No. Classification Chip RF Jumper 151-XB-JP00BE PRODUCT SPECIFICATION FOR INFORMATION Subject EXBD6JP000A 12 - 10 1. Dimensions, structure and materials L A1 6 - D 6 T B1 5 W 4 B1 E1 1 2 3 P E2 T2 F1 A2 A ' F2 B2 B2 F1 A' F2 L W T1 A1 B1 E1 F1 Dimensions 3.200.15 1.600.15 0.550.15 0.400.15 0.200.15 0.400.15 0.200.15 (mm) A2 P D 1.905 Dimensions 0.400.15 0.380.15 0.400.15 0.350.15 0.200.15 (mm) 0.300 A-A' Sectional plan B2 (3) E2 F2 B-B' Sectional plan (2) (1) (5) (6) (7) (1) (2) (3) (4) (5) (6) Name Substrate Termination (Inner) Protective coating(Top) Protective coating(Bottom) Termination (Between) Termination (Outer) Material Alumina Ag Epoxy resin(Black) Epoxy resin(White) Ni plating Sn plating MATSUSHITA ELECTRONIC COMPONENTS CO., LTD. No. Classification Chip RF Jumper PRODUCT SPECIFICATION FOR INFORMATION 151-XB-JP00BE Subject EXBD6JP000A 12 - 11 2. Specifications Item Resistance(between 1-4 terminal) Isolation (2.5 GHz) Return loss (2.5 GHz) Insertion loss (2.5 GHz) Rated current 1) Maximum rated current Number of Terminals Category temperature range Specification 50 m max. -40 dB max. -20 dB max. -0.5 dB min. 1A 2A 6 Terminals -55 C to +125 C 1) Derating curve For jumpers operated in ambient temperature above 70 C, rated current shall be derated in accordance with 3. Derating curve Percent of rated current (%) 3. Derating curve for high ambient temperature 100 70C -55C 80 60 40 20 0 -60 -40 -20 125C 0 20 40 60 80 100 120 140 160 Ambient temperature (C) 4. Explanation of part number 1 2 3 4 5 6 7 8 9 10 11 E X B D 6 J P 0 0 0 A (2) (3) (1) (4) (5) 12 (6) (1) Product code: Thick film resistor network (2) Dimension code of chip resistor network: 3.2 mm x 1.6 mm (3) Number of terminals: 6 terminals (4) Circuit configuration Code JP000 (5) Characteristics impedance Circuit configuration RF jumper circuit Signal terminal: 1, 4, GND terminal: 2, 3, 5, 6 Code Characteristic impedance A 50 (6) Code for special requirements 5. Circuit 6 5 4 1 2 3 MATSUSHITA ELECTRONIC COMPONENTS CO., LTD. No. Classification Chip RF Jumper 151-XB-JP00BE PRODUCT SPECIFICATION FOR INFORMATION Subject EXBD6JP000A 12 - 12 6. Performance specification 6.1. Standard environmental condition Unless otherwise specified, ambient atmosphere at performance tests and measuring shall meet the following conditions. Ambient temperature: 25 C 2 C, Relative humidity: 45 % to 75 %, Atmosphere pressure: 86 kPa to 106 kPa 6.2. Test method Unless otherwise specified, the board, the land pattern, the flux, the solder and the soldering method in performance tests shall be subjected to "7. Precaution for mounting". 6.3. Electrical performance Characteristics 6.3.1. Resistance Specification 50 m max. 6.3.2. Isolation -40 dB max. (2.5 GHz) Test method Resistance value measured by four - point probe method at the test current of 10 mA to 100 mA. The measurement system shall be accurate sufficiently. Specimens shall be measured at the test circuit specified below. Measuring board: the attached drawing Measuring equipment: network analyzer Measuring parameter: s parameter(S21) Measuring power: 0 dBm Port 2 6 Port 1 5 4 1 2 50 MATSUSHITA ELECTRONIC COMPONENTS CO., LTD. 3 50 No. Classification Chip RF Jumper 151-XB-JP00BE PRODUCT SPECIFICATION FOR INFORMATION Subject EXBD6JP000A Characteristics 6.3.3. Return loss Specification -20 dB max. (2.5 GHz) 12 - 13 Test method Specimens shall be measured at the test circuit specified below. Measuring board: the attached drawing Measuring equipment: network analyzer Measuring parameter: s parameter (S11) Measuring power: 0 dBm Port 1 6 5 2 3 4 1 50 50 6.3.4. Insertion loss -0.5 dB min. (2.5 GHz) Specimens shall be measured at the test circuit specified below. Measuring board: the attached drawing Measuring equipment: network analyzer Measuring parameter: s parameter (S21) Measuring power: 0 dBm Port 1 6 5 2 3 4 1 50 6.3.5. 