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LMX9838

SNOSAZ9F –JULY 2007–REVISED DECEMBER 2014

LMX9838 Bluetooth Serial Port Module

1 Features 3 Description

The Texas Instruments LMX9838 Bluetooth Serial

1• Complete Bluetooth®2.0 Stack Including Port module is a fully integrated Bluetooth 2.0

– Baseband and Link Manager baseband controller, 2.4 GHz radio, crystal, antenna,

– Protocols: L2CAP, RFCOMM, SDP LDO and discreets; combined to form a complete

small form factor (10 mm x 17 mm x 2.0 mm)

– Profiles: GAP, SDAP, SPP Bluetooth node.

• High Integration: Includes Processor, Antenna, All hardware and firmware is included to provide a

Crystal, EEPROM, LDO complete solution from antenna through the complete

• Supporting up to 7 Active Bluetooth Data Links lower and upper layers of the Bluetooth stack, up to

and 1 Active SCO Link the application including the Generic Access Profile

• Class 2 Operation (GAP), the Service Discovery Application Profile

(SDAP), and the Serial Port Profile (SPP). The

• UART Command/Data Port Speed 921.6kbits/s module includes a configurable service database to

• AAI for External PCM Codec fulfil service requests for additional profiles on the

• Better than -80dBm Input Sensitivity host. Moreover, the LMX9838 is qualified as a

• FCC, IC, CE, and Japan MIC Certified Bluetooth endproduct, ready to be used in the end

application without additional testing and license cost.

• Bluetooth SIG QD ID: B012394

• Compact Size: 10 mm x 17 mm x 2.0 mm Based on TI’s CompactRISC 16-bit processor

architecture and Digital Smart Radio technology, the

LMX9838 is optimized to handle the data and link

2 Applications management processing requirements of a Bluetooth

• Factory Automation and Control node.

• Test and Measurement Device Information(1)

• Telematics PART NUMBER PACKAGE BODY SIZE (NOM)

• POS Terminals LMX9838 PLGA (70) 17.00 mm × 10.00 mm

• Medical/Telemedicine (1) For all available packages, see the orderable addendum at

• Data Logging Systems the end of the data sheet.

• Audio Gateways

4 Block Diagram

An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,

intellectual property matters and other important disclaimers. PRODUCTION DATA.

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Table of Contents

8.3 Feature Description................................................... 9

1 Features.................................................................. 18.4 Device Functional Modes........................................ 17

2 Applications ........................................................... 18.5 Programming - Command Interface........................ 21

3 Description............................................................. 19 Application and Implementation ........................ 26

4 Block Diagram........................................................ 19.1 Typical Applications ............................................... 26

5 Revision History..................................................... 210 Power Supply Recommendations ..................... 31

6 Pin Configuration and Functions......................... 310.1 Power Supply Schematics ................................... 31

7 Specifications......................................................... 510.2 Filtered Power Supply........................................... 33

7.1 Absolute Maximum Ratings ...................................... 510.3 Power Up .............................................................. 33

7.2 Handling Ratings ...................................................... 511 Regulatory Compliance...................................... 35

7.3 Recommended Operating Conditions....................... 511.1 FCC Instructions ................................................... 35

7.4 Thermal Information.................................................. 512 Device and Documentation Support ................. 38

7.5 Power Supply Requirements .................................... 612.1 Device Support .................................................... 38

7.6 Digital DC Characteristics ........................................ 612.2 Documentation Support ....................................... 38

7.7 RF Receiver Performance Characteristics................ 712.3 Trademarks........................................................... 38

7.8 RF Transmitter Performance Characteristics............ 712.4 Electrostatic Discharge Caution............................ 38

7.9 RF Synthesizer Performance Characteristics........... 812.5 Glossary................................................................ 38

8 Detailed Description.............................................. 913 Mechanical, Packaging, and Orderable

8.1 Overview................................................................... 9Information........................................................... 38

8.2 Functional Block Diagram......................................... 9

5 Revision History

NOTE: Page numbers for previous revisions may differ from page numbers in the current version.

Changes from Revision E (January 2014) to Revision F Page

• Added Handling Rating table, Feature Description section, Device Functional Modes, Application and

Implementation section, Power Supply Recommendations section, Layout section, Device and Documentation

Support section, and Mechanical, Packaging, and Orderable Information section ............................................................... 1

• Changed EN 301 489-17 v1.2.1 to EN 301 489-17 v2.2.1................................................................................................... 35

Changes from Revision D (April 2013) to Revision E Page

• Added two parameters for operating conditions..................................................................................................................... 5

• Changed schematic.............................................................................................................................................................. 28

Changes from Revision C (April 2013) to Revision D Page

• Changed layout of National Data Sheet to TI format ........................................................................................................... 36

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6 Pin Configuration and Functions

PLGA NAW0070A Package

70 Pins

Top View

Pin Functions

PAD NAME PAD LOCATION I/O DEFAULT LAYOUT DESCRIPTION

SYSTEM INTERFACE SIGNALS

OP3 16 I OP3: Pin checked during Startup Sequence for configuration option

OP4: I OP4: Pin checked during Startup Sequence for configuration option

OP4/PG4 26 PG4: I/O PG4: GPIO

OP5 25 I/O OP5: Pin checked during Startup Sequence for configuration option

32K- 28 O NC (if not used) 32.768 kHz Crystal Oscillator

32K+ 27 I GND (if not used) 32.768 kHz Crystal Oscillator

UART Interface Signals

CTS#(1) 15 I GND (if not used) Host Serial Port Clear To Send (active low)

RTS#(2) 14 O NC (if not used) Host Serial Port Request To Send (active low)

RXD 12 I Host Serial Port Receive Data

TXD 13 O Host Serial Port Transmit Data

AUXILIARY PORTS INTERFACE SIGNALS

PG6 7 I/O GPIO - Default setup LINK STATUS indication

PG7 19 I/O GPIO - Default setup RF traffic LED indication

Low active, either

RESET# 2 I NC or connect to Module Reset (active low)

host

XOSCEN 8 O Host main Clock Request. Toggles with Main crystal (X1) enable/disable

AUDIO INTERFACE SIGNALS

SCLK 20 I/O Audio PCM Interface Clock

SFS 21 I/O Audio PCM Interface Frame Synchronization

SRD 23 I Audio PCM Interface Receive Data Input

STD 22 O Audio PCM Interface Transmit Data Output

(1) Connect to GND if CTS is not use.

(2) Treat As No Connect If RTS is not used. Pad required for mechanical stability.

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Pin Functions (continued)

PAD NAME PAD LOCATION I/O DEFAULT LAYOUT DESCRIPTION

POWER, GROUND AND NO CONNECT SIGNALS

3, 4, 17, 18, 24,

GND I GND Must be connected to ground plane

29, 30, 31, 32

MVCC 6 I Module internal Voltage Regulator Input

1, 5, 33, 34, 35,

NC NC Place Pads for stability.

36, 37, 38, 39, 40

41, 42, 43, 44,

45, 46, 47, 48,

49, 50, 51, 52,

53, 54, 55, 56,

NC NC DO NOT PLACE ANY PADS.

57, 58, 59, 60,

61, 62, 63, 64,

65, 66, 67, 68,

69, 70

VCC_CORE 9 I/O Voltage Regulator Input/Output

VCC 10 I Voltage Regulator Input Baseband

VCC_IO 11 I Power Supply I/O

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7 Specifications

7.1 Absolute Maximum Ratings(1)

The following conditions are true unless otherwise stated in the tables: TA= –40°C to +85°C. VCC = 3.3 V. RF system

performance specifications are ensured on Texas Instruments Flagstaff board rev 2.1 evaluation platform.

MIN MAX UNIT

VCC Digital Voltage Regulator input -0.2 4 V

VIVoltage on any pad with GND = 0 V -0.2 VCC + 0.2 V

Lead Temperature NOPB(2)(3)

TLNOPB 250 °C

(solder 40 sec.)

(1) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for

which the device is intended to be functional. This device is a high performance RF integrated circuit and is ESD sensitive. Handling and

assembly of this device should be performed at ESD free workstations.

(2) Reference IPC/JDEC J-STD-20C spec.

(3) NOPB = No Pb (No Lead).

7.2 Handling Ratings MIN MAX UNIT

Tstg Storage temperature range –65 150 °C

Human body model (HBM), per ANSI/ESDA/JEDEC JS-001, all 2000

pins(1)

V(ESD) Electrostatic discharge V

Charged device model (CDM), per JEDEC specification 1000

JESD22-C101, all pins(2)

ESDMM ESD - Machine Model 200(3) V

(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

(3) All pins meet 200V Macine Model ESD rating except pins RXD, TXD, CTS, RTS, PG4, OP5, PG6, PG7, SCL, SDA, MDOD1, MWCS,

SFS, STD, SRD RATED AT 150v.

7.3 Recommended Operating Conditions MIN NOM MAX UNIT

MVCC Module internal Voltage Regulator input 3.0 3.3 3.6 V

VCC Digital Voltage Regulator input 2.5 3.3 3.6 V

TRDigital Voltage Regulator Rise Time 10 μs

Ambient Operating Temperature Range

TA-40 +25 +85 °C

Fully Functional Bluetooth Node

VCC_IO(1) Supply Voltage Digital I/O 1.8 3.3 3.6 V

VCC_CORE Supply Voltage Output(2) 1.8 V

VCC_COREMAX Supply Voltage Output Max Load 5 mA

VCC_CORESHORT When used as Supply Input (VCC grounded) 1.6 1.8 2 V

(1) VCC must be > (VCC_IO - 0.5V) to avoid backdrive supply.

