74LVC1G3157
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74LVC1G3157
SINGLE-POLE DOUBLE-THROW ANALOG SWITCH
Description
The 74LVC1G3157 is a single-pole, double-throw analog switch. The
device is designed for operation with a power supply range of 1.65V
to 5.5V. The bidirectional switch can handle signal amplitudes
between Vcc and Ground. The OFF state impedance of the switch is
typically 50MΩ while the ON state is typically 6Ω.
Features
Wide Supply Voltage Range from 1.65 to 5.5V
Control Pin Includes Hysteresis Allowing for Slower Input Rise
and Fall Times
CMOS Low Power Consumption
Very Low ON-State Resistance
- 7.5Ω (typical) at VCC = 2.7V
- 6.5Ω (typical) at VCC = 3.3V
- 6Ω (typical) at VCC = 4.5V
Break Before Make Switching
Control Input accepts up to 5.5V Regardless of Vcc.
Direct Interface with TTL Levels when VCC = 3.3V
ESD Protection Tested per JESD 22
- Exceeds 200-V Machine Model (A115)
- Exceeds 2,000-V Human Body Model (A114)
- Exceeds 1,000-V Charged Device Model (C101)
Latch-Up Exceeds 100mA per JESD 78, Class I
Range of Package Options
Totally Lead-Free & Fully RoHS Compliant (Notes 1 & 2)
Halogen and Antimony Free. “Green” Device (Note 3)
Packages not to scale
(Top View)
X2-DFN1410-6
B1
43
2
1
SOT363
(Top View)
GND
B0
6
5
B1
GND
B0
A
Select
Vcc
A
Select
Vcc
1
2
3 4
5
6
Notes: 1. No purposely added lead. Fully EU Directive 2002/95/EC (RoHS) & 2011/65/EU (RoHS 2) compliant.
2. See http://www.diodes.com/quality/lead_free.html for more information about Diodes Incorporated’s definitions of Halogen- and
Antimony-free, "Green" and Lead-free.
3. Halogen- and Antimony-free "Green” products are defined as those which contain <900ppm bromine, <900ppm chlorine (<1500ppm total
Br + Cl) and <1000ppm antimony compounds.
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Ordering Information (Note 4)
74LVC1G 3157 XXX -7
Logic Device
Function
Package
Packing
74 : Logic Prefix
3157:
Analog Switch
DW : SOT363
-7 : 7” Tape & Reel
LVC : 1.65 to 5.5 V
SPDT
FZ4 : X2- DFN1410-6
Logic Family
1G : Single Gate
Device
Package
Code
Package
(Note 5)
Package
Size
7” Tape and Reel (Note 6)
Quantity
Part Number Suffix
74LVC1G3157DW-7
DW
SOT363
2.0mm x 2.0mm x 1.1mm
0.65 mm lead pitch
3,000/Tape & Reel
-7
74LVC1G3157FZ4-7
FZ4
X2-DFN1410-6
1.4mm x 1.0mm x 0.4mm
0.5 mm pad pitch
5,000/Tape & Reel
-7
Notes: 4. For packaging details, go to our website at https://www.diodes.com/design/support/packaging/diodes-packaging/.
5. Pad layout as shown in Diodes Incorporated’s package outline PDFs, which can be found on our website at
https://www.diodes.com/design/support/packaging/diodes-packaging/.
