Features
• High brightness
• Small size
• Industrial standard footprint
• Diffused optics
• Top emitting or right angle emitting
• Compatible with IR soldering
• Compatible for use with light piping
• Available in 8 mm tape on 7" diameter reel
• Reel sealed in zip locked moisture barrier bags
Applications
• LCD backlighting
• Push button backlighting
• Front panel indicator
• Symbol indicator
• Microdisplays
• Small message panel signage
Description
These small chip-type LEDs utilize high efficient and high
brightness InGaN material to deliver competitively priced
high performance blue and green. These 520 nm green
and 470 nm blue are unique hues which provide color
differentiation to a product.
These ChipLEDs come in either top emitting packages
(HSMx-C130, C150, C170, C177, C190, C191, C197), in
side emitting packages (HSMx-C110, C120) or in a reverse
mount package (C265). The side emitting package is
especially suitable for LCD backlighting application. The
top emitting packages, with their wide viewing angle,
are suitable for direct backlighting application or being
used with light pipes. In order to facilitate pick and place
operation, these ChipLEDs are shipped in tape and reel
with 4000 units per reel for HSMx-C120, C130, C170, C177,
C190, C191 and C197 packages, and 3000 units per reel
for HSMx-C110, C150 and C265 packages. All packages
are compatible with IR soldering and binned by both
color and intensity.
HSMQ-C110, HSMQ-C120, HSMQ-C150, HSMQ-C170, HSMQ-C177,
HSMQ-C190, HSMQ-C191, HSMQ-C197, HSMQ-C265,
HSMR-C110, HSMR-C120, HSMR-C130, HSMR-C150, HSMR-C170,
HSMR-C177, HSMR-C190, HSMR-C191, HSMR-C197, HSMR-C265
HSMQ-C1xx and HSMR-C1xx
High Performance Chip LED
Data Sheet
CAUTION: HSMQ-Cxxx and HSMR-Cxxx LEDs are Class 1A ESD sensitive per JESD22-A114C.01. Please observe appropriate
precautions during handling and processing. Refer to Avago Technologies Application Note AN-1142 for additional details.
2
Package Dimensions
NOTES:
1. ALL DIMENSIONS IN MILLIMETERS (INCHES).
2. TOLERANCE IS ± 0.1 mm (± 0.004 IN.) UNLESS OTHERWISE SPECIFIED.
3.2 (0.126 )
0.5 (0.020)
0.8 (0.031)
POLARITY
CATHODE
LINE
1.5 (0.059)
LED DIE
CLEAR
EPOXY
PC BOARD
SOLDERING
TERMINAL
1.0 (0.039)
1.0 (0.039)
2.6 (0.102 )
1.6 (0.063 )
CATHODE LINE
3.2 (0.126 )
HSMx-C110
2.0 (0.079 )
0.3 (0.012)
0.4 ± 0.15
(0.016 ± 0.006)
0.3 (0.012)
POLARITY
CATHODE
MARK
0.8 (0.031)
0.4 ± 0.15
(0.016 ± 0.006)
1.4
(0.055)
DIFFUSED
EPOXY
PC BOARD
SOLDERING
TERMINAL
1.25 (0.049)
HSMx-C170
CATHODE LINE
HSMx-C190
1.6
(0.063 )
0.3 (0.012)
0.3 ± 0.15
(0.012 ± 0.006)
0.3 (0.012)
POLARITY
CATHODE
MARK
0.8 (0.031)
0.3 ± 0.15
(0.012 ± 0.006)
1.0
(0.039)
DIFFUSED EPOXY
PC BOARD
SOLDERING
TERMINAL
0.8 (0.031)
0.7 (0.028) MIN.
CATHODE LINE
HSMx-C191
1.6
(0.063 )
0.3 (0.012)
0.3 ± 0.15
(0.012 ± 0.006)
0.3 (0.012)
POLARITY
CATHODE
MARK
0.6 (0.023)
0.3 ± 0.15
(0.012 ± 0.006)
1.0
(0.039)
DIFFUSED EPOXY
PC BOARD
SOLDERING
TERMINAL
0.8 (0.031)
CATHODE LINE
0.7 (0.028) MIN.