(2) Should not be used for external supplies

7.4 Thermal Information LMX9838

THERMAL METRIC(1) NAW UNIT

70 PINS

RθJA Junction-to-ambient thermal resistance 45 °C/W

(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.

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7.5 Power Supply Requirements(1)(2)

PARAMETER MIN TYP(3) MAX UNIT

ICC-TX Power supply current for continuous transmit 65 mA

ICC-RX Power supply current for continuous receive 65 mA

IRXSL Receive Data in SPP Link, Slave 26 mA

IRXM Receive Data in SPP Link, Master 23 mA

ISnM Sniff Mode, Sniff interval 1 second 6.5 mA

ISC-TLDIS Scanning, No Active Link, TL Disabled 1.1 mA

(1) Power supply requirements based on Class II output power.

(2) Based on UART Baudrate 115.2kbit/s.

(3) VCC = 3.3 V, Ambient Temperature = +25 °C.

7.6 Digital DC Characteristics

PARAMETER TEST CONDITIONS MIN MAX UNIT

Logical 1 Input Voltage high 1.8 V ≤VCC_IO ≤3.0 V 0.7 x VCC_IO VCC_IO + 0.2

VIH V

(except oscillator I/O) 3.0 V ≤VCC_IO ≤3.6 V 2.0 VCC_IO + 0.2

Logical 0 Input Voltage low 1.8 V ≤VCC_IO ≤3.0 V -0.2 0.25 x VCC_IO

VIL V

(except oscillator I/O) 3.0 V ≤VCC_IO ≤3.6 V -0.2 0.8

Logical 1 Output Voltage high VCC_IO = 1.8 V 0.7 x VCC_IO

VOH V

(except oscillator I/O) VCC_IO = 3.0 V 2.4

Logical 0 Output Voltage low

VOL 0.4 V

(except oscillator I/O)

VHYS Hysteresis Loop Width(1) 0.1 x VCC V

IIH Logical 1 Input leakage High 10 µA

IIL Logical 0 Input leakage Low -10 µA

IOH Logical 1 Output Current VOH = 2.4 V, VCC_IO = 3.0 V -10 mA

IOL Logical 0 Output Current VOH = 0.4 V, VCC_IO = 3.0 V 10 mA

(1) Specified by design.

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7.7 RF Receiver Performance Characteristics

All tests performed are based on Bluetooth Test Specification revision 2.0. All tests are measured at antenna port unless

otherwise specified. TA= –40°C to +85°C--VDD_RF = 2.8 V unless otherwise specified. RF system performance specifications

are ensured on Texas Instruments Flagstaff board rev 2.1 evaluation platform. All RF parameters are tested prior to the

antenna. PARAMETER TEST CONDITIONS MIN TYP(1) MAX UNIT

2.402 GHz -80 -76 dBm

RXsense Receive Sensitivity BER < 0.001 2.441 GHz -80 -76 dBm

2.480 GHz -80 -76 dBm

PinRF Maximum Input Level -10 0 dBm

F1= + 3 MHz,

IMP(2) Intermodulation Performance F2= + 6 MHz, -38 -36 dBm

PinRF = -64 dBm

RSSI Dynamic Range at LNA

RSSI -72 -52 dBm

Input PinRF = -10 dBm,

30 MHz < FCWI < 2 GHz, -10 dBm

BER < 0.001

PinRF = -27 dBm,

2000 MHz < FCWI < 2399 MHz, -27 dBm

BER < 0.001

Out Of Band Blocking

OOB(2) Performance PinRF = -27 dBm,

2498 MHz < FCWI < 3000 MHz, -27 dBm

BER < 0.001

PinRF = -10 dBm,

3000 MHz < FCWI < 12.75 GHz, -10 dBm

BER < 0.001

(1) Typical operating conditions are at 2.75V operating voltage and 25°C ambient temperature.

(2) The f0= -64 dBm Bluetooth modulated signal, f1= -39dbm sine wave, f2= -39 dBm Bluetooth modulated signal, f0= 2f1- f2, and |f2- f1|

= n * 1MHz, where n is 3, 4, or 5. For the typical case, n = 3.

7.8 RF Transmitter Performance Characteristics

All tests performed are based on Bluetooth Test Specification revision 2.0. All tests are measured at antenna port unless

otherwise specified. TA= -40°C to +85°C--VDD_RF = 2.8V unless otherwise specified. RF system performance specifications

are ensured on Texas Instruments Flagstaff board rev 2.1 evaluation platform. All RF parameters are tested prior to the

antenna. PARAMETER TEST CONDITIONS MIN TYP(1) MAX UNIT

2.402 GHz −4 0 +3 dBm

POUTRF Transmit Output Power 2.441 GHz −4 0 +3 dBm

2.480 GHz −4 0 +3 dBm

MOD ΔF1AVG Modulation Characteristics Data = 00001111 140 165 175 kHz

MOD ΔF2MAX(2) Modulation Characteristics Data = 10101010 115 125 kHz

ΔF2AVG/DF1AVG(3) Modulation Characteristics 0.8

20 dB Bandwidth 1000 kHz

Maximum gain setting:

POUT2*fo(4) PA 2nd Harmonic Suppression f0= 2402 MHz, -30 dBm

Pout = 4804 MHz

RF Output Impedance/Input

ZRFOUT(5) Pout @ 2.5 GHz 47 Ω

Impedance of RF Port (RF_inout)

(1) Typical operating conditions are at 2.75V operating voltage and 25°C ambient temperature.

(2) ΔF2max ≥115 kHz for at least 99.9% of all Δf2max.

(3) Modulation index set between 0.28 and 0.35.

(4) Out-of-Band spurs only exist at 2nd and 3rd harmonics of the CW frequency for each channel.

(5) Not tested in production.

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7.9 RF Synthesizer Performance Characteristics

All tests performed are based on Bluetooth Test Specification revision 2.0. All tests are measured at antenna port unless

otherwise specified. TA= -40°C to +85°C. VDD_RF = 2.8V unless otherwise specified. RF system performance specifications

are ensured on Texas Instruments Flagstaff board rev 2.1 evaluation platform. All RF parameters are tested prior to the

antenna. PARAMETER TEST CONDITIONS MIN TYP MAX UNIT

fVCO VCO Frequency Range 2402 2480 MHz

tLOCK Lock Time f0± 20 kHz 120 µs

Initial Carrier Frequency

Δf0offset(1) During preamble -75 0 75 kHz

Tolerance DH1 data packet -25 0 25 kHz

DH3 data packet -40 0 40 kHz

Δf0drift(1) Initial Carrier Frequency Drift DH5 data packet -40 0 40 kHz

Drift Rate -20 0 20 kHz/50µs

tD- Tx Transmitter Delay Time From Tx data to antenna 4 µs

(1) Frequency accuracy is dependent on crystal oscillator chosen. The crystal must have a cumulative accuracy of < ±20ppm to meet

Bluetooth specifications.

Product Folder Links: LMX9838

GPIO

UART

POR

LFO

32 kHz

Config

Options

Audio

Port

CVSD

Codecs

Combined

System and

Patch RAM

ROM

EPROM

Voltage

Regulator

XTAL

Compact RISC

Processor

BLUEtoothTM

Core

2.4 GHz

Radio

Antenna Link

Manager UART

Transport

PG6

PG7

TXD

RXD

RTS#

CTS#

RESET#

OP3

OP4/PG4

OP5

SCLK

STD

SRD

32k+

32k-

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8 Detailed Description

8.1 Overview

LMX9838 is a fully certified Bluetooth 2.0 module, with integrated processor, radio, antenna, LDO, crystal, and

passive components to form a small form factor plug-n-play solution. The built-in Bluetooth stacks up to the

application layer allows users to communicate directly with SPP commands, and develop additional SPP-based

Bluetooth profiles on Host through UART interface.

8.2 Functional Block Diagram

8.3 Feature Description

8.3.1 Features Overview

The firmware supplied in the on-chip ROM memory offers a complete Bluetooth (v2.0) stack including profiles

and command interface. This firmware features point-to-point and point-to-multipoint link management supporting

data rates up to the theoretical maximum over RFComm of 704 kbps. The internal memory supports up to 7

active Bluetooth data links and one active SCO link.

The on-chip Patch RAM provided for lowest cost and risk, allows the flexibility of firmware upgrade.

The module is lead free and RoHS (Restriction of Hazardous Substances) compliant.

For more information on those quality standards, please visit our green compliance website at

http://focus.ti.com/quality/docs/qualityhome.tsp.

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Feature Description (continued)

8.3.2 Hardware

• Baseband and Link Management Processors based on TI's CompactRISC Core

• Embedded ROM and Patch RAM Memory

• Auxiliary Host Interface Ports:

– Link Status

– Transceiver Status (Tx or Rx)

• Advanced Power Management (APM) Features

• Supports Low-Power Mode with Optional 32.768 kHz Oscillator

• Full Radio Path Integrated Including Antenna

• On-Chip Reference Crystal for Bluetooth Operation

• Single Supply Voltage

8.3.3 Firmware

• Additional Profile Support on Host. e.g:

– Dial Up Networking (DUN)

– Facsimile Profile (FAX)

– File Transfer Protocol (FTP)

– Object Push Profile (OPP)

– Synchronization Profile (SYNC)

– Headset (HSP)

– Handsfree Profile (HFP)

– Basic Imaging Profile (BIP)

– Basic Printing Profile (BPP)

• On-Chip Application Including:

– Default Connections

– Command Interface:

– Link Setup and Configuration (also Multipoint)

– Configuration of the Module

– Service Database Modifications

– UART Transparent Mode

– Optimized Cable Replacement:

– Automatic Transparent Mode

– Event Filter

8.3.4 Compliance

• FCC compliance: The device complies with Part 15 of FCC Rules. Operation is subject to the following two

conditions:

– This device may not cause harmful interference

– This device must accept any interference received, including interference that may cause undesired

operation

• Compliant with IC for Canada, CE for Europe, and MIC for Japan. See Regulatory Compliance.

