SN5410, SN54LS10, SN54S10, SN7410, SN74LS10, SN74S10 TRIPLE 3-INPUT POSITIVE-NAND GATES SDLS035A - DECEMBER 1983 - REVISED APRIL 2003 Copyright (c) 2003, Texas Instruments Incorporated PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. POST OFFICE BOX 655303 * DALLAS, TEXAS 75265 1 SN5410, SN54LS10, SN54S10, SN7410, SN74LS10, SN74S10 TRIPLE 3-INPUT POSITIVE-NAND GATES SDLS035A - DECEMBER 1983 - REVISED APRIL 2003 2 POST OFFICE BOX 655303 * DALLAS, TEXAS 75265 SN5410, SN7410, TRIPLE 3-INPUT POSITIVE-NAND GATES SDLS035 - DECEMBER 1983 - REVISED MARCH 1988 POST OFFICE BOX 655303 * DALLAS, TEXAS 75265 3 SN54LS10, SN74LS10, TRIPLE 3-INPUT POSITIVE-NAND GATES SDLS035 - DECEMBER 1983 - REVISED MARCH 1988 4 POST OFFICE BOX 655303 * DALLAS, TEXAS 75265 SN54S10, SN74S10, TRIPLE 3-INPUT POSITIVE-NAND GATES SDLS035 - DECEMBER 1983 - REVISED MARCH 1988 POST OFFICE BOX 655303 * DALLAS, TEXAS 75265 5 PACKAGE OPTION ADDENDUM www.ti.com 23-Mar-2012 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Qty Eco Plan (2) Lead/ Ball Finish MSL Peak Temp OBSOLETE CDIP J 14 TBD Call TI Call TI JM38510/00103BDA OBSOLETE CFP W 14 TBD Call TI Call TI JM38510/07005BCA ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type JM38510/07005BDA ACTIVE CFP W 14 1 TBD A42 N / A for Pkg Type JM38510/30005B2A ACTIVE LCCC FK 20 1 TBD JM38510/30005BCA ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type JM38510/30005BDA ACTIVE CFP W 14 1 TBD A42 N / A for Pkg Type JM38510/30005SCA ACTIVE CDIP J 14 25 TBD A42 N / A for Pkg Type JM38510/30005SDA ACTIVE CFP W 14 25 TBD A42 N / A for Pkg Type M38510/07005BCA ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type M38510/07005BDA ACTIVE CFP W 14 1 TBD A42 N / A for Pkg Type M38510/30005B2A ACTIVE LCCC FK 20 1 TBD M38510/30005BCA ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type M38510/30005BDA ACTIVE CFP W 14 1 TBD A42 N / A for Pkg Type M38510/30005SCA ACTIVE CDIP J 14 25 TBD A42 N / A for Pkg Type 25 TBD A42 N / A for Pkg Type TBD Call TI TBD A42 N / A for Pkg Type A42 N / A for Pkg Type ACTIVE CFP W 14 SN5410J OBSOLETE CDIP J 14 SN54LS10J ACTIVE CDIP J 14 SN54S10J ACTIVE CDIP J 14 1 TBD SN7410N NRND PDIP N 14 25 Pb-Free (RoHS) SN7410N3 OBSOLETE PDIP N 14 1 TBD POST-PLATE N / A for Pkg Type POST-PLATE N / A for Pkg Type Call TI CU NIPDAU N / A for Pkg Type Call TI Call TI SN7410NE4 NRND PDIP N 14 25 Pb-Free (RoHS) SN74LS10D ACTIVE SOIC D 14 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LS10DE4 ACTIVE SOIC D 14 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LS10DG4 ACTIVE SOIC D 14 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LS10DR ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Addendum-Page 1 Samples (Requires Login) JM38510/00103BCA M38510/30005SDA (3) CU NIPDAU N / A for Pkg Type PACKAGE OPTION ADDENDUM www.ti.com 23-Mar-2012 Orderable Device Status (1) Package Type Package Drawing Pins Package Qty Eco Plan (2) Lead/ Ball Finish MSL Peak Temp ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LS10DRG4 ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LS10N ACTIVE PDIP N 14 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type SN74LS10N3 OBSOLETE PDIP N 14 SN74LS10NE4 ACTIVE PDIP N 14 25 Pb-Free (RoHS) SN74LS10NSR ACTIVE SO NS 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LS10NSRE4 ACTIVE SO NS 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LS10NSRG4 ACTIVE SO NS 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74S10N ACTIVE PDIP N 14 25 Pb-Free (RoHS) SN74S10N3 OBSOLETE PDIP N 14 TBD 25 Pb-Free (RoHS) Call TI Call TI CU NIPDAU N / A for Pkg Type CU NIPDAU N / A for Pkg Type Call TI Call TI SN74S10NE4 ACTIVE PDIP N 14 SNJ5410J OBSOLETE CDIP J 14 TBD Call TI Call TI SNJ5410W OBSOLETE CFP W 14 TBD Call TI Call TI Call TI Call TI SNJ5410WA OBSOLETE CFP WA 14 SNJ54LS10FK ACTIVE LCCC FK 20 1 TBD TBD Samples (Requires Login) SN74LS10DRE4 TBD (3) CU NIPDAU N / A for Pkg Type POST-PLATE N / A for Pkg Type SNJ54LS10J ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type SNJ54LS10W ACTIVE CFP W 14 1 TBD A42 N / A for Pkg Type SNJ54S10FK ACTIVE LCCC FK 20 1 TBD SNJ54S10J ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type SNJ54S10W ACTIVE CFP W 14 1 TBD A42 N / A for Pkg Type POST-PLATE N / A for Pkg Type (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. Addendum-Page 2 PACKAGE OPTION ADDENDUM www.ti.com 23-Mar-2012 TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. 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OTHER QUALIFIED VERSIONS OF SN5410, SN54LS10, SN54LS10-SP, SN54S10, SN7410, SN74LS10, SN74S10 : * Catalog: SN7410, SN74LS10, SN54LS10, SN74S10 * Military: SN5410, SN54LS10, SN54S10 * Space: SN54LS10-SP NOTE: Qualified Version Definitions: * Catalog - TI's standard catalog product * Military - QML certified for Military and Defense Applications * Space - Radiation tolerant, ceramic packaging and qualified for use in Space-based application Addendum-Page 3 PACKAGE MATERIALS INFORMATION www.ti.com 14-Jul-2012 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant SN74LS10DR SOIC D 14 2500 330.0 16.4 6.5 9.0 2.1 8.0 16.0 Q1 SN74LS10NSR SO NS 14 2000 330.0 16.4 8.2 10.5 2.5 12.0 16.0 Q1 Pack Materials-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 14-Jul-2012 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) SN74LS10DR SN74LS10NSR SOIC D 14 2500 367.0 367.0 38.0 SO NS 14 2000 367.0 367.0 38.0 Pack Materials-Page 2 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. 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