Ver. AED
This product complies with the RoHS Directive (EU 2002/95/EC).
Publication date: February 2012 1
DSC8P01
Silicon NPN epitaxial planar type darlington
For low frequency output amplication
Darlington connection
DSC2P01 in MT-2 through hole type package
Features
High forward current transfer ratio hFE with excellent linearity
Contributes to miniaturization of sets, reduction of component count.
Eco-friendly Halogen-free package
Packaging
DSC8P01×0A Radial type : 2000 pcs / carton
Absolute Maximum Ratings Ta = 25°C
Parameter Symbol Rating Unit
Collector-base voltage (Emitter open) VCBO 60 V
Collector-emitter voltage (Base open) VCEO 50 V
Emitter-base voltage (Collector open) VEBO 5 V
Collector current IC500 A
Peak collector current ICP 750 A
Collector power dissipation PC1 W
Junction temperature Tj150 °C
Storage temperature Tstg –55 to +150 °C
Note) Printed circuit board: Copper foil area of 1 cm2 or more, and the board thickness
of 1.7 mm for the collector portion
Absolute maximum rating without heat sink for PC is 0.5 W
Electrical Characteristics Ta = 25°C±3°C
Parameter Symbol Conditions Min Typ Max Unit
Collector-base voltage (Emitter open) VCBO IC = 100 mA, IE = 0 60 V
Collector-emitter voltage (Base open) VCEO IC = 1 mA, IB = 0 50 V
Emitter-base voltage (Collector open) VEBO IE = 100 mA, IC = 0 5 V
Collector-base cutoff current (Emitter open) ICBO VCB = 25 V, IE = 0 100 nA
Emitter-base cutoff current (Collector open) IEBO VEB = 4 V, IC = 0 100 nA
Forward current transfer ratio *1, 2 hFE VCE = 10 V, IC = 500 mA 4
000 20
000
Collector-emitter saturation voltage *1VCE(sat) IC = 500 mA, IB = 0.5 mA 2.5 V
Base-emitter saturation voltage *1VBE(sat) IC = 500 mA, IB = 0.5 mA 3.0 V
Note) 1. Measuring methods are based on JAPANESE INDUSTRIAL STANDARD JIS C 7030 measuring methods for transistors.
2. *1: Pulse measurement
*2: Rank classication
Code Q R
Rank Q R
hFE 4
000 to 10
000 8
000 to 20
000
Marking Symbol E5Q E5R
Package
Code
MT-2-A2-B
Package dimension clicks here.
Pin Name
1. Emitter
2. Collector
3. Base
Marking Symbol: E5
C
B
200 E
Click!
Ver. AED
This product complies with the RoHS Directive (EU 2002/95/EC).
DSC8P01
2
PC Ta IC VCE hFE IC
VCE(sat) IC IC VBE Cob VCB
00 20016040 12080
Ambient temperature Ta (°C)
Collector power dissipation PC (mW)
DSC8P01_PC-Ta
250
1
000
750
500
1
250
Copper plate at the collector is
more than 1.0 cm2 in area, 1.7 mm
in thickness.
0
0 122 104 86
300
250
200
150
50
100
Collector current IC (mA)
Collector-emitter voltage VCE (V)
DSC8P01_IC-VCE
Ta = 25°CIB = 30 µA
20 µA
25 µA
0
1
20
000
16
000
12
000
8
000
4
000
10 102103
Forward current transfer ratio hFE
Collector current IC (mA)
DSC8P01_hFE-IC
25°C
30°C
Ta = 85°C
VCE = 10 V
101
1
1
10
10 102103
Collector-emitter saturation voltage VCE(sat) (V)
Collector current IC (mA)
DSC8P01_VCEsat-IC
25°C
30°C
Ta = 85°C
IC / IB = 1
000
0
0 2.50.5 1.0 2.01.5
500
400
300
200
100
Collector current IC (mA)
Base-emitter voltage VBE (V)
DSC8P01_IC-VBE
30°C
25°C
Ta = 85°C
VCE = 10 V
01
12
10
8
6
4
2
10 102
Collector-base voltage VCB (V)
DSC8P01_Cob-VCB
Collector output capacitance
(Common base, input open circuited) Cob (pF)
IE = 0
f = 1 MHz
Ta = 25°C
VBE(sat) IC
101
1
1
10
102
10 102103
Base-emitter saturation voltage VBE(sat) (V)
Collector current IC (mA)
DSC8P01_VBEsat-IC
25°C30°C
Ta = 85°C
IC / IB = 1
000
Request for your special attention and precautions in using the technical information and
semiconductors described in this book
(1) If any of the products or technical information described in this book is to be exported or provided to non-residents, the laws and
regulations of the exporting country, especially, those with regard to security export control, must be observed.
(2) The technical information described in this book is intended only to show the main characteristics and application circuit examples
of the products. No license is granted in and to any intellectual property right or other right owned by Panasonic Corporation or any
other company. Therefore, no responsibility is assumed by our company as to the infringement upon any such right owned by any
other company which may arise as a result of the use of technical information described in this book.
(3) The products described in this book are intended to be used for general applications (such as office equipment, communications
equipment, measuring instruments and household appliances), or for specific applications as expressly stated in this book.
Consult our sales staff in advance for information on the following applications:
Special applications (such as for airplanes, aerospace, automotive equipment, traffic signaling equipment, combustion equipment,
life support systems and safety devices) in which exceptional quality and reliability are required, or if the failure or malfunction of
the products may directly jeopardize life or harm the human body.
It is to be understood that our company shall not be held responsible for any damage incurred as a result of or in connection with
your using the products described in this book for any special application, unless our company agrees to your using the products in
this book for any special application.
(4) The products and product specifications described in this book are subject to change without notice for modification and/or im-
provement. At the final stage of your design, purchasing, or use of the products, therefore, ask for the most up-to-date Product
Standards in advance to make sure that the latest specifications satisfy your requirements.
(5) When designing your equipment, comply with the range of absolute maximum rating and the guaranteed operating conditions
(operating power supply voltage and operating environment etc.). Especially, please be careful not to exceed the range of absolute
maximum rating on the transient state, such as power-on, power-off and mode-switching. Otherwise, we will not be liable for any
defect which may arise later in your equipment.
Even when the products are used within the guaranteed values, take into the consideration of incidence of break down and failure
mode, possible to occur to semiconductor products. Measures on the systems such as redundant design, arresting the spread of fire
or preventing glitch are recommended in order to prevent physical injury, fire, social damages, for example, by using the products.
(6) Comply with the instructions for use in order to prevent breakdown and characteristics change due to external factors (ESD, EOS,
thermal stress and mechanical stress) at the time of handling, mounting or at customer's process. When using products for which
damp-proof packing is required, satisfy the conditions, such as shelf life and the elapsed time since first opening the packages.
(7) This book may be not reprinted or reproduced whether wholly or partially, without the prior written permission of our company.
20100202