     
  
  
SLOS081G − FEBRUAR Y 1977 − REVISED SEPTEMBER 2004
1
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
DLow Power Consumption
DWide Common-Mode and Differential
Voltage Ranges
DLow Input Bias and Offset Currents
DOutput Short-Circuit Protection
DLow Total Harmonic
Distortion . . . 0.003% Typ
DHigh Input Impedance . . . JFET-Input Stage
DLatch-Up-Free Operation
DHigh Slew Rate . . . 13 V/µs Typ
DCommon-Mode Input Voltage Range
Includes VCC+
description/ordering information
The TL08x JFET-input operational amplifier family is designed to offer a wider selection than any previously
developed operational amplifier family. Each of these JFET-input operational amplifiers incorporates
well-matched, high-voltage JFET and bipolar transistors in a monolithic integrated circuit. The devices feature
high slew rates, low input bias and offset currents, and low offset-voltage temperature coefficient. Offset
adjustment and external compensation options are available within the TL08x family.
The C-suffix devices are characterized for operation from 0°C to 70°C. The I-suffix devices are characterized
for operation from −40°C to 85°C. The Q-suffix devices are characterized for operation from −40°C to 125°C.
The M-suffix devices are characterized for operation over the full military temperature range of −55°C to 125°C.
ORDERING INFORMATION
TJVIOmax
AT 255CPACKAGE†ORDERABLE
PART NUMBER TOP-SIDE
MARKING
PDIP (P)
Tube of 50 TL081CP TL081CP
PDIP (P) Tube of 50 TL082CP TL082CP
PDIP (N) Tube of 25 TL084CN TL084CN
Tube of 75 TL081CD
TL081C
Reel of 2500 TL081CDR TL081C
SOIC (D)
Tube of 75 TL082CD
TL082C
SOIC (D) Reel of 2500 TL082CDR TL082C
0°C to 70°C
15 mV
Tube of 50 TL084CD
TL084C
0°C to 70°C15 mV Reel of 2500 TL084CDR TL084C
SOP (PS)
Reel of 2000 TL081CPSR T081
SOP (PS) Reel of 2000 TL082CPSR T082
SOP (NS) Reel of 2000 TL084CNSR TL084
Tube of 150 TL082CPW
T082
TSSOP (PW)
Reel of 2000 TL082CPWR T082
TSSOP (PW) Tube of 90 TL084CPW
T084
Reel of 2000 TL084CPWR T084
†Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at
www.ti.com/sc/package.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications o
f
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
Copyright 2004, Texas Instruments Incorporated
  ! " #$%! "  &$'(#! )!%*
)$#!" # ! "&%##!" &% !+% !%"  %," "!$%!"
"!)) -!.* )$#! &#%""/ )%" ! %#%""(. #($)%
!%"!/  (( &%!%"*
 &)$#!" #&(! ! 0101 (( &%!%" % !%"!%)
$(%"" !+%-"% !%)*  (( !+% &)$#!" &)$#!
&#%""/ )%" ! %#%""(. #($)% !%"!/  (( &%!%"*
     
  
  
SLOS081G − FEBRUAR Y 1977 − REVISED SEPTEMBER 2004
2POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
description/ordering information (continued)
ORDERING INFORMATION
TJVIOmax
AT 255CPACKAGE†ORDERABLE
PART NUMBER TOP-SIDE
MARKING
PDIP (P)
Tube of 50 TL081ACP TL081ACP
PDIP (P) Tube of 50 TL082ACP TL082ACP
PDIP (N) Tube of 25 TL084ACN TL084ACN
Tube of 75 TL081ACD
081AC
Reel of 2500 TL081ACDR 081AC
6 mV
SOIC (D)
Tube of 75 TL082ACD
082AC
6 mV
SOIC (D) Reel of 2500 TL082ACDR 082AC
Tube of 50 TL084ACD
TL084AC
Reel of 2500 TL084ACDR TL084AC
0°C to 70°C
SOP (PS) Reel of 2000 TL082ACPSR T082A
0°C to 70°CSOP (NS) Reel of 2000 TL084ACNSR TL084A
PDIP (P)
Tube of 50 TL081BCP TL081BCP
PDIP (P) Tube of 50 TL082BCP TL082BCP
PDIP (N) Tube of 25 TL084BCN TL084BCN
Tube of 75 TL081BCD
081BC
3 mV Reel of 2500 TL081BCDR 081BC
3 mV
SOIC (D)
Tube of 75 TL082BCD
082BC
SOIC (D) Reel of 2500 TL082BCDR 082BC
Tube of 50 TL084BCD
TL084BC
Reel of 2500 TL084BCDR TL084BC
PDIP (P)
Tube of 50 TL081IP TL081IP
PDIP (P) Tube of 50 TL082IP TL082IP
PDIP (N) Tube of 25 TL084IN TL081IN
Tube of 75 TL081ID
TL081I
−40°C to 85°C
6 mV
Reel of 2500 TL081IDR TL081I
−40°C to 85°C6 mV
SOIC (D)
Tube of 75 TL082ID
TL082I
SOIC (D) Reel of 2500 TL082IDR TL082I
Tube of 50 TL084ID
TL084I
Reel of 2500 TL084IDR TL084I
TSSOP (PW) Reel of 2000 TL082IPWR Z082
−40°C to 125°C
9 mV
SOIC (D)
Tube of 50 TL084QD
TL084QD
−40°C to 125°C9 mV SOIC (D) Reel of 2500 TL084QDR TL084QD
9 mV
CDIP (J) Tube of 25 TL084MJ TL084MJ
−55°C to 125°C
9 mV LCCC (FK) Reel of 55 TL084FK TL084FK
−55
°
C to 125
°
C
6 mV
CDIP (JG) Tube of 50 TL082MJG TL082MJG
6 mV
LCCC (FK) Tube of 55 TL082MFK TL082MFK
†Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at
www.ti.com/sc/package.
     
