INTEGRATED CIRCUITS DIVISION
DS-IXD_630-R02 www.ixysic.com 1
RoHS
2002/95/EC e
3
Pb
Features
•30A Peak Source/Sink Drive Current
•High Operating Voltage Capability: 35V
•-40°C to +125°C Extended Operating Temperature
Range
•Under-Voltage Lockout Protection
•Logic Input Withstands Negative Swing of up to 5V
•Fast Rise and Fall Times: < 20ns
•Low Propagation Delay Time
•Low 10A Supply Current
•Low Output Impedance
Applications
•Efficient Power MOSFET and IGBT Switching
•Switch Mode Power Supplies
•Motor Controls
•DC to DC Converters
•Class-D Switching Amplifiers
•Pulse Transformer Driver
Description
The IXDD630/IXDI630/IXDN630 high-speed gate
drivers are especially well suited for driving the latest
IXYS power MOSFETs and IGBTs. The IXD_630
output can source and sink 30A of peak current while
producing voltage rise and fall times of less than 20ns.
Internal circuitry eliminates cross conduction and
current "shoot-through," and the driver is virtually
immune to latch up. Under-voltage lockout (UVLO)
circuitry holds the output LOW until sufficient supply
voltage is applied (12.5V for the IXD_630 versions,
and 9V for the IXD_630M versions). Low propagation
delays and fast, matched rise and fall times make the
IXD_630 family ideal for very high frequency and
high-power applications.
The IXDD630 is configured as a non-inverting driver
with an enable. The IXDN630 is configured as a
non-inverting driver, and the IXDI630 is configured as
an inverting driver.
The IXD_630 family is available in a 5-pin TO-220 (CI),
and a 5-pin TO-263 (YI) package.
Ordering Information
Part Number Logic
Configuration UVLO Package Type Packing
Method Quantity
IXDD630CI 12.5V 5-Pin TO-220 Tube 50
IXDD630MCI 9V 5-Pin TO-220 Tube 50
IXDD630YI 12.5V 5-Pin TO-263 Tube 50
IXDD630MYI 9V 5-Pin TO-263 Tube 50
IXDI630CI 12.5V 5-Pin TO-220 Tube 50
IXDI630MCI 9V 5-Pin TO-220 Tube 50
IXDI630YI 12.5V 5-Pin TO-263 Tube 50
IXDI630MYI 9V 5-Pin TO-263 Tube 50
IXDN630CI 12.5V 5-Pin TO-220 Tube 50
IXDN630MCI 9V 5-Pin TO-220 Tube 50
IXDN630YI 12.5V 5-Pin TO-263 Tube 50
IXDN630MYI 9V 5-Pin TO-263 Tube 50
IN
EN
OUT
INOUT
INOUT
IXD_630
30-Ampere Low-Side
Ultrafast MOSFET Drivers
INTEGRATED CIRCUITS DIVISION
IXD_630
2www.ixysic.com R02
1. Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
1.1 Lead Configurations. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
1.2 Lead Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
1.3 Absolute Maximum Ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
1.4 Recommended Operating Conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
1.5 Electrical Characteristics: TA = 25°C . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
1.6 Electrical Characteristics: TA = - 40°C to +125°C . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
1.7 Thermal Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
2. Functional Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
2.1 IXDD630 Block Diagram & Truth Table . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
2.2 IXDI630 Block Diagram & Truth Table. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
2.3 IXDN630 Block Diagram & Truth Table . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
3. Typical Performance Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
4. Manufacturing Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
4.1 Moisture Sensitivity . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
4.2 ESD Sensitivity . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
4.3 Reflow Profile. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
4.4 Board Wash . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
4.5 Mechanical Dimensions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
INTEGRATED CIRCUITS DIVISION
IXD_630
R02 www.ixysic.com 3
1 Specifications
1.1 Lead Configurations 1.2 Lead Definitions
1.3 Absolute Maximum Ratings
Unless stated otherwise, absolute maximum electrical ratings are at 25°C
Absolute maximum ratings are stress ratings. Stresses in excess of these ratings can cause permanent damage to the device.
Functional operation of the device at conditions beyond those indicated in the operational sections of this data sheet is not
implied.
