Classification No.
151-XB-JP00BE
Chip RF Jumper PRODUCT SPECIFICATION FOR INFORMATION
Subject
12 - 10
EXBD6JP000A
MATSUSHITA ELECTRONIC COMPONENTS CO., LTD.
1. Dimensions, structure and materials
F1
F1
T
L
P
A
1
F2
6 - φD
E1
E2
B1
B1
B2
B2
W
A
2
F2
1
23
4
5
6
A
A
’
Ｂ’
Ｂ
T2
A-A' Sectional plan B-B' Sectional plan
(3)
(2)
(1)
(5)
(6)
(7)
Name Material
(1) Substrate
A
lumina
(2) Termination (Inner)
A
g
(3) Protective coating(Top) Epoxy resin(Black)
(4) Protective coating(Bottom) Epoxy resin(White)
(5) Termination (Between) Ni plating
(6) Termination (Outer) Sn plating
L W T1 A1 B1 E1 F1
Dimensions
(mm) 3.20±0.15 1.60±0.15 0.55±0.15 0.40±0.15 0.20±0.15 0.40±0.15 0.20±0.15
A2 B2 E2 F2 P D
Dimensions
(mm) 0.40±0.15 0.38±0.15 0.40±0.15 0.35±0.15 1.905
±0.300 0.20±0.15
Classification No.
151-XB-JP00BE
Chip RF Jumper PRODUCT SPECIFICATION FOR INFORMATION
Subject
12 - 11
EXBD6JP000A
MATSUSHITA ELECTRONIC COMPONENTS CO., LTD.
2. S pecificatio ns
Item Specification
Resistance(between 1-4 terminal) 50 m
Ω
max.
Isolation (2.5 GHz) -40 dB max.
Return loss (2.5 GHz) -20 dB max.
Insertion loss (2.5 GHz) -0.5 dB min.
Rated current 1) 1 A
Maximum rated current 2 A
Number of Terminals 6 Terminals
Category temperature range -55 °C to +125 °C
3. Derating curve for high ambi ent temperature
100
80
60
40
20
020
0120100-40 -20-60 806040 140 160
70°C
Ambient temperature (°C)
Percent of rated current (%)
125°C
-55°C
4. Explanation of part number
1 2 3 4 5 6 7 8 9 10 11 12
E X B D 6 J P 0 0 0 A
(1) (2) (3) (4) (5) (6)
(1) Product code: Thick film resistor network
(2) Dimension code of chip resistor network: 3.2 mm × 1.6 mm
(3) Number of terminals: 6 terminals
(4) Circuit configuration (5) Characteristics impedance
Code Circuit configuration Code Characteristic impedance
JP000
RF jumper circuit
A 50 Ω
(6) Code for special requirements
5. Circuit
65
4
3
2
1
1) Derating curve
For jumpers operated in
ambient temperature above
70 °C, rated current shall be
derated in accordance with
3. Derating curve
Signal terminal: 1, 4,
GND terminal: 2
,
3
,
5
,
6
Classification No.
151-XB-JP00BE
Chip RF Jumper PRODUCT SPECIFICATION FOR INFORMATION
Subject
12 - 12
EXBD6JP000A
MATSUSHITA ELECTRONIC COMPONENTS CO., LTD.
6. Performance specification
6.1. Standard environmental condition
Unless otherwise specified, ambient atmosphere at performance tests and measuring shall
meet the following conditions.
Ambient temperature: 25 °C ± 2 °C, Relative humidity: 45 % to 75 %,
Atmosphere pressure: 86 kPa to 106 kPa
6.2. Test method
Unless otherwise specified, the board, the land pattern, the flux, the solder and the
soldering method in performance tests shall be subjected to “7. Precaution for mounting”.
6.3. Electrical performance
Characteristics Specification Test method
6.3.1.
Resistance
50 mΩ max. Resistance value measured by four
–
point
probe method at the test current of 10 mA to
100 mA. The measurement system shall be
accurate sufficiently.
6.3.2.
Isolation
-40 dB max. (2.5 GHz) Specimens shall be measured at the test
circuit specified below.
Measuring board: the attached drawing
Measuring equipment: network analyzer
Measuring parameter: s parameter(S21)
Measuring power: 0 dBm
23
4
6
1
Port 2
Port 1
50 Ω50 Ω
5
Classification No.
151-XB-JP00BE
Chip RF Jumper PRODUCT SPECIFICATION FOR INFORMATION
Subject
12 - 13
EXBD6JP000A
MATSUSHITA ELECTRONIC COMPONENTS CO., LTD.
Characteristics Specification Test method
6.3.3.
Return loss
-20 dB max. (2.5 GHz) Specimens shall be measured at the test
circuit specified below.
