General Description
The MAX19999 dual-channel downconverter provides
8.3dB of conversion gain, +24dBm input IP3, +11.4dBm
1dB input compression point, and a noise figure of
10.5dB for 3000MHz to 4000MHz WiMAX™ and LTE
diversity receiver applications. With an optimized LO fre-
quency range of 2650MHz to 3700MHz, this mixer is
ideal for low-side LO injection architectures.
In addition to offering excellent linearity and noise per-
formance, the MAX19999 also yields a high level of
component integration. This device includes two dou-
ble-balanced passive mixer cores, two LO buffers, and
a pair of differential IF output amplifiers. Integrated on-
chip baluns allow for single-ended RF and LO inputs.
The MAX19999 requires a nominal LO drive of 0dBm
and a typical supply current of 388mA at VCC = +5.0V
or 279mA at VCC = +3.3V.
The MAX19999 is pin compatible with the MAX19997A
1800MHz to 2900MHz mixer and pin similar with the
MAX19985/MAX19985A and MAX19995/MAX19995A
series of 700MHz to 2200MHz mixers, making this
entire family of downconverters ideal for applications
where a common PCB layout is used across multiple
frequency bands.
The MAX19999 is available in a compact 6mm x 6mm,
36-pin thin QFN package with an exposed pad.
Electrical performance is guaranteed over the extended
temperature range, from TC= -40°C to +85°C.
Applications
3.5GHz WiMAX and LTE Base Stations
Fixed Broadband Wireless Access
Microwave Links
Wireless Local Loop
Private Mobile Radios
Military Systems
Features
♦3000MHz to 4000MHz RF Frequency Range
♦2650MHz to 3700MHz LO Frequency Range
♦50MHz to 500MHz IF Frequency Range
♦8.3dB Conversion Gain
♦+24dBm Input IP3
♦10.5dB Noise Figure
♦+11.4dBm Input 1dB Compression Point
♦74dBc Typical 2 x 2 Spurious Rejection at
PRF = -10dBm
♦Dual Channels Ideal for Diversity Receiver
Applications
♦Integrated LO Buffer
♦Integrated LO and RF Baluns for Single-Ended
Inputs
♦Low -3dBm to +3dBm LO Drive
♦Pin Compatible with the MAX19997A 1800MHz to
2900MHz Mixer
♦Pin Similar to the MAX9995/MAX9995A and
MAX19995/MAX19995A 1700MHz to 2200MHz
Mixers and the MAX9985/MAX9985A and
MAX19985/MAX19985A 700MHz to 1000MHz
Mixers
♦39dB Channel-to-Channel Isolation
♦Single +5.0V or +3.3V Supply
♦External Current-Setting Resistors Provide Option
for Operating Device in Reduced-Power/Reduced-
Performance Mode
MAX19999
Dual, SiGe High-Linearity, 3000MHz to
4000MHz Downconversion Mixer with LO Buffer
________________________________________________________________
Maxim Integrated Products
1
Ordering Information
19-4293; Rev 0; 10/08
For pricing, delivery, and ordering information, please contact Maxim Direct at 1-888-629-4642,
or visit Maxim’s website at www.maxim-ic.com.
PART TEMP RANGE PIN-PACKAGE
MAX19999ETX+ -40°C to +85°C 36 Thin QFN-EP*
MAX19999ETX+T -40°C to +85°C 36 Thin QFN-EP*
WiMAX is a trademark of WiMAX Forum.
+
Denotes a lead-free/RoHS-compliant package.
*
EP = Exposed pad.
T = Tape and reel.
Pin Configuration/Functional Diagram and Typical
Application Circuit appear at end of data sheet.
MAX19999
Dual, SiGe High-Linearity, 3000MHz to
4000MHz Downconversion Mixer with LO Buffer
2 _______________________________________________________________________________________
ABSOLUTE MAXIMUM RATINGS
+5.0V SUPPLY DC ELECTRICAL CHARACTERISTICS
(
Typical Application Circuit
, no input RF or LO signals applied, VCC = +4.75V to +5.25V, TC= -40°C to +85°C. Typical values are at
VCC = +5.0V, TC= +25°C, unless otherwise noted. R1 = R4 = 750Ω, R2 = R5 = 698Ω.)
+3.3V SUPPLY DC ELECTRICAL CHARACTERISTICS
(
Typical Application Circuit
, no input RF or LO signals applied, TC= -40°C to +85°C. Typical values are at
VCC = +3.3V, TC= +25°C, unless otherwise noted. R1 = R4 = 1.1kΩ; R2 = R5 = 845Ω.) (Note 5)
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.
VCC to GND...........................................................-0.3V to +5.5V
RF_, LO to GND.....................................................-0.3V to +0.3V
IFM_, IFD_, IFM_SET, IFD_SET, LO_ADJ_M,
LO_ADJ_D to GND.................................-0.3V to (VCC + 0.3V)
RF_, LO Input Power ......................................................+15dBm
RF_, LO Current (RF and LO are DC shorted to GND
through balun).................................................................50mA
Continuous Power Dissipation (Note 1) ..............................8.7W
θJA (Notes 2, 3)..............................................................+38°C/W
θJC (Note 3).....................................................................7.4°C/W
Operating Case Temperature Range
(Note 4) ...................................................TC= -40°C to +85°C
Junction Temperature......................................................+150°C
Storage Temperature Range .............................-65°C to +150°C
Lead Temperature (soldering, 10s) .................................+300°C
PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS
Supply Voltage VCC 4.75 5 5.25 V
Supply Current ICC Total supply current 388 420 mA
PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS
Supply Voltage VCC (Note 6) 3 3.3 3.6 V
Supply Current ICC Total supply current 279 mA
PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS
RF Frequency fRF (Notes 5, 7) 3000 4000 MHz
LO Frequency fLO (Notes 5, 7) 2650 3700 MHz
Using Mini-Circuits TC4-1W-17 4:1
transformer as defined in the Typical
Application Circuit, IF matching
components affect the IF frequency range
(Notes 5, 7)
100 500
IF Frequency fIF
Using alternative Mini-Circuits TC4-1W-7A
4:1 transformer, IF matching components
affect the IF frequency range (Notes 5, 7)
50 250
MHz
LO Drive Level PLO (Note 7) -3 +3 dBm
Note 1: Based on junction temperature TJ= TC+ (θJC x VCC x ICC). This formula can be used when the temperature of the exposed
pad is known while the device is soldered down to a PCB. See the
Applications Information
section for details. The junction
temperature must not exceed +150°C.
Note 2: Junction temperature TJ= TA+ (θJA x VCC x ICC). This formula can be used when the ambient temperature of the PCB is
known. The junction temperature must not exceed +150°C.
Note 3: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-
layer board. For detailed information on package thermal considerations, refer to www.maxim-ic.com/thermal-tutorial.
