SN74LVC125ADBRG4 - Texas Instruments

D, DB, NS, OR PW PACKAGE

(TOP VIEW)

1OE

2OE

GND

VCC

4OE

3OE

RGY PACKAGE

(TOP VIEW)

1 14

7 8

4OE

3OE

2OE

1OE

3Y V

GND

SN74LVC125A

www.ti.com

SCAS290P –JANUARY 1993–REVISED OCTOBER 2010

QUADRUPLE BUS BUFFER GATE

WITH 3-STATE OUTPUTS

Check for Samples: SN74LVC125A

1FEATURES

• Operates From 1.65 V to 3.6 V

• Specified From –40°C to 85°C

and –40°C to 125°C

• Inputs Accept Voltages to 5.5 V

• Max tpd of 4.8 ns at 3.3 V

• Typical VOLP (Output Ground Bounce)

<0.8 V at VCC = 3.3 V, TA= 25°C

• Typical VOHV (Output VOH Undershoot)

>2 V at VCC = 3.3 V, TA= 25°C

• Latch-Up Performance Exceeds 250 mA Per

JESD 17

• ESD Protection Exceeds JESD 22

– 2000-V Human-Body Model (A114-A)

– 200-V Machine Model (A115-A)

– 1000-V Charged-Device Model (C101)

DESCRIPTION/ORDERING INFORMATION

This quadruple bus buffer gate is designed for 1.65-V to 3.6-V VCC operation.

The SN74LVC125A features independent line drivers with 3-state outputs. Each output is disabled when the

associated output-enable (OE) input is high.

To ensure the high-impedance state during power up or power down, OE should be tied to VCC through a pullup

resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver.

Inputs can be driven from either 3.3-V or 5-V devices. This feature allows the use of this device as a translator in

a mixed 3.3-V/5-V system environment.

1Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas

Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.

Products conform to specifications per the terms of the Texas

Instruments standard warranty. Production processing does not

necessarily include testing of all parameters.

1OE

1A 1Y

2OE

2A 2Y

3OE

3A 3Y

4OE

4A 4Y

SN74LVC125A

SCAS290P –JANUARY 1993–REVISED OCTOBER 2010

www.ti.com

ORDERING INFORMATION

TAPACKAGE(1) (2) ORDERABLE PART NUMBER TOP-SIDE MARKING

–40°C to 85°C QFN – RGY Reel of 1000 SN74LVC125ARGYR LC125A

Tube of 50 SN74LVC125AD

SOIC – D Reel of 2500 SN74LVC125ADRG3 LVC125A

Reel of 250 SN74LVC125ADT

SOP – NS Reel of 2000 SN74LVC125ANSR LVC125A

–40°C to 125°C SSOP – DB Reel of 2000 SN74LVC125ADBR LC125A

Tube of 90 SN74LVC125APW

TSSOP – PW Reel of 2000 SN74LVC125APWRG3 LC125A

Reel of 250 SN74LVC125APWT

(1) Package drawings, thermal data, and symbolization are available at www.ti.com/packaging.

(2) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI

website at www.ti.com.

Table 1. FUNCTION TABLE

(EACH BUFFER)

INPUTS OUTPUT

OE A

L H H

L L L

H X Z

LOGIC DIAGRAM (POSITIVE LOGIC)

Product Folder Link(s): SN74LVC125A

SN74LVC125A

www.ti.com

SCAS290P –JANUARY 1993–REVISED OCTOBER 2010

Absolute Maximum Ratings(1)

over operating free-air temperature range (unless otherwise noted) MIN MAX UNIT

VCC Supply voltage range –0.5 6.5 V

VIInput voltage range(2) –0.5 6.5 V

VOOutput voltage range(2) (3) –0.5 VCC + 0.5 V

IIK Input clamp current VI< 0 –50 mA

IOK Output clamp current VO< 0 –50 mA

IOContinuous output current ±50 mA

Continuous current through VCC or GND ±100 mA

D package(4) 86

DB package(4) 96

qJA Package thermal impedance NS package(4) 76 °C/W

PW package(4) 113

RGY package(5) 47

Tstg Storage temperature range –65 150 °C

Ptot Power dissipation TA= –40°C to 125°C(6) (7) 500 mW

(1) Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings

only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating

conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2) The input and output negative-voltage ratings may be exceeded if the input and output current ratings are observed.

(3) The value of VCC is provided in the recommended operating conditions table.

(4) The package thermal impedance is calculated in accordance with JESD 51-7.

(5) The package thermal impedance is calculated in accordance with JESD 51-5.

(6) For the D package: above 70°C, the value of Ptot derates linearly with 8 mW/K.