6. The taping orientation is located on our website at https://www.diodes.com/assets/Datasheets/ap02007.pdf.
Pin Descriptions
Pin Name
Description
B1
Selectable Data I/0
GND
Ground
B0
Selectable Data I/0
A
Common Data I/0
VCC
Supply Voltage
Select
Selection Pin
1
3
B1
B0 A
Select
4
6
Function Table
Select
Status
H
B1 connected to A;
B0 high impedance
L
B0 connected to A;
B1 high impedance
1
B1
B0
A
Select 4
6
3
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Absolute Maximum Ratings (Note 7)
Symbol
Description
Rating
Unit
ESD HBM
Human Body Model ESD Protection
2
kV
ESD CDM
Charged Device Model ESD Protection
1
kV
ESD MM
Machine Model ESD Protection
200
V
VCC
Supply Voltage Range
-0.5 to 6.5
V
VIN
Input Voltage Range Applicable to Select Pin
-0.5 to 6.5
V
VSW
Voltage Range Applicable to B0, B1, and A Pins
-0.5 to VCC +0.5
V
IIK
Input Clamp Current VI<0 Applicable to Select Pin
-50
mA
IIO
Continuous Current Applicable to B0,B1, and A Pins
±50
mA
ICC, IGND
Continuous current through VCC or GND
±100
mA
TJ
Operating Junction Temperature
-40 to +150
°C
TSTG
Storage Temperature
-65 to +150
°C
Note: 7. Stresses beyond the absolute maximum may result in immediate failure or reduced reliability. These are stress values and device operation should
be within recommend values.
Recommended Operating Conditions
Symbol
Parameter
Min
Max
Unit
VCC
Operating Voltage
Operating
1.65
5.5
V
VIN
Select Input Voltage
0
5.5
V
VSW
Switch Voltage (applicable to pins B0,B1,A)
-0.2
VCC
V
Δt/ΔV
Input Transition Rise or Fall
Rate – Select Pin
VCC = 1.65 to 2.7V
-
20
ns/V
VCC = 2.7V to 5.5V
-
10
TA
Operating Free-Air
Temperature
-
-40
+125
°C
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Electrical Characteristics (All typical values are at, TJ = +25°C)
Symbol
Parameter
Test Condition
VCC (V)
TA = -40 to +85°C
TA = -40 to +125°C
Unit
Min
Typical
(Note 8)
Max
Min
Max
VIH
High Level
Input Voltage
Select Pin
-
1.65 to 1.95
0.65VCC
-
-
0.65VCC
-
V
2.3 to 2.7
1.7
-
-
1.7
-
3 to 3.6
2.0
-
-
2.0
-
4.5 to 5.5
0.7VCC
-
-
0.7VCC
-
VIL
Low Level
Input Voltage
Select Pin
-
1.65 to 1.95
-
-
0.35VCC
-
0.35VCC
V
2.3 to 2.7
-
-
0.7
-
0.7
3 to 3.6
-
-
0.8
-
0.8
4.5 to 5.5
-
-
0.3VCC
-
0.3VCC
IIN
Input Leakage
Current
Select Pin
0 ≤ Select ≤ 5.5V
0 to 5.5
-
±0.05
±1
-
±10
µA
IS(OFF)
OFF State
Leakage
Current
0V ≤ A, Bn ≤ VCC
Figure 1
1.65 to 5.5
-
±0.05
±1
-
±10
µA
IS(ON)
ON State
Leakage
Current
0V ≤ A, Bn ≤ VCC
Figure 2
1.65 to 5.5
-
±0.05
±1
-
±10
µA
IS(ON)
ON State
Leakage
Current
-0.1V ≤ A, Bn ≤ VCC
Figure 2
1.65 to 5.5
-
±0.05
±2
-
±20
µA
ICC
Quiescent
Supply Current
Select = VCC or GND
A, Bn = VCC or GND
IOUT = 0
5.5
-
1.0
10
-
40
µA
ΔICC
Additional
Supply Current
Select= VCC – 0.6V
A, Bn = VCC or GND
IOUT = 0
5.5
-
30
500
-
5,000
µA
CI
Input
Capacitance
Select Pin
-
3.3
-
2.5
-
-
-
pF
CS(OFF)
OFF State
Capacitance
Select = VCC or GND
A, Bn = VCC or GND
IOUT = 0
3.3
-
6.0
-
-
-
pF
CS(ON)
ON State
Capacitance
Select = VCC or GND
A, Bn = VCC or GND
IOUT = 0
3.3
-
18
-
-
-
pF
Note: 8. Typical performance information is included in figures 11 to 34 on pages 11 to 14.
