OP43B152K251CT - Walsin Technology Corp.

Approval sheet

Open Mode Series

Page 1 of 10 ASC_ Open Mode_012O_AS Oct. 2012

*Contents in this sheet are subject to change without prior notice.

MULTILAYER CERAMIC CAPACITORS

Open-Mode Series (100V to 500V)

0805 to 1812 Sizes

X7R Dielectric

RoHS Compliance

Approval sheet

Open Mode Series

Page 2 of 10 ASC_ Open Mode_012O_AS Oct. 2012

1. INTRODUCTION

WTC open-mode series MLCC is designed by a special internal electrode pattern, which can reduce voltage

concentrations by distributing voltage gradients throughout the entire capacitor. This special design also affords

open-mode pattern to prevent circuit leakage when focused to failure in a board flex situation.

4. HOW TO ORDER

OP 32 B 103 K 201 C T

Series

OP=Open-mode

Size

21=0805 (2012)

31=1206 (3216)

32=1210 (3225)

43=1812 (4532)

Dielectric

B=X7R

Capacitance

Two significant

digits followed

by no. of zeros.

And R is in

place of

decimal point.

eg.:

102=10x10

2

=1000pF

Tolerance

K=±10%

M=±20%

Rated voltage

Two significant

digits followed by

no. of zeros. And

R is in place of

decimal point.

101=100 VDC

201=200 VDC

251=250 VDC

501=500 VDC

Termination

C=Cu/Ni/Sn

Packaging

T=7” reeled

G=13” reeled

2. FEATURES

b. High voltage in a given case size.

c. Circuit open during product cracking.

d. High stability and reliability.

3. APPLICATIONS

a. High current applications.

b. Power supply and related industries

c. The other mechanical stress concerned products.

Approval sheet

Open Mode Series

Page 3 of 10 ASC_ Open Mode_012O_AS Oct. 2012

5. EXTERNAL DIMENSIONS

6. GENERAL ELECTRICAL DATA

Dielectric X7R

Size 0805, 1206, 1210, 1812

Capacitance* 100pF to 1µF

Capacitance tolerance** K (±10%), M (±20%)

Rated voltage (WVDC) 100V, 200V, 250V, 500V

Tan δ* ≤2.5%

Insulation resistance at Ur ≥10GΩ or RxC≥500Ω-F whichever is smaller

Dielectric strength 100V: ≥2.5 x WVDC

200V and 250V: ≥2 x WVDC

500V: ≥1.5 x WVDC

Operating temperature -55 to +125°C

Capacitance characteristic ±15%

Termination Ni/Sn (lead-free termination)

* Measured at 25°C ambient temperature and 30~70% related humidity. Apply 1.0±0.2Vrms, 1.0kHz±10%.

** Preconditioning for Class II MLCC: Perform a heat treatment at 150±10°C for 1 hour, then leave in ambient condition for 24±2 hours

before measurement.

T

W

L

M

B

M

B

Fig. 1 The outline of MLCC

Size

Inch (mm)

L (mm) W (mm) T (mm)/Symbol Remark

M

B

(mm)

0.80±0.10

B

0805 (2012)

2.00±0.15

1.25±0.10

D # 0.40±0.20

0.80±0.10

B

0.95±0.10

C

3.20±0.15

1.60±0.15

1.25±0.10

D #

1206 (3216)

3.20±0.20

1.60±0.20

G #

0.50±0.20

0.95±0.10

C #

3.20±0.30

2.50±0.20

1.25±0.10

D #

1.60±0.20

G

#

1210 (3225)

3.20±0.40

2.50±0.30

M #

0.50±0.25

1.25±0.10

D #

1812 (4532)

4.50+0.5/-0.3

3.20±0.30

2.00±0.20

K # 0.60±0.25

# Reflow soldering only is recommended.

Approval sheet

Open Mode Series

Page 4 of 10 ASC_ Open Mode_012O_AS Oct. 2012

7. CAPACITANCE RANGE

DIELECTRIC X7R

SIZE 0805 1206 1210 1812

RATED VOLTAGE (VDC)

100

200

250

500

100

200

250

500

100

200

250

500

100

200

250

500

100pF (101)

B B B B

120pF (121)

B B B B

150pF (151)

B B B B B D

D

180pF (181)

B B B B B D

D

220pF (221)

B B B B B D

D

270pF (271)

B B B B B D

D

330pF (331)

B B B B B D

D

390pF (391)