3
Package Dimensions, continued
NOTES:
1. ALL DIMENSIONS IN MILLIMETERS (INCHES).
2. TOLERANCE IS ± 0.1 mm (± 0.004 IN.) UNLESS OTHERWISE SPECIFIED.
1.6 (0.063)
0.5 (0.020)
POLARITY
CATHODE MARK
1.0 (0.039)
3 – 0.3 (0.012)
1.2 (0.047)
0.3 (0.012)
LED DIE
CLEAR EPOXY
PC BOARD
SOLDERING
TERMINAL
0.6 (0.024)
CATHODE LINE
HSMx-C120
HSMx-C150
3.2 (0.126 )
0.5 (0.020)
0.50 ± 0.20
(0.020 ± 0.008)
0.6 (0.024)
POLARITY
CATHODE
MARK
1.1 (0.043)
0.50 ± 0.20
(0.020 ± 0.008)
2.0 (0.079)
DIFFUSED
EPOXY
PC BOARD
SOLDERING
TERMINAL
1.6 (0.063)
CATHODE LINE
CATHODE MARK
1.25
(0.049)
2.00 (0.079)
DIFFUSED EPOXY
PC BOARD
0.40 (0.016)
0.16 (0.006)
POLARITY
0.40 ± 0.15
(0.016 ± 0.006)
SOLDERING
TERMINAL
1.10 (0.043) MIN.
0.40 ± 0.15
(0.016 ± 0.006)
CATHODE LINE
HSMx-C177
0.80
(0.031) 1.60
(0.063) POLARITY
0.70 (0.028) MIN.
CATHODE LINE
0.30 ± 0.15
(0.012 ± 0.006)
DIFFUSED EPOXY
PC BOARD
0.40 (0.016)
0.16 (0.006)
SOLDERING
TERMINAL
CATHODE MARK
HSMx-C197
4
Absolute Maximum Ratings at TA = 25˚C
HSMQ-Cxxx
Parameter HSMR-Cxxx Units
DC Forward Current [1] 20 mA
Power Dissipation 78 mW
Reverse Voltage (IR = 100 µA) 5 V
LED Junction Temperature 95 ˚C
Operating Temperature Range –40 to +85 ˚C
Storage Temperature Range –40 to +85 ˚C
Soldering Temperature See reflow soldering profile (Figures 11 & 12)
Device Selection Guide
Package Dimension (mm) [1], [2] InGaN Green InGaN Blue Package Description
3.2(L) x 1.5(W) x 1.0(H) HSMQ-C110 HSMR-C110 Untinted, Non-diffused
1.6(L) x 1.0(W) x 0.6(H) HSMQ-C120 HSMR-C120 Untinted, Non-diffused
1.6(L) x 0.8(W) x 0.35(H) – HSMR-C130 Untinted, Diffused
3.2(L) x 1.6(W) x 1.1(H) HSMQ-C150 HSMR-C150 Untinted, Diffused
2.0(L) x 1.25(W) x 0.8(H) HSMQ-C170 HSMR-C170 Untinted, Diffused
2.0(L) x 1.25(W) x 0.4(H) HSMQ-C177 HSMR-C177 Untinted, Diffused
1.6(L) x 0.8(W) x 0.8(H) HSMQ-C190 HSMR-C190 Untinted, Diffused
1.6(L) x 0.8(W) x 0.6(H) HSMQ-C191 HSMR-C191 Untinted, Diffused
1.6(L) x 0.8(W) x 0.4(H) HSMQ-C197 HSMR-C197 Untinted, Diffused
3.4(L) x 1.25(W) x 1.1(H) HSMQ-C265 HSMR-C265 Untinted, Non-diffused
Notes: 1. Dimensions in mm. 2. Tolerance ± 0.1 mm unless otherwise noted.
