RoHS Recast Compliant
M.2 2260 Flash Drive
H200-M Product Specifications
March 6, 2015
Version 1.0
Apacer Technology Inc.
1F, No.32, Zhongcheng Rd., Tucheng Dist., New Taipei City, Taiwan, R.O.C
Tel: +886-2-2267-8000 Fax: +886-2-2267-2261
www.apacer.com
M.2 2260 Flash Drive
APM2T60H200xxxxAN-xTMx
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© 2015 Apacer Technology Inc. Rev. 1.0
Features:
Standard SATA Interface Compliance
– Serial ATA Revision 3.1 compliance
– SATA 6.0 Gbps interface
– ATA-8 command set
Capacities
– 64, 128, 256, 512 GB
Performance*
– Interface burst read/write: 600 MB/sec
– Sustained read: up to 520 MB/sec
– Sustained write: up to 380 MB/sec
Flash Management
– Built-in hardware ECC, enabling up to 72
bit correction per 1K bytes
– Static/dynamic wear-leveling
– Flash bad-block management
– S.M.A.R.T.
– Power Failure Management
– ATA Secure Erase
– TRIM
NAND Flash Type: MLC
Temperature ranges
– Operating:
Standard: 0°C to 70°C
Extended: -40°C to +85°C
– Storage: -40°C to 85°C
Supply voltage
– 3.3 V ± 5%
Power consumption (typical)*
– Active mode: 2,250 mW
– Idle mode: 250 mW
Connector type
– 75-pin SATA-based M.2 module pinout
Form factor
– M.2 2260 form factor
– Dimensions: 60.00x 22.00x3.88, unit: mm
Shock & Vibration***
– Shock:1500 G
– Vibration: 15 G
MTBF: >1,000,000 hours
RoHS Recast compliant (complies with
2011/65/EU standard)
*Varies from capacities. The values for performances and power consumptions presented are typical and may vary depending on flash configurations
or platform settings. The term idle refers to the standby state of the device.
**Non-operating
M.2 2260 Flash Drive
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© 2015 Apacer Technology Inc. Rev. 1.0
Table of Contents
1. GENERAL DESCRIPTION .................................................................................................... 3
2. PIN ASSIGNMENTS ............................................................................................................... 3
3. PRODUCT SPECIFICATIONS .............................................................................................. 6
3.1 CAPACITY ............................................................................................................................................................. 6
3.2 PERFORMANCE ..................................................................................................................................................... 6
3.3 ENVIRONMENTAL SPECIFICATIONS ....................................................................................................................... 7
3.4 MEAN TIME BETWEEN FAILURES (MTBF) ........................................................................................................... 7
3.5 CERTIFICATION AND COMPLIANCE ....................................................................................................................... 7
4. FLASH MANAGEMENT ....................................................................................................... 8
4.1 ERROR CORRECTION/DETECTION ......................................................................................................................... 8
4.2 BAD BLOCK MANAGEMENT ................................................................................................................................. 8
4.3 WEAR LEVELING .................................................................................................................................................. 8
4.4 POWER FAILURE MANAGEMENT ........................................................................................................................... 8
4.5 ATA SECURE ERASE ............................................................................................................................................ 9
4.6 TRIM ................................................................................................................................................................... 9
4.7 SATA POWER MANAGEMENT .............................................................................................................................. 9
5. SOFTWARE INTERFACE .................................................................................................. 10
5.1 COMMAND SET ................................................................................................................................................... 10
5.2 S.M.A.R.T. ......................................................................................................................................................... 11
6. ELECTRICAL SPECIFICATION ...................................................................................... 12
7. MECHANICAL SPECIFICATIONS .................................................................................. 13
8. PRODUCT ORDERING INFORMATION ........................................................................ 14
M.2 2260 Flash Drive
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© 2015 Apacer Technology Inc. Rev. 1.0
1.General Description
Apacer’s H200-M is the next generation modularized Solid State Drive (SSD) with the shape of all new
M.2 form factor, aimed to be the more suitable for mobile and compact computers with standard width at
only 22.00 mm. H200-M appears in M.2 2260 mechanical dimensions and is believed to be the leading
add-in storage solution for future host computing systems.
