SLUS566A - JULY 2003 - REVISED NOVEMBER 2003 ! " " FEATURES D Integrated Power Interface Switch for IEEE D D D D D D D D D DESCRIPTION Acting as an interface between the Power Source Equipment (PSE) and the Powered Device (PD), the TPS2371 performs all detection, class- ification, inrush current limiting, and switch FET control that is necessary for compatibility with Legacy/IEEE 802.3af Standard. The TPS2371 incorporates precision UVLO thresholds and hysteresis as well as a UVLO off-time delay to enable Legacy IEEE802.3af PoE compatibilty. An internal 0.3- FET provides maximum power delivery. As an additional feature, the TPS2371 interfaces with the enable/soft-start signal of a dc-to-dc converter, eliminating the need to have an accurate UVLO in the dc-to-dc converter. 802.3af Powered Devices (PDs) Precision UVLO Thresholds 20-ms UVLO Off-Time Delay Provides PD Detection Signature Provides PD Classification Signature (Class 0-4) Programmable Inrush Current Limit Internal 0.3- Low-Side FET Interfaces to DC/DC Soft-Start for DC/DC Enable Internal Thermal Protection - Disconnects PD Load 8-Pin SOIC, 8-Pin TSSOP Packages At low input voltages (1.8 V to 10 V), the TPS2371 draws less than 12 A, allowing accurate sensing of the external 24.9-k discovery resistor. At input voltages between 15 V and 20 V, an external resistor sets the level of current to be drawn during classification mode. TPS2371 is compatible with current as well as voltage measurement schemes for classification. Above 20-V input, the classification current is shut off, reducing internal power dissipation. APPLICATIONS D VoIP Phones D Internet Appliances D Wireless LAN Access Points D Bluetooth Access Points SIMPLIFIED APPLICATION DIAGRAM V+ RDET CBYPASS 8 3 44 V TO 57 V TPS2371 RLIM CDEL 1 CLIM DC/DC VREG Converter/ Controller 6 RCLASS SMAJ54A CDCDCIN 7 Ethernet Appliance CSS 2 5V 4 5 V- UDG-03092 Bluetooth is a trademark of the Bluetooth SIG, Inc. "# " $%&'($% $) *+&&,%( ) -+./$*($% 0(, &0+*() *%&' ( )-,*$$*($%) -,& (1, (,&') ,2) %)(&+',%() )(%0&0 3&&%(4 &0+*($% -&*,))$%5 0,) %( %,*,))&$/4 $%*/+0, (,)($%5 // -&',(,&) Copyright 1999 - 2003, Texas Instruments Incorporated www.ti.com 1 SLUS566A - JULY 2003 - REVISED NOVEMBER 2003 DESCRIPTION (continued) The TPS2371 drives an internal low-side FET for control of the return side of the power path. The internal FET is turned on when the input voltage reaches 36 V and above. When the input voltage decreases, the FET remains on until the input voltage drops to below 30 V. During initial turn-on of the switch (inrush mode), an external resistor is used to program the inrush current, allowing a wide range of capacitor values to be used at the load. According to IEEE 802.3af specification, inrush current of 400 mA is allowed only for 50 ms, limiting the load capacitor to approximately 180 F. A programmable inrush current limit removes this limitation, allowing a larger capacitor to be used with a lower inrush current limit. These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates. ABSOLUTE MAXIMUM RATINGS Over operating free-air temperature range unless otherwise noted (2) TPS2371 Input voltage range, wrt VEE ILIM, DELAY 4 CLASS 12 DET, RTN, EN_DC, VDD 68 UNIT V Operating junction temperature range, TJ -55 to 150 C Storage temperature, Tstg -65 to 150 C Lead temperature 1,6 mm (1/16 inch) from case for 10 seconds 300 C (2) Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. RECOMMENDED OPERATING CONDITIONS MIN Input voltage, VI Operating junction temperature, TJ 0 NOM MAX UNIT 48 57 V 70 C DISSIPATION RATINGS(3)(4) TA < 25C POWER RATING TA = 25C DERATING FACTOR TA = 70C POWER RATING 258.5C/W 464 mW 3.9 mW/C 290 mW 176.0C/W 682 mW 5.7 mW/C 426 mW PACKAGE THERMAL IMPEDANCE JUNCTION-TO-AMBIENT 8-Pin Plastic TSSOP (PW) 8-Pin Plastic SOIC (D) (3) Test board conditions: 1. 