Datasheet Voltage Detector IC Series Free Delay Time Setting CMOS Voltage Detector IC Series BD52xx series BD53xx series General Description ROHM's BD52xx and BD53xx series are highly accurate, low current consumption reset IC series with a built-in delay circuit. The lineup was established with tow output types (Nch open drain and CMOS output) and detection voltages range from 2.3V to 6.0V in increments of 0.1V, so that the series may be selected according the application at hand. Features Free delay time setting by external capacitor Two output types (Nch open drain and CMOS output) Ultra-low current consumption Very small and low height package Key Specifications Detection voltage: 2.3V to 6.0V (Typ.) 0.1V steps High accuracy detection voltage: 1.0% Ultra-low current consumption: 0.95A (Typ.) Package SSOP5: 2.90mm x 2.80mm x 1.15mm VSOF5: 1.60mm x 1.60mm x 0.60mm Applications All electronic devices that use micro controllers and logic circuits Typical Application Circuit VDD1 VDD2 VDD1 RL RST BD52xx CT CT CL CL (Capacitor for noise filtering) (Capacitor for noise filtering) GND GND Open Drain Output type BD52xx Series Connection Diagram SSOP5 CT TOP VIEW CMOS Output type BD53xx Series N.C. VSOF5 TOP VIEW Lot. No Marking Pin Descriptions VOUT Micro RST controller BD53xx Micro controller VDD GND 4 5 Marking 1 2 3 VOUT SUB CT VDD GND SSOP5 Lot. No VSOF5 PIN No. 1 2 Symbol VOUT VDD Function Reset Output Power Supply Voltage PIN No. 1 2 Symbol VOUT SUB 3 GND GND 3 CT 4 N.C. 4 GND 5 CT Unconnected Terminal Capacitor connection terminal for output delay time Function Reset Output Substrate* Capacitor connection terminal for output delay time GND 5 VDD Power Supply Voltage *Connect the substrate to GND. Product structureSilicon monolithic integrated circuit This product is not designed protection against radioactive rays. www.rohm.com (c) 2011 ROHM Co., Ltd. All rights reserved. TSZ2211114001 1/10 TSZ02201-0R7R0G300040-1-2 19.DEC.2011 Rev.002 BD52xx series Datasheet BD53xx series Ordering Information B D 5 2 2 BD52: Adjustable Delay Time CMOS Reset IC Open Drain Type BD53: Adjustable Delay Time CMOS Reset IC CMOS Output Type 3 G Reset Voltage Value 23: 2.3V to (0.1V step) 60: 6.0V Package G: SSOP5 FVE: VSOF5 TR Packaging and forming specification TR: Embossed tape and reel SSOP5 5 4 1 2 3 Tape Embossed carrier tape Quantity 3000pcs Direction of feed 0.2Min. +0.2 1.6 -0.1 2.80.2 <Tape and Reel information> +6 4 -4 2.90.2 TR The direction is the 1pin of product is at the upper right when you hold ( reel on the left hand and you pull out the tape on the right hand 1pin +0.05 0.13 -0.03 +0.05 0.42 -0.04 0.050.05 1.10.05 1.25Max. ) 0.95 0.1 Direction of feed Reel (Unit : mm) Order quantity needs to be multiple of the minimum quantity. VSOF5 4 (MAX 1.28 include BURR) 1.2 0.05 1.6 0.05 5 0.2MAX 1.60.05 1.00.05 1 2 3 0.6MAX 0.130.05 0.5 0.220.05 (Unit : mm) Lineup Detection Marking Voltage PW 6.0V PV 5.9V PU 5.8V PT 5.7V PS 5.6V PR 5.5V PQ 5.4V PP 5.3V PN 5.2V PM 5.1V PL 5.0V PK 4.9V PJ 4.8V PH 4.7V PG 4.6V PF 4.5V PE 4.4V PD 4.3V PC 4.2V Part Marking Number BD5260 PB BD5259 PA BD5258 MV BD5257 MU BD5256 MT BD5255 MS BD5254 MR BD5253 MQ BD5252 MP BD5251 MN BD5250 MM BD5249 ML BD5248 MK BD5247 MJ BD5246 MH BD5245 MG BD5244 MF BD5243 ME BD5242 MD Detection Voltage 4.1V 4.0V 3.9V 3.8V 3.7V 3.6V 3.5V 3.4V 3.3V 3.2V 3.1V 3.0V 2.9V 2.8V 2.7V 2.6V 2.5V 2.4V 2.3V Part Marking Number BD5241 RW BD5240 RV BD5239 RU BD5238 RT BD5237 RS