The M.2 SSD is designed with SATA-based connector pinouts, providing full compliance with the latest
SATA Revision 3.1 interface specifications. Aside from SATA compliance, H200-M delivers exceptional
performance and power efficiency. On the other hand, the extreme thin and light form factor makes H200-
M the ideal choice for mobile computing systems, which appears to be the trend in near future.
Regarding reliability, H200-M is built with a powerful SATA controller that supports on-the-module ECC as
well as efficient wear leveling scheme. In terms of power efficiency, H200-M is compliant with SATA 6.0
Gbps interface standard so that it can operate on SATA power management modes, which greatly save
on power consumption.
2. Pin Assignments
This connector does not support hot plug capability. There are a total of 75 pins. 12 pin locations are used
for mechanical key locations; this allows such a module to plug into both Key B and Key M connectors.
Pin
Type
Description
1
CONFIG_3
Ground (according to M.2 configurations for SSD-SATA definition)
2
3.3V
Supply Pin, 3.3V
3
GND
Ground
4
3.3V
Supply pin, 3.3V
5
No connect
No connect
6
Not available
No connect (used for other purposes)
7
Not available
No connect (used for other purposes)
8
Not available
No connect (used for other purposes)
9
No connect
No connect
10
DAS/DSS
Device Activity Signal/Disable Staggered Spin-up
Notch B
Notch M
Pin1
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11
No connect
No connect (used for other purposes)
12
Module key
13
Module key
14
Module key
15
Module key
16
Module key
17
Module key
18
Module key
19
Module key
20
Not available
No connect (used for other purposes)
21
CONFIG_0
Ground (according to M.2 configurations for SSD-SATA definition)
22
Not available
No connect (used for other purposes)
23
Not available
No connect (used for other purposes)
24
Not available
No connect (used for other purposes)
25
Not available
No connect (used for other purposes)
26
Not available
No connect (used for other purposes)
27
GND
Ground
28
Not available
No connect (used for other purposes)
29
Not available
No connect
30
Not available
No connect (used for other purposes)
31
Not available
No connect
32
Not available
No connect (used for other purposes)
33
GND
Ground
34
Not available
No connect (used for other purposes)
35
Not available
No connect
36
Not available
No connect (used for other purposes)
37
Not available
No connect
38
Not available
No connect
39
GND
Ground
40
Not available
No connect (used for other purposes)
41
SATA-Rx+
Host receiver differential signal pair
42
Not available
No connect (used for other purposes)
43
SATA-Rx-
Host receiver differential signal pair
44
Not available
No connect (used for other purposes)
45
GND
Ground
46
Not available
No connect (used for other purposes)
47
SATA-Tx-
Host transmitter differential pair
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© 2015 Apacer Technology Inc. Rev. 1.0
48
Not available
No connect (used for other purposes)
49
SATA-Tx+
Host transmitter differential pair
50
Not available
No connect
51
GND
Ground
52
Not available
Not used
53
Not available
Not used
54
Not available
Not used
55
Not available
Not used
56
Reserved for MFG
Data
Manufacturing Data line. Used for SSD manufacturing only. Not used
in normal operation. Pins should be left N/C in platform Socket.
57
GND
Ground
58
Reserved for MFG
clock
Manufacturing Clock line. Used for SSD manufacturing only. Not used
in normal operation. Pins should be left N/C in platform Socket
59
Module key
60
Module key
61
Module key
62
Module key
63
Module key
64
Module key
65
Module key
66
Module key
67
Not available
No connect (used for other purposes)
68
SUSCLK
32 kHz clock supply input that is provided by PCH to reduce power
and cost for the module
69
CONFIG_1
Defines module type
70
3.3V
Supply pin, 3.3V
71
GND
Ground
72
3.3V
Supply pin, 3.3V
73
GND
Ground
74
3.3V
Supply pin, 3.3V
75
CONFIG_2
Ground
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© 2015 Apacer Technology Inc. Rev. 1.0
3. Product Specifications
3.1 Capacity
Capacity specification of H200-M is available as shown in Table 3-1. It lists the specific capacity and the
default numbers of heads, sectors and cylinders for each product line.
