Order Number: 317116, Revision: 001US
25-April-2007
Intel® TXN31111D1 Tri-Rate 850 nm Optical
Transceiver - SFP* MSA Compatible
Datasheet
The Intel® LC Small Form F actor Pluggable (SFP) optical transceivers are high-performance integrated
modules for bi-directional communication over Multimode optical fiber.
The Intel® TXN31111D1 Tri-Rate 850 nm Optical Transceiver (called hereafter the TXN31111D1
Optical Transceiver) is specifically designed for high-speed Fibre Channel data links at 2.125 Gbps, 1x
Fibre Channel and Gigabit Ethernet rates.
The TXN31111D1 Optical Transceiver has an LC receptacle compatible with the industry-standard LC
connector. The TXN31111D1 Optical Transceiver is Class 1 laser safety compliant with FDA Radiation
Pe rform an ce Stand ard s , 21 CF R 1040. 10 , and international standards IEC 60825-1 and IEC 60825-2.
Product Features
Applications
Compliant with the Fibre Channel FC-PI
Standard
2.125/1.0625 Gbps Fibre Channel and 1.25
Gbps Ethernet Compliant
Compatible with the SFP Multisource
Agreement (MSA) Specification
Hot pluggable
850 nm VCSEL emitter
TTL Loss of Signal (LOS) Output
Transmitter Disable Input
AC-coupled CML Level Input/Output
Single +3.3 V Power Supply
Class 1 Laser Safety Product
IEC/UL 60950-1 Safety Certified
Designed and verified as RoHS compliant
China RoHS compliant with 30-year EFUP
Digital Diagnostics Support
Fibre Channel Switch 1 GbE Ethernet Switch
Intel® TXN31111D1 Tri-Rate 850 nm Optical Transceiver - SFP* MSA Compatible
Datasheet 25-April-2007
2Order Number: 317116, Revision: 001US
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The Intel® TXN31111D1 Tri-Rate 850 nm Optical Transceiver - SFP* MSA Compatible may contain design defects or errors known as errata which may
cause the product to deviate from published specifications. Current characterized errata are available on request.Contac t your local Intel sales office or
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*Other names and brands may be claimed as the property of others.
Copyright © 2007, Intel Corporation. All Rights Reserved.
Intel® TXN31111D1 Tri-Rate 850 nm Optical Transceiver - SFP* MSA Compatible
25-April-2007 Datasheet
Order Number: 317116, Revision: 001US 3
Intel® TXN31111D1 Tri-Rate 850 nm Optical Transceiver - SFP* MSA Compatible
Contents
1.0 Introduction..............................................................................................................7
2.0 Specifications ............................................................................................................8
2.1 Maximum Ratings and Recommended Operating Conditions ......................................8
2.2 Electrical Characteristics.......................................................................................9
3.0 Electrical Interface..................................................................................................12
4.0 Termination.............................................................................................................14
4.1 Types of I/O Interfaces ......................................................................................14
4.2 CML Termination...............................................................................................14
5.0 SFP Timing Parameters ...........................................................................................16
6.0 Digital Diagnostic Monitoring Interface ...................................................................17
6.1 Overview of Digital Diagnostic Monitoring Interface................................................17
6.2 General Memory Map Descriptions.......................................................................18
6.3 Alarm and Warning Fields for 2-Wire Interface Address A2h....................................19
6.4 A/D Fields for 2-Wire Interface Address A2h..........................................................21
7.0 Mechanical Specification..........................................................................................22
8.0 Regulatory Compliance............................................................................................23
8.1 Electromagnetic Compatibility Compliance ............................................................23
8.2 Safety Compliance.............................................................................................24
8.3 Lead-Free Conf ormance ................ .. ............ ............. ............. ............ .................25
8.4 Compliance with Restriction of Hazardous Substances (RoHS) .................................25
8.5 Management Methods on Control of Pollution from Electronic Information Products
(a.k.a. China RoHS)...........................................................................................26
8.6 Product Certification Markings and Compliance Statements.....................................27
9.0 Ordering Information ..............................................................................................28
10.0 Acronyms ................................................................................................................29
Figures
1 Electrical Interface Pin Numbers and Names ................................................................12
2 Circuit Diagram for CML Termination on Receiver Output...............................................14
3 Circuit Diagram for CML Termination on Transmitter Input.............................................15
4 SFP Mechanical Specifications....................................................................................22
Intel® TXN31111D1 Tri-Rate 850 nm Optical Transceiver - SFP* MSA Compatible
Intel® TXN31111D1 Tri-Rate 850 nm Optical Transceiver - SFP* MSA Compatible
Datasheet 25-April-2007
4Order Number: 317116, Revision: 001US
Tables
1 Absolute Maxim um Ratings............ .. ... ............ ....................... ............. ............. ........... 8
2 Recommended Ope rating C ond itions.................. .. .. ... ............ ............. ............. .. ........... 8
3 Electrical Characteristics – Power and Current ............................................................... 9
4 Electrical Characteristics – Transmitter......................................................................... 9
5 Electrical Characteristics – Receiver ............................................................................10
6 Electrical Characteristics – 2-Wire Interface .................................................................10
7 Fiber Length Specifications ............ .. ............. ............. ............ ........................ ............10
8 Optical Specifications – Transmitter ............................................................................11
9 Optical Specifications – Receiver.................................................................................11
10 Plug Sequence: Pin Engagement Sequence during Hot Plugging......................................12
11 Timing Parameters for SFP Management......................................................................16
12 Memory Map – 2-Wire Addr ess Ran ge De scrip tions ................... .. ............. .. ............. .. ....18
13 Alarm and Warning Fields – 2-Wire Address A2h, Address 0-95 ......................................19
14 A/D Fields – 2-Wire Address A2h, Addresses 96-109 .....................................................21
15 A/D Status/Control Bits – 2-Wire Address A2h, Address 110...........................................21
16 Electromagnetic Compatibility Compliance ..................................................................23
17 Safety Compliance....................................................................................................24
18 Lead-Free 2nd-Level Interconnect Markings..................................................................25
19 Hazardous Substances Table......................................................................................26
20 Product Certification Markings and Compliance Statements ............................................27
21 Ordering Information ................................................................................................28
22 Acronyms................................................................................................................29
Intel® TXN31111D1 Tri-Rate 850 nm Optical Transceiver - SFP* MSA Compatible
25-April-2007 Datasheet
Order Number: 317116, Revision: 001US 5
Intel® TXN31111D1 Tri-Rate 850 nm Optical Transceiver - SFP* MSA Compatible
Revision History
§ §
Date Revision Description
18-April-2007 001 Initial release of document
Intel® TXN31111D1 Tri-Rate 850 nm Optical Transceiver - SFP* MSA Compatible
Intel® TXN31111D1 Tri-Rate 850 nm Optical Transceiver - SFP* MSA Compatible
Datasheet 25-April-2007
6Order Number: 317116, Revision: 001US
Intel® TXN31111D1 Tri-Rate 850 nm Optical Transceiver - SFP* MSA Compatible
25-April-2007 Datasheet
Order Number: 317116, Revision: 001US 7
Intel® TXN31111D1 Tri-Rate 850 nm Optical Transceiver - SFP* MSA Compatible
1.0 Introduction
The Intel® TXN31111D1 Tri-Rate 850 nm Optical Transceiver - SFP* MSA Compatible
(called hereafter the TXN31111D1 Optical Transceiver) is specifically designed for
high-speed Fibre Channel and Gigabit Ethernet links at up to 2.125 Gbps (2x Fibre
Channel rate).
