INTEGRATED CIRCUITS DIVISION
DS-CPC1466-R02 www.ixysic.com 1
CPC1466
Broadband ADSL/VDSL
DC Termination IC
Features
•Meets wetting (sealing) current requirements per
ITU G.992.3 Annex 14.1 Region A
•Integrated bridge rectifier for polarity correction
•Uses inexpensive optocoupler for DC sealing current
monitoring
•Electronic inductor, breakover, and latch circuits
•Current limiting and excess power protection circuits
•ADSL/VDSL compatible with low-pass filter network
•MLT and SARTS compatible
•Compatible with portable test sets
•Small SOIC or DFN Package
•DFN package 60 percent smaller than SOIC
Applications
•ADSL/VDSL broadband modems
•Router and bridge customer premises equipment
•Leased line equipment
•Mechanized Loop Test (MLT) networks
•Switched Access Remote Test System (SARTS)
networks
Figure 1. CPC1466 Block Diagram
Description
The CPC1466 is a DC Termination IC for broadband
ADSL/VDSL applications. The high-voltage,
monolithic device provides a termination for DC
wetting (sealing) current in customer premises
equipment (CPE) to eliminate phone line corrosion on
DSL twisted-pair copper lines without telephone voice
services (i.e. only broadband services).
Internally, a bridge rectifier provides a
polarity-insensitive DC termination for DSL loop
sealing current. The IC includes an electronic inductor,
break-over and latch circuits, current limit and excess
power protection. A sealing current detect output
provides the means to monitor the loop for the
presence of sealing current.
The CPC1466 is manufactured in IXYS Integrated
Circuits Division’s high voltage BCDMOS process that
is used extensively in telephony applications
worldwide.
Ordering Information
PR+
NC
NC
TIP
RING
NC
NC
PR-
TC
NC
NC
RS
PD
NC
NC
COM
Current Limit
and Excess
Power Protection
Electronic
Inductor,
Breakover,
Latch, and
Opto Driver
Bridge
Rectifier
16
15
14
13
12
11
10
9
1
2
3
4
5
6
7
8
Part Number Description
CPC1466D DC Termination IC, 16-pin SOIC in tubes,
47/tube
CPC1466DTR DC Termination IC, 16-pin SOIC tape and reel,
1000/reel
CPC1466M DC Termination IC, 16-pin DFN in tubes,
52/tube
CPC1466MTR DC Termination IC, 16-pin DFN tape and reel,
1000/reel
INTEGRATED CIRCUITS DIVISION
CPC1466
2www.ixysic.com R02
1. Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
1.1 Package Pinout . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
1.2 Pin Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
1.3 Absolute Maximum Ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
1.4 Electrical Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
1.4.1 DC Characteristics, Normal Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
1.4.2 AC Characteristics, Normal Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
1.4.3 Transition Characteristics, Normal Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
1.5 Sealing Current Monitor Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
1.5.1 LED Trigger Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
2. Functional Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
2.1 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
2.2 Surge Protection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
2.3 Bridge Rectifier . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
2.4 State Transitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
2.4.1 Activation - On-State . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
2.4.2 Deactivation - Off-State . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
2.5 Photo-Diode (PD) Output Behavior . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
2.6 On-State Behavior . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
2.6.1 Typical Conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
2.6.2 Over-Voltage Conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
3. Manufacturing Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
3.1 Mechanical Dimensions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
3.1.1 CPC1466M 16-Pin DFN Package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
3.1.2 CPC1466MTR 16-Pin DFN Tape & Reel . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
3.1.3 CPC1466D 16-Pin SOIC Package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
3.1.4 CPC1466DTR 16-Pin SOIC Tape & Reel . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
INTEGRATED CIRCUITS DIVISION
R02 www.ixysic.com 3
CPC1466
1. Specifications
1.1 Package Pinout 1.2 Pin Description
1.3 Absolute Maximum Ratings
Electrical absolute maximum ratings are at 25C.
Absolute maximum ratings are stress ratings. Stresses in
excess of these ratings can cause permanent damage to
the device. Functional operation of the device at conditions
beyond those indicated in the operational sections of this
data sheet is not implied.
