SEMICONDUCTORS
SUMMARY
Schottky Diode VR= 40V; IF= 0.7A; IR= 10 A
DESCRIPTION
This compact SOT23 packaged Schottky diode offers users an excellent performance
combination comprising high current operation, extremely low leakage and low forward
voltage ensuring suitability for applications requiring efficient operation at higher
temperatures (above 85⬚C) see Operational efficiency chart on page 4.
Key benefits:
Performance capability equivalent to much larger packages
Improved circuit efficiency & power levels
PCB area savings
FEATURES
•Extremely low leakage (10␮A @30V)
•High current capability (IF= 0.7A)
•Low VF, fast switching Schottky
•SOT23 package
•ZLLS500 complements low temperature equivalent ZHCS500
•Package thermally rated to 150⬚C
APPLICATIONS
•DC - DC converters
•Strobes
•Mobile phones
•Charging circuits
•Motor control
DEVICE MARKING
L05
ZLLS500
ISSUE 3 - MAY 2006
1
40V SILICON HIGH CURRENT LOW LEAKAGE SCHOTTKY DIODE
DEVICE REEL
(inches)
TAPE WIDTH
(mm)
QUANTITY
PER REEL
ZLLS500TA 7 8mm embossed 3000 units
ZLLS500TC 13 8mm embossed 10000 units
ORDERING INFORMATION
Top view
ZLLS500
SEMICONDUCTORS
ISSUE 3 - MAY 2006
2
PARAMETER SYMBOL VALUE UNIT
Schottky Diode
Continuous reverse voltage VR40 V
Forward current IF0.7 A
Peak repetitive forward current
Rectangular pulse duty cycle
IFPK 1.14 A
Non repetitive forward current t=ⱕ100␮s
t=ⱕ10ms
IFSM 13
3.2
A
A
Package
Power dissipation at Tamb=25⬚C
single die continuous
single die measured at t<5 secs
PD500
630
mW
mW
Storage temperature range Tstg -55 to +150 ⬚C
Junction temperature Tj 150 ⬚C
ABSOLUTE MAXIMUM RATINGS
PARAMETER SYMBOL VALUE UNIT
Junction to ambient (a) R⍜JA 250 °C/W
Junction to ambient (b) R⍜JA 198 °C/W
THERMAL RESISTANCE
Notes
(a) For a device surface mounted on 25mm x 25mm FR4 PCB with high coverage of single sided 1oz copper,
in still air conditions.
(b) For a device surface mounted on FR4 PCB measured at t<5secs.
ZLLS500
SEMICONDUCTORS
ISSUE 3 - MAY 2006
3
TYPICAL CHARACTERISTICS
Operational efficiency chart
The operational efficiency chart indicates the beneficial use of the ZLLS series diodes in applications requiring
higher voltage, higher temperature operation. Circuits requiring low voltage low temperature operation will
benefit from using Zetex low VFZHCS series diodes.
ZLLS500
SEMICONDUCTORS
ISSUE 3 - MAY 2006
4
SCHOTTKY DIODE CHARACTERISTICS
PARAMETER SYMBOL MIN. TYP. MAX. UNIT CONDITIONS
Reverse breakdown voltage V(BR)R 40 V IR=200µA
Forward voltage VF305
335
395
465
550
620
710
415
360
390
450
530
630
710
800
mV
mV
mV
mV
mV
mV
mV
mV
IF=50 mA*
IF=100 mA*
IF=250mA*
IF=500mA*
IF=750mA*
IF=1A*
IF=1.5A*
IF=500mA*,Ta = 100⬚C
Reverse current IR6
370
10 ␮A
␮A
VR=30V
VR=30V,Ta = 85⬚C
Diode capacitance CD16 pF f=1MHz,VR=30V
Reverse recovery time
Reverse recovery charge
trr
Qrr
3
210
ns
pC
Switched from
IF= 500mA to VR=5.5V
Measured @ IR50mA.
di /d t = 500mA/ ns.
Rsource = 6⍀;Rload= 10⍀
ELECTRICAL CHARACTERISTICS (at Tamb = 25°C unless otherwise stated)
*Measured under pulsed conditions. Pulse width = 300µS. Duty cycle 艋2%.
ZLLS500
SEMICONDUCTORS
ISSUE 3 - MAY 2006
5
TYPICAL CHARACTERISTICS
ZLLS500
SEMICONDUCTORS
6
ISSUE 3 - MAY 2006
Europe
Zetex GmbH
Streitfeldstraße 19
D-81673 München
Germany
Telefon: (49) 89 45 49 49 0
Fax: (49) 89 45 49 49 49
europe.sales@zetex.com
Americas
Zetex Inc
700 Veterans Memorial Hwy
Hauppauge, NY 11788
USA
Telephone: (1) 631 360 2222
Fax: (1) 631 360 8222
usa.sales@zetex.com
Asia Pacific
Zetex (Asia) Ltd
3701-04 Metroplaza Tower 1
Hing Fong Road, Kwai Fong
Hong Kong
Telephone: (852) 26100 611
Fax: (852) 24250 494
asia.sales@zetex.com
Corporate Headquarters
Zetex Semiconductors plc
Zetex Technology Park
Chadderton, Oldham, OL9 9LL
United Kingdom
Telephone (44) 161 622 4444
Fax: (44) 161 622 4446
hq@zetex.com
These offices are supported by agents and distributors in major countries world-wide.
This publication is issued to provide outline information only which (unless agreed by the Company in writing) may not be used, applied or reproduced
for any purpose or form part of any order or contract or be regarded as a representation relating to the products or services concerned. The Company
reserves the right to alter without notice the specification, design, price or conditions of supply of any product or service.
For the latest product information, log on to www.zetex.com
© Zetex Semiconductors plc 2006
Pad LayoutPackage Outline
DIM
Millimeters Inches
Min Max Min Max
A 2.67 3.05 0.105 0.120
B 1.20 1.40 0.047 0.055
C – 1.10 – 0.043
D 0.37 0.53 0.0145 0.021
F 0.085 0.15 0.0033 0.0059
G NOM 1.9 NOM 0.075
K 0.01 0.10 0.0004 0.004
L 2.10 2.50 0.0825 0.0985
NNOM 0.95 NOM 0.037
Package Dimensions