B B B B B D

D

470pF (471)

B B B B B D

D

560pF (561)

B B B B B D

D

680pF (681)

B B B B B D

D

820pF (821)

B B B B B D

D

1,000pF (102)

B B B B B D

D

C

D

1,200pF (122)

B B B B B D

D

C

D

1,500pF (152)

B B B B B D

D

C

D

1,800pF (182)

B B B B B D

D

C

D

2,200pF (222)

B B B B B D

D

C

D

2,700pF (272)

B B B B B D

D

C

D

3,300pF (332)

B B B B B D

D

C

D

3,900pF (392)

B B B B D

D

C

D

4,700pF (472)

B B B B D

D

C

D

5,600pF (562)

B D

D

B D

D

C

D

6,800pF (682)

B D

D

B D

D

C

D

8,200pF (822)

B D

D

B D

D

C

D

0.010µF (103)

B D

D

B D

D

C

D

0.012µF (123)

B D

D

B D

D

C

D

0.015µF (153)

B D

D

B D

D

C

D

0.018µF (183)

B D

D

B D

D

C

D

0.022µF (223)

B D

D

B D

D

G

C

D

0.027µF (273)

D

B D

D

G

C

D

0.033µF (333)

D

B G

G

C

G

D

0.039µF (393)

D

B G

G

C

G

D

0.047µF (473)

D

B G

G

C

D

G

D

0.056µF (563)

B G

G

C

D

G

D

K

0.068µF (683)

B G

G

C

G

D

K

0.082µF (823)

D

G

C

G

D

K

0.10µF (104)

D

G

C

G

D

K

0.12µF (124)

D

C

G

D

0.15µF (154)

G

D

M

D

K K

0.18µF (184)

G

D

M

D

K K

0.22µF (224)

G

D

M

D

K K

0.27µF (274)

G

D

K K

0.33µF (334)

G

D

K K

0.39µF (394)

M

D

K K

0.47µF (474)

M

K K K

0.56µF (564)

M

K

0.68µF (684)

K

0.82µF (824)

K

Capacitance

1.0µF (105)

K

The letter in cell is expressed the symbol of product thickness.

Approval sheet

Open Mode Series

Page 5 of 10 ASC_ Open Mode_012O_AS Oct. 2012

8. PACKAGING DIMENSION AND QUANTITY

Paper tape Plastic tape

Size Thickness (mm)/Symbol

7” reel 13” reel 7” reel 13” reel

0.80±0.10 B 4k 15k - -

0805 1.25±0.10 D - - 3k 10k

0.80±0.10 B 4k 15k - -

0.95±0.10 C - - 3k 10k

1.25±0.10 D - - 3k 10k

1206

1.60±0.20 G - - 2k 10k

0.95±0.10 C - - 3k 10k

1.25±0.10 D - - 3k 10k

1.60±0.20 G - - 2k -

1210

2.50±0.30 M - - 1k 6k

1.25±0.10 D - - 1k 5k

1812 2.00±0.20 K - - 1k -

Unit: pieces

9. INNER CONSTRUCTION OF OPEN-MODE DESIGN

CP

M

B

Crack

Fig. 2 Normal design (CP<M

B

) –

circuit leakage during cracking.

M

B

CP

Crack

Fig. 3 Open-mode design (CP>M

B

) –

circuit open during cracking.

Crack

Fig. 4 Floating design (one kind of

open-mode design)– circuit open

during cracking.

Approval sheet

Open Mode Series

Page 6 of 10 ASC_ Open Mode_012O_AS Oct. 2012

10. RELIABILITY TEST CONDITIONS AND REQUIREMENTS

No.

Item Test Condition Requirements

1.

Visual and

Mechanical

--- * No remarkable defect.

* Dimensions to conform to individual specification sheet.

2.

Capacitance * Shall not exceed the limits given in the detailed spec.

3.

Q/ D.F.

(Dissipation

Factor)

1.0±0.2Vrms, 1kHz±10%

D.F. ≤2.5%

4.

Dielectric

Strength

* To apply voltage:

100V ≥2.5 times VDC

200V~300V ≥2 times VDC

500V ≥1.5 times VDC

* Cut-off, set at 10mA

* TEST= 15 sec.

* RAMP=0

* No evidence of damage or flash over during test.

5.

Insulation

Resistance

100V, To apply rated voltage for max. 120 sec.

≥200V, To apply rated voltage for 60 sec.

≥10GΩ or RxC≥100Ω-F whichever is smaller.