BD5236 RR BD5235 RQ BD5234 RP BD5233 RN BD5232 RM BD5231 RL BD5230 RK BD5229 RJ BD5228 RH BD5227 RG BD5226 RF BD5225 RE BD5224 RD BD5223 RC www.rohm.com (c) 2011 ROHM Co., Ltd. All rights reserved. TSZ2211115001 2/10 Detection Voltage 6.0V 5.9V 5.8V 5.7V 5.6V 5.5V 5.4V 5.3V 5.2V 5.1V 5.0V 4.9V 4.8V 4.7V 4.6V 4.5V 4.4V 4.3V 4.2V Part Marking Number BD5360 RB BD5359 RA BD5358 QV BD5357 QU BD5356 QT BD5355 QS BD5354 QR BD5353 QQ BD5352 QP BD5351 QN BD5350 QM BD5349 QL BD5348 QK BD5347 QJ BD5346 QH BD5345 QG BD5344 QF BD5343 QE BD5342 QD Detection Voltage 4.1V 4.0V 3.9V 3.8V 3.7V 3.6V 3.5V 3.4V 3.3V 3.2V 3.1V 3.0V 2.9V 2.8V 2.7V 2.6V 2.5V 2.4V 2.3V Part Number BD5341 BD5340 BD5339 BD5338 BD5337 BD5336 BD5335 BD5334 BD5333 BD5332 BD5331 BD5330 BD5329 BD5328 BD5327 BD5326 BD5325 BD5324 BD5323 TSZ02201-0R7R0G300040-1-2 19.DEC.2011 Rev.002 BD52xx series Datasheet BD53xx series z Absolute maximum ratings (Ta=25C) Parameter Power Supply Voltage Nch Open Drain Output Output Voltage CMOS Output *1*3 Power SSOP5 *2*3 Dissipation VSOF5 Operating Temperature Ambient Storage Temperature Symbol VDD-GND Limits -0.3 ~ +10 GND-0.3 ~ +10 GND-0.3 ~ VDD+0.3 540 210 -40 ~ +105 -55 ~ +125 VOUT Pd Topr Tstg Unit V V mW C C *1 Use above Ta=25C results in a 5.4mW loss per degree. *2 Use above Ta=25C results in a 2.1mW loss per degree. *3 When a ROHM standard circuit board (70mmx70mmx1.6mm glass epoxy board) is mounted. Electrical characteristics (Unless Otherwise Specified Ta=-40 to 105C) Parameter Detection Voltage Symbol VDET Circuit Current when ON IDD1 Circuit Current when OFF IDD2 Operating Voltage Range VOPL `Low' Output Current (Nch) IOL `High' Output Current (Pch) IOH Leak Current when OFF Ileak Limit Typ. Condition VDD=HAEL, RL=470k *1 VDET =2.3-3.1V VDET =3.2-4.2V VDD=VDET-0.2V VDET =4.3-5.2V VDET =5.3-6.0V VDET =2.3-3.1V VDET =3.2-4.2V VDD=VDET+2.0V VDET =4.3-5.2V VDET =5.3-6.0V VOL0.4V, Ta=25~105C, RL=470k VOL0.4V, Ta=-40~25C, RL=470k VDS=0.5V VDD=1.2V VDS=0.5V VDD=2.4V VDS=0.5V VDD=4.8V VDET=2.3-4.2V VDS=0.5V VDD=6.0V VDET=4.3-5.2V VDS=0.5V VDD=8.0V VDET=5.3-6.0V VDD=VDS=10V *1 VDD=VDETx1.1, VDET=2.3-2.6V, RL=470k VDD=VDETx1.1, VDET=2.7-4.2V, RL=470k CT pin Threshold Voltage VCTH VDD=VDETx1.1, VDET=4.3-5.2V, RL=470k VDD=VDETx1.1, VDET=5.3-6.0V, RL=470k Output Delay Resistance CT pin Output Current Detection Voltage Temperature coefficient Hysteresis Voltage RCT ICT VDD=VDETx1.1 VCT=0.5V VCT=0.1V VDD=0.95V VCT=0.5V VDD=1.5V VDET/T Ta=-40C to 105C VDET VDD=LAEHAEL, RL=470k *1 *1 Min. Max. VDET(T) VDET(T) VDET(T) x0.99 x1.01 0.80 2.40 0.85 2.55 0.90 2.70 0.95 2.85 0.75 2.25 0.80 2.40 0.85 2.55 0.90 2.70 0.95 1.20 0.4 1.2 2.0 5.0 0.7 1.4 0.9 1.8 1.1 2.2 0.1 VDD VDD VDD x0.30 x0.40 x0.60 VDD VDD VDD x0.30 x0.45 x0.60 VDD VDD VDD x0.35 x0.50 x0.60 VDD VDD VDD x0.40 x0.50 x0.60 5.5 9 12.5 15 40 150 240 - Unit V A A V mA mA A V M A - 100 360 ppm/C VDET x0.03 VDET x0.05 VDET x0.08 V VDET (T) : Standard Detection Voltage (2.3V to 6.0V, 0.1V step) RL: Pull-up resistor to be connected between VOUT and power supply. Designed Guarantee. (Outgoing inspection is not done on all products.) *1 Guarantee is Ta=25C. www.rohm.com (c) 2011 ROHM Co., Ltd. All rights reserved. TSZ2211115001 3/10 TSZ02201-0R7R0G300040-1-2 19.DEC.2011 Rev.002 BD52xx series Datasheet BD53xx series Block Diagrams VDD VOUT Vref CT GND Fig.1 BD52xx Series VDD VOUT Vref CT GND Fig.2 BD53xx www.rohm.com (c) 2011 ROHM Co., Ltd. All rights reserved. TSZ2211115001 4/10 Series