1
4
3
2
5
V
CC
OUT
GND
IN
EN
1
4
3
2
5
V
CC
OUT
GND
IN
NC
1
4
3
2
5
V
CC
OUT
GND
IN
NC
IXDD630 CI / YI
IXDI630 CI / YI
IXDN630 CI / YI
Lead Name Description
IN Logic Input
EN
Output Enable - Drive lead low to disable
output, and force output to a high impedance
state
OUT Output - Sources or sinks current to turn-on or
turn-off a discrete MOSFET or IGBT
OUT Inverted Output - Sources or sinks current to
turn-on or turn-off a discrete MOSFET or IGBT
VCC Supply Voltage - Provides power to the device
GND Ground - Common ground reference for the
device
NC Not connected
Parameter Symbol Minimum Maximum Units
Supply Voltage VCC -0.3 40 V
Input Voltage Range VIN , VEN -5 VCC+0.3 V
Output Current IOUT -±30A
Junction Temperature TJ-55 +150 °C
Storage Temperature TSTG -65 +150 °C
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IXD_630
4www.ixysic.com R02
1.4 Recommended Operating Conditions
1.5 Electrical Characteristics: TA = 25°C
Test Conditions: UVLO < VCC < 35V (unless otherwise noted).
Parameter Symbol Range Units
Supply Voltage VCC UVLO to 35 V
Operating Temperature Range T
A-40 to +125 °C
Parameter Conditions Symbol Minimum Typical Maximum Units
Input Voltage, High UVLO < VCC < 18V VIH 3.5 - - V
Input Voltage, Low UVLO < VCC < 18V VIL --0.8
Input Current 0V < VIN < VCC IIN --±10A
EN Input Voltage, High IXDD630 only VENH 2/3VCC --
V
EN Input Voltage, Low IXDD630 only VENL --
1/3VCC
Output Voltage, High - VOH VCC-0.025 --
V
Output Voltage, Low - VOL - - 0.025
Output Resistance, High State VCC=18V, IOUT= -100mA ROH -0.170.4
Output Resistance, Low State VCC=18V, IOUT=100mA ROL -0.160.3
Output Current, Continuous Limited by package power
dissipation IDC --±8A
Rise Time CLOAD=5.6nF, VCC=18V tr-1120
ns
Fall Time CLOAD=5.6nF, VCC=18V tf-1118
On-Time Propagation Delay CLOAD=5.6nF, VCC=18V tondly -4665
Off-Time Propagation Delay CLOAD=5.6nF, VCC=18V toffdly -4665
Output Enable Time IXDD630 only tPZL, tPZH -3465
Output Disable Time IXDD630 only tPLZ, tPHZ -65125
Enable Pull-Up Resistor IXDD630 only REN -400-k
Power Supply Current
VCC=18V, VIN=3.5V
ICC
-2.54mA
VCC=18V, VIN=0V - - 0.75 mA
VCC=18V, VIN=VCC - - 0.75
Under-Voltage Lockout Threshold
VCC Rising, IXD_630M
UVLO 799.9
V
VCC Rising, IXD_630 10 12.5 13.5
Under-Voltage Lockout Hysteresis IXD_630M --1-
V
IXD_630 -1.5-
INTEGRATED CIRCUITS DIVISION
IXD_630
R02 www.ixysic.com 5
1.6 Electrical Characteristics: TA = - 40°C to +125°C
Test Conditions: UVLO < VCC < 35V, TJ<150°C.
1.7 Thermal Characteristics
Parameter Conditions Symbol Minimum Maximum Units
Input Voltage, High UVLO < VCC < 18V VIH 4-
V
Input Voltage, Low UVLO < VCC < 18V VIL -0.8
Output Resistance, High State VCC=18V, IOUT= -100mA ROH -0.6
Output Resistance, Low State VCC=18V, IOUT=100mA ROL -0.45
Rise Time CLOAD=5.6nF, VCC=18V tr-35
ns
Fall Time CLOAD=5.6nF, VCC=18V tf-35
On-Time Propagation Delay CLOAD=5.6nF, VCC=18V tondly -100
Off-Time Propagation Delay CLOAD=5.6nF, VCC=18V toffdly -100
Package Parameter Symbol Rating Units
IXD_630CI (5-Lead TO-220) Thermal Resistance, Junction-to-Ambient JA
36 °C/W
IXD_630YI (5-Lead TO-263) 46
IXD_630CI (5-Lead TO-220) Thermal Resistance, Junction-to-Case JC
3°C/W
IXD_630YI (5-Lead TO-263) 2
