(2,54mm) .100"
CLH SERIES
CLH–110–F–D–DV
CLH–108–F–D–DV–P
CLH–120–F–D–BE
WWW.SAMTEC.COM
Mates with:
TSW, MTSW, HW, DW,
EW, ZW, TLW, TSM,
MTLW
PLATING
OPTION
CLH 1NO. PINS
PER ROW
Note: Some lengths,
styles and options are
non-standard, non-returnable.
OTHER
OPTION
D
02 thru 50
(5,08)
.200
(2,54)
.100
(2,54)
.100
(3,56)
.140
(0,51)
.020
No. of Positions x (2,54) .100
02
0103
(3,66)
.144
(7,11)
.280
ENTRY
OPTION
–DV
= Top
Entry
–BE
= Bottom
Entry
–K
= (6,50mm) .256"
DIA Polyimide fi lm
Pick & Place Pad
(3 positions min.)
–TR
= Tape & Reel
Packaging
(29 positions
maximum)
–TR
= Tape & Reel
Packaging
(–DV only)
–A
= Alignment Pin
(4 positions
minimum)
(1,22)
.048
(1,60)
.063
DIA
–LC
= Locking
Clip
(1,27)
.050
(1,42)
.056
–P
= Pick & Place Pad
(3 positions
minimum)
(3,86)
.152
(7,11) .280
x
(5,71) .225
Not always necessary
for auto placement.
Call Samtec.
TAPE & REEL AVAILABILITY
Call Samtec for specifications
and ordering information.
No tooling charges.
Minimum order is the lesser of
a full reel quantity or 125 pieces.
Order any quantity above minimum.
In-house design, manufacture.
Quick turn-around.
–F
= Pre-plated Gold fl ash on contact,
75µ" (1,91µm) Matte Tin on tail
–L
= Pre-plated 10µ" (0,25µm)
Gold on contact,
75µ" (1,91µm) Matte Tin on tail
SMT LOW PROFILE SOCKET
F-211
For complete specifi cations and
rec om mend ed PCB layouts
see www.samtec.com?CLH
Insulator Material:
Black Liquid
Crystal Polymer
Contact Material:
Phosphor Bronze
Operating Temp Range:
-65°C to +125°C with Gold
-65°C to +105°C with Tin
Plating:
Au or Sn over
50µ" (1,27µm) Ni
Contact Resistance:
10 mΩ max
Insertion Depth:
(2,67mm) .105" to
(3,43mm) .135"
plug from top, (3,18mm) .125"
min plus board thickness plug
from bottom
Insertion Force:
4.0oz (1,11N) average
Normal Force:
50 grams (0,48N)
Withdrawal Force:
1.1oz (0,31N) average
Max Cycles:
100 with 10µ" (0,25µm) Au
RoHS Compliant:
Ye s
Processing:
Lead–Free Solderable:
Ye s
SMT Lead Coplanarity:
(0,10mm) .004" max
SPECIFICATIONS
Note: Other Gold plating
options available.
Contact Samtec.