This document discusses the following TXN31111D1 Optical Transceiver topics:
•Section 2.0, “Specifications” on page 8
•Section 3.0, “Electrical Interface” on page 12
•Section 4.0, “Termination” on page 14
•Section 5.0, “SFP Timing Parameters” on page 16
•Section 6.0, “Digital Diagnostic Monitoring Interface” on page 17
•Section 7.0, “Mechanical Specification” on page 22
•Section 8.0, “Regulatory Compliance” on page 23
•Section 9.0, “Ordering Information” on page 28
•Section 10.0, “Acronyms” on page 29
For information on standards that apply to the TXN31111D1 Optical Transceiver, see
the following references:
• “Diagnostic Monitoring Interface for Optical Xcvrs”. SFF Document Number
SFF-8472, Revision 9.3.
• IEEE Std 802.3, 2002 Edition, Clause 38, PMD Type 1000BASE-SX. IEEE Standards
Department, 2002
• IEEE Std 802.3z, 1998 Edition. Gigabit Interface Converter (GBIC) Ethernet
Standard.
• Small Form-Factor Pluggable (SFP) Transceiver Multisource Agreement (MSA)
• Telcordia Technologies* GR-63 Section 4.2
Intel® TXN31111D1 Tri-Rate 850 nm Optical Transceiver - SFP* MSA Compatible
Intel® TXN31111D1 Tri-Rate 850 nm Optical Transceiver - SFP* MSA Compatible
Datasheet 25-April-2007
8Order Number: 317116, Revision: 001US
2.0 Specifications
Specifications include the following:
•Section 2.1, “Maximum Ratings and Recommended Operating Conditions” on
page 8
•Section 2.2, “Electrical Characteristics” on page 9
•Section , “Table 5 lists the TXN31111D1 Optical Transceiver receiver electrical
characteristics. Table 6 lists the TXN31111D1 Optical Transceiver 2-Wire Interface
electrical characteristics. Optical Specifications” on page 10
2.1 Maximum Ratings and Recommended Operating
Conditions
Table 1 lists the absolute maximum ratings for the TXN31111D1 Optical Transceiver.
Table 2 lists the recommended operating conditions. (Minimum and maximum values
listed in Table 3 through Table 9 apply over the recommended operating conditions
specified in Table 2.)
Table 1. Absolute Maximum Ratings
Parameter Symbol Min Typ Max Units Notes
Storage Temperature Ts-40 – 85 °C –
Relative Humidity RH 5 – 95 % –
Supply Voltage VccT, R -0.5 – 4 V –
Data AC Voltage TD+ and TD- – – 2.2 Vpp Differential
Control Input Voltage Vi -0.5 – Vcc + 0.3 V –
Caution: Exceeding these values may cause permanent damage. Functional
operation under these conditions is not implied.
Table 2. Recommended Operating Conditions
Parameter Symbol Min Typ Max Units
Case Temperature Tc-20 – 85 °C
Supply Voltage VccT, R 2.97 3.3 3.63 VDC
Data Rate – 1.0625 – 2.125 Gbps
Intel® TXN31111D1 Tri-Rate 850 nm Optical Transceiver - SFP* MSA Compatible
25-April-2007 Datasheet
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Intel® TXN31111D1 Tri-Rate 850 nm Optical Transceiver - SFP* MSA Compatible
2.2 Electrical Characteristics
The minimum and maximum values in this section apply over the following
recommended temperature and voltage range (from Table 2, “Recommended Operating
Conditions” on page 8).
-20 °C < Tc < 85 °C, 3.0 V < Vcc < 3.6 V
Table 3 lists the TXN31111D1 Optical Transceiver electrical characteristics for power
and current.To be updated once "t otal current" info is availableTable 4 lists the
TXN31111D1 Optical Transceiver transmitter electrical characteristics.
Table 3. Electrical Characteristics – Power and Current
Parameter Symbol Min Typ Max Units Notes
Supply Current lcc –170 mA Tc = 20°C, Vcc = 3.3 V
– 220 mA –
Power Dissipation Pdiss – 570 800 mW –
Supply Noise Rejection – 100 – – mV 10 kHz to 4 MHz
with supply filter
Inrush Current – – – 30 mA
Hot plugging of the
TXN31111D1 Optical
Transceiver results in the
inrush current of no more
than 30 mA greater than the
steady state value.