Note: 1. Derate linearly as shown in Figure 4.
NOTES:
1. ALL DIMENSIONS IN MILLIMETERS (INCHES).
2. TOLERANCE IS ± 0.1 mm (± 0.004 IN.) UNLESS OTHERWISE SPECIFIED.
Package Dimensions, continued
1.6
(0.063)
0.12 (0.005)
0.3 ± 0.15
(0.012 ± 0.006)
0.23 (0.009)
CATHODE
MARK
0.35 (0.014)
0.3 ± 0.15
(0.012 ± 0.006)
1.15
(0.045)
LED DIE
DIFFUSED EPOXY
PCB BOARD
0.8 (0.031)
CATHODE LINE
0.7 (0.028) MIN.
POLARITY
(0.625)
SOLDERING
TERMINAL
HSMx-C130
5
Optical Characteristics at TA = 25˚C
Luminous Color, Viewing Luminous
Intensity Peak Dominant Angle Efficacy
IV (mcd) Wavelength Wavelength 2 θ1/2 ηV
@ 20 mA[1] λpeak (nm) λd[2] (nm) Degrees[3] (lm/w)
Part Number Color Min. Typ. Typ. Typ. Typ. Typ.
HSMQ-C110 Green 45 150 520 527 130 500
HSMQ-C120 Green 45 145 520 527 155 500
HSMQ-C150/170/190/191 Green 45 145 520 527 140 500
HSMQ-C177/197 Green 45 145 520 527 130 500
HSMQ-C265 Green 45 140 520 527 150 500
HSMR-C110 Blue 18 60 469 473 130 88
HSMR-C120 Blue 18 55 469 473 155 88
HSMR-C130 Blue 18 55 469 473 145 88
HSMR-C150/170/190/191 Blue 18 55 469 473 140 88
HSMR-C177/197 Blue 18 55 469 473 130 88
HSMR-C265 Blue 18 45 469 473 150 88
Notes:
1. The luminous intensity, IV, is measured at the peak of the spatial radiation pattern which may not be aligned with the mechanical axis of the lamp
package.
2. The dominant wavelength, λd, is derived from the CIE Chromaticity Diagram and represents the perceived color of the device.
3. θ1/2 is the off-axis angle where the luminous intensity is 1/2 the peak intensity.
Electrical Characteristics at TA = 25˚C
Forward Voltage Reverse Breakdown Capacitance C Thermal
VF (Volts) VR (Volts) (pF), VF = 0, Resistance
@ IF = 20 mA @ IR = 100 µA f = 1 MHz RθJ–PIN (˚C/W)
Part Number Typ. Max. Min. Typ. Typ.
HSMQ-C110/C150 3.4 3.9 5 140 450
HSMR-C110/C150 3.4 3.9 5 140 450
HSMQ-C120 3.4 3.9 5 100 450
HSMR-C120/C130 3.4 3.9 5 100 450
HSMQ-C170/C190/C191 3.4 3.9 5 110 300
HSMR-C170/C190/C191 3.4 3.9 5 110 300
HSMQ-C177/C197 3.4 3.9 5 110 350
HSMR-C177/C197 3.4 3.9 5 110 350
HSMQ-C265 3.4 3.9 5 65 300
HSMR-C265 3.4 3.9 5 65 300
VF Tolerance: ±0.1 V
Blue Color Bins[1]
Dom. Wavelength (nm)
Bin ID Min. Max.
A 460.0 465.0
B 465.0 470.0
C 470.0 475.0
D 475.0 480.0
Note:
1. Bin categories are established for classification of products. Products may not be available in all categories. Please contact your Avago
representative for information on currently available bins.
Color Bin Limits[1]
InGaN Green Color Bins[1]
Dom. Wavelength (nm)
Bin ID Min. Max.
A 515.0 520.0
B 520.0 525.0
C 525.0 530.0
D 530.0 535.0
Tolerance: ±1 nm Tolerance: ±1 nm
6
Figure 1. Relative intensity vs. wavelength.
