-1: OUTPUT COMPARE MODULE BLOCK DIAGRAM
Note 1: This data sheet summarizes the features
of the PIC32MX1XX/2XX family of
devices. It is not intended to be a
comprehensive reference source. To
complement the information in this data
sheet, refer to Section 16. “Output
Compare” (DS61111) in the “PIC32
Family Reference Manual”, which is
available from the Microchip web site
(www.microchip.com/PIC32).
2: Some registers and associated bits
described in this section may not be
available on all devices. Refer to
Section 4.0 “Memory Organization” in
this data sheet for device-specific register
and bit information.
OCxR(1)
Comparator
Output
Logic
QS
R
OCM<2:0>
Output Enable
OCx(1)
Set Flag bit
OCxIF(1)
OCxRS(1)
Mode Select
3
Note 1: Where ‘x’ is shown, reference is made to the registers associated with the respective output compare channels,
1 through 5.
2: The OCFA pin controls the OC1-OC4 channels. The OCFB pin controls the OC5 channel.
01
OCTSEL 01
16
16
OCFA or OCFB(2)
Timer2 Timer2 Timer3
Logic
Output
Enable
Timer3
Rollover Rollover
PIC32MX1XX/2XX
DS61168E-page 162 Preliminary 2011-2012 Microchip Technology Inc.
REGISTER 15-1: OCxCON: OUTPUT COMPARE ‘x’ CONTROL REGISTER
Bit
Range Bit
31/23/15/7 Bit
30/22/14/6 Bit
29/21/13/5 Bit
28/20/12/4 Bit
27/19/11/3 Bit
26/18/10/2 Bit
25/17/9/1 Bit
24/16/8/0
31:24 U-0 U-0 U-0 U-0 U-0 U-0 U-0 U-0
23:16 U-0 U-0 U-0 U-0 U-0 U-0 U-0 U-0
15:8 R/W-0 U-0 R/W-0 U-0 U-0 U-0 U-0 U-0
ON(1) —SIDL
7:0 U-0 U-0 R/W-0 R-0 R/W-0 R/W-0 R/W-0 R/W-0
OC32 OCFLT(2) OCTSEL OCM<2:0>
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 31-16 Unimplemented: Read as ‘0
bit 15 ON: Output Compare Peripheral On bit(1)
1 = Output Compare peripheral is enabled
0 = Output Compare peripheral is disabled
bit 14 Unimplemented: Read as ‘0
bit 13 SIDL: Stop in Idle Mode bit
1 = Discontinue operation when CPU enters Idle mode
0 = Continue operation in Idle mode
bit 12-6 Unimplemented: Read as ‘0
bit 5 OC32: 32-bit Compare Mode bit
1 = OCxR<31:0> and/or OCxRS<31:0> are used for comparisions to the 32-bit timer source
0 = OCxR<15:0> and OCxRS<15:0> are used for comparisons to the 16-bit timer source
bit 4 OCFLT: PWM Fault Condition Status bit(2)
1 = PWM Fault condition has occurred (cleared in HW only)
0 = No PWM Fault condition has occurred
bit 3 OCTSEL: Output Compare Timer Select bit
1 = Timer3 is the clock source for this OCMP module
0 = Timer2 is the clock source for this OCMP module
bit 2-0 OCM<2:0>: Output Compare Mode Select bits
111 = PWM mode on OCx; Fault pin enabled
110 = PWM mode on OCx; Fault pin disabled
101 = Initialize OCx pin low; generate continuous output pulses on OCx pin
100 = Initialize OCx pin low; generate single output pulse on OCx pin
011 = Compare event toggles OCx pin
010 = Initialize OCx pin high; compare event forces OCx pin low
001 = Initialize OCx pin low; compare event forces OCx pin high
000 = Output compare peripheral is disabled but continues to draw current
Note 1: When using 1:1 PBCLK divisor, the user’s software should not read/write the peripheral’s SFRs in the
SYSCLK cycle immediately following the instruction that clears the module’s ON bit.
2: This bit is only used when OCM<2:0> = ‘111’. It is read as ‘0’ in all other modes.
2011-2012 Microchip Technology Inc. Preliminary DS61168E-page 163
PIC32MX1XX/2XX
16.0 SERIAL PERIPHERAL
INTERFACE (SPI) The SPI module is a synchronous serial interface that
is useful for communicating with external peripherals
and other microcontroller devices. These peripheral
devices may be Serial EEPROMs, Shift registers, dis-
play drivers, Analog-to-Digital Converters (ADC), etc.
The PIC32 SPI module is compatible with Motorola®
SPI and SIOP interfaces.
Some of the key features of the SPI module are:
Master and Slave modes support
Four different clock formats
Enhanced Framed SPI protocol support
User-configurable 8-bit, 16-bit and 32-bit data width
Separate SPI FIFO buffers for receive and transmit
- FIFO buffers act as 4/8/16-level deep FIFOs
based on 32/16/8-bit data width
Programmable interrupt event on every 8-bit,
16-bit and 32-bit data transfer
Operation during CPU Sleep and Idle mode
Audio Codec Support:
-I
2S protocol
- Left-justified
- Right-justified
-PCM
FIGURE 16-1: SPI MODULE BLOCK DIAGRAM
Note 1: This data sheet summarizes the features
of the PIC32MX1XX/2XX family of
devices. It is not intended to be a
comprehensive reference source. To
complement the information in this data
sheet, refer to Section 23. “Serial
Peripheral Interface (SPI)” (DS61106) in
the “PIC32 Family Reference Manual”,
which is available from the Microchip web
site (www.microchip.com/PIC32).
2: Some registers and associated bits
described in this section may not be
available on all devices. Refer to
Section 4.0 “Memory Organization” in
this data sheet for device-specific register
and bit information.
Internal
Data Bus
SDIx
SDOx
SSx/FSYNC
SCKx
SPIxSR
bit 0
Shift
Control
Edge
Select
MSTEN
Baud Rate
Slave Select
Sync Control
Clock
Control
Transmit
Receive
and Frame
Note: Access SPIxTXB and SPIxRXB FIFOs via SPIxBUF register.
FIFOs Share Address SPIxBUF
SPIxBUF
Generator
PBCLK
WriteRead
SPIxTXB FIFO
SPIxRXB FIFO
REFCLK
MCLKSEL
PIC32MX1XX/2XX
DS61168E-page 164 Preliminary 2011-2012 Microchip Technology Inc.
REGISTER 16-1: SPIxCON: SPI CONTROL REGISTER
Bit
Range Bit
31/23/15/7 Bit
30/22/14/6 Bit
29/21/13/5 Bit
28/20/12/4 Bit
27/19/11/3 Bit
26/18/10/2 Bit
25/17/9/1 Bit
24/16/8/0
31:24 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
FRMEN FRMSYNC FRMPOL MSSEN FRMSYPW FRMCNT<2:0>
23:16 R/W-0 U-0 U-0 U-0 U-0 U-0 R/W-0 R/W-0
MCLKSEL(2) SPIFE ENHBUF(2)
15:8 R/W-0 U-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
ON(1) SIDL DISSDO MODE32 MODE16 SMP CKE(3)
7:0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
SSEN CKP(4) MSTEN DISSDI STXISEL<1:0> SRXISEL<1:0>
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 31 FRMEN: Framed SPI Support bit
1 = Framed SPI support is enabled (SSx pin used as FSYNC input/output)
0 = Framed SPI support is disabled
bit 30 FRMSYNC: Frame Sync Pulse Direction Control on SSx pin bit (Framed SPI mode only)
1 = Frame sync pulse input (Slave mode)
0 = Frame sync pulse output (Master mode)
bit 29 FRMPOL: Frame Sync Polarity bit (Framed SPI mode only)
1 = Frame pulse is active-high
0 = Frame pulse is active-low
bit 28 MSSEN: Master Mode Slave Select Enable bit
1 = Slave select SPI support enabled. The SS pin is automatically driven during transmission in
Master mode. Polarity is determined by the FRMPOL bit.
0 = Slave select SPI support is disabled.
bit 27 FRMSYPW: Frame Sync Pulse Width bit
1 = Frame sync pulse is one character wide
0 = Frame sync pulse is one clock wide
bit 26-24 FRMCNT<2:0>: Frame Sync Pulse Counter bits. Controls the number of data characters transmitted per
pulse. This bit is only valid in FRAMED_SYNC mode.
111 = Reserved; do not use
110 = Reserved; do not use
101 = Generate a frame sync pulse on every 32 data characters
100 = Generate a frame sync pulse on every 16 data characters
011 = Generate a frame sync pulse on every 8 data characters
010 = Generate a frame sync pulse on every 4 data characters
001 = Generate a frame sync pulse on every 2 data characters
000 = Generate a frame sync pulse on every data character
bit 23 MCLKSEL: Master Clock Enable bit(2)
1 = REFCLK is used by the Baud Rate Generator
0 = PBCLK is used by the Baud Rate Generator
bit 22-18 Unimplemented: Read as ‘0
Note 1: When using the 1:1 PBCLK divisor, the user’s software should not read or write the peripheral’s SFRs in
the SYSCLK cycle immediately following the instruction that clears the module’s ON bit.
2: This bit can only be written when the ON bit = 0.
3: This bit is not used in the Framed SPI mode. The user should program this bit to ‘0’ for the Framed SPI
mode (FRMEN = 1).
4: When AUDEN = 1, the SPI module functions as if the CKP bit is equal to ‘1’, regardless of the actual value
of CKP.
2011-2012 Microchip Technology Inc. Preliminary DS61168E-page 165
PIC32MX1XX/2XX
bit 17 SPIFE: Frame Sync Pulse Edge Select bit (Framed SPI mode only)
1 = Frame synchronization pulse coincides with the first bit clock
0 = Frame synchronization pulse precedes the first bit clock
bit 16 ENHBUF: Enhanced Buffer Enable bit(2)
1 = Enhanced Buffer mode is enabled
0 = Enhanced Buffer mode is disabled
bit 15 ON: SPI Peripheral On bit(1)
1 = SPI Peripheral is enabled
0 = SPI Peripheral is disabled
bit 14 Unimplemented: Read as ‘0
bit 13 SIDL: Stop in Idle Mode bit
1 = Discontinue operation when CPU enters in Idle mode
0 = Continue operation in Idle mode
bit 12 DISSDO: Disable SDOx pin bit
1 = SDOx pin is not used by the module. Pin is controlled by associated PORT register
0 = SDOx pin is controlled by the module
bit 11-10 MODE<32,16>: 32/16-Bit Communication Select bits
When AUDEN = 1:
MODE32 MODE16 Communication
1124-bit Data, 32-bit FIFO, 32-bit Channel/64-bit Frame
1032-bit Data, 32-bit FIFO, 32-bit Channel/64-bit Frame
0116-bit Data, 16-bit FIFO, 32-bit Channel/64-bit Frame
0016-bit Data, 16-bit FIFO, 16-bit Channel/32-bit Frame
When AUDEN = 0:
MODE32 MODE16 Communication
1x32-bit
0116-bit
008-bit
bit 9 SMP: SPI Data Input Sample Phase bit
Master mode (MSTEN = 1):
1 = Input data sampled at end of data output time
0 = Input data sampled at middle of data output time
Slave mode (MSTEN = 0):
SMP value is ignored when SPI is used in Slave mode. The module always uses SMP = 0.
bit 8 CKE: SPI Clock Edge Select bit(3)
1 = Serial output data changes on transition from active clock state to Idle clock state (see CKP bit)
0 = Serial output data changes on transition from Idle clock state to active clock state (see CKP bit)
bit 7 SSEN: Slave Select Enable (Slave mode) bit
1 = SSx pin used for Slave mode
0 = SSx pin not used for Slave mode, pin controlled by port function.
bit 6 CKP: Clock Polarity Select bit(4)
1 = Idle state for clock is a high level; active state is a low level
0 = Idle state for clock is a low level; active state is a high level
bit 5 MSTEN: Master Mode Enable bit
1 = Master mode
0 =Slave mode
REGISTER 16-1: SPIxCON: SPI CONTROL REGISTER (CONTINUED)
Note 1: When using the 1:1 PBCLK divisor, the user’s software should not read or write the peripheral’s SFRs in
the SYSCLK cycle immediately following the instruction that clears the module’s ON bit.
2: This bit can only be written when the ON bit = 0.
3: This bit is not used in the Framed SPI mode. The user should program this bit to ‘0’ for the Framed SPI
mode (FRMEN = 1).
4: When AUDEN = 1, the SPI module functions as if the CKP bit is equal to ‘1’, regardless of the actual value
of CKP.
PIC32MX1XX/2XX
DS61168E-page 166 Preliminary 2011-2012 Microchip Technology Inc.
bit 4 DISSDI: Disable SDI bit
1 = SDI pin is not used by the SPI module (pin is controlled by PORT function)
0 = SDI pin is controlled by the SPI module
bit 3-2 STXISEL<1:0>: SPI Transmit Buffer Empty Interrupt Mode bits
11 = Interrupt is generated when the buffer is not full (has one or more empty elements)
10 = Interrupt is generated when the buffer is empty by one-half or more
01 = Interrupt is generated when the buffer is completely empty
00 = Interrupt is generated when the last transfer is shifted out of SPISR and transmit operations are
complete
bit 1-0 SRXISEL<1:0>: SPI Receive Buffer Full Interrupt Mode bits
11 = Interrupt is generated when the buffer is full
10 = Interrupt is generated when the buffer is full by one-half or more
01 = Interrupt is generated when the buffer is not empty
00 = Interrupt is generated when the last word in the receive buffer is read (i.e., buffer is empty)
REGISTER 16-1: SPIxCON: SPI CONTROL REGISTER (CONTINUED)
Note 1: When using the 1:1 PBCLK divisor, the user’s software should not read or write the peripheral’s SFRs in
the SYSCLK cycle immediately following the instruction that clears the module’s ON bit.
2: This bit can only be written when the ON bit = 0.
3: This bit is not used in the Framed SPI mode. The user should program this bit to ‘0’ for the Framed SPI
mode (FRMEN = 1).
4: When AUDEN = 1, the SPI module functions as if the CKP bit is equal to ‘1’, regardless of the actual value
of CKP.
2011-2012 Microchip Technology Inc. Preliminary DS61168E-page 167
PIC32MX1XX/2XX
REGISTER 16-2: SPIxCON2: SPI CONTROL REGISTER 2
Bit
Range Bit
31/23/15/7 Bit
30/22/14/6 Bit
29/21/13/5 Bit
28/20/12/4 Bit
27/19/11/3 Bit
26/18/10/2 Bit
25/17/9/1 Bit
24/16/8/0
31:24 U-0 U-0 U-0 U-0 U-0 U-0 U-0 U-0
23:16 U-0 U-0 U-0 U-0 U-0 U-0 U-0 U-0
15:8 R/W-0 U-0 U-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
SPISGNEXT FRMERREN SPIROVEN SPITUREN IGNROV IGNTUR
7:0 R/W-0 U-0 U-0 U-0 R/W-0 U-0 R/W-0 R/W-0
AUDEN(1) AUDMONO(1,2) AUDMOD<1:0>(1,2)
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 31-16 Unimplemented: Read as ‘0
bit 15 SPISGNEXT: Sign Extend Read Data from the RX FIFO bit
1 = Data from RX FIFO is sign extended
0 = Data from RX FIFO is not sign extened
bit 14-13 Unimplemented: Read as ‘0
bit 12 FRMERREN: Enable Interrupt Events via FRMERR bit
1 = Frame Error overflow generates error events
0 = Frame Error does not generate error events
bit 11 SPIROVEN: Enable Interrupt Events via SPIROV bit
1 = Receive overflow generates error events
0 = Receive overflow does not generate error events
bit 10 SPITUREN: Enable Interrupt Events via SPITUR bit
1 = Transmit Underrun Generates Error Events
0 = Transmit Underrun Does Not Generates Error Events
bit 9 IGNROV: Ignore Receive Overflow bit (for Audio Data Transmissions)
1 = A ROV is not a critical error; during ROV data in the fifo is not overwritten by receive data
0 = A ROV is a critical error which stop SPI operation
bit 8 IGNTUR: Ignore Transmit Underrun bit (for Audio Data Transmissions)
1 = A TUR is not a critical error and zeros are transmitted until the SPIxTXB is not empty
0 = A TUR is a critical error which stop SPI operation
bit 7 AUDEN: Enable Audio CODEC Support bit(1)
1 = Audio protocol enabled
0 = Audio protocol disabled
bit 6-5 Unimplemented: Read as ‘0
bit 3 AUDMONO: Transmit Audio Data Format bit(1,2)
1 = Audio data is mono (Each data word is transmitted on both left and right channels)
0 = Audio data is stereo
bit 2 Unimplemented: Read as ‘0
bit 1-0 AUDMOD<1:0>: Audio Protocol Mode bit(1,2)
11 = PCM/DSP mode
10 = Right Justified mode
01 = Left Justified mode
00 = I2S mode
Note 1: This bit can only be written when the ON bit = 0.
2: This bit is only valid for AUDEN = 1.
PIC32MX1XX/2XX
DS61168E-page 168 Preliminary 2011-2012 Microchip Technology Inc.
REGISTER 16-3: SPIxSTAT: SPI STATUS REGISTER
Bit
Range Bit
31/23/15/7 Bit
30/22/14/6 Bit
29/21/13/5 Bit
28/20/12/4 Bit
27/19/11/3 Bit
26/18/10/2 Bit
25/17/9/1 Bit
24/16/8/0
31:24 U-0 U-0 U-0 R-0 R-0 R-0 R-0 R-0
RXBUFELM<4:0>
23:16 U-0 U-0 U-0 R-0 R-0 R-0 R-0 R-0
TXBUFELM<4:0>
15:8 U-0 U-0 U-0 R/C-0, HS R-0 U-0 U-0 R-0
FRMERR SPIBUSY —SPITUR
7:0 R-0 R/W-0 R-0 U-0 R-1 U-0 R-0 R-0
SRMT SPIROV SPIRBE —SPITBE SPITBF SPIRBF
Legend: C = Clearable bit HS = Set in hardware
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 31-29 Unimplemented: Read as ‘0
bit 28-24 RXBUFELM<4:0>: Receive Buffer Element Count bits (valid only when ENHBUF = 1)
bit 23-21 Unimplemented: Read as ‘0
bit 20-16 TXBUFELM<4:0>: Transmit Buffer Element Count bits (valid only when ENHBUF = 1)
bit 15-13 Unimplemented: Read as ‘0
bit 12 FRMERR: SPI Frame Error status bit
1 = Frame error detected
0 = No Frame error detected
This bit is only valid when FRMEN = 1.
bit 11 SPIBUSY: SPI Activity Status bit
1 = SPI peripheral is currently busy with some transactions
0 = SPI peripheral is currently idle
bit 10-9 Unimplemented: Read as ‘0
bit 8 SPITUR: Transmit Under Run bit
1 = Transmit buffer has encountered an underrun condition
0 = Transmit buffer has no underrun condition
This bit is only valid in Framed Sync mode; the underrun condition must be cleared by disabling/re-enabling
the module.
bit 7 SRMT: Shift Register Empty bit (valid only when ENHBUF = 1)
1 = When SPI module shift register is empty
0 = When SPI module shift register is not empty
bit 6 SPIROV: Receive Overflow Flag bit
1 = A new data is completely received and discarded. The user software has not read the previous data in
the SPIxBUF register.
0 = No overflow has occurred
This bit is set in hardware; can only be cleared (= 0) in software.
bit 5 SPIRBE: RX FIFO Empty bit (valid only when ENHBUF = 1)
1 = RX FIFO is empty (CRPTR = SWPTR)
0 = RX FIFO is not empty (CRPTR SWPTR)
bit 4 Unimplemented: Read as ‘0
2011-2012 Microchip Technology Inc. Preliminary DS61168E-page 169
PIC32MX1XX/2XX
bit 3 SPITBE: SPI Transmit Buffer Empty Status bit
1 = Transmit buffer, SPIxTXB is empty
0 = Transmit buffer, SPIxTXB is not empty
Automatically set in hardware when SPI transfers data from SPIxTXB to SPIxSR.
Automatically cleared in hardware when SPIxBUF is written to, loading SPIxTXB.
bit 2 Unimplemented: Read as ‘0
bit 1 SPITBF: SPI Transmit Buffer Full Status bit
1 = Transmit not yet started, SPITXB is full
0 = Transmit buffer is not full
Standard Buffer Mode:
Automatically set in hardware when the core writes to the SPIBUF location, loading SPITXB.
Automatically cleared in hardware when the SPI module transfers data from SPITXB to SPISR.
Enhanced Buffer Mode:
Set when CWPTR + 1 = SRPTR; cleared otherwise
bit 0 SPIRBF: SPI Receive Buffer Full Status bit
1 = Receive buffer, SPIxRXB is full
0 = Receive buffer, SPIxRXB is not full
Standard Buffer Mode:
Automatically set in hardware when the SPI module transfers data from SPIxSR to SPIxRXB.
Automatically cleared in hardware when SPIxBUF is read from, reading SPIxRXB.
Enhanced Buffer Mode:
Set when SWPTR + 1 = CRPTR; cleared otherwise
REGISTER 16-3: SPIxSTAT: SPI STATUS REGISTER
PIC32MX1XX/2XX
DS61168E-page 170 Preliminary 2011-2012 Microchip Technology Inc.
NOTES:
2011-2012 Microchip Technology Inc. Preliminary DS61168E-page 171
PIC32MX1XX/2XX
17.0 INTER-INTEGRATED
CIRCUIT™ (I2C™) The I2C module provides complete hardware support
for both Slave and Multi-Master modes of the I2C serial
communication standard. Figure 17-1 illustrates the
I2C module block diagram.
Each I2C module has a 2-pin interface: the SCLx pin is
clock and the SDAx pin is data.
Each I2C module offers the following key features:
•I
2C interface supporting both master and slave
operation
•I
2C Slave mode supports 7-bit and 10-bit addressing
•I
2C Master mode supports 7-bit and 10-bit
addressing
•I
2C port allows bidirectional transfers between
master and slaves
Serial clock synchronization for the I2C port can
be used as a handshake mechanism to suspend
and resume serial transfer (SCLREL control)
•I
2C supports multi-master operation; detects bus
collision and arbitrates accordingly
Provides support for address bit masking
Note 1: This data sheet summarizes the features
of the PIC32MX1XX/2XX family of
devices. It is not intended to be a
comprehensive reference source. To
complement the information in this data
sheet, refer to Section 24. “Inter-
Integrated Circuit™ (I2C™)” (DS61116)
in the “PIC32 Family Reference Manual”,
which is available from the Microchip web
site (www.microchip.com/PIC32).
2: Some registers and associated bits
described in this section may not be
available on all devices. Refer to
Section 4.0 “Memory Organization” in
this data sheet for device-specific register
and bit information.
PIC32MX1XX/2XX
DS61168E-page 172 Preliminary 2011-2012 Microchip Technology Inc.
FIGURE 17-1: I2C™ BLOCK DIAGRAM
Internal
Data Bus
SCLx
SDAx
Shift
Match Detect
I2CxADD
Start and Stop
Bit Detect
Clock
Address Match
Clock
Stretching
I2CxTRN
LSB
Shift Clock
BRG Down Counter
Reload
Control
PBCLK
Start and Stop
Bit Generation
Acknowledge
Generation
Collision
Detect
I2CxCON
I2CxSTAT
Control Logic
Read
LSB
Write
Read
I2CxBRG
I2CxRSR
Write
Read
Write
Read
Write
Read
Write
Read
Write
Read
I2CxMSK
I2CxRCV
2011-2012 Microchip Technology Inc. Preliminary DS61168E-page 173
PIC32MX1XX/2XX
REGISTER 17-1: I2CXCON: I2C™ CONTROL REGISTER
Bit
Range Bit
31/23/15/7 Bit
30/22/14/6 Bit
29/21/13/5 Bit
28/20/12/4 Bit
27/19/11/3 Bit
26/18/10/2 Bit
25/17/9/1 Bit
24/16/8/0
31:24 U-0 U-0 U-0 U-0 U-0 U-0 U-0 U-0
23:16 U-0 U-0 U-0 U-0 U-0 U-0 U-0 U-0
15:8 R/W-0 U-0 R/W-0 R/W-1, HC R/W-0 R/W-0 R/W-0 R/W-0
ON(1) SIDL SCLREL STRICT A10M DISSLW SMEN
7:0 R/W-0 R/W-0 R/W-0 R/W-0, HC R/W-0, HC R/W-0, HC R/W-0, HC R/W-0, HC
GCEN STREN ACKDT ACKEN RCEN PEN RSEN SEN
Legend: HC = Cleared in Hardware
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 31-16 Unimplemented: Read as ‘0
bit 15 ON: I2C Enable bit(1)
1 = Enables the I2C module and configures the SDA and SCL pins as serial port pins
0 = Disables the I2C module; all I2C pins are controlled by PORT functions
bit 14 Unimplemented: Read as ‘0
bit 13 SIDL: Stop in Idle Mode bit
1 = Discontinue module operation when device enters Idle mode
0 = Continue module operation in Idle mode
bit 12 SCLREL: SCLx Release Control bit (when operating as I2C slave)
1 = Release SCLx clock
0 = Hold SCLx clock low (clock stretch)
If STREN = 1:
Bit is R/W (i.e., software can write0’ to initiate stretch and write ‘1’ to release clock). Hardware clear at
beginning of slave transmission. Hardware clear at end of slave reception.
If STREN = 0:
Bit is R/S (i.e., software can only write ‘1’ to release clock). Hardware clear at beginning of slave
transmission.
bit 11 STRICT: Strict I2C Reserved Address Rule Enable bit
1 = Strict reserved addressing is enforced. Device does not respond to reserved address space or generate
addresses in reserved address space.
0 = Strict I2C Reserved Address Rule not enabled
bit 10 A10M: 10-bit Slave Address bit
1 = I2CxADD is a 10-bit slave address
0 = I2CxADD is a 7-bit slave address
bit 9 DISSLW: Disable Slew Rate Control bit
1 = Slew rate control disabled
0 = Slew rate control enabled
bit 8 SMEN: SMBus Input Levels bit
1 = Enable I/O pin thresholds compliant with SMBus specification
0 = Disable SMBus input thresholds
Note 1: When using 1:1 PBCLK divisor, the user’s software should not read/write the peripheral’s SFRs in the
SYSCLK cycle immediately following the instruction that clears the module’s ON bit.
PIC32MX1XX/2XX
DS61168E-page 174 Preliminary 2011-2012 Microchip Technology Inc.
bit 7 GCEN: General Call Enable bit (when operating as I2C slave)
1 = Enable interrupt when a general call address is received in the I2CxRSR
(module is enabled for reception)
0 = General call address disabled
bit 6 STREN: SCLx Clock Stretch Enable bit (when operating as I2C slave)
Used in conjunction with SCLREL bit.
1 = Enable software or receive clock stretching
0 = Disable software or receive clock stretching
bit 5 ACKDT: Acknowledge Data bit (when operating as I2C master, applicable during master receive)
Value that is transmitted when the software initiates an Acknowledge sequence.
1 = Send NACK during Acknowledge
0 = Send ACK during Acknowledge
bit 4 ACKEN: Acknowledge Sequence Enable bit
(when operating as I2C master, applicable during master receive)
1 = Initiate Acknowledge sequence on SDAx and SCLx pins and transmit ACKDT data bit.
Hardware clear at end of master Acknowledge sequence.
0 = Acknowledge sequence not in progress
bit 3 RCEN: Receive Enable bit (when operating as I2C master)
1 = Enables Receive mode for I2C. Hardware clear at end of eighth bit of master receive data byte.
0 = Receive sequence not in progress
bit 2 PEN: Stop Condition Enable bit (when operating as I2C master)
1 = Initiate Stop condition on SDAx and SCLx pins. Hardware clear at end of master Stop sequence.
0 = Stop condition not in progress
bit 1 RSEN: Repeated Start Condition Enable bit (when operating as I2C master)
1 = Initiate Repeated Start condition on SDAx and SCLx pins. Hardware clear at end of
master Repeated Start sequence.
0 = Repeated Start condition not in progress
bit 0 SEN: Start Condition Enable bit (when operating as I2C master)
1 = Initiate Start condition on SDAx and SCLx pins. Hardware clear at end of master Start sequence.
0 = Start condition not in progress
REGISTER 17-1: I2CXCON: I2C™ CONTROL REGISTER (CONTINUED)
Note 1: When using 1:1 PBCLK divisor, the user’s software should not read/write the peripheral’s SFRs in the
SYSCLK cycle immediately following the instruction that clears the module’s ON bit.
2011-2012 Microchip Technology Inc. Preliminary DS61168E-page 175
PIC32MX1XX/2XX
REGISTER 17-2: I2CXSTAT: I2C™ STATUS REGISTER
Bit
Range Bit
31/23/15/7 Bit
30/22/14/6 Bit
29/21/13/5 Bit
28/20/12/4 Bit
27/19/11/3 Bit
26/18/10/2 Bit
25/17/9/1 Bit
24/16/8/0
31:24 U-0 U-0 U-0 U-0 U-0 U-0 U-0 U-0
23:16 U-0 U-0 U-0 U-0 U-0 U-0 U-0 U-0
15:8 R-0, HSC R-0, HSC U-0 U-0 U-0 R/C-0, HS R-0, HSC R-0, HSC
ACKSTAT TRSTAT BCL GCSTAT ADD10
7:0
R/C-0, HS R/C-0, HS R-0, HSC R/C-0, HSC R/C-0, HSC R-0, HSC R-0, HSC R-0, HSC
IWCOL I2COV D_A P S R_W RBF TBF
Legend: HS = Set in hardware HSC = Hardware set/cleared
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared C = Clearable bit
bit 31-16 Unimplemented: Read as ‘0
bit 15 ACKSTAT: Acknowledge Status bit
(when operating as I2C™ master, applicable to master transmit operation)
1 = NACK received from slave
0 = ACK received from slave
Hardware set or clear at end of slave Acknowledge.
bit 14 TRSTAT: Transmit Status bit (when operating as I2C master, applicable to master transmit operation)
1 = Master transmit is in progress (8 bits + ACK)
0 = Master transmit is not in progress
Hardware set at beginning of master transmission. Hardware clear at end of slave Acknowledge.
bit 13-11 Unimplemented: Read as ‘0
bit 10 BCL: Master Bus Collision Detect bit
1 = A bus collision has been detected during a master operation
0 = No collision
Hardware set at detection of bus collision.
bit 9 GCSTAT: General Call Status bit
1 = General call address was received
0 = General call address was not received
Hardware set when address matches general call address. Hardware clear at Stop detection.
bit 8 ADD10: 10-bit Address Status bit
1 = 10-bit address was matched
0 = 10-bit address was not matched
Hardware set at match of 2nd byte of matched 10-bit address. Hardware clear at Stop detection.
bit 7 IWCOL: Write Collision Detect bit
1 = An attempt to write the I2CxTRN register failed because the I2C module is busy
0 = No collision
Hardware set at occurrence of write to I2CxTRN while busy (cleared by software).
bit 6 I2COV: Receive Overflow Flag bit
1 = A byte was received while the I2CxRCV register is still holding the previous byte
0 = No overflow
Hardware set at attempt to transfer I2CxRSR to I2CxRCV (cleared by software).
bit 5 D_A: Data/Address bit (when operating as I2C slave)
1 = Indicates that the last byte received was data
0 = Indicates that the last byte received was device address
Hardware clear at device address match. Hardware set by reception of slave byte.
PIC32MX1XX/2XX
DS61168E-page 176 Preliminary 2011-2012 Microchip Technology Inc.
bit 4 P: Stop bit
1 = Indicates that a Stop bit has been detected last
0 = Stop bit was not detected last
Hardware set or clear when Start, Repeated Start or Stop detected.
bit 3 S: Start bit
1 = Indicates that a Start (or Repeated Start) bit has been detected last
0 = Start bit was not detected last
Hardware set or clear when Start, Repeated Start or Stop detected.
bit 2 R_W: Read/Write Information bit (when operating as I2C slave)
1 = Read – indicates data transfer is output from slave
0 = Write – indicates data transfer is input to slave
Hardware set or clear after reception of I2C device address byte.
bit 1 RBF: Receive Buffer Full Status bit
1 = Receive complete, I2CxRCV is full
0 = Receive not complete, I2CxRCV is empty
Hardware set when I2CxRCV is written with received byte. Hardware clear when software
reads I2CxRCV.
bit 0 TBF: Transmit Buffer Full Status bit
1 = Transmit in progress, I2CxTRN is full
0 = Transmit complete, I2CxTRN is empty
Hardware set when software writes I2CxTRN. Hardware clear at completion of data transmission.
REGISTER 17-2: I2CXSTAT: I2C™ STATUS REGISTER (CONTINUED)
2011-2012 Microchip Technology Inc. Preliminary DS61168E-page 177
PIC32MX1XX/2XX
18.0 UNIVERSAL ASYNCHRONOUS
RECEIVER TRANSMITTER
(UART)
The UART module is one of the serial I/O modules
available in PIC32MX1XX/2XX family devices. The
UART is a full-duplex, asynchronous communication
channel that communicates with peripheral devices
and personal computers through protocols, such as
RS-232, RS-485, LIN and IrDA®. The module also sup-
ports the hardware flow control option, with UxCTS and
UxRTS pins, and also includes an IrDA encoder and
decoder.
The primary features of the UART module are:
Full-duplex, 8-bit or 9-bit data transmission
Even, Odd or No Parity options (for 8-bit data)
One or two Stop bits
Hardware auto-baud feature
Hardware flow control option
Fully integrated Baud Rate Generator (BRG) with
16-bit prescaler
Baud rates ranging from 38 bps to 12.5 Mbps at
50 MHz
8-level deep First-In-First-Out (FIFO) transmit
data buffer
8-level deep FIFO receive data buffer
Parity, framing and buffer overrun error detection
Support for interrupt-only on address detect
(9th bit = 1)
Separate transmit and receive interrupts
Loopback mode for diagnostic support
LIN Protocol support
IrDA encoder and decoder with 16x baud clock
output for external IrDA encoder/decoder support
Figure 18-1 illustrates a simplified block diagram of the
UART.
FIGURE 18-1: UART SIMPLIFIED BLOCK DIAGRAM
Note 1: This data sheet summarizes the features
of the PIC32MX1XX/2XX family of
devices. It is not intended to be a
comprehensive reference source. To
complement the information in this data
sheet, refer to Section 21. “Universal
Asynchronous Receiver Transmitter
(UART)” (DS61107) in the “PIC32 Family
Reference Manual”, which is available
from the Microchip web site
(www.microchip.com/PIC32).
2: Some registers and associated bits
described in this section may not be
available on all devices. Refer to
Section 4.0 “Memory Organization” in
this data sheet for device-specific register
and bit information.
Baud Rate Generator
UxRX
Hardware Flow Control
UARTx Receiver
UARTx Transmitter UxTX
UxCTS
UxRTS/BCLKx
IrDA®
Note: Not all pins are available for all UART modules. Refer to the device-specific pin diagram for more information.
PIC32MX1XX/2XX
DS61168E-page 178 Preliminary 2011-2012 Microchip Technology Inc.
REGISTER 18-1: UxMODE: UARTx MODE REGISTER
Bit
Range Bit
31/23/15/7 Bit
30/22/14/6 Bit
29/21/13/5 Bit
28/20/12/4 Bit
27/19/11/3 Bit
26/18/10/2 Bit
25/17/9/1 Bit
24/16/8/0
31:24 U-0 U-0 U-0 U-0 U-0 U-0 U-0 U-0
23:16 U-0 U-0 U-0 U-0 U-0 U-0 U-0 U-0
15:8 R/W-0 U-0 R/W-0 R/W-0 R/W-0 U-0 R/W-0 R/W-0
ON(1) —SIDLIRENRTSMD—UEN<1:0>
7:0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
WAKE LPBACK ABAUD RXINV BRGH PDSEL<1:0> STSEL
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 31-16 Unimplemented: Read as ‘0
bit 15 ON: UARTx Enable bit(1)
1 = UARTx is enabled. UARTx pins are controlled by UARTx as defined by UEN<1:0> and UTXEN
control bits
0 = UARTx is disabled. All UARTx pins are controlled by corresponding bits in the PORTx, TRISx and LATx
registers; UARTx power consumption is minimal
bit 14 Unimplemented: Read as ‘0
bit 13 SIDL: Stop in Idle Mode bit
1 = Discontinue operation when device enters Idle mode
0 = Continue operation in Idle mode
bit 12 IREN: IrDA Encoder and Decoder Enable bit
1 = IrDA is enabled
0 = IrDA is disabled
bit 11 RTSMD: Mode Selection for UxRTS Pin bit
1 =UxRTS
pin is in Simplex mode
0 =UxRTS
pin is in Flow Control mode
bit 10 Unimplemented: Read as ‘0
bit 9-8 UEN<1:0>: UARTx Enable bits
11 = UxTX, UxRX and UxBCLK pins are enabled and used; UxCTS pin is controlled by corresponding bits
in the PORTx register
10 = UxTX, UxRX, UxCTS and UxRTS pins are enabled and used
01 = UxTX, UxRX and UxRTS pins are enabled and used; UxCTS pin is controlled by corresponding bits
in the PORTx register
00 = UxTX and UxRX pins are enabled and used; UxCTS and UxRTS/UxBCLK pins are controlled by
corresponding bits in the PORTx register
bit 7 WAKE: Enable Wake-up on Start bit Detect During Sleep Mode bit
1 = Wake-up enabled
0 = Wake-up disabled
bit 6 LPBACK: UARTx Loopback Mode Select bit
1 = Loopback mode is enabled
0 = Loopback mode is disabled
Note 1: When using 1:1 PBCLK divisor, the user software should not read/write the peripheral SFRs in the
SYSCLK cycle immediately following the instruction that clears the module’s ON bit.