Measuring board: the attached drawing
Measuring equipment: network analyzer
Measuring parameter: s parameter (S11)
Measuring power: 0 dBm
23
4
6
1
Port 1
50 Ω50 Ω
5
Port 2
6.3.4.
Insertion loss -0.5 dB min. (2.5 GHz) Specimens shall be measured at the test
circuit specified below.
Measuring board: the attached drawing
Measuring equipment: network analyzer
Measuring parameter: s parameter (S21)
Measuring power: 0 dBm
23
4
6
1
Port 1
50 Ω50 Ω
5
Port 2
6.3.5.
Insulation resistance 1000 MΩ min. Insulation resistance shall be measured at
DC 25 V between the terminal and the
protective coating.
Classification No.
151-XB-JP00BE
Chip RF Jumper PRODUCT SPECIFICATION FOR INFORMATION
Subject
12 - 14
EXBD6JP000A
MATSUSHITA ELECTRONIC COMPONENTS CO., LTD.
6.4. Environmental performance
Characteristics Specification Test method
6.4.1.
Rapid change of
temperature
50 mΩ max.
Specimens shall be tested for 700 cycles
continuously in accordance with the
following duty cycle.
* Prior to use, verify the performance,
reliability, etc. thoroughly, if you use the
board that is not glass-fabric based epoxy
resin.
6.4.2.
Load life in humidity
50 mΩ max. Specimens shall be exposed at 60 °C ± 2 °C
and 90 % to 95 % relative humidity in a
humidity test chamber for 1000 h +48
0 h.
During this time, the rated current shall be
applied intermittently for 1.5 h ON, 0.5 h
OFF.
6.4.3.
Endurance at 85°C
50 mΩ max. Specimens shall be exposed at 85 °C ± 2 °C
for 1000 h +48
0 h. During this time, the
rated current shall be applied.
6.4.4.
Endurance at -40°C
50 mΩ max. Specimens shall be exposed at –40 °C ± 2 °C
for 1000 h +48
0 h. During this time, the
rated current shall be applied.
6.4.5.
High temperature
exposure
50 mΩ max. Specimens shall be exposed at 85 °C ± 2 °C
for 1000 h +48
0 h.
6.4.6.
Low temperature
exposure
50 mΩ max. Specimens shall be exposed at –40 °C ± 2 °C
for 1000 h +48
0 h.
6.4.7.
Solvent resistance
No deterioration of protective
coatings
Specimens shall be immersed in a bath of
isopropyl alcohol completely for 5 min.
6.4.8.
Resistance to
soldering heat
50 mΩ max. Specimens shall be immersed in 260 °C ± 5
°C solder (H63A) for 10 s ± 1 s, 2 times after
150 °C ± 5 °C pre-heat for 1 min.
Step Temperature Time
1 -40 °C
±
3 °C 40 min ± 3 min
2room temperature 3 min max.
3+85 °C
±
3 °C 40 min ± 3 min
4room temperature 3 min max.
Classification No.
151-XB-JP00BE
Chip RF Jumper PRODUCT SPECIFICATION FOR INFORMATION
Subject
12 - 15
EXBD6JP000A
MATSUSHITA ELECTRONIC COMPONENTS CO., LTD.
7. Mechanical Performance
Characteristics Specification Test method
7.1.1.
Bond strength of the
face plating
50 mΩ max.
and no evidence of
mechanical damage.
Specimens shall be placed on testing board
that is glass-fabric based epoxy resin with
100 mm in length, 40 mm in width and 1.6
mm in thickness.
The testing board shall be supported at two
points 45 mm from its center with
mounting surface, and middle part of it’s
board shall be pressed at rate of 1 mm/s
until the deflection becomes 1 mm and
then the pressure shall be maintained for
30 s.
7.1.2.
Solderability
95 % coverage min. Specimens shall be tested by the following
conditions.
Test temperature of solder : 215 °C ± 5 °C
Dwell time in solder : 5 s ± 0.5 s
8. Precautions for mounting
8.1. Land pattern
Land pattern is shown in the figure below.
0.4 1.51 Land pattern
Unit: mm
2.2
0.5
0.4
3.8
0.6 0.6
0.65
0.65
8.2. Solder cream in reflow soldering
Printing pattern of solder cream is shown in the figure below.
Metal mask
opening pattern
Unit: mm
2.4
4.0
A
A
BB
B
B
0.2 0.35
0.1
0.5
0.7
A
0.4
0.6
B
0.35 0.25
0.1
Classification No.
151-XB-JP00BE
Chip RF Jumper PRODUCT SPECIFICATION FOR INFORMATION
Subject
12 - 16
EXBD6JP000A
MATSUSHITA ELECTRONIC COMPONENTS CO., LTD.
Classification No.
151-XB-JP00BE
Chip RF Jumper PRODUCT SPECIFICATION FOR INFORMATION
Subject
12 - 17
EXBD6JP000A
MATSUSHITA ELECTRONIC COMPONENTS CO., LTD.
