F-219 QSH-060-01-L-D-DP-A QSH-060-01-L-D-A-K (R) QSH-030-01-F-D-A (0.50 mm) .0197" QSH SERIES HIGH-SPEED GROUND PLANE SOCKET Board Mates: QTH SPECIFICATIONS For complete specifications and recommended PCB layouts see www.samtec.com?QSH Cable Mates: HQCD, HQDP (See Also Available Note) Insulator Material: Liquid Crystal Polymer Contact Material: Phosphor Bronze Plating: Au or Sn over 50 " (1.27 m) Ni Current Rating: Contact: 2 A per pin (2 pins powered) Ground Plane: 25 A per ground plane (1 ground plane powered) Operating Temp Range: -55 C to +125 C Voltage Rating: 175 VAC (5 mm Stack Height) Max Cycles: 100 RoHS Compliant: Yes POWER/SIGNAL APPLICATION 10 YEAR MFG WITH 50 " GOLD EXTENDED LIFE PRODUCT HIGH MATING CYCLES HIGH-SPEED CHANNEL PERFORMANCE QTH/QSH @ 5 mm Mated Stack Height Rating based on Samtec reference channel. For full SI performance data visit Samtec.com or contact SIG@samtec.com PROCESSING 25 Compatible with UMPT/UMPS for flexible two-piece power/signal solutions G b p s PINS PER ROW NO. OF PAIRS QSH PLATING OPTION 01 -F = Gold Flash on Signal Pins and Ground Plane, Matte Tin on tails -030, -060, -090 (60 total pins per bank = -D) RECOGNITIONS -020, -040, -060 For complete scope of recognitions see www.samtec.com/quality -L (20 pairs per bank = -D-DP) = 10 " (0.25 m) Gold on Signal Pins and Ground Plane, Matte Tin on tails -D = (No. of Pins per Row/30) x (20.00) .7875 + (1.27) .050 FILE NO. E111594 STANDARDS * PISMOTM 1 Visit www.samtec.com/standards for more information. 02 -DP = (No. of Pairs per Row/20) x (20.00) .7875 + (1.27) .050 (20.00) .7875 (7.49) .295 ALSO AVAILABLE 01 (MOQ Required) Note: Some lengths, styles and options are non-standard, non-returnable. Integral metal plane for power or ground Standoffs: SO Lead-Free Solderable: Yes SMT Lead Coplanarity: (0.10 mm) .004" max (020-060) Board Stacking: For applications requiring more than two connectors per board contact ipg@samtec.com * 15 mm, 22 mm and 30 mm stack height * 30 " (0.76 m) Gold (Specify -H plating for Data Rate cable mating applications.) * Edge Mount & Guide Posts * 80 (-DP), 120, 150 positions per row * Retention Option Blade & Beam Design (0.50) .0197 (0.15) .006 (3.05) .120 (7.24) .285 (0.76) .030 (0.89) .035 DIA -L A TYPE -D = SingleEnded -D-DP = Differential Pair (-01 only) -C* = Electro-Polished Selective 50 " (1.27 m) min Au over 150 " (3.81 m) Ni on Signal Pins in contact area, 10 " (0.25 m) min Au over 50 " (1.27 m) Ni on Ground Plane in contact area, Matte Tin over 50 " (1.27 m) min Ni on all solder tails (3.25) .128 *Note: -C Plating passes 10 year MFG testing (0.64) .025 -K = (8.25 mm) .325" DIA Polyimide Film Pick & Place Pad -TR = Tape & Reel (-090 positions maximum) -L = Latching Option (Not available on -060 (-D-DP) & -090 positions) QTH MATED HEIGHT LEAD STYLE WITH QSH* -01 -02 -03 -04 -05 -07 -09 (5.00) .197 (8.00) .315 (11.00) .433 (16.00) .630 (19.00) .748 (25.00) .984 (14.00) .551 *Processing conditions will affect mated height. See SO Series for board space tolerances Due to technical progress, all designs, specifications and components are subject to change without notice. WWW.SAMTEC.COM OTHER OPTION All parts within this catalog are built to Samtec's specifications. Customer specific requirements must be approved by Samtec and identified in a Samtec customer-specific drawing to apply.