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Electrical Characteristics (All typical values are at TJ = +25°C)
Symbol
Parameter
Test Condition
(Note 9)
VCC (V)
TA = -40 to +85°C
TA = -40 to +125°C
Unit
Min
Typ
Max
Min
Max
RON
ON
Resistance
VI = 0V, IO = 4mA
1.65
-
12.5
18
-
27
Ω
VI = 1.65V, IO = -4mA
-
14
18
-
35
VI = 0V, IO = 8mA
2.3
-
9.0
16
-
24
VI = 2.3V, IO =-8mA
-
9.0
2016
-
30
VI = 0V, IO = 12mA
2.7
-
8.0
14
-
21
VI = 2.7V, IO =-12mA
-
8.0
14
-
27
VI = 0V, IO = 24mA
3.0
-
7.0
12
-
18
VI = 3.0V, IO =-24mA
-
7.0
12
-
23
VI = 0V, IO = 32mA
4.5
-
5.5
10
-
15
VI = 2.7V, IO =-32mA
-
6.0
12
-
17
VI = 4.5V, IO =-32mA
-
5.5
10
-
15
RRANGE
On
Resistance
Over Signal
Range
IA = 4mA, 0 ≤ VBN ≤ VCC
1.65
-
34
130
-
195
Ω
IA = 8mA, 0 ≤ VBN ≤ VCC
2.3
-
5
30
-
45
IA = 12mA, 0 ≤ VBN ≤ VCC
2.7
-
4
25
-
38
IA = 24mA, 0 ≤ VBN ≤ VCC
3.0
-
7.8
20
-
30
IA = 32mA, 0 ≤ VBN ≤ VCC
4.5
-
6.2
15
-
23
∆RON
On
Resistance
Match
Between
Channels
(Note 10)
IA = -4mA,
VBN = 1.15 V
1.65
-
0.25
-
-
-
Ω
IA = -8mA,
VBN = 1.6 V
2.3
-
0.25
-
-
-
IA = -12mA,
VBN = 1.9 V
2.7
-
0.25
-
-
-
IA = -24mA,
VBN = 2.1
3.0
-
0.25
-
-
-
IA = -32mA,
VBN = 3.15
4.5
-
0..25
-
-
-
Rflat
On
Resistance
Flatness
(Note 11)
IA = -4mA, 0 ≤ VBN ≤ VCC
1.65
-
26
110
-
150
Ω
IA = -8mA, 0 ≤ VBN ≤ VCC
2.3
-
5.0
26
-
105
IA = -24mA, 0 ≤ VBN ≤ VCC
2.7
-
3.5
16
-
35
IA = -24mA, 0 ≤ VBN ≤ VCC
3.3
-
2.0
9
-
15
IA = -32mA, 0 ≤ VBN ≤ VCC
5.0
-
1.5
4
-
8
Note: 9. Switch resistance test is measured per Figure 3.
10. ∆RON is measured at identical VCC, temperature and voltage levels.
11. Flatness is defined as the difference between the maximum and minimum of ON resistance measured at identical VCC and temperature.
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Switching Characteristics
Symbol
Parameter
Test Condition
VCC
Volts
TA = -40 to +85°C
TA = -40 to
+125°C
Unit
Figure
Number
Min
Typ
Max
Min
Max
tPHL
tPLH
Propagation
Delay
A to Bn
VI = OPEN
(Note 12)
1.65 to 1.95
-
-
2.0
-
3.0
ns
Figure 4
2.3 to 2.7
-
-
1.2
-
2.0
2.7
-
-
1.0
-
1.5
3.0 to 3.6
-
-
0.8
-
1.5
4.5 to 5.5
-
-
0.6
-
1.0
tPZL
tPZH
Output
Enable Time
Switch to Bn
VI = 2 x VCC for tPZL
VI = 0V for tPZH
(Note 13)
1.65 to 1.95
1.0
8.7
14.0
1.0
14.0
ns
Figure 4
2.3 to 2.7
1.0
5.3
7.5
1.0
7.5
2.7
1.0
4.9
6.0
1.0
6.0
3.0 to 3.6
0.5
4.0
5.5
0.5
5.5
4.5 to 5.5
0.5
3.0
4.0
0.5
4.0
tPLZ
tPHZ
Output
Disable Time
Switch to Bn
VI = 2 x VCC for tPLZ
VI = 0V for tPHZ
(Note 13)
1.65 to 1.95
2.5
6.0
8.5
2.5
8.5
ns
Figure 4
2.3 to 2.7
2.0
4.4
8.2
2.0
8.2
2.7
1.5
4.2
