SLUS247F − APRIL 1997 − REVISED NOVEMBER 2007
1
www.ti.com
FEATURES
DFully Programmable Reset Threshold
DFully Programmable Reset Period
DFully Programmable Watchdog Period
D2% Accurate Reset Threshold
DInput Voltage Down to 2 V
DInput 18-µA Maximum Input Current
DReset Valid Down to 1 V
DESCRIPTION
The UCCx946 is designed to provide accurate
microprocessor supervision, including reset and
watchdog functions. During power up, the device
asserts a reset signal RES with VDD as low as 1 V.
The reset signal remains asserted until the VDD
voltage rises and remains above the reset
threshold for the reset period. Both reset threshold
and reset period are programmable by the user.
The UCCx946 is also resistant to glitches on the
VDD line. Once RES has been deasserted, any
drops below the threshold voltage need to be of
certain time duration and voltage magnitude to
generate a reset signal. These values are shown
in Figure 1. An I/O line of the microprocessor may
be tied to the watchdog input (WDI) for watchdog
functions. If the I/O line is not toggled within a set
watchdog period, programmable by the user,
WDO is asserted. The watchdog function is
disabled during reset conditions.
The UCCx946 is available in 8-pin SOIC(D), 8-pin
PDIP (N) and 8-pin TSSOP(PW) packages to
optimize board space.
UDG−0219
2
6
7
WDI
WP
8
VDD
3
5
POWER TO
CIRCUITRY
A3
A2
A1
A0
CLK
CLR
8−BIT
COUNTER
400 nA
WDO
GND
EDGE DETECT
WATCHDOG
TIMING
100 mV
1.235 V
2
RTH
4
RP
400 nA
POWER ON RESET RES
+
+
S Q
QR SQ
QR
SQ
QR
1
1.235 V +
+
+
+
+
!"# $"%&! '#(
'"! ! $#!! $# )# # #* "#
'' +,( '"! $!#- '# #!#&, !&"'#
#- && $##(
Copyright 2007, Texas Instruments Incorporated
SLUS247F − APRIL 1997 − REVISED NOVEMBER 2007
2www.ti.com
ORDERING INFORMATION
TA
PACKAGED DEVICES(3)
T
A(D) (N) (PW)
−40°C to 95°C UCC2946D UCC2946N UCC2946PW
0°C to 70°C UCC3946D UCC3946N UCC3946PW
(1) The D and PW packages are also available taped and reeled. Add an R suffix to the device type (i.e., UCC2946DR) for quantities of 3,000
devices per reel.
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
ABSOLUTE MAXIMUM RATINGS
over operating free-air temperature range unless otherwise noted(1)
UCC2946
UCC3946 UNIT
Input voltage range, VIN 10 V
Junction temperature range, TJ−55 to 150
Storage temperature, Tstg −65 to 150 °C
Lead temperature 1,6 mm (1/16 inch) from case for 10 seconds 300
C
(1) Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only,
and functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is
not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. Voltages are with respect to
GND. Currents are positive into, and negative out of the specified terminal.
1
2
3
4
8
7
6
5
GND
RTH
RES
RP
VDD
WDI
WP
WDO
D PACKAGE
(TOP VIEW)
TERMINAL FUNCTIONS
TERMINAL
I/O
DESCRIPTION
NAME NO.
I/O
DESCRIPTION
GND 1 − Ground reference for the device
RES 3 O This pin is high only if the voltage on the RTH has risen above 1.235 V. Once RTH rises above the threshold, this
pin remains low for the reset period. This pin asserts low and remains low if the RTH voltage dips below 1.235 V for
an amount of time determined by Figure 1.
RTH 2 I This input compares its voltage to an internal 1.25-V reference. By using external resistors, a user can program any
desired reset threshold.
RP 4 I This pin allows the user to program the reset period by adjusting an external capacitor.
VDD 8 I Supply voltage for the device.
WDI 7 I This pin is the input to the watchdog timer. If this pin is not toggled or strobed within the watchdog period, WDO is
asserted.
WDO 5 O This pin is the watchdog output. This pin is asserted low if the WDI pin is not strobed or toggled within the watchdog
period.