Table 4. Electrical Characteristics – Transmitter
Parameter Symbol Min Typ Max Units Notes
CML Input (Single Ended) – 250 – 1100 mVpp AC coupled inputs
CML Input (Differential) – 500 – 2200 mVpp Peak-to-peak voltage
Input Impedance
(differential) ZIN 85 100 115 Ω–
TX_DISABLE input voltage -
High VIH 2–V
cc + 0.3 V –
TX_DISABLE input voltage -
Low VIL 0–0.6V–
TX_Fault Output Voltage -
High VOH 2.0 – Vcc +
0.3 VIOH = 40 µA,
1 TTL Unit Load
TX_Fault Output Voltage -
Low VOL 0–0.8V
IOL = -1.6 mA,
1 TTL Unit Load
Intel® TXN31111D1 Tri-Rate 850 nm Optical Transceiver - SFP* MSA Compatible
Intel® TXN31111D1 Tri-Rate 850 nm Optical Transceiver - SFP* MSA Compatible
Datasheet 25-April-2007
10 Order Number: 317116, Revision: 001US
Table 5 lists the TXN31111D1 Optical Transceiver receiver electrical characteristics.
Table 6 lists the TXN31111D1 Optical Transceiver 2-Wire Interface electrical
characteristics. Optical Specifications
Table 7 lists the TXN31111D1 Optical Transceiver fiber length specifications.
Table 8 lists the TXN31111D1 Optical Transceiver transmitter optical specifications.
Table 5. Electrical Characteristic s – Receiver
Parameter Symbol Min Typ Max Units Notes
CML Output (Single Ended) – 250 300 500 mVpp AC-coupled outputs
CML Output (Differential) – 500 600 1000 mVpp Peak-to-peak voltage
CML Output rise/fall time – – – 150 ps 20% - 80%
Output Impedan ce
(differential) Zout 85 100 115 Ω–
TTL LOS Output - Low – 0 – 0.8 V IOL = -1.6 mA,
1 TTL Unit Load
TTL LO S Output - High VOH 2.0 – VCC +
0.3 VIOL = 40 μA,
1 TTL Unit Load
Deterministic Jitter DJ 170 ps –
Total Jitter TJ – – 266 ps –
Table 6. Electrical Characteristics – 2-Wire Interface
Parameter Symbol Min Typ Max Units Notes
MOD_DEF (0:2)
VOH 2.5 – VCC +
0.3 VWith Serial ID
VOL 0–0.5V–
NC 100 K – – ΩMeasured to RGND/
TGND
Table 7. Fiber Length Specifications
Parameter Symbol Min Typ Max Units Notes
Data rate BR 1.0625,
1.25,
2.125 Gbps 1
Bit Error Rate BER 10-12 4
50 µm/125 µm MMF L 2 – 500
300 m2
3
62.5 µm/125 µm MMF L 2 – 300
150 m2
3
NOTES:
1. 1000BASE-SX compatible per IEEE802.3 and 1x and 2x Fibre Channel compatible per FC-PI-2
2. Data rates at 1000BASE-SX Gigabit Ethernet and 1.0625 Gbps
3. Data rates at 2.125 Gbps Fibre Channel.
4. Data rate at 2.125 Gbps with 27 - 1 PRBS pattern.
Intel® TXN31111D1 Tri-Rate 850 nm Optical Transceiver - SFP* MSA Compatible
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Intel® TXN31111D1 Tri-Rate 850 nm Optical Transceiver - SFP* MSA Compatible
Table 9 lists the TXN3 1111D1 Optical Transceiver receiver optical specifications.
Table 8. Optical Specifications – Transmitter
Parameter Symbol Min Typ Max Units Notes
Optical Transmit Power
(50 or 62.5 µm MMF) Popt -8 -5 -1.1 dBm Average launch power
Optical Center Wavelength 830 850 860 nm –
Spectral Width – – – 0.85 nm RMS
Optical Modulation Amplitude OMA 247 – – µW pk-pk
Relative Intensity Noise RIN – – -118 dB/Hz –
Deterministic Jitter DJ 80 ps –
Total Jitter TJ – – 227 ps –
Output Rise/Fall Time tR, tF – – 130 ps 20 - 80% values,
measured unfiltered
Eye Mask: Compliant with eye mask requirements of Fibre Channel – Physical Interfaces (FC-PI-2)
specifications, IEEE 802.3z* Gigabit Ethernet 1000 BASE-SX standard
Table 9. Optical Specifications – Receiver
Parameter Symbol Min Typ Max Units Notes
Optical Input
Wavelength – 770 – 860 nm –
Receiver Sensitivity Pr -18 -20 – dBm
1.0625, 1.25, and 2.125 Gbps
Test conditions:
•10
-12 BER
• 9 dB ER input
•2
7 - 1 PRBS
Stressed Sensitivity Compliant with Fibre Channel – Physical Interfaces (FC-PI-2) specifications, IEEE
802.3z Gigabit Ethernet 1000 BASE-SX standard
Receiver Overload – – – 0 dBm –
Optical Return Loss ORL 12 – – dB –
LOS - Asserted Pa -29 – – dB Measured on transition -
low to high
LOS - De-asserted Pd – – -17 dBm Measured on transition -
high to low
LOS - Hysteresis Pa - Pd 1 – 5 dB –
Intel® TXN31111D1 Tri-Rate 850 nm Optical Transceiver - SFP* MSA Compatible
Intel® TXN31111D1 Tri-Rate 850 nm Optical Transceiver - SFP* MSA Compatible
Datasheet 25-April-2007
12 Order Number: 317116, Revision: 001US
3.0 Electrical Interface
Figure 1 shows the TXN31111D1 Optical Transceiver electrical interface pin numbers
and names.
Table 10 lists the plug sequence to follow during hot plugging, as well as pin functions.