2011-2012 Microchip Technology Inc. Preliminary DS61168E-page 179
PIC32MX1XX/2XX
bit 5 ABAUD: Auto-Baud Enable bit
1 = Enable baud rate measurement on the next character – requires reception of Sync character (0x55);
cleared by hardware upon completion
0 = Baud rate measurement disabled or completed
bit 4 RXINV: Receive Polarity Inversion bit
1 = UxRX Idle state is ‘0
0 = UxRX Idle state is ‘1
bit 3 BRGH: High Baud Rate Enable bit
1 = High-Speed mode – 4x baud clock enabled
0 = Standard Speed mode – 16x baud clock enabled
bit 2-1 PDSEL<1:0>: Parity and Data Selection bits
11 = 9-bit data, no parity
10 = 8-bit data, odd parity
01 = 8-bit data, even parity
00 = 8-bit data, no parity
bit 0 STSEL: Stop Selection bit
1 = 2 Stop bits
0 = 1 Stop bit
REGISTER 18-1: UxMODE: UARTx MODE REGISTER (CONTINUED)
Note 1: When using 1:1 PBCLK divisor, the user software should not read/write the peripheral SFRs in the
SYSCLK cycle immediately following the instruction that clears the module’s ON bit.
PIC32MX1XX/2XX
DS61168E-page 180 Preliminary 2011-2012 Microchip Technology Inc.
REGISTER 18-2: UxSTA: UARTx STATUS AND CONTROL REGISTER
Bit
Range Bit
31/23/15/7 Bit
30/22/14/6 Bit
29/21/13/5 Bit
28/20/12/4 Bit
27/19/11/3 Bit
26/18/10/2 Bit
25/17/9/1 Bit
24/16/8/0
31:24 U-0 U-0 U-0 U-0 U-0 U-0 U-0 R/W-0
—ADM_EN
23:16 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
ADDR<7:0>
15:8 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R-0 R-1
UTXISEL<1:0> UTXINV URXEN UTXBRK UTXEN UTXBF TRMT
7:0 R/W-0 R/W-0 R/W-0 R-1 R-0 R-0 R/W-0 R-0
URXISEL<1:0> ADDEN RIDLE PERR FERR OERR URXDA
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 31-25 Unimplemented: Read as ‘0
bit 24 ADM_EN: Automatic Address Detect Mode Enable bit
1 = Automatic Address Detect mode is enabled
0 = Automatic Address Detect mode is disabled
bit 23-16 ADDR<7:0>: Automatic Address Mask bits
When the ADM_EN bit is ‘1’, this value defines the address character to use for automatic address
detection.
bit 15-14 UTXISEL<1:0>: TX Interrupt Mode Selection bits
11 = Reserved, do not use
10 = Interrupt is generated and asserted while the transmit buffer is empty
01 = Interrupt is generated and asserted when all characters have been transmitted
00 = Interrupt is generated and asserted while the transmit buffer contains at least one empty space
bit 13 UTXINV: Transmit Polarity Inversion bit
If IrDA mode is disabled (i.e., IREN (UxMODE<12>) is ‘0’):
1 = UxTX Idle state is ‘0
0 = UxTX Idle state is ‘1
If IrDA mode is enabled (i.e., IREN (UxMODE<12>) is ‘1’):
1 = IrDA encoded UxTX Idle state is ‘1
0 = IrDA encoded UxTX Idle state is ‘0
bit 12 URXEN: Receiver Enable bit
1 = UARTx receiver is enabled. UxRX pin is controlled by UARTx (if ON = 1)
0 = UARTx receiver is disabled. UxRX pin is ignored by the UARTx module. UxRX pin is controlled by port.
bit 11 UTXBRK: Transmit Break bit
1 = Send Break on next transmission. Start bit followed by twelve ‘0’ bits, followed by Stop bit; cleared by
hardware upon completion
0 = Break transmission is disabled or completed
bit 10 UTXEN: Transmit Enable bit
1 = UARTx transmitter is enabled. UxTX pin is controlled by UARTx (if ON = 1).
0 = UARTx transmitter is disabled. Any pending transmission is aborted and buffer is reset. UxTX pin is con-
trolled by port.
bit 9 UTXBF: Transmit Buffer Full Status bit (read-only)
1 = Transmit buffer is full
0 = Transmit buffer is not full, at least one more character can be written
bit 8 TRMT: Transmit Shift Register is Empty bit (read-only)
1 = Transmit shift register is empty and transmit buffer is empty (the last transmission has completed)
0 = Transmit shift register is not empty, a transmission is in progress or queued in the transmit buffer
2011-2012 Microchip Technology Inc. Preliminary DS61168E-page 181
PIC32MX1XX/2XX
bit 7-6 URXISEL<1:0>: Receive Interrupt Mode Selection bit
11 = Reserved; do not use
10 = Interrupt flag bit is asserted while receive buffer is 3/4 or more full (i.e., has 6 or more data characters)
01 = Interrupt flag bit is asserted while receive buffer is 1/2 or more full (i.e., has 4 or more data characters)
00 = Interrupt flag bit is asserted while receive buffer is not empty (i.e., has at least 1 data character)
bit 5 ADDEN: Address Character Detect bit (bit 8 of received data = 1)
1 = Address Detect mode is enabled. If 9-bit mode is not selected, this control bit has no effect.
0 = Address Detect mode is disabled
bit 4 RIDLE: Receiver Idle bit (read-only)
1 = Receiver is Idle
0 = Data is being received
bit 3 PERR: Parity Error Status bit (read-only)
1 = Parity error has been detected for the current character
0 = Parity error has not been detected
bit 2 FERR: Framing Error Status bit (read-only)
1 = Framing error has been detected for the current character
0 = Framing error has not been detected
bit 1 OERR: Receive Buffer Overrun Error Status bit.
This bit is set in hardware and can only be cleared (= 0) in software. Clearing a previously set OERR bit.
resets the receiver buffer and RSR to empty state.
1 = Receive buffer has overflowed
0 = Receive buffer has not overflowed
bit 0 URXDA: Receive Buffer Data Available bit (read-only)
1 = Receive buffer has data, at least one more character can be read
0 = Receive buffer is empty
REGISTER 18-2: UxSTA: UARTx STATUS AND CONTROL REGISTER (CONTINUED)
PIC32MX1XX/2XX
DS61168E-page 182 Preliminary 2011-2012 Microchip Technology Inc.
Figure 18-2 and Figure 18-3 illustrate typical receive
and transmit timing for the UART module.
FIGURE 18-2: UART RECEPTION
FIGURE 18-3: TRANSMISSION (8-BIT OR 9-BIT DATA)
Start 1 Stop Start 2 Stop 4 Start 5 Stop 10 Start 11 Stop 13
Read to
UxRXREG
UxRX
RIDLE
OERR
UxRXIF
URXISEL = 00
UxRXIF
URXISEL = 01
UxRXIF
URXISEL = 10
Char 1 Char 2-4 Char 5-10 Char 11-13
Cleared by
Software
Cleared by
Software
Cleared by
Software
StartStart Bit 0 Bit 1 Stop
Write to
TSR
BCLK/16
(Shift Clock)
UxTX
UxTXIF
UxTXIF
UTXISEL = 00
Bit 1
UxTXREG
UTXISEL = 01
UxTXIF
UTXISEL = 10
8 into TxBUF
Pull from Buffer
2011-2012 Microchip Technology Inc. Preliminary DS61168E-page 183
PIC32MX1XX/2XX
19.0 PARALLEL MASTER PORT
(PMP)
The PMP is a parallel 8-bit input/output module
specifically designed to communicate with a wide
variety of parallel devices, such as communications
peripherals, LCDs, external memory devices and
microcontrollers. Because the interface to parallel
peripherals varies significantly, the PMP module is
highly configurable.
Key features of the PMP module include:
Fully multiplexed address/data mode
Demultiplexed or partially multiplexed address/
data mode
- up to 11 address lines with single Chip Select
- up to 12 address lines without Chip Select
One Chip Select Line
Programmable Strobe Options
- Individual Read and Write Strobes or;
- Read/Write Strobe with Enable Strobe
Address Auto-Increment/Auto-Decrement
Programmable Address/Data Multiplexing
Programmable Polarity on Control Signals
Legacy Parallel Slave Port Support
Enhanced Parallel Slave Support
- Address Support
- 4-Byte Deep Auto-Incrementing Buffer
Programmable Wait States
Selectable Input Voltage Levels
FIGURE 19-1: PMP MODULE PINOUT AND CONNECTIONS TO EXTERNAL DEVICES
Note 1: This data sheet summarizes the features
of the PIC32MX1XX/2XX family of
devices. It is not intended to be a
comprehensive reference source. To
complement the information in this data
sheet, refer to Section 13. “Parallel
Master Port (PMP)” (DS61128) in the
“PIC32 Family Reference Manual”, which
is available from the Microchip web site
(www.microchip.com/PIC32).
2: Some registers and associated bits
described in this section may not be
available on all devices. Refer to
Section 4.0 “Memory Organization” in
this data sheet for device-specific register
and bit information.
PMA<0>
PMA<14>
PMRD
PMWR
PMENB
PMRD/PMWR
PMCS1
PMA<1>
PMA<10:2>
PMALL
PMALH Flash
Address Bus
Data Bus
Control Lines
PIC32MX1XX/2XX
LCD FIFO
Microcontroller
8-bit Data (with or without multiplexed addressing)
Up to 12-bit Address
Parallel
Buffer
PMD<7:0>
Master Port
EEPROM
SRAM
PIC32MX1XX/2XX
DS61168E-page 184 Preliminary 2011-2012 Microchip Technology Inc.
REGISTER 19-1: PMCON: PARALLEL PORT CONTROL REGISTER
Bit
Range Bit
31/23/15/7 Bit
30/22/14/6 Bit
29/21/13/5 Bit
28/20/12/4 Bit
27/19/11/3 Bit
26/18/10/2 Bit
25/17/9/1 Bit
24/16/8/0
31:24 U-0 U-0 U-0 U-0 U-0 U-0 U-0 U-0
————————
23:16 U-0 U-0 U-0 U-0 U-0 U-0 U-0 U-0
————————
15:8 R/W-0 U-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
ON(1) —SIDL
ADRMUX<1:0>
PMPTTL PTWREN PTRDEN
7:0 R/W-0 R/W-0 R/W-0 U-0 R/W-0 U-0 R/W-0 R/W-0
CSF<1:0>(2) ALP(2) —CS1P
(2) WRSP RDSP
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 31-16 Unimplemented: Read as ‘0
bit 15 ON: Parallel Master Port Enable bit(1)
1 = PMP enabled
0 = PMP disabled, no off-chip access performed
bit 14 Unimplemented: Read as ‘0
bit 13 SIDL: Stop in Idle Mode bit
1 = Discontinue module operation when device enters Idle mode
0 = Continue module operation in Idle mode
bit 12-11 ADRMUX<1:0>: Address/Data Multiplexing Selection bits
11 = Lower 8 bits of address are multiplexed on PMD<7:0> pins; upper 8 bits are not used
10 = All 16 bits of address are multiplexed on PMD<7:0> pins
01 = Lower 8 bits of address are multiplexed on PMD<7:0> pins, upper bits are on PMA<10:8> and
PMA<14>
00 = Address and data appear on separate pins
bit 10 PMPTTL: PMP Module TTL Input Buffer Select bit
1 = PMP module uses TTL input buffers
0 = PMP module uses Schmitt Trigger input buffer
bit 9 PTWREN: Write Enable Strobe Port Enable bit
1 = PMWR/PMENB port enabled
0 = PMWR/PMENB port disabled
bit 8 PTRDEN: Read/Write Strobe Port Enable bit
1 = PMRD/PMWR port enabled
0 = PMRD/PMWR port disabled
bit 7-6 CSF<1:0>: Chip Select Function bits(2)
11 = Reserved
10 = PMCS1 function as Chip Select
01 = PMCS1 functions as address bit 14
00 = PMCS1 function as address bit 14
bit 5 ALP: Address Latch Polarity bit(2)
1 = Active-high (PMALL and PMALH)
0 = Active-low (PMALL and PMALH)
Note 1: When using 1:1 PBCLK divisor, the user’s software should not read/write the peripheral’s SFRs in the
SYSCLK cycle immediately following the instruction that clears the module’s ON control bit.
2: These bits have no effect when their corresponding pins are used as address lines.
2011-2012 Microchip Technology Inc. Preliminary DS61168E-page 185
PIC32MX1XX/2XX
bit 4 Unimplemented: Read as ‘0
bit 3 CS1P: Chip Select 0 Polarity bit(2)
1 = Active-high (PMCS1)
0 = Active-low (PMCS1)
bit 2 Unimplemented: Read as ‘0
bit 1 WRSP: Write Strobe Polarity bit
For Slave Modes and Master mode 2 (PMMODE<9:8> = 00,01,10):
1= Write strobe active-high (PMWR)
0= Write strobe active-low (PMWR)
For Master mode 1 (PMMODE<9:8> = 11):
1= Enable strobe active-high (PMENB)
0= Enable strobe active-low (PMENB)
bit 0 RDSP: Read Strobe Polarity bit
For Slave modes and Master mode 2 (PMMODE<9:8> = 00,01,10):
1= Read Strobe active-high (PMRD)
0= Read Strobe active-low (PMRD)
For Master mode 1 (PMMODE<9:8> = 11):
1= Read/write strobe active-high (PMRD/PMWR)
0= Read/write strobe active-low (PMRD/PMWR)
REGISTER 19-1: PMCON: PARALLEL PORT CONTROL REGISTER (CONTINUED)
Note 1: When using 1:1 PBCLK divisor, the user’s software should not read/write the peripheral’s SFRs in the
SYSCLK cycle immediately following the instruction that clears the module’s ON control bit.
2: These bits have no effect when their corresponding pins are used as address lines.
PIC32MX1XX/2XX
DS61168E-page 186 Preliminary 2011-2012 Microchip Technology Inc.
REGISTER 19-2: PMMODE: PARALLEL PORT MODE REGISTER
Bit
Range Bit
31/23/15/7 Bit
30/22/14/6 Bit
29/21/13/5 Bit
28/20/12/4 Bit
27/19/11/3 Bit
26/18/10/2 Bit
25/17/9/1 Bit
24/16/8/0
31:24 U-0 U-0 U-0 U-0 U-0 U-0 U-0 U-0
23:16 U-0 U-0 U-0 U-0 U-0 U-0 U-0 U-0
15:8 R-0 R/W-0 R/W-0 R/W-0 R/W-0 U-0 R/W-0 R/W-0
BUSY IRQM<1:0> INCM<1:0> MODE<1:0>
7:0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
WAITB<1:0>(1) WAITM<3:0>(1) WAITE<1:0>(1)
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set 0’ = Bit is cleared x = Bit is unknown
bit 31-16 Unimplemented: Read as ‘0
bit 15 BUSY: Busy bit (Master mode only)
1 = Port is busy
0 = Port is not busy
bit 14-13 IRQM<1:0>: Interrupt Request Mode bits
11 = Reserved, do not use
10 = Interrupt generated when Read Buffer 3 is read or Write Buffer 3 is written (Buffered PSP mode)
or on a read or write operation when PMA<1:0> =11 (Addressable Slave mode only)
01 = Interrupt generated at the end of the read/write cycle
00 = No Interrupt generated
bit 12-11 INCM<1:0>: Increment Mode bits
11 = Slave mode read and write buffers auto-increment (PMMODE<1:0> = 00 only)
10 = Decrement ADDR<10:2> and ADDR<14> by 1 every read/write cycle(2)
01 = Increment ADDR<10:2> and ADDR<14> by 1 every read/write cycle(2)
00 = No increment or decrement of address
bit 10 Unimplemented: Read as ‘0
bit 9-8 MODE<1:0>: Parallel Port Mode Select bits
11 = Master mode 1 (PMCS1, PMRD/PMWR, PMENB, PMA<x:0>, and PMD<7:0>)
10 = Master mode 2 (PMCS1, PMRD, PMWR, PMA<x:0>, and PMD<7:0>)
01 = Enhanced Slave mode, control signals (PMRD, PMWR, PMCS1, PMD<7:0>, and PMA<1:0>)
00 = Legacy Parallel Slave Port, control signals (PMRD, PMWR, PMCS1, and PMD<7:0>)
bit 7-6 WAITB<1:0>: Data Setup to Read/Write Strobe Wait States bits(1)
11 = Data wait of 4 TPB; multiplexed address phase of 4 TPB
10 = Data wait of 3 TPB; multiplexed address phase of 3 TPB
01 = Data wait of 2 TPB; multiplexed address phase of 2 TPB
00 = Data wait of 1 TPB; multiplexed address phase of 1 TPB (default)
Note 1: Whenever WAITM<3:0> = 0000, WAITB and WAITE bits are ignored and forced to 1 TPBCLK cycle for a
write operation; WAITB = 1 TPBCLK cycle, WAITE = 0 TPBCLK cycles for a read operation.
2: Address bit A14 is not subject to auto-increment/decrement if configured as Chip Select CS1.
2011-2012 Microchip Technology Inc. Preliminary DS61168E-page 187
PIC32MX1XX/2XX
bit 5-2 WAITM<3:0>: Data Read/Write Strobe Wait States bits(1)
1111 = Wait of 16 TPB
0001 = Wait of 2 TPB
0000 = Wait of 1 TPB (default)
bit 1-0 WAITE<1:0>: Data Hold After Read/Write Strobe Wait States bits(1)
11 = Wait of 4 TPB
10 = Wait of 3 TPB
01 = Wait of 2 TPB
00 = Wait of 1 TPB (default)
For Read operations:
11 = Wait of 3 TPB
10 = Wait of 2 TPB
01 = Wait of 1 TPB
00 = Wait of 0 TPB (default)
REGISTER 19-2: PMMODE: PARALLEL PORT MODE REGISTER (CONTINUED)
Note 1: Whenever WAITM<3:0> = 0000, WAITB and WAITE bits are ignored and forced to 1 TPBCLK cycle for a
write operation; WAITB = 1 TPBCLK cycle, WAITE = 0 TPBCLK cycles for a read operation.
2: Address bit A14 is not subject to auto-increment/decrement if configured as Chip Select CS1.
PIC32MX1XX/2XX
DS61168E-page 188 Preliminary 2011-2012 Microchip Technology Inc.
REGISTER 19-3: PMADDR: PARALLEL PORT ADDRESS REGISTER
Bit
Range Bit
31/23/15/7 Bit
30/22/14/6 Bit
29/21/13/5 Bit
28/20/12/4 Bit
27/19/11/3 Bit
26/18/10/2 Bit
25/17/9/1 Bit
24/16/8/0
31:24 U-0 U-0 U-0 U-0 U-0 U-0 U-0 U-0
23:16 U-0 U-0 U-0 U-0 U-0 U-0 U-0 U-0
15:8 U-0 R/W-0 U-0 U-0 U-0 R/W-0 R/W-0 R/W-0
—CS1—— ADDR<10:8>
7:0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
ADDR<7:0>
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 31-15 Unimplemented: Read as ‘0
bit 14 CS1: Chip Select 1 bit
1 = Chip Select 1 is active
0 = Chip Select 1 is inactive (pin functions as PMA<14>)
bit 13-11 Unimplemented: Read as ‘0
bit 10-0 ADDR<10:0>: Destination Address bits
2011-2012 Microchip Technology Inc. Preliminary DS61168E-page 189
PIC32MX1XX/2XX
REGISTER 19-4: PMAEN: PARALLEL PORT PIN ENABLE REGISTER
Bit
Range Bit
31/23/15/7 Bit
30/22/14/6 Bit
29/21/13/5 Bit
28/20/12/4 Bit
27/19/11/3 Bit
26/18/10/2 Bit
25/17/9/1 Bit
24/16/8/0
31:24 U-0 U-0 U-0 U-0 U-0 U-0 U-0 U-0
————————
23:16 U-0 U-0 U-0 U-0 U-0 U-0 U-0 U-0
————————
15:8 U-0 R/W-0 U-0 U-0 U-0 R/W-0 R/W-0 R/W-0
—PTEN14———PTEN<10:8>
7:0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
PTEN<7:0>
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 31-15 Unimplemented: Read as ‘0
bit 15-14 PTEN14: PMCS1 Strobe Enable bits
1 = PMA14 functions as either PMA14 or PMCS1(1)
0 = PMA14 functions as port I/O
bit 13-11 Unimplemented: Read as ‘0
bit 10-2 PTEN<10:2>: PMP Address Port Enable bits
1 = PMA<10:2> function as PMP address lines
0 = PMA<10:2> function as port I/O
bit 1-0 PTEN<1:0>: PMALH/PMALL Strobe Enable bits
1 = PMA1 and PMA0 function as either PMA<1:0> or PMALH and PMALL(2)
0 = PMA1 and PMA0 pads functions as port I/O
Note 1: The use of this pin as PMA14 or CS1 is selected by the CSF<1:0> bits in the PMCON register.
2: The use of these pins as PMA1/PMA0 or PMALH/PMALL depends on the Address/Data Multiplex mode
selected by bits ADRMUX<1:0> in the PMCON register.
PIC32MX1XX/2XX
DS61168E-page 190 Preliminary 2011-2012 Microchip Technology Inc.
REGISTER 19-5: PMSTAT: PARALLEL PORT STATUS REGISTER (SLAVE MODES ONLY)
Bit
Range Bit
31/23/15/7 Bit
30/22/14/6 Bit
29/21/13/5 Bit
28/20/12/4 Bit
27/19/11/3 Bit
26/18/10/2 Bit
25/17/9/1 Bit
24/16/8/0
31:24 U-0 U-0 U-0 U-0 U-0 U-0 U-0 U-0
————————
23:16 U-0 U-0 U-0 U-0 U-0 U-0 U-0 U-0
————————
15:8 R-0 R/W-0, HSC U-0 U-0 R-0 R-0 R-0 R-0
IBF IBOV IB3FIB2FIB1FIB0F
7:0 R-1 R/W-0, HSC U-0 U-0 R-1 R-1 R-1 R-1
OBE OBUF OB3E OB2E OB1E OB0E
Legend: HSC = Set by Hardware; Cleared by Software
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 31-16 Unimplemented: Read as ‘0
bit 15 IBF: Input Buffer Full Status bit
1 = All writable input buffer registers are full
0 = Some or all of the writable input buffer registers are empty
bit 14 IBOV: Input Buffer Overflow Status bit
1 = A write attempt to a full input byte buffer occurred (must be cleared in software)
0 = No overflow occurred
bit 13-12 Unimplemented: Read as ‘0
bit 11-8 IBxF: Input Buffer ‘x’ Status Full bits
1 = Input Buffer contains data that has not been read (reading buffer will clear this bit)
0 = Input Buffer does not contain any unread data
bit 7 OBE: Output Buffer Empty Status bit
1 = All readable output buffer registers are empty
0 = Some or all of the readable output buffer registers are full
bit 6 OBUF: Output Buffer Underflow Status bit
1 = A read occurred from an empty output byte buffer (must be cleared in software)
0 = No underflow occurred
bit 5-4 Unimplemented: Read as ‘0
bit 3-0 OBxE: Output Buffer ‘x’ Status Empty bits
1 = Output buffer is empty (writing data to the buffer will clear this bit)
0 = Output buffer contains data that has not been transmitted
2011-2012 Microchip Technology Inc. Preliminary DS61168E-page 191
PIC32MX1XX/2XX
20.0 REAL-TIME CLOCK AND
CALENDAR (RTCC)
The PIC32 RTCC module is intended for applications in
which accurate time must be maintained for extended
periods of time with minimal or no CPU intervention.
Low-power optimization provides extended battery
lifetime while keeping track of time.
Following are some of the key features of this module:
Time: hours, minutes and seconds
24-hour format (military time)
Visibility of one-half second period
Provides calendar: Weekday, date, month and
year
Alarm intervals are configurable for half of a
second, one second, 10 seconds, one minute, 10
minutes, one hour, one day, one week, one month
and one year
Alarm repeat with decrementing counter
Alarm with indefinite repeat: Chime
Year range: 2000 to 2099
Leap year correction
BCD format for smaller firmware overhead
Optimized for long-term battery operation
Fractional second synchronization
User calibration of the clock crystal frequency with
auto-adjust
Calibration range: 0.66 seconds error per month
Calibrates up to 260 ppm of crystal error
Requirements: External 32.768 kHz clock crystal
Alarm pulse or seconds clock output on
RTCC pin
FIGURE 20-1: RTCC BLOCK DIAGRAM
Note 1: This data sheet summarizes the features
of the PIC32MX1XX/2XX family of
devices. It is not intended to be a
comprehensive reference source. To
complement the information in this data
sheet, refer to Section 29. “Real-Time
Clock and Calendar (RTCC)”
(DS61125) in the “PIC32 Family
Reference Manual”, which is available
from the Microchip web site
(www.microchip.com/PIC32).
2: Some registers and associated bits
described in this section may not be
available on all devices. Refer to
Section 4.0 “Memory Organization” in
this data sheet for device-specific register
and bit information.
RTCC Prescalers
RTCC Timer
Comparator
Compare Registers
Repeat Counter
ALRMTIME
HR, MIN, SEC
ALRMDATE
with Masks
RTCC Interrupt Logic
Alarm
Event
32.768 kHz Input
from Secondary
0.5s
Alarm Pulse
Set RTCC Flag
RTCVAL
ALRMVAL
RTCC
RTCOE
Oscillator (SOSC)
CAL<9:0>
MONTH, DAY, WDAY
RTCTIME
HR, MIN, SEC
RTCDATE
YEAR, MONTH, DAY, WDAY
Seconds Pulse
RTSECSEL
0
1
PIC32MX1XX/2XX
DS61168E-page 192 Preliminary 2011-2012 Microchip Technology Inc.
REGISTER 20-1: RTCCON: RTC CONTROL REGISTER
Bit
Range Bit
31/23/15/7 Bit
30/22/14/6 Bit
29/21/13/5 Bit
28/20/12/4 Bit
27/19/11/3 Bit
26/18/10/2 Bit
25/17/9/1 Bit
24/16/8/0
31:24 U-0 U-0 U-0 U-0 U-0 U-0 R/W-0 R/W-0
—CAL<9:8>
23:16 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
CAL<7:0>
15:8 R/W-0 U-0 R/W-0 U-0 U-0 U-0 U-0 U-0
ON(1,2) —SIDL
7:0 R/W-0 R-0 U-0 U-0 R/W-0 R-0 R-0 R/W-0
RTSECSEL(3) RTCCLKON —RTCWREN
(4) RTCSYNC HALFSEC(5) RTCOE
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 31-26 Unimplemented: Read as ‘0
bit 25-16 CAL<9:0>: RTC Drift Calibration bits, which contain a signed 10-bit integer value
0111111111 = Maximum positive adjustment, adds 511 RTC clock pulses every one minute
0000000001 = Minimum positive adjustment, adds 1 RTC clock pulse every one minute
0000000000 = No adjustment
1111111111 = Minimum negative adjustment, subtracts 1 RTC clock pulse every one minute
1000000000 = Minimum negative adjustment, subtracts 512 clock pulses every one minute
bit 15 ON: RTCC On bit(1,2)
1 = RTCC module is enabled
0 = RTCC module is disabled
bit 14 Unimplemented: Read as ‘0
bit 13 SIDL: Stop in Idle Mode bit
1 = Disables the PBCLK to the RTCC when CPU enters in Idle mode
0 = Continue normal operation in Idle mode
bit 12-8 Unimplemented: Read as ‘0
bit 7 RTSECSEL: RTCC Seconds Clock Output Select bit(3)
1 = RTCC Seconds Clock is selected for the RTCC pin
0 = RTCC Alarm Pulse is selected for the RTCC pin
bit 6 RTCCLKON: RTCC Clock Enable Status bit
1 = RTCC Clock is actively running
0 = RTCC Clock is not running
Note 1: The ON bit is only writable when RTCWREN = 1.
2: When using the 1:1 PBCLK divisor, the user’s software should not read/write the peripheral’s SFRs in the
SYSCLK cycle immediately following the instruction that clears the module’s ON bit.
3: Requires RTCOE = 1 (RTCCON<0>) for the output to be active.
4: The RTCWREN bit can be set only when the write sequence is enabled.
5: This bit is read-only. It is cleared to ‘0’ on a write to the seconds bit fields (RTCTIME<14:8>).
Note: This register is reset only on a Power-on Reset (POR).
2011-2012 Microchip Technology Inc. Preliminary DS61168E-page 193
PIC32MX1XX/2XX
bit 5-4 Unimplemented: Read as ‘0
bit 3 RTCWREN: RTC Value Registers Write Enable bit(4)
1 = RTC Value registers can be written to by the user
0 = RTC Value registers are locked out from being written to by the user
bit 2 RTCSYNC: RTCC Value Registers Read Synchronization bit
1 = RTC Value registers can change while reading, due to a rollover ripple that results in an invalid data read
If the register is read twice and results in the same data, the data can be assumed to be valid
0 = RTC Value registers can be read without concern about a rollover ripple
bit 1 HALFSEC: Half-Second Status bit(5)
1 = Second half period of a second
0 = First half period of a second
bit 0 RTCOE: RTCC Output Enable bit
1 = RTCC clock output enabled – clock presented onto an I/O
0 = RTCC clock output disabled
REGISTER 20-1: RTCCON: RTC CONTROL REGISTER (CONTINUED)
Note 1: The ON bit is only writable when RTCWREN = 1.
2: When using the 1:1 PBCLK divisor, the user’s software should not read/write the peripheral’s SFRs in the
SYSCLK cycle immediately following the instruction that clears the module’s ON bit.
3: Requires RTCOE = 1 (RTCCON<0>) for the output to be active.
4: The RTCWREN bit can be set only when the write sequence is enabled.
5: This bit is read-only. It is cleared to ‘0’ on a write to the seconds bit fields (RTCTIME<14:8>).
Note: This register is reset only on a Power-on Reset (POR).
PIC32MX1XX/2XX
DS61168E-page 194 Preliminary 2011-2012 Microchip Technology Inc.
REGISTER 20-2: RTCALRM: RTC ALARM CONTROL REGISTER
Bit
Range Bit
31/23/15/7 Bit
30/22/14/6 Bit
29/21/13/5 Bit
28/20/12/4 Bit
27/19/11/3 Bit
26/18/10/2 Bit
25/17/9/1 Bit
24/16/8/0
31:24 U-0 U-0 U-0 U-0 U-0 U-0 U-0 U-0
23:16 U-0 U-0 U-0 U-0 U-0 U-0 U-0 U-0
15:8 R/W-0 R/W-0 R/W-0 R-0 R/W-0 R/W-0 R/W-0 R/W-0
ALRMEN(1,2) CHIME(2) PIV(2) ALRMSYNC(3) AMASK<3:0>(2)
7:0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
ARPT<7:0>(2)
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 31-16 Unimplemented: Read as ‘0
bit 15 ALRMEN: Alarm Enable bit(1,2)
1 = Alarm is enabled
0 = Alarm is disabled
bit 14 CHIME: Chime Enable bit(2)
1 = Chime is enabled – ARPT<7:0> is allowed to rollover from 0x00 to 0xFF
0 = Chime is disabled – ARPT<7:0> stops once it reaches 0x00
bit 13 PIV: Alarm Pulse Initial Value bit(2)
When ALRMEN = 0, PIV is writable and determines the initial value of the Alarm Pulse.
When ALRMEN = 1, PIV is read-only and returns the state of the Alarm Pulse.
bit 12 ALRMSYNC: Alarm Sync bit(3)
1 = ARPT<7:0> and ALRMEN may change as a result of a half second rollover during a read.
The ARPT must be read repeatedly until the same value is read twice. This must be done since multiple
bits may be changing, which are then synchronized to the PB clock domain
0 = ARPT<7:0> and ALRMEN can be read without concerns of rollover because the prescaler is > 32 RTC
clocks away from a half-second rollover
bit 11-8 AMASK<3:0>: Alarm Mask Configuration bits(2)
0000 = Every half-second
0001 = Every second
0010 = Every 10 seconds
0011 = Every minute
0100 = Every 10 minutes
0101 = Every hour
0110 = Once a day
0111 = Once a week
1000 = Once a month
1001 = Once a year (except when configured for February 29, once every four years)
1010 = Reserved; do not use
1011 = Reserved; do not use
11xx = Reserved; do not use
Note 1: Hardware clears the ALRMEN bit anytime the alarm event occurs, when ARPT<7:0> = 00 and
CHIME = 0.
2: This field should not be written when the RTCC ON bit = ‘1’ (RTCCON<15>) and ALRMSYNC = 1.
3: This assumes a CPU read will execute in less than 32 PBCLKs.
Note: This register is reset only on a Power-on Reset (POR).
2011-2012 Microchip Technology Inc. Preliminary DS61168E-page 195
PIC32MX1XX/2XX
bit 7-0 ARPT<7:0>: Alarm Repeat Counter Value bits(2)
11111111 = Alarm will trigger 256 times
00000000 = Alarm will trigger one time
The counter decrements on any alarm event. The counter only rolls over from 0x00 to 0xFF if CHIME = 1.
REGISTER 20-2: RTCALRM: RTC ALARM CONTROL REGISTER (CONTINUED)
Note 1: Hardware clears the ALRMEN bit anytime the alarm event occurs, when ARPT<7:0> = 00 and
CHIME = 0.
2: This field should not be written when the RTCC ON bit = ‘1’ (RTCCON<15>) and ALRMSYNC = 1.
3: This assumes a CPU read will execute in less than 32 PBCLKs.
Note: This register is reset only on a Power-on Reset (POR).
PIC32MX1XX/2XX
DS61168E-page 196 Preliminary 2011-2012 Microchip Technology Inc.
REGISTER 20-3: RTCTIME: RTC TIME VALUE REGISTER
Bit
Range Bit
31/23/15/7 Bit
30/22/14/6 Bit
29/21/13/5 Bit
28/20/12/4 Bit
27/19/11/3 Bit
26/18/10/2 Bit
25/17/9/1 Bit
24/16/8/0
31:24 R/W-x R/W-x R/W-x R/W-x R/W-x R/W-x R/W-x R/W-x
HR10<3:0> HR01<3:0>
23:16 R/W-x R/W-x R/W-x R/W-x R/W-x R/W-x R/W-x R/W-x
MIN10<3:0> MIN01<3:0>
15:8 R/W-x R/W-x R/W-x R/W-x R/W-x R/W-x R/W-x R/W-x
SEC10<3:0> SEC01<3:0>
7:0 U-0 U-0 U-0 U-0 U-0 U-0 U-0 U-0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 31-28 HR10<3:0>: Binary-Coded Decimal Value of Hours bits, 10 digits; contains a value from 0 to 2
bit 27-24 HR01<3:0>: Binary-Coded Decimal Value of Hours bits, 1 digit; contains a value from 0 to 9
bit 23-20 MIN10<3:0>: Binary-Coded Decimal Value of Minutes bits, 10 digits; contains a value from 0 to 5
bit 19-16 MIN01<3:0>: Binary-Coded Decimal Value of Minutes bits, 1 digit; contains a value from 0 to 9
bit 15-12 SEC10<3:0>: Binary-Coded Decimal Value of Seconds bits, 10 digits; contains a value from 0 to 5
bit 11-8 SEC01<3:0>: Binary-Coded Decimal Value of Seconds bits, 1 digit; contains a value from 0 to 9
bit 7-0 Unimplemented: Read as ‘0
Note: This register is only writable when RTCWREN = 1 (RTCCON<3>).
