SURFACE MOUNT DISPLAY APSC03-41EWW HIGH EFFICIENCY RED Features Description !0.3 The High Efficiency Red source color devices are made INCH DIGIT HEIGHT. !LOW CURRENT OPERATION. !EXCELLENT CHARACTER APPEARANCE. with Gallium Arsenide Phosphide on Gallium Phosphide Orange Light Emitting Diode. !I.C. COMPATIBLE. !MECHANICALLY !WHITE RUGGED. FACE,WHITE SEGMENT. !PACKAGE:1100PCS/REEL. Package Dimensions& Internal Circuit Diagram Notes: 1. All dimensions are in millimeters (inches). 2. Tolerance is 0.25(0.01") unless otherwise noted. 3. Lead spacing is measured where the lead emerge package. 4. Specifications are subject to change without notice. SPEC NO: DSAB0115 APPROVED : J. Lu REV NO: V.2 CHECKED :Joe Lee DATE: APR/17/2002 DRAWN:Y.G PAGE: 1 OF 5 Selection Guide P ar t N o . Dic e APSC03-41EWW Iv (m c d ) @ 10 m A L en s Ty p e HIGH EFFICIENCY RED (GaAsP/GaP) WHITE DIFFUSED Min . Ty p . 1.9 4.21 D es c r i p t i o n Common Cathode, Rt. Hand Decimal Electrical / Optical Characteristics at TA=25C Sy m b o l P ar am et er peak Peak Wavelength High Efficiency Red D Dominate Wavelength High Efficiency Red 1/2 D ev i c e Spectral Line Half-width High Efficiency Red Ty p . Un its Tes t Co n d it io n s 627 nm IF=20mA 625 nm IF=20mA 45 nm IF=20mA pF VF=0V;f=1MHz 2.5 V IF=20mA 10 uA V R = 5V C Capacitance High Efficiency Red 15 VF Forward Voltage High Efficiency Red 2.0 IR Reverse Current High Efficiency Red Max . Absolute Maximum Ratings at TA=25C P ar am et er H i g h E f f i c i en c y R ed Un its Power dissipation 105 mW DC Forward Current 30 mA Peak Forward Current [1] 160 mA Reverse Voltage 5 V Operating/Storage Temperature -40C To +85C Note: 1. 1/10 Duty Cycle, 0.1ms Pulse Width. SPEC NO: DSAB0115 APPROVED : J. Lu REV NO: V.2 CHECKED :Joe Lee DATE: APR/17/2002 DRAWN:Y.G PAGE: 2 OF 5 High Efficiency Red SPEC NO: DSAB0115 APPROVED : J. Lu APSC03-41EWW REV NO: V.2 CHECKED :Joe Lee DATE: APR/17/2002 DRAWN:Y.G PAGE: 3 OF 5 APSC03-41EWW SMT Reflow Soldering Instruction Number of reflow process shall be less than 2 times and cooling process to normal temperature is required between first and second soldering process. Recommended Soldering Pattern (Units : mm) SPEC NO: DSAB0115 APPROVED : J. Lu REV NO: V.2 CHECKED :Joe Lee DATE: APR/17/2002 DRAWN:Y.G PAGE: 4 OF 5 Tape Specification (Units : mm) SPEC NO: DSAB0115 APPROVED : J. Lu REV NO: V.2 CHECKED :Joe Lee DATE: APR/17/2002 DRAWN:Y.G PAGE: 5 OF 5