Figure 1. Electrical Interface Pin Numbers and Names
B3242-01
Table 10. Plug Sequence: Pin Engagement Sequence during Hot Plugging (Sheet 1 of 2)
Pin
Number Pin Name Pin Function Plug
Sequence Notes
1V
eeT Transmitter Ground 1 –
2TX_FAULT Transmitter Fault
Indication 3Note 1
3 TX_DISABLE Transmitter Disable 3 Note 2: T ransmitter disables on high
or open
4 MOD_DEF (2) Module Definition 2 3 Note 3: Wire Serial ID interface
5 MOD_DEF (1) Module Definition 1 3 Note 3: Wire Serial ID interface
6 MOD_DEF (0) Module Definition 0 3 Note 3: Ground
7RATE SELECT– 3 Note 4
8LOS Loss of Signal 3 Note 5
9V
eeR Receiver Ground 1 –
10 VeeR Receiver Ground 1 –
11 VeeR Receiver Ground 1 –
Intel® TXN31111D1 Tri-Rate 850 nm Optical Transceiver - SFP* MSA Compatible
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Intel® TXN31111D1 Tri-Rate 850 nm Optical Transceiver - SFP* MSA Compatible
12 RD- Inverted Received Data
out 3Note 6
13 RD+ Non-Inverted Received
Data out 3Note 6
14 VeeR Receiver Ground 1 –
15 VccR Receiver Power 2 Note 7
16 VccT Transmitter Power 2 Note 7
17 VeeT Transmitter Ground 1 –
18 TD+ Non-inverted Data In 3 Note 8
19 TD- Inverted Data In 3 Note 8
20 VeeT Transmitter Ground 1 –
NOTES:
1. TX FAUL T is an open collector output that is pulled up with a 4.7 K - 10 K W resistor on the host board. Use
a pull-up voltage between 2.0 V and VccT, R+0.3 V.
• Low: Indicates normal operation. In the low state, the output is pulled to < 0.8 V.
• High: Indicates a laser fault.
2. TX DISABLE is an input used to shut down the transmitter optical output. It is pulled up within the
TXN31111D1 Optical Transceiver with a 4.7 K - 10 K W resistor. The states are as follows:
• Low (0 - 0.6 V): Transmitter Enabled
• (>0.8, <2.0 V): Un defined
• High (2.0 - 3.465 V): Transmitter Disabled
3. MOD-DEF 0, 1, 2: These pins are definition pins for the TXN31111D1 Optical Transceiver. They are pulled
up with a 4.7 K - 10 K W resistor on the host board. Use a pull-up voltage between 2.0 V and VccT,
R+0.3 V.
• MOD-DEF 0 is grounded by the TXN31111D1 Optical Transceiver to indicate the TXN31111D1 Optical
Transceiver is present.
• MOD-DEF 1 is the clock line of a two-wire serial interfac e for serial ID.
• MOD-DEF 2 is the data line of a two-wire serial interface for serial ID.
4. RATE SELECT: This signal function is not implemented in the TXN31111D1 Optical Transceiver. The
TXN31111D1 Optical Transceiver is rate agile – that is, it meets the specifications for 1.0625 Gbps to
2.125 Gbps data rates without the use of a rate-select pin.
5. LOS (Loss of Signal) is an open collector output that is pulled up with a 4.7K – 10KW resistor on the host
board.
• When low, this output indicates normal operation. In the low state, the output is pulled to < 0.8V.
• When high, this output indicates the received optical power is below the worst -case receiver s ensitivity
(as defined by the standard in use).
6. RD-/+ are the differential receiver outputs. They are AC-coupled 100 W differential lines that are
terminated with 100 W (differential) at the user SerDes. The AC coupling is performed inside the
TXN31111D1 Optical Transceiver and is therefore not required on the host board.
7. VccR and VccT are the receiver and transmitter power supplies. Their values, which are listed in Table 2,
“Recommended Operating Conditions” on page 8, are defined at the SFP connector pin. Maximum supply
current is listed in Table 3, “Electrical Characteristics – Power and Current” on page 9. Hot plugging of the
TXN31111D1 Optical Transceiver results in the inrush c urrent listed in Table 3, “Electrical Characteristics –
Power and Current” on page 9.
8. TD-/+ are the differential transmitter inputs. They are AC-coupled differential lines with 100 W differential
termination inside TXN31111D1 Optical Transceiver. The AC coupling is performed inside the TXN31111D1
Optical Transceiver and is therefore not required on the host board.
Table 10. Plug Sequence: Pin Engagement Sequence during Hot Plugging (Sheet 2 of 2)
Pin
Number Pin Name Pin Function Plug
Sequence Notes
Intel® TXN31111D1 Tri-Rate 850 nm Optical Transceiver - SFP* MSA Compatible
Intel® TXN31111D1 Tri-Rate 850 nm Optical Transceiver - SFP* MSA Compatible
Datasheet 25-April-2007
14 Order Number: 317116, Revision: 001US
4.0 Termination
4.1 Types of I/O Interfaces
The TXN31111D1 Optical Transceiver has the following types of I/O interfaces.
•CML interface
•TTL interface
High-speed I/Os use the CML interface, while control signals use the TTL interface.
Proper termination of I/Os is required for good signal integrity. If I/Os (particularly the
CML I/Os) are not terminated properly, then jitter increases significantly due to
reflection from impedance mismatches.
4.2 CML Termination
Figure 2 shows a circuit diagram for the CML termination for the TXN31111D1 Optical
Transceiver receiver output. The TXN31111D1 Optical Transceiver has built in AC-
coupling capacitors, which help prevent a direct current path from the TXN31111D1
Optical Transceiver power supply to the SerDes input. (A direct current path could
damage the ESD diodes on the SerDes.)
•Internal termination. For the TXN31111D1 Optical Transceiver receiver output,
the SerDes interface provides an internal termination resistor.
•External termination. For the proper external termination of the SerDes
interface, refer to the SerDes specification.