2011-2012 Microchip Technology Inc. Preliminary DS61168E-page 197
PIC32MX1XX/2XX
REGISTER 20-4: RTCDATE: RTC DATE VALUE REGISTER
Bit
Range Bit
31/23/15/7 Bit
30/22/14/6 Bit
29/21/13/5 Bit
28/20/12/4 Bit
27/19/11/3 Bit
26/18/10/2 Bit
25/17/9/1 Bit
24/16/8/0
31:24 R/W-x R/W-x R/W-x R/W-x R/W-x R/W-x R/W-x R/W-x
YEAR10<3:0> YEAR01<3:0>
23:16 R/W-x R/W-x R/W-x R/W-x R/W-x R/W-x R/W-x R/W-x
MONTH10<3:0> MONTH01<3:0>
15:8 R/W-x R/W-x R/W-x R/W-x R/W-x R/W-x R/W-x R/W-x
DAY10<3:0> DAY01<3:0>
7:0 U-0 U-0 U-0 U-0 R/W-x R/W-x R/W-x R/W-x
WDAY01<3:0>
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 31-28 YEAR10<3:0>: Binary-Coded Decimal Value of Years bits, 10 digits
bit 27-24 YEAR01<3:0>: Binary-Coded Decimal Value of Years bits, 1 digit
bit 23-20 MONTH10<3:0>: Binary-Coded Decimal Value of Months bits, 10 digits; contains a value from 0 to 1
bit 19-16 MONTH01<3:0>: Binary-Coded Decimal Value of Months bits, 1 digit; contains a value from 0 to 9
bit 15-12 DAY10<3:0>: Binary-Coded Decimal Value of Days bits, 10 digits; contains a value from 0 to 3
bit 11-8 DAY01<3:0>: Binary-Coded Decimal Value of Days bits, 1 digit; contains a value from 0 to 9
bit 7-4 Unimplemented: Read as ‘0
bit 3-0 WDAY01<3:0>: Binary-Coded Decimal Value of Weekdays bits,1 digit; contains a value from 0 to 6
Note: This register is only writable when RTCWREN = 1 (RTCCON<3>).
PIC32MX1XX/2XX
DS61168E-page 198 Preliminary 2011-2012 Microchip Technology Inc.
REGISTER 20-5: ALRMTIME: ALARM TIME VALUE REGISTER
Bit
Range Bit
31/23/15/7 Bit
30/22/14/6 Bit
29/21/13/5 Bit
28/20/12/4 Bit
27/19/11/3 Bit
26/18/10/2 Bit
25/17/9/1 Bit
24/16/8/0
31:24 R/W-x R/W-x R/W-x R/W-x R/W-x R/W-x R/W-x R/W-x
HR10<3:0> HR01<3:0>
23:16 R/W-x R/W-x R/W-x R/W-x R/W-x R/W-x R/W-x R/W-x
MIN10<3:0> MIN01<3:0>
15:8 R/W-x R/W-x R/W-x R/W-x R/W-x R/W-x R/W-x R/W-x
SEC10<3:0> SEC01<3:0>
7:0 U-0 U-0 U-0 U-0 U-0 U-0 U-0 U-0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 31-28 HR10<3:0>: Binary Coded Decimal value of hours bits, 10 digits; contains a value from 0 to 2
bit 27-24 HR01<3:0>: Binary Coded Decimal value of hours bits, 1 digit; contains a value from 0 to 9
bit 23-20 MIN10<3:0>: Binary Coded Decimal value of minutes bits, 10 digits; contains a value from 0 to 5
bit 19-16 MIN01<3:0>: Binary Coded Decimal value of minutes bits, 1 digit; contains a value from 0 to 9
bit 15-12 SEC10<3:0>: Binary Coded Decimal value of seconds bits, 10 digits; contains a value from 0 to 5
bit 11-8 SEC01<3:0>: Binary Coded Decimal value of seconds bits, 1 digit; contains a value from 0 to 9
bit 7-0 Unimplemented: Read as ‘0
2011-2012 Microchip Technology Inc. Preliminary DS61168E-page 199
PIC32MX1XX/2XX
REGISTER 20-6: ALRMDATE: ALARM DATE VALUE REGISTER
Bit
Range Bit
31/23/15/7 Bit
30/22/14/6 Bit
29/21/13/5 Bit
28/20/12/4 Bit
27/19/11/3 Bit
26/18/10/2 Bit
25/17/9/1 Bit
24/16/8/0
31:24 U-0 U-0 U-0 U-0 U-0 U-0 U-0 U-0
23:16 R/W-x R/W-x R/W-x R/W-x R/W-x R/W-x R/W-x R/W-x
MONTH10<3:0> MONTH01<3:0>
15:8 R/W-x R/W-x R/W-x R/W-x R/W-x R/W-x R/W-x R/W-x
DAY10<1:0> DAY01<3:0>
7:0 U-0 U-0 U-0 U-0 R/W-x R/W-x R/W-x R/W-x
WDAY01<3:0>
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 31-24 Unimplemented: Read as ‘0
bit 23-20 MONTH10<3:0>: Binary Coded Decimal value of months bits, 10 digits; contains a value from 0 to 1
bit 19-16 MONTH01<3:0>: Binary Coded Decimal value of months bits, 1 digit; contains a value from 0 to 9
bit 15-12 DAY10<3:0>: Binary Coded Decimal value of days bits, 10 digits; contains a value from 0 to 3
bit 11-8 DAY01<3:0>: Binary Coded Decimal value of days bits, 1 digit; contains a value from 0 to 9
bit 7-4 Unimplemented: Read as ‘0
bit 3-0 WDAY01<3:0>: Binary Coded Decimal value of weekdays bits, 1 digit; contains a value from 0 to 6
PIC32MX1XX/2XX
DS61168E-page 200 Preliminary 2011-2012 Microchip Technology Inc.
NOTES:
2011-2012 Microchip Technology Inc. Preliminary DS61168E-page 201
PIC32MX1XX/2XX
21.0 10-BIT ANALOG-TO-DIGITAL
CONVERTER (ADC) The PIC32MX1XX/2XX 10-bit Analog-to-Digital
Converter (ADC) includes the following features:
Successive Approximation Register (SAR)
conversion
Up to 1 Msps conversion speed
Up to 13 analog input pins
External voltage reference input pins
One unipolar, differential Sample and Hold
Amplifier (SHA)
Automatic Channel Scan mode
Selectable conversion trigger source
16-word conversion result buffer
Selectable buffer fill modes
Eight conversion result format options
Operation during CPU Sleep and Idle modes
A block diagram of the 10-bit ADC is illustrated in
Figure 21-1. The 10-bit ADC has up to 13 analog input
pins, designated AN0-AN12. In addition, there are two
analog input pins for external voltage reference
connections. These voltage reference inputs may be
shared with other analog input pins and may be
common to other analog module references.
FIGURE 21-1: ADC1 MODULE BLOCK DIAGRAM
Note 1: This data sheet summarizes the features
of the PIC32MX1XX/2XX family of
devices. It is not intended to be a
comprehensive reference source. To
complement the information in this data
sheet, refer to Section 17. “10-bit
Analog-to-Digital Converter (ADC)”
(DS61104) in the “PIC32 Family
Reference Manual”, which is available
from the Microchip web site
(www.microchip.com/PIC32).
2: Some registers and associated bits
described in this section may not be
available on all devices. Refer to
Section 4.0 “Memory Organization” in
this data sheet for device-specific register
and bit information.
SAR ADC
S&H
ADC1BUF0
ADC1BUF1
ADC1BUF2
ADC1BUFF
ADC1BUFE
CTMUT(3)
IVREF(4)
AN1
VREFL
CH0SB<4:0>
CH0NA CH0NB
+
-
CH0SA<4:0>
Channel
Scan
CSCNA
Alternate
VREF+(1) AVDD AVSS
VREF-(1)
Note 1: VREF+ and VREF- inputs can be multiplexed with other analog inputs.
2: AN8 is only available on 44-pin devices. AN6 and AN7 are not available on 28-pin devices.
3: Connected to the CTMU module. See Section 24.0 “Charge Time Measurement Unit (CTMU) for more
information.
4: See Section 23.0 “Comparator Voltage Reference (CVREF)” for more information.
5: This selection is only used with CTMU capacitive and time measurement.
Input Selection
VREFH VREFL
VCFG<2:0>
AN12(2)
AN0
Open(5)
CTMUI(3)
PIC32MX1XX/2XX
DS61168E-page 202 Preliminary 2011-2012 Microchip Technology Inc.
FIGURE 21-2: ADC CONVERSION CLOCK PERIOD BLOCK DIAGRAM
1
0
Div 2
TPB(2)
ADC Conversion
Clock Multiplier
2, 4,..., 512
ADRC
TAD
8
ADCS<7:0>
FRC(1)
Note 1: See Section 29.0 “Electrical Characteristics” for the exact FRC clock value.
2: Refer to Figure 8-1 in Section 8.0 “Oscillator Configuration” for more information.
2011-2012 Microchip Technology Inc. Preliminary DS61168E-page 203
PIC32MX1XX/2XX
REGISTER 21-1: AD1CON1: ADC CONTROL REGISTER 1
Bit
Range Bit
31/23/15/7 Bit
30/22/14/6 Bit
29/21/13/5 Bit
28/20/12/4 Bit
27/19/11/3 Bit
26/18/10/2 Bit
25/17/9/1 Bit
24/16/8/0
31:24 U-0 U-0 U-0 U-0 U-0 U-0 U-0 U-0
23:16 U-0 U-0 U-0 U-0 U-0 U-0 U-0 U-0
15:8 R/W-0 U-0 R/W-0 U-0 U-0 R/W-0 R/W-0 R/W-0
ON(1) —SIDL FORM<2:0>
7:0 R/W-0 R/W-0 R/W-0 R/W-0 U-0 R/W-0 R/W-0, HSC
R/C-0, HSC
SSRC<2:0> CLRASAM ASAM SAMP(2) DONE(3)
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 31-16 Unimplemented: Read as ‘0
bit 15 ON: ADC Operating Mode bit(1)
1 = ADC module is operating
0 = ADC module is not operating
bit 14 Unimplemented: Read as ‘0
bit 13 SIDL: Stop in Idle Mode bit
1 = Discontinue module operation when device enters Idle mode
0 = Continue module operation in Idle mode
bit 12-11 Unimplemented: Read as ‘0
bit 10-8 FORM<2:0>: Data Output Format bits
111 = Signed Fractional 32-bit (DOUT = sddd dddd dd00 0000 0000 0000 0000)
110 = Fractional 32-bit (DOUT = dddd dddd dd00 0000 0000 0000 0000 0000)
101 = Signed Integer 32-bit (DOUT = ssss ssss ssss ssss ssss sssd dddd dddd)
100 = Integer 32-bit (DOUT = 0000 0000 0000 0000 0000 00dd dddd dddd)
011 = Signed Fractional 16-bit (DOUT = 0000 0000 0000 0000 sddd dddd dd00 0000)
010 = Fractional 16-bit (DOUT = 0000 0000 0000 0000 dddd dddd dd00 0000)
001 = Signed Integer 16-bit (DOUT = 0000 0000 0000 0000 ssss sssd dddd dddd)
000 =Integer 16-bit (DOUT = 0000 0000 0000 0000 0000 00dd dddd dddd)
bit 7-5 SSRC<2:0>: Conversion Trigger Source Select bits
111 = Internal counter ends sampling and starts conversion (auto convert)
110 = Reserved
101 = Reserved
100 = Reserved
011 = CTMU ends sampling and starts conversion
010 = Timer 3 period match ends sampling and starts conversion
001 = Active transition on INT0 pin ends sampling and starts conversion
000 = Clearing SAMP bit ends sampling and starts conversion
Note 1: When using 1:1 PBCLK divisor, the user’s software should not read/write the peripheral’s SFRs in the
SYSCLK cycle immediately following the instruction that clears the module’s ON bit.
2: If ASAM = 0, software can write a ‘1’ to start sampling. This bit is automatically set by hardware if
ASAM = 1. If SSRC = 0, software can write a ‘0’ to end sampling and start conversion. If SSRC 0’, this
bit is automatically cleared by hardware to end sampling and start conversion.
3: This bit is automatically set by hardware when analog-to-digital conversion is complete. Software can
write a ‘0’ to clear this bit (a write of ‘1’ is not allowed). Clearing this bit does not affect any operation
already in progress. This bit is automatically cleared by hardware at the start of a new conversion.
PIC32MX1XX/2XX
DS61168E-page 204 Preliminary 2011-2012 Microchip Technology Inc.
bit 4 CLRASAM: Stop Conversion Sequence bit (when the first ADC interrupt is generated)
1 = Stop conversions when the first ADC interrupt is generated. Hardware clears the ASAM bit when the
ADC interrupt is generated.
0 = Normal operation, buffer contents will be overwritten by the next conversion sequence
bit 3 Unimplemented: Read as ‘0
bit 2 ASAM: ADC Sample Auto-Start bit
1 = Sampling begins immediately after last conversion completes; SAMP bit is automatically set.
0 = Sampling begins when SAMP bit is set
bit 1 SAMP: ADC Sample Enable bit(2)
1 = The ADC sample and hold amplifier is sampling
0 = The ADC sample/hold amplifier is holding
When ASAM = 0, writing1’ to this bit starts sampling.
When SSRC = 000, writing ‘0’ to this bit will end sampling and start conversion.
bit 0 DONE: Analog-to-Digital Conversion Status bit(3)
1 = Analog-to-digital conversion is done
0 = Analog-to-digital conversion is not done or has not started
Clearing this bit will not affect any operation in progress.
REGISTER 21-1: AD1CON1: ADC CONTROL REGISTER 1 (CONTINUED)
Note 1: When using 1:1 PBCLK divisor, the user’s software should not read/write the peripheral’s SFRs in the
SYSCLK cycle immediately following the instruction that clears the module’s ON bit.
2: If ASAM = 0, software can write a ‘1’ to start sampling. This bit is automatically set by hardware if
ASAM = 1. If SSRC = 0, software can write a ‘0’ to end sampling and start conversion. If SSRC 0’, this
bit is automatically cleared by hardware to end sampling and start conversion.
3: This bit is automatically set by hardware when analog-to-digital conversion is complete. Software can
write a ‘0’ to clear this bit (a write of ‘1’ is not allowed). Clearing this bit does not affect any operation
already in progress. This bit is automatically cleared by hardware at the start of a new conversion.
2011-2012 Microchip Technology Inc. Preliminary DS61168E-page 205
PIC32MX1XX/2XX
REGISTER 21-2: AD1CON2: ADC CONTROL REGISTER 2
Bit
Range Bit
31/23/15/7 Bit
30/22/14/6 Bit
29/21/13/5 Bit
28/20/12/4 Bit
27/19/11/3 Bit
26/18/10/2 Bit
25/17/9/1 Bit
24/16/8/0
31:24 U-0 U-0 U-0 U-0 U-0 U-0 U-0 U-0
23:16 U-0 U-0 U-0 U-0 U-0 U-0 U-0 U-0
15:8 R/W-0 R/W-0 R/W-0 R/W-0 U-0 R/W-0 U-0 U-0
VCFG<2:0> OFFCAL —CSCNA
7:0
R-0 U-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
BUFS SMPI<3:0> BUFM ALTS
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 31-16 Unimplemented: Read as ‘0
bit 15-13 VCFG<2:0>: Voltage Reference Configuration bits
VREFH VREFL
000 AVDD AVss
001 External VREF+ pin AVSS
010 AVDD External VREF- pin
011 External VREF+ pin External VREF- pin
1xx AVDD AVSS
bit 12 OFFCAL: Input Offset Calibration Mode Select bit
1 = Enable Offset Calibration mode
Positive and negative inputs of the sample and hold amplifier are connected to VREFL
0 = Disable Offset Calibration mode
The inputs to the sample and hold amplifier are controlled by AD1CHS or AD1CSSL
bit 11 Unimplemented: Read as ‘0
bit 10 CSCNA: Input Scan Select bit
1 = Scan inputs
0 = Do not scan inputs
bit 9-8 Unimplemented: Read as ‘0
bit 7 BUFS: Buffer Fill Status bit
Only valid when BUFM = 1.
1 = ADC is currently filling buffer 0x8-0xF, user should access data in 0x0-0x7
0 = ADC is currently filling buffer 0x0-0x7, user should access data in 0x8-0xF
bit 6 Unimplemented: Read as ‘0
bit 5-2 SMPI<3:0>: Sample/Convert Sequences Per Interrupt Selection bits
1111 = Interrupts at the completion of conversion for each 16th sample/convert sequence
1110 = Interrupts at the completion of conversion for each 15th sample/convert sequence
0001 = Interrupts at the completion of conversion for each 2nd sample/convert sequence
0000 = Interrupts at the completion of conversion for each sample/convert sequence
bit 1 BUFM: ADC Result Buffer Mode Select bit
1 = Buffer configured as two 8-word buffers, ADC1BUF7-ADC1BUF0, ADC1BUFF-ADCBUF8
0 = Buffer configured as one 16-word buffer ADC1BUFF-ADC1BUF0
bit 0 ALTS: Alternate Input Sample Mode Select bit
1 = Uses Sample A input multiplexer settings for first sample, then alternates between Sample B and
Sample A input multiplexer settings for all subsequent samples
0 = Always use Sample A input multiplexer settings
PIC32MX1XX/2XX
DS61168E-page 206 Preliminary 2011-2012 Microchip Technology Inc.
REGISTER 21-3: AD1CON3: ADC CONTROL REGISTER 3
Bit
Range Bit
31/23/15/7 Bit
30/22/14/6 Bit
29/21/13/5 Bit
28/20/12/4 Bit
27/19/11/3 Bit
26/18/10/2 Bit
25/17/9/1 Bit
24/16/8/0
31:24 U-0 U-0 U-0 U-0 U-0 U-0 U-0 U-0
23:16 U-0 U-0 U-0 U-0 U-0 U-0 U-0 U-0
15:8 R/W-0 U-0 U-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
ADRC SAMC<4:0>(1)
7:0
R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W R/W-0
ADCS<7:0>(2)
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 31-16 Unimplemented: Read as ‘0
bit 15 ADRC: ADC Conversion Clock Source bit
1 = Clock derived from FRC
0 = Clock derived from Peripheral Bus Clock (PBCLK)
bit 14-13 Unimplemented: Read as ‘0
bit 12-8 SAMC<4:0>: Auto-Sample Time bits(1)
11111 =31 TAD
00001 = 1 TAD
00000 = 0 TAD (Not allowed)
bit 7-0 ADCS<7:0>: ADC Conversion Clock Select bits(2)
11111111 =TPB • 2 • (ADCS<7:0> + 1) = 512 • TPB = TAD
00000001 =TPB • 2 • (ADCS<7:0> + 1) = 4 • TPB = TAD
00000000 =TPB • 2 • (ADCS<7:0> + 1) = 2 • TPB = TAD
Note 1: This bit is only used if the SSRC<2:0> bits (AD1CON1<7:5>) = 111.
2: This bit is not used if the ADRC bit (AD1CON3<15>) = 1.
2011-2012 Microchip Technology Inc. Preliminary DS61168E-page 207
PIC32MX1XX/2XX
REGISTER 21-4: AD1CHS: ADC INPUT SELECT REGISTER
Bit
Range Bit
31/23/15/7 Bit
30/22/14/6 Bit
29/21/13/5 Bit
28/20/12/4 Bit
27/19/11/3 Bit
26/18/10/2 Bit
25/17/9/1 Bit
24/16/8/0
31:24 R/W-0 U-0 U-0 U-0 R/W-0 R/W-0 R/W-0 R/W-0
CH0NB CH0SB<3:0>
23:16 R/W-0 U-0 U-0 U-0 R/W-0 R/W-0 R/W-0 R/W-0
CH0NA CH0SA<3:0>
15:8 U-0 U-0 U-0 U-0 U-0 U-0 U-0 U-0
7:0 U-0 U-0 U-0 U-0 U-0 U-0 U-0 U-0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 31 CH0NB: Negative Input Select bit for Sample B
1 = Channel 0 negative input is AN1
0 = Channel 0 negative input is VREFL
bit 30-28 Unimplemented: Read as ‘0
bit 27-24 CH0SB<3:0>: Positive Input Select bits for Sample B
1111 = Channel 0 positive input is Open(1)
1110 = Channel 0 positive input is IVREF(2)
1101 = Channel 0 positive input is CTMU temperature sensor (CTMUT)(3)
1100 = Channel 0 positive input is AN12(4)
0001 = Channel 0 positive input is AN1
0000 = Channel 0 positive input is AN0
bit 23 CH0NA: Negative Input Select bit for Sample A Multiplexer Setting(2)
1 = Channel 0 negative input is AN1
0 = Channel 0 negative input is VREFL
bit 22-20 Unimplemented: Read as ‘0
bit 19-16 CH0SA<3:0>: Positive Input Select bits for Sample A Multiplexer Setting
1111 = Channel 0 positive input is Open(1)
1110 = Channel 0 positive input is IVREF(2)
1101 = Channel 0 positive input is CTMU temperature (CTMUT)(3)
1100 = Channel 0 positive input is AN12(4)
0001 = Channel 0 positive input is AN1
0000 = Channel 0 positive input is AN0
bit 15-0 Unimplemented: Read as ‘0
Note 1: This selection is only used with CTMU capacitive and time measurement.
2: See Section 23.0 “Comparator Voltage Reference (CVREF)” for more information.
3: See Section 24.0 “Charge Time Measurement Unit (CTMU)” for more information.
4: AN12 is only available on 44-pin devices. AN6-AN8 are not available on 28-pin devices.
PIC32MX1XX/2XX
DS61168E-page 208 Preliminary 2011-2012 Microchip Technology Inc.
REGISTER 21-5: AD1CSSL: ADC INPUT SCAN SELECT REGISTER
Bit
Range Bit
31/23/15/7 Bit
30/22/14/6 Bit
29/21/13/5 Bit
28/20/12/4 Bit
27/19/11/3 Bit
26/18/10/2 Bit
25/17/9/1 Bit
24/16/8/0
31:24 U-0 U-0 U-0 U-0 U-0 U-0 U-0 U-0
23:16 U-0 U-0 U-0 U-0 U-0 U-0 U-0 U-0
15:8 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
CSSL15 CSSL14 CSSL13 CSSL12 CSSL11 CSSL10 CSSL9 CSSL8
7:0
R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
CSSL7 CSSL6 CSSL5 CSSL4 CSSL3 CSSL2 CSSL1 CSSL0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 31-16 Unimplemented: Read as ‘0
bit 15-0 CSSL<15:0>: ADC Input Pin Scan Selection bits(1,2)
1 = Select ANx for input scan
0 = Skip ANx for input scan
Note 1: CSSL = ANx, where ‘x’ = 0-12; CSSL13 selects CTMU input for scan; CSSL14 selects IVREF for scan;
CSSL15 selects VSS for scan.
2: On devices with less than 13 analog inputs, all CSSLx bits can be selected; however, inputs selected for
scan without a corresponding input on the device will convert to VREFL.
2011-2012 Microchip Technology Inc. Preliminary DS61168E-page 209
PIC32MX1XX/2XX
22.0 COMPARATOR The PIC32MX1XX/2XX Analog Comparator module
contains three comparators that can be configured in a
variety of ways.
Following are some of the key features of this module:
Selectable inputs available include:
- Analog inputs multiplexed with I/O pins
- On-chip internal absolute voltage reference
(IVREF)
- Comparator voltage reference (CVREF)
Outputs can be Inverted
Selectable interrupt generation
A block diagram of the comparator module is provided
in Figure 22-1.
FIGURE 22-1: COMPARATOR BLOCK DIAGRAM
Note 1: This data sheet summarizes the features
of the PIC32MX1XX/2XX family of
devices. It is not intended to be a
comprehensive reference source. To
complement the information in this
data sheet, refer to Section 19.
“Comparator” (DS61110) in the “PIC32
Family Reference Manual”, which is
available from the Microchip web site
(www.microchip.com/PIC32).
2: Some registers and associated bits
described in this section may not be
available on all devices. Refer to
Section 4.0 “Memory Organization” in
this data sheet for device-specific register
and bit information.
C3IND
C3INA
C3OUT
CMP3
COE
CREF
CCH<1:0>
CPOL
C3INC
C3INB
CVREF(1)
IVREF (1.2V)
C2IND
C2INA
C2OUT
CMP2
COE
CREF
CCH<1:0>
CPOL
C2INC
C2INB
C1IND
C1INA
C1OUT
CMP1
COE
CREF
CCH<1:0>
CPOL
C1INC
C1INB
CMSTAT<C1OUT>
CM1CON<COUT>
CMSTAT<C2OUT>
CM2CON<COUT>
CMSTAT<C3OUT>
CM3CON<COUT>
To CTMU module
(Pulse Generator)
Note 1: Internally connected. See Section 23.0 “Comparator Voltage Reference
(CVREF)” for more information.
PIC32MX1XX/2XX
DS61168E-page 210 Preliminary 2011-2012 Microchip Technology Inc.
REGISTER 22-1: CMXCON: COMPARATOR CONTROL REGISTER
Bit
Range Bit
31/23/15/7 Bit
30/22/14/6 Bit
29/21/13/5 Bit
28/20/12/4 Bit
27/19/11/3 Bit
26/18/10/2 Bit
25/17/9/1 Bit
24/16/8/0
31:24 U-0 U-0 U-0 U-0 U-0 U-0 U-0 U-0
23:16 U-0 U-0 U-0 U-0 U-0 U-0 U-0 U-0
15:8 R/W-0 R/W-0 R/W-0 U-0 U-0 U-0 U-0 R-0
ON(1) COE CPOL(2) —COUT
7:0 R/W-1 R/W-1 U-0 R/W-0 U-0 U-0 R/W-1 R/W-1
EVPOL<1:0> CREF CCH<1:0>
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 31-16 Unimplemented: Read as ‘0
bit 15 ON: Comparator ON bit(1)
1 = Module is enabled. Setting this bit does not affect the other bits in this register
0 = Module is disabled and does not consume current. Clearing this bit does not affect the other bits in this
register
bit 14 COE: Comparator Output Enable bit
1 = Comparator output is driven on the output CxOUT pin
0 = Comparator output is not driven on the output CxOUT pin
bit 13 CPOL: Comparator Output Inversion bit(2)
1 = Output is inverted
0 = Output is not inverted
bit 12-9 Unimplemented: Read as ‘0
bit 8 COUT: Comparator Output bit
1 = Output of the Comparator is a ‘1
0 = Output of the Comparator is a ‘0
bit 7-6 EVPOL<1:0>: Interrupt Event Polarity Select bits
11 = Comparator interrupt is generated on a low-to-high or high-to-low transition of the comparator output
10 = Comparator interrupt is generated on a high-to-low transition of the comparator output
01 = Comparator interrupt is generated on a low-to-high transition of the comparator output
00 = Comparator interrupt generation is disabled
bit 5 Unimplemented: Read as ‘0
bit 4 CREF: Comparator Positive Input Configure bit
1 = Comparator non-inverting input is connected to the internal CVREF
0 = Comparator non-inverting input is connected to the CXINA pin
bit 3-2 Unimplemented: Read as ‘0
bit 1-0 CCH<1:0>: Comparator Negative Input Select bits for Comparator
11 = Comparator inverting input is connected to the IVREF
10 = Comparator inverting input is connected to the CxIND pin
01 = Comparator inverting input is connected to the CxINC pin
00 = Comparator inverting input is connected to the CxINB pin
Note 1: When using the 1:1 PBCLK divisor, the user’s software should not read/write the peripheral’s SFRs in the
SYSCLK cycle immediately following the instruction that clears the module’s ON bit.
2: Setting this bit will invert the signal to the comparator interrupt generator as well. This will result in an
interrupt being generated on the opposite edge from the one selected by EVPOL<1:0>.
2011-2012 Microchip Technology Inc. Preliminary DS61168E-page 211
PIC32MX1XX/2XX
REGISTER 22-2: CMSTAT: COMPARATOR STATUS REGISTER
Bit
Range Bit
31/23/15/7 Bit
30/22/14/6 Bit
29/21/13/5 Bit
28/20/12/4 Bit
27/19/11/3 Bit
26/18/10/2 Bit
25/17/9/1 Bit
24/16/8/0
31:24 U-0 U-0 U-0 U-0 U-0 U-0 U-0 U-0
23:16 U-0 U-0 U-0 U-0 U-0 U-0 U-0 U-0
15:8 U-0 U-0 R/W-0 U-0 U-0 U-0 U-0 U-0
—SIDL
7:0 U-0 U-0 U-0 U-0 U-0 R-0 R-0 R-0
C3OUT C2OUT C1OUT
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 31-14 Unimplemented: Read as ‘0
bit 13 SIDL: Stop in IDLE Control bit
1 = All Comparator modules are disabled in IDLE mode
0 = All Comparator modules continue to operate in the IDLE mode
bit 12-3 Unimplemented: Read as ‘0
bit 2 C3OUT: Comparator Output bit
1 = Output of Comparator 3 is a ‘1
0 = Output of Comparator 3 is a ‘0
bit 1 C2OUT: Comparator Output bit
1 = Output of Comparator 2 is a ‘1
0 = Output of Comparator 2 is a ‘0
bit 0 C1OUT: Comparator Output bit
1 = Output of Comparator 1 is a ‘1
0 = Output of Comparator 1 is a ‘0
PIC32MX1XX/2XX
DS61168E-page 212 Preliminary 2011-2012 Microchip Technology Inc.
NOTES:
2011-2012 Microchip Technology Inc. Preliminary DS61168E-page 213
PIC32MX1XX/2XX
23.0 COMPARATOR VOLTAGE
REFERENCE (CVREF)The CVREF module is a 16-tap, resistor ladder network
that provides a selectable reference voltage. Although
its primary purpose is to provide a reference for the
analog comparators, it also may be used independently
of them.
A block diagram of the module is illustrated in
Figure 23-1. The resistor ladder is segmented to
provide two ranges of voltage reference values and has
a power-down function to conserve power when the
reference is not being used. The module’s supply refer-
ence can be provided from either device VDD/VSS or an
external voltage reference. The CVREF output is avail-
able for the comparators and typically available for pin
output.
The comparator voltage reference has the following
features:
High and low range selection
Sixteen output levels available for each range
Internally connected to comparators to conserve
device pins
Output can be connected to a pin
FIGURE 23-1: COMPARATOR VOLTAGE REFERENCE BLOCK DIAGRAM
Note 1: This data sheet summarizes the features
of the PIC32MX1XX/2XX family of
devices. It is not intended to be a
comprehensive reference source. To
complement the information in this data
sheet, refer to Section 20. “Comparator
Voltage Reference (CVREF)” (DS61109)
in the “PIC32 Family Reference Manual”,
which is available from the Microchip web
site (www.microchip.com/PIC32).
2: Some registers and associated bits
described in this section may not be
available on all devices. Refer to
Section 4.0 “Memory Organization” in
this data sheet for device-specific register
and bit information.
16-to-1 MUX
CVR<3:0>
8R
R
CVREN
CVRSS = 0
AVDD
VREF+CVRSS = 1
8R
CVRSS = 0
VREF-CVRSS = 1
R
R
R
R
R
R
16 Steps
CVRR
CVREFOUT
AVSS
CVRCON<CVROE>
CVREF
CVRSRC
PIC32MX1XX/2XX
DS61168E-page 214 Preliminary 2011-2012 Microchip Technology Inc.
REGISTER 23-1: CVRCON: COMPARATOR VOLTAGE REFERENCE CONTROL REGISTER
Bit
Range Bit
31/23/15/7 Bit
30/22/14/6 Bit
29/21/13/5 Bit
28/20/12/4 Bit
27/19/11/3 Bit
26/18/10/2 Bit
25/17/9/1 Bit
24/16/8/0
31:24 U-0 U-0 U-0 U-0 U-0 U-0 U-0 U-0
23:16 U-0 U-0 U-0 U-0 U-0 U-0 U-0 U-0
15:8 R/W-0 U-0 U-0 U-0 U-0 U-0 U-0 U-0
ON(1)
7:0 U-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
CVROE CVRR CVRSS CVR<3:0>
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 31-16 Unimplemented: Read as ‘0
bit 15 ON: Comparator Voltage Reference On bit(1)
1= Module is enabled
Setting this bit does not affect other bits in the register.
0= Module is disabled and does not consume current.
Clearing this bit does not affect the other bits in the register.
bit 14-7 Unimplemented: Read as ‘0
bit 6 CVROE: CVREFOUT Enable bit
1= Voltage level is output on CVREFOUT pin
0= Voltage level is disconnected from CVREFOUT pin
bit 5 CVRR: CVREF Range Selection bit
1= 0 to 0.67 CVRSRC, with CVRSRC/24 step size
0= 0.25 CVRSRC to 0.75 CVRSRC, with CVRSRC/32 step size
bit 4 CVRSS: CVREF Source Selection bit
1= Comparator voltage reference source, CVRSRC = (VREF+) – (VREF-)
0= Comparator voltage reference source, CVRSRC = AVDD – AVSS
bit 3-0 CVR<3:0>: CVREF Value Selection 0 CVR<3:0> 15 bits
When CVRR = 1:
CVREF = (CVR<3:0>/24) (CVRSRC)
When CVRR = 0:
CVREF =1/4 (CVRSRC) + (CVR<3:0>/32) (CVRSRC)
Note 1: When using 1:1 PBCLK divisor, the user’s software should not read/write the peripheral’s SFRs in the
SYSCLK cycle immediately following the instruction that clears the module’s ON bit.
2011-2012 Microchip Technology Inc. Preliminary DS61168E-page 215
PIC32MX1XX/2XX
24.0 CHARGE TIME
MEASUREMENT UNIT (CTMU)
The Charge Time Measurement Unit (CTMU) is a flex-
ible analog module that has a configurable current
source with a digital configuration circuit built around it.
The CTMU can be used for differential time measure-
ment between pulse sources and can be used for gen-
erating an asynchronous pulse. By working with other
on-chip analog modules, the CTMU can be used for
high resolution time measurement, measure capaci-
tance, measure relative changes in capacitance or
generate output pulses with a specific time delay. The
CTMU is ideal for interfacing with capacitive-based
sensors.
The module includes the following key features:
Up to 13 channels available for capacitive or time
measurement input
On-chip precision current source
16-edge input trigger sources
Selection of edge or level-sensitive inputs
Polarity control for each edge source
Control of edge sequence
Control of response to edges
High precision time measurement
Time delay of external or internal signal asynchro-
nous to system clock
Integrated temperature sensing diode
Control of current source during auto-sampling
Four current source ranges
Time measurement resolution of one nanosecond
A block diagram of the CTMU is shown in Figure 24-1.
FIGURE 24-1: CTMU BLOCK DIAGRAM
Note 1: This data sheet summarizes the fea-
tures of the PIC32MX1XX/2XX family of
devices. It is not intended to be a
comprehensive reference source. To
complement the information in this data
sheet, refer to Section 37. “Charge
Time Measurement Unit (CTMU)”
(DS61167) in the “PIC32 Family
Reference Manual”, which is available
from the Microchip web site
(www.microchip.com).
2: Some registers and associated bits
described in this section may not be
available on all devices. Refer to
Section 4.0 “Memory Organization” in
this data sheet for device-specific register
and bit information.
CTED1
CTED13
Current Source
Edge
Control
Logic
CTMUCON1 or CTMUCON2
Pulse
Generator
CTMUI
Comparator 2
Timer1
OC1
Current
Control
ITRIM<5:0>
IRNG<1:0>
CTMUICON
CTMU
Control
Logic
EDG1STAT
EDG2STAT
ADC
CTPLS
IC1-IC3
CMP1-CMP3
C2INB
CDelay
CTMUT
Temperature
Sensor
Current Control Selection TGEN EDG1STAT, EDG2STAT
CTMUT 0EDG1STAT = EDG2STAT
CTMUI 0EDG1STAT EDG2STAT
CTMUP 1EDG1STAT EDG2STAT
No Connect 1EDG1STAT = EDG2STAT
Trigger
TGEN
CTMUP
External capacitor
for pulse generation
(To ADC S&H capacitor)
(To ADC)
PBCLK
PIC32MX1XX/2XX
DS61168E-page 216 Preliminary 2011-2012 Microchip Technology Inc.
REGISTER 24-1: CTMUCON: CTMU CONTROL REGISTER
Bit
Range Bit
31/23/15/7 Bit
30/22/14/6 Bit
29/21/13/5 Bit
28/20/12/4 Bit
27/19/11/3 Bit
26/18/10/2 Bit
25/17/9/1 Bit
24/16/8/0
31:24 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
EDG1MOD EDG1POL EDG1SEL<3:0> EDG2STAT EDG1STAT
23:16 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 U-0 U-0
EDG2MOD EDG2POL EDG2SEL<3:0>
15:8 R/W-0 U-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
ON —CTMUSIDLTGEN
(1) EDGEN EDGSEQEN IDISSEN(2) CTTRIG
7:0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
ITRIM<5:0> IRNG<1:0>
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 31 EDG1MOD: Edge1 Edge Sampling Select bit
1 = Input is edge-sensitive
0 = Input is level-sensitive
bit 30 EDG1POL: Edge 1 Polarity Select bit
1 = Edge1 programmed for a positive edge response
0 = Edge1 programmed for a negative edge response
bit 29-26 EDG1SEL<3:0>: Edge 1 Source Select bits
1111 = C3OUT pin is selected
1110 = C2OUT pin is selected
1101 = C1OUT pin is selected
1100 = IC3 Capture Event is selected
1011 = IC2 Capture Event is selected
1010 = IC1 Capture Event is selected
1001 = CTED8 pin is selected
1000 = CTED7 pin is selected
0111 = CTED6 pin is selected
0110 = CTED5 pin is selected
0101 = CTED4 pin is selected
0100 = CTED3 pin is selected
0011 = CTED1 pin is selected
0010 = CTED2 pin is selected
0001 = OC1 Compare Event is selected
0000 = Timer1 Event is selected
bit 25 EDG2STAT: Edge2 Status bit
Indicates the status of Edge2 and can be written to control edge source
1 = Edge2 has occurred
0 = Edge2 has not occurred
Note 1: When this bit is set for Pulse Delay Generation, the EDG2SEL<2:0> bits must be set to ‘1110’ to select
C2OUT.
