MCR708AT4G - ON SEMICONDUCTOR - Datasheet.Directory

Speciﬁcations are subject to change without notice.

Revised: 05/15/18

Thyristors

Surface Mount – 100V -600V > MCR70xA Series

• Small Size

• Passivated Die Surface for Reliability and Uniformity

• Low Level Triggering and Holding Characteristics

• Recommend Electrical Replacement for C106

• Surface Mount Package − Case 369C

• To Obtain “DPAK” in Straight Lead Version

(Shipped in Sleeves): Add ’1’ Sufﬁx to Componant

Number, i.e., MCR706A1

• UL Recognized compound meeting ﬂammability

rating V-0.

• ESD Ratings: Human Body Model, 3B > 8000 V

Machine Model, C > 400 V

• Pb−Free Packages are Available

Features

PNPN Componants designed for high volume, low cost

consumer applications such as temperature, light and

speed control; process and remote control; and warning

systems where reliability of operation is critical.

Description

MCR70xA Series

Functional Diagram

Additional Information

Samples

Resources

Datasheet

Pin Out

Speciﬁcations are subject to change without notice.

Revised: 05/15/18

Thyristors

Surface Mount – 100V -600V > MCR70xA Series

Rating Symbol Value Unit

Peak Repetitive Off−State Voltage (Note 1)

(TC = − 40 to +110°C, Sine Wave, 50 to 60 Hz, RGK = 1 k Ω)

MCR703A

MCR706A

MCR708A

VDRM,

VRRM

100

400

600

Peak Non-Repetitive Off−State Voltage

(180º Conduction Angles; TC = 85ºC)

MCR703A

MCR706A

MCR708A

VDSM

150

450

650

On−State RMS Current (180º Conduction Angles; TC = 90ºC) IT(RMS) 4.0 A

Average On-State Current TC = −40 to +90ºC

(180º Conduction Angles) TC = +100ºC IT(AV)

2.6

1. 6 A

Non-Repetitive Surge Current

(1/2 Cycle, Sine Wave 60 Hz, TJ = 110 °C)

(1/2 Cycle, Sine Wave 1.5 ms, TJ = 110 °C)

ITSM

Circuit Fusing Consideration (t = 8.3 ms) I2t 2.6 A²sec

Forward Peak Gate Power (Pulse Width ≤ 1.0 µsec, TC= 90°C) IGM 0.5 W

Forward Peak Gate Current (Pulse Width ≤ 1.0 µsec, TC= 90°C) PGM 0.2 A

Forward Average Gate Power (t = 8.3 ms, TC = 90ºC) PG(AV) 0.1 W

Operating Junction Temperature Range TJ-40 to +110 °C

Storage Temperature Range Tstg -40 to +150 °C

Maximum Ratings (TJ = 25°C unless otherwise noted)

Thermal Characteristics*

Rating Symbol Value Unit

Thermal Resistance, Junction−to−Case RƟJC 3.0 °C/W

Thermal Resistance, Junction−to−Ambient (Note 2) RƟJA 80

Maximum Lead Temperature for Soldering Purposes 1/8" from Case for

10 Seconds TL260 °C

Stresses exceeding Maximum Ratings may damage the Componant. Maximum Ratings are stress ratings only. Functional operation above the Recommended

Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect Componant reliability.

1. V DRM and VRRM for all types can be applied on a continuous basis. Ratings apply for zero or negative gate voltage; however, positive gate voltage shall not be

applied concurrent with negative potential on the anode. Blocking voltages shall not be tested with a constant current source such that the voltage ratings of

the Componants are exceeded.

2. Case 369C when surface mounted on minimum pad sizes recommended.

Speciﬁcations are subject to change without notice.