8.3.5 Package

• Complete system interface provided in Lead Grid Array on underside for surface mount assembly

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Feature Description (continued)

8.3.6 Baseband and Link Management Processors

Baseband and Lower Link control functions are implemented using a combination of Texas Instruments'

CompactRISC 16-bit processor and the Bluetooth Lower Link Controller. These processors operate from

integrated ROM memory and RAM and execute on-board firmware implementing all Bluetooth functions.

8.3.7 Bluetooth Lower Link Controller

The integrated Bluetooth Lower Link Controller (LLC) complies with the Bluetooth Specification version 2.0 and

implements the following functions:

• Adaptive Frequency Hopping

• Interlaced Scanning

• Fast Connect

• Support for 1, 3, and 5 slot packet types

• 79 Channel hop frequency generation circuitry

• Fast frequency hopping at 1600 hops per second

• Power management control

• Access code correlation and slot timing recovery

8.3.8 Bluetooth Upper Layer Stack

The integrated upper layer stack is prequalified and includes the following protocol layers:

• L2CAP

• RFComm

• SDP

8.3.9 Profile Support

The on-chip application of the LMX9838 allows full stand-alone operation, without any Bluetooth protocol layer

necessary outside the module. It supports the Generic Access Profile (GAP), the Service Discovery Application

Profile (SDAP), and the Serial Port Profile (SPP).

The on-chip profiles can be used as interfaces to additional profiles executed on the host. The LMX9838 includes

a configurable service database to answer requests with the profiles supported.

8.3.10 Application With Command Interface

The module supports automatic slave operation eliminating the need for an external control unit. The

implemented transparent option enables the chip to handle incoming data raw, without the need for packaging in

a special format. The device uses a pin to block unallowed connections. This pincode can be fixed or

dynamically set.

Acting as master, the application offers a simple but versatile command interface for standard Bluetooth

operation like inquiry, service discovery, or serial port connection. The firmware supports up to seven slaves.

Default Link Policy settings and a specific master mode allow optimized configuration for the application specific

requirements. See the Integrated Firmware section.

8.3.11 Memory

The LMX9838 introduces 16 kB of combined system and Patch RAM memory that can be used for data and/or

code upgrades of the ROM based firmware. Due to the flexible startup used for the LMX9838 operating

parameters like the Bluetooth Device Address (BD_ADDR) are defined during boot time. This allows reading out

the parameters of an internal EEPROM or programming them directly over UART.

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Feature Description (continued)

8.3.12 Transport Port - UART

The LMX9838 provides one Universal Asynchronous Receiver Transmitter (UART). The UART interface consists

out of Receive (RX), Transmit (TX), Ready-to-Send (RTS) and Clear-to-Send signals. RTS and CTS are used for

hardware handshaking between the host and the LMX9838. Since the LMX9838 acts as gateway between the

bluetooth and the UART interface, Texas Instruments recommends to use the handshaking signals especially for

transparent operation. In case two signals are used CTS needs to be pulled to GND. Refer to LMX9838 Software

User’s Guide, literature number SNOA498 for detailed information on 2-wire operation.

The UART interface supports formats of 8-bit data with or without parity, with one or two stop bits. It can operate

at standard baud rates from 2400bits/s up to a maximum baud rate of 921.6kbits/s. DMA transfers are supported

to allow for fast processor independent receive and transmit operation.

The UART baudrate is configured during startup by checking option pins OP3, OP4 and OP5. Table 2 gives the

correspondence between the OP pins settings and the UART speed.

The UART offers wakeup from the power save modes via the multi-input wakeup module. When the LMX9838 is

in low power mode, RTS# and CTS# can function as Host_WakeUp and Bluetooth_WakeUp respectively.

Table 1 represents the operational modes supported by the firmware for implementing the transport via the

UART.

Table 1. UART Operation Modes

ITEM RANGE DEFAULT at POWER-UP

Baud Rate 2.4 to 921.6 kbits/s Either configured by option pins, NVS

Flow Control RTS#/CTS# or None RTS#/CTS#

Parity Odd, Even, None None

Stop Bits 1,2 1

Data Bits 8 8

OP3, OP4, OP5 can be strapped to the host logic 0 and 1 levels to set the host interface boot-up configuration.

Alternatively all OP3, OP4, OP5 can be hardwired over 1k Ohm pullup/pulldown resistors. See Table 2.

Table 2. UART Frequency Settings

OP3(1) OP4(2) OP5(3) FUNCTION

1 0 0 UART speed read from NVS

1 0 1 UART speed 9.6 kbps

1 1 0 UART speed 115.2 kbps

1 1 1 UART speed 921.6 kbps

(1) If OP3 is 1, must use 1K pull up

(2) If OP4 is 1, must use 1K pull up

(3) If OP5 is 1, must use 1K pull up

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8.3.13 Audio Port

8.3.13.1 Advanced Audio Interface

The Advanced Audio Interface (AAI) is an advanced version of the Synchronous Serial Interface (SSI) that

provides a full-duplex communications port to a variety of industry-standard 13/14/15/16-bit linear or 8-bit log

PCM codecs, DSPs, and other serial audio devices.

The interface allows the support one codec or interface. The firmware selects the desired audio path and

interface configuration by a parameter that is located in RAM (imported from non-volatile storage or programmed

during boot-up). The audio path options include the OKI MSM7717 codec, the Winbond W681360/W681310

codecs and the PCM slave through the AAI.

In case an external codec or DSP is used the LMX9838 audio interface generates the necessary bit and frame

clock driving the interface.

Table 3 summarizes the audio path selection and the configuration of the audio interface at the specific modes.

The LMX9838 supports one SCO link.

Table 3. Audio Path Configuration

AAI FRAME AAI FRAME SYNC

AUDIO SETTING INTERFACE FORMAT AAI BIT CLOCK CLOCK PULSE LENGTH

OKI MSM7717 8-bit log PCM

Advanced audio interface 520 kHz 8 kHz 14 Bits

(a-law only)

Winbond W681310 8-bit log PCM

Advanced audio interface 520 kHz 8 kHz 14 Bits

A-law and u-law

Winbond W681360 Advanced audio interface 13-bit linear 520 kHz 8 kHz 13 Bits

PCM slave(1) Advanced audio interface 8/16 bits 128 - 1024 kHz 8 kHz 8/16 Bits

(1) In PCM slave mode, parameters are stored in NVS. Bit clock and frame clock must be generated by the host interface.

8.3.13.1.1 PCM Slave Configuration Example

PCM slave uses the slot 0, 1 slot per frame, 16 bit linear mode, long frame sync, normal frame sync. In this case,

0x03E0 should be stored in NVS. See LMX9838 Software User’s Guide, literature number SNOA498 for more

details.

8.3.14 Auxiliary Ports

8.3.14.1 RESET#

The RESET# is active low and will put radio and baseband into reset.

8.3.15 Digital Smart Radio

8.3.15.1 General Purpose I/Os

The LMX9838 device offers 3 pins which either can be used as indication and configuration pins or can be used

for General Purpose functionality. The selection is made out of settings derived out of the power up sequence.

In General Purpose configuration the pins are controlled hardware specific commands giving the ability to set the

direction, set them to high or low or enable a weak pull-up.

In alternate function the pins have pre-defined indication functionality. Please see Table 4 for a description on the

alternate indication functionality.

Table 4. Alternate GPIO Pin Configuration

PIN DESCRIPTION

Operation Mode pin to configure

OP4/PG4 Transport Layer settings during boot-up

PG6 GPIO - Link Status indication

PG7 RF Traffic indication

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8.3.16 Functional Architecture

The integrated Digital Smart Radio utilizes a heterodyne receiver architecture with a low intermediate frequency

(2 MHz) such that the intermediate frequency filters can be integrated on chip. The receiver consists of a low-

noise amplifier (LNA) followed by two mixers. The intermediate frequency signal processing blocks consist of a

poly-phase bandpass filter (BPF), two hard-limiters (LIM), a frequency discriminator (DET), and a post-detection

filter (PDF). The received signal level is detected by a received signal strength indicator (RSSI).

The received frequency equals the local oscillator frequency (fLO) plus the intermediate frequency (fIF):

fRF = fLO + fIF (supradyne).

The radio includes a synthesizer consisting of a phase detector, a charge pump, an (off-chip) loop-filter, an RF-

frequency divider, and a voltage controlled oscillator (VCO).

The transmitter utilizes IQ-modulation with bit-stream data that is gaussian filtered. Other blocks included in the

transmitter are a VCO buffer and a power amplifier (PA).

8.3.17 Receiver Front-End

The receiver front-end consists of a low-noise amplifier (LNA) followed by two mixers and two low-pass filters for

the I- and Q-channels.

The intermediate frequency (IF) part of the receiver front-end consists of two IF amplifiers that receive input

signals from the mixers, delivering balanced I- and Q-signals to the poly-phase bandpass filter. The poly-phase

bandpass filter is directly followed by two hard-limiters that together generate an AD-converted RSSI signal.

8.3.18 Poly-Phase Bandpass Filter

The purpose of the IF bandpass filter is to reject noise and spurious (mainly adjacent channel) interference that

would otherwise enter the hard limiting stage. In addition, it takes care of the image rejection.

The bandpass filter uses both the I- and Q-signals from the mixers. The out-of-band suppression should be

higher than 40 dB (f<1 MHz, f>3 MHz). The bandpass filter is tuned over process spread and temperature

variations by the autotuner circuitry. A 5th order Butterworth filter is used.