  
  
SLOS081G − FEBRUAR Y 1977 − REVISED SEPTEMBER 2004
3
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
NC − No internal connection
1
2
3
4
5
6
7
14
13
12
11
10
9
8
1OUT
1IN−
1IN+
VCC+
2IN+
2IN−
2OUT
4OUT
4IN−
4IN+
VCC−
3IN+
3IN−
3OUT
TL084, TL084A, TL084B
D, J, N, NS, OR PW PACKAGE
(TOP VIEW)
3 2 1 20 19
910111213
4
5
6
7
8
18
17
16
15
14
4IN+
NC
VCC−
NC
3IN+
1IN+
NC
VCC+
NC
2IN+
TL084M . . . FK PACKAGE
(TOP VIEW)
1IN −
1OUT
NC
3OUT
3IN − 4OUT
4IN −
2IN −
2OUT
NC
3212019
910111213
4
5
6
7
8
18
17
16
15
14
NC
2OUT
NC
2IN−
NC
NC
1IN−
NC
1IN+
NC
TL082M . . . FK PACKAGE
(TOP VIEW)
NC
1OUT
NC
2IN +
NC NC
NC
NC
1
2
3
4
8
7
6
5
OFFSET N1
IN−
IN+
VCC−
NC
VCC+
OUT
OFFSET N2
TL081, TL081A, TL081B
D, P, OR PS PACKAGE
(TOP VIEW)
1
2
3
4
8
7
6
5
1OUT
1IN−
1IN+
VCC−
VCC+
2OUT
2IN−
2IN+
TL082, TL082A, TL082B
D, JG, P, PS, OR PW PACKAGE
(TOP VIEW)
VCC+
VCC −
NC − No internal connection NC − No internal connection
symbols
+
−
+
−
OFFSET N1
IN+
IN− OUT IN+
IN− OUT
TL082 (EACH AMPLIFIER)
TL084 (EACH AMPLIFIER)
TL081
OFFSET N2
     
  
  
SLOS081G − FEBRUAR Y 1977 − REVISED SEPTEMBER 2004
4POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
schematic (each amplifier)
C1
VCC+
IN+
VCC−
OFFSET N1
1080 Ω 1080 Ω
IN−
TL081 Only
64 Ω
128 Ω
64 Ω
OUT
Component values shown are nominal.
OFFSET N2
     
  
  
SLOS081G − FEBRUAR Y 1977 − REVISED SEPTEMBER 2004
5
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)†
TL08_C
TL08_AC
TL08_BC TL08_I TL084Q TL08_M UNIT
Supply voltage, VCC+ (see Note 1) 18 18 18 18 V
Supply voltage VCC− (see Note 1) −18 −18 −18 −18 V
Differential input voltage, VID (see Note 2) ±30 ±30 ±30 ±30 V
Input voltage, VI (see Notes 1 and 3) ±15 ±15 ±15 ±15 V
Duration of output short circuit (see Note 4) Unlimited Unlimited Unlimited Unlimited
Continuous total power dissipation See Dissipation Rating Table
Operating free-air temperature range, TA0 to 70 − 40 to 85 − 40 to 125 − 55 to 125 °C
D package (8-pin) 97 97
D package (14-pin) 86 86
N package (14-pin) 76 76
Package thermal impedance,
θ
JA
NS package (14-pin) 80
°C/W
Package thermal impedance, θJA
(see Notes 5 and 6) P package (8-pin) 85 85 °C/W
(see Notes 5 and 6)
PS package (8-pin) 95 95
PW package (8-pin) 149
PW package (14-pin) 113 113
Operating virtual junction temperature 150 150 150 150 °C
Case temperature for 60 seconds, TCFK package 260 °C
Lead temperature 1,6 mm (1/16 inch) from case
for 60 seconds J or JG package 300 °C
Storage temperature range, Tstg − 65 to 150 − 65 to 150 − 65 to 150 − 65 to 150 °C
†Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTES: 1. All voltage values, except differential voltages, are with respect to the midpoint between VCC+ and VCC−.
2. Differential voltages are at IN+ with respect to IN−.
3. The magnitude of the input voltage must never exceed the magnitude of the supply voltage or 15 V, whichever is less.
4. The output may be shorted to ground or to either supply. Temperature and/or supply voltages must be limited to ensure that the
dissipation rating is not exceeded.
5. Maximum power dissipation is a function of TJ(max), θJA, and TA. The maximum allowable power dissipation at any allowable
ambient temperature is PD = (TJ(max) − TA)/θJA. Operating at the absolute maximum TJ of 150°C can affect reliability.
6. The package thermal impedance is calculated in accordance with JESD 51-7.
DISSIPATION RATING TABLE
PACKAGE TA ≤ 25°C
POWER RATING DERATING
FACTOR DERATE
ABOVE TATA = 70°C
POWER RATING TA = 85°C
POWER RATING TA = 125°C
POWER RATING
D (14 pin) 680 mW 7.6 mW/°C 60°C604 mW 490 mW 186 mW
FK 680 mW 11.0 mW/°C88°C 680 mW 680 mW 273 mW
J680 mW 11.0 mW/°C88°C 680 mW 680 mW 273 mW
JG 680 mW 8.4 mW/°C 69°C672 mW 546 mW 210 mW
22222
22
322
SLOS081G − FEBRUARY 1977 − REVISED SEPTEMBER 2004
6POST OFFICE BOX 655303 DALLAS, TEXAS 75265
•
electrical characteristics, VCC± = ±15 V (unless otherwise noted)
PARAMETER TEST CONDITIONS TA†
TL081C
TL082C
TL084C
TL081AC
TL082AC
TL084AC
TLO81BC
TL082BC
TL084BC
TL081I
TL082I
TL084I UNIT
A
MIN TYP MAX MIN TYP MAX MIN TYP MAX MIN TYP MAX
25°C 3 15 3 6 2 3 3 6
VIO Input offset voltage VO = 0 RS = 50 Ω Full range 20 7.5 5 9 mV
αVIO Temperature
coefficient of input
offset voltage VO = 0 RS = 50 ΩFull range 18 18 18 18 µV/°C
Input offset current‡
25°C 5 200 5 100 5 100 5 100 pA
IIO
Input offset current‡
VO = 0 Full range 2 2 2 10 nA
Input bias current‡
25°C 30 400 30 200 30 200 30 200 pA
IIB
Input bias current‡
VO = 0 Full range 10 7 7 20 nA
VICR Common-mode input
voltage range 25°C±11 −12
to
15 ±11 −12
to
15 ±11 −12
to
15 ±11 −12
to
15 V
Maximum peak
RL = 10 kΩ25°C±12 ±13.5 ±12 ±13.5 ±12 ±13.5 ±12 ±13.5
V
OM
Maximum peak
output voltage swing
RL ≥ 10 kΩ
±12 ±12 ±12 ±12 V
VOM
output voltage swing
RL ≥ 2 kΩFull range ±10 ±12 ±10 ±12 ±10 ±12 ±10 ±12
V
Large-signal
differential voltage
VO = ±10 V, RL ≥ 2 kΩ25°C 25 200 50 200 50 200 50 200
AVD
differential voltage
amplification VO = ±10 V, RL ≥2 kΩFull range 15 25 25 25 V/mV
B1Unity-gain bandwidth 25°C 3 3 3 3 MHz
riInput resistance 25°C 1012 1012 1012 1012 Ω
CMRR
Common-mode
rejection ratio
V
IC
= V
ICR
min,
V = 0, R = 50
25
°
C
70
86
75
86
75
86
75
86
dB
CMRR
Common-mode
rejection ratio
VIC = VICRmin,
V
O
= 0, R
S
= 50 Ω
25
°
C
70
86
75
86
75
86
75
86
dB
kSVR
Supply-voltage
rejection ratio
V
CC
= ±15 V to ±9 V,
V = 0, R = 50
25
°
C
70
86
80
86
80
86
80
86
dB
k
SVR
rejection ratio
(∆V
CC
±/∆V
IO
)
VCC = ±15 V to ±9 V,
VO = 0, RS = 50 Ω
25
°
C
70
86
80
86
80
86
80
86
dB
ICC Supply current
(per amplifier) VO = 0, No load 25°C 1.4 2.8 1.4 2.8 1.4 2.8 1.4 2.8 mA
VO1/VO2 Crosstalk attenuation AVD = 100 25°C 120 120 120 120 dB
†All characteristics are measured under open-loop conditions with zero common-mode voltage, unless otherwise specified. Full range for TA is 0°C to 70°C for TL08_C, TL08_AC,
TL08_BC and −40°C to 85°C for TL08_I.
‡Input bias currents of an FET-input operational amplifier are normal junction reverse currents, which are temperature sensitive, as shown in Figure 17. Pulse techniques m u st b e u s ed
that maintain the junction temperature as close to the ambient temperature as possible.
     