3" x 3", 4 layers, thickness: 0.062" 2. 1.5 oz. copper traces located on the top of the PCB 3. 1.5 oz. copper ground plane on the bottom of the PCB 4. 0.5 oz. copper ground planes on the 2 internal layers 5. 12 thermal vias (see "Recommended Land Pattern" in applications section of this data sheet) (4) Maximum power dissipation may be limited by over current protection. 2 www.ti.com SLUS566A - JULY 2003 - REVISED NOVEMBER 2003 ELECTRICAL CHARACTERISTICS VDD = 48 V; TA = 0C to 70C; all voltages and currents are with respect to VEE; (unless otherwise noted) PARAMETER TEST CONDITIONS MIN TYP MAX 5 12 UNIT SUPPLY IDD IDET Offset current VDD = 1.8 V, DET = OPEN Sleep current 1.8 V VDD < 10 V, DET = OPEN Detection load current Classification current threshold 3 RDET = 24.9 k, VDD = 1.8 V 70 73 76 RDET = 24.9 k, VDD = 9.5 V 380 390 400 Turn on 10.0 12.5 14.0 Turn off 21.5 22.5 23.5 2.2 2.5 2.8 VDD current class 0 0.44 W PPoE 12.95 W, 15 V VDD 20 V, RCLASS = 4.42 k VDD current class 1 0.44 W PPoE 3.84 W, 15 V VDD 20 V, RCLASS = 953 10.4 10.8 11.5 VDD current class 2 3.84 W PPoE 6.49 W, 15 V VDD 20 V, RCLASS = 549 18.1 18.6 19.5 VDD current class 3 6.49 W PPoE 12.95 W, 15 V VDD 20 V, RCLASS = 357 27.7 28.4 29.9 VDD current class 4 Reserved for future use, 15 V VDD 20 V, RCLASS = 255 38.5 39.6 42.0 500 800 VDD quiescent current Input UVLO threshold 30 V VDD 57 V, RCLASS = 255 Turn on 33.9 35.0 36.1 Turn off 29.5 30.5 31.5 4.3 4.5 UVLO hysteresis UVLO off-time delay CDELAY = 180 nF 18 EN_DC sink current 40 RTN threshold for EN_DC 80 A A V mA A V ms 200 A 1.2 1.5 1.8 V 0.15 0.30 0.60 Full load current limit IRTN = 200 mA VRTN < 1.5 V 405 455 505 ILIM current limit programming RLIM = 125 k, VRTN > 1.5 V during startup 180 250 300 DMOS RDS(on) Thermal shutdown temperature 144 Thermal shutdown hysteresis 20 mA C D OR PW PACKAGE (TOP VIEW) ILIM CLASS DET VEE 1 8 2 7 3 6 4 5 VDD DELAY EN_DC RTN ORDERING INFORMATION TA 0C to 70C (1) PACKAGE(1) PART NUMBER Plastic TSSOP (PW) TPS2371PW Plastic SOIC (D) TPS2371D The PW and D packages are also available taped and reeled. Add an R suffix to the device type (i.e., TPS2371PWR). www.ti.com 3 SLUS566A - JULY 2003 - REVISED NOVEMBER 2003 TERMINAL FUNCTIONS TERMINAL NAME NO. I/O DESCRIPTION CLASS 2 O Sets classification level with a single resistor to VEE. A precision voltage of 10.0 V is applied to this pin during classification. RCLASS values listed in Table 1. DELAY(2) 7 I UVLO turn-off delay programming. Connect a capacitor between VCC and this pin to program the UVLO turn-off delay. DET 3 O Connect the 24.9k detection resistor (RDET) between this pin and VDD. EN_DC 6 O Ties to dc-to-dc converter's shutdown or soft-start pin. Sinks 80A until the load capacitor is fully charged. ILIM(1) 1 O Sets startup current limit level with a resistor to VEE. If using CDC2DCIN > 180 F, IRUSH must be less than 400 mA. Extra capacitance on ILIM pin can cause oscillations in the current waveform. RTN 5 O Return pin. Connect this pin to input return side of the dc-to-dc converter. VDD 8 I Connection to PD input port positive voltage. VEE 4 I Input side power return for the controller. NOTE 1: I INRUSH + 450 mA * 25 kW R LIM NOTE 2: T DELAY + 100 ms mF (1 A) C DELAY DETAILED PIN DESCRIPTIONS ILIM (Pin 1) Inrush current limiting pin. This pin is used to program the inrush current of the device. Due to the low UVLO hysteresis of this device, a 1.0-F capacitor from this pin to VEE is necessary to allow startup with 20 in series with VDD as required by the IEEE standards. By placing a resistor to VEE from this pin, the inrush current into the load will be limited via the following equation: I INRUSH + 450 mA * 25 kW R LIM (1 A) (1) CLASS (Pin 2) Classification pin. The PD can be optionally classified by adding a resistor from this pin to ground. The resistor specific