1000 M min. Insulation resistance Port 2 Port 2 50 Insulation resistance shall be measured at DC 25 V between the terminal and the protective coating. MATSUSHITA ELECTRONIC COMPONENTS CO., LTD. No. Classification Chip RF Jumper PRODUCT SPECIFICATION FOR INFORMATION 151-XB-JP00BE Subject EXBD6JP000A 12 - 14 6.4. Environmental performance Characteristics 6.4.1. Rapid change of temperature Specification 50 m max. Test method Specimens shall be tested for 700 cycles continuously in accordance with the following duty cycle. * Prior to use, verify the performance, reliability, etc. thoroughly, if you use the board that is not glass-fabric based epoxy resin. Step Temperature Time -40 C 3 C 1 40 min 3 min room temperature 2 3 min max. +85 C 3 C 3 40 min 3 min room temperature 4 3 min max. 6.4.2. 50 m max. Load life in humidity 6.4.3. Endurance at 85C 50 m max. 6.4.4. Endurance at -40C 50 m max. 6.4.5. High temperature exposure 6.4.6. Low temperature exposure 6.4.7. Solvent resistance 6.4.8. Resistance to soldering heat 50 m max. 50 m max. Specimens shall be exposed at 60 C 2 C and 90 % to 95 % relative humidity in a h. humidity test chamber for 1000 h +48 0 During this time, the rated current shall be applied intermittently for 1.5 h ON, 0.5 h OFF. Specimens shall be exposed at 85 C 2 C for 1000 h +48 h. During this time, the 0 rated current shall be applied. Specimens shall be exposed at -40 C 2 C for 1000 h +48 h. During this time, the 0 rated current shall be applied. Specimens shall be exposed at 85 C 2 C for 1000 h +48 h. 0 Specimens shall be exposed at -40 C 2 C h. for 1000 h +48 0 No deterioration of protective Specimens shall be immersed in a bath of coatings isopropyl alcohol completely for 5 min. 50 m max. Specimens shall be immersed in 260 C 5 C solder (H63A) for 10 s 1 s, 2 times after 150 C 5 C pre-heat for 1 min. MATSUSHITA ELECTRONIC COMPONENTS CO., LTD. No. Classification Chip RF Jumper 151-XB-JP00BE PRODUCT SPECIFICATION FOR INFORMATION Subject EXBD6JP000A 12 - 15 7. Mechanical Performance Characteristics Specification 7.1.1. 50 m max. Bond strength of the and no evidence of face plating mechanical damage. 7.1.2. Solderability Test method Specimens shall be placed on testing board that is glass-fabric based epoxy resin with 100 mm in length, 40 mm in width and 1.6 mm in thickness. The testing board shall be supported at two points 45 mm from its center with mounting surface, and middle part of it's board shall be pressed at rate of 1 mm/s until the deflection becomes 1 mm and then the pressure shall be maintained for 30 s. Specimens shall be tested by the following conditions. Test temperature of solder : 215 C 5 C Dwell time in solder : 5 s 0.5 s 95 % coverage min. 8. Precautions for mounting 8.1. Land pattern Land pattern is shown in the figure below. 3.8 1.51 0.4 0.4 Land pattern 0.6 0.65 2.2 0.5 0.65 0.6 Unit: mm 8.2. Solder cream in reflow soldering Printing pattern of solder cream is shown in the figure below. 0.5 B 0.35 A 0.1 A B 0.1 B 0.25 B 0.4 Unit: mm Metal mask opening pattern A 0.35 2.4 B 0.2 0.7 4.0 0.6 MATSUSHITA ELECTRONIC COMPONENTS CO., LTD. No. Classification Chip RF Jumper PRODUCT SPECIFICATION FOR INFORMATION 151-XB-JP00BE Subject EXBD6JP000A MATSUSHITA ELECTRONIC COMPONENTS CO., LTD. 12 - 16 No. Classification Chip RF Jumper 151-XB-JP00BE PRODUCT SPECIFICATION FOR INFORMATION Subject EXBD6JP000A 12 - 17 8.3. Flux Use rosin-based flux. Do not use high-activity flux (the chlorine content is 0.2wt% or more.) 8.4. Precaution for handling of substrate Do not bend the board after soldering the product extremely. (Example) Vacuum nozzle Another chip * Mounting place should be as far as possible from the position which is closed to the break line of board or the line of large holes of board. The product * When mounting other components, do not Board bend the board extremely. If necessary, use Support pin back-up pin (support pin) to prevent from bending extremely. * Do not break the board by hand. We recommend to use the machine or the jig to break it. 8.5. Precaution for soldering Note that the product will be easily damaged by rapid heating, rapid cooling and local heating. Allow enough preheating so that the difference of soldering temperature and temperature of surface of the part is 100 C or less. This temperature difference shall be kept in rapid cooling by immersion into solvent. 