INTEGRATED CIRCUITS DIVISION
IXD_630
6www.ixysic.com R02
2 Functional Description
2.1 IXDD630 Block Diagram & Truth Table
2.2 IXDI630 Block Diagram & Truth Table
2.3 IXDN630 Block Diagram & Truth Table
IN EN OUT
0 1 or open 0
1 1 or open 1
00
Z
10
Z
IN OUT
01
10
GND
IN
EN
IXDD630
V
CC
OUT
UVLO
GND
IN
IXDI630
VCC
OUT
UVLO
IN OUT
00
11
GND
IN
IXDN630
VCC
OUT
UVLO
INTEGRATED CIRCUITS DIVISION
IXD_630
R02 www.ixysic.com 7
3 Typical Performance Characteristics
Supply Voltage (V)
10 15 20 25 30 35
Fall Time (ns)
0
10
20
30
40
50
60
70
80
90
100
110
Fall Time vs. Supply Voltage
(VIN=0-5V, f=10kHz, TA=25ºC)
C
LOAD
=50nF
C
LOAD
=25nF
C
LOAD
=200nF
C
LOAD
=100nF
C
LOAD
=10nF
Temperature (ºC)
-50 -30 -10 10 30 50 70 90 110 130
Time (ns)
20
21
22
23
24
25
26
27
28
Rise & Fall Times vs. Temperature
(VIN=0-5V, VCC=18V, CLOAD=25nF)
tf
tr
Load Capacitance (nF)
0 50 100 150 200
Rise Time (ns)
0
20
40
60
80
100
Rise Time vs. Load Capacitance
VCC=10V
VCC=12V,18V,25V,30V,35V
Load Capacitance (nF)
0 50 100 150 200
Fall Time (ns)
0
20
40
60
80
100
Fall Time vs. Load Capacitance
V
CC
=10V
V
CC
=12V
V
CC
=18V
V
CC
=25V
V
CC
=30V
V
CC
=35V
Supply Voltage (V)
5 101520253035
Propagation Delay (ns)
20
30
40
50
60
70
80
90
Propagation Delay vs. Supply Voltage
(VIN=0-5V, CLOAD=5.6nF, f=1KHz)
t
offdly
t
ondly
Input Voltage (V)
0 5 10 15 20 25 30
Propagation Delay (ns)
0
20
40
60
80
100
Propagation Delay vs. Input Voltage
(VCC=25V, CLOAD=5.6nF, f=1kHz)
t
offdly
t
ondly
Temperature (ºC)
-50 -30 -10 10 30 50 70 90 110 130
Propagation Delay (ns)
20
30
40
50
60
70
Propagation Delay
vs. Junction Temperature
(VIN=0-5V, CLOAD= 5.6nF, VCC=18V, f=1kHz)
tondly
toffdly
Temperature (ºC)
-50 -30 -10 10 30 50 70 90 110 130
Input Threshold (V)
1.8
2.0
2.2
2.4
2.6
2.8
3.0
3.2
3.4
Input Threshold vs. Temperature
(VCC=18V, CLOAD=5.6nF)
Min V
IH
Max V
IL
Supply Voltage (V)
10 15 20 25 30 35
Input Threshold (V)
2.0
2.5
3.0
3.5
4.0
Input Threshold
vs. Supply Voltage
Min V
IH
Max V
IL
Supply Voltage (V)
10 12 14 16 1820 22 24 26 2830 32 34 36
Enable Threshold (V)
4
6
8
10
12
14
16
18
20
22
Enable Thresholds
vs. Supply Voltage
V
ENH
V
ENL
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IXD_630
8www.ixysic.com R02
Load Capacitance (nF)
5.0 7.5 10.0 12.5 15.0 17.5 20.0 22.5 25.0 27.5
Supply Current (mA)
1
10
100
1000
Supply Current vs. Load Capacitance
(VCC=35V)
f=1MHz
f=500kHz
f=100kHz
f=50kHz
f=10kHz
Load Capacitance (nF)
5.0 7.5 10.0 12.5 15.0 17.5 20.0 22.5 25.0 27.5
Supply Current (mA)
1
10
100
1000
Supply Current vs. Load Capacitance
(VCC=18V)
f=1MHz
f=500kHz
f=100kHz
f=50kHz
f=10kHz
Load Capacitance (pF)
5000 10000 15000 20000 25000
Supply Current (mA)
1
10
100
1000
Supply Current vs. Load Capacitance
(VCC=12V)
f=1MHz
f=500kHz
f=100kHz
f=50kHz
f=10kHz
Load Capacitance (pF)
5000 10000 15000 20000 25000
Supply Current (mA)
1
10
100
1000
Supply Current vs. Load Capacitance
(VCC=10V)
f=1MHz
f=500kHz
f=100kHz
f=50kHz
f=10kHz
Frequency (kHz)
1 10 100 1000
Supply Current (mA)
0.01
0.1
1
10
100
1000
Supply Current vs. Frequency
(VCC=35V)
CLOAD=25nF
CLOAD=10nF
CLOAD=5.6nF
Frequency (kHz)
1 10 100 1000
Supply Current (mA)
0.01
0.1
1
10
100
1000
Supply Current vs. Frequency