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8.3.19 Hard-Limiter and RSSI

The I- and Q-outputs of the bandpass filter are each followed by a hard-limiter. The hard-limiter has its own

reference current. The RSSI (Received Signal Strength Indicator) measures the level of the RF input signal.

The RSSI is generated by piece-wise linear approximation of the level of the RF signal. The RSSI has a mV/dB

scale, and an analog-to-digital converter for processing by the baseband circuit. The input RF power is converted

to a 5-bit value. The RSSI value is then proportional to the input power (in dBm).

The digital output from the ADC is sampled on the BPKTCTL signal low-to-high transition.

8.3.20 Receiver Back-End

The hard-limiters are followed by a two frequency discriminators. The I-frequency discriminator uses the 90×

phase-shifted signal from the Q-path, while the Q-discriminator uses the 90× phase-shifted signal from the I-path.

A poly-phase bandpass filter performs the required phase shifting. The output signals of the I- and Q-

discriminator are substracted and filtered by a low-pass filter. An equalizer is added to improve the eye-pattern

for 101010 patterns.

After equalization, a dynamic AFC (automatic frequency offset compensation) circuit and slicer extract the

RX_DATA from the analog data pattern. It is expected that the Eb/No of the demodulator is approximately 17 dB.

8.3.21 Frequency Discriminator

The frequency discriminator gets its input signals from the limiter. A defined signal level (independent of the

power supply voltage) is needed to obtain the input signal. Both inputs of the frequency discriminator have

limiting circuits to optimize performance. The bandpass filter in the frequency discriminator is tuned by the

autotuning circuitry.

8.3.22 Post-Detection Filter and Equalizer

The output signals of the FM discriminator first go through a post-detection filter and then through an equalizer.

Both the post-detection filter and equalizer are tuned to the proper frequency by the autotuning circuitry. The

post-detection filter is a low-pass filter intended to suppress all remaining spurious signals, such as the second

harmonic (4 MHz) from the FM detector and noise generated after the limiter.

The post-detection filter also helps for attenuating the first adjacent channel signal. The equalizer improves the

eye-opening for 101010 patterns. The post-detection filter is a third order Butterworth filter.

8.3.23 Autotuning Circuitry

The autotuning circuitry is used for tuning the bandpass filter, the detector, the post-detection filter, the equalizer,

and the transmit filters for process and temperature variations. The circuit also includes an offset compensation

for the FM detector.

8.3.24 Synthesizer

The synthesizer consists of a phase-frequency detector, a charge pump, a low-pass loop filter, a programmable

frequency divider, a voltage-controlled oscillator (VCO), a delta-sigma modulator, and a lookup table.

The frequency divider consists of a divide-by-2 circuit (divides the 5 GHz signal from the VCO down to 2.5 GHz),

a divide-by-8-or-9 divider, and a digital modulus control. The delta-sigma modulator controls the division ratio and

also generates an input channel value to the lookup table.

8.3.25 Phase-Frequency Detector

The phase-frequency detector is a 5-state phase-detector. It responds only to transitions, hence phase-error is

independent of input waveform duty cycle or amplitude variations. Loop lockup occurs when all the negative

transitions on the inputs, F_REF and F_MOD, coincide. Both outputs (i.e., Up and Down) then remain high. This

is equal to the zero error mode. The phase-frequency detector input frequency range operates at 12 MHz.

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8.3.26 Transmitter Circuitry

The transmitter consists of ROM tables, two Digital to Analog (DA) converters, two low-pass filters, IQ mixers,

and a power amplifier (PA).

The ROM tables generate a digital IQ signal based on the transmit data. The output of the ROM tables is

inserted into IQ-DA converters and filtered through two low-pass filters. The two signal components are mixed up

to 2.5 GHz by the TX mixers and added together before being inserted into the transmit PA.

8.3.27 IQ-DA Converters and TX Mixers

The ROM output signals drive an I- and a Q-DA converter. Two Butterworth low-pass filters filter the DA output

signals. The 6 MHz clock for the DA converters and the logic circuitry around the ROM tables are derived from

the autotuner.

The TX mixers mix the balanced I- and Q-signals up to 2.4-2.5 GHz. The output signals of the I- and Q-mixers

are summed.

8.3.28 32 kHz Oscillator

An oscillator is provided (see Figure 1) that is tuned to provide optimum performance and low-power

consumption while operating with a 32.768 kHz crystal. An external crystal clock network is required between the

32k+ clock input (pad 27) and the 32k- clock output (pad 28) signals.The oscillator is built in a Pierce

configuration and uses two external capacitors. Table 5 provides the oscillator’s specifications.

In case the 32kHz is not used, it is recommended to leave 32k- open and connect 32k+ to GND.

Figure 1. 32.768 kHz Oscillator

Table 5. 32.768 kHz Oscillator Specifications

PARAMETER CONDITION MIN TYP MAX UNIT

VDD Supply Voltage 1.62 1.8 1.98 V

IDDACT Supply Current (Active) 2 µA

f Nominal Output Frequency 32.768 kHz

VPPOSC Oscillating Amplitude 1.8 V

Duty Cycle 40% — 60%

8.3.29 Integrated Firmware

The LMX9838 device includes the full Bluetooth stack up to RFComm to support the following profiles:

• GAP (Generic Access Profile)

• SDAP (Service Discovery Application Profile)

• SPP (Serial Port Profile)

Figure 2 shows the Bluetooth protocol stack with command interpreter interface. The command interpreter offers

a number of different commands to support the functionality given by the different profiles. Execution and

interface timing is handled by the control application.

The chip has an internal data area in RAM that includes the parameters shown in Table 6.

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Figure 2. LMX9838 Software Implementation

8.4 Device Functional Modes

8.4.1 Operation Modes

On boot-up, the application configures the module following the parameters in the data area.

8.4.1.1 Automatic Operation

8.4.1.1.1 No Default Connections Stored:

In Automatic Operation the module is connectable and discoverable and automatically answers to service

requests. The command interpreter listens to commands and links can be set up. The full command list is

supported.

If connected by another device, the module sends an event back to the host, where the RFComm port has been

connected, and switches to transparent mode.

8.4.1.1.2 Default Connections Stored

If default connections were stored on a previous session, once the LMX9838 is reset, it will attempt to connect

each device stored within the data RAM three times. The host will be notified about the success of the link setup

via a link status event.

8.4.1.1.3 Non-Automatic Operation

In Non-Automatic Operation, the LMX9838 does not check the default connections section within the Data RAM.

If connected by another device, it will NOT switch to transparent mode and continue to interpret data sent on the

UART.

8.4.1.1.4 Transparent Mode

The LMX9838 supports transparent data communication from the UART interface to a bluetooth link.

If activated, the module does not interpret the commands on the UART which normally are used to configure and

control the module. The packages don’t need to be formatted as described in Table 8. Instead all data are

directly passed through the firmware to the active bluetooth link and the remote device.

Transparent mode can only be supported on a point-to-point connection. To leave Transparent mode, the host

must send a UART_BREAK signal to the module.

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Device Functional Modes (continued)

8.4.1.1.5 Force Master Mode

In Force Master mode tries to act like an access point for multiple connections. For this it will only accept the link

if a Master/slave role switch is accepted by the connecting device. After successful link establishment the

LMX9838 will be Master and available for additional incoming links. On the first incoming link the LMX9838 will

switch to transparent depending on the setting for automatic or command mode. Additional links will only be

possible if the device is not in transparent mode.

8.4.2 Default Connections

The LMX9838 device supports the storage of up to 3 devices within its NVS. Those connections can either be

connected after reset or on demand using a specific command.

8.4.3 Event Filter

The LMX9838 uses events or indicators to notify the host about successful commands or changes at the

bluetooth interface. Depending on the application the LMX9838 can be configured. The following levels are

defined:

• No Events:

– The LMX9838 is not reporting any events. Optimized for passive cable replacement solutions.

• Standard LMX9838 events:

– Only necessary events will be reported.

• All events:

– Additional to the standard all changes at the physical layer will be reported.

8.4.4 Default Link Policy

Each Bluetooth Link can be configured to support M/S role switch, Hold Mode, Sniff Mode and Park Mode. The

default link policy defines the standard setting for incoming and outgoing connections.

8.4.5 Audio Support

The LMX9838 offers commands to establish and release synchronous connections (SCO) to support Headset or

Handsfree applications. The firmware supports one active link with all available package types (HV1, HV2, HV3),

routing the audio data between the bluetooth link and the advanced audio interface. In order to provide the

analog data interface, an external audio codec is required. The LMX9838 includes a list of codecs which can be

used.

Table 6. Operation Parameters Stored in LMX9838

PARAMETER DEFAULT VALUE DESCRIPTION

BDADDR Preprogrammed by TI Bluetooth device address

Local Name Serial port device

PinCode 0000 Bluetooth PinCode

Operation Mode Automatic ON Automatic mode ON or OFF

Default Connections 0 Up to seven default devices to connect to

1 SPP entry:

Name: COM1

SDP Database Service discovery database, control for supported profiles

Authentication and encryption

enabled

UART Speed 9600 Sets the speed of the physical UART interface to the host

UART Settings 1 Stop bit, parity disabled Parity and stop bits on the hardware UART interface

Ports to Open 0000 0001 Defines the RFComm ports to open

Link Keys No link keys Link keys for paired devices

Security Mode 2 Security mode

Page Scan Mode Connectable Connectable/Not connectable for other devices

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Device Functional Modes (continued)

Table 6. Operation Parameters Stored in LMX9838 (continued)

PARAMETER DEFAULT VALUE DESCRIPTION

Discoverable/Not Discoverable/Limited Discoverable for other

Inquiry Scan Mode Discoverable devices

Configures modes allowed for incoming or outgoing connections

Default Link Policy All modes allowed (Role switch, Hold mode, Sniff mode...)