(7) For the DB, NS, and PW packages: above 60°C, the value of Ptot derates linearly with 5.5 mW/K.

Recommended Operating Conditions(1)

TA= 25°C –40°C to 85°C –40°C to 125°C UNIT

MIN MAX MIN MAX MIN MAX

Operating 1.65 3.6 1.65 3.6 1.65 3.6

VCC Supply voltage V

Data retention only 1.5 1.5 1.5

VCC = 1.65 V to 1.95 V 0.65 × VCC 0.65 × VCC 0.65 × VCC

High-level

VIH VCC = 2.3 V to 2.7 V 1.7 1.7 1.7 V

input voltage VCC = 2.7 V to 3.6 V 2 2 2

VCC = 1.65 V to 1.95 V 0.35 × VCC 0.35 × VCC 0.35 × VCC

Low-level

VIL VCC = 2.3 V to 2.7 V 0.7 0.7 0.7 V

input voltage VCC = 2.7 V to 3.6 V 0.8 0.8 0.8

VIInput voltage 0 5.5 0 5.5 0 5.5 V

VOOutput voltage 0 VCC 0 VCC 0 VCC V

VCC = 1.65 V –4 –4 –4

VCC = 2.3 V –8 –8 –8

High-level

IOH mA

output current VCC = 2.7 V –12 –12 –12

VCC = 3 V –24 –24 –24

VCC = 1.65 V 4 4 4

VCC = 2.3 V 8 8 8

Low-level

IOL mA

output current VCC = 2.7 V 12 12 12

VCC = 3 V 24 24 24

Δt/Δv Input transition rise or fall rate 8 8 8 ns/V

(1) All unused inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report,

Implications of Slow or Floating CMOS Inputs, literature number SCBA004.

Product Folder Link(s): SN74LVC125A

SN74LVC125A

SCAS290P –JANUARY 1993–REVISED OCTOBER 2010

www.ti.com

Electrical Characteristics

over recommended operating free-air temperature range (unless otherwise noted)

TA= 25°C –40°C to 85°C –40°C to 125°C

PARAMETER TEST CONDITIONS VCC UNIT

MIN TYP MAX MIN MAX MIN MAX

IOH = –100 mA 1.65 V to 3.6 V VCC – 0.2 VCC – 0.2 VCC – 0.3

IOH = –4 mA 1.65 V 1.29 1.2 1.05

IOH = –8 mA 2.3 V 1.9 1.7 1.55

VOH V

2.7 V 2.2 2.2 2.05

IOH = –12 mA 3 V 2.4 2.4 2.25

IOH = –24 mA 3 V 2.3 2.2 2

IOL = 100 mA 1.65 V to 3.6 V 0.1 0.2 0.3

IOL = 4 mA 1.65 V 0.24 0.45 0.6

VOL IOL = 8 mA 2.3 V 0.3 0.7 0.75 V

IOL = 12 mA 2.7 V 0.4 0.4 0.6

IOL = 24 mA 3 V 0.55 0.55 0.8

IIVI= 5.5 V or GND 3.6 V ±1 ±5 ±20 mA

IOZ VO= VCC or GND 3.6 V ±1 ±10 ±20 mA

ICC VI= VCC or GND, IO= 0 3.6 V 1 10 40 mA

One input at VCC – 0.6 V,

ΔICC Other inputs at VCC or 2.7 V to 3.6 V 500 500 5000 mA

GND

CiVI= VCC or GND 3.3 V 5 pF

Switching Characteristics

over recommended operating free-air temperature range (unless otherwise noted) (see Figure 1)

TA= 25°C –40°C to 85°C –40°C to 125°C

FROM TO

PARAMETER VCC UNIT

(INPUT) (OUTPUT) MIN TYP MAX MIN MAX MIN MAX

1.8 V ± 0.15 V 1 4.5 11.8 1 12.3 1 13.8

2.5 V ± 0.2 V 1 2.7 5.8 1 6.3 1 8.4

tpd A Y ns

2.7 V 1 3 5.3 1 5.5 1 7

3.3 V ± 0.3 V 1 2.5 4.6 1 4.8 1 6

1.8 V ± 0.15 V 1 4.3 13.8 1 14.3 1 15.8

2.5 V ± 0.2 V 1 2.7 6.9 1 7.4 1 9.5

ten OE Y ns

2.7 V 1 3.3 6.4 1 6.6 1 8.5

3.3 V ± 0.3 V 1 2.4 5.2 1 5.4 1 7

1.8 V ± 0.15 V 1 4.3 10.6 1 11.1 1 12.6

2.5 V ± 0.2 V 1 2.2 5.1 1 5.6 1 7.7

tdis OE Y ns

2.7 V 1 2.5 4.8 1 5 1 6.5

3.3 V ± 0.3 V 1 2.4 4.4 1 4.6 1 6

tsk(o) 3.3 V ± 0.3 V 1 1.5 ns

Operating Characteristics

TA= 25°C TEST

PARAMETER VCC TYP UNIT

CONDITIONS

1.8 V 7.4

Cpd Power dissipation capacitance per gate f = 10 MHz 2.5 V 11.3 pF

3.3 V 15

Product Folder Link(s): SN74LVC125A

tsu

From Output

Under Test

(see Note A)