Note 4: TCis the temperature on the exposed pad of the package. TAis the ambient temperature of the device and PCB.
RECOMMENDED AC OPERATING CONDITIONS
MAX19999
Dual, SiGe High-Linearity, 3000MHz to
4000MHz Downconversion Mixer with LO Buffer
_______________________________________________________________________________________ 3
PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS
Conversion Gain GCTC = +25°C (Notes 6, 9) 7.3 8.3 9.3 dB
Conversion Gain Flatness fRF = 3200MHz to 3900MHz, over any
100MHz band 0.15 dB
Gain Variation Over Temperature TCCG fRF = 3200MHz to 3900MHz, TC = -40°C to
+85°C -0.01 dB/°C
Input Compression Point IP1dB (Notes 6, 9, 10) 9.8 11.4 dBm
fRF1 - fRF2 = 1MHz, PRF = -5dBm per tone
(Notes 6, 9) 21.6 24.3
Third-Order Input Intercept Point IIP3 fRF = 3550MHz, fRF1 - fRF2 = 1MHz,
PRF = -5dBm per tone, TC = +25°C
(Notes 6, 9)
22 24.3
dBm
Third-Order Input Intercept Point
Variation Over Temperature fRF1 - fRF2 = 1MHz, TC = -40°C to +85°C ±0.3 dBm
Single sideband, no blockers present
(Notes 5, 6) 10.5 13
Noise Figure NFSSB Single sideband, no blockers present,
fRF = 3500MHz, TC = +25°C (Notes 5, 6) 10.5 11.5
dB
Noise Figure Temperature
Coefficient TCNF Single sideband, no blockers present,
TC = -40°C to +85°C 0.018 dB/°C
Noise Figure Under Blocking
Conditions NFB
fBLOC KE R = 3700M H z, P
BLOC KE R = 8d Bm,
fRF = 3450M H z, fLO = 3100M H z, P
LO = 0d Bm,
V
C C
= 5.0V, TC
= + 25°C ( Notes 5, 6, 11)
21 25 dB
PRF = -10dBm,
(Notes 5, 6) 68 74
2RF-2LO Spurious Rejection 2 x 2
fRF = 3500MHz, fLO =
3150MHz, fSPUR = fLO +
175MHz, TC = +25°C PRF = -5dBm,
(Notes 6, 9) 63 69
dBc
PRF = -10dBm,
(Notes 5, 6) 77 86
3RF-3LO Spurious Rejection 3 x 3
fRF = 3500MHz, fLO =
3150MHz, fSPUR = fLO +
116.67MHz, TC = +25°C PRF = -5dBm,
(Notes 6, 9) 67 76
dBc
RF Input Return Loss LO on and IF terminated into a matched
impedance 15.4 dB
LO Input Return Loss RF and IF terminated into a matched
impedance 14 dB
IF Output Impedance ZIF Nominal differential impedance at the IC’s
IF outputs 200 Ω
+5.0V SUPPLY AC ELECTRICAL CHARACTERISTICS
(
Typical Application Circuit
, VCC = +4.75V to +5.25V, RF and LO ports are driven from 50Ωsources, PLO = -3dBm to +3dBm,
PRF = -5dBm, fRF = 3200MHz to 3900MHz, fLO = 2800MHz to 3600MHz, fIF = 350MHz, fRF > fLO, TC= -40°C to +85°C. Typical val-
ues are at VCC = +5.0V, PRF = -5dBm, PLO = 0dBm, fRF = 3550MHz, fLO = 3200MHz, fIF = 350MHz, TC= +25°C, unless otherwise
noted.) (Note 8)
MAX19999
Dual, SiGe High-Linearity, 3000MHz to
4000MHz Downconversion Mixer with LO Buffer
4 _______________________________________________________________________________________
+3.3V SUPPLY AC ELECTRICAL CHARACTERISTICS
(
Typical Application Circuit,
typical values are at VCC = +3.3V, PRF = -5dBm, PLO = 0dBm, fRF = 3550MHz, fLO = 3200MHz,
fIF = 350MHz, TC= +25°C, unless otherwise noted.) (Note 8)
PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS
Conversion Gain GC8.0 dB
Conversion Gain Flatness fRF = 3200MHz to 3900MHz, over any
100MHz band 0.15 dB
Gain Variation Over Temperature TCCG fRF = 3200MHz to 3900MHz, TC = -40°C to
+85°C -0.01 dB/°C
Input Compression Point IP1dB 8.4 dBm
Third-Order Input Intercept Point IIP3 fRF1 - fRF2 = 1MHz, PRF = -5dBm per tone 20.3 dBm
Third-Order Input Intercept
Variation Over Temperature fRF1 - fRF2 = 1MHz, TC = -40°C to +85°C ±0.3 dBm
Noise Figure NFSSB Single sideband, no blockers present 10.5 dB
Noise Figure Temperature
Coefficient TCNF Single sideband, no blockers present,
TC = -40°C to +85°C 0.018 dB/°C
PRF = -10dBm 74
2RF-2LO Spurious Rejection 2 x 2 fSPUR = fLO + 175MHz PRF = -5dBm 69 dBc
PRF = -10dBm 75
3RF-3LO Spurious Rejection 3 x 3 fSPUR = fLO + 116.67MHz PRF = -5dBm 65 dBc
RF Input Return Loss LO on and IF terminated into a matched
impedance 16 dB
LO Input Return Loss RF and IF terminated into a matched
impedance 15.5 dB
PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS
IF Output Return Loss
RF terminated into 50Ω, LO driven by a 50Ω
source, IF transformed to 50Ω using
external components shown in the Typical
Application Circuit
18 dB
RF-to-IF Isolation 28 dB
LO Leakage at RF Port (Notes 6, 9) -31 -24 dBm
2LO Leakage at RF Port -30 dBm
LO Leakage at IF Port -23 dBm
Channel Isolation
RFMAIN (RFDIV) converted power
measured at IFDIV (IFMAIN), relative to
IFMAIN (IFDIV), all unused ports terminated
to 50Ω (Notes 6, 9)
36 39 dB
+5.0V SUPPLY AC ELECTRICAL CHARACTERISTICS (continued)
(
Typical Application Circuit
, VCC = +4.75V to +5.25V, RF and LO ports are driven from 50Ωsources, PLO = -3dBm to +3dBm,
PRF = -5dBm, fRF = 3200MHz to 3900MHz, fLO = 2800MHz to 3600MHz, fIF = 350MHz, fRF > fLO, TC= -40°C to +85°C. Typical val-
ues are at VCC = +5.0V, PRF = -5dBm, PLO = 0dBm, fRF = 3550MHz, fLO = 3200MHz, fIF = 350MHz, TC= +25°C, unless otherwise
noted.) (Note 8)
MAX19999
Dual, SiGe High-Linearity, 3000MHz to
4000MHz Downconversion Mixer with LO Buffer
_______________________________________________________________________________________ 5
+3.3V SUPPLY AC ELECTRICAL CHARACTERISTICS (continued)
(
Typical Application Circuit,
typical values are at VCC = +3.3V, PRF = -5dBm, PLO = 0dBm, fRF = 3550MHz, fLO = 3200MHz,
fIF = 350MHz, TC= +25°C, unless otherwise noted.) (Note 8)
PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS
IF Output Impedance ZIF Nominal differential impedance at the IC’s
IF outputs 200 Ω
IF Output Return Loss
RF terminated into 50Ω, LO driven by a 50Ω
source, IF transformed to 50Ω using
external components shown in the Typical
Application Circuit
19 dB
RF-to-IF Isolation 28 dB
LO Leakage at RF Port -36 dBm
2LO Leakage at RF Port -34 dBm
LO Leakage at IF Port -27 dBm
Channel Isolation
RFM AIN ( RFD IV ) conver ted p ow er m easur ed
at IFD IV ( IFM AIN ) , r el ati ve to IFM AIN ( IFD IV ) ,
al l unused p or ts ter m i nated to 50Ω
38.5 dB
Note 5: Not production tested.