(VCC=18V)
CLOAD=25nF
CLOAD=10nF
CLOAD=5.6nF
Frequency (kHz)
1 10 100 1000
Supply Current (mA)
0.01
0.1
1
10
100
1000
Supply Current vs. Frequency
(VCC=12V)
CLOAD=25nF
CLOAD=10nF
CLOAD=5.6nF
Frequency (kHz)
1 10 100 1000
Supply Current (mA)
0.01
0.1
1
10
100
1000
Supply Current vs. Frequency
(VCC=10V)
CLOAD=25nF
CLOAD=10nF
CLOAD=5.6nF
Temperature (ºC)
-50 -30 -10 10 30 50 70 90 110 130
Supply Current (mA)
0.0
0.5
1.0
1.5
2.0
2.5
3.0
Quiesent Supply Current
vs. Temperature
(VCC=18V)
VIN=3.5V
VIN=5V
VIN=10V
VIN=0V & 18V
Temperature (ºC)
-50 -30 -10 10 30 50 70 90 110 130
Supply Current (mA)
0.0
0.2
0.4
0.6
0.8
1.0
1.2
1.4
Dynamic Supply Current
vs. Temperature
(VCC=18V, VIN=0-5V, f =1kHz, CLOAD=5.6nF)
Supply Voltage (V)
10 15 20 25 30 35
Output Source Current (A)
-10
-15
-20
-25
-30
-35
-40
-45
-50
-55
-60
-65
Output Source Current
vs. Supply Voltage
(VIN=7V, CLOAD=1μF)
Supply Voltage (V)
10 15 20 25 30 35
Output Sink Current (A)
10
15
20
25
30
35
40
45
50
55
60
65
Output Sink Current
vs. Supply Voltage
(VIN=7V, CLOAD=1μF)
INTEGRATED CIRCUITS DIVISION
IXD_630
R02 www.ixysic.com 9
Temperature (ºC)
-50 -30 -10 10 30 50 70 90 110 130
Output Source Current (A)
-24
-26
-28
-30
-32
-34
-36
Output Source Current
vs. Temperature
(VCC=18V, CLOAD=1μF)
Temperature (ºC)
-50 -30 -10 10 30 50 70 90 110 130
Output Sink Current (A)
26
28
30
32
34
36
Output Sink Current
vs. Temperature
(VCC=18V, CLOAD=1μF)
Supply Voltage (V)
5 101520253035
Output Resistance (Ω)
0.10
0.12
0.14
0.16
0.18
0.20
0.22
High-State Output Resistance
vs. Supply Voltage
R
OH
@ -100mA
Supply Voltage (V)
5 101520253035
Output Resistance (Ω)
0.10
0.12
0.14
0.16
0.18
0.20
0.22
Low-State Output Resistance
vs. Supply Voltage
R
OL
@ +100mA
Temperature (ºC)
-50 -30 -10 10 30 50 70 90 110 130
UVLO Threshold (V)
7.0
7.5
8.0
8.5
9.0
Under Voltage Lockout Threshold
vs. Temperature - IXD_630M
VCC Rising
VCC Falling
Temperature (ºC)
-50 -30 -10 10 30 50 70 90 110 130
UVLO Threshold (V)
10.0
10.5
11.0
11.5
12.0
12.5
13.0
Under-Voltage Lockout Threshold
vs. Temperature - IXD_630
V
CC
Rising
V
CC
Falling
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IXD_630
10 www.ixysic.com R02
4 Manufacturing Information
4.1 Moisture Sensitivity
All plastic encapsulated semiconductor packages are susceptible to moisture ingression. IXYS Integrated
Circuits Division classified all of its plastic encapsulated devices for moisture sensitivity according to the
latest version of the joint industry standard, IPC/JEDEC J-STD-020, in force at the time of product
evaluation. We test all of our products to the maximum conditions set forth in the standard, and guarantee
proper operation of our devices when handled according to the limitations and information in that standard as well as
to any limitations set forth in the information or standards referenced below.
Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced
product performance, reduction of operable life, and/or reduction of overall reliability.
This product carries a Moisture Sensitivity Level (MSL) rating as shown below, and should be handled according to
the requirements of the latest version of the joint industry standard IPC/JEDEC J-STD-033.
