DMTH10H010LCT
Document number: DS38444 Rev. 2 - 2
1 of 6
www.diodes.com
March 2016
© Diodes Incorporated
DMTH10H010LCT
100V 175°C N-CHANNEL ENHANCEMENT MODE MOSFET
Product Summary
V(BR)DSS
RDS(ON)
Package
ID
TC = +25°C
100V
9.5mΩ @VGS = 10V
TO220AB
108A
Description
This new generation MOSFET features low on-resistance and fast
switching, making it ideal for high-efficiency power management
applications.
Applications
Motor Control
Backlighting
DC-DC Converters
Power Management Functions
Features
Rated to +175°C Ideal for High Ambient Temperature
Environments
Low Input Capacitance
High BVDSS Rating for Power Application
Low Input/Output Leakage
Lead-Free Finish; RoHS Compliant (Notes 1 & 2)
Halogen and Antimony Free. “Green” Device (Note 3)
Qualified to AEC-Q101 Standards for High Reliability
Mechanical Data
Case: TO220AB
Case Material: Molded Plastic, ―Green‖ Molding Compound.
UL Flammability Classification Rating 94V-0
Terminals: Matte Tin Finish Annealed over Copper Leadframe.
Solderable per MIL-STD-202, Method 208
Terminal Connections: See Diagram Below
Weight: TO220AB 1.85 grams (Approximate)
Ordering Information (Note 4)
Part Number
Case
Packaging
DMTH10H010LCT
TO220AB
50 pieces/tube
Notes: 1. EU Directive 2002/95/EC (RoHS) & 2011/65/EU (RoHS 2) compliant. All applicable RoHS exemptions applied.
2. See http://www.diodes.com/quality/lead_free.html for more information about Diodes Incorporated’s definitions of Halogen- and Antimony-free, "Green"
and Lead-free.
3. Halogen- and Antimony-free "Green‖ products are defined as those which contain <900ppm bromine, <900ppm chlorine (<1500ppm total Br + Cl) and
<1000ppm antimony compounds.
4. For packaging details, go to our website at http://www.diodes.com/products/packages.html.
Marking Information
= Manufacturer’s Marking
H10H010 = Product Type Marking Code
YYWW = Date Code Marking
YY or YY = Last Two Digits of Year (ex: 15 = 2015)
WW or WW = Week Code (01 to 53)
Equivalent Circuit
Top View
Pin Out Configuration
Top View
Bottom View
TO220AB
YYWW
H10H010
DMTH10H010LCT
Document number: DS38444 Rev. 2 - 2
2 of 6
www.diodes.com
March 2016
© Diodes Incorporated
DMTH10H010LCT
Maximum Ratings (@TA = +25°C, unless otherwise specified.)
Characteristic
Symbol
Value
Units
Drain-Source Voltage
VDSS
100
V
Gate-Source Voltage
VGSS
±20
V
Continuous Drain Current
TC = +25°C
TC = +10C
ID
108
76
A
Maximum Continuous Body Diode Forward Current
TC = +25°C
IS
90
A
Pulsed Drain Current (10μs pulse, duty cycle = 1%)
IDM
92
A
Avalanche Current, L=0.3mH (Note 7)
IAS
10
A
Avalanche Energy, L=0.3mH (Note 7)
EAS
15
mJ
Thermal Characteristics
Characteristic
Symbol
Value
Units
Total Power Dissipation (Note 5)
Steady State
PD
W
Thermal Resistance, Junction to Ambient (Note 5)
Steady State
RJA
°C/W
Total Power Dissipation
TC = +25°C
PD
W
Thermal Resistance, Junction to Case
RJC
°C/W
Operating and Storage Temperature Range
TJ, TSTG
-55 to +175
°C
Electrical Characteristics (@TA = +25°C, unless otherwise specified.)
Characteristic
Symbol
Min
Typ
Max
Unit
Test Condition
OFF CHARACTERISTICS (Note 6)
Drain-Source Breakdown Voltage
BVDSS
100
V
VGS = 0V, ID = 1mA
Zero Gate Voltage Drain Current
IDSS
1
µA
VDS = 80V, VGS = 0V
Gate-Source Leakage
IGSS
±100
nA
VGS = ±20V, VDS = 0V
ON CHARACTERISTICS (Note 6)
Gate Threshold Voltage
VGS(TH)
1.4
1.9
3.5
V
VDS = VGS, ID = 250 A
Static Drain-Source On-Resistance
RDS(ON)
6.9
9.5
m
VGS = 10V, ID = 13A
Diode Forward Voltage
VSD
1.3
V
VGS = 0V, IS = 13A
DYNAMIC CHARACTERISTICS (Note 7)
Input Capacitance
Ciss
2592
pF
VDS = 50V, VGS = 0V
f = 1MHz
Output Capacitance
Coss
792
Reverse Transfer Capacitance
Crss
45
Gate Resistance
RG
2
VDS = 0V, VGS = 0V, f = 1MHz
Total Gate Charge
Qg
53.7
nC
VDD = 50V, ID = 13A,
VGS = 10V
Gate-Source Charge
Qgs
10.6
Gate-Drain Charge
Qgd
8.2
Turn-On Delay Time
tD(ON)
11.6
ns
VDD = 50V, VGS = 10V,
ID = 13A, RG = 6Ω
Turn-On Rise Time
tR
14.1
Turn-Off Delay Time
tD(OFF)
42.9
Turn-Off Fall Time
tF
22
Reverse Recovery Time
tRR
49.8
ns
IF = 13A, di/dt = 100A/µs
Reverse Recovery Charge
QRR
85.1
nC
Notes: 5. Device mounted on FR-4 PC board, with minimum recommended pad layout, single sided.