Note 6: Guaranteed by design and characterization.
Note 7: Operation outside this range is possible, but with degraded performance of some parameters. See the
Typical Operating
Characteristics
section.
Note 8: All limits reflect losses of external components, including a 0.9dB loss at fIF = 350MHz due to the 4:1 impedance trans-
former. Output measurements were taken at IF outputs of the
Typical Application Circuit
.
Note 9: 100% production tested for functional performance.
Note 10: Maximum reliable continuous input power applied to the RF or IF port of this device is +12dBm from a 50Ωsource.
Note 11: Measured with external LO source noise filtered so the noise floor is -174dBm/Hz. This specification reflects the effects of
all SNR degradations in the mixer, including the LO noise as defined in Application Note 2021:
Specifications and
Measurement of Local Oscillator Noise in Integrated Circuit Base Station Mixers
.
Typical Operating Characteristics
(
Typical Application Circuit
, VCC = +5.0V, LO is low-side injected for a 350MHz IF, PLO = 0dBm, PRF = -5dBm, TC=+25°C, unless
otherwise noted.)
MAX19999
Dual, SiGe High-Linearity, 3000MHz to
4000MHz Downconversion Mixer with LO Buffer
6 _______________________________________________________________________________________
CONVERSION GAIN vs. RF FREQUENCY
MAX19999 toc01
RF FREQUENCY (MHz)
CONVERSION GAIN (dB)
3800360034003200
7
8
9
10
6
3000 4000
TC = +25°C
TC = +85°C
TC = -30°C
CONVERSION GAIN vs. RF FREQUENCY
MAX19999 toc02
RF FREQUENCY (MHz)
CONVERSION GAIN (dB)
3800360034003200
7
8
9
10
6
3000 4000
PLO = -3dBm, 0dBm, +3dBm
CONVERSION GAIN vs. RF FREQUENCY
MAX19999 toc03
RF FREQUENCY (MHz)
CONVERSION GAIN (dB)
3800360034003200
7
8
9
10
6
3000 4000
VCC = 4.75V, 5.0V, 5.25V
INPUT IP3 vs. RF FREQUENCY
MAX19999 toc04
RF FREQUENCY (MHz)
INPUT IP3 (dBm)
3800360034003200
23
24
25
26
27
22
3000 4000
TC = +25°C
TC = +85°C
TC = -30°C
PRF = -5dBm/TONE
INPUT IP3 vs. RF FREQUENCY
MAX19999 toc05
RF FREQUENCY (MHz)
INPUT IP3 (dBm)
3800360034003200
23
24
25
26
27
22
3000 4000
PRF = -5dBm/TONE
PLO = -3dBm, 0dBm, +3dBm
INPUT IP3 vs. RF FREQUENCY
MAX19999 toc06
RF FREQUENCY (MHz)
INPUT IP3 (dBm)
3800360034003200
23
24
25
26
27
22
3000 4000
PRF = -5dBm/TONE
VCC = 4.75V, 5.0V, 5.25V
NOISE FIGURE vs. RF FREQUENCY
MAX19999 toc07
RF FREQUENCY (MHz)
NOISE FIGURE (dB)
372535503375
8
9
10
11
12
13
7
3200 3900
TC = +25°C
TC = +85°C
TC = -30°C
NOISE FIGURE vs. RF FREQUENCY
RF FREQUENCY (MHz)
NOISE FIGURE (dB)
MAX19999 toc08
3200 3375 3550 3725 3900
7
8
9
10
11
12
13
PLO = -3dBm, 0dBm, +3dBm
NOISE FIGURE vs. RF FREQUENCY
RF FREQUENCY (MHz)
NOISE FIGURE (dB)
MAX19999 toc09
3200 3375 3550 3725 3900
7
8
9
10
11
12
13
VCC = 4.75V, 5.0V, 5.25V
Typical Operating Characteristics (continued)
(
Typical Application Circuit
, VCC = +5.0V, LO is low-side injected for a 350MHz IF, PLO = 0dBm, PRF = -5dBm, TC=+25°C, unless
otherwise noted.)
MAX19999
Dual, SiGe High-Linearity, 3000MHz to
4000MHz Downconversion Mixer with LO Buffer
_______________________________________________________________________________________
7
2RF-2LO RESPONSE vs. RF FREQUENCY
RF FREQUENCY (MHz)
2RF-2LO RESPONSE (dBc)
MAX19999 toc10
3000 3200 3400 3600 3800 4000
50
60
70
80
90
PRF = -5dBm
TC = +85°C
TC = -30°C
TC = +25°C
2RF-2LO RESPONSE vs. RF FREQUENCY
RF FREQUENCY (MHz)
2RF-2LO RESPONSE (dBc)
MAX19999 toc11
3000 3200 3400 3600 3800 4000
50
60
70
80
90
PRF = -5dBm
PLO = 0dBm
PLO = +3dBm
PLO = -3dBm
2RF-2LO RESPONSE vs. RF FREQUENCY
RF FREQUENCY (MHz)
2RF-2LO RESPONSE (dBc)
MAX19999 toc12
3000 3200 3400 3600 3800 4000
50
60
70
80
90
VCC = 4.75V, 5.0V, 5.25V
PRF = -5dBm
3RF-3LO RESPONSE vs. RF FREQUENCY
RF FREQUENCY (MHz)
3RF-3LO RESPONSE (dBc)
MAX19999 toc13
3000 3200 3400 3600 3800 4000
55
65
75
85
95
TC = -30°C, +25°C, +85°C
PRF = -5dBm
3RF-3LO RESPONSE vs. RF FREQUENCY
RF FREQUENCY (MHz)
3RF-3LO RESPONSE (dBc)
MAX19999 toc14
3000 3200 3400 3600 3800 4000
55
65
75
85
95
PRF = -5dBm
PLO = -3dBm, 0dBm, +3dBm
3RF-3LO RESPONSE vs. RF FREQUENCY
RF FREQUENCY (MHz)
3RF-3LO RESPONSE (dBc)
MAX19999 toc15
3000 3200 3400 3600 3800 4000
55
65
75
85
95
PRF = -5dBm
VCC = 4.75V, 5.0V, 5.25V
INPUT P1dB vs. RF FREQUENCY
RF FREQUENCY (MHz)
INPUT P1dB (dBm)
MAX19999 toc16
3200 3375 3550 3725 3900
9
10
11
12
13
TC = +85°C
TC = +25°C
TC = -30°C
INPUT P1dB vs. RF FREQUENCY
RF FREQUENCY (MHz)
INPUT P1dB (dBm)
MAX19999 toc17
3200 3375 3550 3725 3900
9
10
11
12
13
PLO = -3dBm, 0dBm, +3dBm
INPUT P1dB vs. RF FREQUENCY
RF FREQUENCY (MHz)
INPUT P1dB (dBm)
MAX19999 toc18
3200 3375 3550 3725 3900
9
10
11
12
13
VCC = 5.25V
VCC = 5.0V VCC = 4.75V
Typical Operating Characteristics (continued)
(
Typical Application Circuit
, VCC = +5.0V, LO is low-side injected for a 350MHz IF, PLO = 0dBm, PRF = -5dBm, TC=+25°C, unless
otherwise noted.)