to each class is given in Table 1: PoE Classification Resistance Values. DET (Pin3) Detection pin. This pin is used to set up the detection resistance during PD detection. By tying a resistor, RDET, from this pin to VDD, the user sets the detection resistance. It should be noted that the device itself looks like approximately 1 M of resistance in parallel with RDET. VEE (Pin 4) Negative supply to the device. RET (Pin 5) Negative supply to the load. This pin is the drain side of a FET between the RET pin and the VEE pin, providing hot swap capabilities to the load. When the FET is switched on, there is approximately 300m between this pin and VEE. 4 www.ti.com SLUS566A - JULY 2003 - REVISED NOVEMBER 2003 DETAILED PIN DESCRIPTIONS (continued) EN_DC (Pin 6) Enable pin for the load. This pin is intended to be used with a dc-to-dc coverter with a soft start capacitor. When power is not available to the dc-to-dc converter, this pin sinks 80-A and hold off the softstart cap on the dc-to-dc converter. Once the voltage across the load is within 1.5 V of its final value, the EN_DC pin stops drawing current and become high impedance, allowing the dc-to-dc to soft start normally. DELAY (Pin 7) This pin controls the amount of time that the device ignores an undervoltage condition on VDD. That time is set by the following equation: T DELAY + 100 ms mF C DELAY (2) VDD (Pin 8) Positive supply to the device. Table 1. PoE Classification Resistance Values CLASS RESISTANCE (RCLASS) VALUE () POWERED DEVICES (PDs) Power (W) 0 4420 0.44 - 12.95 2.5 1 953 0.44 - 3.84 10.8 2 549 3.84 - 6.49 18.6 3 357 6.49 - 12.95 28.4 4 255 reserved for future use 39.6 www.ti.com CLASSIFICATION CURRENT (mA) 5 SLUS566A - JULY 2003 - REVISED NOVEMBER 2003 INTERNAL BLOCK DIAGRAM TO DC/DC's EN/SS +VE SUPPLY VDD RDET 24.9 k 8 DELAY UVLO, Detection, Classification Control CLASS 2 LDO 10 V CSS Precision Bandgap Reference DET Precision Current Source 3 CBYBASS 7 Internal Supplies 5V 60 V 80 A VEE 15 V EN_DC 6 1.5 V RCLASS 5V RTN ILIM 5 20 A 1 + 2 k 0.1 TO DC/DC's INPUT RETURN 4 CLIM RLIM VEE -VE SUPPLY 6 UDG-03093 www.ti.com SLUS566A - JULY 2003 - REVISED NOVEMBER 2003 STATE DIAGRAM DETECTION VDD < 10 V IDD = VDD/(RDET) || 1 M Switch Resistance > 100 M Power Down CLASSIFICATION 10 V < VDD < 22 V IDD 10 V/(RCLASS) Switch Resistance > 100 M INRUSH MODE VDD > 36 V (rising edge) VRTN > 1.5 V IRET = IINRUSH = 450 mA - (25 k/RLIM) x (1 A) Switch Resistance 100 LATCH OFF VDD > 30 V IDD < 1 mA Switch Resistance 100 M NORMAL OPERATION VDD > 30 V (IRET = ILOAD) < 450 mA Switch Resistance 0.3 NO YES TSD Count < 7? OVERLOAD/FAULT VDD > 30 V IRET = 450 mA Switch Resistance 100 YES TJ < 145 _C? THERMAL SHUTDOWN VDD > 30 V IDD < 1 mA Switch Resistance > 100 M NO MACHINE STATE 0 Detection (RLOAD = 25 k) Classification 2 15 4 6 8 10 20 UVLO OFF (Falling Edge) 25 30.5 www.ti.com UVLO ON (Rising Edge) 35 44 Normal Operation (IDD = 450 mA) 50 57 7 SLUS566A - JULY 2003 - REVISED NOVEMBER 2003 APPLICATION INFORMATION OVERVIEW With the addition of power via media dependent interface (MDI) to the IEEE 802.3af Standard, all data terminal equipment (DTE) now has the option to receive power over existing cabling that is used for data transmission. The IEEE 802.3af Standard defines the requirements associated with providing and receiving power over the existing cabling. The power sourcing equipment (PSE) provides the power on the cable and the powered device (PD) receives the power. As part of the IEEE 802.3af Standard, the interface between the PSE and PD is defined as it relates to the detection and classification protocol. POWER SOURCING EQUIPMENT DETECTION OF A POWERED DEVICE A powered device (PD) draws power or requests power by participating in a PD detection algorithm. This algorithm requires the power sourcing equipment (PSE) to probe the link