Approval sheet Open Mode Series MULTILAYER CERAMIC CAPACITORS Open-Mode Series (100V to 500V) 0805 to 1812 Sizes X7R Dielectric RoHS Compliance *Contents in this sheet are subject to change without prior notice. Page 1 of 10 ASC_ Open Mode_012O_AS Oct. 2012 Approval sheet Open Mode Series 1. INTRODUCTION WTC open-mode series MLCC is designed by a special internal electrode pattern, which can reduce voltage concentrations by distributing voltage gradients throughout the entire capacitor. This special design also affords open-mode pattern to prevent circuit leakage when focused to failure in a board flex situation. 2. FEATURES 3. APPLICATIONS b. c. d. a. b. c. High voltage in a given case size. Circuit open during product cracking. High stability and reliability. High current applications. Power supply and related industries The other mechanical stress concerned products. 4. HOW TO ORDER OP 32 B 103 K 201 C T Series Size Dielectric Capacitance Tolerance Rated voltage Termination Packaging OP=Open-mode 21=0805 (2012) 31=1206 (3216) 32=1210 (3225) 43=1812 (4532) B=X7R Two significant K=10% digits followed M=20% by no. of zeros. And R is in place of decimal point. eg.: 102=10x102 =1000pF Page 2 of 10 Two significant C=Cu/Ni/Sn digits followed by no. of zeros. And R is in place of decimal point. T=7" reeled G=13" reeled 101=100 VDC 201=200 VDC 251=250 VDC 501=500 VDC ASC_ Open Mode_012O_AS Oct. 2012 Approval sheet Open Mode Series 5. EXTERNAL DIMENSIONS Size Inch (mm) L (mm) W (mm) 0805 (2012) 2.000.15 1.250.10 3.200.15 1.600.15 1206 (3216) 3.200.20 1.600.20 3.200.30 2.500.20 1210 (3225) 1812 (4532) 3.200.40 2.500.30 4.50+0.5/-0.3 3.200.30 T (mm)/Symbol 0.800.10 1.250.10 0.800.10 0.950.10 1.250.10 1.600.20 0.950.10 1.250.10 1.600.20 2.500.30 1.250.10 2.000.20 Remark B D B C D G C D G M D K # # # # # # # # # MB (mm) L 0.400.20 T W 0.500.20 MB MB Fig. 1 The outline of MLCC 0.500.25 0.600.25 # Reflow soldering only is recommended. 6. GENERAL ELECTRICAL DATA Dielectric X7R Size 0805, 1206, 1210, 1812 Capacitance* 100pF to 1F Capacitance tolerance** K (10%), M (20%) Rated voltage (WVDC) 100V, 200V, 250V, 500V Tan * 2.5% Insulation resistance at Ur 10G or RxC500-F whichever is smaller Dielectric strength 100V: 2.5 x WVDC 200V and 250V: 2 x WVDC 500V: 1.5 x WVDC Operating temperature -55 to +125C Capacitance characteristic 15% Termination Ni/Sn (lead-free termination) * Measured at 25C ambient temperature and 30~70% r elated humidity. Apply 1.00.2Vrms, 1.0kHz10%. ** Preconditioning for Class II MLCC: Perform a heat treatment at 15010C for 1 hour, then leave in a mbient condition for 242 hours before measurement. Page 3 of 10 ASC_ Open Mode_012O_AS Oct. 2012 Approval sheet Open Mode Series 7. CAPACITANCE RANGE Capacitance DIELECTRIC SIZE RATED VOLTAGE (VDC) 100 100pF (101) B 120pF (121) B 150pF (151) B 180pF (181) B 220pF (221) B 270pF (271) B 330pF (331) B 390pF (391) B 470pF (471) B 560pF (561) B 680pF (681) B 820pF (821) B 1,000pF (102) B 1,200pF (122) B 1,500pF (152) B 1,800pF (182) B 2,200pF (222) B 2,700pF (272) B 3,300pF (332) B 3,900pF (392) B 4,700pF (472) B 5,600pF (562) B 6,800pF (682) B 8,200pF (822) B 0.010F (103) B 0.012F (123) B 0.015F (153) B 0.018F (183) B 0.022F (223) B 0.027F (273) D 0.033F (333) D 0.039F (393) D 0.047F (473) D 0.056F (563) 0.068F (683) 0.082F (823) 0.10F (104) 0.12F (124) 