8.0
1.5
8.0
3.0 to 3.6
1.5
3.6
7.8
1.5
7.8
4.5 to 5.5
0.8
2.9
7.5
0.8
7.5
tB-M
Break Before
Make Time
(Note 9)
-
1.65 to 1.95
0.5
-
0.5
-
ns
Figure 5
2.3 to 2.7
0.5
-
-
0.5
-
2.7
0.5
-
-
0.5
-
3.0 to 3.6
0.5
-
0.5
-
4.5 to 5.5
0.5
-
-
0.5
Q
Charge
Injection
(Note 9)
CL = 0.1 nF,
VGEN = 0V
RGEN = 0 Ω
5.0
-
7.0
-
-
-
pC
Figure 6
3.3
3.0
-
-
-
QIRR
Off Isolation
(Note 11)
RL = 50 Ω ,
f = 10MHz
1.65 ~ 5.5
-
-42
-
-
-
dB
Figure 7
Xtalk
Crosstalk
RL = 50 Ω , f = 10MHz
1.65 ~ 5.5
-
-42
-
-
-
dB
Figure 8
BW
-3dB
Bandwidth
RL = 50 Ω
1.65 ~ 5.5
-
300
-
-
-
MHz
Figure 9
THD
Total
Harmonic
Distortion
(Note 9)
RL = 600 Ω, 0.5 VP-P,
f = 600Hz to 20kHz
5.0
-
0.1
-
-
-
%
Figure 10
Notes: 12. Due to the symmetry of the part, the direction of the propagation delay applies to either direction A to Bn or Bn to A. Propagation time is the
calculated RC time constant of the typical ON resistance of the switch and the specified load capacitance when capacitance when driven by
an ideal voltage source.
13. The Switch signal enable and disables time are the same for Bn and A if they are reversed at input and output.
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Parameter Measurement Information
B1
GND
B0
A
Select VCC
VO
VCC VIH
VIL
Select
SW
1
2
VILorVIH
SW
VI
GND
VO
VI
VO=
Condition 1:
Condition 2: VI
A
=GND VCC
VCC
=
,
,=
1
2
Figure 1 OFF –State Leakage Curent Test
B1
GND
B0
A
Select VCC
VO
VCC VIH
VIL
Select
SW
1
2
VILorVIH
SW
VIA
GND
VIVCC
=or
VO= open
1
2
Figure 2 ON –State Leakage Curent Test
B1
GND
B0
A
Select VCC
ron
VO
Ω
VCC VIH
VIL
Select
SW
1
2
VILorVIH
IO
SW
VIGND
or
=VCC
IO
V
=
VO
VI-
VO
VI-
1
2
Figure 3 ON State Resistance Test
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Parameter Measurement Information ( Notes 15-19)
RL
RL
CL
(see Note A)
From Output
Under Test
VLOAD
Open
GND
S1
TEST
S1
RL
tPLH/tPHL
Open
500Ω
tPLZ/tPZL
Vload
500Ω
tPHZ/tPZH
GND
500Ω
VCC
Inputs
VM
VLOAD
CL
(Note 14)
V∆
VI
tr/tf
1.8V ± 0.15V
VCC
≤2ns
VCC/2
2 x VCC
50pF
0.1V
2.5V ± 0.2V
VCC
≤2ns
VCC/2
2 x VCC
50pF
0.1V
3.3V ± 0.3V
VCC
≤2.5ns
VCC/2
2 x VCC
50pF
0.1V
5V ± 0.5V
VCC
≤2.5ns
VCC/2
2 x VCC
50pF
0.1V
Switch VMVM
Vl
0 V
tPZL
tPZH
VM
VLOAD/2
VM
tPHZ
VOH
VOL
VOH - V
Bn Output
S1 at VLOAD VOL + V
Bn Output
Waveform 2
S1 at GND
tPLZ
0V
Voltage Waveform Enable and Disable Times
Input VMVM
Vl
0 V
tPHL
tPLH
VMVM
VOH
VOL
Output
A or Bn
Bn or A
Voltage Waveform Propagation Delay Times
Figure 4 Load Circuit and Voltage Waveforms
Notes: 14. Includes test lead and test apparatus capacitance.