looking for a valid PD. The PSE probes the link by sending out a voltage between 2.8 V and 10 V across the power lines. A valid PD detects this voltage and places a resistance of between 23.75 k and 26.25k across the power lines. Naturally, the current varies depending on the input voltage. Upon detecting this current, the PSE concludes that a valid PD is connected at the end of the ethernet cable and is requesting power. If the powered device (PD) is in a state in which it does not accept power, the PD is required to place a resistance above or below the values listed for a valid PD. On the lower end, a range between 12 k and 23.75 k signifies that the PD does not require power. On the higher end, the range is defined to be between 26.25 k and 45 k . Any resistance value less than 12 k and greater than 45 k, is interpreted by the PSE as a non-valid PD detection signature. The TPS2371 participates in the detection algorithm by activating an internal FET, which connects the DET pin of the device to VEE. As a result, any resistance connected between VDD and the DET pin of the TPS2371 is, in effect, across the power lines. This internal FET is active only when input power to the PD is between 2.8 V and 10 V. POWER SOURCING EQUIPMENT CLASSIFICATION OF A POWERED DEVICE After the detection phase, the PSE can optionally initiate a classification of the PD. The classification of a PD is used by the PSE to determine the maximum power required by the PD during normal operation. Five different levels of classification are defined by the IEEE 802.3af Standard. These levels are shown in Table 2. Table 2. Powered Device Classification Levels CLASS 8 USAGE POWER DEVICE POWER (W) CLASSIFICATION CURRENT (mA) MIN MAX MIN MAX 0 Default 0.44 12.95 0 4 1 Optional 0.44 3.84 9 12 2 Optional 3.84 6.49 17 20 3 Optional 6.49 12.95 26 30 4 Not allowed 36 44 reserved for future use www.ti.com SLUS566A - JULY 2003 - REVISED NOVEMBER 2003 APPLICATION INFORMATION Classification of the PD is optionally performed by the PSE only after a valid PD has been detected. To determine PD classification, the PSE increases the voltage across the power lines to between 15.5 V and 20.5 V. The amount of current drawn by the PD determines the classification (see Table 2). When the input voltage to the TPS2371 is between 14.0 V and 20.5 V, the TPS2371 uses an internal regulator to generate a fixed voltage on the CLASS pin. A resistor connected between the CLASS pin and VEE draws a fixed amount of current and thereby defines the classification level of the PD. POWER SOURCING EQUIPMENT POWER TO THE POWERED DEVICE Upon completion of the detection and optional classification phases, the PSE ramps its output voltage above 36 V . Once the UVLO threshold has been reached, the internal FET is turned on. At this point, the PD begins to operate normally and it continues to operate normally as long as the input voltage remains above 30 V. For most PDs, this input voltage is down-converted using an on board dc-to-dc converter to generate the required voltages. The TPS2371 is designed to apply the PSE output voltage of 36 V to 57 V across the input of the on board dc-to-dc converter. This is accomplished on the TPS2371 by turning on an internal pass FET located across the power return. Programming the Inrush Current During the initial turn-on of the pass FET, an inrush current is created from the charging of the capacitance at the input of the dc-to-dc converter. According to the IEEE 802.3af specification, if the input capacitance is less than 180-F, the PSE limits the inrush current. If the input capacitance is greater than 180-F, the IEEE 802.3af specification requires the PD to limit the inrush current to less than 400 mA. In order to satisfy the IEEE 802.3af requirements, the TPS2371 has been designed for a typical current limit