Figure 2. Circuit Diagram for CML Termination on Receiver Output
Receiver Outp u t SerDes Input
AC-coupling
capacitor
50 Ω
100 Ω
3.3 V
B3243-02
Intel® TXN31111D1 Tri-Rate 850 nm Optical Transceiver - SFP* MSA Compatible
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Intel® TXN31111D1 Tri-Rate 850 nm Optical Transceiver - SFP* MSA Compatible
Figure 3 shows a circuit diagram for the CML termination for the TXN31111D1 Optical
Transceiver transmitter input.
Internal termination. The TXN31111D1 Optical Transceiver transmitter input has an
internal 100 Ω termination between two inputs. AC-coupling capacitors are also built into
the TXN31111D1 Optical Transceiver.
Figure 3. Circuit Diagram for CML Termination on Transmitte r Input
Transmitter Input SerDes Outpu t
100 Ω
3.3 V
B3244-02
AC-Coupling
Capacitor
Intel® TXN31111D1 Tri-Rate 850 nm Optical Transceiver - SFP* MSA Compatible
Intel® TXN31111D1 Tri-Rate 850 nm Optical Transceiver - SFP* MSA Compatible
Datasheet 25-April-2007
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5.0 SFP Timing Parameters
Table 11 lists the timing parameters for SFP management.
Table 11. Timing Parameters for SFP Management
Parameter Symbol Min Max Unit Conditions
TX_DISABLE assert time t_off – 10 µs Time from rising edge of TX_DISABLE
to when the optical output falls below
10% of nominal
TX_DISABLE negate time t_on – 1 ms Time from falling edge of TX_DIS ABLE
to when the modulated optical output
rises above 90% of nominal
Time to initialize includes
reset of TX_FAULT t_init – 300 ms Time from power on or negation of
TX_FAULT using TX_DISABLE
TX_FAULT Assert Time t_fault – 100 µs Time from fault to TX_FAU LT ON
TX Disable to reset t_reset 10 µs Time TX Disable must be held high to
reset TX_FAULT
RX_LOS Assert time t_loss_on – 100 µs Time from LOS state to RX_LOS assert
RX_LOS De-assert time t_loss_off – 100 µs Time from non-LOS state to RX_LOS
de-assert
Serial ID Clock Rate f_serial_clock – 100 kHz –
Intel® TXN31111D1 Tri-Rate 850 nm Optical Transceiver - SFP* MSA Compatible
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Intel® TXN31111D1 Tri-Rate 850 nm Optical Transceiver - SFP* MSA Compatible
6.0 Digital Diagnostic Monitoring Interface
This section includes the following topics:
•Section 6.1, “Overview of Digital Diagnostic Monitoring Interface” on page 17
•Section 6.2, “General Memory Map Descriptions” on page 18
•Section 6.3, “Alarm and Warning Fields for 2-Wire Interface Address A2h” on
page 19
•Section 6.4, “A/D Fields for 2-Wire Interface Address A2h” on page 21
6.1 Overview of Digital Diagnostic Monitoring Interface
The TXN31111D1 Optical Transceiver supports the 2-wire serial communication
protocol. The TXN31111D1 Optical Transceiver has a digital diagnostic monitoring
interface that is an extension of the serial ID interface defined in the Gigabit Interface
Converter (GBIC) specification and the SFP Transceiver MultiSource Agreement (MSA)
referenced in Section 1.0, “Introduction” on page 7.
•Standard SFP serial ID interface. The standard SFP serial ID interface (the
memory map for which is in Table 12, “Memory Map – 2-Wire Address Range
Descriptions” on page 18) provides access to identification information using the 8-
bit address 1010000X (A0h). The serial identification information describes
information such as the following for the TXN31111D1 Optical Transceiver:
capabilities, standard interfaces, and manufacturer information.
•Digital diagnostic monitoring interface. The digital diagnostic monitor interface
(the memory map for which is in Table 12, “Memory Map – 2-Wire Address Range
Descriptions” on page 18) is an extension of the standard serial ID interface. This
interface, which uses the 8-bit address 1010001X (A2h) reserved for optical
transceiv ers, allows real-time access to device-operating parameters while leaving
unchanged the original serial ID memory map A0h. The digital diagnostic
monitoring interface is backward compatible with both the GBIC specification and
the SFP MSA.
Note: For details on the 2-wire addresses A0h and A2h, refer to the SFF-8472 document
referenced in Section 1.0, “Introduction” on page 7.
Intel® TXN31111D1 Tri-Rate 850 nm Optical Transceiver - SFP* MSA Compatible
Intel® TXN31111D1 Tri-Rate 850 nm Optical Transceiver - SFP* MSA Compatible
Datasheet 25-April-2007
18 Order Number: 317116, Revision: 001US
6.2 General Memory Map Descriptions
Table 12 lists descriptions of address ranges for the serial ID memory map.
• The 2-wire address A0h contains serial ID information defined by the SFP MSA.
• The 2-wire address A2h contains data related to the digital diagnostics, defined by
the SFF-8472 document referenced in Section 1.0, “Introduction” on page 7.
Table 12. Memory Map – 2-Wire Address Range Descriptions
2-Wire Address 1010000X (A0h) 2-Wire Address 1010001X (A2h)
Address
Range Address Range Description
(Standard Serial ID Information) Address
Range Address Range Description
(Digital Diagnostics Information)
0-95 Serial ID Defined SFP MSA (96 bytes)
0-39 Alarm and Warning (40 bytes)
For detai ls, see Table 13, “ Alarm and W arning
Fields – 2-Wire Address A2h, Address 0-95”.
40-95
Vendor Specific / Calibration Constants
(56 bytes)
For detai ls, see Table 13, “ Alarm and W arning
Fields – 2-Wire Address A2h, Address 0-95”.
