Microwave Ceramics and Modules Filter
2-Pol Filter for WLL B69842N3487A185
Data Sheet
ISSUE DATE 05.07.04 ISSUE P1 PUBLISHER SAW MWC PD PAGE 1/4
Features
zSMD filter consisting of coupled resonators with stepped impedances
zMgTiO3-CaTiO3 (εr = 21 / TCf =0±10 ppm/K) with a coating of copper (10µm) and tin (>5µm)
zExcellent reflow solderability, no migration effect due to copper/tin metallization
z ESD insensitivity and ESD protecting due to filter characteristics
Index
Page 2 Component drawing
Recommended footprint
Page 3 Characteristics
Maximum ratings
Typical passband characteristic
Page 4 Processing information
Soldering requirements
Delivery mode
Microwave Ceramics and Modules Filter
2-Pol Filter for WLL B69842N3487A185
Data Sheet
ISSUE DATE 05.07.04 ISSUE P1 PUBLISHER SAW MWC PD PAGE 2/4
Component drawing
Recommended footprint
View from below onto the solder terminals and view from
solder pads
ground area below solder resist with vias
to second ground layer
connected to lines with an impedance of
50 Ohm
FR4 material
permitivity : 4.4
preferred thickness : 0.3
Vias: Ø0.3mm / mm²
For other thickness
correlation might be necessary
Microwave Ceramics and Modules Filter
2-Pol Filter for WLL B69842N3487A185
Data Sheet
ISSUE DATE 05.07.04 ISSUE P1 PUBLISHER SAW MWC PD PAGE 3/4
Characteristics
min. typ. max.
Center frequency fc- 3487.5 - MHz
Insertion loss αIL 0.8 1.6 dB
Passband B185 MHz
Amplitude ripple (peak - peak) ∆α 0.4 1.0 dB
Standing wave ratio SWR 1.7 2.0
Impedance Z50
A
ttenuation α
at 3100 MHz
at 3242 MHz
at 3875 MHz
27
10
9
33
14
10
dB
dB
dB
Maximum ratings
IEC climatic category (IEC 68-1) - 40/+ 90/56
Operating temperature Top -30 / +85 °C
Typical passband characteristic
-60
-50
-40
-30
-20
-10
0
2000 2200 2400 2600 2800 3000 3200 3400 3600 3800 4000 4200 4400
frequency [MHz]
attenuation [dB]
S11
S21
Microwave Ceramics and Modules Filter
2-Pol Filter for WLL B69842N3487A185
Data Sheet
ISSUE DATE 05.07.04 ISSUE P1 PUBLISHER SAW MWC PD PAGE 4/4
Processing information
zWettability acc. to IEC 68-2-58: 75% (after aging)
Soldering Requirements
Profile for eutectic
SnPb solder paste
Profile for leadfree
solder paste
Soldering type reflow reflow
Maximum solderin
g
tem
p
erature 235
(
max. 2 sec.
)
260
(
max. 2 sec.
)
°C
(measuring point on top surface of the component) 225 (max. 10 sec.) 250 (max. 10 sec.) °C
Recommended soldering conditions (infrared):
20-40 sec.
40-80 sec.
within 10 sec.
Time [sec.]
Temp. [°C]
215°C±10°C
30 sec.
2-3 min.
within 10 sec.
Time [sec.]
Temp. [°C]
245°C±5°C
2.5 °C/s > - 5 °C/s
Delivery mode
zBlister tape acc. to IEC 286-3, polyester, grey
z Pieces/tape: 3000
EPCOS AG 2001. All Rights Reserved. Reproduction, publication and dissemination of this data sheet, enclosures hereto and the
information contained therein without EPCOS' prior express consent is prohibited.
The information contained in this data sheet describes the type of component and shall not be considered as guaranteed characteristics.
Purchase orders are subject to the General Conditions for the Supply of Products and Services of the Electrical and Electronics Industry
recommended by the ZVEI (German Electrical and Electronic Manufacturers
'
Association), unless otherwise agreed.