ERJ-XGNJ363Y - Panasonic Electronic Components

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ect Spec. No.

Chip Resistor PRODUCT SPECIFICATION FOR IMFORMATION151-SRJ-EX07A

Part No. 

ERJXGN11 - 1



Panasonic Electronic Devices Co., Ltd.

1. Dimension

L W a b t

Dimension (mm) 0.40+/-0.02 0.20+/-0.02 0.10+/-0.03 0.10+/-0.03 0.13+/-0.02

2. Power Derating Curve

100

80

60

40

20

0

120

Ambi e nt Tempe rature (deg. C)

Rated Power (%)

-60 -40 -20 020 40 60 80 100 120 140 160

Figure 1

3. Ratings

Item Rated value Explanation

Power Rating 0.031W When used at ambient temperature above 70

deg.C, power rating shall be determined in

accordance with Figure 1.

Category temperature range:

: -55 to 125 deg.C

(1) Substrate : Alumina

(2) Protective Coating : Resin

(Restricted Flame Retardant Free)

(3) Resistive Element : Metal glaze

(4) Inner Termination : Thick film material

(5) Middle Termination : Ni Plating

(6) Outer Termination : Sn Plating

L

a a

W

t

b b

(1) (2) (3) (4) (5) (6)

70

125

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ect Spec. No.

Chip Resistor PRODUCT SPECIFICATION FOR IMFORMATION151-SRJ-EX07A

Part No. 

ERJXGN11 - 2



Panasonic Electronic Devices Co., Ltd.

Item Rated value Explanation

Rated voltage &

Rated Continuous

Working Voltage

The rated voltage of each resistance should be calculated from the equation

below. And when the rated voltage exceeds the maximum RCWV,

the maximum RCWV should be the rated voltage.

Rated voltage = (Power rating x Resistance Value) 1/2

The maximum RCWV : 15V

Max.

Overload Voltage

The overload voltage should be 2.5 times the rated voltage. And when

the voltage exceeds the maximum overload voltage, the value shown below

should be the maximum overload voltage.

The maximum overload voltage : 30V

Resistance

Tolerance J : +/- 5%

Resistance Range 10 ohm – 1.0 M ohm (E-24 series)

4. Explanation of Part Number

E R J X G N J 1 0 2 Y

(1) (2) (3) (4) (5)

(1) Product Code : Thick Film Chip Resistor

(2) Size and Rated Power : 0.4 mm x 0.2 mm, 0.031 W

Restricted Flame Retardant Free

(3) Resistance Tolerance

Code Resistance Tolerance

J +/- 5%

(4) Resistance Value

The first two digits are the significant figures of resistance value, and the last figure shows

the number of zero following in ohm.

(5) Packaging Configuration

Code Packaging Configuration

Y Taping (20,000pcs/reel)

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ect Spec. No.

Chip Resistor PRODUCT SPECIFICATION FOR IMFORMATION151-SRJ-EX07A

Part No. 

ERJXGN11 - 3



Panasonic Electronic Devices Co., Ltd.

5. Appearance & Construction

Item Specification Explanation

Appearance &

Construction

1. The resistive element should be covered with protective coating that don’t

fade easily. The surface of coating should avoid unevenness, flaw, pinhole

and discoloration.

2. The electrode should be printed uniformly, as shown in the dimensions.

The plating should not fade easily, and should avoid unevenness, flaw,

pinhole, projection and discoloration.

3. The electrode should be connected electrically, mechanically to resistive

element.

4. Dimensions of the substrate should be as in the list and it should not

have chipping, flaw, flash and crack.

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ect Spec. No.

Chip Resistor PRODUCT SPECIFICATION FOR IMFORMATION151-SRJ-EX07A

Part No. 

ERJXGN 11 - 4

Panasonic Electronic Devices Co., Ltd.

As far as there shall not designation especially, the following tests and measurement shall be

operated under the following conditions.

Normal temperature : 5 deg.C to 35 deg.C

Normal humidity : 45 % to 85 %

Normal atmospheric pressure : 86 k Pa to 106 k Pa

6. Performance Specification

Item Specification Test Method (JIS-C5201-1)

DC resistance DC resistance value shall

be within the specified

tolerance. At 20 deg.C, 65%RH

Temperature

coefficient

of resistance

(TCR)

10 ohm – 91 ohm

: +/- 300 x 10–6/deg.C

100 ohm – 1 M ohm

: +/- 200 x 10–6/deg.C

Natural resistance change per temperature

degree centigrade.