8.3. Flux
Use rosin-based flux. Do not use high-activity flux (the chlorine content is 0.2wt% or
more.)
8.4. Precaution for handling of substrate
Do not bend the board after soldering the product extremely.
(Example)
• Mounting place should be as far as possible
from the position which is closed to the break
line of board or the line of large holes of
board.
• When mounting other components, do not
bend the board extremely. If necessary, use
back-up pin (support pin) to prevent from
bending extremely.
• Do not break the board by hand. We recommend to use the machine or the jig to break it.
8.5. Precaution for soldering
Note that the product will be easily damaged by rapid heating, rapid cooling and local
heating.
Allow enough preheating so that the difference of soldering temperature and temperature
of surface of the part is 100 °C or less. This temperature difference shall be kept in rapid
cooling by immersion into solvent.
8.6. Recommendable reflow soldering
• Please measure temperature of terminals
and study solderability every type of boards,
before actual use.
• Please inquire of us when you use the
different conditions.
The product
Support pin
Board
Another chip Vacuum nozzle
Temperature
Time
Preheating Main
heating
Peak
<Eutectic solder> (Sn/Pb system et al.)
Condition Time
Preheating 140oC to 160oC 60s to 120s
Main
heating 200oC min. 30s to 40s
Peak 235oC ± 5oC 10s max.
<Lead-free solder> (Sn/Ag/Cu system et al.)
Condition Time
Preheating 150oC to 180oC 60s to 120s
Main
heating 230oC min. 30s to 40s
Peak 260oC max. 10s max.
Classification No.
151-XB-JP00BE
Chip RF Jumper PRODUCT SPECIFICATION FOR INFORMATION
Subject
12 - 18
EXBD6JP000A
MATSUSHITA ELECTRONIC COMPONENTS CO., LTD.
• Reflow soldering shall be within five times.
Classification No.
151-XB-JP00BE
Chip RF Jumper PRODUCT SPECIFICATION FOR INFORMATION
Subject
12 - 19
EXBD6JP000A
MATSUSHITA ELECTRONIC COMPONENTS CO., LTD.
8.7. Caution of flow soldering
We can not recommend the flow soldering to the product, because we are afraid that solder
bridge may happen owing to narrow pitch of it’s terminals.
8.8. Replacement with soldering iron
Note the followings in case of using soldering iron for replacement.
(1) The tip temperature should be less than 350 °C for the period within 3 s for each
terminal.
(2) The soldering iron tip should not touch the product directly.
8.9. Recommendable cleaning method
Solvents Isopropyl alcohol
Cleaning
method
Dipping 40 °C max., 5 min max.
Ultrasonic 1 min max.
(Power: 20 W/l max, frequency: 10 kHz to 100 kHz)
Residual fluxes after board washing may cause solder migration. Carefully check the status
of board washing.
Study type and amount of flux to be used in cleaning free soldering. Study type of
water-soluble flux and cleaning agent and dry condition when water washing is made.
Confirm they will not cause any troubles.
9. Notice for use
!Notice for use
(1)This specification shows the quality and performance of the product in a unit
component. Before adoption, be sure to evaluate and verify the product mounted on
your circuit board.
(2)Use fail-safe design and ensure safety by carrying out the following items in cases
where it is forecast that the failure of the product gives serious damage to something
important like human life, for instance in traffic transportation equipment (trains,
cars, traffic signal equipment, etc.), medical equipment, aerospace equipment,
electric heating appliances, combustion and gas equipment, rotating equipment,
disaster and crime preventive equipment.
Ensure safety as the system by setting protective circuits and protective
equipment.
Ensure safety as the system by setting such redundant circuits as do not cause
danger by a single failure.
(3)The product is designed to use in general standard applications of general electric
equipment (AV products, household electric appliances, office equipment, information
and communication equipment, etc.); hence, it do not take the use under the
following special environments into consideration.
Classification No.
151-XB-JP00BE
Chip RF Jumper PRODUCT SPECIFICATION FOR INFORMATION
Subject
12 - 20
EXBD6JP000A
MATSUSHITA ELECTRONIC COMPONENTS CO., LTD.
!Notice for use
A
ccordingly, the use in the following special environments, and such environmental
conditions may affect the performance of the product; prior to use, verify the
performance, reliability, etc. thoroughly.
1) Use in liquids such as water, oil, chemical and organic solvent.
2) Where the product is close to a heating component, or where an inflammable
such as a polyvinyl chloride wire is arranged close to the product.
3) Where the product is sealed or coated with resin , etc.
4) Where water or a water-soluble detergent is used in flux cleaning after
soldering. (pay particular attention to soluble flux.)