0.15F (154) 0.18F (184) 0.22F (224) 0.27F (274) 0.33F (334) 0.39F (394) 0.47F (474) 0.56F (564) 0.68F (684) 0.82F (824) 1.0F (105) X7R 0805 200 250 B B B B B B B B B B B B B B B B B B B B B B B B B B B B B B B B B B B B B B B B B B D D D D D D D D D D D D D D D D 500 B B B B B B B B B B B B B B B B B B B 100 B B B B B B B B B B B B B B B B B B B B B B B B B B B B B B B B B D D D G G G 1206 200 250 D D D D D D D D D D D D D D D D D D D D D D D D D D D D G G G G G G G D D D D D D D D D D D D D D D D D D D D D D D D D D D D G G G G G G G 500 D D D D D D D D D D D D D D D D D D D D D D D D D D G G G 100 C C C C C C C C C C C C C C C C C C C C C C C C C C D D D G G M M M 1210 200 250 C C C C C C C C C C C C C C C C C C C C D D G G G G M M M C C C C C C C C C C C C C C C C C C C C D D G G G G M M M 500 100 D D D D D D D D D D D D D D D D D D G G G G G D D D D D D D D D D D D D D D D D D D D D D D D D D D D D D D D K K K K K 1812 200 250 D D D D D D D D D D D D D D D D D D D D D D D D D D K K K K K K K D D D D D D D D D D D D D D D D D D D D D D D D D D K K K K K K K 500 D D D D D D D D D D D D D D D D D D D D D K K K K The letter in cell is expressed the symbol of product thickness. Page 4 of 10 ASC_ Open Mode_012O_AS Oct. 2012 Approval sheet Open Mode Series 8. PACKAGING DIMENSION AND QUANTITY Size 0805 1206 1210 1812 Thickness (mm)/Symbol 0.800.10 B Paper tape 7" reel 4k Plastic tape 13" reel 15k 7" reel - 13" reel 10k 1.250.10 D - - 3k 0.800.10 B 4k 15k - - 0.950.10 C - - 3k 10k 1.250.10 D - - 3k 10k 1.600.20 0.950.10 G C - - 2k 3k 10k 10k 1.250.10 D - - 3k 10k 1.600.20 G - - 2k - 2.500.30 M - - 1k 6k 1.250.10 2.000.20 D K - - 1k 1k 5k Unit: pieces 9. INNER CONSTRUCTION OF OPEN-MODE DESIGN MB CP Crack Fig. 2 Normal design (CP<MB) - circuit leakage during cracking. Page 5 of 10 CP MB Crack Fig. 3 Open-mode design (CP>MB) - circuit open during cracking. ASC_ Open Mode_012O_AS Crack Fig. 4 Floating design (one kind of open-mode design)- circuit open during cracking. Oct. 2012 Approval sheet Open Mode Series 10. RELIABILITY TEST CONDITIONS AND REQUIREMENTS No. 1. Item Visual and Test Condition --- * No remarkable defect. Mechanical 2. 3. Capacitance Requirements * Dimensions to conform to individual specification sheet. 1.00.2Vrms, 1kHz10% * Shall not exceed the limits given in the detailed spec. Q/ D.F. D.F. 2.5% (Dissipation Factor) 4. Dielectric Strength * To apply voltage: 100V * No evidence of damage or flash over during test. 2.5 times VDC 200V~300V 2 times VDC 500V 1.5 times VDC * Cut-off, set at 10mA * TEST= 15 sec. * RAMP=0 5. 6. 7. Insulation 100V, To apply rated voltage for max. 120 sec. 10G or RxC100-F whichever is smaller. Resistance 200V, To apply rated voltage for 60 sec. X7R=100V: RxC100-F Temperature With no electrical load. Within 15%. Coefficient Operating temperature: -55~125C at 25C Adhesive * Pressurizing force Strength of 8. * No remarkable damage or removal of the terminations. 