6. Short duration pulse test used to minimize self-heating effect.
7. Guaranteed by design. Not subject to product testing.
DMTH10H010LCT
Document number: DS38444 Rev. 2 - 2
3 of 6
www.diodes.com
March 2016
© Diodes Incorporated
DMTH10H010LCT
0
5
10
15
20
25
30
0 0.5 1 1.5 2 2.5 3
I , DRAIN CURRENT (A)
D
V , DRAIN -SOURCE VOLTAGE (V)
DS
Figure 1 Typical Output Characteristics
V = 3.5V
GS
V = 3.0V
GS
V = 10.0V
GS
V = 6.0V
GS
V = 5.0V
GS
V = 4.5V
GS
V = 4.0V
GS
0
5
10
15
20
25
30
1 2 3 4 5 6
I , DRAIN CURRENT (A)
D
V , GATE-SOURCE VOLTAGE (V)
GS
Figure 2 Typical Transfer Characteristics
V = 5.0V
DS
T = 125 C
A
T = 85 C
A
T = 25 C
A
T = -55 C
A
T = 175 C
A
T = 150 C
A
0.002
0.003
0.004
0.005
0.006
0.007
0.008
0.009
0.01
0 5 10 15 20 25 30 35 40 45 50
R , DRAIN-SOURCE ON-RESISTANCE ( )
DS(ON)
V = 10V
GS
I , DRAIN-SOURCE CURRENT (A)
D
Figure 3 Typical On-Resistance vs.
Drain Current and Gate Voltage
0
0.002
0.004
0.006
0.008
0.01
0.012
0.014
0.016
0.018
0.02
0 4 8 12 16 20
R , DRAIN-SOURCE ON-RESISTANCE ( )
DS(ON)
V , GATE-SOURCE VOLTAGE (V)
GS
Figure 4 Typical Transfer Characteristics
I = 13A
D
0
0.002
0.004
0.006
0.008
0.01
0.012
0.014
0.016
0.018
0.02
0 5 10 15 20 25 30
R , DRAIN-SOURCE ON-RESISTANCE ( )
DS(ON)
I , DRAIN SOURCE CURRENT (A)
D
Figure 5 Typical On-Resistance vs.
Drain Current and Junction Temperature
V = 10V
GS
T = 25 C
A
T = 85 C
A
T = 125 C
A
T = 150 C
A
T = 175 C
A
T = -55 C
A
0.5
1
1.5
2
2.5
-50 -25 0 25 50 75 100 125 150 175
R , DRAIN-SOURCE
DS(ON)
ON-RESISTANCE (NORMALIZED)
T , JUNCTION TEMPERATURE ( C)
J
Figure 6 On-Resistance Variation with
Junction Temperature
V = 10V
GS
I = 13A
D
DMTH10H010LCT
Document number: DS38444 Rev. 2 - 2
4 of 6
www.diodes.com
March 2016
© Diodes Incorporated
DMTH10H010LCT
0
0.003
0.006
0.009
0.012
0.015
-50 -25 0 25 50 75 100 125 150 175
R , DRAIN-SOURCE ON-RESISTANCE ( )
DS(on)
T , JUNCTION TEMPERATURE ( C)
J
Figure 7 On-Resistance Variation with
Junction Temperature
V = 10V
GS
I = 13A
D
0
0.5
1
1.5
2
2.5
3
3.5
4
-50 -25 0 25 50 75 100 125 150 175
V , GATE THRESHOLD VOLTAGE (V)
GS(TH)
T , JUNCTION TEMPERATURE (°C)
A
Figure 8 Gate Threshold Variation vs.