TSZ02201-0R7R0G300040-1-2 19.DEC.2011 Rev.002 BD52xx series Datasheet BD53xx series Typical Performance Curves "LOW" OUTPUT CURRENT IOL [mA] CIRCUIT CURRENT IDD [A] 2.0 BD5242G/FVE BD5242 BD5342 1.5 1.0 0.5 0.0 0 1 2 3 4 5 6 7 8 9 10 18 BD5342 12 VDD =2.4V 9 6 3 VDD =1.2V 0 0.0 0.5 1.0 1.5 2.0 2.5 DRAIN-SOURCE VOLTAGE VDS[V] VDD SUPPLY VOLTAGE VDD [V] Fig.4 "Low" Output Current Fig.3 Circuit Current 9 45 BD5342G/FVE BD5342 40 OUTPUT VOLTAGE VOUT [V] "HIGH" OUTPUT CURRENT IOH [mA] BD5242G/FVE BD5242 15 35 30 25 20 VDD =8.0V 15 VDD =6.0V 10 5 VDD =4.8V 8 BD5242G/FVE BD5242 7 BD5342 6 5 4 3 Ta=25 2 1 Ta=25 0 0 0 1 2 3 4 5 6 0 0.5 1 1.5 2 2.5 3 3.5 4 4.5 5 5.5 DRAIN-SOURCE VOLTAGE VDS[V] VDD SUPPLY VOLTAGE VDD [V] Fig.5 "High" Output Current Fig.6 I/O Characteristics www.rohm.com (c) 2011 ROHM Co., Ltd. All rights reserved. TSZ2211115001 5/10 TSZ02201-0R7R0G300040-1-2 19.DEC.2011 Rev.002 BD52xx series Datasheet BD53xx series 450 BD5242G/FVE BD5242 0.8 CT OUTPUT CURRENT ICT [A] OUTPUT VOLTAGE VOUT [V] 1.0 BD5342 0.6 0.4 0.2 0.0 0.0 0.5 1.0 1.5 2.0 400 BD5242G/FVE BD5242 350 BD5342 300 250 200 150 100 50 0 0 2.5 1 CIRCUIT CURRENT WHEN ON IDD1 [A] DETECTION VOLTAGE V DET[V] 5.6 BD5242G/FVE BD5242 BD5342 Low to high(VDET+ VDET) 4.4 4.0 High to low(VDET) 3.6 3.2 -40 0 40 80 5 1.5 BD5242G/FVE BD5242 BD5342 1.0 0.5 0.0 -40 -20 0 20 40 60 80 100 TEMPERATURE Ta[] TEMPERATURE Ta[] Fig.10 Circuit Current when ON Fig.9 Detection Voltage Release Voltage www.rohm.com (c) 2011 ROHM Co., Ltd. All rights reserved. TSZ2211115001 4 Fig.8 CT Terminal Current Fig.7 Operating Limit Voltage 4.8 3 VDD SUPPLY VOLTAGE VDD [V] VDD SUPPLY VOLTAGE VDD [V] 5.2 2 6/10 TSZ02201-0R7R0G300040-1-2 19.DEC.2011 Rev.002 BD52xx series Datasheet BD53xx series 1.5 BD5242G/FVE BD5242 MINIMUM OPERATING VOLTAGE V OPL[V] CIRCUIT CURRENT WHEN OFF I DD2 [A] 1.5 BD5342 1.0 0.5 0.0 -40 -20 0 20 40 60 80 100 BD5242G/FVE BD5242 BD5342 1.0 0.5 0.0 -40 -20 Fig.11 Circuit Current when OFF BD5342 60 80 100 10000 BD5242G/FVE BD5242 DELAY TIME tPLH [ms] RESISTANCE OF CT RCT[M] 11 40 Fig.12 Operating Limit Voltage 13 BD5242G/FVE BD5242 20 TEMPERATURE Ta[] TEMPERATURE Ta[] 12 0 10 9 8 7 6 1000 BD5342 100 10 1 5 4 -40 -20 0 20 40 60 80 0.1 0.0001 100 0.01 0.1 CAPACITANCE OF CT C CT[F] TEMPERATURE Ta[] Fig.14 Delay Time (tPLH) and CT Terminal External Capacitance Fig.13 CT Terminal Circuit Resistance www.rohm.com (c) 2011 ROHM Co., Ltd. All rights reserved. TSZ2211115001 0.001 7/10 TSZ02201-0R7R0G300040-1-2 19.DEC.2011 Rev.002 BD52xx series Datasheet BD53xx series Application Information Explanation of Operation For both the open drain type (Fig.15) and the CMOS output type (Fig.16), the detection and release voltages are used as threshold voltages. When the voltage applied to the VDD pins reaches the applicable threshold voltage, the VOUT terminal voltage switches from either "High" to "Low" or from "Low" to "High". Because the BD52xx series uses an open drain output type, it is possible to connect a pull-up resistor to VDD or another power supply [The output "High" voltage (VOUT) in this case becomes VDD or the voltage of the other power supply]. VDD VDD VDD RL R1 Q2 R1 RESET Vref VDD Vref RESET VOUT R2 R2 Q1 Q3 VOUT Q1 Q3 R3 R3 GND GND CT CT Fig.15 (BD52xxType Internal Block Diagram) Fig.16 (BD53xxType Internal Block Diagram) Setting of Detector Delay Time This detector IC can be set delay time at the rise of VDD by the capacitor connected to CT terminal. Delay time at the rise of