CPC1330 Single-Pole, Normally Open 4-Pin OptoMOS(R) Relay INTEGRATED CIRCUITS DIVISION Parameters Peak Blocking Voltage Ratings 350 Units VP Load Current On-Resistance (max) 120 30 mArms / mADC Description The CPC1330G is a single-pole normally-open (1-Form-A) Solid State Relay with an enhanced input to output isolation barrier of 5000Vrms. The relay output is constructed with efficient MOSFET switches that use IXYS Integrated Circuits Division's patented OptoMOS architecture. The input, a highly efficient GaAlAS infrared LED, controls the optically coupled output. Features * * * * * * * * 5000Vrms Input/Output Isolation 350VP Blocking Voltage 100% Solid State Low Drive Power Requirements (TTL/CMOS Compatible) Arc-Free With No Snubbing Circuits No EMI/RFI Generation Small 4-Pin Package Machine Insertable, Wave Solderable Approvals * UL Certified Component: File E76270 * CSA Certified Component: Certificate 1172007 * EN/IEC 60950-1 Certified Component: TUV Certificate B 10 05 49410 006 Ordering Information Applications * Instrumentation * Multiplexers * Data Acquisition * Electronic Switching * I/O Subsystems * Meters (Watt-Hour, Water, Gas) * Medical Equipment--Patient/Equipment Isolation * Security * Aerospace * Industrial Controls Part Number CPC1330G CPC1330GR CPC1330GRTR Description 4-Pin DIP (100/Tube) 4-Pin Surface Mount (100/Tube) 4-Pin Surface Mount (1000/Reel) Pin Configuration + Control - Control 1 4 2 3 Load Load Switching Characteristics of Normally Open Devices Form-A IF 90% 10% ILOAD ton Pb DS-CPC1330-R05 toff e3 www.ixysic.com 1 INTEGRATED CIRCUITS DIVISION CPC1330 Absolute Maximum Ratings @ 25C Parameter Peak Blocking Voltage Reverse Input Voltage Input Control Current Peak (10ms) Input Power Dissipation 1 Total Package Dissipation 2 Isolation Voltage, Input to Output Operational Temperature Storage Temperature 1 Derate linearly 1.33 mW / C 2 Derate linearly 3.00 mW / C Ratings 350 5 50 1 100 550 5000 -40 to +85 -40 to +125 Units VP V mA A mW mW Vrms C C Absolute Maximum Ratings are stress ratings. Stresses in excess of these ratings can cause permanent damage to the device. Functional operation of the device at conditions beyond those indicated in the operational sections of this data sheet is not implied. Electrical Characteristics @ 25C Parameters Output Characteristics Load Current Continuous Peak On-Resistance Off-State Leakage Current Switching Speeds Turn-On Turn-Off Output Capacitance Input Characteristics Input Control Current to Activate Input Control Current to Deactivate Input Voltage Drop Reverse Input Current Common Characteristics Input to Output Capacitance 2 Conditions Symbol Min Typ - IL - t=10ms IL=120mA VL=350VP ILPK RON ILEAK - IF=0mA, VL=50V, f=1MHz ton toff COUT IL=120mA IF=5mA VR=5V - IF=5mA, VL=10V Max Units - 120 25 - 350 30 1 mArms / mADC mAP - 25 2 1 - IF IF VF IR 0.2 0.9 - 0.33 0.3 1.2 - 2 1.4 10 mA mA V A CI/O - 3 - pF www.ixysic.com A ms pF R05 INTEGRATED CIRCUITS DIVISION CPC1330 PERFORMANCE DATA* Typical Turn-On Time (N=50, IF=5mA, IL=120mA, TA=25C) 35 Device Count (N) Device Count (N) 30 25 20 15 10 Typical Turn-Off Time (N=50, IF=5mA, IL=120mA, TA=25C) 25 25 20 20 Device Count (N) Typical LED Forward Voltage Drop (N=50, IF=5mA, TA=25C) 15 10 5 15 10 5 5 0 0 LED Forward Voltage Drop (V) 1.00 1.10 1.15 Turn-On (ms) Typical IF for Switch Operation (N=50, IL=120mA, TA=25C) Typical IF for Switch Dropout (N=50, IL=120mA, TA=25C) 1.19 1.21 1.23 0.85 1.25 25 25 20 20 15 10 5 0.90 1.20 1.25 0.21 0.29 0.30 0.31 0.32 0.33 0.34 LED Current (mA) 15 10 5 0.26 0.27 25 20 15 10 5 0 0.27 0.35 0.28 0.29 0.30 0.31 0.32 0.33 23.5 24 24.5 25 25.5 26 26.5 On-Resistance (:) LED Current (mA) 35 0.23 0.24 0.25 Turn-Off (ms) 30 0 0 0.22 