BD5328G-TR - Rohm Semiconductor - Datasheet.Directory

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Datasheet

Voltage Detector IC Series

Free Delay Time Setting

CMOS Voltage Detector IC Series

BD52xx series BD53xx series

●General Description

ROHM’s BD52xx and BD53xx series are highly

accurate, low current consumption reset IC series with

a built-in delay circuit. The lineup was established with

tow output types (Nch open drain and CMOS output)

and detection voltages range from 2.3V to 6.0V in

increments of 0.1V, so that the series may be selected

according the application at hand.

●Features

 Free delay time setting by external capacitor

 Two output types (Nch open drain and CMOS output)

 Ultra-low current consumption

 Very small and low height package

●Key Specifications

 Detection voltage: 2.3V to 6.0V (Typ.)

0.1V steps

 High accuracy detection voltage: ±1.0%

 Ultra-low current consumption: 0.95µA (Typ.)

●Package

SSOP5: 2.90mm x 2.80mm x 1.15mm

VSOF5: 1.60mm x 1.60mm x 0.60mm

●Applications

All electronic devices that use micro controllers and logic

circuits

●Typical A pplication Circuit

●Connection Diagram

SSOP5 VSOF5

●Pin Descriptions

SSOP5 VSOF5

PIN No. Symbol Function PIN No. Symbol Function

1 VOUT Reset Output 1 VOUT Reset Output

2 VDD Power Supply Voltage 2 SUB Substrate*

3 GND GND 3 CT Capacitor connection terminal for

output delay time

4 N.C. Unconnected Terminal 4 GND GND

5 CT Capacitor connection terminal for

output delay time 5 VDD Power Supply Voltage

*Connect the substrate to GND.

Open Drain Output type

BD52xx Series

CMOS Output type

BD53xx Series

VDD1

BD52xx

VDD2

GND

(Capacitor for

noise filtering)

RST Micro

controller

VDD1

BD53xx

GND

CTCL

(Capacitor for

noise filtering)

RST Micro

controller

TOP VIEW TOP VIEW

○Product structure：Silicon monolithic integrated circuit ○This product is not designed protection against radioactive rays.

VOUT VDD GND

N.C. CT

Lot. No

Marking

GND

VOUT SUB CT

VDD

Marking Lot. No

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Datasheet

●Ordering Information

B D 5 2 2 3 G －T R

BD52: Adjustable Delay Time Reset Voltage Value Package Packaging and forming specification