Revised: 05/15/18

Thyristors

Surface Mount – 100V -600V > MCR70xA Series

Electrical Characteristics - OFF (TJ = 25°C unless otherwise noted)

Electrical Characteristics - ON (TJ = 25°C unless otherwise noted)

Characteristic Symbol Min Typ Max Unit

Peak Repetitive Forward or Reverse Blocking Current

(VAK = Rated VDRM or VRRM, RGK = 1 k Ω)

TJ = 25°C IDRM,

IRRM

- - 10

µA

TJ = 110°C - - 200

Dynamic Characteristics*

Characteristic Symbol Min Typ Max Unit

Critical Rate of Rise of Off−State Voltage

(VD = Rated VDRM, RGK = 1 k Ω, Exponential Waveform, Gate Open, Tc = 110ºC)

dv/dt − 10 − V/µs

Repetitive Critical Rate of Rise of On−State Current

(Cf = 60 Hz, IPK = 30 A, PW = 100 µs, diG/dt = 1 A/µs) di/dt − − 100 A/µs

Characteristic Symbol Min Typ Max Unit

Peak Forward "On" Voltage

(ITM = 8.2 A Peak, Pulse Width = 1 to 2 ms, 2% Duty Cycle) VTM

__2.2 V

Gate Trigger Current (Continuous dc) (Note 3)

(VAK = 12 V; RL = 24 Ω)

TJ = 25°C

IGT

_ 25 75

µA

TJ = –40°C _ _ 300

Gate Trigger Voltage (Continuous dc) (Note 3)

(VAK = 12 V; RL = 24 Ω)

TJ = 25°C

VGT

_ _ 0.8

TJ = –40°C _ _ 1. 0

Gate Non-Trigger Voltage (Note 3) (VAK= 12 Vdc; RL = 100 Ω, TC =110º) VGD 0.2 _ _ V

Holding Current

(VAK = 12 Vdc, RGK = 1 k Ω) TC = 25ºC

(Initiating Current = 20 mA) TC = −40ºC

IH–

–

5.0

Peak Reverse Gate Blocking Voltage (IGR = 10 µA) VRGM 10 12.5 18 V

Peak Reverse Gate Blocking Current (VGR = 10 V) IRGM _ _ 1. 2 µA

Total Turn-On Time (Source Voltage = 12 V, RS = 6 kQ)

(ITM = 8.2 A, IGT = 2 mA, Rated VDRM) (Rise Time = 20 ns,

Pulse Width = 10 µs)

tgt _ 2.0 _ µs

3. RGK current not included in measurement.

Speciﬁcations are subject to change without notice.

Revised: 05/15/18

Thyristors

Surface Mount – 100V -600V > MCR70xA Series

Voltage Current Characteristic of SCR

Symbol Parameter

VDRM Peak Repetitive Forward Off State Voltage

IDRM Peak Forward Blocking Current

VRRM Peak Repetitive Reverse Off State Voltage

IRRM Peak Reverse Blocking Current

VTM Maximum On State Voltage

IHHolding Current

+Current

+Voltage

VTM

IDRM at VDRM

Anode +

on state

Reverse Blocking Region

(off state)

Reverse Avalanche Region

Anode

Forward Blocking Region

IRRM at VRRM

(off state)

Figure 4. Transient Thermal Response

Figure 3. On−State Characteristics

t, TIME (ms)

1.00.1

1.0

0.1

0.01

r(t), TRANSIEN T RESIST ANCE (NORMALIZED)

000,01000100101

ZJC(t) = R JC(t)• r(t)

Figure 1. RMS Current Derating Figure 2. On−State Power Dissipation

Conduction Angle Conduction Angle

Speciﬁcations are subject to change without notice.

Revised: 05/15/18

Thyristors

Surface Mount – 100V -600V > MCR70xA Series

Figure 8. Typical Latching Current vs Junction Temperature

Figure 7. Typical Holding Current vs Junction Temperature

I, LATCHING CURRENT (mA)

110-40

TJ, JUNCTION TEMPERA TURE (°C)

2.0

1.5

0.5

20-200 40

1.0

60 80 100

110-40

TJ, JUNCTION TEMPERA TURE (°C)

2.0

1.5

IH, HOLDING CURRENT (mA)

0.5

20-200 40

1.0

60 80 100

-20 40-40

TJ, JUNCTION TEMPERA TURE (°C)

, GATE TRIGGER CURRENT ( A)IGT

20 10060 80 110

Figure 5. Typical Gate Trigger Current vs Junction Temperature Figure 6. Typical Gate Trigger Voltage vs Junction Temperature

TJ, JUNCTION TEMPERA TURE (°C)

1.0

0.5

VGT, GATE TRIGGER VOLTAGE (VOLTS)

-20 40-40 02 0 10060 80 110

200

-20 0-20 0

Speciﬁcations are subject to change without notice.