Table 3-1: Capacity specifications
Capacity
Total Bytes
Cylinders
Heads
Sectors
Max LBA
64 GB
64,023,257,088
16,383
16
63
125,045,424
128 GB
128,035,676,160
16,383
16
63
250,069,680
256 GB
256,060,514,304
16,383
16
63
500,118,192
512 GB
512,110,190,592
16,383
16
63
1,000,215,216
*Display of total bytes varies from file systems, which means not all of the bytes can be used for storage.
**Notes: 1 GB = 1,000,000,000 bytes; 1 sector = 512 bytes.
LBA count addressed in the table above indicates total user storage capacity and will remain the same throughout the lifespan of the
device. However, the total usable capacity of the SSD is most likely to be less than the total physical capacity because a small portion
of the capacity is reserved for device maintenance usages.
3.2 Performance
Performances of H200-M are listed below in table 3-2.
Table 3-2: Performance
Capacity
Performance
64 GB
128 GB
256 GB
512 GB
Sustained read (MB/s)
520
520
520
520
Sustained write (MB/s)
190
350
370
380
Note: Results were measured by CrystalDiskMark benchmark and may differ from various flash
configurations or host system setting
M.2 2260 Flash Drive
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© 2015 Apacer Technology Inc. Rev. 1.0
3.3 Environmental Specifications
Environmental specification of H200-M series follows MIL-STD-810 standards as shown in Table 3-3.
Table 3-3 H200-M environmental specifications
Item
Specification
Operating temperature
0℃~70℃(standard) ; -40℃~85℃(extended) ;
Non-operating temperature
-40℃~85℃
Operating humidity
40℃, 90%RH
Non-operating humidity
40℃, 93%RH
Vibration (Non-operating)
Frequency/Displacement: 20Hz~80Hz/1.52mm
Frequency/Acceleration: 80Hz~2000Hz/20G
X, Y, Z axis/30mins
shock (Non-operating)
500G, 2ms
Drop (Non-operating)
110cm free fall, 6 face of each unit
Bending (non-operating)
≧10N, hold 1min/5times
Torque (non-operating)
0.5N-m or 5 deg, hold 5min/5times
ESD (Electrostatic)
Passed (at relative temp/humidity: 24℃, 49%RH)
3.4 Mean Time Between Failures (MTBF)
Mean Time Between Failures (MTBF) is predicted based on reliability data for the individual components
in H200-M. The prediction result for H200-M is more than 1,000,000 hours.
Notes about the MTBF:
The MTBF is predicated and calculated based on “Telcordia Technologies Special Report, SR-332, Issue
2” method.
3.5 Certification and Compliance
H200-M complies with the following standards:
CE
FCC
BSMI
RoHS Recast
M.2 2260 Flash Drive
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© 2015 Apacer Technology Inc. Rev. 1.0
4. Flash Management
4.1 Error Correction/Detection
H200-M implements a hardware ECC scheme, based on the BCH algorithm. It can detect and correct up
to 72 bits error in 1K bytes.
4.2 Bad Block Management
Bad blocks are blocks that include one or more invalid bits, and their reliability is not guaranteed. Blocks
that are identified and marked as bad by the manufacturer are referred to as “Initial Bad Blocks”. Bad
blocks that are developed during the lifespan of the flash are named “Later Bad Blocks”. Apacer
implements an efficient bad block management algorithm to detect the factory-produced bad blocks and
manages any bad blocks that appear with use. This practice further prevents data being stored into bad
blocks and improves the data reliability.
4.3 Wear Leveling
NAND flash devices can only undergo a limited number of program/erase cycles, and in most cases, the
flash media are not used evenly. If some areas get updated more frequently than others, the lifetime of
the device would be reduced significantly. Thus, Wear Leveling is applied to extend the lifespan of NAND
flash by evenly distributing write and erase cycles across the media.
Apacer provides advanced Wear Leveling algorithm, which can efficiently spread out the flash usage
through the whole flash media area. Moreover, by implementing both dynamic and static Wear Leveling
algorithms, the life expectancy of the NAND flash is greatly improved.
