Product
Specification 108-40018
01Mar10 Rev E
AMP-LATCH* and IDC Header Connectors, .100 X .100 Inch
Grid
©2010 Tyco Electronics Corporation
Harrisburg, PA
All International Rights Reserved.
* Trademark
| Indicates change For latest revision, visit our website at www.tycoelectronics.com\documents.
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LOC B
1. SCOPE
1.1. Content
This specification covers performance, tests and quality requirements for AMP-LATCH* universal and
low profile, and IDC standard and low profile .100 X .100 inch grid headers, right angle and vertical
assemblies.
1.2. Qualification
When tests are performed on subject product line, procedures specified in Figure 1 shall be used. All
inspections shall be performed using applicable inspection plan and product drawing.
1.3. Successful qualification testing on the subject product line was completed on 03Nov95, additional|testing was completed on 23Feb10. The Qualification Test Report number for this testing is 501-325.|This documentation is on file at and available from Engineering Practices and Standards (EPS).|
2. APPLICABLE DOCUMENTS
The following documents form a part of this specification to the extent specified herein. Unless
otherwise specified, the latest edition of the document applies. In the event of conflict between the
requirements of this specification and the product drawing, the product drawing shall take precedence.
In the event of conflict between the requirements of this specification and referenced documents, this
specification shall take precedence.
2.1. Tyco Electronics Documents|
!109-1: Test Specification (General Requirements for Test Specifications)
!109 Series: Test Specifications as indicated in Figure 1
!501-325: Qualification Test Report (Connector, AMPLATCH* Header, .100 X .100 Inch Grid)
2.2. Industry Document|
EIA-364: Electrical Connector/Socket Test Procedures Including Environmental Classifications|
2.3. Reference Document|
109-197: Test Specification (Tyco Electronics Test Specifications vs EIA and IEC Test Methods)|
3. REQUIREMENTS
3.1. Design and Construction
Product shall be of design, construction and physical dimensions specified on applicable product
drawing.
3.2. Materials
Materials used in the construction of this product shall be as specified on the applicable product
drawing.
108-40018
Rev E 2 of 5
3.3. Ratings
!Voltage: 250 volts AC
!Current: Signal application only, 1 ampere maximum per contact
!Temperature: -65 to 105°C
3.4. Performance and Test Description
Product is designed to meet electrical, mechanical and environmental performance requirements
specified in Figure 1. Unless otherwise specified, all tests shall be performed at ambient environmental
conditions per Test Specification 109-1.
3.5. Test Requirements and Procedures Summary
Test Description Requirement Procedure
Examination of product. Meets requirements of product
drawing. Visual, dimensional and functional
per applicable quality inspection
plan.
ELECTRICAL
Insulation resistance. 5000 megohms minimum initial.
1000 megohms minimum final. EIA-364-21.
500 volts DC, 2 minute hold.
Test between adjacent contacts of
unmated specimens.
Withstanding voltage. One minute hold with no breakdown
or flashover. EIA-364-20, Condition I.
1000 volts AC at sea level.
Test between adjacent contacts of
unmated specimens.
MECHANICAL
Solderability. Solderable area shall have
minimum of 95% solder coverage. AMP Spec 109-11-1.
Subject contacts to solderability for
specimens with tin-lead plated
soldertails.
AMP Spec 109-11-11.
Subject contacts to solderability for
specimens with lead-free tin plated
soldertails.
Component resistance to wave
soldering. See Note. AMP Spec 109-202, Condition A.
240°C for specimens with tin-lead
plated soldertails.
AMP Spec 109-202, Condition B.
265°C for specimens with lead-free
tin plated soldertails.
Contact retention. Post shall not dislodge from normal
position. EIA-364-29, Method A.
Apply axial load of 2 pounds to
contacts and hold for 6 seconds.
See Figure 3.
Figure 1 (continued)
108-40018
Test Description Requirement Procedure
Rev E 3 of 5
ENVIRONMENTAL
Thermal shock. See Note. EIA-364-32, Test Condition II.
Subject unmated specimens to 5
cycles between -65 and 105°C with
30 minute dwells at temperature
extremes.
Humidity/temperature cycling. See Note. EIA-364-31, Method III.
Subject unmated specimens to 10
cycles (10 days) between 25 and
65°C at 80 to 100% RH with cold
shock.
Shall meet visual requirements, show no physical damage and shall meet requirements of
NOTE additional tests as specified in Test Sequence in Figure 2.
Figure 1 (end)
3.6. Product Qualification and Requalification Test Sequence
Test or Examination Test Group (a)
123
Test Sequence (b)
Examination of product 1,3,5 1,3 1,8
Insulation resistance 2,6
Withstanding voltage 3,7
Solderability 2
Component resistance to wave soldering 2
Contact retention 4
Thermal shock 4
Humidity/temperature cycling 5
(a) See paragraph 4.1.A.
NOTE (b) Numbers indicate sequence in which tests are performed.
Figure 2
108-40018
Rev E 4 of 5
4. QUALITY ASSURANCE PROVISIONS
4.1. Qualification Testing
A. Specimen Selection
Specimens shall be prepared in accordance with applicable Instruction Sheets and shall be
selected at random from current production. All test groups shall each consist of a minimum of 5
headers of each type.
B. Test Sequence
Qualification inspection shall be verified by testing specimens as specified in Figure 2.
4.2. Requalification Testing
If changes significantly affecting form, fit or function are made to the product or manufacturing process,
product assurance shall coordinate requalification testing, consisting of all or part of the original testing
sequence as determined by development/product, quality and reliability engineering.
4.3. Acceptance
Acceptance is based on verification that the product meets the requirements of Figure 1. Failures
attributed to equipment, test setup or operator deficiencies shall not disqualify the product. When
product failure occurs, corrective action shall be taken and specimens resubmitted for qualification.
Testing to confirm corrective action is required before resubmittal.
4.4. Quality Conformance Inspection
The applicable quality inspection plan will specify sampling acceptable quality level to be used.
Dimensional and functional requirements shall be in accordance with the applicable product drawing
and this specification.
108-40018
Rev E 5 of 5
Figure 3
Contact Retention
AMP-LATCH Low Profile Header
AMP-LATCH Universal Header
IDC Standard Profile Header
IDC Low Profile Header