Revised: 05/15/18

Thyristors

Surface Mount – 100V -600V > MCR70xA Series

Dimensions Soldering Footprint

1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M,

1982.

2. CONTROLLING DIMENSION: INCH.

3. DIMENSION Z DEFINES A ZONE WHERE ALL BODY AND

LEAD IRREGULARITIES ARE ALLOWED.

2 PL

0.13 (0.005) T

TSEATING

PLANE

12 3

5.80

0.228

2.58

0.101

1.6

0.063

6.20

0.244

3.0

0.118

6.172

0.243

inches

SCALE 3:1

DPAK

CASE 369C 01

ISSUE A

Dim

Inches Millimeters

Min Max Min Max

A 0.086 0.094 2.18 2.38

A1 0.000 0.005 0.00 0.13

b 0.025 0.035 0.63 0.89

b2 0.030 0.045 0.76 1. 14

b3 0.180 0.215 4.57 5.46

c 0.018 0.024 0.46 0.61

c2 0.018 0.024 0.46 0.61

D 0.235 0.245 5.97 6.22

E 0.250 0.265 6.35 6.73

e 0.090 BSC 2.29 BSC

H0.370 0.410 9.40 10.41

L 0.055 0.070 1.40 1.78

L1 0.108 REF 2.74 REF

L2 0.020 BSC 0.51 BSC

L3 0.035 0.050 0.89 1.27

L4 −−− 0.040 −−− 1. 01

Z 0.155 −−− 3.93 −−−

Speciﬁcations are subject to change without notice.

Revised: 05/15/18

Thyristors

Surface Mount – 100V -600V > MCR70xA Series

Part Marking System

Pin Assignment

1Gate

2 Anode

3 Cathode

4 Anode

Ordering Information

Componant Package Shipping

MCR703AT4

DPAK

369C

2500

Tape & Reel

MCR703AT4G 369C

(Pb-Free)

MCR706AT4 369C

MCR706AT4G 369C

(Pb-Free)

MCR708A 369C

Units/ Rail

MCR708AG 369C

(Pb-Free)

MCR708A1

DPAK-3

369D

MCR708A1G 369D

(Pb-Free)

MCR708AT4

DPAK

369C 2500

Tape & Reel

MCR708AT4G 369C

(Pb-Free)

DPAK

CASE 369C

STYLE 5

4YWW

70xAG

DPAK 3

CASE 369D

STYLE 5

YWW

70xAG

Dimensions

1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M,

1982.

2. CONTROLLING DIMENSION: INCH.

Dim

Inches Millimeters

Min Max Min Max

A 0.235 0.245 5.97 6.35

B 0.250 0.265 6.35 6.73

C 0.086 0.094 2.19 2.38

D0.027 0.035 0.69 0.88

E 0.018 0.023 0.46 0.58

F 0.037 0.045 0.94 1. 14

G 0.090 BSC 2.29 BSC

H0.034 0.040 0.87 1.01

J 0.018 0.023 0.46 0.58

K 0.350 0.380 8.89 9.65

R 0.180 0.215 4.45 5.45

S 0.025 0.040 0.63 1. 01

V 0.035 0.050 0.89 1.27

Z 0.155 −−− 3.93 −−−

12 3

SEATING

PLANE

D3 PL

0.13 (0.005) T

DPAK 3

CASE 369D 01

ISSUE B

Disclaimer Notice - Information furnished is believed to be accurate and reliable. However, users should independently evaluate the suitability of and test each

product selected for their own applications. Littelfuse products are not designed for, and may not be used in, all applications. Read complete Disclaimer Notice at:

www.littelfuse.com/disclaimer-electronics

Y = Year

WW = Work Week

70xA = Componant Code

x = 3, 6 or 8

G = Pb-Free Package