UCC1837 UCC2837 UCC3837 8-Pin N-FET Linear Regulator Controller FEATURES DESCRIPTION * On Board Charge Pump to Drive External N-MOSFET The UCC3837 Linear Regulator Controller includes all the features required for an extremely low dropout linear regulator that uses an external N-channel MOSFET as the pass transistor. The device can operate from input voltages as low as 3V and can provide high current levels, thus providing an efficient linear solution for custom processor voltages, bus termination voltages, and other logic level voltages below 3V. The on board charge pump creates a gate drive voltage capable of driving an external N-MOSFET which is optimal for low dropout voltage and high efficiency. The wide versatility of this IC allows the user to optimize the setting of both current limit and output voltage for applications beyond or between standard 3-terminal linear regulator ranges. * Input Voltage as Low as 3V * Duty Ratio Mode Over Current Protection * Extremely Low Dropout Voltage * Low External Parts Count * Output Voltages as Low as 1.5V This 8-pin controller IC features a duty ratio current limiting technique that provides peak transient loading capability while limiting the average power dissipation of the pass transistor during fault conditions. See the Application Section for detailed information. BLOCK DIAGRAM VDD CS CAP 1 8 2 CHARGE PUMP CURRENT SENSE AMPLIFIER LEVEL SHIFT 5 VOUT 6 FB 3 GND ERROR AMPLIFIER + 140mV UVLO 1.5V REF CURRENT SENSE COMPARATOR TIMER + 100mV SLUS228A - AUGUST 1999 7 4 CT COMP UDG-99145 UCC1837 UCC2837 UCC3837 CONNECTION DIAGRAM ABSOLUTE MAXIMUM RATINGS All pins referenced to GND . . . . . . . . . . . . . . . . . -0.3V to +15V CS, CT, FB . . . . . . . . . . . . . . . . . . . . . . . . -0.3V to VDD + 0.3V Storage Temperature . . . . . . . . . . . . . . . . . . . -65C to +150C Junction Temperature . . . . . . . . . . . . . . . . . . . -55C to +150C Lead Temperature (Soldering, 10sec.) . . . . . . . . . . . . . +300C DIL-8, SOIC-8 (Top View) J or N Package, D Package Currents are positive into, negative out of the specified terminal. Consult Packaging Section of Databook for thermal limitations and considerations of packages. ELECTRICAL CHARACTERISTICS: Unless otherwise specified, TA = -55C to 125C for the UCC1837, -25C to 85C for the UCC2837 and 0C to 70C for UCC3837; VDD = 5V, CT = 10nF, CCAP = 100nF. PARAMETER TEST CONDITIONS MIN TYP MAX UNITS Input Supply Supply Current VDD = 5V 1 1.5 mA VDD = 10V 1.2 2 mA Under Voltage Lockout Minimum Voltage to Start 2.00 2.65 3.00 V Minimum Voltage After Start 1.6 2.2 2.6 V Hysteresis 0.25 0.45 0.65 V 25C 1.485 1.5 1.515 V 0C to 70C 1.470 1.5 1.530 V -55C to 125C 1.455 1.5 1.545 V Reference ( Note 1 ) VREF Current Sense Comparator Offset 0C to 70C 90 100 110 mV Comparator Offset -55C to 125C 85 100 115 mV 120 140 160 mV 0.5 5 A 36 56 A Amplifier Offset Input Bias Current VCS = 5V Current Fault Timer CT Charge Current VCT = 1V CT Discharge Current VCT = 1V 16 0.4 1.2 1.9 A CT Fault Low Threshold 0.4 0.5 0.6 V CT Fault Hi Threshold 1.3 1.5 1.7 V 2 3.3 5 % 0.5 2 A Fault Duty Cycle Error Amplifier Input Bias Current Open Loop Gain 60 90 -10A to 10A 2 5 8 mMho Charge Current VCOMP = 6V 20 40 60 A Discharge Current VCOMP = 6V 10 25 40 A Transconductance 2 dB UCC1837 UCC2837 UCC3837 ELECTRICAL CHARACTERISTICS: Unless otherwise specified, TA = -55C to 125C for the UCC1837, -25C to 85C for the UCC2837 and 0C to 70C for UCC3837; VDD = 5V, CT = 10nF, CCAP = 100nF. PARAMETER TEST CONDITIONS MIN TYP MAX UNITS 0.5 1.5 2.5 mA 175 A FET Driver Peak Output Current VCAP = 10V, VOUT = 1V Average Output Current VOUT = 1V 25 100 Max Output Voltage VDD = 4.5V, IOUT = 0A 8.4 9.7 V VDD = 4.5V, IOUT = 10A, 0C to 70C 8 9 V VDD = 4.5V, IOUT = 10A, -55C to 125C 7.5 9 V VDD = 4.5V, C/S = 