MAX19999
Dual, SiGe High-Linearity, 3000MHz to
4000MHz Downconversion Mixer with LO Buffer
8 _______________________________________________________________________________________
CHANNEL ISOLATION vs. RF FREQUENCY
RF FREQUENCY (MHz)
CHANNEL ISOLATION (dB)
MAX19999 toc19
3000 3200 3400 3600 3800 4000
30
35
40
45
50
TC = -30°C, +25°C, +85°C
CHANNEL ISOLATION vs. RF FREQUENCY
RF FREQUENCY (MHz)
CHANNEL ISOLATION (dB)
MAX19999 toc20
3000 3200 3400 3600 3800 4000
30
35
40
45
50
PLO = -3dBm, 0dBm, +3dBm
CHANNEL ISOLATION vs. RF FREQUENCY
RF FREQUENCY (MHz)
CHANNEL ISOLATION (dB)
MAX19999 toc21
3000 3200 3400 3600 3800 4000
30
35
40
45
50
VCC = 4.75V, 5.0V, 5.25V
LO LEAKAGE AT IF PORT
vs. LO FREQUENCY
LO FREQUENCY (MHz)
LO LEAKAGE AT IF PORT (dBm)
MAX19999 toc22
2600 2800 3000 3200 3400 3600
-60
-50
-40
-30
-20
-10
0
TC = -30°C
TC = +25°C, +85°C
LO LEAKAGE AT IF PORT
vs. LO FREQUENCY
LO FREQUENCY (MHz)
LO LEAKAGE AT IF PORT (dBm)
MAX19999 toc23
2600 2800 3000 3200 3400 3600
-60
-50
-40
-30
-20
-10
0
PLO = -3dBm, 0dBm, +3dBm
LO LEAKAGE AT IF PORT
vs. LO FREQUENCY
LO FREQUENCY (MHz)
LO LEAKAGE AT IF PORT (dBm)
MAX19999 toc24
2600 2800 3000 3200 3400 3600
-60
-50
-40
-30
-20
-10
0
VCC = 4.75V, 5.0V, 5.25V
RF-TO-IF ISOLATION vs. RF FREQUENCY
RF FREQUENCY (MHz)
RF-TO-IF ISOLATION (dB)
MAX19999 toc25
3000 3200 3400 3600 3800 4000
10
20
30
40
TC = -30°C
TC = +25°C
TC = +85°C
RF-TO-IF ISOLATION vs. RF FREQUENCY
RF FREQUENCY (MHz)
RF-TO-IF ISOLATION (dB)
MAX19999 toc26
3000 3200 3400 3600 3800 4000
10
20
30
40
PLO = -3dBm, 0dBm, +3dBm
RF-TO-IF ISOLATION vs. RF FREQUENCY
RF FREQUENCY (MHz)
RF-TO-IF ISOLATION (dB)
MAX19999 toc27
3000 3200 3400 3600 3800 4000
10
20
30
40
VCC = 4.75V, 5.0V, 5.25V
Typical Operating Characteristics (continued)
(
Typical Application Circuit
, VCC = +5.0V, LO is low-side injected for a 350MHz IF, PLO = 0dBm, PRF = -5dBm, TC=+25°C, unless
otherwise noted.)
MAX19999
Dual, SiGe High-Linearity, 3000MHz to
4000MHz Downconversion Mixer with LO Buffer
_______________________________________________________________________________________
9
LO LEAKAGE AT RF PORT
vs. LO FREQUENCY
LO FREQUENCY (MHz)
LO LEAKAGE AT RF PORT (dBm)
MAX19999 toc28
2700 3100 3500 3900
-50
-40
-30
-20
-10
TC = -30°C, +25°C, +85°C
LO LEAKAGE AT RF PORT
vs. LO FREQUENCY
LO FREQUENCY (MHz)
LO LEAKAGE AT RF PORT (dBm)
MAX19999 toc29
2700 3100 3500 3900
-50
-40
-30
-20
-10
PLO = -3dBm, 0dBm, +3dBm
LO LEAKAGE AT RF PORT
vs. LO FREQUENCY
LO FREQUENCY (MHz)
LO LEAKAGE AT RF PORT (dBm)
MAX19999 toc30
2700 3100 3500 3900
-50
-40
-30
-20
-10
VCC = 4.75V, 5.0V, 5.25V
2LO LEAKAGE AT RF PORT
vs. LO FREQUENCY
LO FREQUENCY (MHz)
2LO LEAKAGE AT RF PORT (dBm)
MAX19999 toc31
2700 3100 3500 3900
-50
-40
-30
-20
-10
TC = -30°C, +25°C, +85°C
2LO LEAKAGE AT RF PORT
vs. LO FREQUENCY
LO FREQUENCY (MHz)
2LO LEAKAGE AT RF PORT (dBm)
MAX19999 toc32
2700 3100 3500 3900
-50
-40
-30
-20
-10
PLO = -3dBm, 0dBm, +3dBm
2LO LEAKAGE AT RF PORT
vs. LO FREQUENCY
LO FREQUENCY (MHz)
2LO LEAKAGE AT RF PORT (dBm)
MAX19999 toc33
2700 3100 3500 3900
-50
-40
-30
-20
-10
VCC = 4.75V, 5.0V, 5.25V
RF PORT RETURN LOSS
vs. RF FREQUENCY
RF FREQUENCY (MHz)
RF PORT RETURN LOSS (dB)
MAX19999 toc34
3000 3200 3400 3600 3800 4000
30
25
20
15
10
5
0
PLO = -3dBm, 0dBm, +3dBm
fIF = 350MHz
IF PORT RETURN LOSS vs. IF FREQUENCY
IF FREQUENCY (MHz)
IF PORT RETURN LOSS (dB)
MAX19999 toc35
50 140 230 320 410 500
30
25
20
15
10
5
0
fLO = 3200MHz
VCC = 4.75V, 5.0V, 5.25V
Typical Operating Characteristics (continued)
(
Typical Application Circuit
, VCC = +5.0V, LO is low-side injected for a 350MHz IF, PLO = 0dBm, PRF = -5dBm, TC=+25°C, unless
otherwise noted.)
