74LVC1G08GS,132 - NXP - Datasheet.Directory

1. General description

The 74LVC1G08 provides one 2-input AND function.

Inputs ca n be driven from e ither 3.3 V or 5 V device s. This f eature allows the use of these

devices as translators in mixed 3.3 V and 5 V applications.

Schmitt trigger action at all inputs makes the circuit tolerant of slower input rise and fall

time.

This device is fully specified for partial power-down applications using IOFF.

The IOFF circuitry disables the outpu t, pr eve nting the damaging backflow current through

the device when it is powered down.

2. Features and benefits

Wide supply voltage range from 1.65 V to 5.5 V

High noise immunity

Complies with JEDEC standard:

JESD8-7 (1.65 V to 1.95 V)

JESD8-5 (2.3 V to 2.7 V)

JESD8-B/JESD36 (2.7 V to 3.6 V)

±24 mA output drive (VCC =3.0V)

CMOS low power consumption

Latch-up performance ≤ 250 m A

Direct interface with TTL levels

Inputs accept voltages up to 5 V

ESD protection:

HBM JESD22-A114F exceeds 2000 V

MM JESD22-A115 -A ex ce ed s 200 V

Multiple package options

Specified from −40 °C to +85 °C and −40 °C to +125 °C

74LVC1G08

Single 2-input AND gate

Rev. 8 — 19 October 2010 Product Specification

Product Specification Rev. 8 — 19 October 2010 2 of 17

NXP Semiconductors 74LVC1G08

Single 2-input AND gate

3. Ordering information

4. Marking

[1] The pin 1 indicator is located on the lo wer left corner of the device, below the marking code.

5. Functional diagram

Tabl e 1. Ordering information

Type number Package

Temperature

range Name Description Version

74LVC1G08GW −40 °Cto+125°C TSSOP5 plastic thin shrink small outline package; 5 leads;

body width 1.25 mm SOT353-1

74LVC1G08GV −40 °Cto+125°C SC-74A plastic surface-mounted package; 5 leads S OT753

74LVC1G08GM −40 °Cto+125°C XSON6 plastic extremely thin small outline package;

no leads; 6 terminals; body 1 ×1.45 ×0.5 mm SOT886

74LVC1G08GF −40 °C to +125 °C XSON6 plastic extremely thin small outline package;

no leads; 6 terminals; body 1 ×1×0.5 mm SOT891

74LVC1G08GN −40 °C to +125 °C XSON6 extremely thin small outline package; no leads;

6 terminals; body 0.9 ×1.0 ×0.35 mm SOT1115

74LVC1G08GS −40 °C to +125 °C XSON6 extremely thin small outline package; no leads;

6 terminals; body 1.0 ×1.0 ×0.35 mm SOT1202

Table 2. Marking

Type number Marking code[1]

74LVC1G08GW VE

74LVC1G08GV V08

74LVC1G08GM VE

74LVC1G08GF VE

74LVC1G08GN VE

74LVC1G08GS VE

Fig 1. Logic symbol Fig 2. IEC logic symbol Fig 3. Logic diagram

mna113

mna114

mna22

Product Specification Rev. 8 — 19 October 2010 3 of 17

NXP Semiconductors 74LVC1G08

Single 2-input AND gate

6. Pinning information

6.1 Pinning

6.2 Pin description

7. Functional description

[1] H = HIGH voltage level; L = LOW voltage level

Fig 4. Pin configuration

SOT353-1 and SOT753 Fig 5. Pin co nfiguration SOT886 Fig 6. Pin configuration SOT891,

SOT1115 and SOT1202

74LVC1G08

GND Y

001aab638

74LVC1G08

001aab639

GND

n.c.

VCC

Transparent top view

674LVC1G08

001aae978

GND

n.c.