Light Intensity (Iv) Bin Limits[1]
Intensity (mcd) Intensity (mcd)
Bin ID Min. Max. Bin ID Min. Max.
A 0.11 0.18 N 28.50 45.00
B 0.18 0.29 P 45.00 71.50
C 0.29 0.45 Q 71.50 112.50
D 0.45 0.72 R 112.50 180.00
E 0.72 1.10 S 180.00 285.00
F 1.10 1.80 T 285.00 450.00
G 1.80 2.80 U 450.00 715.00
H 2.80 4.50 V 715.00 1125.00
J 4.50 7.20 W 1125.00 1800.00
K 7.20 11.20 X 1800.00 2850.00
L 11.20 18.00 Y 2850.00 4500.00
M 18.00 28.50
Tolerance: ±15%
Notes:
1. Bin categories are established for classification of products. Products may not be available in
all categories. Please contact your Avago representative for information on currently available
bins.
2. The Iv binning specification set-up is for lowest allowable Iv binning only. There are no upper
Iv bin limits.
Figure 2. Forward current vs. forward voltage. Figure 3. Luminous intensity vs. forward
current.
Figure 4. Maximum forward current vs.
ambient temperature.
100
10
1
0.12.0 2.5 3.0 3.5 4.0
VF – FORWARD VOLTAGE – V
IF – FORWARD CURRENT – mA
GREEN
HSMx-C1xx fig 2
BLUE
0 5 15
I
F
– FORWARD CURRENT – mA
0
0.4
1.0
LUMINOUS INTENSITY
(NORMALIZED AT 20 mA)
HSMx-C1xx fig 3
20
0.6
0.2
0.8
10 25
1.2
GREEN
BLUE
WAVELENGTH – nm
HSMx-C1xx fig 1
RELATIVE INTENSITY – %
100
50
0600 700
BLUE GREEN
500400
90
80
70
60
40
30
20
10
0
020 60 80 90
5
IF MAX – MAXIMUM FORWARD CURRENT – mA
TA – AMBIENT TEMPERATURE – °C
40
HSMx-C1xx fig 4
15
30
10
20
RθJ-A = 600°C/W
RθJ-A = 500°C/W
25
10 30 50 70
7
Figure 5. Relative intensity vs. angle for HSMx-C110.
Figure 6. Relative intensity vs. angle for HSMx-C120.
RELATIVE INTENSITY – %
100
0
ANGLE
80
60
20
40
-70 -50 -30 30 50 70 90-90 -10 10
RELATIVE INTENSITY – %
100
0
ANGLE
80
60
20
40
-70 -50 -30 30 50 70 90-90 -10 10
100
90
80
70
60
50
40
30
20
10
0
RELATIVE INTENSITY
-90 -80 -70 -60 -50 -40 -30 -20 -10 0 10 20 30 40 50 60 70 80 90
ANGLE
100
90
80
70
60
50
40
30
20
10
0
RELATIVE INTENSITY
-90 -80 -70 -60 -50 -40 -30 -20 -10 0 10 20 30 40 50 60 70 80 90
ANGLE
8
Figure 9. Relative intensity vs. angle for HSMx-C170, C190, C191, and C150.
Figure 7. Relative intensity vs. angle for HSMx-C177 and C197.
Figure 8. Relative intensity vs. angle for HSMx-C130.
Figure 10. Relative intensity vs. angle for HSMx-C265.
RELATIVE INTENSITY – %
100
0
ANGLE
80
60
50
70
20
10
30
40
90
-70 -50 -30 0 20 30 50 70 90-90 -20-80 -60 -40 -10 10 40 60 80
RELATIVE INTENSITY – %
100
0
ANGLE
80
60
50
70
20
10
30
40
90
-70 -50 -30 0 20 30 50 70 90-90 -20-80 -60 -40 -10 10 40 60 80
RELATIVE INTENSITY – %
100
0
ANGLE
80
60
50
70
20
10
30
40
90
-70 -50 -30 0 20 30 50 70 90-90 -20-80 -60 -40 -10 10 40 60 80
RELATIVE INTENSITY – %
100
0
ANGLE
80
60
50
70
20
10
30
40
90
-70 -50 -30 0 20 30 50 70 90-90 -20-80 -60 -40 -10 10 40 60 80
9
Figure 12. Recommended Pb-free reflow soldering profile.