8.6. Recommendable reflow soldering <Eutectic solder> (Sn/Pb system et al.) Temperature Peak Condition Preheating Main heating Preheating Main heating Peak and study solderability every type of boards, before actual use. * Please inquire of us when you use the to 160oC Time 60s to 120s 200oC min. 30s to 40s 235oC 5oC 10s max. <Lead-free solder> (Sn/Ag/Cu system et al.) Condition Time * Please measure temperature of terminals 140oC Preheating 150oC to 180oC Main 230oC min. heating Peak 260oC max. different conditions. MATSUSHITA ELECTRONIC COMPONENTS CO., LTD. Time 60s to 120s 30s to 40s 10s max. No. Classification Chip RF Jumper PRODUCT SPECIFICATION FOR INFORMATION 151-XB-JP00BE Subject EXBD6JP000A * Reflow soldering shall be within five times. MATSUSHITA ELECTRONIC COMPONENTS CO., LTD. 12 - 18 No. Classification Chip RF Jumper PRODUCT SPECIFICATION FOR INFORMATION 151-XB-JP00BE Subject EXBD6JP000A 12 - 19 8.7. Caution of flow soldering We can not recommend the flow soldering to the product, because we are afraid that solder bridge may happen owing to narrow pitch of it's terminals. 8.8. Replacement with soldering iron Note the followings in case of using soldering iron for replacement. (1) The tip temperature should be less than 350 C for the period within 3 s for each terminal. (2) The soldering iron tip should not touch the product directly. 8.9. Recommendable cleaning method Solvents Cleaning method Dipping Ultrasonic Isopropyl alcohol 40 C max., 5 min max. 1 min max. (Power: 20 W/l max, frequency: 10 kHz to 100 kHz) Residual fluxes after board washing may cause solder migration. Carefully check the status of board washing. Study type and amount of flux to be used in cleaning free soldering. Study type of water-soluble flux and cleaning agent and dry condition when water washing is made. Confirm they will not cause any troubles. 9. Notice for use ! Notice for use (1)This specification shows the quality and performance of the product in a unit component. Before adoption, be sure to evaluate and verify the product mounted on your circuit board. (2)Use fail-safe design and ensure safety by carrying out the following items in cases where it is forecast that the failure of the product gives serious damage to something important like human life, for instance in traffic transportation equipment (trains, cars, traffic signal equipment, etc.), medical equipment, aerospace equipment, electric heating appliances, combustion and gas equipment, rotating equipment, disaster and crime preventive equipment. Ensure safety as the system by setting protective circuits and protective equipment. Ensure safety as the system by setting such redundant circuits as do not cause danger by a single failure. (3)The product is designed to use in general standard applications of general electric equipment (AV products, household electric appliances, office equipment, information and communication equipment, etc.); hence, it do not take the use under the following special environments into consideration. MATSUSHITA ELECTRONIC COMPONENTS CO., LTD. No. Classification Chip RF Jumper PRODUCT SPECIFICATION FOR INFORMATION 151-XB-JP00BE Subject EXBD6JP000A 12 - 20 ! Notice for use Accordingly, the use in the following special environments, and such environmental conditions may affect the performance of the product; prior to use, verify the performance, reliability, etc. thoroughly. 1) Use in liquids such as water, oil, chemical and organic solvent. 2) Where the product is close to a heating component, or where an inflammable such as a polyvinyl chloride wire is arranged close to the product. 3) Where the product is sealed or coated with resin , etc. 4) Where water or a water-soluble detergent is used in flux cleaning after soldering. (pay particular attention to soluble flux.) 5) Use in such a place where the product is wetted due to dew condensation 6) Use in places full of corrosive gases such as sea breeze, Cl, HS, NH, SO, and NOX 7) Use under direct sunlight, in outdoor or in dusty atmospheres 8) Use in environment with large static electricity or strong electromagnetic waves. (4)Whenever a doubt about safety arises from this product, please inform us immediately and be sure to evaluate and verify the product mounted on your circuit board. 