2: The ADC module Sample and Hold capacitor is not automatically discharged between sample/conversion
cycles. Software using the ADC as part of a capacitive measurement, must discharge the ADC capacitor
before conducting the measurement. The IDISSEN bit, when set to ‘1’, performs this function. The ADC
module must be sampling while the IDISSEN bit is active to connect the discharge sink to the capacitor
array.
3: Refer to the CTMU Current Source Specifications (Table 29-39) in Section 29.0 “Electrical
Characteristics” for current values.
4: This bit setting is not available for the CTMU temperature diode.
2011-2012 Microchip Technology Inc. Preliminary DS61168E-page 217
PIC32MX1XX/2XX
bit 24 EDG1STAT: Edge1 Status bit
Indicates the status of Edge1 and can be written to control edge source
1 = Edge1 has occurred
0 = Edge1 has not occurred
bit 23 EDG2MOD: Edge2 Edge Sampling Select bit
1 = Input is edge-sensitive
0 = Input is level-sensitive
bit 22 EDG2POL: Edge 2 Polarity Select bit
1 = Edge2 programmed for a positive edge response
0 = Edge2 programmed for a negative edge response
bit 21-18 EDG2SEL<3:0>: Edge 2 Source Select bits
1111 = C3OUT pin is selected
1110 = C2OUT pin is selected
1101 = C1OUT pin is selected
1100 = PBCLK clock is selected
1011 = IC3 Capture Event is selected
1010 = IC2 Capture Event is selected
1001 = IC1 Capture Event is selected
1000 = CTED13 pin is selected
0111 = CTED12 pin is selected
0110 = CTED11 pin is selected
0101 = CTED10 pin is selected
0100 = CTED9 pin is selected
0011 = CTED1 pin is selected
0010 = CTED2 pin is selected
0001 = OC1 Compare Event is selected
0000 = Timer1 Event is selected
bit 17-16 Unimplemented: Read as ‘0
bit 15 ON: ON Enable bit
1 = Module is enabled
0 = Module is disabled
bit 14 Unimplemented: Read as ‘0
bit 13 CTMUSIDL: Stop in Idle Mode bit
1 = Discontinue module operation when device enters Idle mode
0 = Continue module operation in Idle mode
bit 12 TGEN: Time Generation Enable bit(1)
1 = Enables edge delay generation
0 = Disables edge delay generation
bit 11 EDGEN: Edge Enable bit
1 = Edges are not blocked
0 = Edges are blocked
REGISTER 24-1: CTMUCON: CTMU CONTROL REGISTER (CONTINUED)
Note 1: When this bit is set for Pulse Delay Generation, the EDG2SEL<2:0> bits must be set to ‘1110’ to select
C2OUT.
2: The ADC module Sample and Hold capacitor is not automatically discharged between sample/conversion
cycles. Software using the ADC as part of a capacitive measurement, must discharge the ADC capacitor
before conducting the measurement. The IDISSEN bit, when set to ‘1’, performs this function. The ADC
module must be sampling while the IDISSEN bit is active to connect the discharge sink to the capacitor
array.
3: Refer to the CTMU Current Source Specifications (Table 29-39) in Section 29.0 “Electrical
Characteristics” for current values.
4: This bit setting is not available for the CTMU temperature diode.
PIC32MX1XX/2XX
DS61168E-page 218 Preliminary 2011-2012 Microchip Technology Inc.
bit 10 EDGSEQEN: Edge Sequence Enable bit
1 = Edge1 must occur before Edge2 can occur
0 = No edge sequence is needed
bit 9 IDISSEN: Analog Current Source Control bit(2)
1 = Analog current source output is grounded
0 = Analog current source output is not grounded
bit 8 CTTRIG: Trigger Control bit
1 = Trigger output is enabled
0 = Trigger output is disabled
bit 7-2 ITRIM<5:0>: Current Source Trim bits
011111 = Maximum positive change from nominal current
011110
000001 = Minimum positive change from nominal current
000000 = Nominal current output specified by IRNG<1:0>
111111 = Minimum negative change from nominal current
100010
100001 = Maximum negative change from nominal current
bit 1-0 IRNG<1:0>: Current Range Select bits(3)
11 = 100 times base current
10 = 10 times base current
01 = Base current level
00 = 1000 times base current(4)
REGISTER 24-1: CTMUCON: CTMU CONTROL REGISTER (CONTINUED)
Note 1: When this bit is set for Pulse Delay Generation, the EDG2SEL<2:0> bits must be set to ‘1110’ to select
C2OUT.
2: The ADC module Sample and Hold capacitor is not automatically discharged between sample/conversion
cycles. Software using the ADC as part of a capacitive measurement, must discharge the ADC capacitor
before conducting the measurement. The IDISSEN bit, when set to ‘1’, performs this function. The ADC
module must be sampling while the IDISSEN bit is active to connect the discharge sink to the capacitor
array.
3: Refer to the CTMU Current Source Specifications (Table 29-39) in Section 29.0 “Electrical
Characteristics” for current values.
4: This bit setting is not available for the CTMU temperature diode.
2011-2012 Microchip Technology Inc. Preliminary DS61168E-page 219
PIC32MX1XX/2XX
25.0 POWER-SAVING FEATURES
This section describes power-saving features for the
PIC32MX1XX/2XX. The PIC32 devices offer a total of
nine methods and modes, organized into two
categories, that allow the user to balance power
consumption with device performance. In all of the
methods and modes described in this section, power-
saving is controlled by software.
25.1 Power Saving with CPU Running
When the CPU is running, power consumption can be
controlled by reducing the CPU clock frequency,
lowering the PBCLK and by individually disabling
modules. These methods are grouped into the
following categories:
FRC Run mode: the CPU is clocked from the FRC
clock source with or without postscalers.
LPRC Run mode: the CPU is clocked from the
LPRC clock source.
•S
OSC Run mode: the CPU is clocked from the
SOSC clock source.
In addition, the Peripheral Bus Scaling mode is available
where peripherals are clocked at the programmable
fraction of the CPU clock (SYSCLK).
25.2 CPU Halted Methods
The device supports two power-saving modes, Sleep
and Idle, both of which Halt the clock to the CPU. These
modes operate with all clock sources, as listed below:
•P
OSC Idle mode: the system clock is derived from
the POSC. The system clock source continues to
operate. Peripherals continue to operate, but can
optionally be individually disabled.
FRC Idle mode: the system clock is derived from
the FRC with or without postscalers. Peripherals
continue to operate, but can optionally be
individually disabled.
•S
OSC Idle mode: the system clock is derived from
the SOSC. Peripherals continue to operate, but
can optionally be individually disabled.
LPRC Idle mode: the system clock is derived from
the LPRC. Peripherals continue to operate, but
can optionally be individually disabled. This is the
lowest power mode for the device with a clock
running.
Sleep mode: the CPU, the system clock source
and any peripherals that operate from the system
clock source are Halted. Some peripherals can
operate in Sleep using specific clock sources.
This is the lowest power mode for the device.
25.3 Power-Saving Operation
Peripherals and the CPU can be Halted or disabled to
further reduce power consumption.
25.3.1 SLEEP MODE
Sleep mode has the lowest power consumption of the
device power-saving operating modes. The CPU and
most peripherals are Halted. Select peripherals can
continue to operate in Sleep mode and can be used to
wake the device from Sleep. See the individual
peripheral module sections for descriptions of
behavior in Sleep.
Sleep mode includes the following characteristics:
The CPU is Halted.
The system clock source is typically shutdown.
See Section 25.3.3 “Peripheral Bus Scaling
Method” for specific information.
There can be a wake-up delay based on the
oscillator selection.
The Fail-Safe Clock Monitor (FSCM) does not
operate during Sleep mode.
The BOR circuit remains operative during Sleep
mode.
The WDT, if enabled, is not automatically cleared
prior to entering Sleep mode.
Some peripherals can continue to operate at
limited functionality in Sleep mode. These
peripherals include I/O pins that detect a change
in the input signal, WDT, ADC, UART and
peripherals that use an external clock input or the
internal LPRC oscillator (e.g., RTCC, Timer1 and
Input Capture).
I/O pins continue to sink or source current in the
same manner as they do when the device is not in
Sleep.
The USB module can override the disabling of the
Posc or FRC. Refer to the USB section for
specific details.
Modules can be individually disabled by software
prior to entering Sleep in order to further reduce
consumption.
Note 1: This data sheet summarizes the features
of the PIC32MX1XX/2XX family of
devices. It is not intended to be a
comprehensive reference source. To
complement the information in this data
sheet, refer to Section 10. “Power-
Saving Features” (DS61130) in the
“P I C 32 Family Reference Manual”, which
is available from the Microchip web site
(www.microchip.com/PIC32).
2: Some registers and associated bits
described in this section may not be
available on all devices. Refer to
Section 4.0 “Memory Organization” in
this data sheet for device-specific register
and bit information.
PIC32MX1XX/2XX
DS61168E-page 220 Preliminary 2011-2012 Microchip Technology Inc.
The processor will exit, or ‘wake-up’, from Sleep on one
of the following events:
On any interrupt from an enabled source that is
operating in Sleep. The interrupt priority must be
greater than the current CPU priority.
On any form of device Reset
On a WDT time-out
If the interrupt priority is lower than or equal to the
current priority, the CPU will remain Halted, but the
PBCLK will start running and the device will enter into
Idle mode.
25.3.2 IDLE MODE
In Idle mode, the CPU is Halted but the System Clock
(SYSCLK) source is still enabled. This allows peripher-
als to continue operation when the CPU is Halted.
Peripherals can be individually configured to Halt when
entering Idle by setting their respective SIDL bit.
Latency, when exiting Idle mode, is very low due to the
CPU oscillator source remaining active.
The device enters Idle mode when the SLPEN bit
(OSCCON<4>) is clear and a WAIT instruction is
executed.
The processor will wake or exit from Idle mode on the
following events:
On any interrupt event for which the interrupt
source is enabled. The priority of the interrupt
event must be greater than the current priority of
the CPU. If the priority of the interrupt event is
lower than or equal to current priority of the CPU,
the CPU will remain Halted and the device will
remain in Idle mode.
On any form of device Reset
On a WDT time-out interrupt
25.3.3 PERIPHERAL BUS SCALING
METHOD
Most of the peripherals on the device are clocked using
the PBCLK. The peripheral bus can be scaled relative to
the SYSCLK to minimize the dynamic power consumed
by the peripherals. The PBCLK divisor is controlled by
PBDIV<1:0> (OSCCON<20:19>), allowing SYSCLK to
PBCLK ratios of 1:1, 1:2, 1:4 and 1:8. All peripherals
using PBCLK are affected when the divisor is changed.
Peripherals such as the USB, Interrupt Controller, DMA,
and the bus matrix are clocked directly from SYSCLK.
As a result, they are not affected by PBCLK divisor
changes.
Changing the PBCLK divisor affects:
The CPU to peripheral access latency. The CPU
has to wait for next PBCLK edge for a read to
complete. In 1:8 mode, this results in a latency of
one to seven SYSCLKs.
The power consumption of the peripherals. Power
consumption is directly proportional to the fre-
quency at which the peripherals are clocked. The
greater the divisor, the lower the power consumed
by the peripherals.
To minimize dynamic power, the PB divisor should be
chosen to run the peripherals at the lowest frequency
that provides acceptable system performance. When
selecting a PBCLK divider, peripheral clock require-
ments, such as baud rate accuracy, should be taken
into account. For example, the UART peripheral may
not be able to achieve all baud rate values at some
PBCLK divider depending on the SYSCLK value.
Note 1: Changing the PBCLK divider ratio
requires recalculation of peripheral tim-
ing. For example, assume the UART is
configured for 9600 baud with a PB clock
ratio of 1:1 and a POSC of 8 MHz. When
the PB clock divisor of 1:2 is used, the
input frequency to the baud clock is cut in
half; therefore, the baud rate is reduced
to 1/2 its former value. Due to numeric
truncation in calculations (such as the
baud rate divisor), the actual baud rate
may be a tiny percentage different than
expected. For this reason, any timing cal-
culation required for a peripheral should
be performed with the new PB clock fre-
quency instead of scaling the previous
value based on a change in the PB divisor
ratio.
2: Oscillator start-up and PLL lock delays
are applied when switching to a clock
source that was disabled and that uses a
crystal and/or the PLL. For example,
assume the clock source is switched from
POSC to LPRC just prior to entering Sleep
in order to save power. No oscillator start-
up delay would be applied when exiting
Idle. However, when switching back to
POSC, the appropriate PLL and/or
oscillator start-up/lock delays would be
applied.
2011-2012 Microchip Technology Inc. Preliminary DS61168E-page 221
PIC32MX1XX/2XX
25.4 Peripheral Module Disable
The Peripheral Module Disable (PMD) registers
provide a method to disable a peripheral module by
stopping all clock sources supplied to that module.
When a peripheral is disabled using the appropriate
PMD control bit, the peripheral is in a minimum power
consumption state. The control and status registers
associated with the peripheral are also disabled, so
writes to those registers do not have effect and read
values are invalid.
To disable a peripheral, the associated PMDx bit must
be set to ‘1’. To enable a peripheral, the associated
PMDx bit must be cleared (default). See Table 25-1 for
more information.
TABLE 25-1: PERIPHERAL MODULE DISABLE BITS AND LOCATIONS
Note: Disabling a peripheral module while it’s
ON bit is set, may result in undefined
behavior. The ON bit for the associated
peripheral module must be cleared prior to
disable a module via the PMDx bits.
Peripheral(1) PMDx bit Name(1) Register Name and Bit Location
ADC1 AD1MD PMD1<0>
CTMU CTMUMD PMD1<8>
Comparator Voltage Reference CVRMD PMD1<12>
Comparator 1 CMP1MD PMD2<0>
Comparator 2 CMP2MD PMD2<1>
Comparator 3 CMP3MD PMD2<2>
Input Capture 1 IC1MD PMD3<0>
Input Capture 2 IC2MD PMD3<1>
Input Capture 3 IC3MD PMD3<2>
Input Capture 4 IC4MD PMD3<3>
Input Capture 5 IC5MD PMD3<4>
Output Compare 1 OC1MD PMD3<16>
Output Compare 2 OC2MD PMD3<17>
Output Compare 3 OC3MD PMD3<18>
Output Compare 4 OC4MD PMD3<19>
Output Compare 5 OC5MD PMD3<20>
Timer1 T1MD PMD4<0>
Timer2 T2MD PMD4<1>
Timer3 T3MD PMD4<2>
Timer4 T4MD PMD4<3>
Timer5 T5MD PMD4<4>
UART1 U1MD PMD5<0>
UART2 U2MD PMD5<1>
SPI1 SPI1MD PMD5<8>
SPI2 SPI2MD PMD5<9>
I2C1 I2C1MD PMD5<16>
I2C2 I2C2MD PMD5<17>
USB(2) USBMD PMD5<24>
RTCC RTCCMD PMD6<0>
Reference Clock Output REFOMD PMD6<1>
PMP PMPMD PMD6<16>
Note 1: Not all modules and associated PMDx bits are available on all devices. See TABLE 1: “PIC32MX1XX
General Purpose Family Features” and TABLE 2: “PIC32MX2XX USB Family Features” for the lists
of available peripherals.
2: The module must not be busy after clearing the associated ON bit and prior to setting the USBMD bit.
PIC32MX1XX/2XX
DS61168E-page 222 Preliminary 2011-2012 Microchip Technology Inc.
25.4.1 CONTROLLING CONFIGURATION
CHANGES
Because peripherals can be disabled during run time,
some restrictions on disabling peripherals are needed
to prevent accidental configuration changes. PIC32
devices include two features to prevent alterations to
enabled or disabled peripherals:
Control register lock sequence
Configuration bit select lock
25.4.1.1 Control Register Lock
Under normal operation, writes to the PMDx registers
are not allowed. Attempted writes appear to execute
normally, but the contents of the registers remain
unchanged. To change these registers, they must be
unlocked in hardware. The register lock is controlled by
the PMDLOCK Configuration bit (CFGCON<12>). Set-
ting PMDLOCK prevents writes to the control registers;
clearing PMDLOCK allows writes.
To set or clear PMDLOCK, an unlock sequence must
be executed. Refer to Section 6. “Oscillator”
(DS61112) in the “PIC32 Family Reference Manual” for
details.
25.4.1.2 Configuration Bit Select Lock
As an additional level of safety, the device can be
configured to prevent more than one write session to
the PMDx registers. The PMDL1WAY Configuration bit
(DEVCFG3<28>) blocks the PMDLOCK bit from being
cleared after it has been set once. If PMDLOCK
remains set, the register unlock procedure does not
execute, and the peripheral pin select control registers
cannot be written to. The only way to clear the bit and
re-enable PMD functionality is to perform a device
Reset.
2011-2012 Microchip Technology Inc. Preliminary DS61168E-page 223
PIC32MX1XX/2XX
26.0 SPECIAL FEATURES
PIC32MX1XX/2XX devices include several features
intended to maximize application flexibility and reliabil-
ity and minimize cost through elimination of external
components. These are:
Flexible device configuration
Watchdog Timer (WDT)
Joint Test Action Group (JTAG) interface
In-Circuit Serial Programming™ (ICSP™)
26.1 Configuration Bits
The Configuration bits can be programmed using the
following registers to select various device
configurations.
DEVCFG0: Device Configuration Word 0
DEVCFG1: Device Configuration Word 1
DEVCFG2: Device Configuration Word 2
DEVCFG3: Device Configuration Word 3
CFGCON: Configuration Control Register
In addition, the DEVID register (Register 26-6)
provides device and revision information.
Note: This data sheet summarizes the features
of the PIC32MX1XX/2XX family of
devices. However, it is not intended to be
a comprehensive reference source. To
complement the information in this data
sheet, refer to Section 9. “Watchdog
Timer and Power-up Timer” (DS61114),
Section 32. “Configuration” (DS61124)
and Section 33. “Programming and
Diagnostics” (DS61129) in the “PIC32
Family Reference Manual” (DS61132),
which is available from the Microchip web
site (www.microchip.com/PIC32).
PIC32MX1XX/2XX
DS61168E-page 224 Preliminary 2011-2012 Microchip Technology Inc.
REGISTER 26-1: DEVCFG0: DEVICE CONFIGURATION WORD 0
Bit
Range Bit
31/23/15/7 Bit
30/22/14/6 Bit
29/21/13/5 Bit
28/20/12/4 Bit
27/19/11/3 Bit
26/18/10/2 Bit
25/17/9/1 Bit
24/16/8/0
31:24 r-0 r-1 r-1 R/P r-1 r-1 r-1 R/P
—CP —BWP
23:16 r-1 r-1 r-1 r-1 r-1 r-1 r-1 R/P
—PWP<6>
15:8 R/P R/P R/P R/P R/P R/P r-1 r-1
PWP<5:0>
7:0 r-1 r-1 r-1 R/P R/P R/P R/P R/P
ICESEL<1:0>(2) JTAGEN(1) DEBUG<1:0>
Legend: r = Reserved bit P = Programmable bit
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 31 Reserved: Write ‘0
bit 30-29 Reserved: Write ‘1
bit 28 CP: Code-Protect bit
Prevents boot and program Flash memory from being read or modified by an external pro-
gramming device.
1 = Protection is disabled
0 = Protection is enabled
bit 27-25 Reserved: Write ‘1
bit 24 BWP: Boot Flash Write-Protect bit
Prevents boot Flash memory from being modified during code execution.
1 = Boot Flash is writable
0 = Boot Flash is not writable
bit 23-17 Reserved: Write ‘1
bit 16-10 PWP<6:0>: Program Flash Write-Protect bits
Prevents selected program Flash memory pages from being modified during code execution.
1111111 = Disabled
1111110 = Memory below 0x0400 address is write-protected
1111101 = Memory below 0x0800 address is write-protected
1111100 = Memory below 0x0C00 address is write-protected
1111011 = Memory below 0x1000 address is write-protected
1111010 = Memory below 0x1400 address is write-protected
1111001 = Memory below 0x1800 address is write-protected
1111000 = Memory below 0x1C00 address is write-protected
1110111 = Memory below 0x2000 address is write-protected
1110110 = Memory below 0x2400 address is write-protected
1110101 = Memory below 0x2800 address is write-protected
1110100 = Memory below 0x2C00 address is write-protected
1110011 = Memory below 0x3000 address is write-protected
1110010 = Memory below 0x3400 address is write-protected
1110001 = Memory below 0x3800 address is write-protected
1110000 = Memory below 0x3C00 address is write-protected
1101111 = Memory below 0x4000 address is write-protected
0000000 = Memory below 0x20000 address is write-protected
Note 1: This bit sets the value for the JTAGEN bit in the CFGCON register.
2: The PGEC4/PGED4 pin pair is not available on all devices. Refer to the “Pin Diagrams” section for
availability.
2011-2012 Microchip Technology Inc. Preliminary DS61168E-page 225
PIC32MX1XX/2XX
bit 9-5 Reserved: Write1
bit 4-3 ICESEL<1:0>: In-Circuit Emulator/Debugger Communication Channel Select bits
11 = PGEC1/PGED1 pair is used
10 = PGEC2/PGED2 pair is used
01 = PGEC3/PGED3 pair is used
00 = PGEC4/PGED4 pair is used(2)
bit 2 JTAGEN: JTAG Enable bit(1)
1 = JTAG is enabled
0 = JTAG is disabled
bit 1-0 DEBUG<1:0>: Background Debugger Enable bits (forced to ‘11 if code-protect is enabled)
1x = Debugger is disabled
0x = Debugger is enabled
REGISTER 26-1: DEVCFG0: DEVICE CONFIGURATION WORD 0 (CONTINUED)
Note 1: This bit sets the value for the JTAGEN bit in the CFGCON register.
2: The PGEC4/PGED4 pin pair is not available on all devices. Refer to the “Pin Diagrams” section for
availability.
PIC32MX1XX/2XX
DS61168E-page 226 Preliminary 2011-2012 Microchip Technology Inc.
REGISTER 26-2: DEVCFG1: DEVICE CONFIGURATION WORD 1
Bit
Range Bit
31/23/15/7 Bit
30/22/14/6 Bit
29/21/13/5 Bit
28/20/12/4 Bit
27/19/11/3 Bit
26/18/10/2 Bit
25/17/9/1 Bit
24/16/8/0
31:24 r-1 r-1 r-1 r-1 r-1 r-1 R/P R/P
FWDTWINSZ<1:0>
23:16 R/P R/P r-1 R/P R/P R/P R/P R/P
FWDTEN WINDIS WDTPS<4:0>
15:8 R/P R/P R/P R/P r-1 R/P R/P R/P
FCKSM<1:0> FPBDIV<1:0> OSCIOFNC POSCMOD<1:0>
7:0 R/P r-1 R/P r-1 r-1 R/P R/P R/P
IESO FSOSCEN —FNOSC<2:0>
Legend: r = Reserved bit P = Programmable bit
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 31-26 Reserved: Write ‘1
bit 25-24 FWDTWINSZ: Watchdog Timer Window Size bits
11 = Window size is 25%
10 = Window size is 37.5%
01 = Window size is 50%
00 = Window size is 75%
bit 23 FWDTEN: Watchdog Timer Enable bit
1 = Watchdog Timer is enabled and cannot be disabled by software
0 = Watchdog Timer is not enabled; it can be enabled in software
bit 22 WINDIS: Watchdog Timer Window Enable bit
1 = Watchdog Timer is in non-Window mode
0 = Watchdog Timer is in Window mode
bit 21 Reserved: Write ‘1
bit 20-16 WDTPS<4:0>: Watchdog Timer Postscale Select bits
10100 = 1:1048576
10011 = 1:524288
10010 = 1:262144
10001 = 1:131072
10000 = 1:65536
01111 = 1:32768
01110 = 1:16384
01101 = 1:8192
01100 = 1:4096
01011 = 1:2048
01010 = 1:1024
01001 = 1:512
01000 = 1:256
00111 = 1:128
00110 = 1:64
00101 = 1:32
00100 = 1:16
00011 = 1:8
00010 = 1:4
00001 = 1:2
00000 = 1:1
All other combinations not shown result in operation = 10100
Note 1: Do not disable the POSC (POSCMOD = 11) when using this oscillator source.
2011-2012 Microchip Technology Inc. Preliminary DS61168E-page 227
PIC32MX1XX/2XX
bit 15-14 FCKSM<1:0>: Clock Switching and Monitor Selection Configuration bits
1x = Clock switching is disabled, Fail-Safe Clock Monitor is disabled
01 = Clock switching is enabled, Fail-Safe Clock Monitor is disabled
00 = Clock switching is enabled, Fail-Safe Clock Monitor is enabled
bit 13-12 FPBDIV<1:0>: Peripheral Bus Clock Divisor Default Value bits
11 = PBCLK is SYSCLK divided by 8
10 = PBCLK is SYSCLK divided by 4
01 = PBCLK is SYSCLK divided by 2
00 = PBCLK is SYSCLK divided by 1
bit 11 Reserved: Write ‘1
bit 10 OSCIOFNC: CLKO Enable Configuration bit
1 = CLKO output disabled
0 = CLKO output signal active on the OSCO pin; Primary Oscillator must be disabled or configured for the
External Clock mode (EC) for the CLKO to be active (POSCMOD<1:0> = 11 or 00)
bit 9-8 POSCMOD<1:0>: Primary Oscillator Configuration bits
11 = Primary Oscillator disabled
10 = HS Oscillator mode selected
01 = XT Oscillator mode selected
00 = External Clock mode selected
bit 7 IESO: Internal External Switchover bit
1 = Internal External Switchover mode is enabled (Two-Speed Start-up is enabled)
0 = Internal External Switchover mode is disabled (Two-Speed Start-up is disabled)
bit 6 Reserved: Write ‘1
bit 5 FSOSCEN: Secondary Oscillator Enable bit
1 = Enable Secondary Oscillator
0 = Disable Secondary Oscillator
bit 4-3 Reserved: Write1
bit 2-0 FNOSC<2:0>: Oscillator Selection bits
111 = Fast RC Oscillator with divide-by-N (FRCDIV)
110 = FRCDIV16 Fast RC Oscillator with fixed divide-by-16 postscaler
101 = Low-Power RC Oscillator (LPRC)
100 = Secondary Oscillator (SOSC)
011 = Primary Oscillator (POSC) with PLL module (XT+PLL, HS+PLL, EC+PLL)
010 = Primary Oscillator (XT, HS, EC)(1)
001 = Fast RC Oscillator with divide-by-N with PLL module (FRCDIV+PLL)
000 = Fast RC Oscillator (FRC)
REGISTER 26-2: DEVCFG1: DEVICE CONFIGURATION WORD 1 (CONTINUED)
Note 1: Do not disable the POSC (POSCMOD = 11) when using this oscillator source.
PIC32MX1XX/2XX
DS61168E-page 228 Preliminary 2011-2012 Microchip Technology Inc.
REGISTER 26-3: DEVCFG2: DEVICE CONFIGURATION WORD 2
Bit
Range Bit
31/23/15/7 Bit
30/22/14/6 Bit
29/21/13/5 Bit
28/20/12/4 Bit
27/19/11/3 Bit
26/18/10/2 Bit
25/17/9/1 Bit
24/16/8/0
31:24 r-1 r-1 r-1 r-1 r-1 r-1 r-1 r-1
23:16 r-1 r-1 r-1 r-1 r-1 R/P R/P R/P
FPLLODIV<2:0>
15:8 R/P r-1 r-1 r-1 r-1 R/P R/P R/P
UPLLEN(1) UPLLIDIV<2:0>(1)
7:0 r-1 R/P-1 R/P R/P-1 r-1 R/P R/P R/P
—FPLLMUL<2:0> FPLLIDIV<2:0>
Legend: r = Reserved bit P = Programmable bit
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 31-19 Reserved: Write ‘1
bit 18-16 FPLLODIV<2:0>: Default PLL Output Divisor bits
111 = PLL output divided by 256
110 = PLL output divided by 64
101 = PLL output divided by 32
100 = PLL output divided by 16
011 = PLL output divided by 8
010 = PLL output divided by 4
001 = PLL output divided by 2
000 = PLL output divided by 1
bit 15 UPLLEN: USB PLL Enable bit(1)
1 = Disable and bypass USB PLL
0 = Enable USB PLL
bit 14-11 Reserved: Write ‘1
bit 10-8 UPLLIDIV<2:0>: USB PLL Input Divider bits(1)
111 = 12x divider
110 = 10x divider
101 = 6x divider
100 = 5x divider
011 = 4x divider
010 = 3x divider
010 = 3x divider
001 = 2x divider
000 = 1x divider
bit 7 Reserved: Write ‘1
bit 6-4 FPLLMUL<2:0>: PLL Multiplier bits
111 = 24x multiplier
110 = 21x multiplier
101 = 20x multiplier
100 = 19x multiplier
011 = 18x multiplier
010 = 17x multiplier
001 = 16x multiplier
000 = 15x multiplier
bit 3 Reserved: Write ‘1
Note 1: This bit is available on PIC32MX2XX devices only.
2011-2012 Microchip Technology Inc. Preliminary DS61168E-page 229
PIC32MX1XX/2XX
bit 2-0 FPLLIDIV<2:0>: PLL Input Divider bits
111 = 12x divider
110 = 10x divider
101 = 6x divider
100 = 5x divider
011 = 4x divider
010 = 3x divider
001 = 2x divider
000 = 1x divider
REGISTER 26-3: DEVCFG2: DEVICE CONFIGURATION WORD 2 (CONTINUED)
Note 1: This bit is available on PIC32MX2XX devices only.
PIC32MX1XX/2XX
DS61168E-page 230 Preliminary 2011-2012 Microchip Technology Inc.
REGISTER 26-4: DEVCFG3: DEVICE CONFIGURATION WORD 3
Bit
Range Bit
31/23/15/7 Bit
30/22/14/6 Bit
29/21/13/5 Bit
28/20/12/4 Bit
27/19/11/3 Bit
26/18/10/2 Bit
25/17/9/1 Bit
24/16/8/0
31:24 R/P R/P R/P R/P r-1 r-1 r-1 r-1
FVBUSONIO FUSBIDIO IOL1WAY PMDL1WAY
23:16 r-1 r-1 r-1 r-1 r-1 r-1 r-1 r-1
15:8 R/P R/P R/P R/P R/P R/P R/P R/P
USERID<15:8>
7:0 R/P R/P R/P R/P R/P R/P R/P R/P
USERID<7:0>
Legend: r = Reserved bit P = Programmable bit
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 31 FVBUSONIO: USB VBUS_ON Selection bit
1 = VBUSON pin is controlled by the USB module
0 = VBUSON pin is controlled by the port function
bit 30 FUSBIDIO: USB USBID Selection bit
1 = USBID pin is controlled by the USB module
0 = USBID pin is controlled by the port function
bit 29 IOL1WAY: Peripheral Pin Select Configuration bit
1 = Allow only one reconfiguration
0 = Allow multiple reconfigurations
bit 28 PMDl1WAY: Peripheral Module Disable Configuration bit
1 = Allow only one reconfiguration
0 = Allow multiple reconfigurations
bit 27-16 Reserved: Write ‘1
bit 15-0 USERID<15:0>: User ID bits
This is a 16-bit value that is user-defined and is readable via ICSP™ and JTAG.
2011-2012 Microchip Technology Inc. Preliminary DS61168E-page 231
PIC32MX1XX/2XX
REGISTER 26-5: CFGCON: CONFIGURATION CONTROL REGISTER
Bit
Range Bit
31/23/15/7 Bit
30/22/14/6 Bit
29/21/13/5 Bit
28/20/12/4 Bit
27/19/11/3 Bit
26/18/10/2 Bit
25/17/9/1 Bit
24/16/8/0
31:24 U-0 U-0 U-0 U-0 U-0 U-0 U-0 U-0
23:16 U-0 U-0 U-0 U-0 U-0 U-0 U-0 U-0
15:8 U-0 U-0 R/W-0 R/W-0 U-0 U-0 U-0 U-0
—IOLOCK
(1) PMDLOCK(1)
7:0 U-0 U-0 U-0 U-0 R/W-1 U-0 U-1 R/W-1
—JTAGEN—TDOEN
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 31-14 Unimplemented: Read as ‘0
bit 13 IOLOCK: Peripheral Pin Select Lock bit(1)
1 = Peripheral Pin Select is locked. Writes to PPS registers is not allowed.
0 = Peripheral Pin Select is not locked. Writes to PPS registers is allowed.
bit 12 PMDLOCK: Peripheral Module Disable bit(1)
1 = Peripheral module is locked. Writes to PMD registers is not allowed.
0 = Peripheral module is not locked. Writes to PMD registers is allowed.
bit 11-4 Unimplemented: Read as ‘0
bit 3 JTAGEN: JTAG Port Enable bit
1 = Enable the JTAG port
0 = Disable the JTAG port
bit 2-1 Unimplemented: Read as ‘1
bit 0 TDOEN: TDO Enable for 2-Wire JTAG
1 = 2-wire JTAG protocol uses TDO
0 = 2-wire JTAG protocol does not use TDO
Note 1: To change this bit, the unlock sequence must be performed. Refer to Sectio n 6. “Oscilla tor” (DS61112)
in the “PIC32 Family Reference Manu al” for details.
PIC32MX1XX/2XX
DS61168E-page 232 Preliminary 2011-2012 Microchip Technology Inc.
REGISTER 26-6: DEVID: DEVICE AND REVISION ID REGISTER
Bit
Range Bit
31/23/15/7 Bit
30/22/14/6 Bit
29/21/13/5 Bit
28/20/12/4 Bit
27/19/11/3 Bit
26/18/10/2 Bit
25/17/9/1 Bit
24/16/8/0
31:24 RRRRRRRR
VER<3:0>(1) DEVID<27:24>(1)
23:16 RRRRRRRR
DEVID<23:16>(1)
15:8 RRRRRRRR
DEVID<15:8>(1)
7:0 RRRRRRRR
DEVID<7:0>(1)
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 31-28 VER<3:0>: Revision Identifier bits(1)
bit 27-0 DEVID<27:0>: Device ID bits(1)
Note 1: See the “PIC32 Flash Programming Specification” (DS61145) for a list of Revision and Device ID values.
2011-2012 Microchip Technology Inc. Preliminary DS61168E-page 233
PIC32MX1XX/2XX
26.2 Watchdog Timer (WDT)
This section describes the operation of the WDT and
Power-up Timer of the PIC32MX1XX/2XX.
The WDT, when enabled, operates from the internal
Low-Power Oscillator (LPRC) clock source and can be
used to detect system software malfunctions by reset-
ting the device if the WDT is not cleared periodically in
software. Various WDT time-out periods can be
selected using the WDT postscaler. The WDT can also
be used to wake the device from Sleep or Idle mode.
The following are some of the key features of the WDT
module:
Configuration or software controlled
User-configurable time-out period
Can wake the device from Sleep or Idle
FIGURE 26-1: WATCHDOG AND POWER-UP TIMER BLOCK DIAGRAM
Wake
WDTCLR = 1
WDT Enable
LPRC
Power Save
25-bit Counter
PWRT Enable
WDT Enable
LPRC
WDT Counter Reset
Control
Oscillator
25
Device Reset
NMI (Wake-up)
PWRT
PWRT Enable
FWDTPS<4:0> (DEVCFG1<20:16>)
Clock
Decoder
1
1:64 Output
0
1
WDT Enable
Reset Event
PIC32MX1XX/2XX
DS61168E-page 234 Preliminary 2011-2012 Microchip Technology Inc.
REGISTER 26-7: WDTCON: WATCHDOG TIMER CONTROL REGISTER
Bit
Range Bit
31/23/15/7 Bit
30/22/14/6 Bit
29/21/13/5 Bit
28/20/12/4 Bit
27/19/11/3 Bit
26/18/10/2 Bit
25/17/9/1 Bit
24/16/8/0
31:24 U-0 U-0 U-0 U-0 U-0 U-0 U-0 U-0
23:16 U-0 U-0 U-0 U-0 U-0 U-0 U-0 U-0
15:8 R/W-0 U-0 U-0 U-0 U-0 U-0 U-0 U-0
ON(1,2)
7:0 U-0 R-y R-y R-y R-y R-y R/W-0 R/W-0
SWDTPS<4:0> WDTWINEN WDTCLR
Legend: y = Values set from Configuration bits on POR
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 31-16 Unimplemented: Read as ‘0
bit 15 ON: Watchdog Timer Enable bit(1,2)
1 = Enables the WDT if it is not enabled by the device configuration
0 = Disable the WDT if it was enabled in software
bit 14-7 Unimplemented: Read as ‘0
bit 6-2 SWDTPS<4:0>: Shadow Copy of Watchdog Timer Postscaler Value from Device Configuration bits
On reset, these bits are set to the values of the WDTPS <4:0> of Configuration bits.
bit 1 WDTWINEN: Watchdog Timer Window Enable bit
1 = Enable windowed Watchdog Timer
0 = Disable windowed Watchdog Timer
bit 0 WDTCLR: Watchdog Timer Reset bit
1 = Writing a ‘1’ will clear the WDT
0 = Software cannot force this bit to a ‘0
Note 1: A read of this bit results in a ‘1’ if the Watchdog Timer is enabled by the device configuration or software.
