LTL-816GE-004A - Lite-On Electronics, Inc.

LITE-ON TECHNOLOGY CORPORATION

Property of Lite-On Only

Features

* High luminous intensity output

* Low power consumption

* 3.2mm dome package with 5.0mm leads pitch

* Available on tape without lead forming

* Low overall height available for a slim unit design

* Reliable and rugged

Package Dimensions

Part No. Lens Source Color

LTL-816GE-004A Green Transparent Green

Notes:

1. All dimensions are in millimeters (inches).

2. Tolerance is ±0.25mm(.010") unless otherwise noted.

3. Protruded resin under flange is 1.0mm(.04") max.

4. Lead spacing is measured where the leads emerge from the package.

5. Specifications are subject to change without notice.

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Absolute Maximum Ratings at TA=25℃

Parameter Maximum Rating Unit

Power Dissipation 100 mW

Peak Forward Current

(1/10 Duty Cycle, 0.1ms Pulse Width) 120 mA

DC Forward Current 30 mA

Derating Linear From 50℃ 0.4 mA/℃

Reverse Voltage 5 V

Operating Temperature Range -55 to + ℃100℃

Storage Temperature Range -55 to + 100℃℃

Lead Soldering Temperature

[1.6mm(.063") From Body] 260 for 5 Seconds℃

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LITE-ON TECHNOLOGY CORPORATION

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Electrical / Optical Characteristics at TA=25℃

Parameter Symbol Min. Typ. Max. Unit Test Condition

BIN1 40 --

BIN2 29 40

BIN3 19 29

BIN4 12.6 19

Luminous Intensity IV

BIN5 8.7 12.6

mcd IF = 10mA

Note 1,5

Viewing Angle 2θ1/2 35 deg Note 2 (Fig.5)

Peak Emission Wavelength λP 563 568 573 nm

Measurement

@Peak (Fig.1)

Dominant Wavelength λd 568 569 578 nm Note 4

Spectral Line Half-Width ∆λ 30 nm

Forward Voltage VF 2.1 2.6 V IF = 20mA

Reverse Current IR 10 µA VR = 5V

Capacitance C 35 pF VF = 0 , f = 1MHz

NOTE: 1. Luminous intensity is measured with a light sensor and filter combination that approximates the

CIE eye-response curve.

2. θ1/2 is the off-axis angle at which the luminous intensity is half the axial luminous intensity.

3. Iv classification code is marked on each packing bag.

4. The dominant wavelength, λd is derived from the CIE chromaticity diagram and represents the

single wavelength which defines the color of the device.

5. The Iv guarantee should be added ±15%.

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LITE-ON TECHNOLOGY CORPORATION

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Typical Electrical / Optical Characteristics Curves

(25 Ambient Temperature Unless Otherwise Noted)℃

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LITE-ON TECHNOLOGY CORPORATION

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Features

* Compatible with radial lead automatic insertion equipment.

* Most radial lead plastic lead lamps available packaged on tape and folding.

* 5mm (0.197") straight lead spacing available.

* Folding packaging simplifies handling and testing.

Reel packaging is available by removing suffix “A” on option.

Package Dimensions

Specification

Item Symbol Minimum Maximum

mm inch mm inch

Tape Feed Hole Diameter D 3.8 0.149 4.2 0.165

Component Lead Pitch F 4.8 0.188 5.8 0.228

Front to Rear Deflection H△ -- -- 2.0 0.078

Feed Hole to Bottom of Component H1 17.5 0.688 18.5 0.728

Feed Hole to Overall Component Height H2 22.7 0.893 24.3 0.957

Lead Length After Component Height L W0 11.0 0.433

Feed Hole Pitch P 12.4 0.488 13.0 0.511

Lead Location P1 3.15 0.124 4.55 0.179

Center of Component Location P2 5.05 0.198 7.65 0.301

Total Tape Thickness T -- -- 0.90 0.035

Feed Hole Location W0 8.5 0.334 9.75 0.384

Adhesive Tape Width W1 14.5 0.571 15.5 0.610

Adhesive Tape Position W2 0 0 3.0 0.118

Tape Width W3 17.5 0.689 19.0 0.748

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LITE-ON TECHNOLOGY CORPORATION

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Packing Spec

2000 pcs per inner carton

10 Inner cartons per outer carton

total 20000 pcs per outer carton

In every shipping lot, only the last pack will be non-full packing

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Cross Section & Material List

No. Items Material

1 Lead Frame (Taiwan) Iron /W Copper + Silver Plating / Solder Dip

2 Die Bond (Japan) Ag Paste

3 LED Chip (Taiwan) GaP on GaP

4 Bonding Wire (Singapore) Au Wire

5 Resin (Taiwan) Epoxy Resin

6 Product Weight About 0.15g

7 Solder Plating Ratio Pure Tin Soldering

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CAUTIONS

1. Application

The LEDs described here are intended to be used for ordinary electronic equipment (such as office equipment,

communication equipment and household applications).Consult Liteon’s Sales in advance for information on

applications in which exceptional reliability is required, particularly when the failure or malfunction of the

LEDs may directly jeopardize life or health (such as in aviation, transportation, traffic control equipment,

medical and life support systems and safety devices).

2. Storage

The storage ambient for the LEDs should not exceed 30°C temperature or 70% relative humidity.

It is recommended that LEDs out of their original packaging are used within three months.

For extended storage out of their original packaging, it is recommended that the LEDs be stored in

a sealed container with appropriate desiccant or in desiccators with nitrogen ambient.

3. Cleaning

Use alcohol-based cleaning solvents such as isopropyl alcohol to clean the LEDs if necessary.