WP 6 I This pin allows the user to program the watchdog period by adjusting an external capacitor.
SLUS247F − APRIL 1997 − REVISED NOVEMBER 2007
3
www.ti.com
ELECTRICAL CHARACTERISTICS
TA = 0°C to 70°C and 2.0 V ≤ VDD ≤ 5.5 V for the UCC3946, TA = −40°C to 95°C and 2.1 V ≤ VDD ≤ 5.5 V for the UCC2946, (unless
otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
REFERENCE
VDD
Operating voltage
UCC2946 2.1 5.5
V
VDD Operating voltage UCC3946 2.0 5.5 V
IDD
Supply current
UCC2946 12 18
A
IDD Supply current UCC3946 10 18 µA
VDD(min)
Minimum operating voltage(1)
UCC2946 1.1
V
VDD(min) Minimum operating voltage
(1)
UCC3946 1.0 V
RESET SECTION
Reset threshold voltage
UCC2946
VDD rising
1.170 1.235 1.260
V
Reset threshold voltage UCC3946 VDD rising 1.190 1.235 1.260 V
Threshold hysteresis 15 mV
ILEAK Input leakage current 5 nA
VOH High-level output voltage ISOURCE = 2 mA VDD−0.3
ISINK = 2 mA 0.1
V
V
OL
Low-level output voltage
UCC2946
ISINK = 20 A, VDD = 1 V
0.4 V
VOL
Low-level output voltage UCC3946 ISINK = 20 µA, VDD = 1 V 0.2
VDD-to-output delay time VDD = −1 mV/µs 120 µs
Reset period
UCC2946
CRP = 64 nF
140 200 320
ms
Reset period UCC3946 CRP = 64 nF 160 200 260 ms
WATCHDOG SECTION
VIH High-level input voltage, WDI 0.7×VDD
V
VIL Low-level input voltage, WDI 0.3×VDD V
Watchdog period
UCC2946
CRP = 64 nF
0.96 1.60 2.56
s
Watchdog period UCC3946 CRP = 64 nF 1.12 1.60 2.08 s
Watchdog pulse width 50 ns
VOH High-level output voltage ISOURCE = 2 mA VDD−0.3
V
VOL Low-level output voltage ISINK = 2 mA 0.1 V
(1) Minimum supply voltage where RES is considered valid.
SLUS247F − APRIL 1997 − REVISED NOVEMBER 2007
4www.ti.com
APPLICATION INFORMATION
The UCCx946 supervisory circuit provides accurate reset and watchdog functions for a variety of
microprocessor applications. The reset circuit prevents the microprocessor from executing code during
undervoltage conditions, typically during power-up and power-down. In order to prevent erratic operation in the
presence of noise, voltage glitches where voltage amplitude and time duration are less than the values specified
in Figure 1 are ignored.
100
40
0110 120 130 140 150 160 170 180
20
100
60
80
120
180
140
160
200
Figure 1.
OVERDRIVE VOLTAGE WITH RESPECT TO
RESET THRESHOLD
vs
DELAY TO OUTPUT LOW ON RESB
VTH − Overdrive Voltage − mV
TDELAY − Delay Time − µs
RT Senses Glitch,
RES Goes Low for Reset Period
Glitches
Ignored,
RESB
Remains
High
The watchdog circuit monitors the microprocessor’s activity, if the microprocessor does not toggle WDI during
the programmable watchdog period WDO goes low, alerting the microprocessor’s interrupt of a fault. The WDO
pin is typically connected to the non-maskable input of the microprocessor so that an error recovery routine can
be executed.
SLUS247F − APRIL 1997 − REVISED NOVEMBER 2007
5
www.ti.com
APPLICATION INFORMATION
PROGRAMMING THE RESET VOLTAGE AND RESET PERIOD
The UCCx946 allows the reset trip voltage to be programmed with two external resistors. In most applications
VDD is monitored by the reset circuit, however, the design allows voltages other than VDD to be monitored.
