VS-ETU3006S-M3, VS-ETU3006-1-M3
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Revision: 26-Oct-17 1Document Number: 93592
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Ultrafast Rectifier, 30 A FRED Pt®
FEATURES
• Low forward voltage drop
• Ultrafast recovery time
• 175 °C operating junction temperature
• Low leakage current
• Designed and qualified according to
JEDEC®-JESD 47
• Meets MSL level 1, per J-STD-020, LF maximum peak
of 245 °C
• Material categorization: for definitions of compliance
please see www.vishay.com/doc?99912
DESCRIPTION
Ultralow VF, soft-switching ultrafast rectifiers optimized for
Discontinuous (Critical) Mode (DCM) Power Factor
Correction (PFC).
The minimized conduction loss, optimized stored charge
and low recovery current minimized the switching losses
and reduce over dissipation in the switching element and
snubbers.
The device is also intended for use as a freewheeling diode
in power supplies and other power switching applications.
APPLICATIONS
AC/DC SMPS 70 W to 400 W
e.g. laptop and printer AC adaptors, desktop PC, TV and
monitor, games units, and DVD AC/DC power supplies.
PRIMARY CHARACTERISTICS
IF(AV) 30 A
VR600 V
VF at IF1.15 V
trr (typ.) 30 ns
TJ max. 175 °C
Package D2PAK (TO-263AB), TO-262AA
Circuit configuration Single
D
2
PAK (TO-263AB) TO-262AA
1
3
2
1
3
2
TO-262
N/C Anode
13
2
D2PA K
Anode
13
Base
cathode
2
N/C
ABSOLUTE MAXIMUM RATINGS
PARAMETER SYMBOL TEST CONDITIONS MAX. UNITS
Repetitive peak reverse voltage VRRM 600 V
Average rectified forward current IF(AV) TC = 113 °C 30 A
Non-repetitive peak surge current IFSM TC = 25 °C 200
Operating junction and storage temperatures TJ, TStg -65 to +175 °C
ELECTRICAL SPECIFICATIONS (TJ = 25 °C unless otherwise specified)
PARAMETER SYMBOL TEST CONDITIONS MIN. TYP. MAX. UNITS
Breakdown voltage,
blocking voltage
VBR,
VRIR = 100 μA 600 - -
V
Forward voltage VF
IF = 30 A - 1.4 2.0
IF = 30 A, TJ = 150 °C - 1.15 1.35
Reverse leakage current IR
VR = VR rated - 0.02 30 μA
TJ = 150 °C, VR = VR rated - 30 250
Junction capacitance CTVR = 600 V - 20 - pF
Series inductance LSMeasured lead to lead 5 mm from package body - 8.0 - nH
VS-ETU3006S-M3, VS-ETU3006-1-M3
www.vishay.com Vishay Semiconductors
Revision: 26-Oct-17 2Document Number: 93592
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THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
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Fig. 1 - Typical Forward Voltage Drop Characteristics Fig. 2 - Typical Values of Reverse Current vs. Reverse Voltage
DYNAMIC RECOVERY CHARACTERISTICS (TJ = 25 °C unless otherwise specified)
PARAMETER SYMBOL TEST CONDITIONS MIN. TYP. MAX. UNITS
Reverse recovery time trr
IF = 1 A, dIF/dt = 50 A/μs, VR = 30 V - 30 45
nsTJ = 25 °C
IF = 30 A
dIF/dt = 200 A/μs
VR = 200 V
-45-
TJ = 125 °C - 100 -
Peak recovery current IRRM
TJ = 25 °C - 5.6 - A
TJ = 125 °C - 10 -
Reverse recovery charge Qrr
TJ = 25 °C - 127 - nC
TJ = 125 °C - 580 -
THERMAL - MECHANICAL SPECIFICATIONS
PARAMETER SYMBOL TEST CONDITIONS MIN. TYP. MAX. UNITS
Maximum junction and storage
temperature range TJ, TStg -65 - 175 °C
Thermal resistance,
junction-to-case RthJC - 0.95 1.4 °C/W
Thermal resistance,
junction-to-ambient RthJA Typical socket mount - - 70
Thermal resistance,
case-to-heatsink RthCS Mounting surface, flat, smooth, and greased - 0.5 -
Weight -2.0- g
-0.07- oz.
