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Surface Mount Rectifier
Features:
• Plastic Package
• For Surface Mounted Applications
• Low Prole Package
• Built-In Strain Relief, Ideal for Automated Placement
• High Temperature Soldering : 250°C/10 seconds at Terminals
• High Current Capability
Mechanical Data
• Case : JEDEC DO-214AA molded plastic over passivated chip
• Terminals : Solder plated, solderable per MIL-STD-750, method 2026
• Polarity : Colour band denotes cathode end
• Weight : 0.003oz, 0.093g
Maximum Ratings and Thermal Characteristics
Ratings at 25°C ambient temperature unless otherwise specied
Note:
(1) Measured at 1MHz and applied reverse voltage of 4V
(2) Thermal resistance from junction to ambient and junction to lead PCB mounted on 0.27ʺ × 0.27ʺ (7 × 7mm2) copper pad areas
Characteristic Symbol S3DB-13-F S3GB-13-F S3MB-13-F Units
Maximum repetitive peak reverse voltage VRRM 200 400 1,000 V
Maximum RMS voltage VRWS 140 280 700 V
Maximum DC blocking voltage VDC 200 400 1,000 V
Maximum average forward rectied current at TL=90°C IF(AV) 3 A
Peak forward surge current at TL = 110°C 8.3 ms single
half-sine-wave superimposed on rated load (JEDEC Method) IFSM 100 A
Maximum Instantaneous Forward Voltage at 3A VF1.15 V
Maximum DC reverse current TA=25°C
at rated DC blocking voltage TA=100°C IR10
100 μA
Typical junction capacitance (Note 1) CJ35 pF
Typical thermal resistance (Note 2) RθJA 40 °C/W
Operating junction and storage temperature range TJ, TSTG -55 to +150 °C
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Page <2> V1.026/02/13
Surface Mount Rectifier
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Page <3> V1.026/02/13
Surface Mount Rectifier
DO-214AC(SMA)
Dim. Min. Max.
A 4.3 4.7
B 3.3 3.7
C 2 2.3
D 5.05 5.55
E0.2 Typ.
F 0.95 1.55
G 0.2 Max.
H 2.1 2.5
I 1.85 2.15
Dimensions : Millimetres
Dimensions : Millimetres
Package Outline Dimensions
Soldering Footprint
Device Package Shipping
S3DB -13-F
S3GB -13-F
S3MB -13-F
DO-214AA(SMB) 3,000 / Tape & Reel
Package Information
Description Part Number
Surface Mount Rectier
S3DB-13-F
S3GB-13-F
S3MB-13-F
Part Number Table
Important Notice : This data sheet and its contents (the “Information”) belong to the members of the Premier Farnell group of companies (the “Group”) or are licensed to it. No licence is granted
for the use of it other than for information purposes in connection with the products to which it relates. No licence of any intellectual property rights is granted. The Information is subject to change
without notice and replaces all data sheets previously supplied. The Information supplied is believed to be accurate but the Group assumes no responsibility for its accuracy or completeness, any
error in or omission from it or for any use made of it. Users of this data sheet should check for themselves the Information and the suitability of the products for their purpose and not make any
assumptions based on information included or omitted. Liability for loss or damage resulting from any reliance on the Information or use of it (including liability resulting from negligence or where the
Group was aware of the possibility of such loss or damage arising) is excluded. This will not operate to limit or restrict the Group’s liability for death or personal injury resulting from its negligence.
Multicomp is the registered trademark of the Group. © Premier Farnell plc 2012.