CMOS Reset IC 23: 2.3V to (0.1V step) G: SSOP5 TR: Embossed tape and reel

Open Drain Type 60: 6.0V FVE: VSOF5

BD53: Adjustable Delay Time

CMOS Reset IC

CMOS Output Type

●Lineup

Marking Detection

Voltage

Part

Number Marking Detection

Voltage

Part

Number Marking Detection

Voltage

Part

Number Marking Detection

Voltage

Part

Number

PW 6.0V BD5260 PB 4.1V BD5241 RW 6.0V BD5360 RB 4.1V BD5341

PV 5.9V BD5259 PA 4.0V BD5240 RV 5.9V BD5359 RA 4.0V BD5340

PU 5.8V BD5258 MV 3.9V BD5239 RU 5.8V BD5358 QV 3.9V BD5339

PT 5.7V BD5257 MU 3.8V BD5238 RT 5.7V BD5357 QU 3.8V BD5338

PS 5.6V BD5256 MT 3.7V BD5237 RS 5.6V BD5356 QT 3.7V BD5337

PR 5.5V BD5255 MS 3.6V BD5236 RR 5.5V BD5355 QS 3.6V BD5336

PQ 5.4V BD5254 MR 3.5V BD5235 RQ 5.4V BD5354 QR 3.5V BD5335

PP 5.3V BD5253 MQ 3.4V BD5234 RP 5.3V BD5353 QQ 3.4V BD5334

PN 5.2V BD5252 MP 3.3V BD5233 RN 5.2V BD5352 QP 3.3V BD5333

PM 5.1V BD5251 MN 3.2V BD5232 RM 5.1V BD5351 QN 3.2V BD5332

PL 5.0V BD5250 MM 3.1V BD5231 RL 5.0V BD5350 QM 3.1V BD5331

PK 4.9V BD5249 ML 3.0V BD5230 RK 4.9V BD5349 QL 3.0V BD5330

PJ 4.8V BD5248 MK 2.9V BD5229 RJ 4.8V BD5348 QK 2.9V BD5329

PH 4.7V BD5247 MJ 2.8V BD5228 RH 4.7V BD5347 QJ 2.8V BD5328

PG 4.6V BD5246 MH 2.7V BD5227 RG 4.6V BD5346 QH 2.7V BD5327

PF 4.5V BD5245 MG 2.6V BD5226 RF 4.5V BD5345 QG 2.6V BD5326

PE 4.4V BD5244 MF 2.5V BD5225 RE 4.4V BD5344 QF 2.5V BD5325

PD 4.3V BD5243 ME 2.4V BD5224 RD 4.3V BD5343 QE 2.4V BD5324

PC 4.2V BD5242 MD 2.3V BD5223 RC 4.2V BD5342 QD 2.3V BD5323

(Unit : mm)

SSOP5

2.9±0.2

0.13

4°+6°

−4°

1.6

2.8±0.2

1.1±0.05

0.05±0.05

+0.2

−0.1

+0.05

−0.03

0.42+0.05

−0.04

0.95

123

1.25Max.

0.2Min.

0.1

Direction of feed

Reel

∗

Order quantity needs to be multiple of the minimum quantity.

Embossed carrier tapeTape

Quantity

Direction

of feed

The direction is the 1pin of product is at the upper right when you hold

reel on the left hand and you pull out the tape on the right hand

3000pcs

()

1pin

(Unit : mm)

VSOF5

1.2±0.05

1.0±0.05

0.6MAX

0.22±0.05

0.5

1.6±0.05

0.13±0.05

0.2MAX

1.6±0.05

(MAX 1.28 include BURR)

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Datasheet

z Absolute maximum ratings (Ta=25°C)

Parameter Symbol Limits Unit

Power Supply Voltage VDD-GND -0.3 ~ +10 V

Nch Open Drain Output GND-0.3 ~ +10

Output Voltage CMOS Output VOUT GND-0.3 ~ VDD+0.3 V

SSOP5 *1*3 540 Power

Dissipation VSOF5 *2*3 Pd 210 mW

Operating Temperature Topr -40 ~ +105 °C

Ambient Storage Temperature Tstg -55 ~ +125 °C

*1 Use above Ta=25°C results in a 5.4mW loss per degree.

*2 Use above Ta=25°C results in a 2.1mW loss per degree.

*3 When a ROHM standard circuit board (70mm×70mm×1.6mm glass epoxy board) is mounted.

●Electrical characteristics (Un l ess Otherwise Specified Ta=-40 to 105°C)

Limit

Parameter Symbol Condition Min. Typ. Max.

Unit

Detection Voltage VDET VDD=HÆL, RL=470k *1 VDET(T)

×0.99 VDET(T) VDET(T)