5N (0603) and 10N (>0603) Termination * Test time: 101 sec. Vibration * Vibration frequency: 10~55 Hz/min. * No remarkable damage. Resistance * Total amplitude: 1.5mm * Cap change and Q/D.F.: To meet initial spec. * Test time: 6 hrs. (Two hrs each in three mutually perpendicular directions.) * Measurement to be made after keeping at room temp. for 242 hrs. 9. Solderability * Solder temperature: 2355C 95% min. coverage of all metalized area. * Dipping time: 20.5 sec. 10. Bending Test * The middle part of substrate shall be pressurized by means * No remarkable damage. of the pressurizing rod at a rate of about 1 mm per second until the deflection becomes 1 mm and then the pressure * Cap change: X7R: within 12.5% (This capacitance change means the change of capacitance under shall be maintained for 51 sec. specified flexure of substrate from the capacitance measured * Measurement to be made after keeping at room temp. for before the test.) 242 hrs. 11. Resistance to * Solder temperature: 2605C * No remarkable damage. Soldering Heat * Dipping time: 101 sec * Cap change: X7R: within 7.5% * Preheating: 120 to 150C for 1 minute before immerse the * Q/D.F., I.R. and dielectric strength: To meet initial requirements. capacitor in a eutectic solder. * 25% max. leaching on each edge. * Before initial measurement (Class II only): Perform 150+0/-10C for 1 hr and then set for 242 hrs at room temp. * Measurement to be made after keeping at room temp. for 242 hrs. Page 6 of 10 ASC_ Open Mode_012O_AS Oct. 2012 Approval sheet Open Mode Series No. 12. Item Test Condition Requirements Temperature * Conduct the five cycles according to the temperatures and * No remarkable damage. Cycle time. * Cap changewithin 7.5% Step Temp. (C) Time (min.) 1 Min. operating temp. +0/-3 2 Room temp. 2~3 3 Max. operating temp. +3/-0 303 4 Room temp. 2~3 * Q/D.F., I.R. and dielectric strength: To meet initial requirements. 303 * Before initial measurement (Class II only): Perform 150+0/-10C for 1 hr and then set for 242 hrs at room temp. * Measurement to be made after keeping at room temp. for 242 hrs. 13. Humidity * Test temp.: 402C * No remarkable damage. (Damp Heat) * Humidity: 90~95% RH * Cap change: within 12.5% Steady State * Test time: 500+24/-0hrs. * Q/D.F. value: D.F. 3.0% *Before initial measurement (Class II only): Perform * I.R.: 1G or RxC50-F whichever is smaller. 150+0/-10C for 1 hr and then set for 242 hrs at room temp. X7R=100V: RxC10-F * Measurement to be made after keeping at room temp. for 24 2 hrs. 14. Humidity * Test temp.: 402C * No remarkable damage. (Damp Heat) * Humidity: 90~95%RH * Cap change: within 12.5% Load * Test time: 500+24/-0 hrs. * Q/D.F. value: D.F. 3.0% * To apply voltagerated voltage. * I.R.: 500M or RxC25-F whichever is smaller. *Before initial measurement (Class II only): To apply test X7R=100V: RxC5-F voltage for 1hr at 40C and then set for 242 hrs at room temp. *Measurement to be made after keeping at room temp. for 24 2 hrs. 15. High * Test temp.: X7R: 1253C * No remarkable damage. Temperature * To apply voltage: * Cap change: within 12.5% Load (1) V<500V: 200% of rated voltage. * Q/D.F. value: D.F. 3.0% (Endurance) (2) 500V: 150% of rated voltage. * I.R.: 1G or RxC50-F whichever is smaller. * Test time: 1000+24/-0 hrs. X7R=100V: RxC10-F *Before initial measurement (Class II only): To apply test voltage for 1hr at test temp. and then set for 242 hrs at room temp. *Measurement to be made after keeping at room temp. for 24 2 hrs Page 7 of 10 ASC_ Open Mode_012O_AS Oct. 2012 Approval sheet Open Mode Series APPENDIXES Tape & reel dimensions Fig. 5 The dimension of paper tape Fig. 6 The dimension of plastic tape Size Thickness 0805 1206 1210 1812 B C, D, I B C, D G C, D G D, K, M A0 1.500.10 <1.57 2.000.10 <1.85 <1.95 <2.97 <2.97 <3.81 B0 2.300.10 <2.40 3.500.10 <3.46 <3.67 <3.73 <3.73 <5.30 T 0.950.05 0.230.05 0.950.05 0.230.05 0.230.05 0.230.05 0.230.05 0.250.05 K0 - <2.50 - <2.50 <2.50 <2.50 <2.50 <2.50 W 8.000.10 8.000.10 8.000.10 8.000.10 8.000.10 8.000.10 8.000.10 12.00.20 P0 4.000.10 4.000.10 4.000.10 4.000.10 4.000.10 4.000.100 4.000.10 4.000.10 10xP0 40.00.10 40.00.10 40.00.10 40.00.10 40.00.10 40.00.10 40.00.10 40.00.10 P1 4.000.10 4.000.10 4.000.10 4.000.10 4.000.10 4.000.10 4.000.10 8.000.10 P2 2.000.05 2.000.05 2.000.05 2.000.05 2.000.05 2.000.05 2.000.05 2.000.05 D0 1.550.05 1.500.05 1.500.05 1.500.05 1.500.05 1.500.05 1.500.05 1.500.05 D1 - 1.000.10 - 1.000.10 1.000.10 1.000.10 1.000.10 1.500.10 E 1.750.05 1.750.10 1.750.10 1.750.10 1.750.10 1.750.10 1.750.10 1.750.10 F 3.500.05 3.500.05 3.500.05 3.500.05 3.500.05 3.500.05 3.500.05 5.500.05 Size Reel size C W1 A N 7" 13.0+0.5/-0.2 8.4+1.5/-0 178.00.10 60.0+1/-0 0603, 0805, 1206, 1210 10" 13" 13.0+0.5/-0.2 13.0+0.5/-0.2 8.4+1.5/-0 8.4+1.5/-0 250.01.0 330.01.0 100.01.0 1001.0 1808, 1812 7" 13.0+0.5/-0.2 12.4+2.0/-0 178.00.10 60.0+1/-0 Fig. 7 The dimension of reel Page 8 of 10 ASC_ Open Mode_012O_AS Oct. 2012 Approval sheet Open Mode Series Description of customer label a. Customer name b. WTC order series and item number c. Customer P/O d. Customer P/N e. Description of product f. Quantity g. Bar code including quantity & WTC P/N or customer h. WTC P/N i. Shipping date j. Order bar code including series and item numbers k. Serial number of label Constructions No. Name X7R 1 Ceramic material BaTiO3 based 2 Inner electrode Ni 3 4 Termination 5 Inner layer Cu Middle layer Ni Outer layer Sn (Matt) Fig. 8 The construction of MLCC Storage and handling conditions (1) To store products at 5 to 40C ambient temperature and 20 to 70%. related humidity conditions. (2) The product is recommended to be used within one year after shipment. Check solderability in case of shelf life extension is needed. Cautions: a. The corrosive gas reacts on the terminal electrodes of capacitors, and results in the poor solderability. Do not store the capacitors in the ambience of corrosive gas (e.g., hydrogen sulfide, sulfur dioxide, chlorine, ammonia gas etc.) b. In corrosive atmosphere, solderability might be degraded, and silver migration might occur to cause low reliability. c. Due to the dewing by rapid humidity change, or the photochemical change of the terminal electrode by direct sunlight,the solderability and electrical performance may deteriorate. Do not store capacitors under direct sunlight or dewing condition. To store products on the shelf and avoid exposure to moisture. . Page 9 of 10 ASC_ Open Mode_012O_AS Oct. 2012 Approval sheet Open Mode Series Recommended soldering conditions The lead-free termination MLCCs are not only to be used on SMT against lead-free solder paste, but also suitable against lead-containing solder paste. If the optimized solder joint is requested, increasing soldering time, temperature and concentration of N2 within oven are recommended. 4 / sec max Over 60sec at least by natural cooling Fig. 9 Recommended reflow soldering profile for SMT process with SnAgCu series solder paste. Page 10 of 10 Fig. 10 Recommended wave soldering profile for SMT process with SnAgCu series solder. ASC_ Open Mode_012O_AS Oct. 2012