96-127 Vendor Specific (32 bytes) 96-119
Real Time Digital Diagnostics Interface
(24 bytes)
For details, see the following:
•Table 14, “A/D Fields – 2-Wire Address
A2h, Addresses 96-109” on page 21
•Table 15, “A/D Status/Control Bits – 2-
Wire Address A2h, Address 110” on
page 21
120-127 Vendor Specific (8 bytes)
128-255 Reserved in SFP MSA (128 bytes) 128-247 User Writable EEPROM (120 bytes)
248-255 Vendor Specific (8 bytes)
Intel® TXN31111D1 Tri-Rate 850 nm Optical Transceiver - SFP* MSA Compatible
25-April-2007 Datasheet
Order Number: 317116, Revision: 001US 19
Intel® TXN31111D1 Tri-Rate 850 nm Optical Transceiver - SFP* MSA Compatible
6.3 Alarm and Warning Fields for 2-Wire Interface Address
A2h
Table 13 is a more detailed memory map of the 2-wire interface address A2h for the
Alarm and Warning fields, address range 0 to 95.
Table 13. Alarm and Warning Fields – 2-Wire Address A2h, Address 0-95 (She et 1 of 2)
Data
Address Field Size
(Bytes) Field Name Field Description
Base ID Fields
0 1 Temperature High alarm MSB at low address
1 1 LSB MSB at low address
2 1 Temperature Low alarm MSB at low address
3 1 LSB MSB at low address
4 1 Temperature High Warning MSB at low address
5 1 LSB MSB at low address
6 1 Temperature Low Warning MSB at low address
7 1 LSB MSB at low address
8 1 Vcc High Alarm MSB at low address
9 1 LSB MSB at low address
10 1 Vcc Low Alarm MSB at low address
11 1 LSB MSB at low address
12 1 Vcc High Warning MSB at low address
13 1 LSB MSB at low address
14 1 Vcc Low Warning MSB at low address
15 1 LSB MSB at low address
16 1 Bias High Alarm MSB at low address
17 1 LSB MSB at low address
18 1 Bias Low Alarm MSB at low address
19 1 LSB MSB at low address
20 1 Tx Bias High Warning MSB at low address
21 1 LSB MSB at low address
22 1 Tx Bias Low Warning MSB at low address
23 1 LSB MSB at low address
24 1 Tx Power High Alarm MSB at low address
25 1 LSB MSB at low address
26 1 Tx Power Low Alarm MSB at low address
27 1 LSB MSB at low address
28 1 Tx Power High Warning MSB at low address
29 1 LSB MSB at low address
30 1 Tx Power Low Warning MSB at low address
31 1 LSB MSB at low address
32 1 Rx Power High Alarm MSB at low address
33 1 LSB MSB at low address
Intel® TXN31111D1 Tri-Rate 850 nm Optical Transceiver - SFP* MSA Compatible
Intel® TXN31111D1 Tri-Rate 850 nm Optical Transceiver - SFP* MSA Compatible
Datasheet 25-April-2007
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34 1 Rx Power Low Alarm MSB at low address
35 1 LSB MSB at low address
36 1 Rx Power High Warning MSB at low address
37 1 LSB MSB at low address
38 1 Rx Power Low Warning MSB at low address
39 1 LSB MSB at low address
40-55 16 Vendor-Specific –
56-95 40 Calibration Constants –
Table 13. Alarm and Warning Fields – 2-Wire Address A2h, Address 0-95 (Sheet 2 of 2)
Data
Address Field Size
(Bytes) Field Name Field Description
Intel® TXN31111D1 Tri-Rate 850 nm Optical Transceiver - SFP* MSA Compatible
25-April-2007 Datasheet
Order Number: 317116, Revision: 001US 21
Intel® TXN31111D1 Tri-Rate 850 nm Optical Transceiver - SFP* MSA Compatible
6.4 A/D Fields for 2-Wire Interface Address A2h
Table 14 lists descriptions of the analog-to-digital (A/D) fields for the 2-wire interface
address A2h, data addresses 96 to 109.
Table 15 lists descriptions of the A/D status/control bits for the 2-wire interface address
A2h, data address 110.
Table 14. A/D Fields – 2-Wire Address A2h, Addresses 96-109
Data
Address
Field
Size
(Bytes) Field Name Field Description
96 1 Temperature MSB Signed 2's complement integer ºC (-40 to +125).
Based on internal temperature measurement.
97 1 Temperature LSB Fractional part of temperature (count/256)
98 1 Vcc MSB Internally measured supply voltage in transceiver.
Voltage reading is full 16-bit value × 100 µVolt.
(Yields range of 0 to 6.55V)
99 1 Vcc LSB
100 1 TX Bias MSB Measured Laser Bias Current in mA.
Bias current is full 16-bit value × 2 µA.
(Full range of 0 to +131 mA)
101 1 TX Bias LSB
102 1 TX power MSB Measure TX output power in mW.
TX power is full 16-bit value × 0.1 µW.
(Full range of -40 to +8.2 dBm)
103 1 TX power LSB
104 1 RX Power MSB Measured RX input power in mW.
RX power is full 16-bit value × 0.1 µW.
(Full range of -40 to +8.2dBm)
105 1 RX Power LSB
106-109 4 Reserved –
Table 15. A/D Status/Control Bits – 2-Wire Address A2h, Address 110
Data
Address Bit Bit Name Bit Description
110 2 Tx Fault Digital State of Tx Fault Output
110 1 LOS Digital State of LOS
110 0 Data Re ady Bar Indicates transceiver h as ac hieved power up and is ready.
Intel® TXN31111D1 Tri-Rate 850 nm Optical Transceiver - SFP* MSA Compatible
Intel® TXN31111D1 Tri-Rate 850 nm Optical Transceiver - SFP* MSA Compatible
Datasheet 25-April-2007
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7.0 Mechanical Specification
Figure 4 shows the TXN31111D1 Optical Transceiver SFP mechanical specifications. The
dimensions comply with the SFP Multisource Agreement (MSA).
Note: Aqueous wash is not applicable for this product.
