Agilent MGA-61563/62563 MMIC Low Noise Amplifier Reliability Data Sheet Description MGA-6x563 is a high performance GaAs MMIC low noise amplifier fabricated with Agilent Technologies EPHEMT (Enhancement mode - Pseudomorphic High Electron Mobility Transistor) process. Agilent E-pHemt based solutions achieve high efficiency and excellent performance over both the entire interested power range and a wide temperature range. The reliability of the device was tested at various stress intervals and the data is shown below. Table 1. Life Tests Demonstrated Performance Test Name Stress Test Condition High Temperature Tch = 150C Operating Life DC Bias Total Units Tested 72 Total Device Hours 72,000 No. of Failed Units 0 A Failure criteria OF 20% parameter drift, 0.3dBm change in OIP3 and 0.5dB change in Noise Figure/Associated Gain was used. Reliability Prediction Model An exponential cumulative failure function (constant failure rate) model was used to predict the failure rate and mean time to failure (MTTF) at various temperatures as shown in Table 2. The wear-out mechanism is therefore not considered. The Arrhenius temperature de-rating equation is used. Agilent assumes no failure mechanism changes between stresses and the use conditions. Bias and temperature condition are alterable stresses and must be considered with the thermal resistance of the devices when determining the stress condition. The failure rate will have a direct relationship to the bias life stress. The E-PHEMT die process was tested to determine the activation energy of 2.2eV. Confidence intervals are based upon the chi-squared prediction method associated with exponential distribution. Table 2. Estimates for Various Channel Temperatures are as follows: Channel Point Typical 90% Point Typical Temp. (C) Performance Confidence Performance MTTF hours MTTF hours FIT 150 7.20 X 104 3.23 X 104 6,944 125 3.19 X 106 1.43 X 106 313 8 8 100 2.35 X 10 1.05 X 10 4.3 85 4.14 X 109 1.89 X 109 0.2 90% Confidence FIT 30,972 699 10 0.5 Point typical MTTF is simply the total device hours divided by the number of failures. However, in cases for which no failures are observed, the point estimate is calculated under the assumption that one unit failed. Revision Date: 4/9/2003 Revision Number: 1 Table 3. Product Qualification - Operating Life Test & Environmental Stress Test Results Units Stress Conditions Duration Tested Wet High Temperature 85C/85% RH, Vd = 3V 1000 hours 72 Operating Life (WHTOL) Temperature Cycle -65C/150C, 10 minutes dwell 500 cycles 72 Thermal Shock -65C/150C, 5 minutes dwell 500 cycles 72 Autoclave 121C/100%RH, 15 psig 96 hours 72 Table 4. Thermal Resistance Information Stress Product MGA-61653 Thermal Resistance MGA-62653 Units Failed 0 0 0 0 Theta Jc 55.66C/W 96.56C/W Table 5. Electrostatic Discharge (ESD) Classification Test Results ESD Test Reference MGA-61653 Human Body Model EIA/JESD22-A114-B 200V Machine Model EIA/JESD22-A115-A 40V Results MGA-62653 250V 50V Class 0 is HBM ESD voltage level <250V, Class 1A is voltage level between 250 and 500V Class A is MM ESD voltage level <200V, Class B is voltage level between 200 and 400V, Class C is voltage level to >400V. Notes: ESD sensitivity levels for Human Body Model and Machine Model necessitate the following handling precautions: 1. Ensure Faraday cage or conductive shield bag is used during transportation processes. 2. If the static charge at SMT assembly station is above device sensitivity level, place an ionizer near to the device for charge neutralization purposes. 3. Personal grounding must be worn at all time when handling the devices. Moisture Sensitivity Classification: Class 1 Preconditioning per JESD22-A113-B class 1 was performed on all devices prior to reliability testing except for ESD classification test. Flammability Rating: UL Class 94V-0 www.semiconductor.agilent.com Data subject to change. Copyright (c) 2003 Agilent Technologies, Inc. Revision Date: 4/9/2003 Revision Number: 1