  
  
SLOS081G − FEBRUAR Y 1977 − REVISED SEPTEMBER 2004
7
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
electrical characteristics, VCC ±= ±15 V (unless otherwise noted)
PARAMETER
TEST CONDITIONS†
TA
TL081M, TL082M TL084Q, TL084M
UNIT
PARAMETER
TEST CONDITIONS
†
T
AMIN TYP MAX MIN TYP MAX
UNIT
VIO
Input offset voltage
VO = 0,
RS = 50 Ω
25°C 3 6 3 9
mV
VIO Input offset voltage VO = 0, RS = 50 ΩFull range 9 15 mV
αVIO Temperature
coefficient of input
offset voltage VO = 0 RS = 50 ΩFull range 18 18 µV/°C
IIO
Input offset current‡
VO = 0
25°C 5 100 5 100 pA
IIO
Input offset current‡
VO = 0 125°C 20 20 nA
IIB
Input bias current‡
VO = 0
25°C 30 200 30 200 pA
IIB
Input bias current‡
VO = 0 125°C 50 50 nA
VICR Common-mode input
voltage range 25°C±11 −12
to
15 ±11 −12
to
15 V
Maximum peak
RL = 10 kΩ25°C±12 ±13.5 ±12 ±13.5
V
OM
Maximum peak
output voltage swing
RL ≥ 10 kΩ
Full range
±12 ±12 V
VOM
output voltage swing
RL ≥ 2 kΩFull range ±10 ±12 ±10 ±12
V
AVD
Large-signal
differential voltage
VO = ±10 V, RL ≥ 2 kΩ25°C 25 200 25 200
V/mV
AVD
differential voltage
amplification VO = ±10 V, RL ≥ 2 kΩFull range 15 15 V/mV
B1Unity-gain bandwidth 25°C 3 3 MHz
riInput resistance 25°C 1012 1012 Ω
CMRR Common-mode
rejection ratio VIC = VICRmin,
VO = 0, RS = 50 Ω25°C 80 86 80 86 dB
kSVR Supply-voltage
rejection ratio
(∆VCC±/∆VIO)
VCC = ±15 V to ±9 V,
VO = 0, RS = 50 Ω25°C 80 86 80 86 dB
ICC Supply current
(per amplifier) VO = 0, No load 25°C 1.4 2.8 1.4 2.8 mA
VO1/VO2 Crosstalk attenuation AVD = 100 25°C 120 120 dB
†All characteristics are measured under open-loop conditions, with zero common-mode input voltage, unless otherwise specified.
‡Input bias currents of a FET-input operational amplifier are normal junction reverse currents, which are temperature sensitive, as shown in
Figure 17. Pulse techniques must be used that maintain the junction temperatures as close to the ambient temperature as possible.
operating characteristics, VCC± = ±15 V, TA = 25°C (unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
VI = 10 V, RL = 2 kΩ, CL = 100 pF, See Figure 1 8∗13
SR Slew rate at unity gain V
I
= 10 V,
T = −55C to 125 C,
RL = 2 kΩ, CL = 100 pF,
5
∗V/µs
SR
Slew rate at unity gain
VI = 10 V,
T
A
= − 55°C to 125°C
,
See Figure 1
5∗
V/µs
trRise time
VI = 20 mV,
RL = 2 kΩ,
CL = 100 pF,
See Figure 1
0.05 µs
Overshoot factor VI = 20 mV, RL = 2 kΩ,C
L = 100 pF
,
See Figure 1 20 %
Vn
Equivalent input noise
voltage
RS = 20 Ω
f = 1 kHz 18 nV/√Hz
Vn
Equivalent input noise
voltage RS = 20 Ωf = 10 Hz to 10 kHz 4µV
InEquivalent input noise
current RS = 20 Ω,f = 1 kHz 0.01 pA/√Hz
THD Total harmonic distortion VIrms = 6 V,
f = 1 kHz AVD = 1, RS ≤ 1 kΩ, RL ≥ 2 kΩ,0.003 %
∗On products compliant to MIL-PRF-38535, this parameter is not production tested.
     