VCC

Transparent top view

Table 3. Pin description

Symbol Pin Description

SOT353-1, SOT753 SOT886, SOT891, SOT1115 and SOT1202

B 1 1 data input

A 2 2 data input

GND 3 3 ground (0 V)

Y 4 4 data output

n.c. - 5 not connected

VCC 5 6 supply voltage

Table 4. Function table[1]

Input Output

ABY

LLL

LHL

HLL

HHH

Product Specification Rev. 8 — 19 October 2010 4 of 17

NXP Semiconductors 74LVC1G08

Single 2-input AND gate

8. Limiting values

[1] The input and output voltage ratings may be exceeded if the input and output current ratings are observed.

[2] When VCC = 0 V (Power-down mode), the output voltage can be 5.5 V in normal operation.

[3] For TSSOP5 and SC-74A packages: above 87.5 °C the value of Ptot derates linearly with 4.0 mW/K.

For XSON6 package: above 118 °C the value of Ptot derates linearly with 7.8 mW/K.

9. Recommended operating conditions

Table 5. Limiting values

In accordance with the Absolute Maximum Rating System (IEC 60134). Voltages are referenced to GND (ground = 0 V).

Symbol Parameter Conditions Min Max Unit

VCC supply voltage −0.5 +6.5 V

IIK input clamping current VI < 0 V −50 - mA

VIinput voltage [1] −0.5 +6.5 V

IOK output clamping current VO > VCC or VO < 0 V - ±50 mA

VOoutput voltage Active mode [1][2] −0.5 VCC + 0.5 V

Power-down mode [1][2] −0.5 +6.5 V

IOoutput current VO = 0 V to VCC -±50 mA

ICC supply current - 100 mA

IGND ground current −100 - mA

Ptot total power dissipation Tamb = −40 °C to +125 °C[3] - 250 mW

Tstg storage temperature −65 +150 °C

Table 6. Recommended operating conditions

Symbol Parameter Conditions Min Typ Max Unit

VCC supply voltage 1.65 - 5.5 V

VIinput voltage 0 - 5.5 V

VOoutput voltage Active mode 0 - VCC V

VCC = 0 V; Power-down mode 0 - 5.5 V

Tamb ambient temp erature −40 - +125 °C

Δt/ΔV input transition rise and fall rate VCC = 1.65 V to 2.7 V - - 20 ns/V

VCC = 2.7 V to 5.5 V - - 10 ns/V

Product Specification Rev. 8 — 19 October 2010 5 of 17

NXP Semiconductors 74LVC1G08

Single 2-input AND gate

10. Static characteristics

[1] All typical values are measured at VCC = 3.3 V and Tamb =25°C.

Table 7. Static characteristics

At recommended operating conditions. Voltages are referenced to GND (ground = 0 V).

Symbol Parameter Conditions −40 °C to +85 °C−40 °C to +125 °CUnit

Min Typ[1] Max Min Max

VIH HIGH-level

input voltage VCC = 1.65 V to 1.95 V 0.65VCC - - 0.65VCC -V

VCC = 2.3 V to 2.7 V 1.7 - - 1.7 - V

VCC = 2.7 V to 3.6 V 2.0 - - 2.0 - V

VCC = 4.5 V to 5.5 V 0.7VCC - - 0.7VCC -V

VIL LOW-level

input voltage VCC = 1.65 V to 1.95 V - - 0.35VCC -0.35V

CC V

VCC = 2.3 V to 2.7 V - - 0.7 - 0.7 V

VCC = 2.7 V to 3.6 V - - 0.8 - 0.8 V

VCC = 4.5 V to 5.5 V - - 0.3VCC -0.3V

CC V

VOH HIGH-level

output voltage VI=V

IH or VIL

IO=−100 μA;

VCC = 1.65 V to 5.5 V VCC −0.1 - - VCC −0.1 - V

IO=−4mA; V

CC = 1.65 V 1.2 - - 0.95 - V

IO=−8mA; V

CC = 2.3 V 1.9 - - 1.7 - V

IO=−12 mA; VCC = 2.7 V 2.2 - - 1.9 - V

IO=−24 mA; VCC = 3.0 V 2.3 - - 2.0 - V

IO=−32 mA; VCC = 4.5 V 3.8 - - 3.4 - V

VOL LOW-level

output voltage VI=V

IH or VIL

IO=100μA;