15. All pulses are supplied at pulse repetition rate ≤ 10MHz.
16. Inputs are measured separately one transition per measurement.
17. tPLZ and tPHZ are the same as tdis.
18. tPZL and tPZH are the same as tEN.
19. tPLH and tPHL are the same as tPD.
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Parameter Measurement Information (Continued)
B1
GND
B0
A
Select VCC
VSelect
RL
VO
VO
VI=VCC /2
RLCL
CL=50Ω35pF
t B-M
VCC
Figure 5 Break before Make Timing Test
GND
A
Select VCC
RLCL
CL=1 MΩ100pF
VCC
B1
B0 SW
Logic
Input
VOUT
VOUT
Logic
Input
RL
RGEN
VGEN
△VOUT
Q = (△VOUT ) (CL)
Figure 6 Charge Injection
B1
GND
B0
A
Select VCC
VCC VIH
VIL
Select
SW
1
2
VILorVIH
SW
fin
RL
=50Ω
Analyzer
50Ω
RL
1
2
Figure 7 OFF Isolation
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Parameter Measurement Information (Cont.)
B0
GND
B1
A
Select VCC
VCC
VILorVIH
=50Ω
50Ω
RL
RL
Analyzer
fin
VIH
VIL
Select
VO
VI
Test Conditions
Connect B1 to VI
Connect B0 to V2
Connect B0 to VI
Connect B1 to V2
Result = 20log (V0/VI)
10
Figure 8 Cross Talk
B1
GND
B0
A
Select VCC
VCC
VILorVIH
SW
fin
=50Ω
50Ω
RL
1
2
VIH
VIL
Select
SW
1
2
0.1 uF
RL
VCC /2
RL
VCC /2
Adjust fin voltage to obtain 0 dBm level at input.
dB
Adjust fin frequency until dB meter reads -3 dB.
CL
Figure 9 Bandwdith
B1
GND
B0
A
Select VCC
VCC
VILorVIH
SW
fin 600Ω
CL
1
2
VIH
VIL
Select
SW
1
2
0.1 uF
RL
VCC /2
D
Figure 10 THD
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Typical Performance Characteristics
Figure 11 ON state Resistance Vcc = 1.65 V; IBn = 4ma
Figure 12 ON state Resistance Vcc = 1.8 V; IBn = 4ma
Figure 13 ON state Resistance Vcc = 2.3 V; IBn = 8ma
Figure 14 ON state Resistance Vcc = 2.5 V; IBn = 8ma
Figure 15 ON state Resistance Vcc = 2.7 V; IBn = 12ma
Figure 16 ON state Resistance Vcc = 3 V; IBn = 24ma
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Typical Performance Characteristics (Continued)
Figure 17 ON state Resistance Vcc = 3.3 V; IBn = 24ma
Figure 18 ON state Resistance Vcc = 4.5 V; IBn = 32ma
Figure 19 ON state Resistance Vcc = 5.5 V; IBn = 32ma
Figure 20 △Ron-Resistance Match Between Channels
Figure 21 IS(OFF) OFF state leakage VIN = 0 V
Figure 22 IS(OFF) OFF state leakage VIN = -0.1 V
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Typical Performance Characteristics (Cont.)
Figure 23 IS(OFF) OFF state leakage VIN = -0.2 V
Figure 24 IS(ON) ON state leakage VIN = 0 V
Figure 25 IS(ON) ON state leakage VIN = -0.1 V
Figure 26 IS(ON) ON state leakage VIN = -0.2V
Figure 27 ICC verses Temperture
Figure 28 Delta ICC verses Temperture
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Typical Performance Characteristics (Cont.)