The Default Link Timeout configures the timeout, after which the link

Default Link Timeout 20 seconds is assumed lost, if no packages have been received from the remote

device

Defines the level of reporting on the UART

- no events

Event Filter Standard LMX9838 events reported - standard events

- standard including ACL link events

Configures the settings for the external codec and the air format.

• Codecs:

- Winbond W681360

- OKI MSM7717 / Winbond W681310

Default Audio Settings none - PCM Slave

• Air Format:

- CVSD

- µ-Law

- A-Law

8.4.6 Low Power Modes

The LMX9838 supports different Low Power Modes to reduce power in different operating situations. The

modular structure of the LMX9838 allows the firmware to power down unused modules.

The Low power modes have influence on:

• UART transport layer

– enabling or disabling the interface

• Bluetooth Baseband activity

– firmware disables LLC and Radio if possible

8.4.6.1 Power Modes

The following LMX9838 power modes, which depend on the activity level of the UART transport layer and the

radio activity are defined:

The radio activity level mainly depends on application requirements and is defined by standard bluetooth

operations like inquiry/page scanning or an active link.

A remote device establishing or disconnecting a link may also indirectly change the radio activity level.

The UART transport layer by default is enabled on device power up. In order to disable the transport layer the

command “Disable Transport Layer” is used. Thus only the Host side command interface can disable the

transport layer. Enabling the transport layer is controlled by the HW Wakeup signalling. This can be done from

either the Host or the LMX9838. See the LMX9838 Software User’s Guide, literature number SNOA498 for

detailed information on timing and implementation requirements.

Table 7. Power Mode Activity

POWER MODE UART ACTIVITY RADIO ACTIVITY REFERENCE CLOCK

PM0 OFF OFF none

PM1 ON OFF Main Clock

PM2 OFF Scanning Main Clock / 32.768 kHz

PM3 ON Scanning Main Clock

PM4 OFF SPP Link Main Clock

PM5 ON SPP Link Main Clock

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Figure 3. Transition Between Different Hardware Power Modes

8.4.7 Enabling and Disabling UART Transport

8.4.7.1 Hardware Wake-up Functionality

In certain usage scenarios the host is able to switch off the transport layer of the LMX9838 in order to reduce

power consumption. Afterwards both devices, host and LMX9838 are able to shut down their UART interfaces.

In order to save system connections the UART interface is reconfigured to hardware wake-up functionality. For a

detailed timing and command functionality, see the LMX9838 Software User’s Guide, AN-1699 literature number

SNOA498. The interface between host and LMX9838 is defined as described in Figure 4.

Figure 4. UART NULL Modem Connection

8.4.7.2 Disabling the UART Transport Layer

The Host can disable the UART transport layer by sending the “Disable Transport Layer” Command. The

LMX9838 will empty its buffers, send the confirmation event and disable its UART interface. Afterwards the

UART interface will be reconfigured to wake up on a falling edge of the CTS pin.

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8.4.7.3 LMX9838 Enabling The UART Interface

As the Transport Layer can be disabled in any situation the LMX9838 must first make sure the transport layer is

enabled before sending data to the host. Possible scenarios can be incoming data or incoming link indicators. If

the UART is not enabled the LMX9838 assumes that the Host is sleeping and waking it up by activating RTS. To

be able to react on that Wake up, the host has to monitor the CTS pin.

As soon as the host activates its RTS pin, the LMX9838 will first send a confirmation event and then start to

transmit the events.

8.4.7.4 Enabling the UART Transport Layer From The Host

If the host needs to send data or commands to the LMX9838 while the UART Transport Layer is disabled it must

first assume that the LMX9838 is sleeping and wake it up using its RTS signal. When the LMX9838 detects the

Wake-Up signal it activates the UART HW and acknowledges the Wake-Up signal by settings its RTS.

Additionally the Wake up will be confirmed by a confirmation event. When the Host has received this “Transport

Layer Enabled” event, the LMX9838 is ready to receive commands.

8.5 Programming - Command Interface

The LMX9838 offers Bluetooth functionality in either a self contained slave functionality or over a simple

command interface. The interface is listening on the UART interface.

The following sections describe the protocol transported on the UART interface between the LMX9838 and the

host in command mode (see Figure 5). In Transparent mode, no data framing is necessary and the device does

not listen for commands.

8.5.1 Framing

The connection is considered “Error free”. But for packet recognition and synchronization, some framing is used.

All packets sent in both directions are constructed per the model shown in Table 8.

8.5.2 Start and End Delimiter

The “STX” char is used as start delimiter: STX = 0x02. ETX = 0x03 is used as end delimiter.

8.5.3 Packet Type ID

This byte identifies the type of packet. See Table 9 for details.

8.5.4 Opcode

The opcode identifies the command to execute. The opcode values can be found within the LMX9838 Software

User’s Guide included with the LMX9838 Evaluation Board.

8.5.5 Data Length

Number of bytes in the Packet Data field. The maximum size is defined with 333 data bytes per packet.

8.5.6 Checksum

This is a simple Block Check Character (BCC) checksum of the bytes “Packet type”, “Opcode” and “Data

Length”. The BCC checksum is calculated as low byte of the sum of all bytes (that is, if the sum of all bytes is

0x3724, the checksum is 0x24).

Figure 5. Bluetooth Functionality

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Programming - Command Interface (continued)

Table 8. Package Framing

START PACKET TYPE END

OPCODE DATA LENGTH CHECK SUM PACKET DATA

DELIMITER ID DELIMITER

1 Byte 1 Byte 1 Byte 2 Bytes 1 Byte <Data Length> Bytes 1 Byte

-------------Checksum-------------

Table 9. Packet Type Identification

ID DIRECTION DESCRIPTION

0x52 REQUEST A request sent to the Bluetooth module.

'R' (REQ) All requests are answered by exactly one confirm.

0x43 Confirm The Bluetooth modules confirm to a request.

'C' (CFM) All requests are answered by exactly one confirm.

0x69 Indication Information sent from the Bluetooth module that is not a direct confirm to a request.

'i' (IND) Indicating status changes, incoming links, or unrequested events.

0x72 Response An optional response to an indication.

'r' (RES) This is used to respond to some type of indication message.

8.5.7 Command Set Overview

The LMX9838 has a well defined command set to:

• Configure the device:

– Hardware settings

– Local Bluetooth parameters

– Service database

• Set up and handle links

Table 10 through Table 20 show the actual command set and the events coming back from the device. A full

documented description of the commands can be found in the LMX9838 Software User’s Guide, literature

number SNOA498.

Note: For standard Bluetooth operation only commands from Table 10 through Table 12 will be used. Most of the

remaining commands are for configuration purposes only.

Table 10. Device Discovery

COMMAND EVENT DESCRIPTION

Inquiry Complete Search for devices

Inquiry Device Found Lists BDADDR and class of device

Remote Device Name Remote Device Name Confirm Get name of remote device

Table 11. SDAP Client Commands

COMMAND EVENT DESCRIPTION

SDAP Connect SDAP Connect Confirm Create an SDP connection to remote device

SDAP Disconnect Confirm Disconnect an active SDAP link

SDAP Disconnect Connection Lost Notification for lost SDAP link

SDAP Service Browse Service Browse Confirm Get the services of the remote device

SDAP Service Search SDAP Service Search Confirm Search a specific service on a remote device

SDAP Attribute Request SDAP Attribute Request Confirm Searches for services with specific attributes

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Table 12. SPP Link Establishment

COMMAND EVENT DESCRIPTION

Establishing SPP Link Confirm Initiates link establishment to a remote device

Establish SPP Link Link Established Link successfully established

Incoming Link A remote device established a link to the local device

Set Link Timeout Set Link Timeout Confirm Confirms the Supervision Timeout for the existing Link

Get Link Timeout Get Link Timeout Confirm Get the Supervision Timeout for the existing Link

Release SPP Link Release SPP Link Confirm Initiate release of SPP link

SPP Send Data Confirm Send data to specific SPP port

SPP Send Data Incoming Data Incoming data from remote device

Transparent Mode Transparent Mode Confirm Switch to Transparent mode on the UART

Table 13. Storing Default Connections

COMMAND EVENT DESCRIPTION

Connect Default Connection Connect Default Connection Confirm Connects to either one or all stored default connections

Store Default Connection Store Default Connection Confirm Store device as default connection

Get list of Default Connections List of Default Devices

Delete Default Connections Delete Default Connections Confirm

Table 14. Bluetooth Low Power Modes

COMMAND EVENT DESCRIPTION

Set Default Link Policy Set Default Link Policy Confirm Defines the link policy used for any incoming or outgoing link

Get Default Link Policy Get Default Link Policy Confirm Returns the stored default link policy

Set Link Policy Set Link Policy Confirm Defines the modes allowed for a specific link

Get Link Policy Get Link Policy Confirm Returns the actual link policy for the link

Enter Sniff Mode Enter Sniff Mode Confirm

Exit Sniff Mode Exit Sniff Mode Confirm

Enter Hold Mode Enter Hold Mode Confirm

Power Save Mode Changed Remote device changed power save mode on the link

Table 15. Audio Control Commands

COMMAND EVENT DESCRIPTION

Establish SCO Link Establish SCO Link Confirm Establish SCO Link on existing RFComm Link