×1.01 V

VDET =2.3-3.1V - 0.80 2.40

VDET =3.2-4.2V - 0.85 2.55

VDET =4.3-5.2V - 0.90 2.70

Circuit Current when ON IDD1 VDD=VDET-0.2V

VDET =5.3-6.0V - 0.95 2.85

µA

VDET =2.3-3.1V - 0.75 2.25

VDET =3.2-4.2V - 0.80 2.40

VDET =4.3-5.2V - 0.85 2.55

Circuit Current when OFF IDD2 VDD=VDET+2.0V

VDET =5.3-6.0V - 0.90 2.70

µA

VOL0.4V, Ta=25~105°C, RL=470k 0.95 - -

Operating Voltage Range VOPL VOL0.4V, Ta=-40~25°C, RL=470k 1.20 - -

VDS=0.5V VDD=1.2V 0.4 1.2 -

‘Low’ Output Current (Nch) IOL VDS=0.5V VDD=2.4V 2.0 5.0 -

VDS=0.5V VDD=4.8V VDET=2.3-4.2V 0.7 1.4 -

VDS=0.5V VDD=6.0V VDET=4.3-5.2V 0.9 1.8 -

‘High’ Output Current (Pch) IOH

VDS=0.5V VDD=8.0V VDET=5.3-6.0V 1.1 2.2 -

Leak Current when OFF Ileak VDD=VDS=10V *1 - - 0.1 µA

VDD=VDET×1.1, VDET=2.3-2.6V, RL=470k VDD

×0.30

VDD

×0.40

VDD

×0.60

VDD=VDET×1.1, VDET=2.7-4.2V, RL=470k VDD

×0.30

VDD

×0.45

VDD

×0.60

VDD=VDET×1.1, VDET=4.3-5.2V, RL=470k VDD

×0.35

VDD

×0.50

VDD

×0.60

CT pin Threshold Voltage VCTH

VDD=VDET×1.1, VDET=5.3-6.0V, RL=470k VDD

×0.40

VDD

×0.50

VDD

×0.60

Output Delay Resistance RCT VDD=VDET×1.1 VCT=0.5V *1 5.5 9 12.5 M

VCT=0.1V VDD=0.95V *1 15 40 -

CT pin Output Current ICT VCT=0.5V VDD=1.5V 150 240 -

µA

Detection Voltage

Temperature coefficient VDET/T Ta=-40°C to 105°C - ±100 ±360 ppm/°C

Hysteresis Voltage  VDET VDD=LÆHÆL, RL=470k VDET

×0.03

VDET

×0.05

VDET

×0.08 V

VDET (T) : Standard Detection Voltage (2.3V to 6.0V, 0.1V step)

RL: Pull-up resistor to be connected between VOUT and power supply.

Designed Guarantee. (Outgoing inspection is not done on all products.)

*1 Guarantee is Ta=25°C.

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BD52xx series BD53xx series

Datasheet

●Block Diagrams

Vref

VOUT

VDD

GND CT

Vref

VOUT

VDD

GND CT

Fig.1 BD52xx Series

Fig.2 BD53xx Series

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Datasheet

●Typical Performance Curves

Fig.3 Circuit Current

0.0

0.5

1.0

1.5

2.0

01 23 456 78 910

VDD SUPPLY VOLTAGE ：VDD[V]

CIRCUIT CURRENT ： IDD [A]

【BD5242G/FVE】

0.0 0.5 1.0 1.5 2.0 2.5

DRAIN-SOURCE VOLTAGE ： VDS

[V]

"LOW" OUTPUT CURRENT ： IOL[mA]

【BD5242G/FVE】

VDD=2.4V

VDD=1.2V

Fig.4 “Low” Output Current

0123456

DRAIN-SOURCE VOLTAGE ： VDS

[V]

"HIGH" OUTPUT CURRENT ： IOH[mA]

【BD5342G/FVE】

VDD=8.0V

VDD=6.0V

VDD=4.8V

Fig.5 “High” Output Current Fig.6 I/O Characteristics

00.5 11.522.5 33.544.5 55.5

VDD SUPPLY VOLTAGE ：VDD[V]

OUTPUT VOLTAGE

： VOUT[V]

【BD5242G/FVE】

Ta=25℃

【BD5242】

【BD5342】

【BD5242】

【BD5342】

【BD5242】

【BD5342】

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BD52xx series BD53xx series

Datasheet

0.0

0.2

0.4

0.6

0.8

1.0

0.0 0.5 1.0 1.5 2.0 2.5

VDD SUPPLY VOLTAGE ： VDD[V]

OUTPUT VOLTAGE

： VOUT[V]

【BD5242G/FVE】

Fig.7 Operating Limit Voltage Fig.8 CT Terminal Current

100

150

200

250

300

350

400

450

012345

VDD SUPPLY VOLTAGE ： VDD[V]

CT OUTPUT CURRENT ： ICT[A]

【BD5242G/FVE】

3.2

3.6

4.0

4.4

4.8

5.2

5.6

-40 0 40 80

TEMPERATURE ： Ta[℃]

DETECTION VOLTAGE ： VDET[V]

Low to hig h(VDET+ΔVDET)

High to low(VDET)

【BD5242G/FVE】

～

Fig.9 Detection Voltage

Release Voltage

0.0

0.5

1.0

1.5

-40 -20 0 20 40 60 80 100

TEMPERATURE ： Ta[℃]

CIRCUIT CURRENT WHEN ON ： IDD1 [A]

【BD5242G/FVE】

Fig.10 Circuit Current when ON

【BD5242】

【BD5342】

【BD5242】

【BD5342】

【BD5242】

【BD5342】

【BD5242】

【BD5342】

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BD52xx series BD53xx series

Datasheet

0.0

0.5

1.0

1.5

-40 -20 0 20 40 60 80 100

TEMPERATURE ： Ta[℃]

CIRCUIT CURRENT WHEN OFF ： I DD2 [A]

【BD5242G/FVE】

Fig.11 Circuit Current when OFF

0.0

0.5

1.0

1.5

-40-200 20406080100

TEMPERATURE ： Ta[℃]