of 450 mA. This current limit setting satisfies the normal operation requirements as well as the inrush requirements for a capacitive load of 180-F or less. If a larger load capacitor is desired, the TPS2371 has been designed with a programmable inrush current limit feature. This feature allows the designer the option of using a capacitor larger than 180-F. Note that the inrush current feature may also be used to lower voltage drops in the cabling between the PSE and the PD during startup. The programmable inrush current limit has a range of 50 mA to 449 mA. The limit is set by connecting an external resistor from ILIM (pin 1) to VEE (pin 4) of the TPS2371. Equation (3) shows the calculation for the programmable inrush current limit. I INRUSH + 450 mA * 25 kW R LIM (1 A) (3) where RLIM is a value between 63.5 k and 25 M. www.ti.com 9 SLUS566A - JULY 2003 - REVISED NOVEMBER 2003 APPLICATION INFORMATION Using EN_DC as a SoftStart or a PowerGood Function The EN_DC pin is an output intended for use as a soft-start for a dc-to-dc converter. During the initial turn-on of the pass FET, an internal 80-A current sink is enabled on the EN_DC pin. This internal current sink is removed only after the load capacitance has been charged to within 1.5-V of the supply voltage. By connecting the EN_DC output to the soft start capacitor of a dc-to-dc converter, the internal current sink keeps the dc-to-dc converter off during startup. Once the voltage across the converter has reached within 1.5 V of full voltage, the dc-to-dc converter is allowed to soft start. A 5-V zener diode connected between EN_DC and RTN is required for operation in this architecture. For operation as a powergood output, the EN_DC requires an external pull-up. A 1-M resistor is recommended. The EN_DC output also requires a clamp to limit the output voltage to within recommended operating levels. A 5-V zener diode connected between EN_DC and RTN (pin 5 of the TPS2371) is recommended. This configuration allows the EN_DC pin to act as an open drain output with which many designers are more familiar. SURGE SUPPRESSION As specified in the Absolute Maximum Ratings table, the absolute maximum input voltage of the TPS2371 is 68 V. The IEEE 802.3af Power-Over-Ethernet Standard specifies the voltage range of PSE output is between 44 V asd 57 V. This PSE output voltage range would be reduced by cable, connector and other IR drops between the PSE and the TPS2371 in the PD. However, the use of extended cable lengths and transformers in some applications may induce transients in excess of 68 V during a hot plug event. To manage these transient events and keep them from significantly exceeding the application's maximum voltage, a transorb such as the SMAJ54A should be placed between the positive input supply, VDD (pin 8), and the negative input supply, VEE (pin 4). This, combined with a 0.1-F bypass capacitor in parallel with the transorb helps to protect the TPS2371 from damage caused by transients during hot plug events. The transorb or zener diode should be selected such that it does not zener below the maximum required application voltage of 57 V, but before reaching the 68-V absolute maximum rating. For layout purposes, the 0.1-F capacitor should be placed as close as possible to the device; the transorb or zener diode should be placed as close to the supply connector as possible. Based on the nature of the PD application, these measures should be considered an implementation requirement. USE OF BARREL RECTIFIERS Many applications use barrel rectifiers after the RJ-45 connector in order to be polarity insensitive. Barrel rectifiers in front of the TPS2371 cause the voltages at the device to be lower than the voltages at the RJ-45. The TPS2371 allows for this and is IEEE802.3af compliant during the detection and classification