VDD tPLHTime until when Vout rise to 1/2 of VDD after VDD rise up and beyond the release voltage(VDET+VDET) tPLH = -CCTxRCTxln CCT: VCTH: VDD-VCTH VDD CT pin Externally Attached Capacitance CT pin Threshold VoltageP.2 VCTH refer. RCT : CT pin Internal Impedance P.2 RCT refer. ln : Natural Logarithm Reference Data of Falling Time (tPHL) Output Examples of Falling Time (tPHL) Output Part Number tPHL[s] -40C tPHL[s] ,+25C tPHL[s],+105C BD5227 30.8 30 28.8 BD5327 26.8 26 24.8 *This data is for reference only. The figures will vary with the application, so please confirm actual operating conditions before use. Timing Waveforms Example: the following shows the relationship between the input voltage VDD, the CT Terminal Voltage VCT and the output voltage VOUT when the input power supply voltage VDD is made to sweep up and sweep down (The circuits are those in Fig.15 and 16). 1 When the power supply is turned on, the output is unsettled from VDD after over the operating limit voltage (VOPL) until tPHL. There fore it is possible that the reset signal is not outputted when the rise time of VDET+VDET VDET VDD is faster than tPHL. 2 When VDD is greater than VOPL but less than the reset release VOPL 0V voltage (VDET+VDET), the CT terminal (VCT) and output (VOUT) voltages will switch to L. VCT 3 If VDD exceeds the reset release voltage (VDET+VDET), then 1/2 VDD VOUT switches from L to H (with a delay to the CT terminal). 4 If VDD drops below the detection voltage (VDET) when the power supply is powered down or when there is a power supply fluctuation, VOUT switches to L (with a delay of tPHL). VOUT tPLH tPHL tPLH 5 The potential difference between the detection voltage and the tPHL release voltage is known as the hysteresis width (VDET). The system is designed such that the output does not flip-flop with power supply fluctuations within this hysteresis width, preventing malfunctions due to noise Fig.17 Timing Waveform www.rohm.com (c) 2011 ROHM Co., Ltd. All rights reserved. TSZ2211115001 8/10 TSZ02201-0R7R0G300040-1-2 19.DEC.2011 Rev.002 BD52xx series Datasheet BD53xx series Circuit Applications Examples of a common power supply detection reset circuit VDD1 VDD2 RL RST BD52xx Micro controller CT CL Noise-filtering Capacitor GND Application examples of BD52xx series (Open Drain output type) and BD53xx series (CMOS output type) are shown below. CASE1: the power supply of the microcontroller (VDD2) differs from the power supply of the reset detection (VDD1). Use the open drain output type (BD52xx) attached a load resistance (RL) between the output and VDD2. (As shown Fig.15) Fig.18 Open Drain Output Type CASE2: the power supply of the microcontroller (VDD1) is same as the power supply of the reset detection (VDD1). Use CMOS output type (BD53xx) or open drain output type (BD52xx) attached a load resistance (RL) between the output and VDD1. (As shown Fig.16) VDD1 Micro RST controller BD53xx CT CL When a capacitance CL for noise filtering is connected to the VOUT pin (the reset signal input terminal of the microcontroller), please take into account the waveform of the rise and fall of the output voltage (VOUT). Noise-filtering Capacitor GND Fig.19 CMOS Output Type www.rohm.com (c) 2011 ROHM Co., Ltd. All rights reserved. TSZ2211115001 9/10 TSZ02201-0R7R0G300040-1-2 19.DEC.2011 Rev.002 BD52xx series Datasheet BD53xx series Operational Notes 1 . Absolute maximum range Absolute Maximum Ratings are those values beyond which the life of a device may be destroyed. We cannot be defined the failure mode, such as short mode or open mode. Therefore a physical security countermeasure, like fuse, is to be given when a specific mode to be beyond absolute maximum ratings is considered. 