VCC = 1.65 V to 5.5 V - - 0.10 - 0.10 V

IO=4mA; V

CC = 1.65 V - - 0.45 - 0 .70 V

IO=8mA; V

CC = 2.3 V - - 0.30 - 0 .4 5 V

IO=12mA; V

CC = 2.7 V - - 0.40 - 0.60 V

IO=24mA; V

CC = 3.0 V - - 0.55 - 0.80 V

IO=32mA; V

CC = 4.5 V - - 0.55 - 0.80 V

IIinput leakage

current VI = 5.5 V or GND;

VCC =0Vto5.5V -±0.1 ±5-±100 μA

IOFF power-off

leakage

current

VCC = 0 V; VIor VO=5.5V - ±0.1 ±10 - ±200 μA

ICC supply current VI = 5.5 V or GND; IO = 0 A;

VCC = 1.65 V to 5.5 V -0.110 - 200μA

ΔICC additional

supply current per pin; VCC = 2.3 V to 5.5 V;

VI=V

CC −0.6 V; IO=0 A - 5 500 - 5000 μA

CIinput

capacitance VCC = 3.3 V; VI = GND to VCC -5- - -pF

Product Specification Rev. 8 — 19 October 2010 6 of 17

NXP Semiconductors 74LVC1G08

Single 2-input AND gate

11. Dynamic characteristics

[1] Typical values are measured at Tamb =25°C and VCC = 1.8 V, 2 . 5 V, 2.7 V, 3.3 V and 5.0 V respectively.

[2] tpd is the same as tPLZ and tPZL.

[3] CPD is used to determine the dynamic power dissipation (PDin μW).

PD=C

PD ×VCC2×fi×N+∑(CL×VCC2×fo) where:

fi= input frequency in MHz;

fo= output frequency in MHz;

CL= output load capacitance in pF;

VCC = supply voltage in V;

N = number of inputs switching;

∑(CL×VCC2×fo) = sum of outputs.

12. AC waveforms

Table 8. Dynamic characteristics

Voltages are referenced to GND (ground = 0 V); for load circuit see Figure 8.

Symbol Parameter Conditions −40 °C to +85 °C−40 °C to +125 °CUnit

Min Typ[1] Max Min Max

tpd propagation delay A, B to Y; see Figure 7 [2]

VCC = 1.65 V to 1.95 V 1.0 3.4 8.0 1.0 10.5 ns

VCC = 2.3 V to 2.7 V 0.5 2.2 5.5 0.5 7.0 ns

VCC = 2.7 V 0.5 2.5 5.5 0.5 7.0 ns

VCC = 3.0 V to 3.6 V 0.5 2.1 4.5 0.5 6.0 ns

VCC = 4.5 V to 5.5 V 0.5 1.7 4.0 0.5 5.5 ns

CPD power dissipation

capacitance VI = GND to VCC; VCC = 3.3 V [3] -16- - -pF

Measurement points are given in Table 9.

VOL and VOH are typical output voltage levels that occur with the output load.

Fig 7. The input A, B to output Y propagation delays

mna61

tPHL tPLH

A, B input

Y output

GND

VOH

VOL

Product Specification Rev. 8 — 19 October 2010 7 of 17

NXP Semiconductors 74LVC1G08

Single 2-input AND gate

Table 9. Measurement points

Supply voltage Input Output

VCC VMVM

1.65 V to 1.95 V 0.5VCC 0.5VCC

2.3 V to 2.7 V 0.5VCC 0.5VCC

2.7V 1.5V 1.5V

3.0V to 3.6V 1.5V 1.5V

4.5 V to 5.5 V 0.5VCC 0.5VCC

Test data is given in Table 10.

Definitions for test circuit:

RL = Load resistance.

CL = Load capacitance including jig and probe capacitance.

RT = Termination resistance should be equal to the output impedance Zo of the pulse generator.