MAX19999
Dual, SiGe High-Linearity, 3000MHz to
4000MHz Downconversion Mixer with LO Buffer
10 ______________________________________________________________________________________
Typical Operating Characteristics (continued)
(
Typical Application Circuit,
VCC = +3.3V, LO is low-side injected for a 350MHz IF, PLO = 0dBm, PRF = -5dBm, TC=+25°C, unless
otherwise noted.)
LO PORT RETURN LOSS vs. LO FREQUENCY
LO FREQUENCY (MHz)
LO PORT RETURN LOSS (dB)
MAX19999 toc36
2650 2900 3150 3400 3650
25
20
15
10
5
0
PLO = -3dBm
PLO = 0dBm
PLO = +3dBm
SUPPLY CURRENT vs. TEMPERATURE (TC)
TEMPERATURE (°C)
SUPPLY CURRENT (mA)
MAX19999 toc37
-35 -15 5 25 45 65 85
350
360
370
380
390
400
VCC = 4.75V VCC = 5.0V
VCC = 5.25V
CONVERSION GAIN vs. RF FREQUENCY
MAX19999 toc38
RF FREQUENCY (MHz)
CONVERSION GAIN (dB)
3800360034003200
7
8
9
10
6
3000 4000
TC = +25°CTC = -30°C
VCC = 3.3V
TC = +85°C
CONVERSION GAIN vs. RF FREQUENCY
MAX19999 toc39
RF FREQUENCY (MHz)
CONVERSION GAIN (dB)
3800360034003200
7
8
9
10
6
3000 4000
VCC = 3.3V
PLO = -3dBm, 0dBm, +3dBm
CONVERSION GAIN vs. RF FREQUENCY
MAX19999 toc40
RF FREQUENCY (MHz)
CONVERSION GAIN (dB)
3800360034003200
7
8
9
10
6
3000 4000
VCC = 3.0V, 3.3V, 3.6V
Typical Operating Characteristics (continued)
(
Typical Application Circuit,
VCC = +3.3V, LO is low-side injected for a 350MHz IF, PLO = 0dBm, PRF = -5dBm, TC=+25°C, unless
otherwise noted.)
MAX19999
Dual, SiGe High-Linearity, 3000MHz to
4000MHz Downconversion Mixer with LO Buffer
______________________________________________________________________________________
11
INPUT IP3 vs. RF FREQUENCY
MAX19999 toc41
RF FREQUENCY (MHz)
INPUT IP3 (dBm)
3800360034003200
20
19
21
22
23
18
3000 4000
PRF = -5dBm/TONE
VCC = 3.3V
TC = +25°C
TC = -30°C
TC = +85°C
INPUT IP3 vs. RF FREQUENCY
MAX19999 toc42
RF FREQUENCY (MHz)
INPUT IP3 (dBm)
3800360034003200
20
19
21
22
23
18
3000 4000
PRF = -5dBm/TONE
VCC = 3.3V
PLO = -3dBm, 0dBm, +3dBm
INPUT IP3 vs. RF FREQUENCY
MAX19999 toc43
RF FREQUENCY (MHz)
INPUT IP3 (dBm)
3800360034003200
20
19
21
22
23
18
3000 4000
PRF = -5dBm/TONE
VCC = 3.0V, 3.3V, 3.6V
NOISE FIGURE vs. RF FREQUENCY
MAX19999 toc44
RF FREQUENCY (MHz)
NOISE FIGURE (dB)
372535503375
10
9
8
11
12
13
7
3200 3900
TC = +25°C
TC = -30°C
VCC = 3.3V
TC = +85°C
NOISE FIGURE vs. RF FREQUENCY
MAX19999 toc45
RF FREQUENCY (MHz)
NOISE FIGURE (dB)
372535503375
10
9
8
11
12
13
7
3200 3900
VCC = 3.3V
PLO = -3dBm, 0dBm, +3dBmPLO = -3dBm, 0dBm, +3dBmPLO = -3dBm, 0dBm, +3dBm
NOISE FIGURE vs. RF FREQUENCY
MAX19999 toc46
RF FREQUENCY (MHz)
NOISE FIGURE (dB)
372535503375
10
9
8
11
12
13
7
3200 3900
VCC = 3.0V, 3.3V, 3.6V
2RF-2LO RESPONSE vs. RF FREQUENCY
MAX19999 toc47
RF FREQUENCY (MHz)
2RF-2LO RESPONSE (dBc)
3600 380034003200
70
60
80
90
50
3000 4000
PRF = -5dBm
VCC = 3.3V
TC = +25°C
TC = -30°C
TC = +85°C
2RF-2LO RESPONSE vs. RF FREQUENCY
MAX19999 toc48
RF FREQUENCY (MHz)
2RF-2LO RESPONSE (dBc)
34003200 38003600
60
70
80
90
50
3000 4000
PRF = -5dBm
VCC = 3.3V
PLO = 0dBm
PLO = +3dBm
PLO = -3dBm
2RF-2LO RESPONSE vs. RF FREQUENCY
MAX19999 toc49
RF FREQUENCY (MHz)
2RF-2LO RESPONSE (dBc)
34003200 38003600
60
70
80
90
50
3000 4000
PRF = -5dBm
VCC = 3.6V
VCC = 3.0V
VCC = 3.3V
Typical Operating Characteristics (continued)
(
Typical Application Circuit,
VCC = +3.3V, LO is low-side injected for a 350MHz IF, PLO = 0dBm, PRF = -5dBm, TC=+25°C, unless
otherwise noted.)