2 . GND potential GND terminal should be a lowest voltage potential every state. Please make sure all pins, which are over ground even if, include transient feature. 3 . Electrical Characteristics Be sure to check the electrical characteristics that are one the tentative specification will be changed by temperature, supply voltage, and external circuit. 4 . Bypass Capacitor for Noise Rejection Please put into the capacitor of 1F or more between VDD pin and GND, and the capacitor of about 1000pF between VOUT pin and GND, to reject noise. If extremely big capacitor is used, transient response might be late. Please confirm sufficiently for the point. 5 . Short Circuit between Terminal and Soldering Don't short-circuit between Output pin and VDD pin, Output pin and GND pin, or VDD pin and GND pin. When soldering the IC on circuit board, please be unusually cautious about the orientation and the position of the IC. When the orientation is mistaken the IC may be destroyed. 6 . Electromagnetic Field Mal-function may happen when the device is used in the strong electromagnetic field. 7 . The VDD line inpedance might cause oscillation because of the detection current. 8 . A VDD -GND capacitor (as close connection as possible) should be used in high VDD line impedance condition. 9 . Lower than the mininum input voltage makes the VOUT high impedance, and it must be VDD in pull up (VDD) condition. 10. This IC has extremely high impedance terminals. Small leak current due to the uncleanness of PCB surface might cause unexpected operations. Application values in these conditions should be selected carefully. If the leakage is assumed between the VOUT terminal and the GND terminal, the pull-up resistor should be less than 1/10 of the assumed leak resistance. If 10M leakage is assumed between the CT terminal and the GND terminal, 1M connection between the CT terminal and the VDD terminal would be recommended. The value of RCT depends on the external resistor that is connected to CT terminal, so please consider the delay time that is decided by xRCTxCCT changes. 11. External parameters The recommended parameter range for CT is 100pF~0.1F and RL is 50k~1M. There are many factors (board layout, etc) that can affect characteristics. Please verify and confirm using practical applications. 12. Power on reset operation Please note that the power on reset output varies with the VDD rise up time. Please verify the actual operation. 13. Precautions for board inspection Connecting low-impedance capacitors to run inspections with the board may produce stress on the IC. Therefore, be certain to use proper discharge procedure before each process of the test operation. To prevent electrostatic accumulation and discharge in the assembly process, thoroughly ground yourself and any equipment that could sustain ESD damage, and continue observing ESD-prevention procedures in all handing, transfer and storage operations. Before attempting to connect components to the test setup, make certain that the power supply is OFF. Likewise, be sure the power supply is OFF before removing any component connected to the test setup. 