PR+
NC
NC
TIP
RING
NC
NC
PR-
TC
NC
NC
RS
PD
NC
NC
COM
16
15
14
13
12
11
10
9
1
2
3
4
5
6
7
8
Pin Name Description
1 PR+ Protection resistor positive side
2 NC No connection
3 TIP Tip Lead
4 NC No connection
5 NC No connection
6 RING Ring lead
7 NC No connection
8 PR- Protection resistor negative side
9 COM Common
10 NC No connection
11 PD Photo-diode (LED input current)
12 NC No connection
13 RS Current limiting resistor
14 NC No connection
15 NC No connection
16 TC Timing capacitor
Parameter Minimum Maximum Unit
Maximum Voltage
(T to R, R to T)* - 300 V
Power dissipation - 1 W
Operating temperature -40 +85 °C
Operating relative humidity 5 95 %
Storage temperature -40 +125 °C
INTEGRATED CIRCUITS DIVISION
CPC1466
4www.ixysic.com R02
1.4 Electrical Characteristics
Unless otherwise specified, minimum and maximum values are guaranteed by production testing requirements.
Typical values are characteristic of the device and are the result of engineering evaluations. In addition, typical values
are provided for informational purposes only and are not part of the testing requirements.
All electrical specifications are provided for TA=25C
1.4.1 DC Characteristics, Normal Operation
For operational templates: (see Figure 2 on page 5) and (see Figure 3 on page 5).
1.4.2 AC Characteristics, Normal Operation
For test conditions: (see Figure 4 on page 6).
1.4.3 Transition Characteristics, Normal Operation
For activation/deactivation test conditions: (see Figure 5 on page 7).
Parameter Conditions Symbol Minimum Typical Maximum Unit
Activate/Non-activate Voltage Off State VAN 30.0 35.0 39.0 V
Breakover current - IBO -0.51mA
DC Voltage drop Active State, 1 mA ISL 20 mA VON -12.515 V
DC leakage current VOFF = 20 V ILKG -1.55A
Hold/Release current Active State IH/R 0.1 0.5 1.0 mA
Minimum on current VON < 54 V IMIN1 20 38 - mA
54 V VON 100 V for 2 seconds,
source resistance 200 to 4 kIMIN2 9.0 45 - mA
VON > 100 V IMIN3 00.1-mA
Maximum on current VON 70 V IMAX1 -38.470mA
VON > 70 V IMAX2 -- mA
Photodiode drive current Active State IPD 0.2 0.3 10 mA
Parameter Conditions Symbol Minimum Typical Maximum Unit
AC impedance 200 Hz to 50 kHz ZMT 10 38 -k
Linearity distortion f= 200 Hz to 40 kHz, ISL = 1 mA to
20 mA, VAPP 12 VPP
D4070 - dB
Parameter Conditions Symbol Minimum Typical Maximum Unit
Activate time (see Figure 6 on page 7) t1 3.0 13 50 ms
Deactivate time (see Figure 7 on page 7) t2 3.0 - 100 ms
VON
1k
-----------
INTEGRATED CIRCUITS DIVISION
R02 www.ixysic.com 5
CPC1466
Figure 2. I-V Requirements Template, 0 V to 50 V
Figure 3. I-V Requirements Template, 0 V to 250 V
1A
100 mA
10 mA
1 mA
100 A
10 A
1A
0
µ
µ
µ
tnerruC
Absolute Voltage (V)
01020304050
Transition
Region
Transition
Region
On State
Off State
I
MAX1
I
MIN1
V
ON
I
HR
I
BO
I
LKG
V
AN
1A
100 mA
10 mA
1 mA
100 A
10 A
1A
0
µ
µ
µ
tnerruC
Absolute Voltage (V)
0 50 100 150 200 250
I
MAX1
I
MIN2
I
MIN1
IMAX2
70 V, 70 mA
54 V, 9 mA
100 V, 0 mA
INTEGRATED CIRCUITS DIVISION
CPC1466
6www.ixysic.com R02
Figure 4. Test Circuit for ac Impedance and Linearity
68 Fμ
1k Ω
DUT
VAPP
ac generator
ISL
1 - 20 mA
dc current source
Vmt
Vsig
Zmt
1000 Vmt
Vsig
----------------------------=
Linearity 20 Vmt
Vsig2ndHarmonic
----------------------------------------
log 20 1000
67.5
------------
log+=
INTEGRATED CIRCUITS DIVISION
R02 www.ixysic.com 7
CPC1466
Figure 5. Test Circuit for Activate and Deactivate Times
Figure 6. Applied Waveform for Activation Test
Figure 7. Applied Waveform for Deactivation Test
1Fμ
85Ω
DUT
Pulse
generator
85 mH
40 V
30 V
20 V
10 V
0
43.5 V
Source Impedance
200 to 4kΩΩ
t1
500 ms
Measure
2.0 mA
1.5 mA
1.0 mA
0.5 mA
0
Current source limited to 30 V
t2
500 ms
Measure
INTEGRATED CIRCUITS DIVISION
CPC1466
8www.ixysic.com R02
1.5 Sealing Current Monitor Characteristics
1.5.1 LED Trigger Characteristics
For test conditions: (see Figure 8 on page 8).