TCR=(R

2-R1)x106/R1(t2-t1) (x10–6/deg.C)

R

1 : Resistance value at reference

temperature (t1)

R

2 : Resistance value at test

temperature (t2)

t

1 : 25 deg.C , t2 : 125 deg.C

Short time

overload ∆R :

+/-(2%+0.1 ohm)

Resistors shall be applied 2.5 times the rated

voltage for 5 seconds.

Max. overload voltage shall be 30V.

Intermittent

overload ∆R :

+/-(5%+0.1 ohm)

Resistors shall be subjected to 10000 cycles

of 2.5 times the rated voltage applied for 1

second with pause of 25 seconds between

tests.

Max. overload voltage shall be 30V.

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ect Spec. No.

Chip Resistor PRODUCT SPECIFICATION FOR IMFORMATION151-SRJ-EX07A

Part No. 

ERJXGN 11 - 5

Panasonic Electronic Devices Co., Ltd.

7. Machinery characteristic

Item Specification Test Method (JIS-C5201-1)

No mechanical damage.

Bending

strength

∆R :

+/-(1%+0.05 ohm)

Substrate : Glass epoxy (t=1.0 mm)

Span : 90mm

Bending distance : 3mm (10 seconds)

Solderability Termination should be

covered uniformly with solder

(Min. 95% coverage)

Resistors shall be dipped in the melted solder

bath at 235 deg.C +/- 5 deg.C for 2 seconds

+/- 0.5 second. Flux shall be removed from

the surface of termination with clean organic

solvent.

Resistance to

soldering heat ∆R :

+/-(1%+0.05 ohm)

Resistors shall be dipped in the melted solder

bath at 270 deg.C +/- 3 deg.C for 10 seconds

+/- 1 second.

Resistance to

vibration

(Low frequency)

∆R :

+/-(1%+0.05 ohm)

Resistors shall be subjected to a single

vibration having as double amplitude of 1.5

mm in 3 directions perpendicular one another

for 2 hours each. (6 hours in total)

The vibration frequency shall be varied

uniformly from 10 Hz to 55 Hz, and return

to 10 Hz traversing for 1 min.

Without distinct

deformation in appearance

Resistance to

solvent ∆R :

+/-(0.5% +0.05 ohm)

Solvent solution : Isopropyl alcohol

(1) Dipping 10 +/- 1 hours, dry in room

condition for 30 +/- 10 minutes.

(2) Ultrasonic wave washing : 5 +/- 1 min.

(0.3W/cm2,28kHz)

Dry in room condition for 30 +/-10 minutes.

0.2 0.2 0.2

0.2

100

40

(mm)

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ect Spec. No.

Chip Resistor PRODUCT SPECIFICATION FOR IMFORMATION151-SRJ-EX07A

Part No. 

ERJXGN 11 - 6

Panasonic Electronic Devices Co., Ltd.

8. Environmental test

Item Specification Test Method (JIS-C5201-1)

Low

temperature

exposure

∆R :

+/-(1%+0.05 ohm)

Resistors shall be exposed at -55 deg.C +/- 3

deg.C with no load for 1000 hours +48/-0

hours.

High

temperature

exposure

∆R :

+/-(1%+0.05 ohm)

Resistors shall be exposed at 125 deg.C +/- 3

deg.C with no load for 1000 hours +48/-0

hours.

Resistors shall be tested for 5 cycles

continuously in accordance with the following

duty cycle.

Step Temperature (deg.C) Time (min.)

1 -55 +/-3 30

2 Room temperature Max. 3

3 +125 +/-3 30

4 Room temperature Max.3

Temperature

cycling ∆R :

+/-(1%+0.05 ohm)

Humidity

(Steady state) ∆R :

+/-(1%+0.05 ohm)

Resistors shall be exposed at 60 deg.C +/- 2

deg.C and 90% to 95% relative hummidity in

a humidity test chamber for 1000 hours +48/-0

hours.

Load life ∆R :

+/-(3%+0.1 ohm)

Resistors shall be operated at DC rated

voltage (1.5 hours "ON", 0.5 hours "OFF") for

1000 hours +48/-0 hours in a test chamber

controlled at 70 deg.C +/-2 deg.C.