Referring to Figure 2, the voltage below which reset is asserted is determined by:
VRESET +1.235 ǒR1 )R2
R2 Ǔ
In order to keep quiescent currents low, resistor values in the megaohm range can be used for R1 and R2. A
manual reset can be easily implemented by connecting a momentary push switch in parallel with R2. RES is
ensured to be low with VDD voltages as low as 1 V.
UDG−98002
6
7
WDI
WP
8
VDD
3
5
POWER TO
CIRCUITRY
WDO
GND
EDGE DETECT
WATCHDOG
TIMING
100 mV
2
RTH
4
RP 400 nA
POWER
ON RESET
VDD
RESET
NMI
I/O
uP
RES
+
−
+
−
+
−
+
−
+
SQ
QR
1.235 V
SQ
QR
R2
R1
400 nA
+
+
1.235 V
A3
A2
A1
A0
CLK
CLR
8−BIT
COUNTER
SQ
QR
1
CRP
CWP
Figure 2. Typical Application Diagram
(1)
SLUS247F − APRIL 1997 − REVISED NOVEMBER 2007
6www.ti.com
APPLICATION INFORMATION
Once VDD rises above the programmed threshold, RES remains low for the reset period defined by:
TRP +3.125 CRP
where T RP is time in milliseconds and CRP is capacitance in nanofarads. CRP is charged with a precision current
source of 400 nA, a high-quality, low-leakage capacitor (such as an NPO ceramic) should be used to maintain
timing tolerances. Figure 3 illustrates the voltage levels and timings associated with the reset circuit.
UDG−97067
t1: VDD > 1 V, RES is ensured low.
t2: VDD > programmed threshold, RES remains low for TRP.
t3: TRP expires, RES pulls high.
t4: Voltage glitch occurs, but is filtered at the RTH pin, RES remains high.
t5: Voltage glitch occurs whose magnitude and duration is greater than the RTH filter, RES is asserted for TRP.
t6: On completion of the TRP pulse the RTH voltage has returned and RES is pulled high.
t7: VDD dips below threshold (minus hysteresis), RES is asserted.
Figure 3. Reset Circuit Timings
(2)
SLUS247F − APRIL 1997 − REVISED NOVEMBER 2007
7
www.ti.com
APPLICATION INFORMATION
PROGRAMMING THE WATCHDOG PERIOD
The watchdog period is programmed with CWP as follows:
TWP +25 CWP
where TWP is in milliseconds and CWP is in nanofarads. A high-quality, low-leakage capacitor should be used
for CWP. The watchdog input WDI must be toggled with a high-to-low or low-to-high transition within the
watchdog period to prevent WDO from assuming a logic level low. WDO maintains the low logic level until WDI
is toggled or RES is asserted. If at any time RES is asserted, WDO assumes a high logic state and the watchdog
period be reinitiated. Figure 4 illustrates the timings associated with the watchdog circuit.
0V
VDD
t1
0V
VDD
VDD
0V
t2 t3 t4 t5 t6 t7 t8 t9 t10 t11 t12 t13 t14
RESET
WDI
WDO
TRP
TWP
UDG−98007
t1: Microprocessor is reset.
t2: WDI is toggled some time after reset, but before TWP expires.
t3: WDI is toggled before TWP expires.
t4: WDI is toggled before TWP expires.
t5: WDI is not toggled before TWP expires and WDO asserts low, triggering the microprocessor to enter an error recovery routine.
t6: The microprocessor’s error recovery routine is executed and WDI is toggled, reinitiating the watchdog timer.
t7: WDI is toggled before TWP expires.
t8: WDI is toggled before TWP expires.
t9: RES is momentarily triggered, RES is asserted low for TRP.
t10: Microprocessor is reset, RES pulls high.
t11: WDI is toggled some time after reset, but before TWP expires.
t12: WDI is toggled before TWP expires.
t13: WDI is toggled before TWP expires.
t14: VDD dips below the reset threshold, RES is asserted.
Figure 4. Watchdog Circuit Timings
(3)
SLUS247F − APRIL 1997 − REVISED NOVEMBER 2007
8www.ti.com
APPLICATION INFORMATION
CONNECTING WDO TO RES
In order to provide design flexibility, the reset and watchdog circuits in the UCCx946 have separate outputs.