MINIMUM OPERATING VOLTAGE ： VOPL[V]

【BD5242G/FVE】

Fig.12 Operating Limit Voltage

-40 -20 0 20 40 60 80 100

TEMPERATURE ： Ta[℃]

RESISTANCE OF CT ： RCT[M]

【BD5242G/FVE】

Fig.13 CT Terminal Circuit Resistance

0.1

100

1000

10000

0.0001 0.001 0.01 0.1

CAPACITANCE OF CT ： CCT[F]

DELAY TIME ： tPL H [ms]

【BD5242G/FVE】

Fig.14 Delay Time (tPLH) and

CT Terminal External Capacitance

【BD5242】

【BD5342】

【BD5242】

【BD5342】

【BD5242】

【BD5342】

【BD5242】

【BD5342】

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Datasheet

●Applic at ion Informa tion

Explanation of Operation

For both the open drain type (Fig.15) and the CMOS output type (Fig.16), the detection and release voltages are used as

threshold voltages. When the voltage applied to the VDD pins reaches the applicable threshold voltage, the VOUT terminal

voltage switches from either “High” to “Low” or from “Low” to “High”. Because the BD52xx series uses an open drain output

type, it is possible to connect a pull-up resistor to VDD or another power supply [The output “High” voltage (VOUT) in this case

becomes VDD or the voltage of the other power supply].

Fig.15 (BD52xxType Internal Block Diagram) Fig.16 (BD53xxType Internal Block Diagram)

Setting of Detector Delay Time

This detector IC can be set delay time at the rise of VDD by the capacitor connected to CT terminal.

Delay time at the rise of VDD t

PLH：Time until when Vout rise to 1/2 of VDD after VDD rise up and beyond the release

voltage(VDET+VDET)

tPLH = -CCT×RCT×ln

C CT: CT pin Externally Attached Capacitance RCT : CT pin Internal Impedance （P. 2 R CT refer.）

VCTH: CT pin Threshold Voltage（P. 2 V CTH refer.） ln : Natural Logarithm

Reference Data of Falling Time (tPHL) Output

Examples of Falling Time (tPHL) Output

Part Number tPHL[µs] -40°C tPHL[µs] ,+25°C tPHL[µs],+105°C

BD5227 30.8 30 28.8

BD5327 26.8 26 24.8

*This data is for reference only.

The figures will vary with the application, so please confirm actual operating conditions before use.

Timing Waveforms

Example: the following shows the relationship between the input voltage VDD, the CT Terminal Voltage VCT and the output

voltage VOUT when the input power supply voltage VDD is made to sweep up and sweep down (The circuits are those in

Fig.15 and 16).

1 When the power supply is turned on, the output is unsettled from

after over the operating limit voltage (VOPL) until tPHL. There fore it is

possible that the reset signal is not outputted when the rise time of

VDD is faster than tPHL.

2 When VDD is greater than VOPL but less than the reset release

voltage (VDET+VDET), the CT terminal (VCT) and output (VOUT)

voltages will switch to L.

3 If VDD exceeds the reset release voltage (VDET+VDET), then

VOUT switches from L to H (with a delay to the CT terminal).

4 If VDD drops below the detection voltage (VDET) when the power

supply is powered down or when there is a power supply fluctuation,

VOUT switches to L (with a delay of tPHL).

5 The potential difference between the detection voltage and the

release voltage is known as the hysteresis width (VDET). The

system is designed such that the output does not flip-flop with power

supply fluctuations within this hysteresis width, preventing

malfunctions due to noise

Vref

VDD

GND

VOUT

RESET

VDD

Vref

VDD

GND

VOUT

RESET

VDD

VDD-VCTH

VDD

VDET+ΔVDET

VDET

VOPL

1/2 VDD

tPHL

①

tPLH

tPHL

tPLH

② ③ ④

⑤

VOUT

Fig.17 Timing Waveform

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BD52xx series BD53xx series

Datasheet

Circuit Applications

●Examples of a common power supply detection reset circuit

Application examples of BD52xx series (Open Drain

output type) and BD53xx series (CMOS output type) are

shown below.

CASE1: the power supply of the microcontroller (VDD2)

differs from the power supply of the reset detection (VDD1).

Use the open drain output type (BD52xx) attached a load

resistance (RL) between the output and VDD2. (As shown

Fig.15)

CASE2: the power supply of the microcontroller (VDD1) is

same as the power supply of the reset detection (VDD1).