Figure 8. Test Circuit for LED Operation
Parameter Conditions Symbol Min Typ Max Unit
Applied DC battery Voltage - - -43.5 - -56 VDC
Frequency (pulses per second) - - 4 - 8 -
Percent break - - 40 - 60 %
Number of pulses - - 6 - 10 -
Total Loop Resistance - - 200 - 4000
Required opto-coupler response
Number of applied pulses per make/break - - - 1 - -
Pulse width (opto on) (see Figure 8 on page 8) TON 10 - - ms
Pulse width (opto off) (see Figure 8 on page 8) TOFF 10 - - ms
CPC1466
TIP
RING
2.2k
5%
Ω
4W
PR+
NC
NC
TIP
RING
NC
NC
PR-
TC
NC
NC
RS
PD
NC
NC
COM
1Fμ
68.1
1%
Ω
1/4 W
85Ω
25Ω
25Ω
+
R
200 - 4k
900 - 4.5k (MLT)
LOOP
ΩΩ
ΩΩ
V
-43.5V to -56V
BAT
85mH
Series rotary dial
Shunt rotary dial
1Fμ
1
2
3
4
5
6
7
8
16
15
14
13
12
11
10
9
VOUT
V
5V
CC
1
2
4
3
75kΩ
INTEGRATED CIRCUITS DIVISION
R02 www.ixysic.com 9
CPC1466
Figure 9. Typical ADSL/VDSL Application Diagram
Transceiver
TIP
RING
2.2kΩ
5%
4W
68Ω
1%
1/4W
CPC1466
PR+
NC
NC
TIP
RING
NC
NC
PR-
TC
NC
NC
RS
PD
NC
NC
COM
Current Limit
and Excess
Power Protection
Electronic
Inductor,
Breakover,
Latch, and
Opto Driver
Bridge
Rectifier
16
15
14
13
12
11
10
9
1
2
3
4
5
6
7
8
CPC1225N
Solid State
Relay
SSR
30 - 35mH
with Loop Current
L1
L2
C1
SP1
1μF
DC
Blocking
Capacitor
Digital
Control
Circuitry
V
5V
CC
1
2
4
3
75kΩ
INTEGRATED CIRCUITS DIVISION
CPC1466
10 www.ixysic.com R02
2. Functional Description
2.1 Introduction
The CPC1466 can be used for a number of DSL
designs requiring a DC-hold circuit such as ADSL
modem applications. Typical ADSL applications will
use a filter circuit design similar to the one shown in
Figure 9‚ “Typical ADSL/VDSL Application
Diagram” on page 9.
The DC Termination IC performs two fundamental
functions in an ADSL modem application; as an
electronic inductor providing a low impedance DC
termination with a high impedance ac termination and
second as part of the sealing current detection system
for automated line sensing. This function provides an
excellent method to monitor for the presence of
sealing current. Generally, loss of sealing current
indicates loop loss.
As can be seen in the application circuit in Figure 9
on page 9, CPC1466 designs require few external
components. For the CPC1466, all that is needed is a
circuit protector, two resistors and a capacitor. To
ensure DSL signal integrity over a wide variety of
conditions a POTS splitter type filter is recommended
to isolate the DSL traffic from the termination.
2.2 Surge Protection
Although the CPC1466 self-protects via current
limiting, it requires over-voltage surge protection to
protect against destructive over-voltage transients.
IXYS Integrated Circuits Division recommends the use
of a crowbar-type surge protector to limit the surge
voltage seen by the CPC1466 to less than 250 V. The
protection device must be able to withstand the surge
requirements specified by the appropriate governing
agency in regions where the product will be deployed.
Teccor, Inc. and Bourns, Inc. make suitable surge
protectors for most applications. Devices such as
Teccor’s P1800SD or P2000SD Sidactors and Bourns’
TISP4220H3BJ or TISP4240H3BJ thyristors should
provide suitable protection.
2.3 Bridge Rectifier
The bridge rectifier in the CPC1466 ensures that the
device is polarity-insensitive and provides consistent
operational characteristics if the TIP/RING circuit
polarity is reversed.
2.4 State Transitions
The DC TIP/RING voltage-current characteristics of
the CPC1466 are shown in Figure 2‚ “I-V
Requirements Template, 0 V to 50 V”, and in
Figure 3‚ “I-V Requirements Template, 0 V to
250 V” on page 5.
Transition timings are illustrated in Figure 6‚ “Applied
Waveform for Activation Test”, and in Figure 7‚
“Applied Waveform for Deactivation Test”. The
test configuration for these timings is given in
Figure 5‚ “Test Circuit for Activate and Deactivate
Times”. All timing figures are located on page 7.