14. When the power supply, is turned on because of in certain cases, momentary Rash-current flow into the IC at the logic unsettled, the couple capacitance, GND pattern of width and leading line must be considered. Status of this document The Japanese version of this document is formal specification. A customer may use this translation version only for a reference to help reading the formal version. If there are any differences in translation version of this document formal version takes priority. www.rohm.com (c) 2011 ROHM Co., Ltd. All rights reserved. TSZ2211115001 10/10 TSZ02201-0R7R0G300040-1-2 19.DEC.2011 Rev.002 Datasheet Notice Precaution for circuit design 1) The products are designed and produced for application in ordinary electronic equipment (AV equipment, OA equipment, telecommunication equipment, home appliances, amusement equipment, etc.). If the products are to be used in devices requiring extremely high reliability (medical equipment, transport equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car accessories, safety devices, etc.) and whose malfunction or operational error may endanger human life and sufficient fail-safe measures, please consult with the ROHM sales staff in advance. If product malfunctions may result in serious damage, including that to human life, sufficient fail-safe measures must be taken, including the following: [a] Installation of protection circuits or other protective devices to improve system safety [b] Installation of redundant circuits in the case of single-circuit failure 2) The products are designed for use in a standard environment and not in any special environments. Application of the products in a special environment can deteriorate product performance. Accordingly, verification and confirmation of product performance, prior to use, is recommended if used under the following conditions: [a] Use in various types of liquid, including water, oils, chemicals, and organic solvents [b] Use outdoors where the products are exposed to direct sunlight, or in dusty places [c] Use in places where the products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2 [d] Use in places where the products are exposed to static electricity or electromagnetic waves [e] Use in proximity to heat-producing components, plastic cords, or other flammable items [f] Use involving sealing or coating the products with resin or other coating materials [g] Use involving unclean solder or use of water or water-soluble cleaning agents for cleaning after soldering [h] Use of the products in places subject to dew condensation 3) The products are not radiation resistant. 4) Verification and confirmation of performance characteristics of products, after on-board mounting, is advised. 5) In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse) is applied, confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect product performance and reliability. 6) De-rate Power Dissipation (Pd) depending on Ambient temperature (Ta). When used in sealed area, confirm the actual ambient temperature. 7) Confirm that operation temperature is within the specified range described in product specification. 8) Failure induced under deviant condition from what defined in the product specification cannot be guaranteed. Precaution for Mounting / Circuit board design 1) When a highly active halogenous (chlorine, bromine, etc.) flux is used, the remainder of flux may negatively affect product performance and reliability. 