2: When using the 1:1 PBCLK divisor, the user’s software should not read or write the peripheral’s SFRs in
the SYSCLK cycle immediately following the instruction that clears the module’s ON bit.
2011-2012 Microchip Technology Inc. Preliminary DS61168E-page 235
PIC32MX1XX/2XX
26.3 On-Chip Voltage Regulator
All PIC32MX1XX/2XX devices’ core and digital logic
are designed to operate at a nominal 1.8V. To simplify
system designs, most devices in the
PIC32MX1XX/2XX family incorporate an on-chip regu-
lator providing the required core logic voltage from
VDD.
A low-ESR capacitor (such as tantalum) must be
connected to the VCAP pin (see Figure 26-2). This
helps to maintain the stability of the regulator. The
recommended value for the filter capacitor is provided
in Section 29.1 “DC Characteristics”.
26.3.1 ON-CHIP REGULATOR AND POR
It takes a fixed delay for the on-chip regulator to generate
an output. During this time, designated as TPU, code
execution is disabled. TPU is applied every time the
device resumes operation after any power-down,
including Sleep mode.
26.3.2 ON-CHIP REGULATOR AND BOR
PIC32MX1XX/2XX devices also have a simple brown-
out capability. If the voltage supplied to the regulator is
inadequate to maintain a regulated level, the regulator
Reset circuitry will generate a Brown-out Reset. This
event is captured by the BOR flag bit (RCON<1>). The
brown-out voltage levels are specific in Section 29.1
“DC Characteristics.
FIGURE 26-2: CONNECTIONS FOR THE
ON-CHIP REGULATOR
26.4 Programming and Diagnostics
PIC32MX1XX/2XX devices provide a complete range
of programming and diagnostic features that can
increase the flexibility of any application using them.
These features allow system designers to include:
Simplified field programmability using two-wire
In-Circuit Serial Programming™ (ICSP™)
interfaces
Debugging using ICSP
Programming and debugging capabilities using
the EJTAG extension of JTAG
JTAG boundary scan testing for device and board
diagnostics
PIC32 devices incorporate two programming and diag-
nostic modules, and a trace controller, that provide a
range of functions to the application developer.
FIGURE 26-3: BLOCK DIAGRAM OF
PROGRAMMING,
DEBUGGING AND TRACE
PORTS
Note: It is important that the low-ESR capacitor
is placed as close as possible to the VCAP
pin.
VDD
VCAP
VSS
PIC32
CEFC(2,3)
3.3V(1)
Note 1: These are typical operating voltages. Refer to
Section 29.1 “DC Characteristics”
for the full
operating ranges of VDD.
2: It is important that the low-ESR capacitor is
placed as close as possible to the VCAP pin.
3: The typical voltage on the VCAP pin is 1.8V.
(10 F typ)
TDI
TDO
TCK
TMS
JTAG
Controller
ICSP™
Controller
Core
JTAGEN DEBUG<1:0>
ICESEL
PGEC1
PGED1
PGEC4
PGED4
PIC32MX1XX/2XX
DS61168E-page 236 Preliminary 2011-2012 Microchip Technology Inc.
NOTES:
2011-2012 Microchip Technology Inc. Preliminary DS61168E-page 237
PIC32MX1XX/2XX
27.0 INSTRUCTION SET
The PIC32MX1XX/2XX family instruction set complies
with the MIPS32® Release 2 instruction set architec-
ture. The PIC32 device family does not support the fol-
lowing features:
Core extend instructions
Coprocessor 1 instructions
Coprocessor 2 instructions
Note: Refer to “MIPS32® Architecture for
Programmers Volume II: The MIPS32®
Instruction Set” at www.mips.com for
more information.
PIC32MX1XX/2XX
DS61168E-page 238 Preliminary 2011-2012 Microchip Technology Inc.
NOTES:
2011-2012 Microchip Technology Inc. Preliminary DS61168E-page 239
PIC32MX1XX/2XX
28.0 DEVELOPMENT SUPPORT
The PIC® microcontrollers and dsPIC® digital signal
controllers are supported with a full range of software
and hardware development tools:
Integrated Development Environment
- MPLAB® IDE Software
Compilers/Assemblers/Linkers
- MPLAB C Compiler for Various Device
Families
- HI-TECH C® for Various Device Families
- MPASMTM Assembler
-MPLINK
TM Object Linker/
MPLIBTM Object Librarian
- MPLAB Assembler/Linker/Librarian for
Various Device Families
Simulators
- MPLAB SIM Software Simulator
Emulators
- MPLAB REAL ICE™ In-Circuit Emulator
In-Circuit Debuggers
- MPLAB ICD 3
- PICkit™ 3 Debug Express
Device Programmers
- PICkit™ 2 Programmer
- MPLAB PM3 Device Programmer
Low-Cost Demonstration/Development Boards,
Evaluation Kits, and Starter Kits
28.1 MPLAB Integrated Development
Environment Software
The MPLAB IDE software brings an ease of software
development previously unseen in the 8/16/32-bit
microcontroller market. The MPLAB IDE is a Windows®
operating system-based application that contains:
A single graphical interface to all debugging tools
- Simulator
- Programmer (sold separately)
- In-Circuit Emulator (sold separately)
- In-Circuit Debugger (sold separately)
A full-featured editor with color-coded context
A multiple project manager
Customizable data windows with direct edit of
contents
High-level source code debugging
Mouse over variable inspection
Drag and drop variables from source to watch
windows
Extensive on-line help
Integration of select third party tools, such as
IAR C Compilers
The MPLAB IDE allows you to:
Edit your source files (either C or assembly)
One-touch compile or assemble, and download to
emulator and simulator tools (automatically
updates all project information)
Debug using:
- Source files (C or assembly)
- Mixed C and assembly
- Machine code
MPLAB IDE supports multiple debugging tools in a
single development paradigm, from the cost-effective
simulators, through low-cost in-circuit debuggers, to
full-featured emulators. This eliminates the learning
curve when upgrading to tools with increased flexibility
and power.
PIC32MX1XX/2XX
DS61168E-page 240 Preliminary 2011-2012 Microchip Technology Inc.
28.2 MPLAB C Compilers for Various
Device Families
The MPLAB C Compiler code development systems
are complete ANSI C compilers for Microchip’s PIC18,
PIC24 and PIC32 families of microcontrollers and the
dsPIC30 and dsPIC33 families of digital signal control-
lers. These compilers provide powerful integration
capabilities, superior code optimization and ease of
use.
For easy source level debugging, the compilers provide
symbol information that is optimized to the MPLAB IDE
debugger.
28.3 HI-TECH C for Various Device
Families
The HI-TECH C Compiler code development systems
are complete ANSI C compilers for Microchip’s PIC
family of microcontrollers and the dsPIC family of digital
signal controllers. These compilers provide powerful
integration capabilities, omniscient code generation
and ease of use.
For easy source level debugging, the compilers provide
symbol information that is optimized to the MPLAB IDE
debugger.
The compilers include a macro assembler, linker, pre-
processor, and one-step driver, and can run on multiple
platforms.
28.4 MPASM Assembler
The MPASM Assembler is a full-featured, universal
macro assembler for PIC10/12/16/18 MCUs.
The MPASM Assembler generates relocatable object
files for the MPLINK Object Linker, Intel® standard HEX
files, MAP files to detail memory usage and symbol
reference, absolute LST files that contain source lines
and generated machine code and COFF files for
debugging.
The MPASM Assembler features include:
Integration into MPLAB IDE projects
User-defined macros to streamline
assembly code
Conditional assembly for multi-purpose
source files
Directives that allow complete control over the
assembly process
28.5 MPLINK Object Linker/
MPLIB Object Librarian
The MPLINK Object Linker combines relocatable
objects created by the MPASM Assembler and the
MPLAB C18 C Compiler. It can link relocatable objects
from precompiled libraries, using directives from a
linker script.
The MPLIB Object Librarian manages the creation and
modification of library files of precompiled code. When
a routine from a library is called from a source file, only
the modules that contain that routine will be linked in
with the application. This allows large libraries to be
used efficiently in many different applications.
The object linker/library features include:
Efficient linking of single libraries instead of many
smaller files
Enhanced code maintainability by grouping
related modules together
Flexible creation of libraries with easy module
listing, replacement, deletion and extraction
28.6 MPLAB Assembler, Linker and
Librarian for Various Device
Families
MPLAB Assembler produces relocatable machine
code from symbolic assembly language for PIC24,
PIC32 and dsPIC devices. MPLAB C Compiler uses
the assembler to produce its object file. The assembler
generates relocatable object files that can then be
archived or linked with other relocatable object files and
archives to create an executable file. Notable features
of the assembler include:
Support for the entire device instruction set
Support for fixed-point and floating-point data
Command line interface
Rich directive set
Flexible macro language
MPLAB IDE compatibility
2011-2012 Microchip Technology Inc. Preliminary DS61168E-page 241
PIC32MX1XX/2XX
28.7 MPLAB SIM Software Simulator
The MPLAB SIM Software Simulator allows code
development in a PC-hosted environment by simulat-
ing the PIC MCUs and dsPIC® DSCs on an instruction
level. On any given instruction, the data areas can be
examined or modified and stimuli can be applied from
a comprehensive stimulus controller. Registers can be
logged to files for further run-time analysis. The trace
buffer and logic analyzer display extend the power of
the simulator to record and track program execution,
actions on I/O, most peripherals and internal registers.
The MPLAB SIM Software Simulator fully supports
symbolic debugging using the MPLAB C Compilers,
and the MPASM and MPLAB Assemblers. The soft-
ware simulator offers the flexibility to develop and
debug code outside of the hardware laboratory envi-
ronment, making it an excellent, economical software
development tool.
28.8 MPLAB REAL ICE In-Circuit
Emulator System
MPLAB REAL ICE In-Circuit Emulator System is
Microchip’s next generation high-speed emulator for
Microchip Flash DSC and MCU devices. It debugs and
programs PIC® Flash MCUs and dsPIC® Flash DSCs
with the easy-to-use, powerful graphical user interface of
the MPLAB Integrated Development Environment (IDE),
included with each kit.
The emulator is connected to the design engineer’s PC
using a high-speed USB 2.0 interface and is connected
to the target with either a connector compatible with in-
circuit debugger systems (RJ11) or with the new high-
speed, noise tolerant, Low-Voltage Differential Signal
(LVDS) interconnection (CAT5).
The emulator is field upgradable through future firmware
downloads in MPLAB IDE. In upcoming releases of
MPLAB IDE, new devices will be supported, and new
features will be added. MPLAB REAL ICE offers
significant advantages over competitive emulators
including low-cost, full-speed emulation, run-time
variable watches, trace analysis, complex breakpoints, a
ruggedized probe interface and long (up to three meters)
interconnection cables.
28.9 MPLAB ICD 3 In-Circuit Debugger
System
MPLAB ICD 3 In-Circuit Debugger System is Micro-
chip's most cost effective high-speed hardware
debugger/programmer for Microchip Flash Digital Sig-
nal Controller (DSC) and microcontroller (MCU)
devices. It debugs and programs PIC® Flash microcon-
trollers and dsPIC® DSCs with the powerful, yet easy-
to-use graphical user interface of MPLAB Integrated
Development Environment (IDE).
The MPLAB ICD 3 In-Circuit Debugger probe is con-
nected to the design engineer's PC using a high-speed
USB 2.0 interface and is connected to the target with a
connector compatible with the MPLAB ICD 2 or MPLAB
REAL ICE systems (RJ-11). MPLAB ICD 3 supports all
MPLAB ICD 2 headers.
28.10 PICkit 3 In-Circuit Debugger/
Programmer and
PICkit 3 Debug Express
The MPLAB PICkit 3 allows debugging and program-
ming of PIC® and dsPIC® Flash microcontrollers at a
most affordable price point using the powerful graphical
user interface of the MPLAB Integrated Development
Environment (IDE). The MPLAB PICkit 3 is connected
to the design engineer's PC using a full speed USB
interface and can be connected to the target via an
Microchip debug (RJ-11) connector (compatible with
MPLAB ICD 3 and MPLAB REAL ICE). The connector
uses two device I/O pins and the reset line to imple-
ment in-circuit debugging and In-Circuit Serial Pro-
gramming™.
The PICkit 3 Debug Express include the PICkit 3, demo
board and microcontroller, hookup cables and CDROM
with user’s guide, lessons, tutorial, compiler and
MPLAB IDE software.
PIC32MX1XX/2XX
DS61168E-page 242 Preliminary 2011-2012 Microchip Technology Inc.
28.11 PICkit 2 Development
Programmer/Debugger and
PICkit 2 Debug Express
The PICkit™ 2 Development Programmer/Debugger is
a low-cost development tool with an easy to use inter-
face for programming and debugging Microchip’s Flash
families of microcontrollers. The full featured
Windows® programming interface supports baseline
(PIC10F, PIC12F5xx, PIC16F5xx), midrange
(PIC12F6xx, PIC16F), PIC18F, PIC24, dsPIC30,
dsPIC33, and PIC32 families of 8-bit, 16-bit, and 32-bit
microcontrollers, and many Microchip Serial EEPROM
products. With Microchip’s powerful MPLAB Integrated
Development Environment (IDE) the PICkit™ 2
enables in-circuit debugging on most PIC® microcon-
trollers. In-Circuit-Debugging runs, halts and single
steps the program while the PIC microcontroller is
embedded in the application. When halted at a break-
point, the file registers can be examined and modified.
The PICkit 2 Debug Express include the PICkit 2, demo
board and microcontroller, hookup cables and CDROM
with user’s guide, lessons, tutorial, compiler and
MPLAB IDE software.
28.12 MPLAB PM3 Device Programmer
The MPLAB PM3 Device Programmer is a universal,
CE compliant device programmer with programmable
voltage verification at VDDMIN and VDDMAX for
maximum reliability. It features a large LCD display
(128 x 64) for menus and error messages and a modu-
lar, detachable socket assembly to support various
package types. The ICSP™ cable assembly is included
as a standard item. In Stand-Alone mode, the MPLAB
PM3 Device Programmer can read, verify and program
PIC devices without a PC connection. It can also set
code protection in this mode. The MPLAB PM3
connects to the host PC via an RS-232 or USB cable.
The MPLAB PM3 has high-speed communications and
optimized algorithms for quick programming of large
memory devices and incorporates an MMC card for file
storage and data applications.
28.13 Demonstration/Development
Boards, Evaluation Kits, and
Star ter Kits
A wide variety of demonstration, development and
evaluation boards for various PIC MCUs and dsPIC
DSCs allows quick application development on fully func-
tional systems. Most boards include prototyping areas for
adding custom circuitry and provide application firmware
and source code for examination and modification.
The boards support a variety of features, including LEDs,
temperature sensors, switches, speakers, RS-232
interfaces, LCD displays, potentiometers and additional
EEPROM memory.
The demonstration and development boards can be
used in teaching environments, for prototyping custom
circuits and for learning about various microcontroller
applications.
In addition to the PICDEM™ and dsPICDEM™ demon-
stration/development board series of circuits, Microchip
has a line of evaluation kits and demonstration software
for analog filter design, KEELOQ® security ICs, CAN,
IrDA®, PowerSmart battery management, SEEVAL®
evaluation system, Sigma-Delta ADC, flow rate
sensing, plus many more.
Also available are starter kits that contain everything
needed to experience the specified device. This usually
includes a single application and debug capability, all
on one board.
Check the Microchip web page (www.microchip.com)
for the complete list of demonstration, development
and evaluation kits.
2011-2012 Microchip Technology Inc. Preliminary DS61168E-page 243
PIC32MX1XX/2XX
29.0 ELECTRICAL CHARACTERISTICS
This section provides an overview of the PIC32MX1XX/2XX electrical characteristics. Additional information will be
provided in future revisions of this document as it becomes available.
Absolute maximum ratings for the PIC32MX1XX/2XX devices are listed below. Exposure to these maximum rating
conditions for extended periods may affect device reliability. Functional operation of the device at these or any other
conditions, above the parameters indicated in the operation listings of this specification, is not implied.
Absolute Maximum Ratings
(See Note 1)
Ambient temperature under bias.............................................................................................................-40°C to +105°C
Storage temperature .............................................................................................................................. -65°C to +150°C
Voltage on VDD with respect to VSS ......................................................................................................... -0.3V to +4.0V
Voltage on any pin that is not 5V tolerant, with respect to VSS (Note 3)......................................... -0.3V to (VDD + 0.3V)
Voltage on any 5V tolerant pin with respect to VSS when VDD 2.3V (Note 3)........................................ -0.3V to +5.5V
Voltage on any 5V tolerant pin with respect to VSS when VDD < 2.3V (Note 3)........................................ -0.3V to +3.6V
Voltage on D+ or D- pin with respect to VUSB3V3..................................................................... -0.3V to (VUSB3V3 + 0.3V)
Voltage on VBUS with respect to VSS ....................................................................................................... -0.3V to +5.5V
Maximum current out of VSS pin(s) .......................................................................................................................300 mA
Maximum current into VDD pin(s) (Note 2)............................................................................................................300 mA
Maximum output current sunk by any I/O pin..........................................................................................................15 mA
Maximum output current sourced by any I/O pin ....................................................................................................15 mA
Maximum current sunk by all ports .......................................................................................................................200 mA
Maximum current sourced by all ports (Note 2)....................................................................................................200 mA
Note 1: Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the
device. This is a stress rating only and functional operation of the device at those or any other conditions,
above those indicated in the operation listings of this specification, is not implied. Exposure to maximum
rating conditions for extended periods may affect device reliability.
2: Maximum allowable current is a function of device maximum power dissipation (see Table 29-2).
3: See the Pin Diagrams section for the 5V tolerant pins.
PIC32MX1XX/2XX
DS61168E-page 244 Preliminary 2011-2012 Microchip Technology Inc.
29.1 DC Characteristics
TABLE 29-1: OPERATING MIPS VS. VOLTAGE
Characteristic VDD Range
(in Volts)(1) Temp. Range
(in °C)
Max. Frequency
PIC32MX1XX/2XX
DC5 2.3-3.6V -40°C to +85°C 40 MHz
DC5b 2.3-3.6V -40°C to +105°C 40 MHz
Note 1: Overall functional device operation at VBORMIN < VDD < VDDMIN is tested, but not characterized. All device
Analog modules, such as ADC, etc., will function, but with degraded performance below VDDMIN. Refer to
parameter BO10 in Table 29-10 for BOR values.
TABLE 29-2: THERMAL OPERATING CONDITIONS
Rating Symbol Min. Typical Max. Unit
Industrial Temperature Devices
Operating Junction Temperature Range TJ-40 +125 °C
Operating Ambient Temperature Range TA-40 +85 °C
V-temp Temperature Devices
Operating Junction Temperature Range TJ-40 +140 °C
Operating Ambient Temperature Range TA-40 +105 °C
Power Dissipation:
Internal Chip Power Dissipation:
PINT = VDD x (IDD – S IOH) PDPINT + PI/OW
I/O Pin Power Dissipation:
I/O = S (({VDD – VOH} x IOH) + S (VOL x IOL))
Maximum Allowed Power Dissipation PDMAX (TJ – TA)/JA W
TABLE 29-3: THERMAL PACKAGING CHARACTERISTICS
Characteristics Symbol Typical Max. Unit Notes
Package Thermal Resistance, 28-pin SSOP JA 71 °C/W 1
Package Thermal Resistance, 28-pin SOIC JA 50 °C/W 1
Package Thermal Resistance, 28-pin SPDIP JA 42 °C/W 1
Package Thermal Resistance, 28-pin QFN JA 35 °C/W 1
Package Thermal Resistance, 36-pin VTLA JA 31 °C/W 1
Package Thermal Resistance, 44-pin QFN JA 32 °C/W 1
Package Thermal Resistance, 44-pin TQFP JA 45 °C/W 1
Package Thermal Resistance, 44-pin VTLA JA 30 °C/W 1
Note 1: Junction to ambient thermal resistance, Theta-JA (JA) numbers are achieved by package simulations.
2011-2012 Microchip Technology Inc. Preliminary DS61168E-page 245
PIC32MX1XX/2XX
TABLE 29-4: DC TEMPER ATURE AND VOLTAGE SPECIFICATIONS
DC CHARACTERISTICS
Standard Operating Co nd itio ns: 2.3V to 3.6V
(unless otherw ise stated)
Operating temperature -40°C TA +85°C for Industrial
-40°C TA +105°C for V-temp
Param.
No. Symbol Characteristics Min. Typ. Max. Units Conditions
Operating Voltage
DC10 VDD Supply Voltage (Note 2) 2.3 3.6 V
DC12 VDR RAM Data Retention Voltage
(Note 1) 1.75 V
DC16 VPOR VDD Start Voltage
to Ensure Internal Power-on Reset
Signal
1.75 2.1 V
DC17 SVDD VDD Rise Rate
to Ensure Internal Power-on Reset
Signal
0.00005 — 0.115 V/s—
Note 1: This is the limit to which VDD can be lowered without losing RAM data.
2: Overall functional device operation at VBORMIN < VDD < VDDMIN is tested, but not characterized. All device
Analog modules, such as ADC, etc., will function, but with degraded performance below VDDMIN. Refer to
parameter BO10 in Table 29-10 for BOR values.
PIC32MX1XX/2XX
DS61168E-page 246 Preliminary 2011-2012 Microchip Technology Inc.
TABLE 29-5: DC CHARACTERISTICS: OPERATING CURRENT (IDD)
DC CHARACTERISTICS
Standard Operating Co nd itio ns: 2.3V to 3.6V
(unless otherwise stated)
Operating temperature -40°C TA +85°C for Industrial
-40°C TA +105°C for V-temp
Parameter
No. Typical(3) Max. Unit s Conditions
Operating Current (IDD) (Note 1, 2)
DC20 2 3 mA 4 MHz (Note 4)
DC21 7 10.5 mA 10 MHz
DC22 10 15 mA 20 MHz (Note 4)
DC23 15 23 mA 30 MHz (Note 4)
DC24 20 30 mA 40 MHz
DC25 100 150 µA +25ºC, 3.3V LPRC (31 kHz) (Note 4)
Note 1: A device’s IDD supply current is mainly a function of the operating voltage and frequency. Other factors,
such as PBCLK (Peripheral Bus Clock) frequency, number of peripheral modules enabled, internal code
execution pattern, execution from Program Flash memory vs. SRAM, I/O pin loading and switching rate,
oscillator type, as well as temperature, can have an impact on the current consumption.
2: The test conditions for IDD measurements are as follows:
Oscillator mode is EC (for 8 MHz and below) and EC+PLL (for above 8 MHz) with OSC1 driven by
external square wave from rail-to-rail, (OSC1 input clock input over/undershoot < 100 mV required)
OSC2/CLKO is configured as an I/O input pin
USB PLL oscillator is disabled if the USB module is implemented, PBCLK divisor = 1:8
CPU, Program Flash, and SRAM data memory are operational, SRAM data memory Wait states = 1
No peripheral modules are operating, (ON bit = 0), but the associated PMD bit is cleared
WDT, Clock Switching, Fail-Safe Clock Monitor, and Secondary Oscillator are disabled
All I/O pins are configured as inputs and pulled to VSS
•MCLR
= VDD
CPU executing while(1) statement from Flash
RTCC and JTAG are disabled
3: Data in “Typical” column is at 3.3V, 25°C at specified operating frequency unless otherwise stated.
Parameters are for design guidance only and are not tested.
4: This parameter is characterized, but not tested in manufacturing.
2011-2012 Microchip Technology Inc. Preliminary DS61168E-page 247
PIC32MX1XX/2XX
TABLE 29-6: DC CHARACTERISTICS: IDLE CURRENT (IIDLE)
DC CHARACTERISTICS
Standard Operating Co nd itions: 2.3V to 3.6V
(unless otherwise stated)
Operating temperature -40°C TA +85°C for Industrial
-40°C TA +105°C for V-temp
Parameter
No. Typical(2) Max. Units Conditions
Idle Current (IIDLE): Core Off, Clock on Base Current (Note 1)
DC30a 1 1.5 mA 4 MHz (Note 3)
DC31a 2 3 mA 10 MHz
DC32a 4 6 mA 20 MHz (Note 3)
DC33a 5.5 8 mA 30 MHz (Note 3)
DC34a 7.5 11 mA 40 MHz
DC37a 100 µA -40°C
3.3V
LPRC (31 kHz)
(Note 3)
DC37b 250 µA +25°C
DC37c 380 µA +85°C
Note 1: The test conditions for IIDLE current measurements are as follows:
Oscillator mode is EC (for 8 MHz and below) and EC+PLL (for above 8 MHz) with OSC1 driven by
external square wave from rail-to-rail, (OSC1 input clock input over/undershoot < 100 mV required)
OSC2/CLKO is configured as an I/O input pin
USB PLL oscillator is disabled if the USB module is implemented, PBCLK divisor = 1:8
CPU is in Idle mode (CPU core Halted), and SRAM data memory Wait states = 1
No peripheral modules are operating, (ON bit = 0), but the associated PMD bit is cleared
WDT, Clock Switching, Fail-Safe Clock Monitor, and Secondary Oscillator are disabled
All I/O pins are configured as inputs and pulled to VSS
•MCLR = VDD
RTCC and JTAG are disabled
2: Data in the “Typical” column is at 3.3V, 25°C unless otherwise stated. Parameters are for design guidance
only and are not tested.
3: This parameter is characterized, but not tested in manufacturing.
PIC32MX1XX/2XX
DS61168E-page 248 Preliminary 2011-2012 Microchip Technology Inc.
TABLE 29-7: DC CHARACTERISTICS: POWER-DOWN CURRENT (IPD)
DC CHARACTERISTICS Standard Operating Conditions: 2.3V to 3.6V (unless otherwise stated)
Operating temperature -40°C TA +85°C for Industrial
-40°C TA +105°C for V-temp
Param.
No. Typical(2) Max. Units Conditions
Power-Down Current (IPD) (Note 1)
DC40k 10 16 A-40°C
Base Power-Down Current
DC40l 44 70 A+25°C
DC40n 168 259 A+85°C
DC40m 335 536 µA +105ºC
Module Differential Current
DC41e 5 20 A 3.6V Watchdog Timer Current: IWDT (Note 3)
DC42e 23 50 A 3.6V RTCC + Timer1 w/32 kHz Crystal: IRTCC (Note 3)
DC43d 1000 1100 A 3.6V ADC: IADC (Note s 3, 4)
Note 1: The test conditions for IPD current measurements are as follows:
Oscillator mode is EC (for 8 MHz and below) and EC+PLL (for above 8 MHz) with OSC1 driven by
external square wave from rail-to-rail, (OSC1 input clock input over/undershoot < 100 mV required)
OSC2/CLKO is configured as an I/O input pin
USB PLL oscillator is disabled if the USB module is implemented, PBCLK divisor = 1:8
CPU is in Sleep mode, and SRAM data memory Wait states = 1
No peripheral modules are operating, (ON bit = 0), but the associated PMD bit is set
WDT, Clock Switching, Fail-Safe Clock Monitor, and Secondary Oscillator are disabled
All I/O pins are configured as inputs and pulled to VSS
•MCLR = VDD
RTCC and JTAG are disabled
2: Data in the “Typical” column is at 3.3V, 25°C unless otherwise stated. Parameters are for design guidance
only and are not tested.
3: The current is the additional current consumed when the module is enabled. This current should be
added to the base IPD current.
4: Test conditions for ADC module differential current are as follows: Internal ADC RC oscillator enabled.
2011-2012 Microchip Technology Inc. Preliminary DS61168E-page 249
PIC32MX1XX/2XX
TABLE 29-8: DC CHARACTER ISTICS: I/O PIN INPUT SPECIFICATIONS
DC CHARACTERISTICS
St andard Operating Conditions: 2.3V to 3.6V (unless otherwise
stated)
Operating temperature -40°C TA +85°C for Industrial
-40°C TA +105°C for V-temp
Param.
No. Symbol Characteristics Min. Typical(1) Max. Units Conditions
VIL Input Low Voltage
DI10 I/O Pins with PMP VSS —0.15VDD V
I/O Pins VSS —0.2VDD V
DI18 SDAx, SCLx VSS —0.3VDD V SMBus disabled
(Note 4)
DI19 SDAx, SCLx VSS 0.8 V SMBus enabled
(Note 4)
VIH Input High Voltage
DI20 I/O Pins not 5V-tolerant(5) 0.65 VDD —VDD V(Note 4)
I/O Pins 5V-tolerant with
PMP(5) 0.25 VDD + 0.8V 5.5 V (Note 4)
I/O Pins 5V-tolerant(5) 0.65 VDD —5.5V
DI28 SDAx, SCLx 0.65 VDD 5.5 V SMBus disabled
(Note 4)
DI29 SDAx, SCLx 2.1 5.5 V SMBus enabled,
2.3V VPIN 5.5
(Note 4)
DI30 ICNPU Change Notification
Pull-up Current 50 250 400 AVDD = 3.3V, VPIN = VSS
DI31 ICNPD Change Notification
Pull-down Current(4) —50µAVDD = 3.3V, VPIN = VDD
IIL Input Leakage Current
(Note 3)
DI50 I/O Ports +1AVSS VPIN VDD,
Pin at high-impedance
DI51 Analog Input Pins +1AVSS VPIN VDD,
Pin at high-impedance
DI55 MCLR(2) ——+1AVSS VPIN VDD
DI56 OSC1 +1AVSS VPIN VDD,
XT and HS modes
Note 1: Data in “Typical” column is at 3.3V, 25°C unless otherwise stated. Parameters are for design guidance only
and are not tested.
2: The leakage current on the MCLR pin is strongly dependent on the applied voltage level. The specified
levels represent normal operating conditions. Higher leakage current may be measured at different input
voltages.
3: Negative current is defined as current sourced by the pin.
4: This parameter is characterized, but not tested in manufacturing.
5: See the “Pin Diagrams” section for the 5V-tolerant pins.
PIC32MX1XX/2XX
DS61168E-page 250 Preliminary 2011-2012 Microchip Technology Inc.
TABLE 29-9: DC CHARACTERISTICS: I/O PIN OUTPU T SPECIFICATIONS
DC CHARACTERISTICS
Standard Operating Conditions: 2.3V to 3.6V
(unless otherwise stated)
Operating temperature -40°C TA +85°C for Industrial
-40°C TA +105°C for V-temp
Param. Symbol Characteristic Min. Typ. Max. Units Conditions
DO10 VOL
Output Low Voltage
I/O Pins
——0.4VIOL 10 mA, VDD = 3.3V
DO20 VOH
Output High Voltage
I/O Pins
1.5(1) ——
V
IOH -14 mA, VDD = 3.3V
2.0(1) —— IOH -12 mA, VDD = 3.3V
2.4 IOH -10 mA, VDD = 3.3V
3.0(1) —— IOH -7 mA, VDD = 3.3V
Note 1: Parameters are characterized, but not tested.
TABLE 29-10: ELECTRICAL CHARACTERISTICS: BOR
DC CHARACTERISTICS
Standard Operating Cond itions: 2.3V to 3.6V
(unless otherwise stated)
Operating temperature -40°C T
A +85°C for Industrial
-40°C T
A +105°C for V-temp
Param.
No. Symbol Characteristics Min.(1) Typical Max. Units Conditions
BO10 VBOR BOR Event on VDD transition
high-to-low(2) 2.0 2.3 V
Note 1: Parameters are for design guidance only and are not tested in manufacturing.
2: Overall functional device operation at VBORMIN < VDD < VDDMIN is tested, but not characterized. All device
Analog modules, such as ADC, etc., will function, but with degraded performance below VDDMIN.
2011-2012 Microchip Technology Inc. Preliminary DS61168E-page 251
PIC32MX1XX/2XX
TABLE 29-11: DC CHARACTERISTICS: PROGRAM MEMORY
DC CHARACTERISTICS
Standard Operating Conditions: 2.3V to 3.6V
(unless otherwise stated)
Operating temperature -40°C T
A +85°C for Industrial
-40°C TA +105°C for V-temp
Param.
No. Symbol Characteristics Min. Typical(1) Max. Units Conditions
Program Flash Memory(3)
D130 EPCell Endurance 20,000 E/W
D131 VPR VDD for Read 2.3 3.6 V
D132 VPEW VDD for Erase or Write 2.3 3.6 V
D134 TRETD Characteristic Retention 20 Year Provided no other specifications
are violated
D135 IDDP Supply Current during
Programming
—10 mA
TWW Word Write Cycle Time 411
FRC Cycles
See Note 4
D136 TRW Row Write Cycle Time 6675 See Note 2,4
D137 TPE Page Erase Cycle Time 20011 See Note 4
TCE Chip Erase Cycle Time 80180 See Note 4
Note 1: Data in “Typical” column is at 3.3V, 25°C unless otherwise stated.
2: The minimum SYSCLK for row programming is 4 MHz. Care should be taken to minimize bus activities
during row programming, such as suspending any memory-to-memory DMA operations. If heavy bus
loads are expected, selecting Bus Matrix Arbitration mode 2 (rotating priority) may be necessary. The
default Arbitration mode is mode 1 (CPU has lowest priority).
3: Refer to the “PIC32 Flash Programming Specification” (DS61145) for operating conditions during
programming and erase cycles.
4: This parameter depends on FRC accuracy (See Table 29-17) and FRC tuning values (See Register 8-2).
PIC32MX1XX/2XX
DS61168E-page 252 Preliminary 2011-2012 Microchip Technology Inc.
TABLE 29-12: COMPARATOR SPECIFICATIONS
DC CHARACTERISTICS
Standard Operating Conditions (see Note 4): 2.3V to 3.6V
(unless otherwise stated)
Operating temperature -40°C TA +85°C for Industrial
-40°C TA +105°C for V-temp
Param.
No. Symbol Characteristics Min. Typical Max. Units Comments
D300 VIOFF Input Offset Voltage ±7.5 ±25 mV AVDD = VDD,
AVSS = VSS
D301 VICM Input Common Mode Voltage 0 VDD VAVDD = VDD,
AVSS = VSS
(Note 2)
D302 CMRR Common Mode Rejection Ratio 55 dB Max VICM = (VDD - 1)V
(Note 2)
D303 TRESP Response Time 150 400 ns AVDD = VDD,
AVSS = VSS
(Notes 1,2)
D304 ON2OV Comparator Enabled to Output
Valid
——10s Comparator module is
configured before setting
the comparator ON bit
(Note 2)
D305 IVREF Internal Voltage Reference 1.14 1.2 1.26 V
D312 TSET Internal Voltage Reference
Setting time (Note 3) ——10µs
Note 1: Response time measured with one comparator input at (VDD – 1.5)/2, while the other input transitions
from VSS to VDD.
2: These parameters are characterized but not tested.
3: Settling time measured while CVRR = 1 and CVR<3:0> transitions from ‘0000’ to ‘1111’. This parameter is
characterized, but not tested in manufacturing.
4: The Comparator module is functional at VBORMIN < VDD < VDDMIN, but with degraded performance. Unless
otherwise stated, module functionality is tested, but not characterized.
TABLE 29-13: INTERNAL VOLTAGE REGULATOR SPECIFICATIONS
DC CHARACTERISTICS
Standa rd Operating Conditions: 2.3V to 3.6V
(unless otherwise stated)
Operating temperature -40°C TA +85°C for Industrial
-40°C TA +105°C for V-temp
Param.
No. Symbol Characteristics Min. Typical Max. Units Comments
D321 CEFC External Filter Capacitor Value 8 10 F Capacitor must be low series
resistance (1 ohm). Typical
voltage on the VCAP pin is
1.8V.
2011-2012 Microchip Technology Inc. Preliminary DS61168E-page 253
PIC32MX1XX/2XX
29.2 AC Characteristics and Timing
Parameters
The information contained in this section defines
PIC32MX1XX/2XX AC characteristics and timing
parameters.
FIGURE 29-1: LOAD CONDITIONS FOR DEVICE TIMING SPECIFICATIONS
FIGURE 29-2: EXTERNAL CLOCK TIMING
VDD/2
CL
RL
Pin
Pin
VSS
VSS
CL
RL=464
CL= 50 pF for all pins
50 pF for OSC2 pin (EC mode)
Load Condition 1 – for all pins except OSC2 Load Condition 2 – for OSC2
TABLE 29-14: CAPACITIVE LOADING REQUIREMENTS ON OUTPUT PINS
AC CHARACTERISTICS
Standard Operating Conditions: 2.3V to 3.6V
(unless otherwise stated)
Operating temperature -40°C TA +85°C for Industrial
-40°C TA +105°C for V-temp
Param.