Use CMOS output type (BD53xx) or open drain output

type (BD52xx) attached a load resistance (RL) between

the output and VDD1. (As shown Fig.16)

When a capacitance CL for noise filtering is connected to

the VOUT pin (the reset signal input terminal of the

microcontroller), please take into account the waveform of

the rise and fall of the output voltage (VOUT).

VDD1

BD52xx

VDD2

GND

（Noise-filtering

Capacitor）

RST Micro

controller

Fig.18 Open Drain Output Type

（Noise-filtering

Capacitor）

VDD1

BD53xx

GND

RST Micro

controller

Fig.19 CMOS Output Type

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Datasheet

●Operational Notes

1 . Absolute maximum range

Absolute Maximum Ratings are those values beyond which the life of a device may be destroyed. We cannot be defined the

failure mode, such as short mode or open mode. Therefore a physical security countermeasure, like fuse, is to be given

when a specific mode to be beyond absolute maximum ratings is considered.

2 . GND potential

GND terminal should be a lowest voltage potential every state.

Please make sure all pins, which are over ground even if, include transient feature.

3 . Electrical Characteristics

Be sure to check the electrical characteristics that are one the tentative specification will be changed by temperature,

supply voltage, and external circuit.

4 . Bypass Capacitor for Noise Rejection

Please put into the capacitor of 1µF or more between VDD pin and GND, and the capacitor of about 1000pF between VOUT pin

and GND, to reject noise. If extremely big capacitor is used, transient response might be late. Please confirm sufficiently for

the point.

5 . Short Circuit between Terminal and Soldering

Don’t short-circuit between Output pin and VDD pin, Output pin and GND pin, or VDD pin and GND pin. When soldering the

IC on circuit board, please be unusually cautious about the orientation and the position of the IC. When the orientation is

mistaken the IC may be destroyed.

6 . Electromagnetic Field

Mal-function may happen when the device is used in the strong electromagnetic field.

7 . The VDD line inpedance might cause oscillation because of the detection current.

8. A V

DD -GND capacitor (as close connection as possible) should be used in high VDD line impedance condition.

9 . Lower than the mininum input voltage makes the VOUT high impedance, and it must be VDD in pull up (VDD) condition.

10. This IC has extremely high impedance terminals. Small leak current due to the uncleanness of PCB surface might cause

unexpected operations. Application values in these conditions should be selected carefully. If the leakage is assumed

between the VOUT terminal and the GND terminal, the pull-up resistor should be less than 1/10 of the assumed leak

resistance. If 10M leakage is assumed between the CT terminal and the GND terminal, 1M connection between the CT

terminal and the VDD terminal would be recommended. The value of RCT depends on the external resistor that is

connected to CT terminal, so please consider the delay time that is decided by ×RCT×CCT changes.

11. External parameters

The recommended parameter range for CT is 100pF~0.1µF and RL is 50k~1M. There are many factors (board layout,

etc) that can affect characteristics. Please verify and confirm using practical applications.

12. Power on reset operation

Please note that the power on reset output varies with the VDD rise up time. Please verify the actual operation.

13. Precautions for board inspection

Connecting low-impedance capacitors to run inspections with the board may produce stress on the IC. Therefore, be

certain to use proper discharge procedure before each process of the test operation.

To prevent electrostatic accumulation and discharge in the assembly process, thoroughly ground yourself and any

equipment that could sustain ESD damage, and continue observing ESD-prevention procedures in all handing, transfer

and storage operations. Before attempting to connect components to the test setup, make certain that the power supply is

OFF. Likewise, be sure the power supply is OFF before removing any component connected to the test setup.

14. When the power supply, is turned on because of in certain cases, momentary Rash-current flow into the IC at the logic

unsettled, the couple capacitance, GND pattern of width and leading line must be considered.

Status of this document

The Japanese version of this document is formal specification. A customer may use this translation version only for a reference

to help reading the formal version.

If there are any differences in translation version of this document formal version takes priority.