LOAD CIRCUIT

S1 VLOAD

Open

GND

Data Input

Timing Input VI

0 V

Input

VOLTAGE WAVEFORMS

SETUP AND HOLD TIMES

VOLTAGE WAVEFORMS

PROPAGATION DELAY TIMES

INVERTING AND NONINVERTING OUTPUTS

VOLTAGE WAVEFORMS

PULSE DURATION

tPLH

tPHL

tPLH

VOH

VOL

0 V

Input

Output

Waveform 1

S1 at VLOAD

(see Note B)

Output

Waveform 2

S1 at GND

(see Note B)

VOL

VOH

tPZL

tPZH

tPLZ

tPHZ

VLOAD/2

0 V

VOL + V∆

VOH - V∆≈0 V

VOLTAGE WAVEFORMS

ENABLE AND DISABLE TIMES

LOW- AND HIGH-LEVEL ENABLING

Output

tPLH/tPHL

tPLZ/tPZL

tPHZ/tPZH

Open

VLOAD

GND

TEST S1

NOTES: A. CL includes probe and jig capacitance.

B. Waveform 1 is for an output with internal conditions such that the output is low, except when disabled by the output control.

Waveform 2 is for an output with internal conditions such that the output is high, except when disabled by the output control.

C. All input pulses are supplied by generators having the following characteristics: PRR ≤ 10 MHz, ZO = 50 Ω.

D. The outputs are measured one at a time, with one transition per measurement.

E. tPLZ and tPHZ are the same as tdis.

F. tPZL and tPZH are the same as ten.

G. tPLH and tPHL are the same as tpd.

H. All parameters and waveforms are not applicable to all devices.

Output

Control

VMVM

1.8 V ± 0.15 V

2.5 V ± 0.2 V

2.7 V

3.3 V ± 0.3 V

1 kΩ

500 Ω

VCC RL

2 × VCC

6 V

VLOAD CL

30 pF

50 pF

0.15 V

0.3 V

V∆

VCC

2.7 V

VCC/2

1.5 V

tr/tf

≤2 ns

≤2.5 ns

INPUTS

SN74LVC125A

www.ti.com

SCAS290P –JANUARY 1993–REVISED OCTOBER 2010

PARAMETER MEASUREMENT INFORMATION

Figure 1. Load Circuit and Voltage Waveforms

Product Folder Link(s): SN74LVC125A

PACKAGE OPTION ADDENDUM

www.ti.com 7-Oct-2010

Addendum-Page 1

PACKAGING INFORMATION

Orderable Device Status (1) Package Type Package

Drawing Pins Package Qty Eco Plan (2) Lead/

Ball Finish MSL Peak Temp (3) Samples

(Requires Login)