Mounting torque 6
(5) -12
(10)
kgf · cm
(lbf · in)
Marking device Case style D2PAK (TO-263AB) ETU3006S
Case style TO-262AA ETU3006-1
VFM - Forward Voltage Drop (V)
IF - Instantaneous Forward Current (A)
0.0 0.5 1.0 1.5 2.0 2.5
1
10
100
1000
TJ = 25 °C
TJ = 150 °C
TJ = 175 °C
0 100 200 300 400 500 600
0.001
0.01
0.1
1
10
100
1000
150°C
175°C
25°C
50°C
75°C
125°C
100°C
VR - Reverse Voltage (V)
I
R
- Reverse Current (μA)
VS-ETU3006S-M3, VS-ETU3006-1-M3
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Revision: 26-Oct-17 3Document Number: 93592
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Fig. 3 - Typical Junction Capacitance vs. Reverse Voltage
Fig. 4 - Max. Thermal Impedance ZthJC Characteristics
Fig. 5 - Maximum Allowable Case Temperature vs.
Average Forward Current
Fig. 6 - Forward Power Loss Characteristics
0100 200 300 400 500 600
1
10
100
1000
VR - Reverse Voltage (V)
CT - Junction Capacitance (pF)
t
1
- Rectangular Pulse Duration (s)
1E-05 1E-04 1E-03 1E-02 1E-0 1E+00
0.01
0.1
1
10
Single Pulse
(Thermal Resistance)
D = 0.02
D = 0.05
D = 0.1
D = 0.2
D = 0.5
D = 0.01
Z
thJC
-
Thermal Impedance (°C/W)
0 5 10 15 20 25 30 35 40 45
90
100
110
120
130
140
150
160
170
180
DC
Allowable Case Temperature (°C)
IF(AV) - Average Forward Current (A)
Average Power Loss (W)
0 5 10 15 20 25 30 35 40 45
0
20
10
30
40
50
60
D = 0.01
D = 0.02
D = 0.05
D = 0.1
D = 0.2
D = 0.5
DC
RMS Limit
IF(AV) - Average Forward Current (A)
VS-ETU3006S-M3, VS-ETU3006-1-M3
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Revision: 26-Oct-17 4Document Number: 93592
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Fig. 7 - Typical Reverse Recovery vs. dIF/dt Fig. 8 - Typical Stored Charge vs. dIF/dt
Fig. 9 - Reverse Recovery Waveform and Definitions
t
rr
(ns)
dIF/dt (A/μs)
10
20
30
40
50
60
70
80
90
100
110
120
130
100 1000
I
F = 30 A, 25 °C
typical value
IF = 30 A, 125 °C
Qrr (nC)
dI
F
/dt (A/μs)
200
0
400
600
800
1000
1200
1400
1600
1800
100 1000
IF = 30 A, 125 °C
IF = 30 A, 25 °C
typical value
Q
rr
0.5 I
RRM
di
(rec)M
/dt
0.75 I
RRM
I
RRM
t
rr
t
b
t
a
I
F
di
F
/dt
0
(1)
(2)
(3)
(4)
(5)
(1) diF/dt - rate of change of current
through zero crossing
(2) IRRM - peak reverse recovery current
(3) trr - reverse recovery time measured
from zero crossing point of negative
going IF to point where a line passing
through 0.75 IRRM and 0.50 IRRM
extrapolated to zero current.
