LM1894 www.ti.com SNAS551C - DECEMBER 1994 - REVISED APRIL 2013 LM1894 Dynamic Noise Reduction System DNR Check for Samples: LM1894 FEATURES DESCRIPTION * The LM1894 is a stereo noise reduction circuit for use with audio playback systems. The DNR system is non-complementary, meaning it does not require encoded source material. The system is compatible with virtually all prerecorded tapes and FM broadcasts. Psychoacoustic masking, and an adaptive bandwidth scheme allow the DNR to achieve 10 dB of noise reduction. DNR can save circuit board space and cost because of the few additional components required. 1 2 * * * * * Non-Complementary Noise Reduction, "Single Ended" Low Cost External Components, No Critical Matching Compatible with All Prerecorded Tapes and FM 10 dB Effective Tape Noise Reduction CCIR/ARM Weighted Wide Supply Range, 4.5V to 18V 1 Vrms Input Overload APPLICATIONS * * * * * Automotive Radio/Tape Players Compact Portable Tape Players Quality HI-FI Tape Systems VCR Playback Noise Reduction Video Disc Playback Noise Reduction 1 2 Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. All trademarks are the property of their respective owners. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright (c) 1994-2013, Texas Instruments Incorporated LM1894 SNAS551C - DECEMBER 1994 - REVISED APRIL 2013 www.ti.com Typical Application *R1 + R2 = 1 k total. See Application Hints. Figure 1. Component Hook-Up for Stereo DNR System 14-Pin SOIC or PDIP or TSSOP See D or NFF0014A or PW Package These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates. Absolute Maximum Ratings (1) (2) Supply Voltage 20V Input Voltage Range, Vpk VS/2 Operating Temperature (3) 0C to +70C -65C to +150C Storage Temperature PDIP Package Soldering Information (1) (2) (3) 2 SOIC Package Soldering (10 seconds) 260C Vapor Phase (60 seconds) 215C Infrared (15 seconds) 220C "Absolute Maximum Ratings" indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for which the device is functional, but do not ensure specific performance limits. If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/Distributors for availability and specifications. For operation in ambient temperature above 25C, the device must be derated based on a 150C maximum junction temperature and a thermal resistance of: (a) 80C/W junction to ambient for the PDIP package, (b) 105C/W junction to ambient for the SOIC package, and (c) 150C/W junction to ambient for the TSSOP package. Submit Documentation Feedback Copyright (c) 1994-2013, Texas Instruments Incorporated Product Folder Links: LM1894 LM1894 www.ti.com SNAS551C - DECEMBER 1994 - REVISED APRIL 2013 Electrical Characteristics VS = 8V, TA = 25C, VIN = 300 mV at 1 kHz, circuit shown in Figure 1 unless otherwise specified Parameter Conditions Min Operating Supply Range Supply Current 4.5 VS = 8V Typ Max Units 8 18 V 17 30 mA V/V MAIN SIGNAL PATH DC Ground Pin 9 (1) -0.9 -1 -1.1 3.7 4.0 4.3 V Channel Balance DC Ground Pin 9 -1.0 1.0 dB Minimum Balance AC Ground Pin 9 with 0.1 FCapacitor (1) 675 1400 Hz Maximum Bandwidth DC Ground Pin 9 (1) 27 34 46 kHz Effective Noise Reduction CCIR/ARM Weighted (2) -10 -14 dB Total Harmonic Distortion DC Ground Pin 9 0.05 0.1 % Input Headroom Maximum VIN for 3% THD 1.0 Vrms VS - 1.5 Vp-p AC Ground Pin 9 79 dB DC Ground Pin 9 77 dB Voltage Gain DC Output Voltage 965 AC Ground Pin 9 Output Headroom Maximum VOUT for 3% THD DC Ground Pin 9 Signal to Noise BW = 20 Hz-20 kHz, re 300 mV CCIR/ARM Weighted re 300 mV (3) AC Ground Pin 9 82 88 dB DC Ground Pin 9 70 76 dB AC Ground Pin 9 77 dB DC Ground Pin 9 64 dB CCIR Peak, re 300 mV (4) Input Impedance Pin 2 and Pin 13 14 20 Channel Separation DC Ground Pin 9 -50 -70 dB Power Supply Rejection C14 = 100 F, -40 -56 dB VRIPPLE = 500 mVrms, 26 k f = 1 kHz Output DC Shift Reference DVM to Pin 14 and Measuree Output DC Shift from Minimum to Maximum Band-width (1) (2) (3) (4) (5) 4.0 20 mV (5) To force the DNR system into maximum bandwidth, DC ground the input to the peak detector, pin 9. A negative temperature coefficient of -0.5%/C on the bandwidth, reduces the maximum bandwidth at increased ambient temperature or higher package dissipation. AC ground pin 9 or pin 6 to select minimum bandwidth. To change minimum and maximum bandwidth, see Application Hints. The maximum noise reduction CCIR/ARM weighted is about 14 dB. This is accomplished by changing the bandwidth from maximum to minimum. In actual operation, minimum bandwidth is not selected, a nominal minimum bandwidth of about 2 kHz gives -10 dB of noise reduction. See