Junction Temperature
I = 250µA
D
I = 1mA
D
0
5
10
15
20
25
30
0 0.3 0.6 0.9 1.2 1.5
I , SOURCE CURRENT (A)
S
V , SOURCE-DRAIN VOLTAGE (V)
SD
Figure 9 Diode Forward Voltage vs. Current
T = 125 C
A
T = 150 C
A
T = 175 C
A
T = 85 C
A
T = 25 C
A
T = -55 C
A
10
100
1000
10000
0 5 10 15 20 25 30 35 40 45 50
CT, JUNCTION CAPACITANCE (pF)
VDS, DRAIN-SOURCE VOLTAGE (V)
Figure 10. Typical Junction Capacitance
f=1MHz
Ciss
Coss
Crss
0
2
4
6
8
10
0 5 10 15 20 25 30 35 40 45 50 55
VGS (V)
Qg(nC)
Figure 11. Gate Charge
VDS = 50V, ID= 13A
0.01
0.1
1
10
100
1000
0.1 1 10 100 1000
I , DRAIN CURRENT (A)
D
V , DRAIN-SOURCE VOLTAGE (V)
DS
Figure 12 SOA, Safe Operation Area
RDS(on)
Limited
T = 17C
J(max)
T = 25°C
A
V = 10V
GS
Single Pulse
DUT on 1 * MRP Board
DC
P = 10s
WP = 1s
WP = 100ms
W
P = 10ms
W
P = 1ms
W
P = 100 s
Wµ
TJ, JUNCTION TEMPERATURE (°C )
DMTH10H010LCT
Document number: DS38444 Rev. 2 - 2
5 of 6
www.diodes.com
March 2016
© Diodes Incorporated
DMTH10H010LCT
Package Outline Dimensions
Please see http://www.diodes.com/package-outlines.html for the latest version.
TO220AB
0.001
0.01
0.1
1
0.000001 0.00001 0.0001 0.001 0.01 0.1 1 10
r(t), TRANSIENT THERMAL RESISTANCE
t1, PULSE DURATION TIMES (sec)
Figure 13 Transient Thermal Resistance
R (t) = r(t) * R
JC JC
R = 0.93°C/W
JC
Duty Cycle, D = t1/ t2
D = 0.7
D = 0.5
D = 0.3
D = 0.1
D = 0.05
D = 0.02
D = 0.01
D = 0.005
Single Pulse
D = 0.9
TO220AB
Dim
Min
Max
Typ
A
3.56
4.82
-
A1
0.51
1.39
-
A2
2.04
2.92
-
b
0.39
1.01
0.81
b2
1.15
1.77
1.24
c
0.356
0.61
-
D
14.22
16.51
-
D1
8.39
9.01
-
D2
11.45
12.87
-
e
-
-
2.54
e1
-
-
5.08
E
9.66
10.66
-
E1
6.86
8.89
-
H1
5.85
6.85
-
L
12.70
14.73
-
L1
-
6.35
-
L2
15.80
16.20
16.00
P
3.54
4.08
-
Q
2.54
3.42
-
All Dimensions in mm
E
Q
D1
D
ØP
L1
L
e
b
A1
A
H1
c
A2
b2
H1
D2
E1
e1
E/2
L2
DMTH10H010LCT
Document number: DS38444 Rev. 2 - 2
6 of 6
www.diodes.com
March 2016
© Diodes Incorporated
DMTH10H010LCT
IMPORTANT NOTICE
DIODES INCORPORATED MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARDS TO THIS DOCUMENT,
INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE
(AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION).
Diodes Incorporated and its subsidiaries reserve the right to make modifications, enhancements, improvements, corrections or other changes
without further notice to this document and any product described herein. Diodes Incorporated does not assume any liability arising out of the
application or use of this document or any product described herein; neither does Diodes Incorporated convey any license under its patent or
trademark rights, nor the rights of others. Any Customer or user of this document or products described herein in such applications shall assume
all risks of such use and will agree to hold Diodes Incorporated and all the companies whose products are represented on Diodes Incorporated
website, harmless against all damages.
Diodes Incorporated does not warrant or accept any liability whatsoever in respect of any products purchased through unauthorized sales channel.
Should Customers purchase or use Diodes Incorporated products for any unintended or unauthorized application, Customers shall indemnify and
hold Diodes Incorporated and its representatives harmless against all claims, damages, expenses, and attorney fees arising out of, directly or
indirectly, any claim of personal injury or death associated with such unintended or unauthorized application.
Products described herein may be covered by one or more United States, international or foreign patents pending. Product names and markings
noted herein may also be covered by one or more United States, international or foreign trademarks.
This document is written in English but may be translated into multiple languages for reference. Only the English version of this document is the
final and determinative format released by Diodes Incorporated.
LIFE SUPPORT
Diodes Incorporated products are specifically not authorized for use as critical components in life support devices or systems without the express
written approval of the Chief Executive Officer of Diodes Incorporated. As used herein:
A. Life support devices or systems are devices or systems which:
1. are intended to implant into the body, or
2. support or sustain life and whose failure to perform when properly used in accordance with instructions for use provided in the
labeling can be reasonably expected to result in significant injury to the user.
B. A critical component is any component in a life support device or system whose failure to perform can be reasonably expected to cause the
failure of the life support device or to affect its safety or effectiveness.
Customers represent that they have all necessary expertise in the safety and regulatory ramifications of their life support devices or systems, and
acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any
use of Diodes Incorporated products in such safety-critical, life support devices or systems, notwithstanding any devices- or systems-related
information or support that may be provided by Diodes Incorporated. Further, Customers must fully indemnify Diodes Incorporated and its
representatives against any damages arising out of the use of Diodes Incorporated products in such safety-critical, life support devices or systems.
Copyright © 2016, Diodes Incorporated
www.diodes.com