(4) Qrr - area under curve dened by trr
and IRRM
trr x IRRM
2
Qrr =
(5) di(rec)M/dt - peak rate of change of
current during tb portion of trr
VS-ETU3006S-M3, VS-ETU3006-1-M3
www.vishay.com Vishay Semiconductors
Revision: 26-Oct-17 5Document Number: 93592
For technical questions within your region: DiodesAmericas@vishay.com, DiodesAsia@vishay.com, DiodesEurope@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
ORDERING INFORMATION TABLE
ORDERING INFORMATION (Example)
PREFERRED P/N QUANTITY PER TUBE MINIMUM ORDER QUANTITY PACKAGING DESCRIPTION
VS-ETU3006S-M3 50 1000 Antistatic plastic tube
VS-ETU3006-1-M3 50 1000 Antistatic plastic tube
VS-ETU3006STRR-M3 800 800 13" diameter reel
VS-ETU3006STRL-M3 800 800 13" diameter reel
LINKS TO RELATED DOCUMENTS
Dimensions D2PAK (TO-263AB) www.vishay.com/doc?96164
TO-262AA www.vishay.com/doc?96165
Part marking information D2PAK (TO-263AB) www.vishay.com/doc?95444
TO-262AA www.vishay.com/doc?95443
Packaging information D2PAK (TO-263AB) www.vishay.com/doc?95032
SPICE model www.vishay.com/doc?96438
2- Circuit configuration
E = single
1- Vishay Semiconductors product
3- T = TO-220
4- U = ultrafast recovery time
5- Current code (30 = 30 A)
6- Voltage code (06 = 600 V)
7- • S = D2PAK (TO-263AB)
- • -1 = TO-262AA
Device code
51 32 4 6
VS- E T U 30 06 S TRL -M3
789
9- -M3 = halogen-free, RoHS-compliant, and terminations lead (Pb)-free
8- • None = tube (50 pieces)
- • TRL = tape and reel (left oriented, for D2PAK (TO-263AB) package)
- • TRR = tape and reel (right oriented, for D2PAK (TO-263AB) package)
Outline Dimensions
www.vishay.com Vishay Semiconductors
Revision: 08-Jul-15 1Document Number: 95046
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D2PAK
DIMENSIONS in millimeters and inches
Notes
(1) Dimensioning and tolerancing per ASME Y14.5 M-1994
(2) Dimension D and E do not include mold flash. Mold flash shall not exceed 0.127 mm (0.005") per side. These dimensions are measured at
the outmost extremes of the plastic body
(3) Thermal pad contour optional within dimension E, L1, D1 and E1
(4) Dimension b1 and c1 apply to base metal only
(5) Datum A and B to be determined at datum plane H
(6) Controlling dimension: inch
(7) Outline conforms to JEDEC® outline TO-263AB
SYMBOL MILLIMETERS INCHES NOTES SYMBOL MILLIMETERS INCHES NOTES
MIN. MAX. MIN. MAX. MIN. MAX. MIN. MAX.
A 4.06 4.83 0.160 0.190 D1 6.86 8.00 0.270 0.315 3
A1 0.00 0.254 0.000 0.010 E 9.65 10.67 0.380 0.420 2, 3
b 0.51 0.99 0.020 0.039 E1 7.90 8.80 0.311 0.346 3
b1 0.51 0.89 0.020 0.035 4 e 2.54 BSC 0.100 BSC
b2 1.14 1.78 0.045 0.070 H 14.61 15.88 0.575 0.625
b3 1.14 1.73 0.045 0.068 4 L 1.78 2.79 0.070 0.110
c 0.38 0.74 0.015 0.029 L1 - 1.65 - 0.066 3
c1 0.38 0.58 0.015 0.023 4 L2 1.27 1.78 0.050 0.070
c2 1.14 1.65 0.045 0.065 L3 0.25 BSC 0.010 BSC
D 8.51 9.65 0.335 0.380 2 L4 4.78 5.28 0.188 0.208
c
B
Detail A
c2
AA
A
± 0.004 B
M
A
Lead tip
(3)
(3)
View A - A
(E)
(D1)
E1
B
H
A1
Detail “A”
Rotated 90 °CW
Scale: 8:1
L
Gauge
plane
0° to 8°
L3
L4
Seating
plane
Section B - B and C - C
Scale: None
(4)
(4)
(b, b2)
b1, b3
(c) c1
Base
Metal
Plating
Conforms to JEDEC
®
outline D
2
PAK (SMD-220)
132
D
C
A
L2
E
(2)(3)
(2)
4
H
BB
2 x b
2 x b2
L1
0.010 AB
MM
(3)
e
2 x
Pad layout
MIN.
11.00
(0.43)
MIN.
9.65
(0.38)
MIN.
3.81
(0.15)
MIN.