Figure 4. SFP Mechanical Specifications
Intel® TXN31111D1 Tri-Rate 850 nm Optical Transceiver - SFP* MSA Compatible
25-April-2007 Datasheet
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Intel® TXN31111D1 Tri-Rate 850 nm Optical Transceiver - SFP* MSA Compatible
8.0 Regulatory Compliance
This section discusses the following topics:
•Section 8.1, “Electromagnetic Compatibility Compliance” on page 23
•Section 8.2, “Safety Compliance” on page 24
•Section 8.3, “Lead-Free Conformance” on page 25
•Section 8.4, “Compliance with Restriction of Hazardous Substances (RoHS)” on
page 25
•Section 8.5, “Management Methods on Control of Pollution from Electronic
Information Products (a.k.a. China RoHS)” on page 26
•Section 8.6, “Product Certification Markings and Compliance Statements” on
page 27
8.1 Electromagnetic Compatibility Compliance
Table 16 lists emissions and immunity regulations with which the TXN31111D1 Optical
Transceiver complies when tested in a representative chassis.
Table 16. Electromagnetic Compatibility Compliance
Requirement Regulation Performance Level
Electromagnetic interference (EMI) • FCC rules, Part 15,
subpart B
• EN 55022
Meets Class B limits with a minimum
6 dB margin
Electrostatic discharge (ESD)
JEDEC JESD22-A114-B
Human Body Model
± 2 kV contact discharge to connector
electrical pins with no degradation in
performance or loss of function
EN 61000-4-2
• ± 15 kV air discharge
• ± 8 kV contact discharge to face
plate
Meets Level B test criteria (that is, no
degradation of performance or loss of
function occurs).
Note: Actual ESD may vary, de pending
on system configuration.
Radio frequency electromagnetic
field (Radiated immunity) EN 61000-4-3,
Level A test criteria
10 V/m from 80 MHz to 1 GHz with no
degradation of performance or loss of
function
Intel® TXN31111D1 Tri-Rate 850 nm Optical Transceiver - SFP* MSA Compatible
Intel® TXN31111D1 Tri-Rate 850 nm Optical Transceiver - SFP* MSA Compatible
Datasheet 25-April-2007
24 Order Number: 317116, Revision: 001US
8.2 Safety Compliance
Table 17 lists and describes the relevant safety regulations with which the TXN31111D1
Optical Transceiver complies.
Caution: This device is a Class 1 laser product for use only under the recommended operating
conditions and ratings specified in this document.
Table 17. Safety Compliance
Requirement Regulation Title
Product Safety
UL 60950-1
CSA C22.2 No. 60950-1 Information Technology Equipment – Safety - Part 1:
General Requirements (USA and Canada)
EN 60950-1+A11 Information Technology Equipment – Safety - Part 1:
General Requirements (European Union)
IEC 60950-1 Information Technology Equipment – Safety - Part 1:
General Requirements (International)
GR-63-CORE Section 4.2,
Clause 4.2.3.1
Compliant with the fire resistance requirements of
Telcordia Technologies Generic Requirements GR-63-CORE
document for discrete electronic components.
Laser Safety
21CFR1040.10 Title 21 Chapter I Subchapter J –
Radiological Health Part 1040:
Performance Standards for Light-Emitting Products
EN 60825-1+A1 +A2 Safety of Laser Products - Part 1:
Equipment Classification, Requirements and User's Guide
IEC 60825-1+A1 +A2 Safety of Laser Products - Part 1:
Equipment Classification, Requirements and User's Guide
EN 60825-2 Safety of Laser Products - Part 2:
Safety of Optical Fiber Communication Systems
IEC 60825-2 Safety of Laser Products - Part 2:
Safety of Optical Fiber Communication Systems
Intel® TXN31111D1 Tri-Rate 850 nm Optical Transceiver - SFP* MSA Compatible
25-April-2007 Datasheet
Order Number: 317116, Revision: 001US 25
Intel® TXN31111D1 Tri-Rate 850 nm Optical Transceiver - SFP* MSA Compatible
8.3 Lead-Free Conformance
The TXN31111D1 Optical Transceiver uses a lead-free assembly, although certain
discrete components within the assembly may contain lead, being necessary for either
component performance or reliability. The TXN31111D1 Optical Transceiver is referred
to as a “Lead-free 2nd Level Interconnect.” The enclosure, circuit board substrate, and
the solder connections from the circuit board to the components (second-level
connections) are all lead-free.
Table 18 lists various forms of the “Lead-Free 2nd Level Interconnect” marking for the
TXN31111D1 Optical Transceiver and accompanying collateral.
8.4 Compliance with Restriction of Hazardous Substances
(RoHS)
This product complies with the European Union directive for Restriction of Hazardous
Substances (RoHS) – Restriction on the Use of Certain Hazardous Substances in
Electrical and Electronic Equipment, Directive 2002/95/EC plus amendments.
However, certain discrete components do contain lead (an RoHS-restricted substance)
in amounts that exceed threshold concentration levels. This product uses the following
applicable RoHS technology exemptions:
• Lead in optical and filter glass
• Lead in glass of electronic components
Note: RoHS implementation details are subject to change.
This product is RoHS 6 compliant, defined as complying with the restriction for all six
listed substances by meeting strict threshold levels for those substances or through the
use of the applicable exemptions listed above.
Table 18. Lead-Free 2nd-Level Interconnect Mark ings
Description Marking
Lead-Free 2nd Level Interconnect:
The Lead-Free 2nd Level Interconnect
symbol is used to identify electrical and
electronic assemblies and components
in which the lead (Pb) concentration
level in the circuit board substrate and
the solder connections from the circuit
board to the components (second-level
interconnect) are not g reater than 0.1%
by weight (1000 ppm).