Datasheet

Notice - Rev.001

Notice

●Precaution for circuit design

1) The products are designed and produced for application in ordinary electronic equipment (AV equipment, OA

equipment, telecommunication equipment, home appliances, amusement equipment, etc.). If the products are to be

used in devices requiring extremely high reliability (medical equipment, transport equipment, aircraft/spacecraft,

nuclear power controllers, fuel controllers, car equipment including car accessories, safety devices, etc.) and whose

malfunction or operational error may endanger human life and sufficient fail-safe measures, please consult with the

ROHM sales staff in advance. If product malfunctions may result in serious damage, including that to human life,

sufficient fail-safe measures must be taken, including the following:

[a] Installation of protection circuits or other protective devices to improve system safety

[b] Installation of redundant circuits in the case of single-circuit failure

2) The products are designed for use in a standard environment and not in any special environments. Application of the

products in a special environment can deteriorate product performance. Accordingly, verification and confirmation of

product performance, prior to use, is recommended if used under the following conditions:

[a] Use in various types of liquid, including water, oils, chemicals, and organic solvents

[b] Use outdoors where the products are exposed to direct sunlight, or in dusty places

[c] Use in places where the products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2,

and NO2

[d] Use in places where the products are exposed to static electricity or electromagnetic waves

[e] Use in proximity to heat-producing components, plastic cords, or other flammable items

[f] Use involving sealing or coating the products with resin or other coating materials

[g] Use involving unclean solder or use of water or water-soluble cleaning agents for cleaning after soldering

[h] Use of the products in places subject to dew condensation

3) The products are not radiation resistant.

4) Verification and confirmation of performance characteristics of products, after on-board mounting, is advised.

5) In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse) is applied,

confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power

exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect

product performance and reliability.

6) De-rate Power Dissipation (Pd) depending on Ambient temperature (Ta).

When used in sealed area, confirm the actual ambient temperature.

7) Confirm that operation temperature is within the specified range described in product specification.

8) Failure induced under deviant condition from what defined in the product specification cannot be guaranteed.

●Precaution for Mounting / Circuit board design

1) When a highly active halogenous (chlorine, bromine, etc.) flux is used, the remainder of flux may negatively affect

product performance and reliability.

2) In principle, the reflow soldering method must be used; if flow soldering method is preferred, please consult with the

Company in advance.

Regarding Precaution for Mounting / Circuit board design, please specially refer to ROHM Mounting specification

●Precautions Regarding Application Examples and External Circuits

1) If change is made to the constant of an external circuit, allow a sufficient margin due to variations of the characteristics

of the products and external components, including transient characteristics, as well as static characteristics.

2) The application examples, their constants, and other types of information contained herein are applicable only when

the products are used in accordance with standard methods. Therefore, if mass production is intended, sufficient

consideration to external conditions must be made.

Datasheet

Notice - Rev.001

●Precaution for Electrostatic

This product is Electrostatic sensitive product, which may be damaged due to Electrostatic discharge. Please take proper

caution during manufacturing and storing so that voltage exceeding Product maximum rating won't be applied to products.

Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron, isolation from

charged objects, setting of Ionizer, friction prevention and temperature / humidity control).

●Precaution for Storage / Transportation

1) Product performance and soldered connections may deteriorate if the products are stored in the following places:

[a] Where the products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2

[b] Where the temperature or humidity exceeds those recommended by the Company

[c] Storage in direct sunshine or condensation

[d] Storage in high Electrostatic

2) Even under ROHM recommended storage condition, solderability of products out of recommended storage time period

may be degraded. It is strongly recommended to confirm solderability before using products of which storage time is

exceeding recommended storage time period .

3) Store / transport cartons in the correct direction, which is indicated on a carton as a symbol. Otherwise bent leads may

occur due to excessive stress applied when dropping of a carton.

4) Use products within the specified time after opening a dry bag.

●Precaution for product label

QR code printed on ROHM product label is only for internal use, and please do not use at customer site. It might contain a

internal part number that is inconsistent with an product part number.

●Precaution for disposition

When disposing products please dispose them properly with a industry waste company.

●Precaution for Foreign exchange and Foreign trade act

Since concerned goods might be fallen under controlled goods prescribed by Foreign exchange and Foreign trade act,

please consult with ROHM in case of export.

●Prohibitions Regarding Industrial Property

1) Information and data on products, including application examples, contained in these specifications are simply for

reference; the Company does not guarantee any industrial property rights, intellectual property rights, or any other

rights of a third party regarding this information or data. Accordingly, the Company does not bear any responsibility for:

[a] infringement of the intellectual property rights of a third party

[b] any problems incurred by the use of the products listed herein.

2) The Company prohibits the purchaser of its products to exercise or use the intellectual property rights, industrial

property rights, or any other rights that either belong to or are controlled by the Company, other than the right to use,

sell, or dispose of the products.