Figure 29 VIH, VIL, Hysteresis VCC = 1.65 V and VCC= 1.95 V
Figure 30 VIH, VIL, Hysteresis VCC = 2.3 V and VCC= 2.7 V
Figure 31 VIH, VIL, Hysteresis VCC = 3 V and VCC= 3.3 V
Figure 32 VIH, VIL, Hysteresis VCC = 4.5 V and VCC= 5.5 V
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74LVC1G3157
Marking Information
(1) SOT363
1 2 3
6
7
4
XX Y W X
XX : Identification code
W : Week : A~Z : 1~26 week;
X : A~Z : Internal Code
Y : Year 0~9
a~z : 27~52 week; z represents
52 and 53 week
7
5
Part Number
Package
Identification Code
74LVC1G3157DW
SOT363
J7
(2) X2-DFN1410-6
XX
Y
W
X
: Identification Code
: Year 0~9
: Week : A~Z : 1~26 week;
a~z : 27~52 week;
z represents 52 and 53 week
: A~Z : Internal Code
XX
Y W X
(Top View)
Part Number
Package
Identification Code
74LVC1G3157FZ4
X2-DFN1410-6
J7
Package Characteristics (All typical values are at VCC = 3.3V, TA = +25°C)
Symbol
Parameter
Test Conditions
VCC
Min
Typ.
Max
Unit
θJA
Thermal Resistance
Junction-to-Ambient
SOT363
(Note 20)
-
371
-
°C/W
X2-DFN1410-6
-
460
-
θJC
Thermal Resistance
Junction-to-Case
SOT363
(Note 20)
-
143
-
°C/W
X2-DFN1410-6
-
265
-
Note: 20. Test condition SOT363, and X2-DFN1410-6: Device mounted on FR-4 substrate PC board, 2oz. copper, with minimum recommended pad layout.
74LVC1G3157
Document number: DS38099 Rev. 3 - 2
16 of 18
www.diodes.com
April 2017
© Diodes Incorporated
NEW PROD UCT
74LVC1G3157
SOT363 Package Outline Dimensions and Suggested Pad Layout
Please see http://www.diodes.com/package-outlines.html for the latest version.
e
D
L
E1
b
E
F
A2
A1
ca
SOT363
Dim
Min
Max
Typ
A1
0.00
0.10
0.05
A2
0.90
1.00
1.00
b
0.10
0.30
0.25
c
0.10
0.22
0.11
D
1.80
2.20
2.15
E
2.00
2.20
2.10
E1
1.15
1.35
1.30
e
0.650 BSC
F
0.40
0.45
0.425
L
0.25
0.40
0.30
a
0°
8°
--
All Dimensions in mm
Y1 G
Y
X
C
Dimensions
Value
(in mm)
C
0.650
G
1.300
X
0.420
Y
0.600
Y1
2.500
74LVC1G3157
Document number: DS38099 Rev. 3 - 2
17 of 18
www.diodes.com
April 2017
© Diodes Incorporated
NEW PROD UCT
74LVC1G3157
X2-DFN1410-6 Package Outline Dimensions and Suggested Pad Layout
Please see http://www.diodes.com/package-outlines.html for the latest version.
D
E
e
L(6x)
A
A3
(Pin #1 ID)
Seating Plane
Z(4x)
A1
b(6x)
Z1(4x)
X2-DFN1410-6
Dim
Min
Max
Typ
A
––
0.40
0.39
A1
0.00
0.05
0.02
A3
––
––
0.13
b
0.15
0.25
0.20
D
1.35
1.45
1.40
E
0.95
1.05
1.00
e
––
––
0.50
L
0.25
0.35
0.30
Z
––
––
0.10
Z1
0.045
0.105
0.075
All Dimensions in mm
1
X1
Y1
Y
X
G
C
Dimensions
Value
(in mm)
C
0.500
G
0.250
X
0.250
X1
1.250
Y
0.525
Y1
1.250
74LVC1G3157
Document number: DS38099 Rev. 3 - 2
18 of 18
www.diodes.com
April 2017
© Diodes Incorporated
NEW PROD UCT
74LVC1G3157
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