Figure 13. Recommended soldering pattern for HSMx-C110. Figure 14. Recommended soldering pattern for HSMx-C170/177.
5.0 (0.200)
1.0 (0.039)
1.5
(0.059)
1.5
(0.059)
2.0
(0.079)
0.9 (0.035)
0.2 (0.008)
0.9 (0.035)
CENTERING
BOARD
NOTE:
1. ALL DIMENSIONS IN MILLIMETERS (INCHES).
1.2 (0.047)
1.2
(0.047)
0.9
(0.035)
1.2
(0.047)
Figure 16. Recommended soldering pattern for HSMx-C150.
1.5 (0.059)
1.5
(0.059)
1.5
(0.059)
2.0
(0.079)
Figure 15. Recommended soldering pattern for HSMx-
C130/190/191/197.
0.8 (0.031)
0.8
(0.031) 0.7
(0.028)
0.8
(0.031)
Figure 17. Recommended soldering pattern for HSMx-C120. Figure 18. Recommended soldering pattern for HSMx-C265.
0.7 (0.028)
0.8
(0.031)
0.8
(0.031)
1.2
(0.047)
0.4 (0.016)
0.15 (0.006)
0.4 (0.016)
CENTERING
BOARD
1.25 (0.049)
1.4
(0.055)
2.3
(0.091)
1.4
(0.055)
2.2 (0.087) DIA. PCB HOLE
Figure 11. Recommended reflow soldering profile.
230°C MAX.
10 SEC. MAX.
4°C/SEC.
MAX.
OVER 2 MIN.
TIME
TEMPERATURE
4°C/SEC. MAX.
140-160°C
3°C/SEC. MAX.
217 C
200 C
60 - 120 SEC.
6 C/SEC. MAX.
3 C/SEC. MAX.
3 C/SEC. MAX.
150 C
255 - 260 C
60 SEC. MAX.
10 SEC. MAX.
TIME
TEMPERATURE
10
Figure 19. Reeling orientation.
Figure 20. Reel dimensions.
CATHODE SIDE
USER FEED DIRECTION
PRINTED LABEL
NOTE:
1. ALL DIMENSIONS IN MILLIMETERS (INCHES).
10.50 ± 1.0 (0.413 ± 0.039)
59.60 ± 1.00
(2.346 ± 0.039)
Ø 20.20 MIN.
(Ø 0.795 MIN.)
6
PS
178.40 ± 1.00
(7.024 ± 0.039)
3.0 ± 0.5
(0.118 ± 0.020)
4.0 ± 0.5
(0.157 ± 0.020)
5.0 ± 0.5
(0.197 ± 0.020)
Ø 13.1 ± 0.5
(Ø 0.516 ± 0.020)
8.0 ± 1.0 (0.315 ± 0.039)
11
Figure 21. Tape dimensions.
NOTE:
1. ALL DIMENSIONS IN MILLIMETERS (INCHES).
8.00 ± 0.30
(0.315 ± 0.012)
USER FEED
DIRECTION
DIM. A
(SEE TABLE 1)
3.50 ± 0.05
(0.138 ± 0.002)
1.75 (0.069)
DIM. C
(SEE TABLE 1)
0.20 ± 0.05
(0.008 ± 0.002)
CARRIER TAPE
COVER TAPE
DIM. B
(SEE TABLE 1)
4.00 (0.157)
2.00 ± 0.05
(0.079 ± 0.002)
4.00 (0.157)
1.50 (0.059)
HSMx-C265 SERIES 3.70 (0.146) 1.45 (0.057) 1.30 (0.051)
TABLE 1
DIMENSIONS IN MILLIMETERS (INCHES)
CATHODE
DIM. A
± 0.10 (0.004)
DIM. B
± 0.10 (0.004)PART NUMBER
DIM. C
± 0.10 (0.004)
8.00 ± 0.30
(0.315 ± 0.012)
USER FEED
DIRECTION
DIM. A
(SEE TABLE 1)
3.50 ± 0.05
(0.138 ± 0.002)
1.75 (0.069)
DIM. C
(SEE TABLE 1)
0.20 ± 0.05
(0.008 ± 0.002)
CARRIER TAPE
COVER TAPE
DIM. B
(SEE TABLE 1)
4.00 (0.157)
2.00 ± 0.05
(0.079 ± 0.002)
4.00 (0.157)
1.50 (0.059)
TABLE 1
DIMENSIONS IN MILLIMETERS (INCHES)
CATHODE
DIM. A
± 0.10 (0.004)
DIM. B
± 0.10 (0.004)PART NUMBER
DIM. C
± 0.10 (0.004)
HSMx-C110/120
POSITION IN
CARRIER TAPE
DIM. B
(SEE TABLE 1)
DIM. A
(SEE TABLE 1)
R 1.0 ± 0.05
(0.039 ± 0.002)
FOR HSMx-C110
1.20 (0.047)
0.75 (0.030)
1.27 (0.050)
0.95 (0.037)
0.60 (0.024)
0.90 (0.035)
0.85 (0.033)
0.60 (0.024)
0.23 ± 0.05
(0.009 ± 0.002)
FOR HSMR-C130
R 0.5 ± 0.05
(0.020 ± 0.002)
FOR HSMx-C120
HSMx-C110 SERIES
HSMx-C120 SERIES
HSMx-C150 SERIES
HSMx-C170 SERIES
HSMx-C177 SERIES
HSMx-C190 SERIES
HSMx-C191 SERIES
HSMx-C197 SERIES
3.40 (0.134)
1.90 (0.075)
3.50 (0.138)
2.30 (0.091)
2.30 (0.091)
1.75 (0.069)
1.85 (0.073)
1.75 (0.069)
1.70 (0.067)
1.15 (0.045)
1.88 (0.074)
1.45 (0.057)
1.40 (0.055)
0.90 (0.035)
0.88 (0.035)
0.95 (0.037)
Figure 22. Tape leader and trailer dimensions.
NOTES:
1. ALL DIMENSIONS IN MILLIMETERS (INCHES).
2. TOLERANCE IS ± 0.1 mm (± 0.004 IN.) UNLESS OTHERWISE SPECIFIED.
END START
THERE SHALL BE A
MINIMUM OF 160 mm
(6.3 INCH) OF EMPTY
COMPONENT POCKETS
SEALED WITH COVER
TAPE.
MOUNTED WITH
COMPONENTS
THERE SHALL BE A
MINIMUM OF 160 mm
(6.3 INCH) OF EMPTY
COMPONENT POCKETS
SEALED WITH COVER
TAPE.
MINIMUM OF
230 mm
(9.05 INCH)
MAY CONSIST
OF CARRIER
AND/OR
COVER TAPE.
For product information and a complete list of distributors, please go to our website: www.avagotech.com
Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies in the United States and other countries.
Data subject to change. Copyright © 2005-2010 Avago Technologies. All rights reserved. Obsoletes AV01-0521EN
AV02-0977EN - April 9, 2010
Convective IR Reflow Soldering
For more information on IR reflow soldering, refer to
Application Note 1060, Surface Mounting SMT LED Indi-
cator Components.
Storage Condition: 5 to 30°C @ 60% RH max.
Baking is required under the condition:
a) Humidity Indicator Card is >10% when read at 23 ±
5°C
b) Device exposed to factory conditions <30°C/60% RH
more than 672 hours.
Baking recommended condition: 60 ± 5°C for 20 hours.