2) In principle, the reflow soldering method must be used; if flow soldering method is preferred, please consult with the Company in advance. Regarding Precaution for Mounting / Circuit board design, please specially refer to ROHM Mounting specification Precautions Regarding Application Examples and External Circuits 1) If change is made to the constant of an external circuit, allow a sufficient margin due to variations of the characteristics of the products and external components, including transient characteristics, as well as static characteristics. 2) The application examples, their constants, and other types of information contained herein are applicable only when the products are used in accordance with standard methods. Therefore, if mass production is intended, sufficient consideration to external conditions must be made. Notice - Rev.001 Datasheet Precaution for Electrostatic This product is Electrostatic sensitive product, which may be damaged due to Electrostatic discharge. Please take proper caution during manufacturing and storing so that voltage exceeding Product maximum rating won't be applied to products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron, isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control). Precaution for Storage / Transportation 1) Product performance and soldered connections may deteriorate if the products are stored in the following places: [a] Where the products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2 [b] Where the temperature or humidity exceeds those recommended by the Company [c] Storage in direct sunshine or condensation [d] Storage in high Electrostatic 2) Even under ROHM recommended storage condition, solderability of products out of recommended storage time period may be degraded. It is strongly recommended to confirm solderability before using products of which storage time is exceeding recommended storage time period . 3) Store / transport cartons in the correct direction, which is indicated on a carton as a symbol. Otherwise bent leads may occur due to excessive stress applied when dropping of a carton. 4) Use products within the specified time after opening a dry bag. Precaution for product label QR code printed on ROHM product label is only for internal use, and please do not use at customer site. It might contain a internal part number that is inconsistent with an product part number. Precaution for disposition When disposing products please dispose them properly with a industry waste company. Precaution for Foreign exchange and Foreign trade act Since concerned goods might be fallen under controlled goods prescribed by Foreign exchange and Foreign trade act, please consult with ROHM in case of export. Prohibitions Regarding Industrial Property 1) Information and data on products, including application examples, contained in these specifications are simply for reference; the Company does not guarantee any industrial property rights, intellectual property rights, or any other rights of a third party regarding this information or data. Accordingly, the Company does not bear any responsibility for: [a] infringement of the intellectual property rights of a third party [b] any problems incurred by the use of the products listed herein. 2) The Company prohibits the purchaser of its products to exercise or use the intellectual property rights, industrial property rights, or any other rights that either belong to or are controlled by the Company, other than the right to use, sell, or dispose of the products. Notice - Rev.001