Application Hints. The CCIR/ARM weighted noise is measured with a 40 dB gain amplifier between the DNR system and the CCIR weighting filter; it is then input referred. Measured using the Rhode-Schwartz psophometer. Pin 10 is DC forced half way between the maximum bandwidth DC level and minimum bandwidth DC level. An AC 1 kHz signal is then applied to pin 10. Its peak-to-peak amplitude is VDC (max BW) - VDC (min BW). Submit Documentation Feedback Copyright (c) 1994-2013, Texas Instruments Incorporated Product Folder Links: LM1894 3 LM1894 SNAS551C - DECEMBER 1994 - REVISED APRIL 2013 www.ti.com Electrical Characteristics (continued) VS = 8V, TA = 25C, VIN = 300 mV at 1 kHz, circuit shown in Figure 1 unless otherwise specified Parameter Conditions Min Typ Max Units V/V CONTROL SIGNAL PATH Summing Amplifier Voltage Gain Both Channels Driven 0.9 1 1.1 Gain Amplifier Input Impedance Pin 6 24 30 39 k Pin 6 to Pin 8 21.5 24 26.5 V/V Peak Detector Input Impedance Pin 9 560 700 840 Voltage Gain Pin 9 to Pin 10 30 33 36 V/V Attack Time Measured to 90% of Final Value with 10 kHz Tone Burst 300 500 700 s Decay Time Measured to 90% of Final Value with 10 kHz Tone Burst 45 75 ms DC Voltage Range Minimum Bandwidth to Maximum Bandwidth 1.1 3.8 V Voltage Gain 4 Submit Documentation Feedback 60 Copyright (c) 1994-2013, Texas Instruments Incorporated Product Folder Links: LM1894 LM1894 www.ti.com SNAS551C - DECEMBER 1994 - REVISED APRIL 2013 Typical Performance Characteristics Supply Current vs Supply Voltage Channel Separation (Referred to the Output) vs Frequency Figure 2. Figure 3. Power Supply Rejection Ratio (Referred to the Output) vs Frequency THD vs Frequency Figure 4. Figure 5. -3 dB Bandwidth vs Frequency and Control Signal Gain of Control Path vs Frequency (with 10 kHz FM Pilot Filter) Figure 6. Figure 7. Submit Documentation Feedback Copyright (c) 1994-2013, Texas Instruments Incorporated Product Folder Links: LM1894 5 LM1894 SNAS551C - DECEMBER 1994 - REVISED APRIL 2013 www.ti.com Typical Performance Characteristics (continued) Main Signal Path Bandwidth vs Voltage Control Peak Detector Response Figure 8. Figure 9. Output Response Figure 10. 6 Submit Documentation Feedback Copyright (c) 1994-2013, Texas Instruments Incorporated Product Folder Links: LM1894 LM1894 www.ti.com SNAS551C - DECEMBER 1994 - REVISED APRIL 2013 External Component Guide (Figure 1) Component Value Purpose C1 0.1 F-100 F May be part of power supply, or may be added to suppress power supply oscillation. C2, C13 1 F Blocks DC, pin 2 and pin 13 are at DC potential of VS/2. C2, C13 form a low frequency pole with 20k RIN. C14 25 F-100 F Improves power supply rejection. C3, C12 0.0033 F Forms integrator with internal gm block and op amp. Sets bandwidth conversion gain of 33 Hz/A of gm current. C4, C11 1 F Output coupling capacitor. Output is at DC potential of VS/2. C5 0.1 F Works with R1 and R2 to attenuate low frequency transients which could disturb control path operation. C6 0.001 F Works with input resistance of pin 6 to form part of control path frequency weighting. C8 0.1 F Combined with L8 and CL forms 19 kHz filter for FM pilot. This is only required in FM applications (1). L8, CL 4.7 mH, 0.015 F Forms 19 kHz filter for FM pilot. L8 is Toko coil CAN-1A185HM (1) (2). C9 0.047 F Works with input resistance of pin 9 to form part of control path frequency weighting. C10 1 F Set attack and decay time of peak detector. R1, R2 1 k Sensitivity resistors set the noise threshold. Reducing attenuation causes larger signals to be peak detected and larger bandwidth in main signal path. Total value of R1 + R2 should equal 1 k. R8 100 Forms RC roll-off with C8. This is only required in FM applications. (1) When FM applications are not required, pin 8 and pin 9 hook-up as follows: (2) Toko America Inc., 1250 Feehanville Drive, Mt. Prospect IL 60056 Circuit Operation The LM1894 has two signal paths, a main signal path and a bandwidth control path. The main path is an audio low pass filter comprised of a gm block with a variable current, and an op amp configured as an integrator. As seen in Figure 11, DC feedback constrains the low frequency gain to AV = -1. Above the cutoff frequency of the filter, the output decreases at -6 dB/oct due to the action of the 0.0033 F capacitor. The purpose of the control paths is to generate a bandwidth control signal which replicates the ear's sensitivity to noise in the presence of a tone. A single control path is used for both channels to keep the stereo image from wandering. This is done by