SN74LVC125AD ACTIVE SOIC D 14 50 Green (RoHS

& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Purchase Samples

SN74LVC125ADBLE OBSOLETE SSOP DB 14 TBD Call TI Call TI Samples Not Available

SN74LVC125ADBR ACTIVE SSOP DB 14 2000 Green (RoHS

& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Contact TI Distributor

or Sales Office

SN74LVC125ADBRG4 ACTIVE SSOP DB 14 2000 Green (RoHS

& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Contact TI Distributor

or Sales Office

SN74LVC125ADE4 ACTIVE SOIC D 14 50 Green (RoHS

& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Purchase Samples

SN74LVC125ADG4 ACTIVE SOIC D 14 50 Green (RoHS

& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Purchase Samples

SN74LVC125ADR ACTIVE SOIC D 14 2500 Green (RoHS

& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Contact TI Distributor

or Sales Office

SN74LVC125ADRE4 ACTIVE SOIC D 14 2500 Green (RoHS

& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Contact TI Distributor

or Sales Office

SN74LVC125ADRG3 ACTIVE SOIC D 14 2500 Green (RoHS

& no Sb/Br) CU SN Level-1-260C-UNLIM Request Free Samples

SN74LVC125ADRG4 ACTIVE SOIC D 14 2500 Green (RoHS

& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Contact TI Distributor

or Sales Office

SN74LVC125ADT ACTIVE SOIC D 14 250 Green (RoHS

& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Purchase Samples

SN74LVC125ADTE4 ACTIVE SOIC D 14 250 Green (RoHS

& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Purchase Samples

SN74LVC125ADTG4 ACTIVE SOIC D 14 250 Green (RoHS

& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Purchase Samples

SN74LVC125ANSR ACTIVE SO NS 14 2000 Green (RoHS

& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Contact TI Distributor

or Sales Office

SN74LVC125ANSRE4 ACTIVE SO NS 14 2000 Green (RoHS

& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Contact TI Distributor

or Sales Office

SN74LVC125ANSRG4 ACTIVE SO NS 14 2000 Green (RoHS

& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Contact TI Distributor

or Sales Office

SN74LVC125APW ACTIVE TSSOP PW 14 90 Green (RoHS

& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Purchase Samples

PACKAGE OPTION ADDENDUM

www.ti.com 7-Oct-2010

Addendum-Page 2

Orderable Device Status (1) Package Type Package

Drawing Pins Package Qty Eco Plan (2) Lead/

Ball Finish MSL Peak Temp (3) Samples

(Requires Login)

SN74LVC125APWE4 ACTIVE TSSOP PW 14 90 Green (RoHS

& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Purchase Samples

SN74LVC125APWG4 ACTIVE TSSOP PW 14 90 Green (RoHS

& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Purchase Samples

SN74LVC125APWLE OBSOLETE TSSOP PW 14 TBD Call TI Call TI Samples Not Available

SN74LVC125APWR ACTIVE TSSOP PW 14 2000 Green (RoHS

& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Contact TI Distributor

or Sales Office

SN74LVC125APWRE4 ACTIVE TSSOP PW 14 2000 Green (RoHS

& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Contact TI Distributor

or Sales Office

SN74LVC125APWRG3 ACTIVE TSSOP PW 14 2000 Green (RoHS

& no Sb/Br) CU SN Level-1-260C-UNLIM Request Free Samples

SN74LVC125APWRG4 ACTIVE TSSOP PW 14 2000 Green (RoHS

& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Contact TI Distributor

or Sales Office

SN74LVC125APWT ACTIVE TSSOP PW 14 250 Green (RoHS

& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Purchase Samples

SN74LVC125APWTE4 ACTIVE TSSOP PW 14 250 Green (RoHS

& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Purchase Samples

SN74LVC125APWTG4 ACTIVE TSSOP PW 14 250 Green (RoHS

& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Purchase Samples

SN74LVC125ARGYR ACTIVE VQFN RGY 14 3000 Green (RoHS

& no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR Request Free Samples

SN74LVC125ARGYRG4 ACTIVE VQFN RGY 14 3000 Green (RoHS

& no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR Request Free Samples

(1) The marketing status values are defined as follows:

ACTIVE: Product device recommended for new designs.

LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.

NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.

PREVIEW: Device has been announced but is not in production. Samples may or may not be available.

OBSOLETE: TI has discontinued the production of the device.

(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability

information and additional product content details.

TBD: The Pb-Free/Green conversion plan has not been defined.

Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that

lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.

Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between

the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.

PACKAGE OPTION ADDENDUM

www.ti.com 7-Oct-2010

Addendum-Page 3

Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight

in homogeneous material)

(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.

Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information

provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and

continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.

TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.

In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.

OTHER QUALIFIED VERSIONS OF SN74LVC125A :

•Automotive: SN74LVC125A-Q1

•Enhanced Product: SN74LVC125A-EP

NOTE: Qualified Version Definitions:

•Automotive - Q100 devices qualified for high-reliability automotive applications targeting zero defects

•Enhanced Product - Supports Defense, Aerospace and Medical Applications

TAPE AND REEL INFORMATION

*All dimensions are nominal

Device Package

Type Package

Drawing Pins SPQ Reel

Diameter

(mm)

Reel

Width

W1 (mm)