10. Storage method If the product is stored in the following environments and conditions, the performance and solderability may be badly affected. Avoid the storage in the following environments. (1) Storage in places full of corrosive gases such as sea breeze, Cl, HS, NH, SO, and NOX (2) Storage in places exposed to direct sunlight (3) Storage in places outside the temperature range of 5 C to 35 C and humidity range of 45 %RH to 85 %RH (4) Storage over a year after our delivery (This item also applies to the case where the storage method specified in item (1) to (3) has been followed.) 11. Low and regulation (1) No ODCs or other ozone-depleting substances that are subject to regulation under the Montreal Protocol are used in our manufacturing processes, including in the manufacture of this product. (2) All materials used in this product are existing chemical substances recognized under "lows on examination of chemical substances and regulations of manufacturing and others." (3) None of the materials used in this product contain the designated incombustible bromic substances, PBBOs and PBBs. (4) Please contact us to obtain a notice as to whether this product has passed inspection under review criteria primarily based on Foreign Exchange and Foreign Trade Control Laws, and appended table in the Export Control Laws. MATSUSHITA ELECTRONIC COMPONENTS CO., LTD. No. Classification Chip RF Jumper 151-XB-JP00BE PRODUCT SPECIFICATION FOR INFORMATION Subject EXBD6JP000A 12 - 21 12. Period of validity for specification If there is not an offer by 3 months before term of validity, term of validity shall be extended every one year. When you confirm revision of this specification while it is in effect, the previous, unrevised version shall lose its validity. 13. Production place Production country: Japan Production factory: Fukui Matsushita Electric Co., Ltd. 14. Taping package and label marking 14.1. Packaging method Products shall be heat-sealed in the chip pockets, spacing pitch 4 mm, of paper carrier tape with bottom tape and cover tape, and the carrier tape shall be reeled to the reel. 14.2. Carrier tape dimensions Feeding hole C - C' C P0 P2 t1 B W F E D0 A t2 P1 C' Chip pocket Tape running direction A Dimensions 2.00.2 (mm) P0 Dimensions 4.00.1 (mm) B W 3.60.2 8.00.2 D0 t1 1.5+0.1 0.0 F E P1 3.50.1 1.750.10 4.00.1 t2 0.750.05 0.840.10 MATSUSHITA ELECTRONIC COMPONENTS CO., LTD. P2 2.00.1 No. Classification Chip RF Jumper PRODUCT SPECIFICATION FOR INFORMATION 151-XB-JP00BE Subject EXBD6JP000A 12 - 22 14.3. Taping reel dimensions and material Unit: mm 11.42.0 180 -30 60 min. 13.01.0 9.01.0 * Material: PS 14.4. Taping specification There shall be portions having no product in both the trailer and the leader of taping, and there shall be portion having only cover tape in the leader of taping as shown below. The component can fall headlong naturally from taping, when the cover tape was removed and the component was moved upside down. Trailer 40 mm min. Leader 400 mm min. 20 pockets min. Having chips Having no chips Cover tape Direction of feed 14.5. Top tape peeling strength When the test shall be operated with the beloe conditions, cover tape peeling strength should be 0.1 N to 1.0 N. Cover tape 165o to 180o Peeling direction (Peeling speed: 300mm/min10mm/min) Carrier tape Direction of feed Bottom tape MATSUSHITA ELECTRONIC COMPONENTS CO., LTD. No. Classification Chip RF Jumper PRODUCT SPECIFICATION FOR INFORMATION 151-XB-JP00BE Subject EXBD6JP000A 12 - 23 14.6. Label marking The following items shall be indicated in the label on the reel (1) Part number (2) Quantity (3) Lot number or serial number [ Lot number ] 2040400103 Year of manufacture (4th number of year) --- 1 digit Month of manufacture --- 2 digits Day of manufacture --- 2 digits Machine number --- 3 digits Serial number --- 2 digits * Part number and quantity shall be indicated on outer packaging. 14.7. Quantity of products in the taping package (1) Standard quantity: 5,000 pcs./ reel (2) Shipping quantity: multiple of standard quantity. MATSUSHITA ELECTRONIC COMPONENTS CO., LTD.