X7R=100V: RxC≥100Ω-F

6.

Temperature

Coefficient

With no electrical load.

Operating temperature: -55~125°C at 25°C

Within ±15%.

7.

Adhesive

Strength of

Termination

* Pressurizing force：

5N (≤0603) and 10N (>0603)

* Test time: 10±1 sec.

* No remarkable damage or removal of the terminations.

8.

Vibration

Resistance

* Vibration frequency: 10~55 Hz/min.

* Total amplitude: 1.5mm

* Test time: 6 hrs. (Two hrs each in three mutually

perpendicular directions.)

* Measurement to be made after keeping at room temp. for

24±2 hrs.

* No remarkable damage.

* Cap change and Q/D.F.: To meet initial spec.

9.

Solderability * Solder temperature: 235±5°C

* Dipping time: 2±0.5 sec.

95% min. coverage of all metalized area.

10.

Bending Test

* The middle part of substrate shall be pressurized by means

of the pressurizing rod at a rate of about 1 mm per second

until the deflection becomes 1 mm and then the pressure

shall be maintained for 5±1 sec.

* Measurement to be made after keeping at room temp. for

24±2 hrs.

* No remarkable damage.

* Cap change: X7R: within ±12.5%

(This capacitance change means the change of capacitance under

specified flexure of substrate from the capacitance measured

before the test.)

11.

Resistance to

Soldering Heat

* Solder temperature: 260±5°C

* Dipping time: 10±1 sec

* Preheating: 120 to 150°C for 1 minute before immerse the

capacitor in a eutectic solder.

* Before initial measurement (Class II only): Perform

150+0/-10°C for 1 hr and then set for 24±2 hrs at room temp.

* Measurement to be made after keeping at room temp. for

24±2 hrs.

* No remarkable damage.

* Cap change: X7R: within ±7.5%

* Q/D.F., I.R. and dielectric strength: To meet initial requirements.

* 25% max. leaching on each edge.

Approval sheet

Open Mode Series

Page 7 of 10 ASC_ Open Mode_012O_AS Oct. 2012

No.

Item Test Condition Requirements

12.

Temperature

Cycle

* Conduct the five cycles according to the temperatures and

time.

Step

Temp. (°C) Time (min.)

1 Min. operating temp. +0/-3 30±3

2 Room temp. 2~3

3 Max. operating temp. +3/-0 30±3

4 Room temp. 2~3

* Before initial measurement (Class II only): Perform

150+0/-10°C for 1 hr and then set for 24±2 hrs at room temp.

* Measurement to be made after keeping at room temp. for

24±2 hrs.

*

No remarkable damage.

*

Cap change：within ±7.5%

* Q/D.F., I.R. and dielectric strength: To meet initial requirements.

13.

Humidity

(Damp Heat)

Steady State

* Test temp.: 40±2°C

* Humidity: 90~95% RH

* Test time: 500+24/-0hrs.

*Before initial measurement (Class II only): Perform

150+0/-10°C for 1 hr and then set for 24±2 hrs at room temp.

* Measurement to be made after keeping at room temp. for 24

±2 hrs.

* No remarkable damage.

* Cap change: within ±12.5%

* Q/D.F. value: D.F. ≤3.0%

* I.R.: ≥1GΩ or RxC≥50Ω-F whichever is smaller.

X7R=100V: RxC≥10Ω-F

14.

Humidity

(Damp Heat)

Load

* Test temp.: 40±2°C

* Humidity: 90~95%RH

* Test time: 500+24/-0 hrs.

* To apply voltage：rated voltage.

*Before initial measurement (Class II only): To apply test

voltage for 1hr at 40°C and then set for 24±2 hrs at room

temp.

*Measurement to be made after keeping at room temp. for 24

±2 hrs.

* No remarkable damage.

* Cap change: within ±12.5%

* Q/D.F. value: D.F. ≤3.0%

* I.R.: ≥500MΩ or RxC≥25Ω-F whichever is smaller.

X7R=100V: RxC≥5Ω-F

15.

High

Temperature

Load

(Endurance)

* Test temp.: X7R: 125±3°C

* To apply voltage:

(1) V<500V: 200% of rated voltage.

(2) 500V: 150% of rated voltage.

* Test time: 1000+24/-0 hrs.

*Before initial measurement (Class II only): To apply test

voltage for 1hr at test temp. and then set for 24±2

hrs at room

temp.