(mm) B0

(mm) K0

(mm) P1

(mm) W

(mm) Pin1

Quadrant

SN74LVC125ADBR SSOP DB 14 2000 330.0 16.4 8.2 6.6 2.5 12.0 16.0 Q1

SN74LVC125ADR SOIC D 14 2500 330.0 16.4 6.5 9.0 2.1 8.0 16.0 Q1

SN74LVC125ADRG4 SOIC D 14 2500 330.0 16.4 6.5 9.0 2.1 8.0 16.0 Q1

SN74LVC125ADT SOIC D 14 250 330.0 16.4 6.5 9.0 2.1 8.0 16.0 Q1

SN74LVC125ANSR SO NS 14 2000 330.0 16.4 8.2 10.5 2.5 12.0 16.0 Q1

SN74LVC125APWR TSSOP PW 14 2000 330.0 12.4 7.0 5.6 1.6 8.0 12.0 Q1

SN74LVC125APWR TSSOP PW 14 2000 330.0 12.4 6.9 5.6 1.6 8.0 12.0 Q1

SN74LVC125APWRG3 TSSOP PW 14 2000 330.0 12.4 7.0 5.6 1.6 8.0 12.0 Q1

SN74LVC125APWRG4 TSSOP PW 14 2000 330.0 12.4 6.9 5.6 1.6 8.0 12.0 Q1

SN74LVC125APWT TSSOP PW 14 250 330.0 12.4 6.9 5.6 1.6 8.0 12.0 Q1

SN74LVC125ARGYR VQFN RGY 14 3000 330.0 12.4 3.75 3.75 1.15 8.0 12.0 Q1

PACKAGE MATERIALS INFORMATION

www.ti.com 14-Jul-2012

Pack Materials-Page 1

*All dimensions are nominal

Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)

SN74LVC125ADBR SSOP DB 14 2000 367.0 367.0 38.0

SN74LVC125ADR SOIC D 14 2500 333.2 345.9 28.6

SN74LVC125ADR SOIC D 14 2500 367.0 367.0 38.0

SN74LVC125ADRG4 SOIC D 14 2500 367.0 367.0 38.0

SN74LVC125ADT SOIC D 14 250 367.0 367.0 38.0

SN74LVC125ANSR SO NS 14 2000 367.0 367.0 38.0

SN74LVC125APWR TSSOP PW 14 2000 364.0 364.0 27.0

SN74LVC125APWR TSSOP PW 14 2000 367.0 367.0 35.0

SN74LVC125APWRG3 TSSOP PW 14 2000 364.0 364.0 27.0

SN74LVC125APWRG4 TSSOP PW 14 2000 367.0 367.0 35.0

SN74LVC125APWT TSSOP PW 14 250 367.0 367.0 35.0

SN74LVC125ARGYR VQFN RGY 14 3000 367.0 367.0 35.0

PACKAGE MATERIALS INFORMATION

www.ti.com 14-Jul-2012

Pack Materials-Page 2

MECHANICAL DATA

MSSO002E – JANUARY 1995 – REVISED DECEMBER 2001

POST OFFICE BOX 655303 • DALLAS, TEXAS 75265

DB (R-PDSO-G**) PLASTIC SMALL-OUTLINE

4040065 /E 12/01

28 PINS SHOWN

Gage Plane

8,20

7,40

0,55

0,95

0,25

12,90

12,30

10,50

8,50

Seating Plane

9,907,90

10,50

9,90

0,38

5,60

5,00

0,22

2016

6,50

0,05 MIN

5,905,90

DIM

A MAX

A MIN

PINS **

2,00 MAX

6,90

7,50

0,65 M

0,15

0°–ā8°

0,10

0,09

0,25

NOTES: A. All linear dimensions are in millimeters.

B. This drawing is subject to change without notice.

C. Body dimensions do not include mold flash or protrusion not to exceed 0,15.

D. Falls within JEDEC MO-150

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regulatory requirements in connection with such use.

TI has specifically designated certain components which meet ISO/TS16949 requirements, mainly for automotive use. Components which

have not been so designated are neither designed nor intended for automotive use; and TI will not be responsible for any failure of such

components to meet such requirements.

Products Applications

Audio www.ti.com/audio Automotive and Transportation www.ti.com/automotive

Amplifiers amplifier.ti.com Communications and Telecom www.ti.com/communications

Data Converters dataconverter.ti.com Computers and Peripherals www.ti.com/computers

DLP® Products www.dlp.com Consumer Electronics www.ti.com/consumer-apps

DSP dsp.ti.com Energy and Lighting www.ti.com/energy

Clocks and Timers www.ti.com/clocks Industrial www.ti.com/industrial

Interface interface.ti.com Medical www.ti.com/medical

Logic logic.ti.com Security www.ti.com/security

Power Mgmt power.ti.com Space, Avionics and Defense www.ti.com/space-avionics-defense

Microcontrollers microcontroller.ti.com Video and Imaging www.ti.com/video

RFID www.ti-rfid.com

OMAP Mobile Processors www.ti.com/omap TI E2E Community e2e.ti.com

Wireless Connectivity www.ti.com/wirelessconnectivity

Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265