4. Lead Forming & Assembly

During lead forming, the leads should be bent at a point at least 3mm from the base of LED lens.

Do not use the base of the lead frame as a fulcrum during forming.

Lead forming must be done before soldering, at normal temperature.

During assembly on PCB, use minimum clinch force possible to avoid excessive mechanical stress.

5. Soldering

When soldering, leave a minimum of 2mm clearance from the base of the lens to the soldering point.

Dipping the lens into the solder must be avoided.

Do not apply any external stress to the lead frame during soldering while the LED is at high temperature.

Recommended soldering conditions :

Soldering iron Wave soldering

Temperature

Soldering time

300°C Max.

3 sec. Max.

(one time only)

Pre-heat

Pre-heat time

Solder wave

Soldering time

100°C Max.

60 sec. Max.

260°C Max.

10 sec. Max.

Note: Excessive soldering temperature and/or time might result in deformation of the LED lens or catastrophic

failure of the LED. IR reflow is not suitable process for through hole type LED lamp product.

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6. Drive Method

An LED is a current-operated device. In order to ensure intensity uniformity on multiple LEDs

connected in parallel in an application, it is recommended that a current limiting resistor be

incorporated in the drive circuit, in series with each LED as shown in Circuit A below.

Circuit model A Circuit model B

LED

(A) Recommended circuit

(B) The brightness of each LED might appear different due to the differences in the I-V characteristics

of those LEDs

7. ESD (Electrostatic Discharge)

Static Electricity or power surge will damage the LED.

Suggestions to prevent ESD damage:

 Use a conductive wrist band or anti- electrostatic glove when handling these LEDs

 All devices, equipment, and machinery must be properly grounded

 Work tables, storage racks, etc. should be properly grounded

 Use ion blower to neutralize the static charge which might have built up on surface of the LEDs

plastic lens as a result of friction between LEDs during storage and handing

.

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Suggested checking list :

Training and Certification

1. Everyone working in a static-safe area is ESD-certified?

2. Training records kept and re-certification dates monitored?

Static-Safe Workstation & Work Areas

1. Static-safe workstation or work-areas have ESD signs?

2. All surfaces and objects at all static-safe workstation and within 1 ft measure less than 100V?

3. All ionizer activated, positioned towards the units?

4. Each work surface mats grounding is good?

Personnel Grounding

1. Every person (including visitors) handling ESD sensitive (ESDS) items wear wrist strap, heel strap or

conductive shoes with conductive flooring?

2. If conductive footwear used, conductive flooring also present where operator stand or walk?

3. Garments, hairs or anything closer than 1 ft to ESD items measure less than 100V*?

4. Every wrist strap or heel strap/conductive shoes checked daily and result recorded for all DLs?

5. All wrist strap or heel strap checkers calibration up to date?

Note: *50V for Blue LED.

Device Handling

1. Every ESDS items identified by EIA-471 labels on item or packaging?

2. All ESDS items completely inside properly closed static-shielding containers when not at static-safe

workstation?

3. No static charge generators (e.g. plastics) inside shielding containers with ESDS items?

4. All flexible conductive and dissipative package materials inspected before reuse or recycle?

Others

1. Audit result reported to entity ESD control coordinator?

2. Corrective action from previous audits completed?

3. Are audit records complete and on file?

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8. Reliability Test

Classification Test Item Test Condition Reference Standard

Operation Life

Ta= Under Room Temperature As

Per Data Sheet Maximum Rating

*Test Time= 1000HRS (-24HRS,+72HRS)

MIL-STD-750D:1026 (1995)

MIL-STD-883D:1005 (1991)

JIS C 7021:B-1 (1982)

High Temperature

High Humidity

Storage

Ta= 65±5℃

RH= 90 ～ 95%

Test Time= 240HRS±2HRS

MIL-STD-202F: 103B(1980)

JIS C 7021 : B-11(1982)

High Temperature

High Humidity

Reverse BIAS

Ta= 65±5℃

RH= 90 ～ 95%

VR=5V

Test Time = 500HRS (-24HRS, +48HRS)

JIS C 7021 : B-11(1982)

High Temperature

Storage

Ta= 105±5℃

*Test Time= 1000HRS (-24HRS,+72HRS)

MIL-STD-883D:1008 (1991)

JIS C 7021:B-10 (1982)

Endurance

Test

Low Temperature

Storage

Ta= -55±5℃

*Test Time=1000HRS (-24HRS,+72HRS) JIS C 7021:B-12 (1982)

Temperature

Cycling

105 ℃～ 25 ℃～ -55 ℃～ 25℃

30mins 5mins 30mins 5mins

10 Cycles

MIL-STD-202F:107D (1980)

MIL-STD-750D:1051(1995)

MIL-STD-883D:1010 (1991)

JIS C 7021: A-4(1982)

Thermal

Shock

105 ± 5 ℃～ -55 ± 5℃℃

10mins 10mins

10 Cycles

MIL-STD-202F:107D(1980)

MIL-STD-750D:1051(1995)

MIL-STD-883D:1011 (1991)

Solder

Resistance

T.sol = 260 ± 5℃

Dwell Time= 10 ± 1secs

MIL-STD-202F:210A(1980)

MIL-STD-750D:2031(1995)

JIS C 7021: A-1(1982)

Environmental

Test

Solderability T. sol = 230 ± 5℃

Dwell Time= 5 ± 1secs

MIL-STD-202F:208D(1980)

MIL-STD-750D:2026(1995)

MIL-STD-883D:2003(1991)

JIS C 7021: A-2(1982)

9. Others

The appearance and specifications of the product may be modified for improvement, without prior notice.

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