*Measurement to be made after keeping at room temp. for 24

±2 hrs

* No remarkable damage.

* Cap change: within ±12.5%

* Q/D.F. value: D.F. ≤3.0%

* I.R.: ≥1GΩ or RxC≥50Ω-F whichever is smaller.

X7R=100V: RxC≥10Ω-F

Approval sheet

Open Mode Series

Page 8 of 10 ASC_ Open Mode_012O_AS Oct. 2012

APPENDIXES

◙ Tape & reel dimensions

Size 0805 1206 1210 1812

Thickness

B C, D, I B C, D G C, D G D, K, M

A

0

1.50±0.10

<1.57 2.00±0.10

<1.85 <1.95 <2.97 <2.97 <3.81

B

0

2.30±0.10

<2.40 3.50±0.10

<3.46 <3.67 <3.73 <3.73 <5.30

T 0.95±0.05

0.23±0.05

0.95±0.05

0.23±0.05

0.25±0.05

K

0

- <2.50 - <2.50 <2.50 <2.50 <2.50 <2.50

W 8.00±0.10

8.00±0.10

12.0±0.20

P

0

4.00±0.10

4.00±0.100

4.00±0.10

10xP

0

40.0±0.10

P

1

4.00±0.10

8.00±0.10

P

2

2.00±0.05

D

0

1.55±0.05

1.50±0.05

D

1

- 1.00±0.10

1.00±0.10

1.50±0.10

E 1.75±0.05

1.75±0.10

F 3.50±0.05

3.50±0.05

5.50±0.05

Fig. 6 The dimension of plastic tape

Fig. 7 The dimension of reel

Fig. 5 The dimension of paper tape

Size 0603, 0805, 1206, 1210 1808, 1812

Reel size

7” 10” 13” 7”

C 13.0+0.5/-0.2 13.0+0.5/-0.2 13.0+0.5/-0.2 13.0+0.5/-0.2

W

1

8.4+1.5/-0 8.4+1.5/-0 8.4+1.5/-0 12.4+2.0/-0

A 178.0±0.10 250.0±1.0 330.0±1.0 178.0±0.10

N 60.0+1/-0 100.0±1.0 100±1.0 60.0+1/-0

Approval sheet

Open Mode Series

Page 9 of 10 ASC_ Open Mode_012O_AS Oct. 2012

◙ Description of customer label

◙ Constructions

◙ Storage and handling conditions

(1) To store products at 5 to 40°C ambient temperature and 20 to 70%. related humidity conditions.

(2) The product is recommended to be used within one year after shipment. Check solderability in case of shelf life

extension is needed.

Cautions: a. The corrosive gas reacts on the terminal electrodes of capacitors, and results in the poor solderability.

Do not store the capacitors in the ambience of corrosive gas (e.g., hydrogen sulfide, sulfur dioxide,

chlorine, ammonia gas etc.)

b. In corrosive atmosphere, solderability might be degraded, and silver migration might occur to cause low

reliability.

c. Due to the dewing by rapid humidity change, or the photochemical change of the terminal electrode by

direct sunlight,the solderability and electrical performance may deteriorate. Do not store capacitors under

direct sunlight or dewing condition. To store products on the shelf and avoid exposure to moisture.

.

Fig. 8 The construction of MLCC

a. Customer name

b. WTC order series and item number

c. Customer P/O

d. Customer P/N

e. Description of product

f. Quantity

g. Bar code including quantity & WTC P/N or customer

h. WTC P/N

i. Shipping date

j. Order bar code including series and item numbers

k. Serial number of label

No.

Name X7R

1

Ceramic material BaTiO

3

based

2

Inner electrode Ni

3

Inner layer Cu

4

Middle layer Ni

5

Termination

Outer layer Sn (Matt)

Approval sheet

Open Mode Series

Page 10 of 10 ASC_ Open Mode_012O_AS Oct. 2012

◙ Recommended soldering conditions

The lead-free termination MLCCs are not only to be used on SMT against lead-free solder paste, but also suitable

against lead-containing solder paste. If the optimized solder joint is requested, increasing soldering time, temperature and

concentration of N

2

within oven are recommended.

Fig. 9 Recommended reflow soldering profile for SMT process

with SnAgCu series solder paste.

4℃

℃℃

℃/ sec max

Over 60sec at least by

natural cooling

4℃

℃℃

℃/ sec max

Over 60sec at least by

natural cooling

Fig. 10 Recommended wave soldering profile for SMT process

with SnAgCu series solder.