4.2 ESD Sensitivity
This product is ESD Sensitive, and should be handled according to the industry standard
JESD-625.
4.3 Reflow Profile
This product has a maximum body temperature and time rating as shown below. All other guidelines of
J-STD-020 must be observed.
4.4 Board Wash
IXYS Integrated Circuits Division recommends the use of no-clean flux formulations. However, board washing to
remove flux residue is acceptable, and the use of a short drying bake may be necessary. Chlorine-based or
Fluorine-based solvents or fluxes should not be used. Cleaning methods that employ ultrasonic energy should not be
used.
Device Moisture Sensitivity Level (MSL) Rating
IXD_630YI / IXD_630MYI / IXD_630CI / IXD_630MCI MSL1
Device Maximum Temperature x Time
IXD_630YI / IXD_630MYI / IXD_630CI / IXD_630MCI 245°C for 30 seconds
RoHS
2002/95/EC
e3
Pb
INTEGRATED CIRCUITS DIVISION
IXD_630
R02 www.ixysic.com 11
4.5 Mechanical Dimensions
4.5.1 IXD_630YI (5-Lead TO-263)
4.5.2 IXD_630CI (5-Lead TO-220)
DIMENSIONS
mm MIN / mm MAX
(inches MIN / inches / MAX)
NOTES:
1. All metal surfaces are solder-plated except trimmed area.
2. No. 3 lead is connected to No. 6 lead (bottom heat sink) internally.
8.636 / 9.144
(0.340 / 0.360)
14.605 / 15.875
(0.575 / 0.625)
9.652 / 10.312
(0.380 / 0.406)
1.70 BSC
(0.067 BSC)
1 2 3 4 5
0.737 / 0.889
(0.029 / 0.035)
1.143 / 1.651
(0.045 / 0.065)
4.318 / 4.597
(0.170 / 0.181)
1.143 / 1.397
(0.045 / 0.055)
2.286 / 2.794
(0.090 / 0.110)
0º - 8º
6.858 MIN
(0.270 MIN)
6.223 MIN
(0.245 MIN)
6
3.95
(0.156)
3.65
(0.144)
6.35
(0.250)
1.00
(0.039)
1.70
(0.067)
10.40
(0.409)
9.30
(0.366)
Recommended PCB Pattern
NOTES:
1. This drawing will meet all dimensions requirement of
JEDEC outlines TS-001AA and 5-lead version TO-220AB.
2. Mounting hole diameter: 3.53 / 3.96 (0.139 / 0.156)
3. The metal tab is connected to pin 3 (GND).
Finished Hole Diameter = 1.45mm (0.057 in.)
Recommended Hole Pattern
1.70mm (0.067 in.)
25.27 / 26.54
(0.995 / 1.045)
11.94 / 12.95
(0.470 / 0.510)
14.73 / 15.75
(0.580 / 0.620)
9.91 / 10.54
(0.390 / 0.415)
1.70 BSC
(0.067 BSC)
0.64 / 1.02
(0.025 / 0.040)
8.64 / 9.40
(0.340 / 0.370)
4.32 / 4.83
(0.170 / 0.190)
1.14 / 1.40
(0.045 / 0.055)
0.38 / 0.64
(0.015 / 0.025)
2.29 / 2.92
(0.090 / 0.115)
DIMENSIONS
mm MIN / mm MAX
(inches MIN / inches / MAX)
12.387
(0.487)
6.299
(0.248)
7.823
(0.308)
12.70 / 14.73
(0.50 / 0.58)
7.620
(0.300)
6.502
(0.256)
1 2 3 4 5
3
INTEGRATED CIRCUITS DIVISION
IXD_630
12 www.ixysic.com R02
For additional information please visit our website at: www.ixysic.com
IXYS Integrated Circuits Division makes no representations or warranties with respect to the accuracy or completeness of the contents of this publication and reserves the right to make
changes to specifications and product descriptions at any time without notice. Neither circuit patent licenses nor indemnity are expressed or implied. Except as set forth in IXYS Integrated
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products including, but not limited to, the implied warranty of merchantability, fitness for a particular purpose, or infringement of any intellectual property right.
The products described in this document are not designed, intended, authorized or warranted for use as components in systems intended for surgical implant into the body, or in other
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property or environmental damage. IXYS Integrated Circuits Division reserves the right to discontinue or make changes to its products at any time without notice.
Specification: DS-IXD_630-R02
©Copyright 2012, IXYS Integrated Circuits Division
All rights reserved. Printed in USA.
5/31/2012