adding the right and left channels together in the summing amplifier of Figure 11. The R1, R2 resistor divider adjusts the incoming noise level to open slightly the bandwidth of the low pass filter. Control path gain is about 60 dB and is set by the gain amplifier and peak detector gain. This large gain is needed to ensure the low pass filter bandwidth can be opened by very low noise floors. The capacitors between Submit Documentation Feedback Copyright (c) 1994-2013, Texas Instruments Incorporated Product Folder Links: LM1894 7 LM1894 SNAS551C - DECEMBER 1994 - REVISED APRIL 2013 www.ti.com the summing amplifier output and the peak detector input determine the frequency weighting as shown in the Typical Performance Characteristics. The 1 F capacitor at pin 10, in conjunction with internal resistors, sets the attack and decay times. The voltage is converted into a proportional current which is fed into the gm blocks. The bandwidth sensitivity to gm current is 33 Hz/A. In FM stereo applications at 19 kHz pilot filter is inserted between pin 8 and pin 9 as shown in Figure 1. Figure 12 is an interesting curve and deserves some discussion. Although the output of the DNR system is a linear function of input signal, the -3 dB bandwidth is not. This is due to the non-linear nature of the control path. The DNR system has a uniform frequency response, but looking at the -3 dB bandwidth on a steady state basis with a single frequency input can be misleading. It must be remembered that a single input frequency can only give a single -3 dB bandwidth and the roll-off from this point must be a smooth -6 dB/oct. A more accurate evaluation of the frequency response can be seen in Figure 13. In this case the main signal path is frequency swept, while the control path has a constant frequency applied. It can be seen that different control path frequencies each give a distinctive gain roll-off. PSYCHOACOUSTIC BASICS The dynamic noise reduction system is a low pass filter that has a variable bandwidth of 1 kHz to 30 kHz, dependent on music spectrum. The DNR system operates on three principles of psychoacoustics. 1. White noise can mask pure tones. The total noise energy required to mask a pure tone must equal the energy of the tone itself. Within certain limits, the wider the band of masking noise about the tone, the lower the noise amplitude need be. As long as the total energy of the noise is equal to or greater than the energy of the tone, the tone will be inaudible. This principle may be turned around; when music is present, it is capable of masking noise in the same bandwidth. 2. The ear cannot detect distortion for less than 1 ms. On a transient basis, if distortion occurs in less than 1 ms, the ear acts as an integrator and is unable to detect it. Because of this, signals of sufficient energy to mask noise open bandwidth to 90% of the maximum value in less than 1 ms. Reducing the bandwidth to within 10% of its minimum value is done in about 60 ms: long enough to allow the ambience of the music to pass through, but not so long as to allow the noise floor to become audible. 3. Reducing the audio bandwidth reduces the audibility of noise. Audibility of noise is dependent on noise spectrum, or how the noise energy is distributed with frequency. Depending on the tape and the recorder equalization, tape noise spectrum may be slightly rolled off with frequency on a per octave basis. The ear sensitivity on the other hand greatly increases between 2 kHz and 10 kHz. Noise in this region is extremely audible. The DNR system low pass filters this noise. Low frequency music will not appreciably open the DNR bandwidth, thus 2 kHz to 20 kHz noise is not heard. 8 Submit Documentation Feedback Copyright (c) 1994-2013, Texas Instruments Incorporated Product Folder Links: LM1894 LM1894 www.ti.com SNAS551C - DECEMBER 1994 - REVISED APRIL 2013 Block Diagram Figure 11. Figure 12. Output vs Frequency Figure 13. -3 dB Bandwidth vs Frequency and Control Signal Submit Documentation Feedback Copyright (c) 1994-2013, Texas Instruments Incorporated Product Folder Links: LM1894 9 LM1894 SNAS551C - DECEMBER 1994 - REVISED APRIL 2013 www.ti.com APPLICATION HINTS The DNR system should always be placed before tone and volume controls as shown in Figure 1. This is because any adjustment of these controls would alter the noise floor seen by the DNR control path. The sensitivity resistors R1 and R2 may need to be switched with the input selector, depending on the noise floors of different sources, i.e., tape, FM, phono. To determine