  
  
SLOS081G − FEBRUAR Y 1977 − REVISED SEPTEMBER 2004
8POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
operating characteristics, VCC± = ±15 V, TA = 25°C
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
SR Slew rate at unity gain VI = 10 V, RL = 2 kΩ, CL = 100 pF, See Figure 1 8 13 V/µs
trRise time
VI = 20 mV,
RL = 2 kΩ,
CL = 100 pF,
See Figure 1
0.05 µs
Overshoot factor VI = 20 mV, RL = 2 kΩ
,
CL = 100 pF, See Figure 1 20 %
Vn
Equivalent input noise voltage
RS = 20 Ω
f = 1 kHz 18 nV/√Hz
VnEquivalent input noise voltage RS = 20 Ωf = 10 Hz to 10 kHz 4µV
InEquivalent input noise current RS = 20 Ω,f = 1 kHz 0.01 pA/√Hz
THD Total harmonic distortion VIrms = 6 V,
f = 1 kHz AVD = 1, RS ≤ 1 kΩ, RL ≥ 2 kΩ,0.003 %
PARAMETER MEASUREMENT INFORMATION
Figure 1
VI
CL = 100 pF RL = 2 kΩ
+
−
OUT
Figure 2
VI
10 kΩ
1 kΩ
RLCL = 100 pF
+
−
OUT
Figure 3
100 kΩ
C2
C1
N1
500 pF
+
−
OUT
IN−
Figure 4
TL081
N2
N1
100 kΩ
1.5 kΩ
VCC−
+
−
OUT
IN−
IN+
     
  
  
SLOS081G − FEBRUAR Y 1977 − REVISED SEPTEMBER 2004
9
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
TYPICAL CHARACTERISTICS
Table of Graphs
FIGURE
vs Frequency
5, 6, 7
VOM
Maximum peak output voltage
vs Frequency
vs Free-air temperature
5, 6, 7
8
VOM Maximum peak output voltage
vs Free-air temperature
vs Load resistance
vs Supply voltage
8
9
10
vs Load resistance
vs Supply voltage
9
10
Large-signal differential voltage amplification
vs Free-air temperature
11
AVD
Large-signal differential voltage amplification
vs Free-air temperature
vs Frequency
11
12
AVD
Differential voltage amplification vs Frequency with feed-forward compensation 13
PDTotal power dissipation vs Free-air temperature 14
ICC
Supply current
vs Free-air temperature
15
ICC Supply current
vs Free-air temperature
vs Supply voltage
15
16
IIB Input bias current vs Free-air temperature 17
Large-signal pulse response vs Time 18
VOOutput voltage vs Elapsed time 19
CMRR Common-mode rejection ratio vs Free-air temperature 20
VnEquivalent input noise voltage vs Frequency 21
THD Total harmonic distortion vs Frequency 22
Figure 5
±15
±12.5
±10
±7.5
±5
±2.5
0
f − Frequency − Hz
1 k 10 k 100 k 1 M 10 M
RL = 10 kΩ
TA = 25°C
See Figure 2
VCC± = ±15 V
VCC± = ±10 V
VCC± = ±5 V
− Maximum Peak Output Voltage − V
MAXIMUM PEAK OUTPUT VOLTAGE
vs
FREQUENCY
VOM
100
Figure 6
MAXIMUM PEAK OUTPUT VOLTAGE
vs
FREQUENCY
VCC± = ±5 V
VCC± = ±10 V
VCC± = ±15 V
RL = 2 kΩ
TA = 25°C
±15
±12.5
±10
±7.5
±5
±2.5
0
f − Frequency − Hz
100 1 k 10 k 1 M 10 M
See Figure 2
100 k
− Maximum Peak Output Voltage − V
VOM
     
  
  
SLOS081G − FEBRUAR Y 1977 − REVISED SEPTEMBER 2004
10 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
TYPICAL CHARACTERISTICS†
Figure 7
0
±2.5
±5
±7.5
±10
±12.5
±15
10 k 40 k 100 k 400 k 1 M 4 M 10 M
VCC± = ±15 V
RL = 2 kΩ
See Figure 2
TA = −55°C
TA = 25°C
TA = 125°C
f − Frequency − Hz
MAXIMUM PEAK OUTPUT VOLTAGE
vs
FREQUENCY
− Maximum Peak Output Voltage − V
VOM
Figure 8
±12.5
±10
±7.5
±5
±2.5
MAXIMUM PEAK OUTPUT VOLTAGE
vs
FREE-AIR TEMPERATURE
− 75 − 50 − 25 0 25 50 75 100 125
±15
0
ÎÎÎÎ
ÎÎÎÎ
RL = 10 kW
ÎÎÎÎ
RL = 2 kW
VCC±= ±15 V
See Figure 2
− Maximum Peak Output Voltage − V
VOM
TA − Free-Air Temperature − °C
Figure 9
0.1
0
RL − Load Resistance − kΩ
10
±15
±2.5
±5
±7.5
±10
±12.5
VCC± = ±15 V
TA = 25°C
See Figure 2
0.2 0.4 0.7 1 2 4 7
MAXIMUM PEAK OUTPUT VOLTAGE
vs
LOAD RESISTANCE
− Maximum Peak Output Voltage − V
VOM
Figure 10
0
0
|VCC±| − Supply Voltage − V 16
±15
2 4 6 8 10 12 14
±2.5
±5
±7.5
±10
±12.5
RL = 10 kΩ
TA = 25°C
MAXIMUM PEAK OUTPUT VOLTAGE
vs
SUPPLY VOLTAGE
− Maximum Peak Output Voltage − V
VOM
†Data at high and low temperatures are applicable only within the rated operating free-air temperature ranges of the various devices.
     
  
  
SLOS081G − FEBRUAR Y 1977 − REVISED SEPTEMBER 2004
11
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
TYPICAL CHARACTERISTICS†
700
70
7
−75
1
TA − Free-Air Temperature − °C
125
1000
−50 −25 0 25 50 75 100
2
4
10
20
40
100
200
400
VCC± = ±15 V
VO = ±10 V
RL = 2 kΩ
LARGE-SIGNAL
DIFFERENTIAL VOLTAGE AMPLIFICATION
vs
FREE-AIR TEMPERATURE
− Large-Signal Differential
AVD
Voltage Amplification − V/mV
Figure 11
180°
135°
90°
45°
0°
Phase Shift
(right scale)
TA = 25°C
RL = 10 kΩ
VCC± = ±5 V to ±15 V
Differential Voltage
Amplification
(left scale)
105
104
103
102
101
1 M100 k10 k1 k10010
106
10 M
f − Frequency − Hz
11
LARGE-SIGNAL
DIFFERENTIAL VOLTAGE AMPLIFICATION
vs
FREQUENCY
− Large-Signal Differential
AVD
Voltage Amplification − V/mV
Phase Shift
Figure 12
†Data at high and low temperatures are applicable only within the rated operating free-air temperature ranges of the various devices.
     