A remote device has established a SCO link to the local

SCO Link Established Indicator device

Release SCO Link Release SCO Link Confirm Release SCO Link Audio Control

SCO Link Released Indicator SCO Link has been released

Change SCO Packet Type Change SCO Packet Type Confirm Changes Packet Type for existing SCO link

SCO Packet Type changed indicator SCO Packet Type has been changed

Set Audio Settings Set Audio Settings Confirm Set Audio Settings for existing Link

Get Audio Settings Get Audio Settings Confirm Get Audio Settings for existing Link

Set Volume Set Volume Confirm Configure the volume

Get Volume Get Volume Confirm Get current volume setting

Mute Mute Confirm Mutes the microphone input

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Table 16. Wake Up Functionality

COMMAND EVENT DESCRIPTION

Disabling the UART Transport Layer and activates the

Disable Transport Layer Transport Layer Enabled Hardware Wakeup function

Table 17. SPP Port Configuration and Status

COMMAND EVENT DESCRIPTION

Set Port Config Set Port Config Confirm Set port setting for the virtual serial port link over the air

Get Port Config Confirm Read the actual port settings for a virtual serial port

Get Port Config Port Config Changed Notification if port settings were changed from remote device

SPP Get Port Status SPP Get Port Status Confirm Returns status of DTR, RTS (for the active RFComm link)

SPP Port Set DTR SPP Port Set DTR Confirm Sets the DTR bit on the specified link

SPP Port Set RTS SPP Port Set RTS Confirm Sets the RTS bit on the specified link

SPP Port BREAK SPP Port BREAK Indicates that the host has detected a break

SPP Port Overrun Error SPP Port Overrun Error Confirm Used to indicate that the host has detected an overrun error

SPP Port Parity Error SPP Port Parity Error Confirm Host has detected a parity error

SPP Port Framing Error SPP Port Framing Error Confirm Host has detected a framing error

Indicates that remote device has changed one of the port

SPP Port Status Changed status bits

Table 18. Local Bluetooth Settings

COMMAND EVENT DESCRIPTION

Read Local Name Read Local Name Confirm Read actual friendly name of the device

Write Local Name Write Local Name Confirm Set the friendly name of the device

Read Local BDADDR Read Local BDADDR Confirm

Change Local BDADDR Change Local BDADDR Confirm Note: The BDADDR is programmed by TI. It cannot be retrieved if erased!

Store Class of Device Store Class of Device Confirm

Set Scan Mode Set Scan Mode Confirm Change mode for discoverability and connectability

Set Scan Mode Indication Reports end of Automatic limited discoverable mode

Get Fixed Pin Get Fixed Pin Confirm Reads current PinCode stored within the device

Set Fixed Pin Set Fixed Pin Confirm Set the local PinCode

PIN request a PIN code is requested during authentication of an ACL link

Get Security Mode Get Security Mode Confirm Get actual Security mode

Set Security Mode Set Security Mode Confirm Configure Security mode for local device (default 2)

Remove Pairing Remove Pairing Confirm Remove pairing with a remote device

List Paired Devices List of Paired Devices Get list of paired devices stored in the LMX9838 data memory

Set Default Link Timeout Set Default Link Timeout Confirm Store default link supervision timeout

Get Default Link Timeout Get Default Link Timeout Confirm Get stored default link supervision timeout

Force Master Role Force Master Role Confirm Enables/Disables the request for master role at incoming connections

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Table 19. Local Service Database Configuration

COMMAND EVENT DESCRIPTION

Store generic SDP Record Store SDP Record Confirm Create a new service record within the service database

Enable SDP Record Enable SDP Record Confirm Enable or disable SDP records

Delete All SDP Records Delete All SDP Records Confirm

Ports to Open Ports to Open Confirmed Specify the RFComm Ports to open on startup

Table 20. Local Hardware Commands

COMMAND EVENT DESCRIPTION

Configure Default Settings for Audio Codec and Air Format,

Set Default Audio Settings Set Default Audio Settings Confirm stored in NVS

Get Default Audio Settings Get Default Audio Settings Confirm Get stored Default Audio Settings

Set Event Filter Set Event Filter Confirm Configures the reporting level of the command interface

Get Event Filter Get Event Filter Confirm Get the status of the reporting level

Read RSSI Read RSSI Confirm Returns an indicator for the incoming signal strength

Change UART Speed Change UART Speed Confirm Set specific UART speed; needs proper ISEL pin setting

Change UART Settings Change UART Settings Confirm Change configuration for parity and stop bits

Test Mode Test Mode Confirm Enable Bluetooth, EMI test, or local loopback

Restore Factory Settings Restore Factory Settings Confirm

Reset Dongle Ready Soft reset

Stops the bluetooth firmware and executes the In-system-

Firmware Upgrade programming code

Set Clock Frequency Set Clock Frequency Confirm Write Clock Frequency setting in the NVS

Get Clock Frequency Get Clock Frequency Confirm Read Clock Frequency setting from the NVS

Set PCM Slave Configuration Set PCM Slave Configuration Confirm Write the PCM Slave Configuration in the NVS

Write ROM Patch Write ROM Patch Confirm Store ROM Patch in the Simply Blue module

Read Memory Read Memory Confirm Read from the internal RAM

Write Memory Write Memory Confirm Write to the internal RAM

Read NVS Read NVS Confirm Read from the NVS (EEPROM)

Write NVS Write NVS Confirm Write to the NVS (EEPROM)

Table 21. Initialization Commands

COMMAND EVENT DESCRIPTION

Set Clock and Baudrate Set Clock and Baudrate Confirm Write Baseband frequency and Baudrate used

Enter Bluetooth Mode Enter Bluetooth Mode Confirm Request SimplyBlue module to enter BT mode

Set Clock and Baudrate Set Clock and Baudrate Confirm Write Baseband frequency and Baudrate used

Table 22. GPIO Control Commands

COMMAND EVENT DESCRIPTION

Set GPIO WPU Set GPIO WPU Confirm Enable/Disable weak pull up resistor on GPIOs

Get GPIO Input State Get GPIO Input States Confirm Read the status of the GPIOs

Set GPIO Direction Set GPIO Direction Confirm Set the GPIOs direction (Input, Ouput)

Set GPIO Output High Set GPIO Output High Confirm Set GPIOs Output to logical High

Set GPIO Output Low Set GPIO Output Low Confirm Set GPIOs Output to logical Low

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RTS

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TXD

RXD

CTS

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PG6

RESET#

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1 k:

PG7 OP3 OP4 OP5

22 pF

32.768 KHZ (OPTIONAL)

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9 Application and Implementation

NOTE

Information in the following applications sections is not part of the TI component

specification, and TI does not warrant its accuracy or completeness. TI’s customers are

responsible for determining suitability of components for their purposes. Customers should

validate and test their design implementation to confirm system functionality.

9.1 Typical Applications

The following diagrams show two application examples for LMX9838 implementations.

Figure 6 illustrates a cable replacement application, requiring the physical UART interface to a data device like a

sensor. The LMX9838 just waits for an incoming link and forwards data between the data device and the

bluetooth link. PG6 acts as active link indicator and is used to enable the data transfer from the sensor. A

32.768khz crystal may be is used to reduce power consumption while waiting for the incoming link.

Figure 7 shows an example for the connection to a host controller, which can include a simple application to

control the LMX9838. The figure also includes the connection to a PCM codec, in case the host controller

application includes an audio profile. Reset, OP4 and OP5 are controlled by the host for full control of the

LMX9838 status.

Refer to the Power Supply Schematics section for more detailed descriptions for LMX9838 designs.

Figure 6. Example For A Cable Replacement Application

Product Folder Links: LMX9838

SCLK SFS STD SRD

Audio Codec

Host

Controller

LMX9838

PG6 PG7 OP3

330:330:

1 k:

CTS

RTS

RXD

TXD

RESET#

OP5

OP4

RTS

CTS

TXD

RXD

GPIO1

GPIO2

GPIO3

LMX9838

www.ti.com

SNOSAZ9F –JULY 2007–REVISED DECEMBER 2014

Typical Applications (continued)

Figure 7. Example For Host Controller Based Application With Audio Support

Product Folder Links: LMX9838

VCC

PG7

PG6

OP5

OP4

OP3

OP4

VCC

OP3

VCC

OP5

SKQTLCE010

SMA FEMALE

C19

1 PF

TP8

RESET

C18

100 nF

2.2 PF

VCC_CORE C7

2.2 PF

100 nF

VCC

VCC_CORE

VCC

J10

VCC_CORE_IN

UART

C13

1 PF

C14

1 PF

C15

1 PF R15

R13

R16

R17

VCC

VCCVCCVCC

TP6

VIN

3+C11

1 PF

100 pF

BATTHOLDER

DC-015PBT

5V MAX

+ -

C17

1 PF

C16

1PF

330R

PG6 PG7

MAX3225

LP3965-3.3V

VOUT

BYPASS

GND

VIN

VEN

+C12

1 PF

100 nF

DB9 MALE

TP1TP2TP3TP4

TP5

R14

OR R18

R11

10k R12

10k

TXD

CTS#

RXD

RTS#

BAUD RATE SETTINGS

JUMPER 921K 115K NVS

SHORTSHORTSHORTJ1

OPENSHORTSHORTJ2

OPENOPENSHORTJ3

C1+

C1-

C2+

C2-

T_IN

R_OUT

FORCEON

FORCEOFF

VCC

T_OUT

R_IN

T_OUT

V+

V-

READY

GND

TP7

GND

1 2

RED

1 2

BLUE

R10

AUDIO

SCLK

STD

SFS

SRD

22 pF

32.768 kHz

VCC

22 pF

LMX9838

GND

PG7

PG6

OP5

OP4/PG4

OP3

32k-

32k+

SRD

STD

SFS

SCLK

CTS#

RTS#

TXD

RXD

VCC

VCC_IO

MVCC

XOSCEN

VCC_CORE

RESET#

INVALD

Network required if using external source.