MAX19999
Dual, SiGe High-Linearity, 3000MHz to
4000MHz Downconversion Mixer with LO Buffer
12 ______________________________________________________________________________________
3RF-3LO RESPONSE vs. RF FREQUENCY
MAX19999 toc50
RF FREQUENCY (MHz)
3RF-3LO RESPONSE (dBc)
34003200 38003600
55
65
75
85
45
3000 4000
PRF = -5dBm
VCC = 3.3V
TC = +85°C
TC = -30°CTC = +25°C
3RF-3LO RESPONSE vs. RF FREQUENCY
MAX19999 toc51
RF FREQUENCY (MHz)
3RF-3LO RESPONSE (dBc)
34003200 38003600
55
65
75
85
45
3000 4000
PRF = -5dBm
VCC = 3.3V
PLO = -3dBm, 0dBm, +3dBm
3RF-3LO RESPONSE vs. RF FREQUENCY
MAX19999 toc52
RF FREQUENCY (MHz)
3RF-3LO RESPONSE (dBc)
34003200 38003600
55
65
75
85
45
3000 4000
PRF = -5dBm
VCC = 3.0V, 3.3V, 3.6V
INPUT P1dB vs. RF FREQUENCY
MAX19999 toc53
RF FREQUENCY (MHz)
INPUT P1dB (dBm)
3550 37253375
7
8
9
10
6
3200 3900
VCC = 3.3V
TC = -30°C
TC = +85°C
TC = +25°C
INPUT P1dB vs. RF FREQUENCY
MAX19999 toc54
RF FREQUENCY (MHz)
INPUT P1dB (dBm)
372535503375
7
8
9
10
6
3200 3900
VCC = 3.3V
PLO = -3dBm, 0dBm, +3dBm
INPUT P1dB vs. RF FREQUENCY
MAX19999 toc55
RF FREQUENCY (MHz)
INPUT P1dB (dBm)
372535503375
7
8
9
10
6
3200 3900
VCC = 3.6V
VCC = 3.0V
VCC = 3.3V
CHANNEL ISOLATION vs. RF FREQUENCY
MAX19999 toc56
RF FREQUENCY (MHz)
CHANNEL ISOLATION (dB)
3400 38003200 3600
35
40
45
50
30
3000 4000
VCC = 3.3V
TC = -30°C, +25°C, +85°C
CHANNEL ISOLATION vs. RF FREQUENCY
MAX19999 toc57
RF FREQUENCY (MHz)
CHANNEL ISOLATION (dB)
3400 38003200 3600
35
40
45
50
30
3000 4000
VCC = 3.3V
PLO = -3dBm, 0dBm, +3dBm
CHANNEL ISOLATION vs. RF FREQUENCY
MAX19999 toc58
RF FREQUENCY (MHz)
CHANNEL ISOLATION (dB)
3800360034003200
35
40
45
50
30
3000 4000
VCC = 3.0V, 3.3V, 3.6V
Typical Operating Characteristics (continued)
(
Typical Application Circuit,
VCC = +3.3V, LO is low-side injected for a 350MHz IF, PLO = 0dBm, PRF = -5dBm, TC=+25°C, unless
otherwise noted.)
MAX19999
Dual, SiGe High-Linearity, 3000MHz to
4000MHz Downconversion Mixer with LO Buffer
______________________________________________________________________________________
13
LO LEAKAGE AT IF PORT
vs. LO FREQUENCY
MAX19999 toc59
LO FREQUENCY (MHz)
LO LEAKAGE AT IF PORT (dBm)
3400320030002800
-50
-40
-30
-20
-10
0
-60
2600 3600
TC = -30°C
TC = +85°C
TC = +25°C
VCC = 3.3V
LO LEAKAGE AT IF PORT
vs. LO FREQUENCY
MAX19999 toc60
LO FREQUENCY (MHz)
LO LEAKAGE AT IF PORT (dBm)
3400320030002800
-50
-40
-30
-20
-10
0
-60
2600 3600
PLO = -3dBm, 0dBm, +3dBm
VCC = 3.3V
LO LEAKAGE AT IF PORT
vs. LO FREQUENCY
MAX19999 toc61
LO FREQUENCY (MHz)
LO LEAKAGE AT IF PORT (dBm)
3400320030002800
-50
-40
-30
-20
-10
0
-60
2600 3600
VCC = 3.0V, 3.3V, 3.6V
RF-TO-IF ISOLATION vs. RF FREQUENCY
MAX19999 toc62
RF FREQUENCY (MHz)
RF-TO-IF ISOLATION (dB)
3800360034003200
20
30
40
10
3000 4000
TC = -30°C
TC = +85°C
TC = +25°C
VCC = 3.3V
RF-TO-IF ISOLATION vs. RF FREQUENCY
MAX19999 toc63
RF FREQUENCY (MHz)
RF-TO-IF ISOLATION (dB)
3800360034003200
20
30
40
10
3000 4000
VCC = 3.3V
PLO = -3dBm, 0dBm, +3dBm
RF-TO-IF ISOLATION vs. RF FREQUENCY
MAX19999 toc64
RF FREQUENCY (MHz)
RF-TO-IF ISOLATION (dB)
3800360034003200
20
30
40
10
3000 4000
VCC = 3.0V, 3.3V, 3.6V
LO LEAKAGE AT RF PORT
vs. LO FREQUENCY
MAX19999 toc65
LO FREQUENCY (MHz)
LO LEAKAGE AT RF PORT (dBm)
35003100
-40
-30
-20
-10
-50
2700 3900
VCC = 3.3V
TC = -30°C, +25°C, +85°C
LO LEAKAGE AT RF PORT
vs. LO FREQUENCY
MAX19999 toc66
LO FREQUENCY (MHz)
LO LEAKAGE AT RF PORT (dBm)
35003100
-40
-30
-20
-10
-50
2700 3900
VCC = 3.3V
PLO = -3dBm, 0dBm, +3dBm
LO LEAKAGE AT RF PORT
vs. LO FREQUENCY
MAX19999 toc67
LO FREQUENCY (MHz)
LO LEAKAGE AT RF PORT (dBm)
35003100
-40
-30
-20
-10
-50
2700 3900
VCC = 3.0V, 3.3V, 3.6V
Typical Operating Characteristics (continued)
(
Typical Application Circuit,
VCC = +3.3V, LO is low-side injected for a 350MHz IF, PLO = 0dBm, PRF = -5dBm, TC=+25°C, unless
otherwise noted.)
MAX19999
Dual, SiGe High-Linearity, 3000MHz to
4000MHz Downconversion Mixer with LO Buffer
14 ______________________________________________________________________________________
2LO LEAKAGE AT RF PORT
vs. LO FREQUENCY
MAX19999 toc68
LO FREQUENCY (MHz)
2LO LEAKAGE AT RF PORT (dBm)
35003100
-40
-30
-20
-10
-50
2700 3900
TC = -30°C, +25°C, +85°C
VCC = 3.3V
-50
-40
-30
-20
-10
2700 3100 3500 3900
2LO LEAKAGE AT RF PORT vs.
LO FREQUENCY
MAX19999 toc69
LO FREQUENCY (MHz)
2LO LEAKAGE AT RF PORT (dBm)
VCC = 3.3V
PLO = -3dBm, 0dBm, +3dBm
-50
-40
-30
-20
-10
2700 3100 3500 3900
2LO LEAKAGE AT RF PORT vs.