  
  
SLOS081G − FEBRUAR Y 1977 − REVISED SEPTEMBER 2004
12 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
TYPICAL CHARACTERISTICS†
Figure 13
See Figure 3
TA = 25°C
C2 = 3 pF
VCC± = ±15 V
105
104
103
102
10
1 M100 k10 k1 k
106
10 M
f − Frequency With Feed-Forward Compensation − Hz
1
100
DIFFERENTIAL VOLTAGE AMPLIFICATION
vs
FREQUENCY WITH FEED-FORWARD COMPENSATION
− Differential Voltage Amplification − V/mVA
VD
Figure 14
−75
0
− Total Power Dissipation − mW
TA − Free-Air Temperature − °C125
250
−50 −25 0 25 50 75 100
25
50
75
100
125
150
175
200
225 VCC± = ±15 V
No Signal
No Load
TL084, TL085
TL082, TL083
TL081
TOTAL POWER DISSIPATION
vs
FREE-AIR TEMPERATURE
P
D
Figure 15
− Supply Current − mA
−75
0
TA − Free-Air Temperature − °C
125
2.0
−50 −25 0 25 50 75 100
0.2
0.4
0.6
0.8
1.0
1.2
1.4
1.6
1.8 VCC± = ±15 V
No Signal
No Load
SUPPLY CURRENT PER AMPLIFIER
vs
FREE-AIR TEMPERATURE
I
CC ±
Figure 16
0
0
|VCC±| − Supply Voltage − V
16
2.0
2 4 6 8 10 12 14
0.2
0.4
0.6
0.8
1.0
1.2
1.4
1.6
1.8 TA = 25°C
No Signal
No Load
SUPPLY CURRENT
vs
SUPPLY VOLTAGE
− Supply Current − mAICC ±
†Data at high and low temperatures are applicable only within the rated operating free-air temperature ranges of the various devices.
     
  
  
SLOS081G − FEBRUAR Y 1977 − REVISED SEPTEMBER 2004
13
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
TYPICAL CHARACTERISTICS†
Figure 17
− 50
0.01
− Input Bias Current − nA
TA − Free-Air Temperature − °C125
100
− 25 0 25 50 75 100
0.1
1
10
VCC± = ±15 V
INPUT BIAS CURRENT
vs
FREE-AIR TEMPERATURE
IIB
Figure 18
VCC± = ±15 V
RL = 2 kΩ
CL = 100 pF
TA = 25°C
Output
4
2
0
− 2
− 4
32.521.510.50
6
3.5
t − Time − µs
Input and Output Voltages − V
− 6
VOLTAGE-FOLLOWER
LARGE-SIGNAL PULSE RESPONSE
Input
Figure 19
− 4
− Output Voltage − mV
t − Elapsed Time − µs1.2
28
0 0.2 0.4 0.6 0.8 1.0
0
4
8
12
16
20
24
OUTPUT VOLTAGE
vs
ELAPSED TIME
VO
VCC± = ±15 V
RL = 2 kΩ
CL = 100 pF
TA = 25°C
See Figure 1
Figure 20
RL = 10 kΩ
VCC± = ±15 V
88
87
86
85
84
1007550250− 25− 50
89
125
TA − Free-Air Temperature − °C
CMRR − Common-Mode Rejection Ratio − dB
83
− 75
COMMON-MODE REJECTION RATIO
vs
FREE-AIR TEMPERATURE
†Data at high and low temperatures are applicable only within the rated operating free-air temperature ranges of the various devices.
     
  
  
SLOS081G − FEBRUAR Y 1977 − REVISED SEPTEMBER 2004
14 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
TYPICAL CHARACTERISTICS†
Figure 21
10
0
− Equilvalent Input Noise Voltage −
f − Frequency − Hz
100 k
50
10
20
30
40
VCC± = ±15 V
AVD = 10
RS = 20 Ω
TA = 25°C
40 100 400 1 k 4 k 10 k 40 k
EQUIVALENT INPUT NOISE VOLTAGE
vs
FREQUENCY
VnnV/ Hz
Figure 22
0.001
THD − Total Harmonic Distortion − %
1VCC± = ±15 V
AVD = 1
VI(RMS) = 6 V
TA = 25°C
40 k10 k4 k1 k400 100 k
f − Frequency − Hz
10
0.004
0.01
0.04
0.1
0.4
TOTAL HARMONIC DISTORTION
vs
FREQUENCY
†Data at high and low temperatures are applicable only within the rated operating free-air temperature ranges of the various devices.
APPLICATION INFORMATION
Figure 23
+
−
−15 V
15 V Output
1 kΩ
9.1 kΩ
3.3 kΩ
CF = 3.3 µF
RF = 100 kΩ
3.3 kΩ
TL081
f = 2π RF CF
1
Figure 24
+
−
R1
C1 C2
R3
C3 VCC−
VCC+
TL081 OutputInput R2
R1 = R2 = 2(R3) = 1.5 MΩ
fo = 2π R1 C1
1= 1 kHz
C1 = C2 = = 110 pF
C3
2
     
  
  
SLOS081G − FEBRUAR Y 1977 − REVISED SEPTEMBER 2004
15
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
APPLICATION INFORMATION
Input
−
+
+
−
TL084 Output C
Output BTL084
−
+
VCC+
Output ATL084
−
+
VCC+
TL084
VCC+
100 kΩ
100 µF
1 µF
1 MΩ
100 kΩ
100 kΩ100 kΩ
VCC+
VCC+
Figure 25. Audio-Distribution Amplifier
+
−
+
−
88.4 kΩ
18 pF
VCC+
VCC−
18 pF
18 pF
88.4 kΩ
88.4 kΩ
1N4148
1N4148
VCC−
VCC+
1 kΩ
− 15 V
6 cos ωt
15 V
18 kΩ
(see Note A)
1 kΩ
6 sin ωt
1/2
TL082 1/2
TL082
18 kΩ
(see Note A)
NOTE A: These resistor values may be adjusted for a symmetrical output.
Figure 26. 100-KHz Quadrature Oscillator
     
  
  