Note: Any of the three symbols
shown may be used, as space
permits.
or
or
Intel® TXN31111D1 Tri-Rate 850 nm Optical Transceiver - SFP* MSA Compatible
Intel® TXN31111D1 Tri-Rate 850 nm Optical Transceiver - SFP* MSA Compatible
Datasheet 25-April-2007
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8.5 Management Methods on Control of Pollution from
Electronic Information Products (a.k.a. China RoHS)
Table 19. Hazardous Substances Table
关于符合中国《电子信息产品污染控制管理办法》的声明
产品中有毒有害物质的名称及含量
有毒有害物质或元素 (Hazardous Substance)
部件名称
(Parts)
铅
(Pb)
汞
(Hg)
镉
(Cd)
六价铬
(Cr(VI))
多溴联苯
(PBB)
多溴二苯醚
(PBDE)
集成光电器件
Integrated optical circuit board
assembly × ○ ○ ○ ○ ○
金属盒件
Metal enclosure ○ ○ ○ ○ ○ ○
○：表示该有毒有害物质在该部件所有均质材料中的含量均在SJ/T 11363-
2006标准规定的限量要求以下。
○：Indicates that this hazardous substance contained in all homogeneous materials of this part is below the
limit requirem e n t in SJ/T 113 63 -2 00 6.
×：表示该有毒有害物质至少在该部件的某一均质材料中的含量超出SJ/T 11363-
2006标准规定的限量要求。
×：Indicates that this hazardous substance contained in at least one of the homogeneous materials of this
part is above the limit requirement in SJ/T 11363-2006.
对销售之日的所售产品,本表显示我公司供应链的电子信息产品可能包含这些物质。注意：在所售产
品中可能会也可能不会含有所有所列的部件。
This table shows where these substances may be found in the supply chain of our electronic information
products, as of the date of sale of the enclosed product. Note that some of the component types listed above
may or may not be a part of the enclosed product.
除非另外特别的标注,此标志为针对所涉及产品的环保使用期限标志.此环保使用
期限只适用于产品在产品手册中所规定的条件下工作.
The Environment-Friendly Use Period (EFUP) for all enclosed products and their parts are per
the symbol shown here, unless otherwise marked. The Environment-Friendly Use Period is
valid only when the product is operated under the conditions defined in the product manual.
Intel® TXN31111D1 Tri-Rate 850 nm Optical Transceiver - SFP* MSA Compatible
25-April-2007 Datasheet
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Intel® TXN31111D1 Tri-Rate 850 nm Optical Transceiver - SFP* MSA Compatible
8.6 Product Certification Markings and Compliance
Statements
Table 20 lists the TXN31111D1 Optical Transceiver product certification markings and
compliance statements.
Table 20. Product Certification Markings and Comp liance Statements
Origin and Description Markings and Compliance Statements
Markings
CE mark.
The CE (Conformité Européen e*) mark indicates compliance
to the European Union Low Voltage directive (2006/95/EC,
formerly 73/23/EEC).
TÜV Rheinland type approval mark for components and
subassemblies for the European Union.
The Technischer Überwachungsverein* (TÜV – German for
“Technical Inspection Association”) Rhe inland t y pe approval
mark is for components and subassemblies for the European
Union.
Where space does not permit, the smaller alternate TÜV
mark (see the next row in this table) may be used.
TÜV Rheinland type approval mark for components and
subassemblies for the European Union – Alternate.
This alternate mark may be used where space constraints
exist that do not permit use of the TUV Rheinland mark in
the previous row of this table.
Alternate TÜV mark:
UL Recognized Component mark for the USA and Canada.
China Environmental Friendly Use Period (EFUP) mark,
where 30 in the marking denotes 30 years.
Compliance Statements
USA Food and Drug Administration (FDA), Center for
Devices and Radiological Health compliance statement.
Complies with 21CFR 1040.10 except for
deviations pursuant to Laser Notice No. 50,
dated July 26, 2001.
USA FDA, Center for Devices and Radiological Health
compliance statement – Alternate.
Use the alternate statement listed, as needed.
Alternate FDA compliance statement:
Complies with FDA performance standards for
laser products except for deviations pursuant
to Laser Notice No. 50, dated July 26, 2001.
Intel® TXN31111D1 Tri-Rate 850 nm Optical Transceiver - SFP* MSA Compatible
Intel® TXN31111D1 Tri-Rate 850 nm Optical Transceiver - SFP* MSA Compatible
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9.0 Ordering Information
Table 21 lists ordering information for the TXN31111D1 Optical Transceiver.
Table 21. O rdering Information
Product Number MM
Number Description
TXN31111D100xxx1886003 Tri-rate 2/1 Gbps Fibre Channel and Gigabit Ethernet SFP module with
digital diagnostics feature compliant to RoHS 6
1. The last 3 characters of the part number ("xxx") are used to designate customer-specific customization.
The Intel standard part has "000" as the last three characters.
Intel® TXN31111D1 Tri-Rate 850 nm Optical Transceiver - SFP* MSA Compatible
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Intel® TXN31111D1 Tri-Rate 850 nm Optical Transceiver - SFP* MSA Compatible
10.0 Acronyms
§ §
Table 22. Acronyms
Acronym Meaning
A/D Analog-to-Digital
BER Bit Error Rate
CFR Code of Federal Relations
CML Current Mode Logic
EMI Electro-Magnetic Interference
ESD Electro-Static Discharge
EU European Union
FC-PI Fibre Channel – Physical Interfaces
FCC Federal Communications Commission
FDA Food and Drug Administration
GBIC GigaBit Interface Converter
IEC International Electrotechnical Commission
IEEE Institute of Electrical and Electron ics Engineers
LOS Loss of Signal
MMF Multimode Fiber
MSA Multisource Agreement
NRZ Non-Return to Zero
Pb Lead
PCB Printed Circuit Board
PRBS Pseudo Random Bit Sequence
RFI Radio Frequency Immunity
SFF Small Form-Factor
SFP Small Form-Factor Pluggable
SCSI Small Computer System Interface
SONET Synchronous Optical Network
TOSA Transmitter Optical Sub-Assembly
TTL Transistor-Transistor Logic
TUV Technischer Überwachungsverein
UL Underwriter Laboratories*
VCSEL Vertical Cavity Surface Emitting Laser
Intel® TXN31111D1 Tri-Rate 850 nm Optical Transceiver - SFP* MSA Compatible
Intel® TXN31111D1 Tri-Rate 850 nm Optical Transceiver - SFP* MSA Compatible
Datasheet 25-April-2007
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