No. Symbol Characteristics Min. Typical(1) Max. Units Conditions
DO56 CIO All I/O pins and OSC2 50 pF EC mode
DO58 CBSCLx, SDAx 400 pF In I2C™ mode
Note 1: Data in “Typical” column is at 3.3V, 25°C unless otherwise stated. Parameters are for design guidance only
and are not tested.
OSC1
OS20 OS30
OS30
OS31
OS31
PIC32MX1XX/2XX
DS61168E-page 254 Preliminary 2011-2012 Microchip Technology Inc.
TABLE 29-15: EXTERNAL CLOCK TIMING REQUIREMENTS
AC CHARACTERISTICS
Standard Operating Conditions: 2.3V to 3.6V
(unless other wise stated)
Operating temperature -40°C TA +85°C for Industrial
-40°C TA +105°C for V-temp
Param.
No. Symbol Characteristics Min. Typical(1) Max. Units Conditions
OS10 FOSC External CLKI Frequency
(External clocks allowed only
in EC and ECPLL modes)
DC
4
40
40
MHz
MHz
EC (Note 4)
ECPLL (Note 3)
OS11 Oscillator Crystal Frequency 3 10 MHz XT (Note 4)
OS12 4 10 MHz XTPLL
(Notes 3,4)
OS13 10 25 MHz HS (Note 5)
OS14 10 25 MHz HSPLL
(Notes 3,4)
OS15 32 32.768 100 kHz SOSC (Note 4)
OS20 TOSC TOSC = 1/FOSC = TCY (Note 2) See parameter
OS10 for FOSC
value
OS30 TOSL,
TOSH
External Clock In (OSC1)
High or Low Time
0.45 x TOSC ——nsEC (Note 4)
OS31 TOSR,
T
OSF
External Clock In (OSC1)
Rise or Fall Time
0.05 x TOSC ns EC (Note 4)
OS40 TOST Oscillator Start-up Timer Period
(Only applies to HS, HSPLL,
XT, XTPLL and SOSC Clock
Oscillator modes)
—1024T
OSC (Note 4)
OS41 TFSCM Primary Clock Fail Safe
Time-out Period
—2ms(Note 4)
OS42 GMExternal Oscillator
Transconductance
—12—mA/VVDD = 3.3V,
TA = +25°C
(Note 4)
Note 1: Data in “Typical” column is at 3.3V, 25°C unless otherwise stated. Parameters are characterized but are not
tested.
2: Instruction cycle period (TCY) equals the input oscillator time base period. All specified values are based on
characterization data for that particular oscillator type under standard operating conditions with the device
executing code. Exceeding these specified limits may result in an unstable oscillator operation and/or
higher than expected current consumption. All devices are tested to operate at “min.” values with an
external clock applied to the OSC1/CLKI pin.
3: PLL input requirements: 4 MHZ FPLLIN 5 MHZ (use PLL prescaler to reduce FOSC). This parameter is
characterized, but tested at 10 MHz only at manufacturing.
4: This parameter is characterized, but not tested in manufacturing.
2011-2012 Microchip Technology Inc. Preliminary DS61168E-page 255
PIC32MX1XX/2XX
TABLE 29-16: PLL CLOCK TIMING SPECIFICATIONS
AC CHARACTERISTICS
Standa rd Operating Conditions: 2.3V to 3.6V
(unless otherwise stated)
Operating temperature -40°C TA +85°C for Industrial
-40°C TA +105°C for V-temp
Param.
No. Symbol Characteristics(1) Min. Typical Max. Units Conditions
OS50 FPLLI PLL Voltage Controlled
Oscillator (VCO) Input
Frequency Range
3.92 5 MHz ECPLL, HSPLL, XTPLL,
FRCPLL modes
OS51 FSYS On-Chip VCO System
Frequency
60 120 MHz
OS52 TLOCK PLL Start-up Time (Lock Time) 2 ms
OS53 DCLK CLKO Stability(2)
(Period Jitter or Cumulative)
-0.25 +0.25 % Measured over 100 ms
period
Note 1: These parameters are characterized, but not tested in manufacturing.
2: This jitter specification is based on clock-cycle by clock-cycle measurements. To get the effective jitter for
individual time-bases on communication clocks, use the following formula:
For example, if SYSCLK = 40 MHz and SPI bit rate = 20 MHz, the effective jitter is as follows:
TABLE 29-17: INTERNAL FRC ACCURACY
AC CHARACTERISTICS
Standa rd Operating Conditions: 2.3V to 3.6V
(unless otherwise stated)
Operating temperature -40°C TA +85°C for Industrial
-40°C TA +105°C for V-temp
Param.
No. Characteristics Min. Typical Max. Units Conditions
Internal FRC Accuracy @ 8.00 MHz(1)
F20b FRC -0.9 +0.9 %
Note 1: Frequency calibrated at 25°C and 3.3V. The TUN bits can be used to compensate for temperature drift.
TABLE 29-18: INTERNAL LPRC ACCURACY
AC CHARACTERISTICS
Standa rd Operating Conditions: 2.3V to 3.6V
(unless otherwise stated)
Operating temperature -40°C TA +85°C for Industrial
-40°C TA +105°C for V-temp
Param.
No. Characteristics Min. Typical Max. Units Conditions
LPRC @ 31.25 kHz(1)
F21 LPRC -15 +15 %
Note 1: Change of LPRC frequency as VDD changes.
PIC32MX1XX/2XX
DS61168E-page 256 Preliminary 2011-2012 Microchip Technology Inc.
FIGURE 29-3: I/O TIMING CHARACTERISTICS
Note: Refer to Figure 29-1 for load conditions.
I/O Pin
(Input)
I/O Pin
(Output)
DI35
DI40
DO31
DO32
TABLE 29-19: I/O TIMING REQUIREMENTS
AC CHARACTERISTICS
Standa rd Operating Conditions: 2.3V to 3.6V
(unless otherwise stated)
Operating temperature -40°C TA +85°C for Industrial
-40°C TA +105°C for V-temp
Param.
No. Symbol Characteristics(2) Min. Typical(1) Max. Units Conditions
DO31 TIOR Port Output Rise Time 5 15 ns VDD < 2.5V
—510nsV
DD > 2.5V
DO32 TIOF Port Output Fall Time 5 15 ns VDD < 2.5V
—510nsVDD > 2.5V
DI35 TINP INTx Pin High or Low Time 10 ns
DI40 TRBP CNx High or Low Time (input) 2 TSYSCLK
Note 1: Data in “Typical” column is at 3.3V, 25°C unless otherwise stated.
2: This parameter is characterized, but not tested in manufacturing.
2011-2012 Microchip Technology Inc. Preliminary DS61168E-page 257
PIC32MX1XX/2XX
FIGURE 29-4: POWER-ON RESET TIMING CHARACTERISTICS
VDD
VPOR
Note 1: The power-up period will be extended if the power-up sequence completes before the device exits from BOR
(VDD < VDDMIN).
2: Includes interval voltage regulator stabilization delay.
SY00
Power-up Sequence
(Note 2)
Internal Voltage Regulator Enabled
(TPU)
SY10 CPU Starts Fetching Code
Clock Sources = (HS, HSPLL, XT, XTPLL and SOSC)
VDD
VPOR
SY00
Power-up Sequence
(Note 2)
Internal Voltage Regulator Enabled
(TPU)
(TSYSDLY)
CPU Starts Fetching Code
(Note 1)
(Note 1)
Clock Sources = (FRC, FRCDIV, FRCDIV16, FRCPLL, EC, ECPLL and LPRC)
(TOST)
SY02
(TSYSDLY)
SY02
PIC32MX1XX/2XX
DS61168E-page 258 Preliminary 2011-2012 Microchip Technology Inc.
FIGURE 29-5: EXTERNAL RESET TIMING CHARACTERISTICS
TABLE 29-20: RESETS TIMING
AC CHARACTERISTICS
Standard Operating Conditions: 2.3V to 3.6V
(unless otherwise stated)
Operating temperature -40°C TA +85°C for Industrial
-40°C TA +105°C for V-temp
Param.
No. Symbol Characteristics(1) Min. Typical(2) Max. Units Conditions
SY00 TPU Power-up Period
Internal Voltage Regulator Enabled
—400600s
SY02 TSYSDLY System Delay Period:
Time Required to Reload Device
Configuration Fuses plus SYSCLK
Delay before First instruction is
Fetched.
s +
8 SYSCLK
cycles
——
SY20 TMCLR MCLR Pulse Width (low) 2 s
SY30 TBOR BOR Pulse Width (low) 1 s—
Note 1: These parameters are characterized, but not tested in manufacturing.
2: Data in “Typ” column is at 3.3V, 25°C unless otherwise stated. Characterized by design but not tested.
MCLR
(SY20)
Reset Sequence
(SY10)
CPU Starts Fetching Code
BOR
(SY30)
TOST
TMCLR
TBOR
Reset Sequence
CPU Starts Fetching Code
Clock Sources = (FRC, FRCDIV, FRCDIV16, FRCPLL, EC, ECPLL and LPRC)
Clock Sources = (HS, HSPLL, XT, XTPLL and S OSC)(TSYSDLY)
SY02
(TSYSDLY)
SY02
2011-2012 Microchip Technology Inc. Preliminary DS61168E-page 259
PIC32MX1XX/2XX
FIGURE 29-6: TIMER1, 2, 3, 4, 5 EXTERNAL CLOCK TIMING CHARACTERISTICS
Note: Refer to Figure 29-1 for load conditions.
Tx11
Tx15
Tx10
Tx20
TMRx
OS60
TxCK
TABLE 29-21: TIMER1 EXTERNAL CLOCK TIMING REQUIREMENTS
AC CHARACTERISTICS(1)
Standard Operating Conditions: 2.3V to 3.6V
(unless otherwise stated)
Operating temperature -40°C TA +85°C for Industrial
-40°C TA +105°C for V-temp
Param.
No. Symbol Characteristics(2) Min. Typical Max. Units Conditions
TA10 TTXHTxCK
High Time
Synchronous,
with prescaler
[(12.5 ns or 1 TPB)/N]
+ 25 ns
ns Must also meet
parameter TA15
Asynchronous,
with prescaler
10 ns
TA11 TTXLTxCK
Low Time
Synchronous,
with prescaler
[(12.5 ns or 1 TPB)/N]
+ 25 ns
ns Must also meet
parameter TA15
Asynchronous,
with prescaler
10 ns
TA15 TTXPTxCK
Input Period
Synchronous,
with prescaler
[(Greater of 25 ns or
2 TPB)/N] + 30 ns
——nsVDD > 2.7V
[(Greater of 25 ns or
2 TPB)/N] + 50 ns
——nsV
DD < 2.7V
Asynchronous,
with prescaler
20 ns VDD > 2.7V
(Note 3)
50 ns VDD < 2.7V
(Note 3)
OS60 FT1 SOSC1/T1CK Oscillator
Input Frequency Range
(oscillator enabled by setting
TCS bit (T1CON<1>))
32 100 kHz
TA20 TCKEXTMRL Delay from External TxCK
Clock Edge to Timer
Increment
—1TPB
Note 1: Timer1 is a Type A timer.
2: This parameter is characterized, but not tested in manufacturing.
3: N = Prescale Value (1, 8, 64, 256).
PIC32MX1XX/2XX
DS61168E-page 260 Preliminary 2011-2012 Microchip Technology Inc.
FIGURE 29-7: INPUT CAPTURE (CAPx) TIMING CHARACTERISTICS
TABLE 29-22: TIMER2, 3, 4, 5 EXTERNAL CLOCK TIMING REQUIREMENTS
AC CHARACTERISTICS
St andard Operating Conditions: 2.3V to 3.6V
(unless otherwise stated)
Operating temperature -40°C TA +85°C for Industrial
-40°C TA +105°C for V-temp
Param.
No. Symbol Characteristics(1) Min. Max. Units Conditions
TB10 TTXHTxCK
High Time
Synchronous, with
prescaler
[(12.5 ns or 1 TPB)/N]
+ 25 ns
ns Must also meet
parameter
TB15
N = prescale
value
(1, 2, 4, 8,
16, 32, 64,
256)
TB11 TTXLTxCK
Low Time
Synchronous, with
prescaler
[(12.5 ns or 1 TPB)/N]
+ 25 ns
ns Must also meet
parameter
TB15
TB15 TTXPTxCK
Input
Period
Synchronous, with
prescaler
[(Greater of [(25 ns or
2 TPB)/N] + 30 ns
—nsVDD > 2.7V
[(Greater of [(25 ns or
2 TPB)/N] + 50 ns
—nsVDD < 2.7V
TB20 TCKEXTMRL Delay from External TxCK
Clock Edge to Timer Increment
—1TPB
Note 1: These parameters are characterized, but not tested in manufacturing.
ICx
IC10 IC11
IC15
Note: Refer to Figure 29-1 for load conditions.
TABLE 29-23: INPUT CAPTURE MODULE TIMING REQUIREMENTS
AC CHARACTERISTICS
Standard Operating Cond itions: 2.3V to 3.6V
(unless otherwise stated)
Operating temperature -40°C TA +85°C for Industrial
-40°C TA +105°C for V-temp
Param.
No. Symbol Characteristics(1) Min. Max. Units Conditions
IC10 TCCL ICx Input Low Time [(12.5 ns or 1 TPB)/N]
+ 25 ns
ns Must also
meet
parameter
IC15.
N = prescale
value (1, 4, 16)
IC11 TCCH ICx Input High Time [(12.5 ns or 1 TPB)/N]
+ 25 ns
ns Must also
meet
parameter
IC15.
IC15 TCCP ICx Input Period [(25 ns or 2 TPB)/N]
+ 50 ns
—ns
Note 1: These parameters are characterized, but not tested in manufacturing.
2011-2012 Microchip Technology Inc. Preliminary DS61168E-page 261
PIC32MX1XX/2XX
FIGURE 29-8: OUTPUT COMPARE MODULE (OCx) TIMING CHARACTERISTICS
TABLE 29-24: OUTPUT COMPARE MODULE TIMING REQUIREMENTS
FIGURE 29-9: OCx/PWM MODULE TIMING CHARACTERISTICS
AC CHARACTERISTICS
Standard Operating Conditi ons : 2.3V to 3.6V
(unless other wise stated)
Operating temperature -40°C TA +85°C for Industrial
-40°C TA +105°C for V-temp
Param.
No. Symbol Characteristics(1) Min. Typical(2) Max. Units Conditions
OC10 TCCF OCx Output Fall Time ns See parameter DO32
OC11 TCCR OCx Output Rise Time ns See parameter DO31
Note 1: These parameters are characterized, but not tested in manufacturing.
2: Data in “Typical” column is at 3.3V, 25°C unless otherwise stated. Parameters are for design guidance only
and are not tested.
OCx
OC11 OC10
(Output Compare
Note: Refer to Figure 29-1 for load conditions.
or PWM mode)
OCFA/OCFB
OCx
OC20
OC15
Note: Refer to Figure 29-1 for load conditions.
OCx is tri-stated
TABLE 29-25: SIMPLE OCx/PWM MODE TIMING REQUIREMENTS
AC CHARACTERISTICS
Standard Operating Conditions: 2.3V to 3.6V
(unless otherwise stated)
Operating temperature -40°C TA +85°C for Industrial
-40°C TA +105°C for V-temp
Param
No. Symbol Characteristics(1) Min Typical(2) Max Units Conditions
OC15 TFD Fault Input to PWM I/O Change 50 ns
OC20 TFLT Fault Input Pulse Width 50 ns
Note 1: These parameters are characterized, but not tested in manufacturing.
2: Data in “Typical” column is at 3.3V, 25°C unless otherwise stated. Parameters are for design guidance only
and are not tested.
PIC32MX1XX/2XX
DS61168E-page 262 Preliminary 2011-2012 Microchip Technology Inc.
FIGURE 29-10: SPIx MODULE MASTER MODE (CKE = 0) TIMING CHARACTERISTICS
TABLE 29-26: SPIx MASTER MODE (CKE = 0) TIMING REQUIREMENTS
AC CHARACTERISTICS
Standar d Op erating Conditions: 2.3V to 3.6V
(unless otherwise stated)
Operating temperature -40°C TA +85°C for Industrial
-40°C TA +105°C for V-temp
Param.
No. Symbol Characteristics(1) Min. Typical(2) Max. Units Conditions
SP10 TSCLSCKx Output Low Time
(Note 3) TSCK/2 ns
SP11 TSCH SCKx Output High Time
(Note 3) TSCK/2 ——ns
SP20 TSCF SCKx Output Fall Time
(Note 4) ——ns
See parameter DO32
SP21 TSCR SCKx Output Rise Time
(Note 4) ——
ns See parameter DO31
SP30 TDOF SDOx Data Output Fall Time
(Note 4) ——
ns See parameter DO32
SP31 TDOR SDOx Data Output Rise Time
(Note 4) ——
ns See parameter DO31
SP35 TSCH2DOV,
TSCL2DOV
SDOx Data Output Valid after
SCKx Edge
——
15 ns VDD > 2.7V
——
20 ns VDD < 2.7V
SP40 TDIV2SCH,
TDIV2SCL
Setup Time of SDIx Data Input
to SCKx Edge
10 ——ns
SP41 TSCH2DIL,
TSCL2DIL
Hold Time of SDIx Data Input
to SCKx Edge
10 ——ns
Note 1: These parameters are characterized, but not tested in manufacturing.
2: Data in “Typical” column is at 3.3V, 25°C unless otherwise stated. Parameters are for design guidance
only and are not tested.
3: The minimum clock period for SCKx is 50 ns. Therefore, the clock generated in Master mode must not
violate this specification.
4: Assumes 50 pF load on all SPIx pins.
SCKx
(CKP = 0)
SCKx
(CKP = 1)
SDOx
SDIx
SP11 SP10
SP40 SP41
SP21
SP20
SP35
SP20
SP21
MSb LSb
Bit 14 - - - - - -1
MSb In LSb In
Bit 14 - - - -1
SP30
SP31
Note: Refer to Figure 29-1 for load conditions.
2011-2012 Microchip Technology Inc. Preliminary DS61168E-page 263
PIC32MX1XX/2XX
FIGURE 29-11: SPIx MODULE MASTER MODE (CKE = 1) TIMING CHARACTERISTICS
TABLE 29-27: SPIx MODULE MASTER MODE (CKE = 1) TIMING REQUIREMENTS
AC CHARACTERISTICS
Standa rd Operating Conditions: 2.3V to 3.6V
(unless otherwise stated)
Operating temperature -40°C TA +85°C for Industrial
-40°C TA +105°C for V-temp
Param.
No. Symbol Characteristics(1) Min. Typ.(2) Max. Units Conditions
SP10 TSCL SCKx Output Low Time (Note 3) TSCK/2 ns
SP11 TSCH SCKx Output High Time (Note 3) TSCK/2 ns
SP20 TSCF SCKx Output Fall Time (Note 4) ns See parameter DO32
SP21 TSCR SCKx Output Rise Time (Note 4) ns See parameter DO31
SP30 TDOF SDOx Data Output Fall Time
(Note 4) ns See parameter DO32
SP31 TDOR SDOx Data Output Rise Time
(Note 4) ns See parameter DO31
SP35 TSCH2DOV,
TSCL2DOV
SDOx Data Output Valid after
SCKx Edge
——15nsV
DD > 2.7V
——20nsV
DD < 2.7V
SP36 TDOV2SC,
TDOV2SCL
SDOx Data Output Setup to
First SCKx Edge
15 ns
SP40 TDIV2SCH,
TDIV2SCL
Setup Time of SDIx Data Input to
SCKx Edge
15 ns VDD > 2.7V
20 ns VDD < 2.7V
SP41 TSCH2DIL,
TSCL2DIL
Hold Time of SDIx Data Input
to SCKx Edge
15 ns VDD > 2.7V
20 ns VDD < 2.7V
Note 1: These parameters are characterized, but not tested in manufacturing.
2: Data in “Typical” column is at 3.3V, 25°C unless otherwise stated. Parameters are for design guidance only
and are not tested.
3: The minimum clock period for SCKx is 50 ns. Therefore, the clock generated in Master mode must not
violate this specification.
4: Assumes 50 pF load on all SPIx pins.
SCKX
(CKP = 0)
SCKX
(CKP = 1)
SDOX
SDIX
SP36
SP30,SP31
SP35
MSb Bit 14 - - - - - -1
LSb In
Bit 14 - - - -1
LSb
Note: Refer to Figure 29-1 for load conditions.
SP11 SP10
SP21
SP20
SP40 SP41
SP20
SP21
MSb In
PIC32MX1XX/2XX
DS61168E-page 264 Preliminary 2011-2012 Microchip Technology Inc.
FIGURE 29-12: SPIx MODULE SLAVE MODE (CKE = 0) TIMING CHARACTERISTICS
SSX
SCKX
(CKP = 0)
SCKX
(CKP = 1)
SDOX
SP50
SP40 SP41
SP30,SP31 SP51
SP35
MSb LSb
Bit 14 - - - - - -1
Bit 14 - - - -1 LSb In
SP52
SP73
SP72
SP72
SP73
SP71 SP70
Note: Refer to Figure 29-1 for load conditions.
SDIXMSb In
TABLE 29-28: SPIx MODULE SLAVE MODE (CKE = 0) TIMING REQUIREMENTS
AC CHARACTERISTICS
Standard Operating Conditio ns : 2.3V to 3.6V
(unless otherwise stated)
Operating temperature -40°C T
A +85°C for Industrial
-40°C TA +105°C for V-temp
Param.
No. Symbol Characteristics(1) Min. Typ.(2) Max. Units Conditions
SP70 TSCL SCKx Input Low Time (Note 3) TSCK/2 ns
SP71 TSCH SCKx Input High Time (Note 3) TSCK/2 ns
SP72 TSCF SCKx Input Fall Time ns See parameter DO32
SP73 TSCR SCKx Input Rise Time ns See parameter DO31
SP30 TDOF SDOx Data Output Fall Time (Note 4) ns See parameter DO32
SP31 TDOR SDOx Data Output Rise Time (Note 4) ns See parameter DO31
SP35 T
SCH2DOV,
T
SCL2DOV
SDOx Data Output Valid after
SCKx Edge
——15nsV
DD > 2.7V
——20nsV
DD < 2.7V
SP40 TDIV2SCH,
TDIV2SCL
Setup Time of SDIx Data Input
to SCKx Edge
10 ns
SP41 T
SCH2DIL,
T
SCL2DIL
Hold Time of SDIx Data Input
to SCKx Edge
10 ns
SP50 T
SSL2SCH,
T
SSL2SCL
SSx to SCKx or SCKx Input 175 ns
SP51 TSSH2DOZ SSx to SDOx Output
High-Impedance (Note 3) 5—25ns
SP52 T
SCH2SSH
T
SCL2SSH
SSx after SCKx Edge TSCK + 20 ns
Note 1: These parameters are characterized, but not tested in manufacturing.
2: Data in “Typical” column is at 3.3V, 25°C unless otherwise stated. Parameters are for design guidance only
and are not tested.
3: The minimum clock period for SCKx is 50 ns.
4: Assumes 50 pF load on all SPIx pins.
2011-2012 Microchip Technology Inc. Preliminary DS61168E-page 265
PIC32MX1XX/2XX
FIGURE 29-13: SPIx MODULE SLAVE MODE (CKE = 1) TIMING CHARACTERISTICS
SSx
SCKx
(CKP = 0)
SCKx
(CKP = 1)
SDOx
SDI
SP60
SDIx
SP30,SP31
MSb Bit 14 - - - - - -1 LSb
SP51
MSb In Bit 14 - - - -1 LSb In
SP52
SP73
SP72
SP72
SP73
SP71
SP40 SP41
Note: Refer to Figure 29-1 for load conditions.
SP50
SP70
SP35
TABLE 29-29: SPIx MODULE SLAVE MODE (CKE = 1) TIMING REQUIREMENTS
AC CHARACTERISTICS
Standard Operating Conditions: 2.3V to 3.6V
(unless otherwise stated)
Operating temperature -40°C T
A +85°C for Industrial
-40°C TA +105°C for V-temp
Param.
No. Symbol Characteristics(1) Min. Typical(2) Max. Units Conditions
SP70 TSCL SCKx Input Low Time (Note 3) TSCK/2 ns
SP71 TSCH SCKx Input High Time (Note 3) TSCK/2 ns
SP72 TSCF SCKx Input Fall Time 5 10 ns
SP73 TSCR SCKx Input Rise Time 5 10 ns
SP30 TDOF SDOx Data Output Fall Time
(Note 4) ns See parameter DO32
SP31 TDOR SDOx Data Output Rise Time
(Note 4) ns See parameter DO31
SP35 TSCH2DOV,
TSCL2DOV
SDOx Data Output Valid after
SCKx Edge
20 ns VDD > 2.7V
30 ns VDD < 2.7V
SP40 TDIV2SCH,
TDIV2SCL
Setup Time of SDIx Data Input
to SCKx Edge
10 ns
SP41 TSCH2DIL,
TSCL2DIL
Hold Time of SDIx Data Input
to SCKx Edge
10 ns
SP50 TSSL2SCH,
TSSL2SCL
SSx to SCKx or SCKx Input 175 ns
Note 1: These parameters are characterized, but not tested in manufacturing.
2: Data in “Typical” column is at 3.3V, 25°C unless otherwise stated. Parameters are for design guidance only
and are not tested.
3: The minimum clock period for SCKx is 50 ns.
4: Assumes 50 pF load on all SPIx pins.
PIC32MX1XX/2XX
DS61168E-page 266 Preliminary 2011-2012 Microchip Technology Inc.
SP51 TSSH2DOZ SSx to SDOX Output
High-Impedance
(Note 4)
5 25 ns
SP52 TSCH2SSH
TSCL2SSH
SSx after SCKx Edge TSCK +
20
——ns
SP60 TSSL2DOV SDOx Data Output Valid after
SSx Edge
25 ns
TABLE 29-29: SPIx MODULE SLAVE MODE (CKE = 1) TIMING REQUIREMENTS (CONTINUED)
AC CHARACTERISTICS
Standard Operating Co nd itions: 2.3V to 3.6V
(unless otherwise stated)
Operating temperature -40°C T
A +85°C for Industrial
-40°C T
A +105°C for V-temp
Param.
No. Symbol Characteristics(1) Min. Typical(2) Max. Units Conditions
Note 1: These parameters are characterized, but not tested in manufacturing.
2: Data in “Typical” column is at 3.3V, 25°C unless otherwise stated. Parameters are for design guidance only
and are not tested.
3: The minimum clock period for SCKx is 50 ns.
4: Assumes 50 pF load on all SPIx pins.
2011-2012 Microchip Technology Inc. Preliminary DS61168E-page 267
PIC32MX1XX/2XX
FIGURE 29-14: I2Cx BUS START/STOP BITS TIMING CHARACTERISTICS (MASTER MODE)
FIGURE 29-15: I2Cx BUS DATA TIMING CHARACTERISTICS (MASTER MODE)
SCLx
SDAx
Start
Condition
Stop
Condition
Note: Refer to Figure 29-1 for load conditions.
IM30
IM31 IM34
IM33
IM11 IM10 IM33
IM11
IM10
IM20
IM26 IM25
IM40 IM40 IM45
IM21
SCLx
SDAx
In
SDAx
Out
Note: Refer to Figure 29-1 for load conditions.
PIC32MX1XX/2XX
DS61168E-page 268 Preliminary 2011-2012 Microchip Technology Inc.
TABLE 29-30: I2Cx BUS DATA TIMING REQUIREMENTS (MASTER MODE)
AC CHARACTERISTICS
Standa rd Operating Conditions: 2.3V to 3.6V
(unless otherwise stated)
Operating temperature -40°C TA +85°C for Industrial
-40°C TA +105°C for V-temp
Param.
No. Symbol Characteristics Min.(1) Max. Units Conditions
IM10 TLO:SCL Clock Low Time 100 kHz mode TPB * (BRG + 2) s—
400 kHz mode TPB * (BRG + 2) s—
1 MHz mode
(Note 2) TPB * (BRG + 2) s—
IM11 THI:SCL Clock High Time 100 kHz mode TPB * (BRG + 2) s—
400 kHz mode TPB * (BRG + 2) s—
1 MHz mode
(Note 2) TPB * (BRG + 2) s—
IM20 TF:SCL SDAx and SCLx
Fall Time
100 kHz mode 300 ns CB is specified to be
from 10 to 400 pF
400 kHz mode 20 + 0.1 CB300 ns
1 MHz mode
(Note 2) 100 ns
IM21 TR:SCL SDAx and SCLx
Rise Time
100 kHz mode 1000 ns CB is specified to be
from 10 to 400 pF
400 kHz mode 20 + 0.1 CB300 ns
1 MHz mode
(Note 2) 300 ns
IM25 TSU:DAT Data Input
Setup Time
100 kHz mode 250 ns
400 kHz mode 100 ns
1 MHz mode
(Note 2) 100 ns
IM26 THD:DAT Data Input
Hold Time
100 kHz mode 0 s—
400 kHz mode 0 0.9 s
1 MHz mode
(Note 2) 0 0.3 s
IM30 TSU:STA Start Condition
Setup Time
100 kHz mode TPB * (BRG + 2) s Only relevant for
Repeated Start
condition
400 kHz mode TPB * (BRG + 2) s
1 MHz mode
(Note 2) TPB * (BRG + 2) s
IM31 THD:STA Start Condition
Hold Time
100 kHz mode TPB * (BRG + 2) s After this period, the
first clock pulse is
generated
400 kHz mode TPB * (BRG + 2) s
1 MHz mode
(Note 2) TPB * (BRG + 2) s
IM33 TSU:STO Stop Condition
Setup Time
100 kHz mode TPB * (BRG + 2) s—
400 kHz mode TPB * (BRG + 2) s
1 MHz mode
(Note 2) TPB * (BRG + 2) s
IM34 THD:STO Stop Condition 100 kHz mode TPB * (BRG + 2) ns
Hold Time 400 kHz mode TPB * (BRG + 2) ns
1 MHz mode
(Note 2) TPB * (BRG + 2) ns
Note 1: BRG is the value of the I2C™ Baud Rate Generator.
2: Maximum pin capacitance = 10 pF for all I2Cx pins (for 1 MHz mode only).
3: The typical value for this parameter is 104 ns.
2011-2012 Microchip Technology Inc. Preliminary DS61168E-page 269
PIC32MX1XX/2XX
IM40 TAA:SCL Output Valid
from Clock
100 kHz mode 3500 ns
400 kHz mode 1000 ns
1 MHz mode
(Note 2) 350 ns
IM45 TBF:SDA Bus Free Time 100 kHz mode 4.7 s The amount of time the
bus must be free
before a new
transmission can start
400 kHz mode 1.3 s
1 MHz mode
(Note 2) 0.5 s
IM50 CBBus Capacitive Loading 400 pF
IM51 TPGD Pulse Gobbler Delay 52 312 ns See Note 3
TABLE 29-30: I2Cx BUS DATA TIMING REQUIREMENTS (MASTER MODE) (CONTINUED)
AC CHARACTERISTICS
Standa rd Operating Conditions: 2.3V to 3.6V
(unless otherwise stated)
Operating temperature -40°C TA +85°C for Industrial
-40°C TA +105°C for V-temp
Param.
No. Symbol Characteristics Min.(1) Max. Units Conditions
Note 1: BRG is the value of the I2C™ Baud Rate Generator.
2: Maximum pin capacitance = 10 pF for all I2Cx pins (for 1 MHz mode only).
3: The typical value for this parameter is 104 ns.
PIC32MX1XX/2XX
DS61168E-page 270 Preliminary 2011-2012 Microchip Technology Inc.
FIGURE 29-16: I2Cx BUS START/STOP BITS TIMING CHARACTERISTICS (SLAVE MODE)
FIGURE 29-17: I2Cx BUS DATA TIMING CHARACTERISTICS (SLAVE MODE)
IS34
SCLx
SDAx
Start
Condition
Stop
Condition
IS33
Note: Refer to Figure 29-1 for load conditions.
IS31
IS30
IS30 IS31 IS33
IS11
IS10
IS20
IS26 IS25
IS40 IS40 IS45
IS21
SCLx
SDAx
In
SDAx
Out
Note: Refer to Figure 29-1 for load conditions.
2011-2012 Microchip Technology Inc. Preliminary DS61168E-page 271
PIC32MX1XX/2XX
TABLE 29-31: I2Cx BUS DATA TIMING REQUIREMENTS (SLAVE MODE)
AC CHARACTERISTICS
Standa rd Operating Conditions: 2.3V to 3.6V
(unless otherwise stated)
Operating temperature -40°C TA +85°C for Industrial
-40°C T
A +105°C for V-temp
Param.
No. Symbol Characteristics Min. Max. Units Conditions
IS10 TLO:SCL Clock Low Time 100 kHz mode 4.7 s PBCLK must operate at a
minimum of 800 kHz
400 kHz mode 1.3 s PBCLK must operate at a
minimum of 3.2 MHz
1 MHz mode
(Note 1) 0.5 s—
IS11 THI:SCL Clock High Time 100 kHz mode 4.0 s PBCLK must operate at a
minimum of 800 kHz
400 kHz mode 0.6 s PBCLK must operate at a
minimum of 3.2 MHz
1 MHz mode
(Note 1) 0.5 s—
IS20 TF:SCL SDAx and SCLx
Fall Time
100 kHz mode 300 ns CB is specified to be from
10 to 400 pF
400 kHz mode 20 + 0.1 CB300 ns
1 MHz mode
(Note 1) —100ns
IS21 TR:SCL SDAx and SCLx
Rise Time
100 kHz mode 1000 ns CB is specified to be from
10 to 400 pF
400 kHz mode 20 + 0.1 CB300 ns
1 MHz mode
(Note 1) —300ns
IS25 TSU:DAT Data Input
Setup Time
100 kHz mode 250 ns
400 kHz mode 100 ns
1 MHz mode
(Note 1) 100 ns
IS26 THD:DAT Data Input
Hold Time
100 kHz mode 0 ns
400 kHz mode 0 0.9 s
1 MHz mode
(Note 1) 00.3s
IS30 TSU:STA Start Condition
Setup Time
100 kHz mode 4700 ns Only relevant for Repeated
Start condition
400 kHz mode 600 ns
1 MHz mode
(Note 1) 250 ns
IS31 THD:STA Start Condition
Hold Time
100 kHz mode 4000 ns After this period, the first
clock pulse is generated
400 kHz mode 600 ns
1 MHz mode
(Note 1) 250 ns
IS33 TSU:STO Stop Condition
Setup Time
100 kHz mode 4000 ns
400 kHz mode 600 ns
1 MHz mode
(Note 1) 600 ns
Note 1: Maximum pin capacitance = 10 pF for all I2Cx pins (for 1 MHz mode only).
PIC32MX1XX/2XX
DS61168E-page 272 Preliminary 2011-2012 Microchip Technology Inc.
IS34 THD:STO Stop Condition
Hold Time
100 kHz mode 4000 ns
400 kHz mode 600 ns
1 MHz mode
(Note 1) 250 ns
IS40 TAA:SCL Output Valid from
Clock
100 kHz mode 0 3500 ns
400 kHz mode 0 1000 ns
1 MHz mode
(Note 1) 0350ns
IS45 TBF:SDA Bus Free Time 100 kHz mode 4.7 s The amount of time the bus
must be free before a new
transmission can start
400 kHz mode 1.3 s
1 MHz mode
(Note 1) 0.5 s
IS50 CBBus Capacitive Loading 400 pF
TABLE 29-31: I2Cx BUS DATA TIMING REQUIREMENTS (SLAVE MODE) (CONTINUED)
AC CHARACTERISTICS
Standard Operating Conditions: 2.3V to 3.6V
(unless otherwise stated)
Operating temperature -40°C TA +85°C for Industrial
-40°C TA +105°C for V-temp
Param.
No. Symbol Characteristics Min. Max. Units Conditions
Note 1: Maximum pin capacitance = 10 pF for all I2Cx pins (for 1 MHz mode only).
2011-2012 Microchip Technology Inc. Preliminary DS61168E-page 273
PIC32MX1XX/2XX
TABLE 29-32: ADC MODULE SPECIFICATIONS
AC CHARACTERISTICS
Standard Operating Conditions (see Note 5): 2.5V to 3.6V
(unless otherwise stated)
Operating temperature -40°C TA +85°C for Industrial
-40°C TA +105°C for V-temp
Param.