Each output independently drives high or low, depending on circuit conditions explained previously.
In some applications, it may be desirable for either the RES or WDO to reset the microprocessor. This can be
done by connecting WDO to RES. If the pins try to drive to dif ferent output levels, the low output level dominates.
Additional current flows from VDD to GND during these states. If the application cannot support additional
current (during fault conditions), RES and WDO can be connected to the inputs of an OR gate whose output
is connected to the microprocessor’s reset pin.
LAYOUT CONSIDERATIONS
A 0.1-µF capacitor connected from VDD to GND is recommended to decouple the UCCx946 from switching
transients on the VDD supply rail.
Since RP and WP are precision current sources, capacitors CRP and CWP should be connected to these pins
with minimal trace length to reduce board capacitance. Care should be taken to route any traces with high
voltage potential or high speed digital signals away from these capacitors.
Resistors R1 a n d R 2 g e n erally have a high ohmic value, traces associated with these parts should be kept short
in order to prevent any transient producing signals from coupling into the high impedance RTH pin.
TYPICAL CHARACTERISTICS
Figure 5.
THRESHOLD RESISTANCE
vs
AMBIENT TEMPERATURE
VRTH − Threshold Resistance − V
TA − Ambient Temperature − °C
−55
1.22
1.20 −35 −15 5 25 45 65 85 105 125
1.21
1.25
1.23
1.24
1.26 VDD = 5 V
2
10.0
9.0 3456
9.5
11.5
10.5
11.0
12.0
Figure 6.
VDD − Input Voltage − V
INPUT CURRENT
vs
INPUT VOLTAGE
IDD − Input Current − µA
PACKAGING INFORMATION
Orderable Device Status (1) Package
Type Package
Drawing Pins Package
Qty Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
UCC2946D ACTIVE SOIC D 8 75 Green (RoHS &
no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR
UCC2946DG4 ACTIVE SOIC D 8 75 Green (RoHS &
no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR
UCC2946DTR ACTIVE SOIC D 8 2500 Green (RoHS &
no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR
UCC2946DTRG4 ACTIVE SOIC D 8 2500 Green (RoHS &
no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR
UCC2946PW ACTIVE TSSOP PW 8 150 Green (RoHS &
no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR
UCC2946PWG4 ACTIVE TSSOP PW 8 150 Green (RoHS &
no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR
UCC2946PWTR ACTIVE TSSOP PW 8 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR
UCC2946PWTRG4 ACTIVE TSSOP PW 8 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR
UCC3946D ACTIVE SOIC D 8 75 Green (RoHS &
no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR
UCC3946DG4 ACTIVE SOIC D 8 75 Green (RoHS &
no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR
UCC3946DTR ACTIVE SOIC D 8 2500 Green (RoHS &
no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR
UCC3946DTRG4 ACTIVE SOIC D 8 2500 Green (RoHS &
no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR
UCC3946N ACTIVE PDIP P 8 50 Green (RoHS &
no Sb/Br) CU NIPDAU N / A for Pkg Type
UCC3946NG4 ACTIVE PDIP P 8 50 Green (RoHS &
no Sb/Br) CU NIPDAU N / A for Pkg Type
UCC3946PW ACTIVE TSSOP PW 8 150 Green (RoHS &
no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR
UCC3946PWG4 ACTIVE TSSOP PW 8 150 Green (RoHS &
no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR
UCC3946PWTR ACTIVE TSSOP PW 8 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR
UCC3946PWTRG4 ACTIVE TSSOP PW 8 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
PACKAGE OPTION ADDENDUM
www.ti.com 18-Sep-2008
Addendum-Page 1
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
OTHER QUALIFIED VERSIONS OF UCC2946 :
•Automotive: UCC2946-Q1
NOTE: Qualified Version Definitions:
•Automotive - Q100 devices qualified for high-reliability automotive applications targeting zero defects
PACKAGE OPTION ADDENDUM
www.ti.com 18-Sep-2008
Addendum-Page 2
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device Package
Type Package
Drawing Pins SPQ Reel
Diameter
(mm)
Reel
Width
W1 (mm)
A0
(mm) B0
(mm) K0
(mm) P1
(mm) W
(mm) Pin1
Quadrant
UCC2946DTR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1
UCC2946PWTR TSSOP PW 8 2000 330.0 12.4 7.0 3.6 1.6 8.0 12.0 Q1
UCC3946DTR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1
UCC3946PWTR TSSOP PW 8 2000 330.0 12.4 7.0 3.6 1.6 8.0 12.0 Q1
PACKAGE MATERIALS INFORMATION
www.ti.com 14-Jul-2012
Pack Materials-Page 1
*All dimensions are nominal
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
UCC2946DTR SOIC D 8 2500 367.0 367.0 35.0
UCC2946PWTR TSSOP PW 8 2000 367.0 367.0 35.0