State transition timings are set by the 1 F capacitor
connected between the TC and COM pins.
2.4.1 Activation - On-State
Application of battery voltage to the loop causes the
CPC1466 to conduct whenever the voltage exceeds
approximately 35 V. With application of sufficient
voltage applied across the TIP/RING terminals, the
CPC1466 will initially conduct a nominal 150 A of
sealing current for approximately 20 ms prior to
activation. Once activated, the CPC1466 will remain in
the on state for as long as the loop current exceeds a
nominal 0.5 mA.
The CPC1466 turn-on timing circuit assures device
activation will occur within 50 ms of an applied voltage
greater than 43.5 V but not within the first 3 ms.
2.4.2 Deactivation - Off-State
While the CPC1466 activation protocol is based on an
initial minimum voltage level, deactivation is based on
a diminished sealing current level. Deactivation occurs
when the nominal sealing current level drops below
0.5 mA with guaranteed deactivation occurring for
sealing current levels less than 0.1 mA
The turn-off timing circuit deactivates the sealing
current hold circuit when 1 mA of sealing current has
been removed for 100 ms but ignores periods of loss
up to 3 ms.
INTEGRATED CIRCUITS DIVISION
R02 www.ixysic.com 11
CPC1466
2.5 Photo-Diode (PD) Output Behavior
Output from the PD pin provides a minimum of 0.2 mA
of photodiode drive current for an optocoupler’s LED
anytime sealing current exceeds 1 mA.
Because LED current is interrupted whenever loop
current is interrupted, the optocoupler provides an
excellent means of indicating loop availability for
designs with a full time sealing current requirement. In
addition, for pulsed sealing current loops, the status
from this detector when used in conjuntion with the
timing of modem retraining events can be used as an
indicator to determine if the sealing current event is
clearing line impairments.
2.6 On-State Behavior
2.6.1 Typical Conditions
On-state sealing current levels are determined by the
network’s power feed circuit and the loop’s DC
impedance. To compensate for low loop resistance or
very high loop voltage, the CPC1466 limits the
maximum sealing current to 70 mA.
The CPC1466 manages package power dissipation
by shunting excess sealing current through the 2.2 k
4W power resistor located between the PR+ and PR-
pins.
2.6.2 Over-Voltage Conditions
Potentials in excess of 100 V applied to the TIP/RING
interface will cause the CPC1466 to disable the
sealing current hold circuit and enter a standby state
with very little current draw. Once the over-voltage
condition is removed, the CPC1466 automatically
resumes normal operation.
INTEGRATED CIRCUITS DIVISION
CPC1466
12 www.ixysic.com R02
3. Manufacturing Information
3.1 Moisture Sensitivity
All plastic encapsulated semiconductor packages are susceptible to moisture ingression. IXYS Integrated
Circuits Division classified all of its plastic encapsulated devices for moisture sensitivity according to the
latest version of the joint industry standard, IPC/JEDEC J-STD-020, in force at the time of product
evaluation. We test all of our products to the maximum conditions set forth in the standard, and guarantee
proper operation of our devices when handled according to the limitations and information in that standard as well as
to any limitations set forth in the information or standards referenced below.
Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced
product performance, reduction of operable life, and/or reduction of overall reliability.
This product carries a Moisture Sensitivity Level (MSL) rating as shown below, and should be handled according to
the requirements of the latest version of the joint industry standard IPC/JEDEC J-STD-033.
3.2 ESD Sensitivity
This product is ESD Sensitive, and should be handled according to the industry standard
JESD-625.
3.3 Reflow Profile
This product has a maximum body temperature and time rating as shown below. All other guidelines of
J-STD-020 must be observed.
3.4 Board Wash
IXYS Integrated Circuits Division recommends the use of no-clean flux formulations. However, board washing to
remove flux residue is acceptable, and the use of a short drying bake may be necessary. Chlorine-based or
Fluorine-based solvents or fluxes should not be used. Cleaning methods that employ ultrasonic energy should not be
used.