Load life in

humidity ∆R :

+/-(3%+0.1 ohm)

Resistors shall be operated at DC rated

voltage (1.5 hours “ON”, 0.5 hours “OFF”) for

1000 hours +48/-0 hours in a test chamber

controlled at 60 deg.C +/- 2 deg.C and at

90 % to 95% in relative hummidity.

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ect Spec. No.

Chip Resistor PRODUCT SPECIFICATION FOR IMFORMATION151-SRJ-EX07A

Part No. 

ERJXGN 11 - 7



Panasonic Electronic Devices Co., Ltd.

9. Common precautions in handling resistors

! Notice for use

(1) This specification shows the quality and performance of a unit component. Before adoption,

be sure to evaluate and verify the product mounting it in your product.

(2) We take no responsibility for troubles caused by the product usage that is not specified in

this specification.

(3) Use fail-safe design and ensure safety by carrying out the following items in cases where it

is forecast that the failure of the product gives serious damage to something important like

human life, for instant in traffic transportation equipment (trains, cars, traffic signal

equipment, etc.), medical equipment, aerospace equipment, electric heating appliances,

combustion and gas equipment, rotating equipment, disaster and crime preventive

equipment.

*Ensure safety as the system by setting protective circuits and protective equipment.

*Ensure safety as the system by setting such redundant circuits as do not cause danger by

a single failure.

(4) When a dogma shall be occurred about safety for this product, be sure to inform us rapidly,

operate your technical examination.

(5) The product is designed to use in general standard applications of general electric

equipment (AV products, household electric appliances, office equipment, information and

communication equipment, etc.); hence, it do not take the use under the following special

environments into consideration.

Accordingly, the use in the following special environments, and such environmental

conditions may affect the performance of the product; prior to use, verify the performance,

reliability, etc. thoroughly.

1) Use in liquids such as water, oil, chemical, and organic solvent.

2) Use under direct sunlight, in outdoor or in dusty atmospheres.

3) Use in places full of corrosive gases such as sea breeze, Cl2, H2S, NH3, SO2, and NOX.

4) Use in environment with large static electricity or strong electromagnetic waves.

5) Where the product is close to a heating component, and where an inflammable such as

a polyvinyl chloride wire is arranged close to the product.

6) Where the resistor is sealed or coated with resin, etc.

7) Where water or a water-soluble detergent is used in cleaning free soldering and in flux

cleaning after soldering (Pay particular attention to soluble flux.)

8) Use in such a place where the product is wetted due to dew condensation.

(6) If transient load (heavy load in a short time) like pulse is expected to be applied, carry out

evaluation and confirmation test with resistors actually mounted on your own board. When

the load of more than rated power is applied under the load condition at steady state, it

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ect Spec. No.

Chip Resistor PRODUCT SPECIFICATION FOR IMFORMATION151-SRJ-EX07A

Part No. 

ERJXGN 11 - 8



Panasonic Electronic Devices Co., Ltd.

may impair performance and/or reliability of resistor. Never exceed the rated power. When

the product shall be used under special condition, be sure to ask us in advance.

(7) Halogen type (Chlorine type, Bromine type, etc.) or other high-activity flux is not

recommended as the residue may affect performance or reliability of resistors.

(8) When soldering with soldering iron, ground a tip of the soldering iron never touch the body

of the chip resistor with a tip of the soldering iron. When using a soldering iron with a tip

at high temperature, solder for a time as short as possible. (three seconds or less up to

350 deg.C)

(9) Avoid physical shock to the resistor and nipping of the resistor with hard tool (a pair of

pliers or tweezers) as it may damage protective film or the body of resistor and may affect

resistor’s performance.

(10) Avoid immersion of chip resistor in solvent for long time. Use solvent after the effect of

immersion is confirmed.

(11) This resistance may change with ESD.

In case of handling this product, please take care as follows.

Environment which static electricity cannot generate easily.

( Recommendation humidity: 40 - 60%)

Wearing of an earth band and a conductive glove.

Connecting surface mounting system to the earth.

Installation of the electric conduction mat on a work table.

10. Storage Method

If the product is stored in the following environments and conditions, the performance and

solderability may be badly affected, avoid the storage in the following environments.

(1) Storage in places full of corrosive gases such as sea breeze, Cl2, H2S, NH3, SO2, and NOX.