Vcc_core open if using internal regulator.

Vcc grounded if Vcc_core using external source.

(for Vcc_core using external source, refer to figure 12)

(for Vcc_core using internal source, refer to figures 10 and 11)

LMX9838

SNOSAZ9F –JULY 2007–REVISED DECEMBER 2014

www.ti.com

9.1.1 Design Requirements

9.1.1.1 Evaluation Design

Product Folder Links: LMX9838

OVEN

210

260

250

250 220

220

200

180

180 170 160 150 140

170 160 150 140

210

260

250

250 220

220

200

180

180 170 160 150 140

170 160 150 140

62 cm / 62 min

LMX9838

www.ti.com

SNOSAZ9F –JULY 2007–REVISED DECEMBER 2014

9.1.1.2 Evaluation Design Reflow Profile:

Figure 8. Reflow Temperature Process

9.1.2 Detailed Design Procedure

9.1.2.1 Soldering

The LMX9838 bumps are designed to melt as part of the Surface Mount Assembly (SMA) process. In order to

ensure reflow of all solder bumps and maximum solder joint reliability while minimizing damage to the package,

recommended reflow profiles should be used.

Table 23,Table 24 and Figure 9 provide the soldering details required to properly solder the LMX9838 to

standard PCBs. The illustration serves only as a guide and TI is not liable if a selected profile does not work.

See IPC/JEDEC J-STD-020C, July 2004 for more information.

Table 23. Soldering Details

PARAMETER VALUE

PCB Land Pad Diameter 13 mil

PCB Solder Mask Opening 19 mil

PCB Finish (HASL details) Defined by customer or manufacturing facility

Stencil Aperture 17 mil

Stencil Thickness 5 mil

Solder Paste Used Defined by customer or manufacturing facility

Flux Cleaning Process Defined by customer or manufacturing facility

Reflow Profiles See Figure 9

Table 24. Classification Reflow Profiles(1)(2)

PROFILE FEATURE NOPB ASSEMBLY

Average Ramp-Up Rate (TsMAX to Tp) 3°C/second maximum

Preheat:

Temperature Min (TsMIN) 150°C

Temperature Max (TsMAX) 200°C

Time (tsMIN to tsMAX) 60 – 180 seconds

(1) See IPC/JEDEC J-STD-020C, July 2004.

(2) All temperatures refer to the top side of the package, measured on the package body surface.

Product Folder Links: LMX9838

LMX9838

SNOSAZ9F –JULY 2007–REVISED DECEMBER 2014

www.ti.com

Table 24. Classification Reflow Profiles(1)(2) (continued)

PROFILE FEATURE NOPB ASSEMBLY

Time maintained above:

Temperature (TL) 217°C

Time (tL) 60 – 150 seconds

Peak/Classification Temperature (Tp) 250 + 0°C

Time within 5°C of actual Peak Temperature (tp) 20 – 40 seconds

Ramp-Down Rate 6°C/second maximum

Time 25 °C to Peak Temperature 8 minutes maximum

Reflow Profiles See Figure 9

9.1.3 Application Performance Plots

Figure 9. Typical Reflow Profiles

Product Folder Links: LMX9838

MVCC MVCC 3.0V ~3.3V

VCC_IOVCC_COREVCC

Optional 32 kHz

If not used

-32k+ = GND

2.2 PF100 nF 2.2 PF2.2 PF100 nF

100 nF

1k 1k 1k

VCC_IO

Reset line connected to host

RXD

TXD

RTS

CTS

RESET#

OP3

OP4

OP5

LMX9838

32k+

32k-

SRD

STD

SFS

SCLK

32.768 kHz C1C2

MVCC

9 1110

-32k- = NC

All Common

GROUND

Reference

Table 5

For No Connects

Reference Table 5

Advanced Audio Interface

Connect to PCM codec

or leave open

For other baudrates

reference Table 7

Frequency Baud

Rate selector

Settings shown for

921600 BPS

UART System Bus

Connected to Host

LMX9838

www.ti.com

SNOSAZ9F –JULY 2007–REVISED DECEMBER 2014

10 Power Supply Recommendations

10.1 Power Supply Schematics

The different possibilities to power supply the LMX9838 depend on the IO interface logic level.

Figure 10 represents an example of system functional schematic for the LMX9838 using a 3.0V to 3.3V IO

interface.

Figure 11 represents an example of system functional schematic for the LMX9838 using a 2.5V to 3.0V IO

interface.

Figure 12 represents an example of system functional schematic for the LMX9838 using a 1.8V to 2.5V IO

interface.

Figure 13 represents an example of system functional schematic for the LMX9838 using a 1.8V IO interface.

10.1.1 Frequency and BAUDRATE Selection

Notes:

Capacitor values C1 and C2 may vary depending on design and crystal manufacturer specification.

Figure 10. 3.0 V to 3.3 V Example Functional System Schematic

Product Folder Links: LMX9838

3.0V+

VCC_IOVCC_COREVCC

Optional 32 kHz

If not used

-32k+ = GND

2.2 PF2.2 PF100 nF

100 nF

1k 1k 1k

VCC_IO

Reset line connected to host

RXD

TXD

RTS

CTS

RESET#

OP3

OP4

OP5

LMX9838

32k+

32k-

SRD

STD

SFS

SCLK

32.768 kHz C1C2

MVCC

9 1110

-32k- = NC

1.8V ~ 2.5V

1.8V

2.2 PF100 nF

All Common

GROUND

Reference

Table 5

For No Connects

Reference Table 5

Advanced Audio Interface

Connect to PCM codec

or leave open

For other baudrates

reference Table 7

Frequency Baud

Rate selector

Settings shown for

921600 BPS

UART System Bus

Connected to Host

VCC_IO 2.5V ~ 3.0V 3.0V+

MVCC

VCC_IOVCC_COREVCC

Optional 32 kHz

If not used

-32k+ = GND

-32k- = NC

2.2 PF100 nF 2.2 PF2.2 PF100 nF

100 nF

1k 1k 1k

VCC_IO

Reset line connected to host

RXD

TXD

RTS

CTS

RESET#

OP3

OP4

OP5

LMX9838

32k+

32k-

SRD

STD

SFS

SCLK

32.768 kHz C1C2

9 1110 6

All Common

GROUND

Reference

Table 5

For No Connects

Reference Table 5

Advanced Audio Interface

Connect to PCM codec

or leave open

For other baudrates

reference Table 7

Frequency Baud

Rate selector

Settings shown for

921600 BPS

UART System Bus

Connected to Host

LMX9838

SNOSAZ9F –JULY 2007–REVISED DECEMBER 2014

www.ti.com

Power Supply Schematics (continued)

Notes:

Capacitor values C1 and C2 may vary depending on design and crystal manufacturer specification.

MVCC can be connected to 3.0V and above in this configuration. Please see Recommended Operating Conditions.

Figure 11. 2.5 V to 3.0 V Example Functional System Schematic

Notes:

Capacitor values C1 and C2 may vary depending on design and crystal manufacturer specification.

MVCC can be connected to 3.0V and above in this configuration. Please see Recommended Operating Conditions.

Figure 12. 1.8 V to 2.5 V Example Functional System Schematic

Product Folder Links: LMX9838

3.0V+

VCC_IOVCC_COREVCC

Optional 32 kHz

If not used

-32k+ = GND

2.2 PF2.2 PF100 nF

100 nF

1k 1k 1k

VCC_IO

Reset line connected to host

RXD

TXD

RTS

CTS

RESET#

OP3

OP4

OP5

LMX9838

32k+

32k-

SRD

STD

SFS

SCLK

32.768 kHz C1C2

MVCC

9 1110

-32k- = NC

1.8V

2.2 PF100 nF 1.8V

All Common

GROUND

Reference

Table 5

For No Connects

Reference Table 5

Advanced Audio Interface

Connect to PCM codec

or leave open

For other baudrates

reference Table 7

Frequency Baud

Rate selector

Settings shown for

921600 BPS

UART System Bus

Connected to Host

LMX9838

www.ti.com

SNOSAZ9F –JULY 2007–REVISED DECEMBER 2014

Power Supply Schematics (continued)

Notes:

Capacitor values C1 and C2 may vary depending on design and crystal manufacturer specification.

MVCC can be connected to 3.0V and above in this configuration. Please see Recommended Operating Conditions.

Figure 13. 1.8 V Example Functional System Schematic

10.2 Filtered Power Supply

It is important to provide the LMX9838 with adequate ground planes and a filtered power supply. It is highly

recommended that a 2.2 μF and a 100 nF bypass capacitor be placed as close as possible to the power supply

pins VCC, MVCC, and VCC_IO.

10.3 Power Up

The LMX9838 contains an internal EEPROM initialized during power up or hardware reset. During this

initialization phase it is recommended not to:

• Send a command to the LMX9838: The command will be ignored.

• Power OFF/ON the LMX9838: The EEPROM initialization phase will be interrupted and the EEPROM will not

be recognized which leaves the device in a lockup situation.

• Issue a Hardware Reset: The EEPROM initialization phase will be interrupted and the EEPROM will not be

recognized which leaves the device in a lockup situation.

Once the initialization phase is completed the module sends the “SimplyBlue Ready Event” (refer to the

LMX9838 Software User's Guide, AN-1699 [SNOA498]) to declare its fully functional state.

It is therefore recommended to wait for the “SimplyBlue Ready Event” message before stating using the LM9838

by sending a command or issuing a Reset or Power On cycle.