LO FREQUENCY
MAX19999 toc70
LO FREQUENCY (MHz)
2LO LEAKAGE AT RF PORT (dBm)
VCC = 3.0V, 3.3V, 3.6V
30
20
25
10
15
5
0
3000 4000
RF PORT RETURN LOSS vs.
RF FREQUENCY
MAX19999 toc71
RF FREQUENCY (MHz)
RF PORT RETURN LOSS (dB)
34003200 3600 3800
VCC = 3.3V fIF = 350MHz
PLO = -3dBm, 0dBm, +3dBm
30
20
25
10
15
5
0
50 500
IF PORT RETURN LOSS vs.
IF FREQUENCY
MAX19999 toc72
IF FREQUENCY (MHz)
IF PORT RETURN LOSS (dB)
230140 320 410
fLO = 3200MHz
VCC = 3.0V, 3.3V, 3.6V
25
20
10
15
5
0
LO PORT RETURN LOSS vs.
LO FREQUENCY
MAX19999 toc73
LO FREQUENCY (MHz)
LO PORT RETURN LOSS (dB)
2650 31502900 3400 3650
VCC = 3.3V
PLO = -3dBm
PLO = +3dBm
PLO = 0dBm
240
260
250
280
270
290
300
SUPPLY CURRENT vs.
TEMPERATURE (TC)
MAX19999 toc74
TEMPERATURE (°C)
SUPPLY CURRENT (mA)
-35 5 25-15 45 65 85
VCC = 3.6V
VCC = 3.0V
VCC = 3.3V
MAX19999
Dual, SiGe High-Linearity, 3000MHz to
4000MHz Downconversion Mixer with LO Buffer
______________________________________________________________________________________ 15
Detailed Description
The MAX19999 provides high linearity and low noise fig-
ure for a multitude of 3000MHz to 4000MHz WiMAX and
LTE base-station applications. This device operates over
an LO range of 2650MHz to 3700MHz and an IF range of
50MHz to 500MHz. Integrated baluns and matching cir-
cuitry allow 50Ωsingle-ended interfaces to the RF and
LO ports. The integrated LO buffer provides a high drive
level to the mixer core, reducing the LO drive required at
the MAX19999’s input to a range of -3dBm to +3dBm.
The IF port incorporates a differential output, which is
ideal for providing enhanced 2RF-2LO performance.
RF Input and Balun
The MAX19999’s two RF inputs (RFMAIN and RFDIV)
provide a 50Ωmatch when combined with a series DC-
blocking capacitor. This DC-blocking capacitor is
required because the input is internally DC shorted to
ground through each channel’s on-chip balun. When
using a 1.5pF DC-blocking capacitor, the RF port input
return loss is typically 15dB over the RF frequency
range of 3200MHz to 3900MHz.
LO Input, Buffer, and Balun
A two-stage internal LO buffer allows a wide input
power range for the LO drive. All guaranteed specifica-
tions are for an LO signal power from -3dBm to +3dBm.
The on-chip low-loss balun, along with an LO buffer,
drives the double-balanced mixer. All interfacing and
matching components from the LO input to the IF out-
puts are integrated on chip.
High-Linearity Mixer
The core of the MAX19999 is a pair of double-bal-
anced, high-performance passive mixers. Exceptional
Pin Description
PIN NAME FUNCTION
1 RFMAIN Main Channel RF Input. Internally matched to 50Ω. Requires an input DC-blocking capacitor.
2, 5, 6, 8, 12, 15,
18, 23, 28, 31, 34 GND Ground. Not internally connected. Ground these pins or leave unconnected.
3, 7, 20, 22, 24,
25, 26, 27 GND Ground. Internally connected to the exposed pad (EP). Connect all ground pins and the exposed
pad together.
4, 10, 16, 21,
30, 36 VCC Power Supply. Connect bypass capacitors as close as possible to the pin (see the Typical
Application Circuit).
9 RFDIV Diversity Channel RF Input. This input is internally matched to 50Ω. Requires a DC-blocking
capacitor.
11 IFD_SET IF Diversity Amplifier Bias Control. Connect a resistor from this pin to ground to set the bias
current for the diversity IF amplifier.
13, 14 IFD+, IFD- Diversity Mixer Differential IF Output. Connect pullup inductors from each of these pins to VCC
(see the Typical Application Circuit).
17 LO_ADJ_D LO Diversity Amplifier Bias Control. Connect a resistor from this pin to ground to set the bias
current for the diversity LO amplifier.
19 LO Local Oscillator Input. This input is internally matched to 50Ω. Requires an input DC-blocking
capacitor.
29 LO_ADJ_M LO Main Amplifier Bias Control. Connect a resistor from this pin to ground to set the bias current
for the main LO amplifier.
32, 33 IFM-, IFM+ Main Mixer Differential IF Output. Connect pullup inductors from each of these pins to VCC
(see the Typical Application Circuit).
35 IFM_SET IF Main Amplifier Bias Control. Connect a resistor from this pin to ground to set the bias current for
the main IF amplifier.
—EP
Exposed Pad. Internally connected to GND. Solder this exposed pad to a PCB pad that uses
multiple ground vias to provide heat transfer out of the device into the PCB ground planes. These
multiple via grounds are also required to achieve the noted RF performance
MAX19999
Dual, SiGe High-Linearity, 3000MHz to
4000MHz Downconversion Mixer with LO Buffer
16 ______________________________________________________________________________________
linearity is provided by the large LO swing from the on-
chip LO buffer. When combined with the integrated IF
amplifiers, the cascaded IIP3, 2RF-2LO rejection, and
NF performance is typically +24dBm, 74dBc, and
10.5dB, respectively, for low-side LO injection architec-
tures covering the 3000MHz to 4000MHz RF band.
Differential IF Output Amplifier
The MAX19999 mixers have an IF frequency range of
50MHz to 500MHz. The differential, open-collector IF
output ports require external pullup inductors to VCC.
These pullup inductors are also used to resonate out
the parasitic shunt capacitance of the IC, PCB compo-
nents, and PCB to provide an optimized IF match at the
frequency of interest. Note that differential IF outputs
are ideal for providing enhanced 2RF-2LO rejection
performance. Single-ended IF applications require a
4:1 balun to transform the 200Ωdifferential output
impedance to a 50Ωsingle-ended output. After the
balun, the IF return loss is typically 18dB.
Applications Information
Input and Output Matching
The RF and LO inputs are internally matched to 50Ω. No
matching components are required for RF frequencies
ranging from 3000MHz to 4000MHz. RF and LO inputs
require only DC-blocking capacitors for interfacing.
The IF output impedance is 200Ω(differential). For
evaluation, an external low-loss 4:1 (impedance ratio)
balun transforms this impedance down to a 50Ωsingle-
ended output (see the
Typical Application Circuit
).