Typical On-Resistance Distribution (N=50, IL=120mA, TA=25C) 35 Device Count (N) 1.17 Device Count (N) Device Count (N) 0 Typical Blocking Voltage Distribution (N=50, TA=25C) Device Count (N) 30 25 20 15 10 5 0 370 I F = 50mA I F = 30mA I F = 20mA I F = 10mA I F = 5mA 1.2 1.0 0.8 -40 -20 0 20 40 60 Temperature (C) 80 100 120 400 2.0 1.8 1.6 1.4 1.2 1.0 0.8 0.6 0.4 0.2 0 Typical Turn-Off vs. LED Forward Current (IL=120mA) 0.7 0.6 Turn-Off (ms) 1.4 Turn-On (ms) LED Forward Voltage Drop (V) 1.6 380 385 390 395 Blocking Voltage (VP) Typical Turn-On vs. LED Forward Current (IL=120mA) Typical LED Forward Voltage Drop vs. Temperature 1.8 375 0.5 0.4 0.3 0.2 0.1 0 0 5 10 15 20 25 30 35 40 LED Forward Current (mA) 45 50 0 5 10 15 20 25 30 35 40 45 50 LED Forward Current (mA) *The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the written specifications, please contact our application department. R05 www.ixysic.com 3 INTEGRATED CIRCUITS DIVISION CPC1330 5.0 4.5 4.0 3.5 3.0 2.5 2.0 1.5 1.0 0.5 0 I F = 5mA I F = 10mA -40 -20 0 20 40 60 Temperature (C) 80 0 80 0.4 0.4 0.2 0 -40 -20 0 20 40 60 80 100 10 -40 20 40 60 Temperature (C) 80 0 -50 -100 -40 -20 0 20 40 60 80 -150 100 Temperature (C) Temperature (C) -1 0 1 Load Voltage (V) Maximum Load Current vs. Temperature Typical Blocking Voltage vs. Temperature Typical Leakage vs. Temperature Measured Across Pins 3 & 4 400 0.016 395 0.014 120 100 I F = 10mA 80 I F = 2mA 60 40 390 385 380 375 20 370 0 365 0 20 40 60 80 Temperature (C) 100 Leakage (PA) 140 -3 -2 2 3 0.012 0.010 0.008 0.006 0.004 0.002 -40 120 100 50 160 -20 0 100 180 -40 -20 150 0.6 0 20 Typical Load Current vs. Load Voltage (IF=5mA, TA=25C) 0.8 0.2 30 100 Load Current (mA) LED Current (mA) 0.6 40 0 20 40 60 Temperature (C) 1.0 0.8 50 Typical IF for Switch Dropout vs. Temperature (IL=80mA) 1.2 Blocking Voltage (VP) LED Current (mA) I F = 5mA -20 Typical On-Resistance vs. Temperature (IF=10mA, IL=80mA) 60 I F = 10mA -40 1.0 Load Current (mA) 1.0 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0 100 Typical IF for Switch Operation vs. Temperature (IL=80mA) 1.2 Typical Turn-Off vs. Temperature (IL=80mA) On-Resistance (:) Typical Turn-On vs. Temperature (IL=80mA) Turn-Off (ms) Turn-On (ms) PERFORMANCE DATA* -20 0 20 40 60 Temperature (C) 80 100 0 -40 -20 0 20 40 60 Temperature (C) 80 100 Load Current (A) Energy Rating Curve 1.0 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0 10s 100s 1ms 10ms 100ms 1s 10s 100s Time *The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the written specifications, please contact our application department. 4 www.ixysic.com R05 INTEGRATED CIRCUITS DIVISION CPC1330 Manufacturing Information Moisture Sensitivity All plastic encapsulated semiconductor packages are susceptible to moisture ingression. IXYS Integrated Circuits Division classified all of its plastic encapsulated devices for moisture sensitivity according to the latest version of the joint industry standard, IPC/JEDEC J-STD-020, in force at the time of product evaluation. We test all of our products to the maximum conditions set forth in the standard, and guarantee proper operation of our devices when handled according to the limitations and information in that standard as well as to any limitations set forth in the information or standards referenced below. Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced product performance, reduction of operable life, and/or reduction of overall reliability. This product carries a Moisture Sensitivity Level (MSL) rating as shown below, and should be handled according to the requirements of the latest version of the joint industry standard IPC/JEDEC J-STD-033. Device Moisture Sensitivity Level (MSL) Rating CPC1330G / CPC1330GR MSL 1 ESD Sensitivity This product is ESD Sensitive, and should be handled according to the industry standard JESD-625. Reflow Profile This product has a maximum body temperature and time rating as shown below. All other guidelines of J-STD-020 must be observed. Device Maximum Temperature x Time CPC1330G / CPC1330GR 250C for 30 seconds Board Wash IXYS Integrated Circuits Division recommends the use of no-clean flux formulations. However, board washing to remove flux residue is acceptable. Since IXYS Integrated Circuits Division employs the use of silicone coating as an optical waveguide in many of its optically isolated products, the use of a short drying bake could be necessary if a wash is used after solder reflow processes. Chlorine- or Fluorine-based solvents or fluxes should not be used. Cleaning methods that employ ultrasonic energy should not be used. Pb R05 e3 www.ixysic.com 5 INTEGRATED CIRCUITS DIVISION CPC1330 MECHANICAL DIMENSIONS CPC1330G 0.991 (0.039) PC Board Pattern (Top View) 0.254 (0.010) 3.30 0.050 (0.130 0.002) 6 - 0.800 DIA. (6 - 0.031 DIA.) 2.540 0.127 (0.100 0.005) 6.350 0.127 (0.250 0.005) 4.572 0.127 (0.180 0.005) 7.620 0.127 (0.300 0.005) PIN 1 9 (ALL) 9 (ALL) 7.620 0.250 (0.300 0.010) 2.159 (0.085) 0.457 0.076 (0.018 0.003) 9.144 0.508 (0.360 0.020) 6.350 0.127 (0.250 0.005) 0.508 (0.020) 3.175 (0.125) 2.540 0.127 (0.100 0.005) Dimensions mm (inches) CPC1330GR 2.540 0.127 (0.100 0.005) PCB Land Pattern 3.300 0.050 (0.130 0.002) 0.635 0.254 (0.025 0.010) 6.350 0.127 (0.250 0.005) 9.525 (0.375) 7.620 0.254 (0.300 0.010) 8.80 (0.346) 1.60 (0.063) PIN #1 0.991 (0.039) 9 1 (ALL) 2.287 (0.09) 3.480 0.076 (0.137 0.003) 4.572 0.127 (0.180 0.005) 0.254 (0.010) 0.95 (0.037) 2.540 0.127 (0.100 0.005) 2.287 0.127 (0.090 0.005) 6 0.102 min / 0.254 max (0.004 min / 0.010 max) www.ixysic.com Dimensions mm (inches) R05 INTEGRATED CIRCUITS DIVISION CPC1330 CPC1330GRTR Tape & Reel 330.2 Dia (13.00 Dia) Top Cover Tape Thickness 0.102 Max (0.004 Max) W=16.000.30 (0.6300.012) B0=5.00 (0.197) K0=4.20 (0.165) K1=3.70 (0.146) A0=10.01 (0.394) P=12.00 (0.472) Dimensions mm (inches) Embossed Carrier Embossment NOTES: 1. All dimensions meet EIA-481-C requirements 2. Unless otherwise noted, tolerances = 0.10 (0.004) For additional information please visit our website at: www.ixysic.com IXYS Integrated Circuits Division makes no representations or warranties with respect to the accuracy or completeness of the contents of this publication and reserves the right to make changes to specifications and product descriptions at any time without notice. Neither circuit patent licenses nor indemnity are expressed or implied. Except as set forth in IXYS Integrated Circuits Division's Standard Terms and Conditions of Sale, IXYS Integrated Circuits Division assumes no liability whatsoever, and disclaims any express or implied warranty, relating to its products including, but not limited to, the implied warranty of merchantability, fitness for a particular purpose, or infringement of any intellectual property right. The products described in this document are not designed, intended, authorized or warranted for use as components in systems intended for surgical implant into the body, or in other applications intended to support or sustain life, or where malfunction of IXYS Integrated Circuits Division's product may result in direct physical harm, injury, or death to a person or severe property or environmental damage. IXYS Integrated Circuits Division reserves the right to discontinue or make changes to its products at any time without notice. 7 Specification: DS-CPC1330-R05 (c)Copyright 2012, IXYS Integrated Circuits Division All rights reserved. Printed in USA. 12/22/2012