SLOS081G − FEBRUAR Y 1977 − REVISED SEPTEMBER 2004
16 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
APPLICATION INFORMATION
Output BOutput A
+
−
1.5 kΩVCC−
43 kΩ
220 pF
43 kΩ
VCC+
30 kΩ
VCC+ 43 kΩ
VCC−
+
−
16 kΩ
43 kΩ
Input 220 pF 220 pF
16 kΩ
+
−
VCC−
VCC+
30 kΩ
VCC+
43 kΩ
220 pF
43 kΩ
VCC−
+
−
1.5 kΩ
1/4
TL084
2 kHz/div
Second-Order Bandpass Filter
fo = 100 kHz, Q = 30, GAIN = 4
2 kHz/div
Cascaded Bandpass Filter
fo = 100 kHz, Q = 69, GAIN = 16
Output A
Outpu
t
B
1/4
TL084
1/4
TL084
1/4
TL084
Figure 27. Positive-Feedback Bandpass Filter
PACKAGE OPTION ADDENDUM
www.ti.com 27-Apr-2012
Addendum-Page 1
PACKAGING INFORMATION
Orderable Device Status (1) Package Type Package
Drawing Pins Package Qty Eco Plan (2) Lead/
Ball Finish MSL Peak Temp (3) Samples
(Requires Login)
5962-9851501Q2A ACTIVE LCCC FK 20 1 TBD Call TI Call TI
5962-9851501QPA ACTIVE CDIP JG 8 1 TBD A42 N / A for Pkg Type
5962-9851503Q2A ACTIVE LCCC FK 20 1 TBD Call TI Call TI
5962-9851503QCA ACTIVE CDIP J 14 1 TBD Call TI Call TI
TL081ACD ACTIVE SOIC D 8 75 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TL081ACDE4 ACTIVE SOIC D 8 75 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TL081ACDG4 ACTIVE SOIC D 8 75 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TL081ACDR ACTIVE SOIC D 8 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TL081ACDRE4 ACTIVE SOIC D 8 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TL081ACDRG4 ACTIVE SOIC D 8 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TL081ACJG OBSOLETE CDIP JG 8 TBD Call TI Call TI
TL081ACP ACTIVE PDIP P 8 50 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type
TL081ACPE4 ACTIVE PDIP P 8 50 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type
TL081BCD ACTIVE SOIC D 8 75 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TL081BCDE4 ACTIVE SOIC D 8 75 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TL081BCDG4 ACTIVE SOIC D 8 75 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TL081BCDR ACTIVE SOIC D 8 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TL081BCDRE4 ACTIVE SOIC D 8 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TL081BCDRG4 ACTIVE SOIC D 8 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TL081BCP ACTIVE PDIP P 8 50 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type
TL081BCPE4 ACTIVE PDIP P 8 50 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type
PACKAGE OPTION ADDENDUM
www.ti.com 27-Apr-2012
Addendum-Page 2
Orderable Device Status (1) Package Type Package
Drawing Pins Package Qty Eco Plan (2) Lead/
Ball Finish MSL Peak Temp (3) Samples
(Requires Login)
TL081CD ACTIVE SOIC D 8 75 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TL081CDE4 ACTIVE SOIC D 8 75 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TL081CDG4 ACTIVE SOIC D 8 75 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TL081CDR ACTIVE SOIC D 8 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TL081CDRE4 ACTIVE SOIC D 8 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TL081CDRG4 ACTIVE SOIC D 8 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TL081CP ACTIVE PDIP P 8 50 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type
TL081CPE4 ACTIVE PDIP P 8 50 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type
TL081CPSR ACTIVE SO PS 8 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TL081CPSRE4 ACTIVE SO PS 8 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TL081CPSRG4 ACTIVE SO PS 8 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TL081CPWLE OBSOLETE TSSOP PW 8 TBD Call TI Call TI
TL081ID ACTIVE SOIC D 8 75 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TL081IDE4 ACTIVE SOIC D 8 75 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TL081IDG4 ACTIVE SOIC D 8 75 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TL081IDR ACTIVE SOIC D 8 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TL081IDRE4 ACTIVE SOIC D 8 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TL081IDRG4 ACTIVE SOIC D 8 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TL081IP ACTIVE PDIP P 8 50 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type
TL081IPE4 ACTIVE PDIP P 8 50 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type
PACKAGE OPTION ADDENDUM
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Addendum-Page 3
Orderable Device Status (1) Package Type Package
Drawing Pins Package Qty Eco Plan (2) Lead/
Ball Finish MSL Peak Temp (3) Samples
(Requires Login)
TL081MFKB OBSOLETE LCCC FK 20 TBD Call TI Call TI
TL081MJG OBSOLETE CDIP JG 8 TBD Call TI Call TI
TL081MJGB OBSOLETE CDIP JG 8 TBD Call TI Call TI
TL082ACD ACTIVE SOIC D 8 75 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TL082ACDE4 ACTIVE SOIC D 8 75 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TL082ACDG4 ACTIVE SOIC D 8 75 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TL082ACDR ACTIVE SOIC D 8 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TL082ACDRE4 ACTIVE SOIC D 8 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TL082ACDRG4 ACTIVE SOIC D 8 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TL082ACP ACTIVE PDIP P 8 50 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type
TL082ACPE4 ACTIVE PDIP P 8 50 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type
TL082ACPSR ACTIVE SO PS 8 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TL082ACPSRE4 ACTIVE SO PS 8 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TL082ACPSRG4 ACTIVE SO PS 8 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TL082BCD ACTIVE SOIC D 8 75 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TL082BCDE4 ACTIVE SOIC D 8 75 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TL082BCDG4 ACTIVE SOIC D 8 75 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TL082BCDR ACTIVE SOIC D 8 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TL082BCDRE4 ACTIVE SOIC D 8 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TL082BCDRG4 ACTIVE SOIC D 8 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
PACKAGE OPTION ADDENDUM
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Addendum-Page 4
Orderable Device Status (1) Package Type Package
Drawing Pins Package Qty Eco Plan (2) Lead/
Ball Finish MSL Peak Temp (3) Samples
(Requires Login)
TL082BCP ACTIVE PDIP P 8 50 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type