Device Moisture Sensitivity Level (MSL) Rating
CPC1466M MSL 3
CPC1466D MSL 1
Device Maximum Temperature x Time
CPC1466M / CPC1466D 260°C for 30 seconds
INTEGRATED CIRCUITS DIVISION
R02 www.ixysic.com 13
CPC1466
3.5 Mechanical Dimensions
3.5.1 CPC1466M 16-Pin DFN Package
3.5.2 CPC1466MTR 16-Pin DFN Tape & Reel
EXPOSED
METALLIC PAD
7.00 ± 0.25
(0.276 ± 0.01)
6.00 ± 0.25
(0.236 ± 0.01)
INDEX AREA TOP VIEW
SEATING
PLANE
SIDE VIEW
0.90 ± 0.10
(0.035 ± 0.004)
0.30 ± 0.05
(0.012 ± 0.002)
0.02, + 0.03, - 0.02
(0.0008, + 0.0012, - 0.0008)
0.20
(0.008)
4.25 ± 0.05
(0.167 ± 0.002)
0.55 ± 0.10
(0.022 ± 0.004)
6.00 ± 0.05
(0.236 ± 0.002)
BOTTOM VIEW
Dimensions
mm
(inch)
Terminal Tip
Pin 16
Pin 1
0.80
(0.032)
DIMENSIONS
mm
(inches)
5.80
(0.228)
0.35
(0.014)
1.05
(0.041)
0.80
(0.031)
Recommended PCB Land Pattern
NOTE: Because the metallic pad on
the bottom of the DFN package is
connected to the substrate of the die, it
is recommended that no printed circuit
board traces or vias be placed under
this area.
K0=1.61 ± 0.10
(0.063 ± 0.004)
A0=6.24 ± 0.10
(0.246 ± 0.004)
B0=7.24 ± 0.10
(0.285 ± 0.004)
P=12.00 ± 0.10
(0.472 ± 0.004)
W=16.00 ± 0.30
(0.630 ± 0.012)
Embossment
Embossed Carrier
Top Cover
Tape Thickness
0.102 MAX.
(0.004 MAX.)
330.2 DIA.
(13.00 DIA.)
DIMENSIONS
mm
(inches)
INTEGRATED CIRCUITS DIVISION
CPC1466
14 www.ixysic.com R02
3.5.3 CPC1466D 16-Pin SOIC Package
3.5.4 CPC1466DTR 16-Pin SOIC Tape & Reel
NOTES:
1. Coplanarity = 0.1016 (0.004) max.
2. Leadframe thickness does not include solder plating
(1000 microinch maximum).
(inches)
mm
DIMENSIONS
8.890 TYP
(0.350 TYP)
0.406 TYP
(0.016 TYP)
10.160±0.381
(0.400±0.015)
7.493±0.127
(0.295±0.005)
10.363±0.127
(0.408±0.005)
1.270 TYP
(0.050 TYP)
0.635 X 45°
(0.025 X 45°)
0.254 ±0.0127
(0.010±0.0005)
1.016 TYP
(0.040 TYP)
0.508±0.1016
(0.020±0.004)
PIN 1
PIN 16
2.057±0.051
(0.081±0.002)
MIN: 0.0254 (0.001)
MAX: 0.102 (0.004)
Lead to Package Standoff:
1.90
(0.075)
1.27
(0.050)
9.30
(0.366)
0.60
(0.024)
PCB Land Pattern
Dimensions
mm
(inches)
Embossment
Embossed Carrier
Top Cover
Tape Thickness
0.102 MAX.
(0.004 MAX.)
330.2 DIA.
(13.00 DIA.)
K0=3.20
(0.126)
K1=2.70
(0.106)
A0=10.90
(0.429)
W=16
(0.630)
B0=10.70
(0.421)
P=12.00
(0.472)
NOTES:
1. All dimensions carry tolerances of EIA Standard 481-2
2. The tape complies with all “Notes” for constant dimensions
listed on page 5 of EIA-481-2
For additional information please visit www.ixysic.com
IXYS Integrated Circuits Division makes no representations or warranties with respect to the accuracy or completeness of the contents of this publication and
reserves the right to make changes to specifications and product descriptions at any time without notice. Neither circuit patent licenses or indemnity are expressed
or implied. Except as set forth in IXYS Integrated Circuits Division’s Standard Terms and Conditions of Sale, IXYS Integrated Circuits Division assumes no liability
whatsoever, and disclaims any express or implied warranty relating to its products, including, but not limited to, the implied warranty of merchantability, fitness for a
particular purpose, or infringement of any intellectual property right.
The products described in this document are not designed, intended, authorized, or warranted for use as components in systems intended for surgical implant into
the body, or in other applications intended to support or sustain life, or where malfunction of IXYS Integrated Circuits Division’s product may result in direct physical
harm, injury, or death to a person or severe property or environmental damage. IXYS Integrated Circuits Division reserves the right to discontinue or make changes
to its products at any time without notice.
Specifications: DS-CPC1466-R02
© Copyright 2013, IXYS Integrated Circuits Division
All rights reserved. Printed in USA.
10/2/2013