Reduced-Power Mode
Each channel of the MAX19999 has two pins
(LO_ADJ_ _, IF_ _SET) that allow external resistors to set
the internal bias currents. Nominal values for these
resistors are given in Table 1. Larger valued resistors
can be used to reduce power dissipation at the expense
of some performance loss. If ±1% resistors are not read-
ily available, ±5% resistors can be substituted.
Significant reductions in power consumption can also
be realized by operating the mixer with an optional sup-
ply voltage of 3.3V. Doing so reduces the overall power
consumption by up to 53%. See the
+3.3V Supply AC
Electrical Characteristics
table and the relevant +3.3V
curves in the
Typical Operating Characteristics
section
to evaluate the power vs. performance trade-offs.
Layout Considerations
A properly designed PCB is an essential part of any
RF/microwave circuit. Keep RF signal lines as short as
possible to reduce losses, radiation, and inductance.
For the best performance, route the ground pin traces
directly to the exposed pad under the package.
The PCB exposed pad MUST be connected to the
ground plane of the PCB. It is suggested that multiple
vias be used to connect this pad to the lower level
ground planes. This method provides a good RF/ther-
mal-conduction path for the device. Solder the exposed
pad on the bottom of the device package to the PCB.
The MAX19999 evaluation kit can be used as a refer-
ence for board layout. Gerber files are available upon
request at www.maxim-ic.com.
Power-Supply Bypassing
Proper voltage-supply bypassing is essential for high-
frequency circuit stability. Bypass each VCC pin with
the capacitors shown in the
Typical Application Circuit
.
Exposed Pad RF/Thermal Considerations
The exposed pad (EP) of the MAX19999’s 36-pin thin
QFN-EP package provides a low thermal-resistance
path to the die. It is important that the PCB on which the
MAX19999 is mounted be designed to conduct heat
from the exposed pad. In addition, provide the exposed
pad with a low-inductance path to electrical ground.
The exposed pad MUST be soldered to a ground plane
on the PCB, either directly or through an array of plated
via holes.
MAX19999
Dual, SiGe High-Linearity, 3000MHz to
4000MHz Downconversion Mixer with LO Buffer
______________________________________________________________________________________ 17
DESIGNATION QTY DESCRIPTION SUPPLIER
C1, C8, C14 3 1.5pF microwave capacitors (0402) Murata Electronics North America, Inc.
C4, C9, C13,
C15, C17, C18 6 0.01μF microwave capacitors (0402) Murata Electronics North America, Inc.
C10, C11, C12,
C19, C20, C21 6 82pF microwave capacitors (0603) Murata Electronics North America, Inc.
L1–L4 4 120nH wire-wound high-Q inductors* (0805) Coilcraft, Inc.
750 ±1% resistor (0402). Use for VCC = +5.0V applications.
Larger values can be used to reduce power at the expense
of some performance loss. See the Typical Operating
Characteristics.
Digi-Key Corp.
R1, R4 2
1.1k ±1% resistor (0402). Use for VCC = +3.3V applications.
Larger values can be used to reduce power at the expense
of some performance loss. See the Typical Operating
Characteristics.
Digi-Key Corp.
698 ±1% resistor (0402). Use for VCC = +5.0V applications.
Larger values can be used to reduce power at the expense
of some performance loss. See the Typical Operating
Characteristics.
Digi-Key Corp.
R2, R5 2
845 ±1% resistor (0402). Use for VCC = +3.3V applications.
Larger values can be used to reduce power at the expense
of some performance loss. See the Typical Operating
Characteristics.
Digi-Key Corp.
R3, R6 2
0 resistors (1206). These resistors can be increased in
value to reduce power dissipation in the device but will
reduce the compression point. Full P1dB performance
achieved using 0.
Digi-Key Corp.
T1, T2 2 4:1 IF balun TC4-1W-17+ Mini-Circuits
U1 1 MAX19999 IC (36 TQFN-EP) Maxim Integrated Products, Inc.
Table 1. Application Circuit Component Values
*
Use 390nH (0805) inductors for an IF frequency of 200MHz. Contact the factory for details.
MAX19999
Dual, SiGe High-Linearity, 3000MHz to
4000MHz Downconversion Mixer with LO Buffer
18 ______________________________________________________________________________________
Typical Application Circuit
RF MAIN INPUT
RF DIV INPUT
*USE 390nH (0805) INDUCTORS FOR AN IF FREQUENCY
OF 200MHz. CONTACT THE FACTORY FOR DETAILS.
C1
C8
C9
C13
C17
C18
R1
VCC
L2*
L1*
R3
C20
C19
IF MAIN OUTPUT
T1
R2
C14
LO
4:1
4:1
VCC
VCC
VCC
VCC
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18 28
29
30
31
32
33
34
35
36
19
20
21
22
23
24
25
26
27
VCC
GND
GND
GND
GND
GND
GND
RFMAIN
RFDIV
EXPOSED
PAD
IFD_SET
GND
GND
LO_ADJ_D
GND
V
CC
V
CC
GND
LO_ADJ_M
V
CC
GND
GND
IFM_SET
IFD+
IFD-
V
CC
IFM+
IFM-
LO
GND
GND
GND
GND
GND
GND
GND
VCC
MAX19999
C4
VCC
C21
C15
VCC
R5
R4
VCC
L3*
L4*
R6
C10
C11
T2
IF DIV OUTPUT
C12
+
MAX19999
Dual, SiGe High-Linearity, 3000MHz to 4000MHz
Downconversion Mixer with LO Buffer
Maxim cannot assume responsibility for use of any circuitry other than circuitry entirely embodied in a Maxim product. No circuit patent licenses are
implied. Maxim reserves the right to change the circuitry and specifications without notice at any time.
Maxim Integrated Products, 120 San Gabriel Drive, Sunnyvale, CA 94086 408-737-7600 ____________________
19
© 2008 Maxim Integrated Products is a registered trademark of Maxim Integrated Products, Inc.
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18 28
29
30
31
32
33
34
35
36
19
20
21
22
23
24
25
26
27 GND
VCC
GND
GND
GND
GND
GND
GND
RFMAIN
RFDIV
EXPOSED
PAD
IFD_SET
GND
GND
LO_ADJ_D
GND
VCC
VCC
GND
LO_ADJ_M
VCC
GND
GND
IFM_SET
IFD+
IFD-
VCC
IFM+
IFM-
LO
GND
GND
GND
GND
GND
GND
VCC
MAX19999
EXPOSED PAD ON THE BOTTOM OF THE PACKAGE.
THIN QFN-EP
(6mm x 6mm)
TOP VIEW
+
Pin Configuration/Functional Diagram
Chip Information
PROCESS: SiGe BiCMOS
Package Information
For the latest package outline information and land patterns, go
to www.maxim-ic.com/packages.
PACKAGE TYPE PACKAGE CODE DOCUMENT NO.
36 Thin QFN-EP T3666+2 21-0141