TL082BCPE4 ACTIVE PDIP P 8 50 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type
TL082CD ACTIVE SOIC D 8 75 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TL082CDE4 ACTIVE SOIC D 8 75 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TL082CDG4 ACTIVE SOIC D 8 75 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TL082CDR ACTIVE SOIC D 8 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TL082CDRE4 ACTIVE SOIC D 8 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TL082CDRG4 ACTIVE SOIC D 8 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TL082CJG OBSOLETE CDIP JG 8 TBD Call TI Call TI
TL082CP ACTIVE PDIP P 8 50 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type
TL082CPE4 ACTIVE PDIP P 8 50 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type
TL082CPSR ACTIVE SO PS 8 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TL082CPSRG4 ACTIVE SO PS 8 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TL082CPW ACTIVE TSSOP PW 8 150 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TL082CPWE4 ACTIVE TSSOP PW 8 150 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TL082CPWG4 ACTIVE TSSOP PW 8 150 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TL082CPWLE OBSOLETE TSSOP PW 8 TBD Call TI Call TI
TL082CPWR ACTIVE TSSOP PW 8 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TL082CPWRE4 ACTIVE TSSOP PW 8 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TL082CPWRG4 ACTIVE TSSOP PW 8 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
PACKAGE OPTION ADDENDUM
www.ti.com 27-Apr-2012
Addendum-Page 5
Orderable Device Status (1) Package Type Package
Drawing Pins Package Qty Eco Plan (2) Lead/
Ball Finish MSL Peak Temp (3) Samples
(Requires Login)
TL082ID ACTIVE SOIC D 8 75 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TL082IDE4 ACTIVE SOIC D 8 75 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TL082IDG4 ACTIVE SOIC D 8 75 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TL082IDR ACTIVE SOIC D 8 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TL082IDRE4 ACTIVE SOIC D 8 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TL082IDRG4 ACTIVE SOIC D 8 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TL082IJG OBSOLETE CDIP JG 8 TBD Call TI Call TI
TL082IP ACTIVE PDIP P 8 50 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type
TL082IPE4 ACTIVE PDIP P 8 50 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type
TL082IPWR ACTIVE TSSOP PW 8 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TL082IPWRE4 ACTIVE TSSOP PW 8 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TL082IPWRG4 ACTIVE TSSOP PW 8 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TL082MFK OBSOLETE LCCC FK 20 TBD Call TI Call TI
TL082MFKB ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type
TL082MJG ACTIVE CDIP JG 8 1 TBD A42 N / A for Pkg Type
TL082MJGB ACTIVE CDIP JG 8 1 TBD A42 N / A for Pkg Type
TL084ACD ACTIVE SOIC D 14 50 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TL084ACDE4 ACTIVE SOIC D 14 50 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TL084ACDG4 ACTIVE SOIC D 14 50 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TL084ACDR ACTIVE SOIC D 14 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TL084ACDRE4 ACTIVE SOIC D 14 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
PACKAGE OPTION ADDENDUM
www.ti.com 27-Apr-2012
Addendum-Page 6
Orderable Device Status (1) Package Type Package
Drawing Pins Package Qty Eco Plan (2) Lead/
Ball Finish MSL Peak Temp (3) Samples
(Requires Login)
TL084ACDRG4 ACTIVE SOIC D 14 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TL084ACN ACTIVE PDIP N 14 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type
TL084ACNE4 ACTIVE PDIP N 14 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type
TL084ACNSR ACTIVE SO NS 14 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TL084ACNSRE4 ACTIVE SO NS 14 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TL084ACNSRG4 ACTIVE SO NS 14 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TL084BCD ACTIVE SOIC D 14 50 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TL084BCDE4 ACTIVE SOIC D 14 50 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TL084BCDG4 ACTIVE SOIC D 14 50 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TL084BCDR ACTIVE SOIC D 14 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TL084BCDRE4 ACTIVE SOIC D 14 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TL084BCDRG4 ACTIVE SOIC D 14 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TL084BCN ACTIVE PDIP N 14 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type
TL084BCNE4 ACTIVE PDIP N 14 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type
TL084CD ACTIVE SOIC D 14 50 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TL084CDE4 ACTIVE SOIC D 14 50 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TL084CDG4 ACTIVE SOIC D 14 50 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TL084CDR ACTIVE SOIC D 14 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TL084CDRE4 ACTIVE SOIC D 14 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
PACKAGE OPTION ADDENDUM
www.ti.com 27-Apr-2012
Addendum-Page 7
Orderable Device Status (1) Package Type Package
Drawing Pins Package Qty Eco Plan (2) Lead/
Ball Finish MSL Peak Temp (3) Samples
(Requires Login)
TL084CDRG4 ACTIVE SOIC D 14 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TL084CJ OBSOLETE CDIP J 14 TBD Call TI Call TI
TL084CN ACTIVE PDIP N 14 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type
TL084CNE4 ACTIVE PDIP N 14 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type
TL084CNSLE OBSOLETE SO NS 14 TBD Call TI Call TI
TL084CNSR ACTIVE SO NS 14 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TL084CNSRG4 ACTIVE SO NS 14 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TL084CPW ACTIVE TSSOP PW 14 90 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TL084CPWE4 ACTIVE TSSOP PW 14 90 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TL084CPWG4 ACTIVE TSSOP PW 14 90 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TL084CPWLE OBSOLETE TSSOP PW 14 TBD Call TI Call TI