the value of R1 and R2 in a tape system for instance; apply tape noise (no program material) and adjust the ratio of R1 and R2 to open slightly the bandwidth of the main signal path. This can easily be done by viewing the capacitor voltage of pin 10 with an oscilloscope, or by using the circuit of Figure 14. This circuit gives an LED display of the voltage on the peak detector capacitor. Adjust the values of R1 and R2 (their sum is always 1 k) to light the LEDs of pin 1 and pin 18. The LED bar graph does not indicate signal level, but rather instantaneous bandwidth of the two filters; it should not be used as a signal-level indicator. For greater flexibility in setting the bandwidth sensitivity, R1 and R2 could be replaced by a 1 k potentiometer. To change the minimum and maximum value of bandwidth, the integrating capacitors, C3 and C12, can be scaled up or down. Since the bandwidth is inversely proportional to the capacitance, changing this 0.0039 F capacitor to 0.0033 F will change the typical bandwidth from 965 Hz-34 kHz to 1.1 kHz-40 kHz. With C3 and C12 set at 0.0033 F, the maximum bandwidth is typically 34 kHz. A double pole double throw switch can be used to completely bypass DNR. The capacitor on pin 10 in conjunction with internal resistors sets the attack and decay times. The attack time can be altered by changing the size of C10. Decay times can be decreased by paralleling a resistor with C10, and increased by increasing the value of C10. When measuring the amount of noise reduction of the DNR system, the frequency response of the cassette should be flat to 10 kHz. The CCIR weighting network has substantial gain to 8 kHz and any additional roll-off in the cassette player will reduce the benefits of DNR noise reduction. A typical signal-to-noise measurement circuit is shown in Figure 15. The DNR system should be switched from maximum bandwidth to nominal bandwidth with tape noise as a signal source. The reduction in measured noise is the signal-to-noise ratio improvement. Figure 14. Bar Graph Display of Peak Detector Voltage 10 Submit Documentation Feedback Copyright (c) 1994-2013, Texas Instruments Incorporated Product Folder Links: LM1894 LM1894 www.ti.com SNAS551C - DECEMBER 1994 - REVISED APRIL 2013 Figure 15. Technique for Measuring S/N Improvement of the DNR System FOR FURTHER READING Tape Noise Levels 1. "A Wide Range Dynamic Noise Reduction System", Blackmer, "dB" Magazine,August-September 1972, Volume 6, #8. 2. "Dolby B-Type Noise Reduction System", Berkowitz and Gundry, Sert Journal,May-June 1974, Volume 8. 3. "Cassette vs Elcaset vs Open Reel", Toole, Audioscene Canada, April 1978. 4. "CCIR/ARM: A Practical Noise Measurement Method", Dolby, Robinson, Gundry, JAES,1978. Noise Masking 1. "Masking and Discrimination", Bos and De Boer, JAES, Volume 39, #4, 1966. 2. "The Masking of Pure Tones and Speech by White Noise", Hawkins and Stevens, JAES, Volume 22, #1, 1950. 3. "Sound System Engineering", Davis Howard W. Sams and Co. 4. "High Quality Sound Reproduction", Moir, Chapman Hall, 1960. 5. "Speech and Hearing in Communication", Fletcher, Van Nostrand, 1953. Submit Documentation Feedback Copyright (c) 1994-2013, Texas Instruments Incorporated Product Folder Links: LM1894 11 LM1894 SNAS551C - DECEMBER 1994 - REVISED APRIL 2013 www.ti.com Printed Circuit Layout Figure 16. DNR Component Diagram 12 Submit Documentation Feedback Copyright (c) 1994-2013, Texas Instruments Incorporated Product Folder Links: LM1894 LM1894 www.ti.com SNAS551C - DECEMBER 1994 - REVISED APRIL 2013 REVISION HISTORY Changes from Revision B (April 2013) to Revision C * Page Changed layout of National Data Sheet to TI format .......................................................................................................... 11 Submit Documentation Feedback Copyright (c) 1994-2013, Texas Instruments Incorporated Product Folder Links: LM1894 13 PACKAGE OPTION ADDENDUM www.ti.com 30-Jun-2016 PACKAGING INFORMATION Orderable Device Status (1) LM1894MX/NOPB ACTIVE Package Type Package Pins Package Drawing Qty SOIC D 14 2500 Eco Plan Lead/Ball Finish MSL Peak Temp (2) (6) (3) Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM Op Temp (C) Device Marking (4/5) 0 to 70 LM1894M (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. (5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device. (6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish value exceeds the maximum column width. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 1 Samples PACKAGE OPTION ADDENDUM www.ti.com 30-Jun-2016 Addendum-Page 2 PACKAGE MATERIALS INFORMATION www.ti.com 5-Feb-2016 TAPE AND REEL INFORMATION *All dimensions are nominal Device LM1894MX/NOPB Package Package Pins Type Drawing SOIC D 14 SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) 2500 330.0 16.4 Pack Materials-Page 1 6.5 B0 (mm) K0 (mm) P1 (mm) 9.35 2.3 8.0 W Pin1 (mm) Quadrant 16.0 Q1 PACKAGE MATERIALS INFORMATION www.ti.com 5-Feb-2016 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) LM1894MX/NOPB SOIC D 14 2500 367.0 367.0 35.0 Pack Materials-Page 2 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. All semiconductor products (also referred to herein as "components") are sold subject to TI's terms and conditions of sale supplied at the time of order acknowledgment. TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI's terms and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily performed. TI assumes no liability for applications assistance or the design of Buyers' products. Buyers are responsible for their products and applications using TI components. To minimize the risks associated with Buyers' products and applications, Buyers should provide adequate design and operating safeguards. TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or other intellectual property right relating to any combination, machine, or process in which TI components or services are used. Information published by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI. Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such altered documentation. Information of third parties may be subject to additional restrictions. Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service voids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice. TI is not responsible or liable for any such statements. Buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirements concerning its products, and any use of TI components in its applications, notwithstanding any applications-related information or support that may be provided by TI. Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards which anticipate dangerous consequences of failures, monitor failures and their consequences, lessen the likelihood of failures that might cause harm and take appropriate remedial actions. Buyer will fully indemnify TI and its representatives against any damages arising out of the use of any TI components in safety-critical applications. In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TI's goal is to help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and requirements. Nonetheless, such components are subject to these terms. No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the parties have executed a special agreement specifically governing such use. Only those TI components which TI has specifically designated as military grade or "enhanced plastic" are designed and intended for use in military/aerospace applications or environments. Buyer acknowledges and agrees that any military or aerospace use of TI components which have not been so designated is solely at the Buyer's risk, and that Buyer is solely responsible for compliance with all legal and regulatory requirements in connection with such use. TI has specifically designated certain components as meeting ISO/TS16949 requirements, mainly for automotive use. In any case of use of non-designated products, TI will not be responsible for any failure to meet ISO/TS16949. Products Applications Audio www.ti.com/audio Automotive and Transportation www.ti.com/automotive Amplifiers amplifier.ti.com Communications and Telecom www.ti.com/communications Data Converters dataconverter.ti.com Computers and Peripherals www.ti.com/computers DLP(R) Products www.dlp.com Consumer Electronics www.ti.com/consumer-apps DSP dsp.ti.com Energy and Lighting www.ti.com/energy Clocks and Timers www.ti.com/clocks Industrial www.ti.com/industrial Interface interface.ti.com Medical www.ti.com/medical Logic logic.ti.com Security www.ti.com/security Power Mgmt power.ti.com Space, Avionics and Defense www.ti.com/space-avionics-defense Microcontrollers microcontroller.ti.com Video and Imaging www.ti.com/video RFID www.ti-rfid.com OMAP Applications Processors www.ti.com/omap TI E2E Community e2e.ti.com Wireless Connectivity www.ti.com/wirelessconnectivity Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265 Copyright (c) 2016, Texas Instruments Incorporated Mouser Electronics Authorized Distributor Click to View Pricing, Inventory, Delivery & Lifecycle Information: Texas Instruments: LM1894MX LM1894MX/NOPB