VEXT = External voltage for measuring switching times.

Fig 8. Test circuit for measuring switching times

EXT

mna61

DUT

Table 10. Test data

Supply voltage Input Load VEXT

VCC VItr=t

fCLRLtPLH, tPHL

1.65 V to 1.95 V VCC ≤ 2.0ns 30pF 1kΩopen

2.3 V to 2.7 V VCC ≤ 2.0ns 30pF 500Ωopen

2.7V 2.7V ≤ 2.5ns 50pF 500Ωopen

3.0V to 3.6V 2.7V ≤ 2.5ns 50pF 500Ωopen

4.5 V to 5.5 V VCC ≤ 2.5ns 50pF 500Ωopen

Product Specification Rev. 8 — 19 October 2010 8 of 17

NXP Semiconductors 74LVC1G08

Single 2-input AND gate

13. Package outline

Fig 9. Package outline SOT353-1 (TSSOP5)

UNIT A1

max. A2A3bpLHELpwyv

ceD(1) E(1) Z(1) θ

REFERENCES

OUTLINE

VERSION EUROPEAN

PROJECTION ISSUE DATE

IEC JEDEC JEITA

mm 0.1

1.0

0.8

0.30

0.15

0.25

0.08

2.25

1.85

1.35

1.15 0.65

1.3 2.25

2.0

0.60

0.15

7°

0°

0.1 0.10.30.425

DIMENSIONS (mm are the original dimensions)

Note

1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.

0.46

0.21

SOT353-1 MO-203 SC-88A 00-09-01

03-02-19

0.15

(A3)

detail X

vMA

1.5 3 mm0

scale

SSOP5: plastic thin shrink small outline package; 5 leads; body width 1.25 mm SOT353-

1.1

Product Specification Rev. 8 — 19 October 2010 9 of 17

NXP Semiconductors 74LVC1G08

Single 2-input AND gate

Fig 10. Package outline SOT753 (SC-74A)

REFERENCES

OUTLINE

VERSION EUROPEAN

PROJECTION ISSUE DATE

IEC JEDEC JEITA

SOT753 SC-74A

wBM

detail X

vMA

0 1 2 mm

scale

132

Plastic surface-mounted package; 5 leads SOT75

UNIT A1bpcDEHELpQywv

mm 0.100

0.013

0.40

0.25

3.1

2.7

0.26

0.10

1.7

1.3

0.95 3.0

2.5 0.2 0.10.2

DIMENSIONS (mm are the original dimensions)

0.6

0.2

0.33

0.23

1.1

0.9

02-04-16

06-03-16

Product Specification Rev. 8 — 19 October 2010 10 of 17

NXP Semiconductors 74LVC1G08

Single 2-input AND gate

Fig 11. Package outline SOT886 (XSON6)

terminal 1

index area

REFERENCES

OUTLINE

VERSION EUROPEAN

PROJECTION ISSUE DATE

IEC JEDEC JEITA

SOT886 MO-252

SOT88

04-07-15

04-07-22

DIMENSIONS (mm are the original dimensions)

XSON6: plastic extremely thin small outline package; no leads; 6 terminals; body 1 x 1.45 x 0.5 mm

0 1 2 mm

scale

Notes

1. Including plating thickness.

2. Can be visible in some manufacturing processes.

UNIT

mm 0.25

0.17

1.5

1.4

0.35

0.27

max b E

1.05

0.95

Dee

0.40

0.32

0.50.6

A(1)

max

0.5 0.04

6×

(2)

4×

(2)

Product Specification Rev. 8 — 19 October 2010 11 of 17

NXP Semiconductors 74LVC1G08

Single 2-input AND gate

Fig 12. Package outline SOT891 (XSON6)

terminal 1

index area

REFERENCES

OUTLINE

VERSION EUROPEAN

PROJECTION ISSUE DATE

IEC JEDEC JEITA

SOT891

SOT89

05-04-06

07-05-15

XSON6: plastic extremely thin small outline package; no leads; 6 terminals; body 1 x 1 x 0.5 mm