TL084CPWR ACTIVE TSSOP PW 14 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TL084CPWRE4 ACTIVE TSSOP PW 14 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TL084CPWRG4 ACTIVE TSSOP PW 14 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TL084ID ACTIVE SOIC D 14 50 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TL084IDE4 ACTIVE SOIC D 14 50 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TL084IDG4 ACTIVE SOIC D 14 50 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TL084IDR ACTIVE SOIC D 14 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TL084IDRE4 ACTIVE SOIC D 14 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TL084IDRG4 ACTIVE SOIC D 14 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
PACKAGE OPTION ADDENDUM
www.ti.com 27-Apr-2012
Addendum-Page 8
Orderable Device Status (1) Package Type Package
Drawing Pins Package Qty Eco Plan (2) Lead/
Ball Finish MSL Peak Temp (3) Samples
(Requires Login)
TL084IJ OBSOLETE CDIP J 14 TBD Call TI Call TI
TL084IN ACTIVE PDIP N 14 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type
TL084INE4 ACTIVE PDIP N 14 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type
TL084MFK ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type
TL084MFKB ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type
TL084MJ ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type
TL084MJB ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type
TL084QD ACTIVE SOIC D 14 50 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TL084QDG4 ACTIVE SOIC D 14 50 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TL084QDR ACTIVE SOIC D 14 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TL084QDRG4 ACTIVE SOIC D 14 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
PACKAGE OPTION ADDENDUM
www.ti.com 27-Apr-2012
Addendum-Page 9
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
OTHER QUALIFIED VERSIONS OF TL082, TL082M, TL084, TL084M :
•Catalog: TL082, TL084
•Automotive: TL082-Q1, TL082-Q1
•Military: TL082M, TL084M
NOTE: Qualified Version Definitions:
•Catalog - TI's standard catalog product
•Automotive - Q100 devices qualified for high-reliability automotive applications targeting zero defects
•Military - QML certified for Military and Defense Applications
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device Package
Type Package
Drawing Pins SPQ Reel
Diameter
(mm)
Reel
Width
W1 (mm)
A0
(mm) B0
(mm) K0
(mm) P1
(mm) W
(mm) Pin1
Quadrant
TL081ACDR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1
TL081BCDR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1
TL081CDR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1
TL081CPSR SO PS 8 2000 330.0 16.4 8.2 6.6 2.5 12.0 16.0 Q1
TL081IDR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1
TL082ACDR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1
TL082ACDR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1
TL082ACPSR SO PS 8 2000 330.0 16.4 8.2 6.6 2.5 12.0 16.0 Q1
TL082BCDR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1
TL082CDR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1
TL082CDR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1
TL082CPSR SO PS 8 2000 330.0 16.4 8.2 6.6 2.5 12.0 16.0 Q1
TL082CPWR TSSOP PW 8 2000 330.0 12.4 7.0 3.6 1.6 8.0 12.0 Q1
TL082IDR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1
TL082IDR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1
TL082IPWR TSSOP PW 8 2000 330.0 12.4 7.0 3.6 1.6 8.0 12.0 Q1
TL084ACDR SOIC D 14 2500 330.0 16.4 6.5 9.0 2.1 8.0 16.0 Q1
TL084ACDR SOIC D 14 2500 330.0 16.4 6.5 9.0 2.1 8.0 16.0 Q1
PACKAGE MATERIALS INFORMATION
www.ti.com 14-Jul-2012
Pack Materials-Page 1
Device Package
Type Package
Drawing Pins SPQ Reel
Diameter
(mm)
Reel
Width
W1 (mm)
A0
(mm) B0
(mm) K0
(mm) P1
(mm) W
(mm) Pin1
Quadrant
TL084ACNSR SO NS 14 2000 330.0 16.4 8.2 10.5 2.5 12.0 16.0 Q1
TL084BCDR SOIC D 14 2500 330.0 16.4 6.5 9.0 2.1 8.0 16.0 Q1
TL084CDR SOIC D 14 2500 330.0 16.4 6.5 9.0 2.1 8.0 16.0 Q1
TL084CNSR SO NS 14 2000 330.0 16.4 8.2 10.5 2.5 12.0 16.0 Q1
TL084CPWR TSSOP PW 14 2000 330.0 12.4 6.9 5.6 1.6 8.0 12.0 Q1
TL084IDR SOIC D 14 2500 330.0 16.4 6.5 9.0 2.1 8.0 16.0 Q1
TL084QDR SOIC D 14 2500 330.0 16.4 6.5 9.0 2.1 8.0 16.0 Q1
*All dimensions are nominal
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
TL081ACDR SOIC D 8 2500 340.5 338.1 20.6
TL081BCDR SOIC D 8 2500 340.5 338.1 20.6
TL081CDR SOIC D 8 2500 340.5 338.1 20.6
TL081CPSR SO PS 8 2000 367.0 367.0 38.0
TL081IDR SOIC D 8 2500 340.5 338.1 20.6
TL082ACDR SOIC D 8 2500 340.5 338.1 20.6
TL082ACDR SOIC D 8 2500 367.0 367.0 35.0
TL082ACPSR SO PS 8 2000 367.0 367.0 38.0
TL082BCDR SOIC D 8 2500 340.5 338.1 20.6
TL082CDR SOIC D 8 2500 340.5 338.1 20.6
PACKAGE MATERIALS INFORMATION
www.ti.com 14-Jul-2012
Pack Materials-Page 2
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
TL082CDR SOIC D 8 2500 367.0 367.0 35.0
TL082CPSR SO PS 8 2000 367.0 367.0 38.0
TL082CPWR TSSOP PW 8 2000 367.0 367.0 35.0
TL082IDR SOIC D 8 2500 367.0 367.0 35.0
TL082IDR SOIC D 8 2500 340.5 338.1 20.6
TL082IPWR TSSOP PW 8 2000 367.0 367.0 35.0
TL084ACDR SOIC D 14 2500 333.2 345.9 28.6
TL084ACDR SOIC D 14 2500 367.0 367.0 38.0
TL084ACNSR SO NS 14 2000 367.0 367.0 38.0
TL084BCDR SOIC D 14 2500 333.2 345.9 28.6
TL084CDR SOIC D 14 2500 333.2 345.9 28.6
TL084CNSR SO NS 14 2000 367.0 367.0 38.0
TL084CPWR TSSOP PW 14 2000 367.0 367.0 35.0
TL084IDR SOIC D 14 2500 333.2 345.9 28.6
TL084QDR SOIC D 14 2500 367.0 367.0 38.0
PACKAGE MATERIALS INFORMATION
www.ti.com 14-Jul-2012
Pack Materials-Page 3
MECHANICAL DATA
MCER001A – JANUARY 1995 – REVISED JANUAR Y 1997
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
JG (R-GDIP-T8) CERAMIC DUAL-IN-LINE
0.310 (7,87)
0.290 (7,37)
0.014 (0,36)
0.008 (0,20)
Seating Plane
4040107/C 08/96
5
4
0.065 (1,65)
0.045 (1,14)
8
1
0.020 (0,51) MIN
0.400 (10,16)
0.355 (9,00)
0.015 (0,38)
0.023 (0,58)
0.063 (1,60)
0.015 (0,38)
0.200 (5,08) MAX
0.130 (3,30) MIN
0.245 (6,22)
0.280 (7,11)
0.100 (2,54)
0°–15°
NOTES: A. All linear dimensions are in inches (millimeters).
B. This drawing is subject to change without notice.
C. This package can be hermetically sealed with a ceramic lid using glass frit.
D. Index point is provided on cap for terminal identification.
E. Falls within MIL STD 1835 GDIP1-T8
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other
changes to its semiconductor products and services per JESD46C and to discontinue any product or service per JESD48B. Buyers should
obtain the latest relevant information before placing orders and should verify that such information is current and complete. All
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