2.32
(0.08)
17.90 (0.70)
15.00 (0.625)
2.64 (0.103)
2.41 (0.096)
Document Number: 95419 For technical questions within your region, please contact one of the following: www.vishay.com
Revision: 04-Oct-10 DiodesAmericas@vishay.com, DiodesAsia@vishay.com, DiodesEurope@vishay.com 1
TO-262
Outline Dimensions
Vishay Semiconductors
DIMENSIONS in millimeters and inches
Notes
(1) Dimensioning and tolerancing as per ASME Y14.5M-1994
(2) Dimension D and E do not include mold flash. Mold flash shall
not exceed 0.127 mm (0.005") per side. These dimensions are
measured at the outmost extremes of the plastic body
(3) Thermal pad contour optional within dimension E, L1, D1 and E1
(4) Dimension b1 and c1 apply to base metal only
(5) Controlling dimension: inches
(6) Outline conform to JEDEC TO-262 except A1 (maximum), b
(minimum) and D1 (minimum) where dimensions derived the
actual package outline
SYMBOL
MILLIMETERS INCHES
NOTES
MIN. MAX. MIN. MAX.
A 4.06 4.83 0.160 0.190
A1 2.03 3.02 0.080 0.119
b 0.51 0.99 0.020 0.039
b1 0.51 0.89 0.020 0.035 4
b2 1.14 1.78 0.045 0.070
b3 1.14 1.73 0.045 0.068 4
c 0.38 0.74 0.015 0.029
c1 0.38 0.58 0.015 0.023 4
c2 1.14 1.65 0.045 0.065
D 8.51 9.65 0.335 0.380 2
D1 6.86 8.00 0.270 0.315 3
E 9.65 10.67 0.380 0.420 2, 3
E1 7.90 8.80 0.311 0.346 3
e 2.54 BSC 0.100 BSC
L 13.46 14.10 0.530 0.555
L1 - 1.65 - 0.065 3
L2 3.56 3.71 0.140 0.146
(4)
(4) Base
metal
Plating b1, b3
(b, b2)
c1
c
Section B - B and C - C
Scale: None
Section A - A
(3)
E1
(3)D1
E
B
A
A
A
c2
c
A1
Seating
plane
Lead tip
(3)
(2) (3)
(2)
A
E
(Datum A)
L1
L2
BB
CC
3
2
1
L
D
2 x e
3 x b2
3 x b
0.010 A B
MM
Modified JEDEC outline TO-262
Lead assignments
Diodes
1. - Anode (two die)/open (one die)
2., 4. - Cathode
3. - Anode
Legal Disclaimer Notice
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Revision: 08-Feb-17 1Document Number: 91000
Disclaimer
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RELIABILITY, FUNCTION OR DESIGN OR OTHERWISE.
Vishay Intertechnology, Inc., its affiliates, agents, and employees, and all persons acting on its or their behalf (collectively,
“Vishay”), disclaim any and all liability for any errors, inaccuracies or incompleteness contained in any datasheet or in any other
disclosure relating to any product.
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the continuing production of any product. To the maximum extent permitted by applicable law, Vishay disclaims (i) any and all
liability arising out of the application or use of any product, (ii) any and all liability, including without limitation special,
consequential or incidental damages, and (iii) any and all implied warranties, including warranties of fitness for particular
purpose, non-infringement and merchantability.
Statements regarding the suitability of products for certain types of applications are based on Vishay’s knowledge of
typical requirements that are often placed on Vishay products in generic applications. Such statements are not binding
statements about the suitability of products for a particular application. It is the customer’s responsibility to validate that a
particular product with the properties described in the product specification is suitable for use in a particular application.
Parameters provided in datasheets and / or specifications may vary in different applications and performance may vary over
time. All operating parameters, including typical parameters, must be validated for each customer application by the customer’s
technical experts. Product specifications do not expand or otherwise modify Vishay’s terms and conditions of purchase,
including but not limited to the warranty expressed therein.
Except as expressly indicated in writing, Vishay products are not designed for use in medical, life-saving, or life-sustaining
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Please contact authorized Vishay personnel to obtain written terms and conditions regarding products designed for
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