4.4 Power Failure Management
Power Failure Management is a mechanism to prevent data loss during unexpected power failure. DRAM
is a volatile memory and frequently used as temporary cache or buffer between the controller and the
NAND flash to improve the SSD performance. However, one major concern of the DRAM is that it is not
able to keep data during power failure. Accordingly, H200-M applies the flush mechanism, which requests
the controller to transfer data to the cache. For H200-M, DDR performs as a cache. Only when the data is
fully committed to the NAND flash will the controller send acknowledgement (ACK) to the host. Such
implementation can prevent false-positive performance and the risk of power cycling issues.
Additionally, it is critical for a controller to shorten the time the in-flight data stays in the cache. Thus,
H200-M applies an algorithm to reduce the amount of data resides in the cache to provide a better
performance. This algorithm allows incoming data to only have a “pit stop” in the cache and then move to
the NAND flash at once. If the flash is jammed due to particular file sizes (such as random 4KB data), the
cache will be treated as an “organizer”, consolidating incoming data into groups before written into the
flash to improve write amplification.
In sum, Power Failure Management proves to provide the reliability required by consumer, industrial, and
enterprise-level applications.
M.2 2260 Flash Drive
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© 2015 Apacer Technology Inc. Rev. 1.0
4.5 ATA Secure Erase
ATA Secure Erase is a standard ATA command and will write all “0xFF” to fully wipe all the data on hard
drives and SSDs. When this command is issued, the SSD controller will empty its storage blocks and
return to its factory default settings.
4.6 TRIM
TRIM is a feature which helps improve the read/write performance and speed of solid-state drives (SSD).
Unlike hard disk drives (HDD), SSDs are not able to overwrite existing data, so the available space
gradually becomes smaller with each use. With the TRIM command, the operating system can inform the
SSD which blocks of data are no longer in use and can be removed permanently. Thus, the SSD will
perform the erase action, which prevents unused data from occupying blocks all the time.
4.7 SATA Power Management
By complying with SATA 6.0 Gb/s specifications, the SSD supports the following SATA power saving
modes:
ACTIVE: PHY ready, full power, Tx & Rx operational
PARTIAL: Reduces power, resumes in under 10 µs (microseconds)
SLUMBER: Reduces power, resumes in under 10 ms (milliseconds)
HIPM: Host-Initiated Power Management
DIPM: Device-Initiated Power Management
Note:
1. The behaviors of power management features would depend on host/device settings.
M.2 2260 Flash Drive
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© 2015 Apacer Technology Inc. Rev. 1.0
5. Software Interface
5.1 Command Set
Table 5-1: Command set
Command
Code
Command
Code
CHECK Power Mode
E5h
Security Disable Password
F6h
Data Set Management
06h
Security Erase Prepare
F3h
DCO
B1h
Security Erase Unit
F4h
Download Microcode PIO
92h
Security Freeze Lock
F5h
Download Microcode DMA
93h
Security Set Password
F1h
Execute Drive Diagnostic
90h
Security Unlock
F2h
Flush Cache
E7h
Seek
70h
Flush Cache Ext
Eah
Set Features
Efh
Identify Device
Ech
Set Max Address
F9h
Idle
E3h
Set Max Address Ext
37h
Idle Immediate
E1h
Set Multiple Mode
C6h
Initialize Drive Parameters
91h
Sleep
E6h
Read Buffer
E4h
SMART
B0h
Read DMA (W/O retry)
C9h
Standby
E2h
Read DMA (W/ retry)
C8h
Standby Immediate
E0h
Read DMA Ext
25h
Write Buffer
E8h
Read FPDMA Queued
60h
Write DMA (W/O retry)
CBh
Read Log Ext
2Fh
Write DMA (W/ retry)
Cah
Read Multiple
C4h
Write DMA Ext
35h
Read Multiple Ext
29h
Write DMA FUA Ext
3Dh
Read Native Max Address
F8h
Write FPDMA Queued
61h
Read Native Max Ext
27h
Write Log Ext
3Fh
Read Sector(s) (W/O retry)
21h
Write Multiple
C5h
Read Sector(s) (W/ retry)
20h
Write Multiple Ext
39h
Read Sector(s) Ext
24h
Write Multiple FUA Ext
Ceh
Read Verify Ext
42h
Write Sector(s) (W/O retry)
31h
Read Verify Sector(s) (W/O retry)
41h
Write Sector(s) (W/ retry)
30h
Read Verify sector(s) (W/ retry)
40h
Write Sector(s) Ext
34h
Recalibrate
10h
Write Uncorrectable
45h
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© 2015 Apacer Technology Inc. Rev. 1.0
5.2 S.M.A.R.T.
SMART, an acronym for Self-Monitoring, Analysis and Reporting Technology, is an open standard that
allows a hard disk drive to automatically detect its health and report potential failures. When a failure is
recorded by SMART, users can choose to replace the drive to prevent unexpected outage or data loss.