(2) Storage in places exposed to direct sunlight.

(3) Storage in places outside the temperature range of 5 deg.C to 35 deg.C and humidity

range of 45 %RH to 85 %RH.

(4) Storage over a year after our delivery (This item also applies to the case where the storage

method specified in item (1) to (3) has been followed.).

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ect Spec. No.

Chip Resistor PRODUCT SPECIFICATION FOR IMFORMATION151-SRJ-EX07A

Part No. 

ERJXGN 11 - 9



Panasonic Electronic Devices Co., Ltd.

11. Laws and Regulations

(1) This product has not been manufactured with any ozone-depleting chemical controlled under

the Montreal Protocol.

(2) This product complies with the RoHS Directive (Restriction of the use of certain Hazardous

Substances in electrical and electronic equipment (DIRECTIVE 2002/95/EC)).

(3) All materials used in this part are registered material under the Law Concerning the

Examination and Regulation of Manufacturs, etc. of Chemical substances.

(4) All the materials used in this part contain no brominated materials of PBBOS or PBBS as the

flame-retardant.

(5) If you need the notice by letter of “A preliminary judgement on the Laws of Japan foreign

exchange and Foreign Trade control”, be sure to let us know.

12. Production site

Country : Japan

Plant : Panasonic Electronic Devices Fukui Co., Ltd.

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ect Spec. No.

Chip Resistor PRODUCT SPECIFICATION FOR IMFORMATION151-SRJ-EX07A

Part No. 

ERJXGN 11 - 10



Panasonic Electronic Devices Co., Ltd.

13. Taped and Reel Package

13-1 Physical Dimensions

Structure and reel dimensions shall be as shown in the figure below.

Inaccordance with EIAJ ET-7200.

13-2 Carrier tape dimension

A B W F E

Dimension (mm) 0.25+/-0.03 0.45+/-0.03 8.00+/-0.20 3.50+/-0.05 1.75+/-0.10

P

1 P

0 øD0 T K

Dimension (mm) 2.00+/-0.10 4.00+/-0.10 1.50+0.10/-0 0.31+/-0.03 0.16+/-0.03

13-3 Specifications

13-3-1 Taping

(1) Minimum Bending Radius

When Carrier tape shall be bent by Minimum Bending Radius (15mm), no defection of chip

and no break of carrier tape. However minimum bending radius shall be tested for 1 time.

(2) Resistance to climate of top tape

When it shall be exposed at 60 deg.C, 90 to 95 %RH for 120 hours, no exfoliation of

top tape.

Carrier tape

Top tape

Adhesive tape

W

F

E

P1

P0

A

B

K

øD0 Sprocket hole

Chip hole Chip resistor

Unit : mm

T

Min. 60.0

11.4 +/- 1.0

9.0 +/- 1.0

180.0 +0 / -3.0

13.0 +/- 1.0

Min. 60.0

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ect Spec. No.

Chip Resistor PRODUCT SPECIFICATION FOR IMFORMATION151-SRJ-EX07A

Part No. 

ERJXGN 11 - 11



Panasonic Electronic Devices Co., Ltd.

(3) When the test shall be operated with the below conditions, peel strength should be 0.049 N

to 0.49 N, should not have flash and tear after peeling.

(Test Method)

13-3-2 Quantity in Taping : 20,000 pcs./reel

13-3-3 Tape packaging

(1) Resistance side shall be facing upward.

(2) Chip resistor shall not be sticking to top tape.

(3) Chip resistor shall be easy to take out from carrier tape and chip hole or sprocket

hole shall not have flash and break.

13-4 Outer Packaging Quantity : 20 reels (Max. 400,000pcs.)

* When taping shall not reach Max. or quantity, the remaining empty space shall be buried with

buffer material.

* When the quantity shall be few, alternative packaging methods may be used. No problem must

occur during the exportation of the product.

13-5 Marking

At last, production country is displayed in English.

(1) Side of reel (Marking shall be on one side)

1) Part name, 2)Part number, 3)Quantity, 4)Lot number, 5)Maker name

6) Poduction country

(2)Packaging box

1)Customer name, 2)Part name, 3)Part number, 4)Customer part number, 5)Quantity

6)Maker name, 7)Poduction country

Peeling directionCarrier tape

Top tape

10 degree

Tape

Marking