5) Use in such a place where the product is wetted due to dew condensation
6) Use in places full of corrosive gases such as sea breeze, Cl２, H２S, NH３, SO２, and
NOX
7) Use under direct sunlight, in outdoor or in dusty atmospheres
8) Use in environment with large static electricity or strong electromagnetic waves.
(4)Whenever a doubt about safety arises from this product, please inform us immediately
and be sure to evaluate and verify the product mounted on your circuit board.
10. Storage method
If the product is stored in the following environments and conditions, the performance and
solderability may be badly affected. Avoid the storage in the following environments.
(1) Storage in places full of corrosive gases such as sea breeze, Cl２, H２S, NH３, SO２, and NOX
(2) Storage in places exposed to direct sunlight
(3) Storage in places outside the temperature range of 5 °C to 35 °C and humidity range of
45 %RH to 85 %RH
(4) Storage over a year after our delivery (This item also applies to the case where the
storage method specified in item (1) to (3) has been followed.)
11. Low and regulation
(1) No ODCs or other ozone-depleting substances that are subject to regulation under the
Montreal Protocol are used in our manufacturing processes, including in the manufacture
of this product.
(2) All materials used in this product are existing chemical substances recognized under
"lows on examination of chemical substances and regulations of manufacturing and
others."
(3) None of the materials used in this product contain the designated incombustible bromic
substances, PBBOs and PBBs.
(4) Please contact us to obtain a notice as to whether this product has passed inspection
under review criteria primarily based on Foreign Exchange and Foreign Trade Control
Laws, and appended table in the Export Control Laws.
Classification No.
151-XB-JP00BE
Chip RF Jumper PRODUCT SPECIFICATION FOR INFORMATION
Subject
12 - 21
EXBD6JP000A
MATSUSHITA ELECTRONIC COMPONENTS CO., LTD.
12. Period of validity for specification
If there is not an offer by 3 months before term of validity, term of validity shall be
extended every one year. When you confirm revision of this specification while it is in effect,
the previous, unrevised version shall lose its validity.
13. Production place
Production country: Japan
Production factory: Fukui Matsushita Electric Co., Ltd.
14. Taping package and label marking
14.1. Packaging method
Products shall be heat-sealed in the chip pockets, spacing pitch 4 mm, of paper carrier tape
with bottom tape and cover tape, and the carrier tape shall be reeled to the reel.
14.2. Carrier tape dimensions
C
C’
Feeding hole
Chip pocket
P1
P0 P2
A
φD0
E
W
F
t1
t2
Tape running direction
C - C’
B
A B W F E P1 P2
Dimensions
(mm) 2.0±0.2 3.6±0.2 8.0±0.2 3.5±0.1 1.75±0.10 4.0±0.1 2.0±0.1
P0
φD0 t1 t2
Dimensions
(mm) 4.0±0.1 1.5+0.1
0.0 0.75±0.05 0.84±0.10
Classification No.
151-XB-JP00BE
Chip RF Jumper PRODUCT SPECIFICATION FOR INFORMATION
Subject
12 - 22
EXBD6JP000A
MATSUSHITA ELECTRONIC COMPONENTS CO., LTD.
14.3. Taping reel dimensions and mat erial
180
11.4±2.0
9.0±1.0
60 min.
0
-3
Unit: mm
13.0
±
1.0
* Material: PS
14.4. Taping specification
There shall be portions having no product in both the trailer and the leader of taping, and
there shall be portion having only cover tape in the leader of taping as shown below.
The component can fall headlong naturally from taping, when the cover tape was removed
and the component was moved upside down.
Trailer
40 mm min.Leader
400 mm min.
20 pockets min.
Having chips Having no chips Cover tape
Direction of feed
14.5. Top tape peeling strength
When the test shall be operated with the beloe conditions, cover tape peeling strength
should be 0.1 N to 1.0 N.
Direction of feed Bottom tape
Carrier tape
Cover tape
Peeling direction
(Peeling speed: 300mm/min±10mm/min)
165o to 180o
Classification No.
151-XB-JP00BE
Chip RF Jumper PRODUCT SPECIFICATION FOR INFORMATION
Subject
12 - 23
EXBD6JP000A
MATSUSHITA ELECTRONIC COMPONENTS CO., LTD.
14.6. Label marking
The following items shall be indicated in the label on the reel
(1) Part number
(2) Quantity
(3) Lot number or serial number
[ Lot number ]
2 0 4 0 4 0 0 1 0 3
Year of manufacture (4th number of year) --- 1 digit
Month of manufacture --- 2 digits
Day of manufacture --- 2 digits
Machine number --- 3 digits
Serial number --- 2 digits
* Part number and quantity shall be indicated on outer packaging.
14.7. Quantity of products in the taping package
(1) Standard quantity: 5,000 pcs./ reel
(2) Shipping quantity: multiple of standard quantity.