UCC3946DTR SOIC D 8 2500 367.0 367.0 35.0
UCC3946PWTR TSSOP PW 8 2000 367.0 367.0 35.0
PACKAGE MATERIALS INFORMATION
www.ti.com 14-Jul-2012
Pack Materials-Page 2
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other
changes to its semiconductor products and services per JESD46C and to discontinue any product or service per JESD48B. Buyers should
obtain the latest relevant information before placing orders and should verify that such information is current and complete. All
semiconductor products (also referred to herein as “components”) are sold subject to TI’s terms and conditions of sale supplied at the time
of order acknowledgment.
TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms
and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary
to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily
performed.
TI assumes no liability for applications assistance or the design of Buyers’ products. Buyers are responsible for their products and
applications using TI components. To minimize the risks associated with Buyers’ products and applications, Buyers should provide
adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or
other intellectual property right relating to any combination, machine, or process in which TI components or services are used. Information
published by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty or
endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the
third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration
and is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such altered
documentation. Information of third parties may be subject to additional restrictions.
Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service
voids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice.
TI is not responsible or liable for any such statements.
Buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirements
concerning its products, and any use of TI components in its applications, notwithstanding any applications-related information or support
that may be provided by TI. Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards which
anticipate dangerous consequences of failures, monitor failures and their consequences, lessen the likelihood of failures that might cause
harm and take appropriate remedial actions. Buyer will fully indemnify TI and its representatives against any damages arising out of the use
of any TI components in safety-critical applications.
In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TI’s goal is to
help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and
requirements. Nonetheless, such components are subject to these terms.
No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the parties
have executed a special agreement specifically governing such use.
Only those TI components which TI has specifically designated as military grade or “enhanced plastic” are designed and intended for use in
military/aerospace applications or environments. Buyer acknowledges and agrees that any military or aerospace use of TI components
which have not been so designated is solely at the Buyer's risk, and that Buyer is solely responsible for compliance with all legal and
regulatory requirements in connection with such use.
TI has specifically designated certain components which meet ISO/TS16949 requirements, mainly for automotive use. Components which
have not been so designated are neither designed nor intended for automotive use; and TI will not be responsible for any failure of such
components to meet such requirements.
Products Applications
Audio www.ti.com/audio Automotive and Transportation www.ti.com/automotive
Amplifiers amplifier.ti.com Communications and Telecom www.ti.com/communications
Data Converters dataconverter.ti.com Computers and Peripherals www.ti.com/computers
DLP® Products www.dlp.com Consumer Electronics www.ti.com/consumer-apps
DSP dsp.ti.com Energy and Lighting www.ti.com/energy
Clocks and Timers www.ti.com/clocks Industrial www.ti.com/industrial
Interface interface.ti.com Medical www.ti.com/medical
Logic logic.ti.com Security www.ti.com/security
Power Mgmt power.ti.com Space, Avionics and Defense www.ti.com/space-avionics-defense
Microcontrollers microcontroller.ti.com Video and Imaging www.ti.com/video
RFID www.ti-rfid.com
OMAP Mobile Processors www.ti.com/omap TI E2E Community e2e.ti.com
Wireless Connectivity www.ti.com/wirelessconnectivity
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2012, Texas Instruments Incorporated