Moreover, SMART can inform users of impending failures while there is still time to perform proactive
actions, such as copy data to another device.
M.2 2260 Flash Drive
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© 2015 Apacer Technology Inc. Rev. 1.0
6. Electrical Specification
Table 6-1: Operating range
Supply Voltage
3.3V±5% (3.135-3.465V)
Table 6-2: Typical power consumption
Capacity
Modes
64 GB
128 GB
256 GB
512 GB
Active (mW)
1485
1620
1630
2250
Idle (mW)
220
230
250
250
Note: Results may differ from various flash configurations or host system setting
M.2 2260 Flash Drive
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© 2015 Apacer Technology Inc. Rev. 1.0
7. Mechanical Specifications
Unit: ㎜
Tolerance: ± 0.25
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© 2015 Apacer Technology Inc. Rev. 1.0
8. Product Ordering Information
8.1 Product Code Designations
A P M2 T60 H200 x x x x AN – x TM x
Flash Type
M.2
Apacer Product Code
Form Factor
Solution version
Capacities:
64G= 64GB
128G = 128GB
256G= 256GB
512G= 512GB
Version Control
Blank: Standard
W: Extended
Apacer Brand
M.2 2260 Flash Drive
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© 2015 Apacer Technology Inc. Rev. 1.0
8.2 Valid Combinations
Capacity
Standard
Extended
64GB
APM2T60H200064GAN-3TM
APM2T60H200064GAN-3TMW
128GB
APM2T60H200128GAN-3TM
APM2T60H200128GAN-3TMW
256GB
APM2T60H200256GAN-3TM
APM2T60H200256GAN-3TMW
512GB
APM2T60H200512GAN-3TM
APM2T60H200512GAN-3TMW
Note: Valid combinations are those products in mass production or will be in mass production. Consult
your Apacer sales representative to confirm availability of valid combinations and to determine availability
of new combinations.
M.2 2260 Flash Drive
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© 2015 Apacer Technology Inc. Rev. 1.0
Revision History
Revision
Date
Description
Remark
1.0
03/06/2015
Official release
M.2 2260 Flash Drive
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© 2015 Apacer Technology Inc. Rev. 1.0
Global Presence
Taiwan (Headquarters)
Apacer Technology Inc.
Apacer Technology Inc.
1F., No.32, Zhongcheng Rd., Tucheng Dist.,
New Taipei City 236, Taiwan R.O.C.
Tel: 886-2-2267-8000
Fax: 886-2-2267-2261
amtsales@apacer.com
U.S.A.
Apacer Memory America, Inc.
386 Fairview Way, Suite102,
Milpitas, CA 95035
Tel: 1-408-518-8699
Fax: 1-408-935-9611
sa@apacerus.com
Japan
Apacer Technology Corp.
5F, Matsura Bldg., Shiba, Minato-Ku
Tokyo, 105-0014, Japan
Tel: 81-3-5419-2668
Fax: 81-3-5419-0018
jpservices@apacer.com
Europe
Apacer Technology B.V.
Science Park Eindhoven 5051 5692 EB Son,
The Netherlands
Tel: 31-40-267-0000
Fax: 31-40-267-0000#6199
sales@apacer.nl
China
Apacer Electronic (Shanghai) Co., Ltd
1301, No.251,Xiaomuqiao Road, Shanghai,
200032, China
Tel: 86-21-5529-0222
Fax: 86-21-5206-6939
sales@apacer.com.cn
India
Apacer Technologies Pvt Ltd,
# 535, 1st Floor, 8th cross, JP Nagar 3rd Phase,
Bangalore – 560078, India
Tel: 91-80-4152-9061
sales_india@apacer.com