0 1 2 mm

scale

DIMENSIONS (mm are the original dimensions)

UNIT

mm 0.20

0.12

1.05

0.95

0.35

0.27

max b E

1.05

0.95

Dee

0.40

0.32

0.350.55

max

0.5 0.04

6×

(1)

4×

(1)

Note

1. Can be visible in some manufacturing processes.

Product Specification Rev. 8 — 19 October 2010 12 of 17

NXP Semiconductors 74LVC1G08

Single 2-input AND gate

Fig 13. Package outline SOT1115 (XSON6)

References

Outline

version

European

projection Issue date

IEC JEDEC JEITA

SOT1115

sot1115_po

10-04-02

10-04-07

Unit

max

nom

min

0.35 0.04 0.95

0.90

0.85

1.05

1.00

0.95

0.55 0.3

0.40

0.35

0.32

A(1)

Dimensions

Note

1. Including plating thickness.

2. Visible depending upon used manufacturing technology.

SON6: extremely thin small outline package; no leads;

terminals; body 0.9 x 1.0 x 0.35 mm SOT111

A1b

0.20

0.15

0.12

DEee

0.35

0.30

0.27

0 0.5 1 mm

scale

terminal 1

index area

(4×)(2)

e1e1

321

6 5 4

(6×)(2)

A1A

Product Specification Rev. 8 — 19 October 2010 13 of 17

NXP Semiconductors 74LVC1G08

Single 2-input AND gate

Fig 14. Package outline SOT1202 (XSON6)

References

Outline

version

European

projection Issue date

IEC JEDEC JEITA

SOT1202

sot1202_po

10-04-02

10-04-06

Unit

max

nom

min

0.35 0.04 1.05

1.00

0.95

1.05

1.00

0.95

0.55 0.35

0.40

0.35

0.32

A(1)

Dimensions

Note

1. Including plating thickness.

2. Visible depending upon used manufacturing technology.

SON6: extremely thin small outline package; no leads;

terminals; body 1.0 x 1.0 x 0.35 mm SOT120

A1b

0.20

0.15

0.12

DEee

0.35

0.30

0.27

0 0.5 1 mm

scale

terminal 1

index area

(4×)(2)

e1e1

123

6 5 4

(6×)(2)

Product Specification Rev. 8 — 19 October 2010 14 of 17

NXP Semiconductors 74LVC1G08

Single 2-input AND gate

14. Abbreviations

15. Revision history

Table 11. Abbreviations

Acronym Description

CMOS Complementary Metal Oxide Semiconductor

DUT Device Under Test

ESD ElectroStatic Discharge

HBM Human Body Model

MM Machine Model

TTL Transistor-Transistor Logic

Table 12. Revision history

Document ID Release date Data sheet status Change notice Supersedes

74LVC1 G08 v.8 20101019 Product data sheet - 74LVC1G08 v.7

Modifications: •Added type number 74LVC1G08GN (SOT1115 / XSON6 package).

•Added type number 74LVC1G08GS (SOT1202 / XSON6 package).

74LVC1 G08 v.7 20070717 Product data sheet - 74LVC1G08 v.6

74LVC1 G08 v.6 20060619 Product data sheet - 74LVC1G08 v.5

74LVC1G08 v.5 20040915 Product specification - 74LVC1G08 v.4

74LVC1G08 v.4 20021002 Product specification - 74LVC1G08 v.3

74LVC1G08 v.3 20020517 Product specification - 74LVC1G08 v.2

74LVC1G08 v.2 20010406 Product specification - 74LVC1G08 v.1

74LVC1G08 v.1 20001121 Product specification - -

Product Specification Rev. 8 — 19 October 2010 15 of 17

NXP Semiconductors 74LVC1G08

Single 2-input AND gate

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[3] The product status of de vice(s) descr ibed in th is document m ay have cha nged since thi s document w as publish ed and may di ffe r in case of multiple devices. The latest product status

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Product Specification Rev. 8 — 19 October 2010 16 of 17

NXP Semiconductors 74LVC1G08

Single 2-input AND gate

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NXP Semiconductors 74LVC1G08

Single 2-input AND gate

For more information, please visit: http://www.nxp.com

For sales office addresses, please send an email to: salesaddresses@nxp.com

Date of release: 19 October 2010

Document identifier: 74LVC1G08

Please be aware that important notices concerning this document and the product(s)

described herein, have been included in section ‘Legal information’.