No. Symbol Characteristics Min. Typical Max. Units Conditions
Device Supply
AD01 AVDD Module VDD Supply Greater of
VDD – 0.3
or 2.5
Lesser of
VDD + 0.3 or
3.6
V—
AD02 AVSS Module VSS Supply VSS —AVDD V(Note 1)
Reference Inputs
AD05
AD05a
VREFH Reference Voltage High AVSS + 2.0
2.5
AVDD
3.6
V
V
(Note 1)
VREFH = AVDD (Note 3)
AD06 VREFL Reference Voltage Low AVSS —VREFH – 2.0 V (Note 1)
AD07 VREF Absolute Reference
Voltage (VREFH – VREFL)
2.0 AVDD V(Note 3)
AD08
AD08a
IREF Current Drain
250
400
3
µA
µA
ADC operating
ADC off
Analog Input
AD12 VINH-VINL Full-Scale Input Span VREFL —VREFH V—
AD13 VINL Absolute VINL Input
Voltage
AVSS – 0.3 AVDD/2 V
AD14 VIN Absolute Input Voltage AVSS – 0.3 AVDD + 0.3 V
AD15 Leakage Current ±0.001 ±0.610 µA VINL = AVSS = VREFL = 0V,
AVDD = VREFH = 3.3V
Source Impedance = 10 k
AD17 RIN Recommended
Impedance of Analog
Voltage Source
—— 5k(Note 1)
ADC Accuracy – Measurements with External VREF+/VREF-
AD20c Nr Resolution 10 data bits bits
AD21c INL Integral Non-linearity > -1 < 1 LSb VINL = AVSS = VREFL = 0V,
AVDD = VREFH = 3.3V
AD22c DNL Differential Non-linearity > -1 < 1 LSb VINL = AVSS = VREFL = 0V,
AVDD = VREFH = 3.3V
(Note 2)
AD23c GERR Gain Error > -1 < 1 LSb VINL = AVSS = VREFL = 0V,
AVDD = VREFH = 3.3V
AD24c EOFF Offset Error > -1 < 1 Lsb VINL = AVSS = 0V,
AVDD = 3.3V
AD25c Monotonicity Guaranteed
Note 1: These parameters are not characterized or tested in manufacturing.
2: With no missing codes.
3: These parameters are characterized, but not tested in manufacturing.
4: Characterized with a 1 kHz sine wave.
5: The ADC module is functional at VBORMIN < VDD < 2.5V, but with degraded performance. Unless otherwise
stated, module functionality is tested, but not characterized.
PIC32MX1XX/2XX
DS61168E-page 274 Preliminary 2011-2012 Microchip Technology Inc.
ADC Accuracy – Measurements with Internal V REF+/VREF-
AD20d Nr Resolution 10 data bits bits (Note 3)
AD21d INL Integral Non-linearity > -1 < 1 LSb VINL = AVSS = 0V,
AVDD = 2.5V to 3.6V
(Note 3)
AD22d DNL Differential Non-linearity > -1 < 1 LSb VINL = AVSS = 0V,
AVDD = 2.5V to 3.6V
(Notes 2,3)
AD23d GERR Gain Error > -4 < 4 LSb VINL = AVSS = 0V,
AVDD = 2.5V to 3.6V
(Note 3)
AD24d EOFF Offset Error > -2 < 2 Lsb VINL = AVSS = 0V,
AVDD = 2.5V to 3.6V
(Note 3)
AD25d Monotonicity Guaranteed
Dynamic Performance
AD32b SINAD Signal to Noise and
Distortion
55 58.5 dB (Notes 3,4)
AD34b ENOB Effective Number of bits 9.0 9.5 bits (Notes 3,4)
TABLE 29-32: ADC MODULE SPECIFICATIONS
AC CHARACTERISTICS
Standard Op erating Conditions (see Note 5): 2.5V to 3.6V
(unless otherwise stated)
Operating temperature -40°C TA +85°C for Industrial
-40°C TA +105°C for V-temp
Param.
No. Symbol Characteristics Min. Typical Max. Units Conditions
Note 1: These parameters are not characterized or tested in manufacturing.
2: With no missing codes.
3: These parameters are characterized, but not tested in manufacturing.
4: Characterized with a 1 kHz sine wave.
5: The ADC module is functional at VBORMIN < VDD < 2.5V, but with degraded performance. Unless otherwise
stated, module functionality is tested, but not characterized.
2011-2012 Microchip Technology Inc. Preliminary DS61168E-page 275
PIC32MX1XX/2XX
TABLE 29-33: 10-BIT CONVERSION RATE PARAMETERS
AC CHARACTERISTICS(2)
Standard Operating Conditions (see Note 3): 2.5V to 3.6V
(unless otherwise stated)
Operating temperature -40°C TA +85°C for Industrial
-40°C TA +105°C for V-temp
ADC Speed TAD Min. Sampling
Time Min. RS Max. VDD ADC Channels Configuration
1 Msps to 400 ksps(1) 65 ns 132 ns 5003.0V to
3.6V
Up to 400 ksps 200 ns 200 ns 5.0 k2.5V to
3.6V
Note 1: External VREF- and VREF+ pins must be used for correct operation.
2: These parameters are characterized, but not tested in manufacturing.
3: The ADC module is functional at VBORMIN < VDD < 2.5V, but with degraded performance. Unless otherwise
stated, module functionality is tested, but not characterized.
VREF-VREF+
ADC
ANx
SHA
CHX
VREF-VREF+
ADC
ANx
SHA
CHX
ANx or VREF-
or
AVSS
or
AVDD
PIC32MX1XX/2XX
DS61168E-page 276 Preliminary 2011-2012 Microchip Technology Inc.
TABLE 29-34: ANALOG-TO-DIGITAL CONVERSION TIMING REQUIREMENTS
AC CHARACTERISTICS
Standa rd Operating Conditions (see Note 4): 2.5V to 3.6V
(unless otherwise stated)
Operating temperature -40°C TA +85°C for Industrial
-40°C TA +105°C for V-temp
Param.
No. Symbol Characteristics Min. Typical(1) Max. Units Conditions
Clock Parameters
AD50 TAD ADC Clock Period(2) 65 ns See Table 29-33
Conversion Rate
AD55 TCONV Conversion Time 12 TAD ——
AD56 FCNV Throughput Rate
(Sampling Speed)
1000 ksps AVDD = 3.0V to 3.6V
400 ksps AVDD = 2.5V to 3.6V
AD57 TSAMP Sample Time 1 TAD ——TSAMP must be 132 ns
Timing Parameters
AD60 TPCS Conversion Start from Sample
Trigger(3) —1.0 TAD Auto-Convert Trigger
(SSRC<2:0> = 111)
not selected
AD61 TPSS Sample Start from Setting
Sample (SAMP) bit
0.5 TAD 1.5 TAD ——
AD62 TCSS Conversion Completion to
Sample Start (ASAM = 1)(3) —0.5 TAD ——
AD63 TDPU Time to Stabilize Analog Stage
from ADC Off to ADC On(3) —— 2s—
Note 1: These parameters are characterized, but not tested in manufacturing.
2: Because the sample caps will eventually lose charge, clock rates below 10 kHz can affect linearity
performance, especially at elevated temperatures.
3: Characterized by design but not tested.
4: The ADC module is functional at VBORMIN < VDD < 2.5V, but with degraded performance. Unless otherwise
stated, module functionality is tested, but not characterized.
2011-2012 Microchip Technology Inc. Preliminary DS61168E-page 277
PIC32MX1XX/2XX
FIGURE 29-18: ANALOG-TO-DIGITAL CONVERSION (10-BIT MODE) TIMING
CHARACTERISTICS (ASAM = 0, SSRC<2:0> = 000)
AD55
TSAMP
Clear SAMPSet SAMP
AD61
ADCLK
Instruction
SAMP
ch0_dischrg
AD60
CONV
ADxIF
Buffer(0)
Buffer(1)
1 2 3 4 5 6 8 5 6 7
1– Software sets ADxCON. SAMP to start sampling.
2– Sampling starts after discharge period. TSAMP is described in Section 17. “10-bit Analog-to-Digital Converter (ADC)”
3– Software clears ADxCON. SAMP to start conversion.
4– Sampling ends, conversion sequence starts.
5– Convert bit 9.
8– One TAD for end of conversion.
AD50
ch0_samp
eoc
7
AD55
8
6– Convert bit 8.
7– Convert bit 0.
Execution
(DS61104) in the “PIC32 Family Reference Manual” .
PIC32MX1XX/2XX
DS61168E-page 278 Preliminary 2011-2012 Microchip Technology Inc.
FIGURE 29-19: ANALOG-TO-DIGITAL CONVERSION (10-BIT MODE) TIMING CHARACTERI STICS
(ASAM = 1, SSRC<2:0> = 111, SAMC<4:0> = 00001)
AD55
TSAMP
Set ADON
ADCLK
Instruction
SAMP
ch0_dischrg
CONV
ADxIF
Buffer(0)
Buffer(1)
1 2 3 4 5 6 4 5 6 8
1– Software sets ADxCON. ADON to start AD operation.
2– Sampling starts after discharge period.
3– Convert bit 9.
4– Convert bit 8.
5– Convert bit 0.
AD50
ch0_samp
eoc
7 3
AD55
6– One TAD for end of conversion.
7– Begin conversion of next channel.
8– Sample for time specified by SAMC<4:0>.
TSAMP
TCONV
3 4
Execution
TSAMP is described in Section 17. “10-bit Analog-to-Digital
Converter (ADC)” (DS61104).
2011-2012 Microchip Technology Inc. Preliminary DS61168E-page 279
PIC32MX1XX/2XX
FIGURE 29-20: PARALLEL SLAVE PORT TIMING
CS
RD
WR
PMD<7:0>
PS1
PS2
PS3
PS4
PS5
PS6
PS7
PIC32MX1XX/2XX
DS61168E-page 280 Preliminary 2011-2012 Microchip Technology Inc.
FIGURE 29-21: PARALLEL MASTER PORT READ TIMING DIAGRAM
TABLE 29-35: PARALLEL SLAVE PORT REQUIREMENTS
AC CHARACTERISTICS
Standard Operating Cond itions: 2.3V to 3.6V
(unless otherwise stated)
Operating temperature -40°C TA +85°C for Industrial
-40°C TA +105°C for V-temp
Para
m.No. Symbol Characteristics(1) Min. Typ. Max. Units Conditions
PS1 TdtV2wr
H
Data In Valid before WR or CS
Inactive (setup time)
20 ns
PS2 TwrH2dt
I
WR or CS Inactive to Data-In
Invalid (hold time)
40 ns
PS3 TrdL2dt
V
RD and CS Active to Data-Out
Valid
——60ns
PS4 TrdH2dtI RD Activeor CS Inactive to
Data-Out Invalid
0—10ns
PS5 Tcs CS Active Time TPB + 40 ns
PS6 TWR WR Active Time TPB + 25 ns
PS7 TRD RD Active Time TPB + 25 ns
Note 1: These parameters are characterized, but not tested in manufacturing.
TPB TPB TPB TPB TPB TPB TPB TPB
PB Clock
PMALL/PMALH
PMD<7:0>
PMA<13:18>
PMRD
PMCS<2:1>
PMWR
PM5
Data
Address<7:0>
PM1
PM3
PM6
Data
PM7
Address<7:0>
Address
PM4
PM2
2011-2012 Microchip Technology Inc. Preliminary DS61168E-page 281
PIC32MX1XX/2XX
FIGURE 29-22: PARALLEL MASTER PORT WRITE TI MING DIAGRAM
TABLE 29-36: PARALLEL MASTER PORT READ TIMING REQUIREMENTS
AC CHARACTERISTICS
Standard Operating Conditions: 2.3V to 3.6V
(unless otherwise stated)
Operating temperature -40°C TA +85°C for Industrial
-40°C TA +105°C for V-temp
Param.
No. Symbol Characteristics(1) Min. Typ. Max. Units Conditions
PM1 TLAT PMALL/PMALH Pulse Width 1 TPB ——
PM2 T
ADSU Address Out Valid to
PMALL/PMALH Invalid (address
setup time)
—2 TPB ——
PM3 TADHOLD PMALL/PMALH Invalid to
Address Out Invalid (address
hold time)
—1 TPB ——
PM4 TAHOLD PMRD Inactive to Address Out
Invalid
(address hold time)
5—ns
PM5 TRD PMRD Pulse Width 1 TPB ——
PM6 TDSU PMRD or PMENB Active to Data
In Valid (data setup time)
15 ns
PM7 TDHOLD PMRD or PMENB Inactive to
Data In Invalid (data hold time)
—80ns
Note 1: These parameters are characterized, but not tested in manufacturing.
TPB TPB TPB TPB TPB TPB TPB TPB
PB Clock
PMALL/PMALH
PMD<7:0>
PMA<13:18>
PMWR
PMCS<2:1>
PMRD
PM12 PM13
PM11
Address
Address<7:0> Data
PM2 + PM3
PM1
PIC32MX1XX/2XX
DS61168E-page 282 Preliminary 2011-2012 Microchip Technology Inc.
TABLE 29-37: PARALLEL MASTER PORT WRITE TIMING REQUIREMENTS
AC CHARACTERISTICS
Standard Operating Cond itions: 2.3V to 3.6V
(unless otherwise stated)
Operating temperature -40°C TA +85°C for Industrial
-40°C TA +105°C for V-temp
Param.
No. Symbol Characteristics(1) Min. Typ. Max. Units Conditions
PM11 TWR PMWR Pulse Width 1 TPB ——
PM12 TDVSU Data Out Valid before PMWR or
PMENB goes Inactive (data setup
time)
—2 TPB ——
PM13 TDVHOLD PMWR or PMEMB Invalid to Data
Out Invalid (data hold time)
—1 TPB ——
Note 1: These parameters are characterized, but not tested in manufacturing.
TABLE 29-38: OTG ELECTRICAL SPECIFICATIONS
AC CHARACTERISTICS
Standard Operating Conditions: 2.3V to 3.6V
(unless otherwise stated)
Operating temperature -40°C TA +85°C for Industrial
-40°C TA +105°C for V-temp
Param.
No. Symbol Characteristics(1) Min. Typ. Max. Units Conditions
USB313 VUSB3V3USB Voltage 3.0 3.6 V Voltage on VUSB3V3
must be in this range
for proper USB
operation
USB315 VILUSB Input Low Voltage for USB Buffer 0.8 V
USB316 VIHUSB Input High Voltage for USB Buffer 2.0 V
USB318 VDIFS Differential Input Sensitivity 0.2 V The difference
between D+ and D-
must exceed this value
while VCM is met
USB319 VCM Differential Common Mode Range 0.8 2.5 V
USB320 ZOUT Driver Output Impedance 28.0 44.0
USB321 VOL Voltage Output Low 0.0 0.3 V 14.25 k load
connected to 3.6V
USB322 VOH Voltage Output High 2.8 3.6 V 14.25 k load
connected to ground
Note 1: These parameters are characterized, but not tested in manufacturing.
2011-2012 Microchip Technology Inc. Preliminary DS61168E-page 283
PIC32MX1XX/2XX
TABLE 29-39: CTMU CURRENT SOURCE SPECIFICATIONS
DC CHARACTERISTICS Standard Operating Conditions (see Note 3):2.3V to 3.6V
(unless otherwise stated)
Operating temperature -40°C TA +85°C for Industrial
-40°C TA +105°C for V-temp
Param
No. Symbol Characteristic Min. Typ. Max. Units Conditions
CTMU CURRENT SOURCE
CTMUI1 IOUT1 Base Range(1) 0.55 µA CTMUICON<9:8> = 01
CTMUI2 IOUT2 10x Range(1) 5.5 µA CTMUICON<9:8> = 10
CTMUI3 IOUT3 100x Range(1) 55 µA CTMUICON<9:8> = 11
CTMUI4 IOUT4 1000x Range(1) 550 µA CTMUICON<9:8> = 00
CTMUFV1 VFTemperature Diode Forward
Voltage(1,2) —0.598 VTA = +25ºC,
CTMUICON<9:8> = 01
—0.658 VT
A = +25ºC,
CTMUICON<9:8> = 10
—0.721 VTA = +25ºC,
CTMUICON<9:8> = 11
CTMUFV2 VFVR Temperature Diode Rate of
Change(1,2) -1.92 mV/ºC CTMUICON<9:8> = 01
-1.74 mV/ºC CTMUICON<9:8> = 10
-1.56 mV/ºC CTMUICON<9:8> = 11
Note 1: Nominal value at center point of current trim range (CTMUICON<15:10> = 000000).
2: Parameters are characterized but not tested in manufacturing. Measurements taken with the following
conditions:
•V
REF+ = AVDD = 3.3V
ADC module configured for conversion speed of 500 ksps
All PMD bits are cleared (PMDx = 0)
Executing a while(1) statement
Device operating from the FRC with no PLL
3: The CTMU module is functional at VBORMIN < VDD < VDDMIN, but with degraded performance. Unless
otherwise stated, module functionality is tested, but not characterized.
PIC32MX1XX/2XX
DS61168E-page 284 Preliminary 2011-2012 Microchip Technology Inc.
FIGURE 29-23: EJTAG TIMING CHARACTERISTICS
TTCKeye
TTCKhigh TTCKlow Trf
Trf
Trf
Trf
TTsetup TThold
TTDOout TTDOzstate
Defined Undefined
TTRST*low
Trf
TCK
TDO
TRST*
TDI
TMS
TABLE 29-40: EJTAG TIMING REQUIREMENTS
AC CHARACTERISTICS
Standard Operating Cond itions: 2.3V to 3.6V
(unless otherwise stated)
Operating temperature -40°C TA +85°C for Industrial
-40°C TA +105°C for V-temp
Param.
No. Symbol Description(1) Min. Max. Units Conditions
EJ1 TTCKCYC TCK Cycle Time 25 ns
EJ2 TTCKHIGH TCK High Time 10 ns
EJ3 TTCKLOW TCK Low Time 10 ns
EJ4 TTSETUP TAP Signals Setup Time Before
Rising TCK
5—ns
EJ5 TTHOLD TAP Signals Hold Time After
Rising TCK
3—ns
EJ6 TTDOOUT TDO Output Delay Time from
Falling TCK
—5ns
EJ7 TTDOZSTATE TDO 3-State Delay Time from
Falling TCK
—5ns
EJ8 TTRSTLOW TRST Low Time 25 ns
EJ9 TRF TAP Signals Rise/Fall Time, All
Input and Output
——ns
Note 1: These parameters are characterized, but not tested in manufacturing.
2011-2012 Microchip Technology Inc. Preliminary DS61168E-page 285
PIC32MX1XX/2XX
30.0 50 MHz ELECTRICAL CHARACTERISTICS
This section provides an overview of the PIC32MX1XX/2XX electrical characteristics for devices operating at 50 MHz.
The specifications for 50 MHz are identical to those shown in Section 29.0 “Electrical Characteristics”, with the
exception of the parameters listed in this chapter.
Parameters in this chapter begin with the letter “M”, which denotes 50 MHz operation. For example, parameter DC29a
in Section 29.0 “Electrical Characteristics”, is the up to 40 MHz operation equivalent for MDC29a.
Absolute maximum ratings for the PIC32MX1XX/2XX 50 MHz devices are listed below. Exposure to these maximum
rating conditions for extended periods may affect device reliability. Functional operation of the device at these or any
other conditions, above the parameters indicated in the operation listings of this specification, is not implied.
Absolute Maximum Ratings
(See Note 1)
Ambient temperature under bias...............................................................................................................-40°C to +85°C
Storage temperature .............................................................................................................................. -65°C to +150°C
Voltage on VDD with respect to VSS ......................................................................................................... -0.3V to +4.0V
Voltage on any pin that is not 5V tolerant, with respect to VSS (Note 3)......................................... -0.3V to (VDD + 0.3V)
Voltage on any 5V tolerant pin with respect to VSS when VDD 2.3V (Note 3)........................................ -0.3V to +5.5V
Voltage on any 5V tolerant pin with respect to VSS when VDD < 2.3V (Note 3)........................................ -0.3V to +3.6V
Voltage on D+ or D- pin with respect to VUSB3V3..................................................................... -0.3V to (VUSB3V3 + 0.3V)
Voltage on VBUS with respect to VSS ....................................................................................................... -0.3V to +5.5V
Maximum current out of VSS pin(s) .......................................................................................................................300 mA
Maximum current into VDD pin(s) (Note 2)............................................................................................................300 mA
Maximum output current sunk by any I/O pin..........................................................................................................15 mA
Maximum output current sourced by any I/O pin ....................................................................................................15 mA
Maximum current sunk by all ports .......................................................................................................................200 mA
Maximum current sourced by all ports (Note 2)....................................................................................................200 mA
Note 1: Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the
device. This is a stress rating only and functional operation of the device at those or any other conditions,
above those indicated in the operation listings of this specification, is not implied. Exposure to maximum
rating conditions for extended periods may affect device reliability.
2: Maximum allowable current is a function of device maximum power dissipation (see Table 29-2).
3: See the Pin Diagrams section for the 5V tolerant pins.
PIC32MX1XX/2XX
DS61168E-page 286 Preliminary 2011-2012 Microchip Technology Inc.
30.1 DC Characteristics
TABLE 30-2: DC CHARACTERISTICS: OPERATING CURRENT (IDD)
TABLE 30-1: OPERATING MIPS VS. VOLTAGE
Characteristic VDD Range
(in Volts)(1) Temp. Range
(in °C)
Max. Frequency
PIC32MX1XX/2XX
MDC5 2.3-3.6V -40°C to +85°C 50 MHz
Note 1: Overall functional device operation at VBORMIN < VDD < VDDMIN is tested, but not characterized. All device
Analog modules, such as ADC, etc., will function, but with degraded performance below VDDMIN. Refer to
parameter BO10 in Table 29-10 for BOR values.
DC CHARACTERISTICS Standar d Ope r a t ing Co nditions: 2.3V to 3. 6 V
(unless otherwise stated)
Operating temperature -40°C TA +85°C for Industrial
Parameter
No. Typical(3) Max. Unit s Conditions
Operating Current (IDD) (Note 1, 2)
MDC24 25 37 mA 50 MHz
Note 1: A device’s IDD supply current is mainly a function of the operating voltage and frequency. Other factors,
such as PBCLK (Peripheral Bus Clock) frequency, number of peripheral modules enabled, internal code
execution pattern, execution from Program Flash memory vs. SRAM, I/O pin loading and switching rate,
oscillator type, as well as temperature, can have an impact on the current consumption.
2: The test conditions for IDD measurements are as follows:
Oscillator mode is EC (for 8 MHz and below) and EC+PLL (for above 8 MHz) with OSC1 driven by
external square wave from rail-to-rail, (OSC1 input clock input over/undershoot < 100 mV required)
OSC2/CLKO is configured as an I/O input pin
USB PLL oscillator is disabled if the USB module is implemented, PBCLK divisor = 1:8
CPU, Program Flash, and SRAM data memory are operational, SRAM data memory Wait states = 1
No peripheral modules are operating, (ON bit = 0), but the associated PMD bit is cleared
WDT, Clock Switching, Fail-Safe Clock Monitor, and Secondary Oscillator are disabled
All I/O pins are configured as inputs and pulled to VSS
•MCLR
= VDD
CPU executing while(1) statement from Flash
3: RTCC and JTAG are disabled
4: Data in “Typical” column is at 3.3V, 25°C at specified operating frequency unless otherwise stated.
Parameters are for design guidance only and are not tested.
2011-2012 Microchip Technology Inc. Preliminary DS61168E-page 287
PIC32MX1XX/2XX
TABLE 30-3: DC CHARACTERISTICS: IDLE CURRENT (IIDLE)
DC CHARACTERISTICS Sta n da r d Ope rating Cond itio ns: 2.3V to 3.6V
(unless otherwise stated)
Operating temperature -40°C TA +85°C for Industrial
Parameter
No. Typical(2) Max. Units Conditions
Idle Current (IIDLE): Core Off, Clock on Base Current (Note 1)
MDC34a 8 13 mA 50 MHz
Note 1: The test conditions for IIDLE current measurements are as follows:
Oscillator mode is EC (for 8 MHz and below) and EC+PLL (for above 8 MHz) with OSC1 driven by
external square wave from rail-to-rail, (OSC1 input clock input over/undershoot < 100 mV required)
OSC2/CLKO is configured as an I/O input pin
USB PLL oscillator is disabled if the USB module is implemented, PBCLK divisor = 1:8
CPU is in Idle mode (CPU core Halted), and SRAM data memory Wait states = 1
No peripheral modules are operating, (ON bit = 0), but the associated PMD bit is cleared
WDT, Clock Switching, Fail-Safe Clock Monitor, and Secondary Oscillator are disabled
All I/O pins are configured as inputs and pulled to VSS
•MCLR = VDD
RTCC and JTAG are disabled
2: Data in the “Typical” column is at 3.3V, 25°C unless otherwise stated. Parameters are for design guidance
only and are not tested.
TABLE 30-4: DC CHARACTERISTICS: POWER-DOWN CURRENT (IPD)
DC CHARACTERISTICS Standard Operating Conditions: 2.3V to 3.6V (unless otherwise stated)
Operating temperature -40°C TA +85°C for Industrial
Param.
No. Typical(2) Max. Units Conditions
Power-Down Current (IPD) (Note 1)
MDC40k 10 25 A-40°C
Base Power-Down Current
MDC40n 250 500 A+85°C
Module Differential Current
MDC41e 10 55 A 3.6V Watchdog Timer Current: IWDT (Not e 3)
MDC42e 23 55 A 3.6V RTCC + Timer1 w/32 kHz Crystal: IRTCC (N o t e 3)
MDC43d 1100 1300 A 3.6V ADC: IADC (Notes 3,4)
Note 1: The test conditions for IPD current measurements are as follows:
Oscillator mode is EC (for 8 MHz and below) and EC+PLL (for above 8 MHz) with OSC1 driven by
external square wave from rail-to-rail, (OSC1 input clock input over/undershoot < 100 mV required)
OSC2/CLKO is configured as an I/O input pin
USB PLL oscillator is disabled if the USB module is implemented, PBCLK divisor = 1:8
CPU is in Sleep mode, and SRAM data memory Wait states = 1
No peripheral modules are operating, (ON bit = 0), but the associated PMD bit is set
WDT, Clock Switching, Fail-Safe Clock Monitor, and Secondary Oscillator are disabled
All I/O pins are configured as inputs and pulled to VSS
•MCLR = VDD
RTCC and JTAG are disabled
2: Data in the “Typical” column is at 3.3V, 25°C unless otherwise stated. Parameters are for design guidance
only and are not tested.
3: The current is the additional current consumed when the module is enabled. This current should be
added to the base IPD current.
4: Test conditions for ADC module differential current are as follows: Internal ADC RC oscillator enabled.
PIC32MX1XX/2XX
DS61168E-page 288 Preliminary 2011-2012 Microchip Technology Inc.
TABLE 30-5: EXTERNAL CLOCK TIMING REQUIREMENTS
AC CHARACTERISTICS Standard Operating Conditions: 2.3V to 3.6V
(unless other wise stated)
Operating temperature -40°C TA +85°C for Industrial
Param.
No. Symbol Characteristics Min. Typical Max. Units Conditions
MOS10 FOSC External CLKI Frequency
(External clocks allowed only
in EC and ECPLL modes)
DC
4
50
50
MHz
MHz
EC (Note 2)
ECPLL (Note 1)
Note 1: PLL input requirements: 4 MHz FPLLIN 5 MHz (use PLL prescaler to reduce Fosc). This parameter is
characterized, but tested at 10 MHz only at manufacturing.
2: This parameter is characterized, but not tested in manufacturing.
TABLE 30-6: SPIx MASTER MODE (CKE = 0) TIMING REQUIREMENTS
AC CHARACTERISTICS Standard Operating Conditions: 2.3V to 3.6V
(unless otherwise stated)
Operating temperature -40°C TA +85°C for Industrial
Param.
No. Symbol Characteristics Min. Typical Max. Units Conditions
MSP10 TSCLSCKx Output Low Time
(Note 1,2) TSCK/2 ns
MSP11 TSCH SCKx Output High Time
(Note 1,2) TSCK/2 ——ns
Note 1: These parameters are characterized, but not tested in manufacturing.
2: The minimum clock period for SCKx is 40 ns. Therefore, the clock generated in Master mode must not
violate this specification.
TABLE 30-7: SPIx MODULE MASTER MODE (CKE = 1) TIMING REQUIREMENTS
AC CHARACTERISTICS Standard Operating Conditions: 2.3V to 3.6V
(unless otherwise stated)
Operating temperature -40°C TA +85°C for Industrial
Param.
No. Symbol Characteristics(1) Min. Typ. Max. Units Conditions
MSP10 TSCL SCKx Output Low Time
(Note 1,2) TSCK/2 ns
MSP11 TSCH SCKx Output High Time
(Note 1,2) TSCK/2 ns
Note 1: These parameters are characterized, but not tested in manufacturing.
2: The minimum clock period for SCKx is 40 ns. Therefore, the clock generated in Master mode must not
violate this specification.
2011-2012 Microchip Technology Inc. Preliminary DS61168E-page 289
PIC32MX1XX/2XX
TABLE 30-8: SPIx MODULE SLAVE MODE (CKE = 0) TIMING REQUIREMENTS
AC CHARACTERISTICS
Standard Operating Conditio ns : 2.3V to 3.6V
(unless otherwise stated)
Operating temperature -40°C T
A +85°C for Industrial
-40°C T
A +105°C for V-temp
Param.
No. Symbol Characteristics Min. Typ. Max. Units Conditions
MSP70 TSCL SCKx Input Low Time (Note 1,2) TSCK/2 ns
MSP71 TSCH SCKx Input High Time (Note 1,2) TSCK/2 ns
MSP51 T
SSH2DOZ SSx to SDOx Output
High-Impedance (Note 2) 5—25ns
Note 1: These parameters are characterized, but not tested in manufacturing.
2: The minimum clock period for SCKx is 40 ns.
TABLE 30-9: SPIx MODULE SLAVE MODE (CKE = 1) TIMING REQUIREMENTS
AC CHARACTERISTICS Standard Operating Conditions: 2.3V to 3.6V
(unless otherwise stated)
Operating temperature -40°C T
A +85°C for Industrial
Param.
No. Symbol Characteristics Min. Typical Max. Units Conditions
SP70 TSCL SCKx Input Low Time (Note 1,2) TSCK/2 ns
SP71 TSCH SCKx Input High Time (Note 1,2) TSCK/2 ns
Note 1: These parameters are characterized, but not tested in manufacturing.
2: The minimum clock period for SCKx is 40 ns.
PIC32MX1XX/2XX
DS61168E-page 290 Preliminary 2011-2012 Microchip Technology Inc.
NOTES:
2011-2012 Microchip Technology Inc. Preliminary DS61168E-page 291
PIC32MX1XX/2XX
30.0 DC AND AC DEVICE CHARACTERISTICS GRAPHS
FIGURE 30-1: I/O OUTPUT VOLTAGE HIGH (VOH) FIGURE 30-2: I/O OUTPUT VOLTAGE LOW (VOL)
Note: The graphs provided following this note are a statistical summary based on a limited number of samples and are provided for design guidance purposes
only. The performance characteristics listed herein are not tested or guaranteed. In some graphs, the data presented may be outside the specified operating
range (e.g., outside specified power supply range) and therefore, outside the warranted range.
-0.050
-0.045
-0.040
-0.035
-0.030
-0.025
-0.020
IOH(A)
VOH (V)
-0.050
-0.045
-0.040
-0.035
-0.030
-0.025
-0.020
-0.015
-0.010
-0.005
0.000
0.00 0.50 1.00 1.50 2.00 2.50 3.00 3.50 4.00
IOH(A)
VOH (V)
3V
3.3V
3.6V
Absolute Maximum
0.015
0.020
0.025
0.030
0.035
0.040
0.045
0.050
IOH(A)
VOL(V)
0.000
0.005
0.010
0.015
0.020
0.025
0.030
0.035
0.040
0.045
0.050
0.00 0.50 1.00 1.50 2.00 2.50 3.00 3.50 4.00
IOH(A)
VOL(V)
3V
3.3V
3.6V
Absolute Maximum
PIC32MX1XX/2XX
DS61168E-page 292 Preliminary 2011-2012 Microchip Technology Inc.
FIGURE 30-3: TYPICAL IPD CURR ENT @ VDD = 3.3V
FIGURE 30-4: TYPICAL IDD CURR ENT @ VDD = 3.3V
FIGURE 30-5: TYPICAL IIDLE CURRENT @ VDD = 3.3V
150
200
250
300
350
400
IPD A)
0
50
100
150
200
250
300
350
400
-40-30-20-10 0 102030405060708090100
IPD (µA)
Temperature (Celsius)
10
15
20
25
IDD (mA)
0
5
10
15
20
25
0 10203040
IDD (mA)
MIPS
3
4
5
6
7
8
D
LE Current (mA)
0
1
2
0 10203040
II
D
MIPS
2011-2012 Microchip Technology Inc. Preliminary DS61168E-page 293
PIC32MX1XX/2XX
FIGURE 30-6: TYPICAL FRC FREQUENCY @ VDD = 3.3V
FIGURE 30-7: TYPICAL LPRC FREQUENCY @ VDD = 3.3V
FIGURE 30-8: TYPICAL CTMU TEMPERATUR E DIODE
FORWARD VOLTAGE
7930
7940
7950
7960
7970
7980
7990
8000
FRC Frequency (kHz)
7900
7910
7920
7930
7940
7950
7960
7970
7980
7990
8000
-40-30-20-10 0 102030405060708090100
FRC Frequency (kHz)
Temperature (Celsius)
31
32
33
LPRC Frequency (kHz)
30
31
32
33
-40-30-20-10 0 102030405060708090100
LPRC Frequency (kHz)
Temperature (Celsius)
0500
0.550
0.600
0.650
0.700
0.750
0.800
0.850
Forward Voltage (V)
0.350
0.400
0.450
0.500
0.550
0.600
0.650
0.700
0.750
0.800
0.850
-40-30-20-100 102030405060708090100110
Forward Voltage (V)
Temperature (Celsius)
VF = 0.598
VF = 0.658
VF = 0.721
55 µA, V
FVR
= -1.56 mV/ºC
5.5 µA, V
FVR
= -1.74 mV/ºC
0.55 µA, V
FVR
= -1.92 mV/ºC
PIC32MX1XX/2XX
DS61168E-page 294 Preliminary 2011-2012 Microchip Technology Inc.
NOTES:
2011-2012 Microchip Technology Inc. Preliminary DS61168E-page 295
PIC32MX1XX/2XX
31.0 PACKAGING INFORMATION
31.1 Package Marking Information
Legend: XX...X Customer-specific information
Y Year code (last digit of calendar year)
YY Year code (last 2 digits of calendar year)
WW Week code (week of January 1 is week ‘01’)
NNN Alphanumeric traceability code
Pb-free JEDEC designator for Matte Tin (Sn)
*This package is Pb-free. The Pb-free JEDEC designator ( )
can be found on the outer packaging for this package.
Note: If the full Microchip part number cannot be marked on one line, it is carried over to the next
line, thus limiting the number of available characters for customer-specific information.
3
e
3
e
Example
32MX220F
032BE/ML
1130235
3
e
28-Lead SSOP
XXXXXXXXXXXX
XXXXXXXXXXXX
YYWWNNN
Example
PIC32MX220F
032B-I/SS
1130235
3
e
28-Lead SOIC
XXXXXXXXXXXXXXXXXXXX
XXXXXXXXXXXXXXXXXXXX
XXXXXXXXXXXXXXXXXXXX
YYWWNNN
Example
PIC32MX220F
1130235
032B-I/SO
3
e
28-Lead QFN
XXXXXXXX
XXXXXXXX
YYWWNNN
28-Lead SPDIP
XXXXXXXXXXXXXXXXX
XXXXXXXXXXXXXXXXX
YYWWNNN
Example
PIC32MX220F
1130235
032B-I/SP
3
e
PIC32MX1XX/2XX
DS61168E-page 296 Preliminary 2011-2012 Microchip Technology Inc.
31.1 Package Marking Information (Continued)
XXXXXXXXXX
44-Lead QFN
XXXXXXXXXX
XXXXXXXXXX
YYWWNNN
32MX220F
Example
032D-E/ML
1130235
44-Lead TQFP
XXXXXXXXXX
XXXXXXXXXX
XXXXXXXXXX
YYWWNNN
Example
32MX220F
032D-I/PT
1130235
3
e
3
e
Legend: XX...X Customer-specific information
Y Year code (last digit of calendar year)
YY Year code (last 2 digits of calendar year)
WW Week code (week of January 1 is week ‘01’)
NNN Alphanumeric traceability code
Pb-free JEDEC designator for Matte Tin (Sn)
*This package is Pb-free. The Pb-free JEDEC designator ( )
can be found on the outer packaging for this package.
Note: If the full Microchip part number cannot be marked on one line, it is carried over to the next
line, thus limiting the number of available characters for customer-specific information.
3
e
3
e
36-Lead VTLA
XXXXXXXX
XXXXXXXX
YYWWNNN
Example
32MX220F
032CE/TL
1130235
3
e
44-Lead VTLA Example
XXXXXXXXXX
XXXXXXXXXX
XXXXXXXXXX
YYWWNNN
PIC32
MX120F0
1130235
3
e
32DI/TL
2011-2012 Microchip Technology Inc. Preliminary DS61168E-page 297
PIC32MX1XX/2XX
31.2 Package Details
This section provides the technical details of the packages.
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DS61168E-page 298 Preliminary 2011-2012 Microchip Technology Inc.
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
2011-2012 Microchip Technology Inc. Preliminary DS61168E-page 299
PIC32MX1XX/2XX
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DS61168E-page 300 Preliminary 2011-2012 Microchip Technology Inc.