phases. For the detection phase, the device begins detection for voltages as low as 1.3 V across the supply pins. For the optional classification phase, the device is guaranteed to start classification below 14 V across the supply pins. Once classification has been engaged, it becomes latched-in and further voltage drops due to cable resistance and class current does not cause it to switch out of classification. However, in cases where the PSE is operating at minimum class voltage (15.5 V) and there is a 20-, 100-m cable between the PSE and the PD, Class 3 devices may not classify correctly when using barrel rectifiers. Class 3 device designs should include schottky diodes to handle all corner cases or switch to Class 0 devices when using barrel rectifiers. Thermal Shutdown In the event of a short circuit or overload condition, the TPS2371 begins to heat up until thermal shutdown is reached. Once thermal shutdown is reached, the internal FET is switched off, removing the load from the supply. After the device has cooled sufficiently, it retries by restarting the internal FET. If the overload or short is not removed, the device cycles thermal shutdown seven times before latching the internal FET off. Once the internal FET is latched off, power needs to be cycled to reset the latch. 10 www.ti.com SLUS566A - JULY 2003 - REVISED NOVEMBER 2003 APPLICATION INFORMATION Figure 1 shows an application where 40 V < VIN < 57 V. In this case, the brick supply is greater then 40 V and goes through TPS2371. PoE Powered Device Front End 3 V+ RX RDET 6 CLIM 1 CSS CDCDCIN 1 V- 2 4 2 6 4 5 VREG DC/DC Converter Ethernet Device RCLASS 5 S P A R E 7 TPS2371 RLIM 44 V TO 57 V TX 8 3 V- 7 8 RJ-45 DC BRICK SUPPLY UDG-03094 Figure 1. For Applications 40 V < VIN < 57 V. Figure 2 shows an application where VIN < 36 V. In this application, the brick supply is bypassing the hot swap switch. Consequently, the dc-to-dc converter can operate from any voltage. However, for VBRICK < 23 V, a Class 0 resistor (RCLASS = 4.42 k) is recommended. This minimizes the power dissipation in TPS2371 if VBRICK falls in the classification voltage range (15 V to 20 V). The 80-A current sink on EN_DC pin is enabled only if VDD > 36 V. PoE POWERED DEVICE FRONT END 3 V+ RX RDET 6 CLIM 1 44 V TO 57 V TX 2 7 CDCDCIN CSS RLIM VREG 1 TPS2371 4 S P A R E 8 3 V- 2 6 4 5 DC/DC Converter Ethernet Device RCLASS 5 V- 7 8 RJ-45 DC BRICK SUPPLY UDG-03095 Figure 2. For Applications VIN < 40 V. www.ti.com 11 PACKAGE OPTION ADDENDUM www.ti.com 14-Apr-2009 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Eco Plan (2) Qty TPS2371D NRND SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TPS2371DG4 NRND SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TPS2371DR NRND SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TPS2371DRG4 NRND SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TPS2371PW NRND TSSOP PW 8 150 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TPS2371PWG4 NRND TSSOP PW 8 150 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TPS2371PWR NRND TSSOP PW 8 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TPS2371PWRG4 NRND TSSOP PW 8 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Lead/Ball Finish MSL Peak Temp (3) (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 14-Jul-2012 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant TPS2371DR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1 TPS2371PWR TSSOP PW 8 2000 330.0 12.4 7.0 3.6 1.6 8.0 12.0 Q1 Pack Materials-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 14-Jul-2012 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) TPS2371DR SOIC D 8 2500 340.5 338.1 20.6 TPS2371PWR TSSOP PW 8 2000 367.0 367.0 35.0 Pack Materials-Page 2 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. 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