www.vishay.com For technical questions, contact: efi@vishay.com Document Number: 61079
50 Revision: 14-Mar-08
QFN
Vishay Electro-Films
NiCr Thin Film, Top-Contact Resistor
CHIP
RESISTORS
The QFN series nichrome on quartz resistor chips offer a
combination of nichrome stability, excellent frequency
response and small size.
The QFNs are manufactured using Vishay Electro-Films
(EFI) sophisticated thin film equipment and manufacturing
technology. The QFNs are 100 % electrically tested and
visually inspected to MIL-STD-883.
FEATURES
Wire bondable
Chip size: 0.020 inches square
Resistance range: 10 Ω to 510 kΩ
Resistor material: Nichrome
Quartz substrate: < 0.1 pF shunt capacitance
Power: 25 mW
APPLICATIONS
Vishay EFI QFN top-contact resistor chips are widely used in hybrid packages where space is limited. Designed with capacity to
handle substantial power loads, they also have the benefit of nichrome stability.
Recommended for hermetic environments where die is not exposed to moisture.
Product may not
be to scale
TEMPERATURE COEFFICIENT OF RESISTANCE, VALUES AND TOLERANCES
PROCESS CODE
CLASS H* CLASS K*
203 207
201 205
202 206
200 204
Gold terminations
*MIL-PRF-38534 inspection criteria
1 Ω
0.1 %
Tightest Standard Tolerance Available
± 25 ppm/°C
± 250 ppm/°C
± 50 ppm/°C
± 100 ppm/°C
1 % 0.5 %
10 Ω30 Ω100 Ω200 kΩ360 kΩ510 kΩ
STANDARD ELECTRICAL SPECIFICATIONS
PARAMETER
Noise, MIL-STD-202, Method 308
100 Ω - 250 kΩ
< 100 Ω or > 251 kΩ
- 35 dB typ.
- 20 dB typ.
Stability, 1000 h, + 125 °C, 50 mW ± 0.1 % max. ΔR/R
Operating Temperature Range- 55 °C to + 125 °C
Thermal Shock, MIL-STD-202,
Method 107, Test Condition F ± 0.25 % max. ΔR/R
High Temperature Exposure, + 150 °C, 100 h ± 0.5 % max. ΔR/R
Dielectric Voltage Breakdown 200 V
Insulation Resistance 1012 min.
Operating Voltage100 V max.
DC Power Rating at + 70 °C (Derated to Zero at + 175 °C) 25 mW
5 x Rated Power Short-Time Overload, + 25 °C, 5 s ± 0.25 % max. ΔR/R
Document Number: 61079 For technical questions, contact: efi@vishay.com www.vishay.com
Revision: 14-Mar-08 51
QFN
NiCr Thin Film, Top-Contact Resistor Vishay Electro-Films
CHIP
RESISTORS
DIMENSIONS in inches
SCHEMATIC
Options: Aluminum bonding pads, 10 kÅ minimum thickness
Consult Applications Engineer
0.020
0.004
TYPICAL RANGE
7.5 kΩ - 510 kΩ
0.020
0.004
0.008
0.004
TYPICAL RANGE
56 Ω - 7.4 kΩ
0.014
0.004
TYPICAL RANGE
10 Ω - 55 Ω
MECHANICAL SPECIFICATIONS in inches
PARAMETER
Chip Size 0.020 x 0.020 ± 0.003 (0.51 x 0.51 ± 0.05 mm)
Chip Thickness 0.010 ± 0.002 (0.254 ± 0.05 mm)
Chip substrate Material Quartz
Resistor Material Nichrome (passivation optional)
Bonding Pad Size 0.004 x 0.004 (0.10 x 0.10 mm)
Number of Pads 2
Pad Material 15 kÅ minimum gold
Backing None, lapped quartz
ORDERING INFORMATION
Example: 100 % visual, 10 kΩ, ± 1 %, ± 50 ppm/°C TCR, gold pads, class H visual inspection
W
INSPECTION/
PACKAGING
W = 100 % visually inspected
parts in matrix tray per
MIL-STD-883
X = Sample, commercial visually
inspected parts loaded in matrix
trays (4 % AQL)
Available alternatives:
Aluminum pads or gold back
Passivation (thermal set plastic)
QFN
PRODUCT
FAMILY
202
PROCESS
CODE
See Process Code
table
1000
RESISTANCE
VALUE
Use the first 4 digits
significant digits of the
resistance
1
MULTIPLIER
CODE
B = 0.01
A = 0.1
0 = 1
1 = 10
2 = 100
3 = 1000
4 = 10 000
F
TOLERANCE
CODE
B = 0.1 %
C = 0.2 %
D = 0.5 %
F = 1.0 %
G = 2.0 %
H = 2.5 %
J = 5.0 %
K = 10 %
Document Number: 91000 www.vishay.com
Revision: 18-Jul-08 1
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therein, which apply to these products.
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