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
2011-2012 Microchip Technology Inc. Preliminary DS61168E-page 301
PIC32MX1XX/2XX
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
PIC32MX1XX/2XX
DS61168E-page 302 Preliminary 2011-2012 Microchip Technology Inc.
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
2011-2012 Microchip Technology Inc. Preliminary DS61168E-page 303
PIC32MX1XX/2XX
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DS61168E-page 304 Preliminary 2011-2012 Microchip Technology Inc.
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PIC32MX1XX/2XX
PIC32MX1XX/2XX
DS61168E-page 306 Preliminary 2011-2012 Microchip Technology Inc.
2011-2012 Microchip Technology Inc. Preliminary DS61168E-page 307
PIC32MX1XX/2XX
PIC32MX1XX/2XX
DS61168E-page 308 Preliminary 2011-2012 Microchip Technology Inc.
2011-2012 Microchip Technology Inc. Preliminary DS61168E-page 309
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PIC32MX1XX/2XX
DS61168E-page 312 Preliminary 2011-2012 Microchip Technology Inc.
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
2011-2012 Microchip Technology Inc. Preliminary DS61168E-page 313
PIC32MX1XX/2XX
APPENDIX A: REVISION HISTORY
Revision A (May 2011)
This is the initial released version of this document.
Revision B (October 2011)
The following two global changes are included in this
revision:
All packaging references to VLAP have been
changed to VTLA throughout the document
All references to VCORE have been removed
All occurrences of the ASCL1, ASCL2, ASDA1, and
ASDA2 pins have been removed
V-temp temperature range (-40ºC to +105ºC) was
added to all electrical specification tables
This revision includes the addition of the following
devices:
Text and formatting changes were incorporated
throughout the document.
All other major changes are referenced by their
respective section in Table A-1.
PIC32MX130F064B PIC32MX230F064B
PIC32MX130F064C PIC32MX230F064C
PIC32MX130F064D PIC32MX230F064D
PIC32MX150F128B PIC32MX250F128B
PIC32MX150F128C PIC32MX250F128C
PIC32MX150F128D PIC32MX250F128D
TABLE A-1: MAJOR SECTION UPDATES
Section Update Description
32-bit Microcontrollers (up to 128 KB
Flash and 32 KB SRAM) with Audio
and Graphics Interfaces, USB, and
Advanced Analog
Split the existing Features table into two: PIC32MX1XX General Purpose
Family Features (Table 1) and PIC32MX2XX USB Family Features (Table 2).
Added the SPDIP package reference (see Table 1, Table 2, and “Pin
Diagrams”).
Added the new devices to the applicable pin diagrams.
Changed PGED2 to PGED1 on pin 35 of the 36-pin VTLA diagram for
PIC32MX220F032C, PIC32MX220F016C, PIC32MX230F064C, and
PIC32MX250F128C devices.
1.0 “Device Overview” Added the SPDIP package reference and updated the pin number for AN12
for 44-pin QFN devices in the Pinout I/O Descriptions (see Table 1-1).
Added the PGEC4/PGED4 pin pair and updated the C1INA-C1IND and
C2INA-C2IND pin numbers for 28-pin SSOP/SPDIP/SOIC devices in the
Pinout I/O Descriptions (see Table 1-1).
2.0 “Guidelines for Getting Started
with 32-bit Microcontrollers” Updated the Recommended Minimum Connection diagram (see Figure 2-1).
PIC32MX1XX/2XX
DS61168E-page 314 Preliminary 2011-2012 Microchip Technology Inc.
4.0 “Memory Organization” Added Memory Maps for the new devices (see Figure 4-3 and Figure 4-4).
Removed the BMXCHEDMA bit from the Bus Matrix Register map (see
Table 4-1).
Added the REFOTRIM register, added the DIVSWEN bit to the REFOCON
registers, added Note 4 to the ULOCK and SOSCEN bits and added the
PBDIVRDY bit in the OSCCON register in the in the System Control Register
map (see Table 4-16).
Removed the ALTI2C1 and ALTI2C2 bits from the DEVCFG3 register and
added Note 1 to the UPLLEN and UPLLIDIV<2:0> bits of the DEVCFG2
register in the Device Configuration Word Summary (see Table 4-17).
Updated Note 1 in the Device and Revision ID Summary (see Table 4-18).
Added Note 2 to the PORTA Register map (see Table 4-19).
Added the ANSB6 and ANSB12 bits to the ANSELB register in the PORTB
Register map (see Table 4-20).
Added Notes 2 and 3 to the PORTC Register map (see Table 4-21).
Updated all register names in the Peripheral Pin Select Register map (see
Table 4-23).
Added values in support of new devices (16 KB RAM and 32 KB RAM) in the
Data RAM Size register (see Register 4-5).
Added values in support of new devices (64 KB Flash and 128 KB Flash) in
the Data RAM Size register (see Register 4-5).
8.0 “Oscillator Configurat ion Added Note 5 to the PIC32MX1XX/2XX Family Clock Diagram (see
Figure 8-1).
Added the PBDIVRDY bit and Note 2 to the Oscillator Control register (see
Register 8-1).
Added the DIVSWEN bit and Note 3 to the Reference Oscillator Control
register (see Register 8-3).
Added the REFOTRIM register (see Register 8-4).
21.0 “10-bit Analog-to-Digital
Converter (ADC)” Updated the ADC1 Module Block Diagram (see Figure 21-1).
Updated the Notes in the ADC Input Select register (see Register 21-4).
24.0 “Charg e Time Measurement
Unit (CTMU)” Updated the CTMU Block Diagram (see Figure 24-1).
Added Note 3 to the CTMU Control register (see Register 24-1)
26.0 “Special Features” Added Note 1 and the PGEC4/PGED4 pin pair to the ICESEL<1:0> bits in
DEVCFG0: Device Configuration Word 0 (see Register 26-1).
Removed the ALTI2C1 and ALTI2C2 bits from the Device Configuration
Word 3 register (see Register 26-4).
Removed 26.3.3 “Power-up Requirements”.
Added Note 3 to the Connections for the On-Chip Regulator diagram (see
Figure 26-2).
Updated the Block Diagram of Programming, Debugging and Trace Ports
diagram (see Figure 26-3).
TABLE A-1: MAJOR SECTION UPDATES (CONTINUED)
Section Update Description
2011-2012 Microchip Technology Inc. Preliminary DS61168E-page 315
PIC32MX1XX/2XX
Revision C (November 2011)
All major changes are referenced by their respective
section in Tabl e A - 2 .
29.0 “Electrical Characteristics” Updated the Absolute Maximum Ratings (removed Voltage on VCORE with
respect to VSS).
Added the SPDIP specification to the Thermal Packaging Characteristics
(see Table 29-2).
Updated the Typical values for parameters DC20-DC24 in the Operating
Current (IDD) specification (see Table 29-5).
Updated the Typical values for parameters DC30a-DC34a in the Idle Current
(IIDLE) specification (see Table 29-6).
Updated the Typical values for parameters DC40i and DC40n and removed
parameter DC40m in the Power-down Current (IPD) specification (see
Table 29-7).
Removed parameter D320 (VCORE) from the Internal Voltage Regulator
Specifications and updated the Comments (see Table 29-13).
Updated the Minimum, Typical, and Maximum values for parameter F20b in
the Internal FRC Accuracy specification (see Table 29-17).
Removed parameter SY01 (TPWRT) and removed all Conditions from Resets
Timing (see Table 29-20).
Updated all parameters in the CTMU Specifications (see Table 29-39).
31.0 “Packaging Information” Added the 28-lead SPDIP package diagram information (see 31.1 “Package
Marking Information” and 31.2 “Package Details”).
Product Identification SystemAdded the SPDIP (SP) package definition.
TABLE A-1: MAJOR SECTION UPDATES (CONTINUED)
Section Update Description
TABLE A-2: MAJOR SECTION UPDATES
Section Update Description
32-bit Microcontrollers (up to 128 KB
Flash and 32 KB SRAM) with Audio
and Graphics Interfaces, USB, and
Advanced Analog
Revised the source/sink on I/O pins (see “Input/Output” on page 1).
Added the SPDIP package to the PIC32MX220F032B device in the
PIC32MX2XX USB Family Features (see Table 2).
4.0 “Memory Organization” Removed ANSB6 from the ANSELB register and added the ODCB6,
ODCB10, and ODCB11 bits in the PORTB Register Map (see Table 4-20).
29.0 “Electrical Characteristics” Updated the minimum value for parameter OS50 in the PLL Clock Timing
Specifications (see Table 29-16).
PIC32MX1XX/2XX
DS61168E-page 316 Preliminary 2011-2012 Microchip Technology Inc.
Revision D (February 2012)
All occurrences of VUSB were changed to: VUSB3V3. In
addition, text and formatting changes were
incorporated throughout the document.
All other major changes are referenced by their
respective section in Table A-3 .
TABLE A-3: MAJOR SECTION UPDATES
Section Update Description
32-bit Microcontrollers (up to 128
KB Flash and 32 KB SRAM) with
Audio and Graphics Interfaces, USB,
and Advanced Analog
Corrected a part number error in all pin diagrams.
Updated the DMA Channels (Programmable/Dedicated) column in the
PIC32MX1XX General Purpose Family Features (see Table 1).
1.0 “Device Overview” Added the TQFP and VTLA packages to the 44-pin column heading and
updated the pin numbers for the SCL1, SCL2, SDA1, and SDA2 pins in the
Pinout I/O Descriptions (see Table 1-1).
7.0 “Interrupt Controller” Updated the Note that follows the features.
Updated the Interrupt Controller Block Diagram (see Figure 7-1).
29.0 “Electrical Characteristics” Updated the Maximum values for parameters DC20-DC24, and the Minimum
value for parameter DC21 in the Operating Current (IDD) DC Characteristics
(see Table 29-5).
Updated all Minimum and Maximum values for the Idle Current (IIDLE) DC
Characteristics (see Table 29-6).
Updated the Maximum values for parameters DC40k, DC40l, DC40n, and
DC40m in the Power-down Current (IPD) DC Characteristics (see Table 29-7).
Changed the minimum clock period for SCKx from 40 ns to 50 ns in Note 3 of
the SPIx Master and Slave Mode Timing Requirements (see Table 29-26
through Table 29-29).
30.0 “DC and AC Device
Characteristics Graphs” Updated the Typical IIDLE Current @ VDD = 3.3V graph (see Figure 30-5).
2011-2012 Microchip Technology Inc. Preliminary DS61168E-page 317
PIC32MX1XX/2XX
Revision E (October 2012)
All singular pin diagram occurrences of CVREF were
changed to: CVREFOUT. In addition, minor text and for-
matting changes were incorporated throughout the
document.
All major changes are referenced by their respective
section in Tabl e A - 4 .
TABLE A-4: MAJOR SECTION UPDATES
Section Update Description
“32-bit Microcontrollers (up to
128 KB Flash and 3 2 KB SRAM )
with Audio and G raphics
Interfaces, USB, and Advanced
Analog”
Updated the following feature sections:
“Operating Conditions”
“Communication Interfaces”
2.0 “Guid elines for Getting
Started with 32-bit MCUs” Removed Section 2.8 “Configuration of Analog and Digital Pins During ICSP
Operations”.
3.0 “CPU” Removed references to GPR shadow registers in 3.1 “Features” and
3.2.1 “Execution Unit”.
4.0 “Memory Organization” Updated the BRG bit range in the SPI1 and SPI2 Register Map (see Tabl e 4 - 8 ).
Added the PWP<6> bit to the Device Configuration Word Summary
(see Tabl e 4 - 1 7 ).
5.0 “Flash Program Memory” Added a note with Flash page size and row size information.
7.0 “Interrupt Controller” Updated the TPC<2:0> bit definitions (see Register 7-1).
Updated the IPTMR<31:0> bit definition (see Register 7-3).
8.0 “Oscillator Configurat ion Updated the PIC32MX1XX/2XX Family Clock Diagram (see Figure 8-1).
Updated the RODIV<14:0> bit definitions (see Register 8-3).
10.0 “USB On-The-Go (OTG)” Updated the Notes in the USB Interface Diagram (see Figure 10-1).
18.0 “Un iversal Asynchronous
Receiver Tr ansmitter (UART)” Updated the baud rate range in the list of primary features.
26.0 “Special Features” Added the PWP<6> bit to the Device Configuration Word 0
(see Register 26-1).
29.0 “Electrical Characteristics” Added Note 1 to Operating MIPS vs. Voltage (see Table 29-1).
Added Note 2 to DC Temperature and Voltage Specifications (see Table 29-4).
Updated the Conditions for parameter DC25 in DC Characteristics: Operating
Current (IDD) (see Tab l e 2 9 -5).
Added Note 2 to Electrical Characteristics: BOR (see Table 29-10).
Added Note 4 to Comparator Specifications (see Table 29-12).
Added Note 5 to ADC Module Specifications (see Table 29-32).
Updated the 10-bit Conversion Rate Parameters and added Note 3 (see
Table 29-33).
Added Note 4 to the Analog-to-Digital Conversion Timing Requirements (see
Table 29-34).
Added Note 3 to CTMU Current Source Specifications (see Table 29-39).
30.0 “50 MHz Electrical
Characteristics” New chapter with electrical characteristics for 50 MHz devices.
31.0 “Packaging Information” The 36-pin and 44-pin VTLA packages have been updated.
PIC32MX1XX/2XX
DS61168E-page 318 Preliminary 2011-2012 Microchip Technology Inc.
Notes:
2011-2012 Microchip Technology Inc. Preliminary DS61168E-page 319
PIC32MX1XX/2XX
INDEX
Numerics
50 MHz Electrical Characteristics ..................................... 285
A
AC Characteristics ............................................................ 253
10-Bit Conversion Rate Parameters ......................... 275
ADC Specifications ................................................... 273
Analog-to-Digital Conversion Requirements............. 276
EJTAG Timing Requirements ................................... 284
Internal FRC Accuracy.............................................. 255
Internal RC Accuracy ................................................ 255
OTG Electrical Specifications ................................... 282
Parallel Master Port Read Requirements ................. 281
Parallel Master Port Write ......................................... 282
Parallel Master Port Write Requirements.................. 282
Parallel Slave Port Requirements ............................. 280
PLL Clock Timing...................................................... 255
Analog-to-Digital Converter (ADC).................................... 201
Assembler
MPASM Assembler................................................... 240
B
Block Diagrams
ADC Module.............................................................. 201
Comparator I/O Operating Modes............................. 209
Comparator Voltage Reference ................................ 213
Connections for On-Chip Voltage Regulator............. 235
Core and Peripheral Modules ..................................... 19
CPU ............................................................................ 31
CTMU Configurations
Time Measurement........................................... 215
DMA .......................................................................... 103
I2C Circuit ................................................................. 172
Input Capture ............................................................ 157
Interrupt Controller ...................................................... 85
JTAG Programming, Debugging and Trace Ports .... 235
Output Compare Module........................................... 161
PMP Pinout and Connections to External Devices ... 183
Reset System.............................................................. 81
RTCC ........................................................................ 191
SPI Module ............................................................... 163
Timer1....................................................................... 149
Timer2/3/4/5 (16-Bit) ................................................. 153
Typical Multiplexed Port Structure ............................ 141
UART ........................................................................ 177
WDT and Power-up Timer ........................................ 233
Brown-out Reset (BOR)
and On-Chip Voltage Regulator................................ 235
C
C Compilers
MPLAB C18 .............................................................. 240
Charge Time Measurement Unit. See CTMU.
Clock Diagram .................................................................... 94
Comparator
Specifications............................................................ 252
Comparator Module .......................................................... 209
Comparator Voltage Reference (CVref ............................. 213
Configuration Bit ............................................................... 223
Configuring Analog Port Pins............................................ 142
CPU
Architecture Overview ................................................ 32
Coprocessor 0 Registers ............................................ 33
Core Exception Types ................................................ 34
EJTAG Debug Support............................................... 34
Power Management ................................................... 34
CPU Module ................................................................. 27, 31
CTMU
Registers .................................................................. 216
Customer Change Notification Service............................. 323
Customer Notification Service .......................................... 323
Customer Support............................................................. 323
D
DC and AC Characteristics
Graphs and Tables ................................................... 291
DC Characteristics............................................................ 244
I/O Pin Input Specifications ...................................... 249
I/O Pin Output Specifications.................................... 250
Idle Current (IIDLE) .................................................... 247
Power-Down Current (IPD)........................................ 248
Program Memory...................................................... 251
Temperature and Voltage Specifications.................. 245
DC Characteristics (50 MHz) ............................................ 286
Idle Current (IIDLE) .................................................... 287
Power-Down Current (IPD)........................................ 287
Development Support....................................................... 239
Direct Memory Access (DMA) Controller.......................... 103
E
Electrical Characteristics .................................................. 243
AC............................................................................. 253
Errata.................................................................................. 16
External Clock
Timer1 Timing Requirements ................................... 259
Timer2, 3, 4, 5 Timing Requirements ....................... 260
Timing Requirements ............................................... 254
External Clock (50 MHz)
Timing Requirements ............................................... 288
F
Flash Program Memory ...................................................... 77
RTSP Operation ......................................................... 77
I
I/O Ports ........................................................................... 141
Parallel I/O (PIO) ...................................................... 142
Write/Read Timing.................................................... 142
Input Change Notification ................................................. 142
Instruction Set................................................................... 237
Inter-Integrated Circuit (I2C .............................................. 171
Internal Voltage Reference Specifications........................ 252
Internet Address ............................................................... 323
Interrupt Controller.............................................................. 85
IRG, Vector and Bit Location ...................................... 86
M
Memory Maps
PIC32MX11X/21X Devices......................................... 36
PIC32MX12X/22X Devices......................................... 37
PIC32MX130/230 Devices ......................................... 38
PIC32MX150/250 Devices ......................................... 39
PIC32MX1XX/2XX
DS61168E-page 320 Preliminary 2011-2012 Microchip Technology Inc.
Memory Organization.......................................................... 35
Layout ......................................................................... 35
Microchip Internet Web Site .............................................. 323
MPLAB ASM30 Assembler, Linker, Librarian ................... 240
MPLAB Integrated Development Environment Software .. 239
MPLAB PM3 Device Programmer..................................... 242
MPLAB REAL ICE In-Circuit Emulator System................. 241
MPLINK Object Linker/MPLIB Object Librarian ................ 240
O
Oscillator Configuration....................................................... 93
Output Compare................................................................ 161
P
Packaging ......................................................................... 295
Details ....................................................................... 297
Marking ..................................................................... 295
Parallel Master Port (PMP) ............................................... 183
PIC32 Family USB Interface Diagram............................... 120
Pinout I/O Descriptions (table) ............................................ 20
Power-on Reset (POR)
and On-Chip Voltage Regulator ................................ 235
Power-Saving Features..................................................... 219
CPU Halted Methods ................................................ 219
Operation .................................................................. 219
with CPU Running..................................................... 219
R
Reader Response ............................................................. 324
Real-Time Clock and Calendar (RTCC)............................ 191
Register Maps ............................................................... 40–68
Registers
[pin name]R (Peripheral Pin Select Input)................. 147
AD1CHS (ADC Input Select) .................................... 207
AD1CON1 (A/D Control 1) ........................................ 199
AD1CON1 (ADC Control 1) .............................. 199, 203
AD1CON2 (ADC Control 2) ...................................... 205
AD1CON3 (ADC Control 3) ...................................... 206
AD1CSSL (ADC Input Scan Select) ......................... 208
ALRMDATE (Alarm Date Value)............................... 199
ALRMDATECLR (ALRMDATE Clear)....................... 199
ALRMDATESET (ALRMDATE Set) .......................... 199
ALRMTIME (Alarm Time Value) ............................... 198
ALRMTIMECLR (ALRMTIME Clear)......................... 199
ALRMTIMEINV (ALRMTIME Invert) ......................... 199
ALRMTIMESET (ALRMTIME Set) ............................ 199
BMXBOOTSZ (Boot Flash (IFM) Size ........................ 76
BMXCON (Bus Matrix Configuration) ......................... 71
BMXDKPBA (Data RAM Kernel Program
Base Address) .................................................... 72
BMXDRMSZ (Data RAM Size Register) ..................... 75
BMXDUDBA (Data RAM User Data Base Address) ... 73
BMXDUPBA (Data RAM User Program
Base Address) .................................................... 74
BMXPFMSZ (Program Flash (PFM) Size) .................. 76
BMXPUPBA (Program Flash (PFM) User Program
Base Address) .................................................... 75
CM1CON (Comparator 1 Control) ............................ 210
CMSTAT (Comparator Control Register) .................. 211
CNCONx (Change Notice Control for PORTx) ......... 148
CTMUCON (CTMU Control) ..................................... 216
CVRCON (Comparator Voltage Reference Control). 214
DCHxCON (DMA Channel ’x’ Control)...................... 109
DCHxCPTR (DMA Channel ’x’ Cell Pointer) ............. 116
DCHxCSIZ (DMA Channel ’x’ Cell-Size)................... 116
DCHxDAT (DMA Channel ’x’ Pattern Data).............. 117
DCHxDPTR (Channel ’x’ Destination Pointer).......... 115
DCHxDSA (DMA Channel ’x’ Destination
Start Address)................................................... 113
DCHxDSIZ (DMA Channel ’x’ Destination Size)....... 114
DCHxECON (DMA Channel ’x’ Event Control)......... 110
DCHxINT (DMA Channel ’x’ Interrupt Control) ......... 111
DCHxSPTR (DMA Channel ’x’ Source Pointer)........ 115
DCHxSSA (DMA Channel ’x’ Source Start Address) 113
DCHxSSIZ (DMA Channel ’x’ Source Size).............. 114
DCRCCON (DMA CRC Control)............................... 106
DCRCDATA (DMA CRC Data) ................................. 108
DCRCXOR (DMA CRCXOR Enable) ....................... 108
DEVCFG0 (Device Configuration Word 0................. 224
DEVCFG1 (Device Configuration Word 1................. 226
DEVCFG2 (Device Configuration Word 2................. 228
DEVCFG3 (Device Configuration Word 3................. 230
DEVID (Device and Revision ID) .............................. 232
DMAADDR (DMA Address) ...................................... 105
DMAADDR (DMR Address)...................................... 105
DMACON (DMA Controller Control) ......................... 104
DMASTAT (DMA Status) .......................................... 105
I2CxCON (I2C Control)............................................. 173
I2CxSTAT (I2C Status) ............................................. 175
ICxCON (Input Capture ’x’ Control) .......................... 158
IFSx (Interrupt Flag Status) ........................................ 90
INTCON (Interrupt Control)......................................... 88
INTSTAT (Interrupt Status)......................................... 89
IPCx (Interrupt Priority Control) .................................. 91
NVMADDR (Flash Address) ....................................... 79
NVMCON (Programming Control) .............................. 78
NVMDATA (Flash Program Data)............................... 80
NVMKEY (Programming Unlock)................................ 79
NVMSRCADDR (Source Data Address) .................... 80
OCxCON (Output Compare ’x’ Control).................... 162
OSCCON (Oscillator Control) ..................................... 95
PMADDR (Parallel Port Address) ............................. 188
PMAEN (Parallel Port Pin Enable)............................ 189
PMCON (Parallel Port Control)................................. 184
PMMODE (Parallel Port Mode)................................. 186
PMSTAT (Parallel Port Status (Slave Modes Only).. 190
REFOCON (Reference Oscillator Control) ................. 99
REFOTRIM (Reference Oscillator Trim)................... 101
RPnR (Peripheral Pin Select Output) ....................... 147
RSWRST (Software Reset) ........................................ 83
RTCCON (RTC Control) ........................................... 192
RTCDATE (RTC Date Value) ................................... 197
RTCTIME (RTC Time Value).................................... 196
SPIxCON (SPI Control) ............................................ 164
SPIxCON2 (SPI Control 2) ....................................... 167
SPIxSTAT (SPI Status)............................................. 168
T1CON (Type A Timer Control) ................................ 150
TPTMR (Temporal Proximity Timer)........................... 89
TxCON (Type B Timer Control) ................................ 155
U1ADDR (USB Address) .......................................... 134
U1BDTP1 (USB BDT Page 1) .................................. 136
U1BDTP2 (USB BDT Page 2) .................................. 137
U1BDTP3 (USB BDT Page 3) .................................. 137
U1CNFG1 (USB Configuration 1)............................. 138
U1CON (USB Control).............................................. 132
U1EIE (USB Error Interrupt Enable)......................... 130
U1EIR (USB Error Interrupt Status).......................... 128
U1EP0-U1EP15 (USB Endpoint Control) ................. 139
U1FRMH (USB Frame Number High) ...................... 135
U1FRML (USB Frame Number Low)........................ 134
U1IE (USB Interrupt Enable) .................................... 127
2011-2012 Microchip Technology Inc. Preliminary DS61168E-page 321
PIC32MX1XX/2XX
U1IR (USB Interrupt)................................................. 126
U1OTGCON (USB OTG Control) ............................. 124
U1OTGIE (USB OTG Interrupt Enable) .................... 122
U1OTGIR (USB OTG Interrupt Status)..................... 121
U1OTGSTAT (USB OTG Status).............................. 123
U1PWRC (USB Power Control)................................ 125
U1SOF (USB SOF Threshold).................................. 136
U1STAT (USB Status) .............................................. 131
U1TOK (USB Token) ................................................ 135
WDTCON (Watchdog Timer Control) ....................... 234
Resets................................................................................. 81
Revision History ................................................................ 313
RTCALRM (RTC ALARM Control) .................................... 194
S
Serial Peripheral Interface (SPI) ....................................... 163
Software Simulator (MPLAB SIM)..................................... 241
Special Features ............................................................... 223
T
Timer1 Module .................................................................. 149
Timer2/3, Timer4/5 Modules ............................................. 153
Timing Diagrams
10-Bit Analog-to-Digital Conversion
(ASAM = 0, SSRC<2:0> = 000)........................ 277
10-Bit Analog-to-Digital Conversion (ASAM = 1, SS-
RC<2:0> = 111, SAMC<4:0> = 00001) ............ 278
EJTAG ...................................................................... 284
External Clock........................................................... 253
I/O Characteristics .................................................... 256
I2Cx Bus Data (Master Mode) .................................. 267
I2Cx Bus Data (Slave Mode) .................................... 270
I2Cx Bus Start/Stop Bits (Master Mode) ................... 267
I2Cx Bus Start/Stop Bits (Slave Mode) ..................... 270
Input Capture (CAPx)................................................ 260
OCx/PWM ................................................................. 261
Output Compare (OCx)............................................. 261
Parallel Master Port Read......................................... 280
Parallel Master Port Write ......................................... 281
Parallel Slave Port .................................................... 279
SPIx Master Mode (CKE = 0) ................................... 262
SPIx Master Mode (CKE = 1) ................................... 263
SPIx Slave Mode (CKE = 0) ..................................... 264
SPIx Slave Mode (CKE = 1) ..................................... 265
Timer1, 2, 3, 4, 5 External Clock............................... 259
UART Reception ....................................................... 182
UART Transmission (8-bit or 9-bit Data)................... 182
Timing Requirements
CLKO and I/O ........................................................... 256
Timing Specifications
I2Cx Bus Data Requirements (Master Mode)........... 268
I2Cx Bus Data Requirements (Slave Mode)............. 271
Input Capture Requirements .................................... 260
Output Compare Requirements................................ 261
Simple OCx/PWM Mode Requirements ................... 261
SPIx Master Mode (CKE = 0) Requirements............ 262
SPIx Master Mode (CKE = 1) Requirements............ 263
SPIx Slave Mode (CKE = 1) Requirements.............. 265
SPIx Slave Mode Requirements (CKE = 0).............. 264
Timing Specifications (50 MHz)
SPIx Master Mode (CKE = 0) Requirements............ 288
SPIx Master Mode (CKE = 1) Requirements............ 288
SPIx Slave Mode (CKE = 1) Requirements.............. 289
SPIx Slave Mode Requirements (CKE = 0).............. 289
U
UART................................................................................ 177
USB On-The-Go (OTG) .................................................... 119
V
VCAP pin............................................................................ 235
Voltage Regulator (On-Chip) ............................................ 235
W
Watchdog Timer (WDT).................................................... 233
WWW Address ................................................................. 323
WWW, On-Line Support ..................................................... 16
PIC32MX1XX/2XX
DS61168E-page 322 Preliminary 2011-2012 Microchip Technology Inc.
NOTES:
2011-2012 Microchip Technology Inc. Preliminary DS61168E-page 323
PIC32MX1XX/2XX
THE MICROCHIP WEB SITE
Microchip provides online support via our WWW site at
www.microchip.com. This web site is used as a means
to make files and information easily available to
customers. Accessible by using your favorite Internet
browser, the web site contains the following
information:
Product Support – Data sheets and errata,
application notes and sample programs, design
resources, user’s guides and hardware support
documents, latest software releases and archived
software
General Technical Support – Frequently Asked
Questions (FAQs), technical support requests,
online discussion groups, Microchip consultant
program member listing
Business of Mic r oc hi p – Product selector and
ordering guides, latest Microchip press releases,
listing of seminars and events, listings of
Microchip sales offices, distributors and factory
representatives
CUSTOMER CHANGE NOTIFICATION
SERVICE
Microchip’s customer notification service helps keep
customers current on Microchip products. Subscribers
will receive e-mail notification whenever there are
changes, updates, revisions or errata related to a
specified product family or development tool of interest.
To register, access the Microchip web site at
www.microchip.com. Under “Support”, click on
“Customer Change Notification” and follow the
registration instructions.
CUSTOMER SUPPORT
Users of Microchip products can receive assistance
through several channels:
Distributor or Representative
Local Sales Office
Field Application Engineer (FAE)
Technical Support
Development Systems Information Line
Customers should contact their distributor,
representative or field application engineer (FAE) for
support. Local sales offices are also available to help
customers. A listing of sales offices and locations is
included in the back of this document.
Technical support is available through the web site
at: http://microchip.com/support
PIC32MX1XX/2XX
DS61168E-page 324 Preliminary 2011-2012 Microchip Technology Inc.
READER RESPONSE
It is our intention to provide you with the best documentation possible to ensure successful use of your Microchip
product. If you wish to provide your comments on organization, clarity, subject matter, and ways in which our
documentation can better serve you, please FAX your comments to the Technical Publications Manager at
(480) 792-4150.
Please list the following information, and use this outline to provide us with your comments about this document.
TO: Technical Publications Manager
RE: Reader Response
Total Pages Sent ________
From: Name
Company
Address
City / State / ZIP / Country
Telephone: (_______) _________ - _________
Application (optional):
Would you like a reply? Y N
Device: Literature Number:
Questions:
FAX: (______) _________ - _________
DS61168EPIC32MX1XX/2XX
1. What are the best features of this document?
2. How does this document meet your hardware and software development needs?
3. Do you find the organization of this document easy to follow? If not, why?
4. What additions to the document do you think would enhance the structure and subject?
5. What deletions from the document could be made without affecting the overall usefulness?
6. Is there any incorrect or misleading information (what and where)?
7. How would you improve this document?
2011-2012 Microchip Technology Inc. Preliminary DS61168E-page 325
PIC32MX1XX/2XX
PRODUCT IDENTIFICATION SYSTEM
To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office.
Architecture MX = M4K® MCU core
Product Groups 1XX = General purpose microcontroller family
2XX = General purpose microcontroller family
Flash Memory Family F = Flash program memory
Program Memory Size 016 = 16K
032 = 32K
Pin Count B = 28-pin
C= 36-pin
D= 44-pin
Speed 50 = 50 MHz
Temperature Range I = -40°C to +85°C (Industrial)
V = -40°C to +105°C (V-temp)
Package ML = 28-Lead (6x6 mm) QFN (Plastic Quad Flatpack)
ML = 44-Lead (8x8 mm) QFN (Plastic Quad Flatpack)
PT = 44-Lead (10x10x1 mm) TQFP (Plastic Thin Quad Flatpack)
SO = 28-Lead (7.50 mm) SOIC (Plastic Small Outline)
SP = 28-Lead (300 mil) SPDIP (Skinny Plastic Dual In-line)
SS = 28-Lead (5.30 mm) SSOP (Plastic Shrink Small Outline)
TL = 36-Lead (5x5 mm) VTLA (Very Thin Leadless Array)
TL = 44-Lead (6x6 mm) VTLA (Very Thin Leadless Array)
Pattern Three-digit QTP, SQTP, Code or Special Requirements (blank otherwise)
ES = Engineering Sample
Example:
PIC32MX110F032DT-I/PT:
General purpose PIC32,
32-bit RISC MCU with M4K® core,
32 KB program memory, 44-pin,
Industrial temperature,
TQFP package.
Microchip Brand
Architecture
Flash Memory Family
Pin Count
Product Groups
Program Memory Size (KB)
PIC32 MX1XX F 032 D T - 50 I / PT - XXX
Flash Memory Family
Pattern
Package
Temperature Range
Tape and Reel Flag (if applicable)
Speed (if applicable)
PIC32MX1XX/2XX
DS61168E-page 326 Preliminary 2011-2012 Microchip Technology Inc.
NOTES:
2011-2012 Microchip Technology Inc. Preliminary DS61168E-page 327
Information contained in this publication regarding device
applications and the like is provided only for your convenience
and may be superseded by updates. It is your responsibility to
ensure that your application meets with your specifications.
MICROCHIP MAKES NO REPRESENTATIONS OR
WARRANTIES OF ANY KIND WHETHER EXPRESS OR
IMPLIED, WRITTEN OR ORAL, STATUTORY OR
OTHERWISE, RELATED TO THE INFORMATION,
INCLUDING BUT NOT LIMITED TO ITS CONDITION,
QUALITY, PERFORMANCE, MERCHANTABILITY OR
FITNESS FOR PURPOSE. Microchip disclaims all liability
arising from this information and its use. Use of Microchip
devices in life support and/or safety applications is entirely at
the buyer’s risk, and the buyer agrees to defend, indemnify and
hold harmless Microchip from any and all damages, claims,
suits, or expenses resulting from such use. No licenses are
conveyed, implicitly or otherwise, under any Microchip
intellectual property rights.
Trademarks
The Microchip name and logo, the Microchip logo, dsPIC,
FlashFlex, KEELOQ, KEELOQ logo, MPLAB, PIC, PICmicro,
PICSTART, PIC32 logo, rfPIC, SST, SST Logo, SuperFlash
and UNI/O are registered trademarks of Microchip Technology
Incorporated in the U.S.A. and other countries.
FilterLab, Hampshire, HI-TECH C, Linear Active Thermistor,
MTP, SEEVAL and The Embedded Control Solutions
Company are registered trademarks of Microchip Technology
Incorporated in the U.S.A.
Silicon Storage Technology is a registered trademark of
Microchip Technology Inc. in other countries.
Analog-for-the-Digital Age, Application Maestro, BodyCom,
chipKIT, chipKIT logo, CodeGuard, dsPICDEM,
dsPICDEM.net, dsPICworks, dsSPEAK, ECAN,
ECONOMONITOR, FanSense, HI-TIDE, In-Circuit Serial
Programming, ICSP, Mindi, MiWi, MPASM, MPF, MPLAB
Certified logo, MPLIB, MPLINK, mTouch, Omniscient Code
Generation, PICC, PICC-18, PICDEM, PICDEM.net, PICkit,
PICtail, REAL ICE, rfLAB, Select Mode, SQI, Serial Quad I/O,
Total Endurance, TSHARC, UniWinDriver, WiperLock, ZENA
and Z-Scale are trademarks of Microchip Technology
Incorporated in the U.S.A. and other countries.
SQTP is a service mark of Microchip Technology Incorporated
in the U.S.A.
GestIC and ULPP are registered trademarks of Microchip
Technology Germany II GmbH & Co. & KG, a subsidiary of
Microchip Technology Inc., in other countries.
All other trademarks mentioned herein are property of their
respective companies.
© 2011-2012, Microchip Technology Incorporated, Printed in
the U.S.A., All Rights Reserved.
Printed on recycled paper.
ISBN: 978-1-62076-640-8
Note the following details of the code protection feature on Microchip devices:
Microchip products meet the specification contained in their particular Microchip Data Sheet.
Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the
intended manner and under normal conditions.
There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our
knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data
Sheets. Most likely, the person doing so is engaged in theft of intellectual property.
Microchip is willing to work with the customer who is concerned about the integrity of their code.
Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not
mean that we are guaranteeing the product as “unbreakable.”
Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our
products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts
allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.
Microchip received ISO/TS-16949:200 9 certif ication for its worldwide
headquarters, design and wafer fabrication facilities in Chandler and
Tempe, Arizona; Gresham, Oregon and design centers in California
and India. The Company’s quality system processes and procedures
are for its PIC® MCUs and dsPIC® DSCs, KEELOQ® code hopping
devices, Serial EEPROMs, microperi pherals, nonvola tile memo ry and
analog product s. In addition, Microchip s quality system for the design
and manufacture of development systems is ISO 9001:2000 certified.
QUALITY MANAGEMENT S
YSTEM
CERTIFIED BY DNV
== ISO/TS 16949 ==
DS61168E-page 328 Preliminary 2011-2012 Microchip Technology Inc.
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