Product Folder Links: LMX9838

LMX9838

SNOSAZ9F –JULY 2007–REVISED DECEMBER 2014

www.ti.com

Power Up (continued)

Figure 14. LMX9838 Power-Up Sequence

Product Folder Links: LMX9838

LMX9838

www.ti.com

SNOSAZ9F –JULY 2007–REVISED DECEMBER 2014

11 Regulatory Compliance

The LMX9838 has been tested and approved to be compliant to the following regulatory standards:

CE Compliance:

• EN 300 328 v1.8.1

• EN 301 489-17 v2.2.1

IC Compliance:

• IC-1520A-LMX9838

• RSS-GEN Issue 1

• RSS-210 Issue 7 Annex 8 and RSS-GEN issue 2

FCC Compliance:

• FCC ID: ED9LMX9838

• FCC Part 15 Subpart C

Japan MIC Compliance:

• Type Certification No. 007-AB0235

11.1 FCC Instructions

11.1.1 Safety Information For RF Exposure

11.1.1.1 FCC Radiation Exposure Statement:

This module may only be installed by the OEM or an OEM integrator. The antenna used for this transmitter must

not be co-located or operating in conjunction with any other antenna or transmitter. OEM integrators and End-

users and installers must be provided with antenna installation instructions and transmitter operating conditions

for satisfying RF exposure compliance.

Only the antenna filed under FCC ID: ED9LMX9838 can be used with this device.

11.1.1.2 End Product Labeling

FCC ID label on the final system must be labeled with “Contains TX FCC ID: ED9LMX9838 “or “Contains

transmitter module FCC ID: ED9LMX9838”.

IC label on the final system must be labeled with “Contains TX IC: 1520A-LMX9838” or “Contains transmitter

module IC: 1520A-LMX9838”.

11.1.1.3 End Product Manual Information

In the user manual, final system integrator must ensure that there is no instruction provided in the user manual to

install or remove the transmitter module.

LMX9838SB must be installed and used in strict accordance with the manufacturer’s instructions as described in

the user documentation that comes with the product.

The following information is required to be incorporated in the user manual of final system.

USA-Federal Communications Commission (FCC)

This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to Part

15 of FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a

residential installation. This equipment generates, uses, and can radiate radio frequency energy. If not installed

and used in accordance with the instructions, it may cause harmful interference to radio communications.

However, there is no ensured specification that interference will not occur in a particular installation.

If this equipment does cause harmful interference to radio or television reception, which can be determined by

tuning the equipment off and on, the user is encouraged to try and correct the interference by one or more of the

following measures:

• Reorient or relocate the receiving antenna.

• Increase the distance between the equipment and the receiver.

Product Folder Links: LMX9838

LMX9838

SNOSAZ9F –JULY 2007–REVISED DECEMBER 2014

www.ti.com

FCC Instructions (continued)

• Connect the equipment to outlet on a circuit different from that to which the receiver is connected.

• Consult the dealer or an experienced radio/TV technician for help.

Any changes or modifications not expressly approved by the party responsible for compliance could void the

user’s authority to operate the equipment.

Caution: Exposure to Radio Frequency Radiation.

This device must not be co-located or operating in conjunction with any other antenna or transmitter.

Canada – Industry Canada (IC)

This device complies with RSS 210 of Industry Canada.

Operation is subject to the following two conditions:

(1) this device may not cause interference, and

(2) this device must accept any interference, including interference that may cause undesired operation of this

device.”

L ‘ utilisation de ce dispositif est autorisée seulement aux conditions suivantes :

(1) il ne doit pas produire d’interference et

(2) l’ utilisateur du dispositif doit étre pr?t ? accepter toute interference radioélectrique reçu, m?me si celle-ci est

susceptible de compromettre le fonctionnement du dispositif.

Caution: Exposure to Radio Frequency Radiation.

The installer of this radio equipment must ensure that the antenna is located or pointed such that it does not emit

RF field in excess of Health Canada limits for the general population; consult Safety Code 6, obtainable from

Health Canada’s website www.hc-sc.gc.ca/rpb.

Product Folder Links: LMX9838

CERTIFICATE for TYPE CERTIFICATION

UL Japan, Inc. hereby declares that this equipment is certified for type certification pursuant to Article

38-24-1 of the Radio Law (Law No. 131 of 1950).

WiSE(Wireless - interoperability - Security - EMC)

Verification Service

UL Japan, Inc.

Radio Certification Section

4383-326 Asama-cho, Ise-shi, Mie-ken, 516-0021 Japan

TEL: +81-596-24-8116 FAX: +81-596-8095

Note 1: Whenever there has been a change in the information mentioned in Item (1) of Paragraph 4 of Article 17 of ordinance

concerning technical regulations conformity certification etc of specified radio equipment, a certified dealer shall

submit without delay to the Minister of Internal Affairs and Communications under Paragraph 5 and 6 of Article 17 of ordinance

concerning technical regulations conformity certification etc of specified radio equipment.

Note2: A certified dealer shall conduct an examination on specified radio equipment and maintain the examination records as

Specified by Paragraph 2 of Article 38-25 of Japanese Radio Law.

Applicant

Texas Instruments Inc.

Address and representative

12500 TI Blvd., Dallas, TX-75243, USA

Mr. Richard Templeton

Category of specific radio equipment

Radio equipment for Article 2-1-19 of Certification

Ordinance

Manufacturer

Texas Instruments Inc.

Model or Product Name

Bluetooth 2.0 Module: Model:LMX9838

Type of radio wave, frequency

and antenna power

FID 2402 MHz~2480 MHz (1 MHz Interval, 79 Channels)

0.000018 W/MHz~0.000063 W/MHz

Type Certification No.

007-AB0235

Date of Certification

November 6, 2013

00183 1/1

LMX9838

www.ti.com

SNOSAZ9F –JULY 2007–REVISED DECEMBER 2014

FCC Instructions (continued)

Figure 15.

Product Folder Links: LMX9838

LMX9838

SNOSAZ9F –JULY 2007–REVISED DECEMBER 2014

www.ti.com

12 Device and Documentation Support

12.1 Device Support

LMX9838DONGLE Evaluation Module http://www.ti.com/tool/lmx9838dongle

12.2 Documentation Support

12.2.1 Related Documentation

Application Notes, Software, and Tools http://www.ti.com/tool/lmx9838-sw

LMX9838 Software User’s Guide, SNOA498

12.3 Trademarks

Bluetooth is a registered trademark of Bluetooth SIG, Inc.

All other trademarks are the property of their respective owners.

12.4 Electrostatic Discharge Caution

These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam

during storage or handling to prevent electrostatic damage to the MOS gates.

12.5 Glossary

SLYZ022 —TI Glossary.

This glossary lists and explains terms, acronyms, and definitions.

13 Mechanical, Packaging, and Orderable Information

The following pages include mechanical, packaging, and orderable information. This information is the most

current data available for the designated devices. This data is subject to change without notice and revision of

this document. For browser-based versions of this data sheet, refer to the left-hand navigation.

Product Folder Links: LMX9838

PACKAGE OPTION ADDENDUM

www.ti.com 14-Feb-2018

Addendum-Page 1

PACKAGING INFORMATION

Orderable Device Status

(1)

Package Type Package

Drawing Pins Package

Qty Eco Plan

(2)

Lead/Ball Finish

(6)

MSL Peak Temp

(3)

Op Temp (°C) Device Marking

(4/5)

Samples

LMX9838SB/NOPB NRND PLGA NAW 70 Green (RoHS

& no Sb/Br) Call TI Level-4-250C-72 HR -40 to 85 LMX9838SB

FCC ID: ED9LMX9838

IC: 1520A-LMX9838

LMX9838SBX/NOPB NRND PLGA NAW 70 1000 Green (RoHS

& no Sb/Br) Call TI Level-4-250C-72 HR -40 to 85 LMX9838SB

FCC ID: ED9LMX9838

IC: 1520A-LMX9838

(1) The marketing status values are defined as follows:

ACTIVE: Product device recommended for new designs.

LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.

NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.

PREVIEW: Device has been announced but is not in production. Samples may or may not be available.

OBSOLETE: TI has discontinued the production of the device.

(2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance

do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may

reference these types of products as "Pb-Free".

RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.

Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based

flame retardants must also meet the <=1000ppm threshold requirement.

(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.

(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.

(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation

of the previous line and the two combined represent the entire Device Marking for that device.

(6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish

value exceeds the maximum column width.

Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information

provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and

continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.

TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.

PACKAGE OPTION ADDENDUM

www.ti.com 14-Feb-2018

Addendum-Page 2

In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.

MECHANICAL DATA

NAW0070A

www.ti.com

SB70A (Rev B)

IMPORTANT NOTICE

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life-critical medical equipment unless authorized officers of the parties have executed a special contract specifically governing such use.

Life-critical medical equipment is medical equipment where failure of such equipment would cause serious bodily injury or death (e.g., life

support, pacemakers, defibrillators, heart pumps, neurostimulators, and implantables). Such equipment includes, without limitation, all

medical devices identified by the U.S. Food and Drug Administration as Class III devices and equivalent classifications outside the U.S.

TI may expressly designate certain products as completing a particular qualification (e.g., Q100, Military Grade, or Enhanced Product).

Designers agree that it has the necessary expertise to select the product with the appropriate qualification designation for their applications

and that proper product selection is at Designers’ own risk. Designers are solely responsible for compliance with all legal and regulatory

requirements in connection with such selection.

Designer will fully indemnify TI and its representatives against any damages, costs, losses, and/or liabilities arising out of Designer’s non-

compliance with the terms and provisions of this Notice.

Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265

Mouser Electronics

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