18. Contents

1 General description. . . . . . . . . . . . . . . . . . . . . . 1

2 Features and benefits . . . . . . . . . . . . . . . . . . . . 1

3 Ordering information. . . . . . . . . . . . . . . . . . . . . 2

4 Marking. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2

5 Functional diagram . . . . . . . . . . . . . . . . . . . . . . 2

6 Pinning information. . . . . . . . . . . . . . . . . . . . . . 3

6.1 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3

6.2 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 3

7 Functional description . . . . . . . . . . . . . . . . . . . 3

8 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 4

9 Recommended operating conditions. . . . . . . . 4

10 Static characteristics. . . . . . . . . . . . . . . . . . . . . 5

11 Dynamic characteristics . . . . . . . . . . . . . . . . . . 6

12 AC waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . 6

13 Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 8

14 Abbreviations. . . . . . . . . . . . . . . . . . . . . . . . . . 14

15 Revision history. . . . . . . . . . . . . . . . . . . . . . . . 14

16 Legal information. . . . . . . . . . . . . . . . . . . . . . . 15

16.1 Data sheet status . . . . . . . . . . . . . . . . . . . . . . 15

16.2 Definitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . 15

16.3 Disclaimers. . . . . . . . . . . . . . . . . . . . . . . . . . . 15

16.4 Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 16

17 Contact information. . . . . . . . . . . . . . . . . . . . . 16

18 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17

Single 2-input AND gate

Products / Packages

Type number Orderable part number Ordering code (12NC) Product status Package Packing Marking ECCN

74LVC1G08GF 74LVC1G08GF,132 9352 824 07132 Volume production

SOT891

(XSON6)

Tape reel smd Standard Marking

74LVC1G08GM 74LVC1G08GM,115 9352 771 88115 Volume production

SOT886

(XSON6)

Tape reel smd Standard Marking

74LVC1G08GM 74LVC1G08GM,132 9352 771 88132 Volume production

SOT886

(XSON6)

Tape reel smd Standard Marking

74LVC1G08GN 74LVC1G08GN,132 9352 917 74132 Volume production

SOT1115

(XSON6)

Standard Marking

74LVC1G08GS 74LVC1G08GS,132 9352 928 97132 Volume production

SOT1202

(XSON6)

Standard Marking

74LVC1G08GV 74LVC1G08GV,125 9352 720 11125 Volume production

SOT753

(TSOP5)

Tape reel smd, Reverse Standard Marking

74LVC1G08GW 74LVC1G08GW,125 9352 683 80125 Volume production

SOT353-1

(TSSOP5)

Reel Pack, Reverse, Reverse Standard Marking

The variants in the table below are discontinued. See the table Discontinuation information at the bottom of this page for more information.

Type number Orderable part number Ordering code (12NC) Product status Package Packing Marking ECCN

74LVC1G08GM 74LVC1G08GM,125 9352 771 88125

Withdrawn

Replacement product

SOT886

(XSON6)

Reel Pack, Reverse, Reverse Standard Marking

74LVC1G08GW 74LVC1G08GW,165 9352 683 80165

Discontinued

Replacement product

SOT353-1

(TSSOP5)

Reel Pack, SMD, Large, Reverse, Reverse Standard Marking

Discontinuation information

Type number Ordering code (12NC) Last-time buy date Last-time delivery date Replacement product DN Notice Status Comments

74LVC1G08GM 935277188125 DN

74LVC1G08GW 935268380165 DN

English

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