FEATURES DESCRIPTION APPLICATIONS
• Low noise
• Red enhanced
• High shunt resistance
• High response
SYMBOL PARAMETER MIN MAX UNITS
VBR Reverse Voltage 75 V
TSTG Storage Temperature -55 +150 °C
TO Operating Temperature -40 +125 °C
TS Soldering Temperature*
+240 °C
SYMBOL CHARACTERISTIC TEST CONDITIONS MIN TYP MAX UNITS
ID Dark Current VR = 50V 35 147 nA
VR = 0V, f = 1 MHz 82
CJ Junction Capacitance VR = 50V, f = 1 MHz 10 pF
lrange Spectral Application Range Spot Scan 350 1100 nm
R Responsivity l= 900nm, VR = 0 V 0.50 0.55 A/W
VBR Breakdown Voltage I = 10 μA 75 V
NEP Noise Equivalent Power VR = 5V @ l=950nm 2.0 x10-13 W/ √ Hz
RL = 50 Ω,VR = 0 V 190
tr Response Time** RL = 50 Ω,VR = 50 V 8 nS
SPECTRAL RESPONSE
0.00
0.10
0.20
0.30
0.40
0.50
0.60
0.70
250
300
350
400
450
500
550
600
650
700
750
800
850
900
950
1000
1050
1100
1150
Wavelength (nm)
Responsiv ity (A /W)
SD 172-11-31-221
PACKAGE DIMENSIONS INCH
[
mm
]
TO-5 PACKAGE
The SD 172-11-31-221 is an ultra low capacitance
silicon PIN photodiode, red enhanced, packaged in a
leaded hermetic TO-5 metal package.
• Military
• Industrial
• Medical
* 1/16 inch from case for 3 seconds max.
ELECTRO
-
OPTICAL CHARACTERISTICS RATING
(TA)
=
2
3
°
C UNLESS OTHERWISE NOTED
**Response time of 10% to 90% is specified at 660nm wavelength light.
Information in this technical datasheet is believed to be correct and reliable. However, no responsibility is assumed for possible inaccuracies or omission. Specifications are
subject to change without notice.
ABSOLUTE MAXIMUM RATING
(TA)
=
2
3
°
C UNLESS OTHERWISE NOTED
CHIP DIMENSIONS INCH [mm]
PACKAGE DIMENSIONS INCH [mm]
CHIP DIMENSIONS INCH [mm]
TO-5 PACKAGE
1 ANODE
SCHEMATIC
2 CASE GROUND
3 CATHODE
45°
1
2
3
Ø.200 [5.08]
PIN CIRCLE
3X Ø.018 [0.46]
3X .500 [12.7] MIN
.157 [3.99]
.169 [4.29]
.010 [0.25] MAX
GLASS ABOVE CAP
TOP EDGE
79°
VIEWING
ANGLE
Ø.256 [6.50]
Ø.264 [6.70]
Ø .362 [9.19]
Ø .357 [9.07]
Ø.320 [8.13]
Ø.330 [8.38]
.201 [5.11]
.142 [3.61] .126 [3.20] ACTIVE AREA
.185 [4.70] ACTIVE AREA
.090 [2.29]
Red Enhanced Ultra Low Capacitance Silicon Photodiode
www.lasercomponents.com Issue: 08/06 / V1 / HW / api/si-pin/red-enhanced-hp/ sd172-11-31-221.pdf
Germany and other countries: LASER COMPONENTS GmbH, Phone: +49 8142 2864 0, Fax: +49 8142 2864 11, info@lasercomponents.com
Great Britain: LASER COMPONENTS (UK) Ltd., Phone: +44 1245 491 499, Fax: +44 1245 491 801, info@lasercomponents.co.uk