0V 11 12.5 V Charge Pump CAP Voltage VDD = 12V, C/S = 0V 15 16.5 V Note 1: This is defined as the voltage on FB which results in a DC voltage of 8V on VOUT. PIN DESCRIPTIONS CAP: The output of the charge pump circuit. A capacitor is connected between this pin and GND to provide a floating bias voltage for an N-Channel MOSFET gate drive. A minimum of a 0.01F ceramic capacitor is recommended. CAP can be directly connected to an external regulated source such as +12V, in which case the external voltage will be the source for driving the N-Channel MOSFET. CT: The input to the duty cycle timer circuit. A capacitor is connected from this pin to GND, setting the maximum ON time of the over current protection circuits. See the Application Section for programming instructions. COMP: The output of the transconductance error amplifier and current sense amplifier. Used for compensating the small signal characteristics of the voltage loop (and current loop when Current Sense Amplifier is active in over curret mode). GND: Ground reference for the device. For accurate output voltage regulation, GND should be referenced to the output load ground. FB: The inverting terminal of the voltage error amplifier, used to feedback the output voltage for comparison with the internal reference voltage. The nominal DC operating voltage at this pin is 1.5V VDD: The system input voltage is connected to this point. VDD must be above 3V. VDD also acts as one side of the Current Sense Amplifier and Comparator. CS: The negative current sense input signal. This pin should be connected through a low noise path to the low side of the current sense resistor. VOUT: This pin directly drives the gate of the external N-MOSFET pass element. The typical output impedance of this pin is 6.5k. APPLICATION INFORMATION tions of the UCC3837 itself. The charge pump output has a typical impedance of 80k and therefore the loading of the IC and the external gate drive reduces the voltage from its ideal level. The UCC3837 can operate in several states including having the error amplifier disabled (shut down), in normal linear regulation mode, and in overdrive mode where the linear regulator is responding to a transient load or line condition. The maximum output voltage available at VOUT is shown in Fig. 2 for these various modes of operation. Topology and General Operation Unitrode Application Note U-152 is a detailed design of a low dropout linear regulator using an N-channel MOSFET as a pass element, and should be used as a guide for understanding the operation of the circuit shown in Fig. 1. Charge Pump Operation The internal charge pump of the UCC3837 is designed to create a voltage equal to 3 times the input VDD voltage at the CAP pin. There is an internal 5V clamp at the input of the charge pump however that insures the voltage at CAP does not exceed the ratings of the IC. This CAP voltage is used to provide gate drive current to the external pass element as well as bias current to internal sec- The charge pump output is designed to supply 10A of average current to the load which is typically the MOSFET gate capacitance present at the VOUT pin.The capacitor value used at CAP is chosen to provide holdup 3 UCC1837 UCC2837 UCC3837 APPLICATION INFORMATION 15 R1 0.020 5V UCC3837 CS 1 VDD 2 CAP VOUT ON/OFF Q1 CT 4 COMP 5 FB 6 GND 3 OVERDRIVE 13 LINEAR REGULATOR 12 Q1 IRL2203N OR EQUIVALENT E/A DISABLED 11 3.3V R2 1.8k 0.1F 7 8 VOUT C1 330F 14 10 9 C3 1000F 8 7 R3 1.5k 6 5 0.1F 3 4 5 6 RCOMP 10k 7 VDD 8 9 10 11 12 Figure 2. Typical VOUT(max) vs. VDD. CCOMP 820pF mode of operation is linear, and therefore the channel resistance is higher than the manufacturer's published RDS(on) value. The MOSFET should only be operated in the non-linear (switch) mode under transient conditions, when minimum dropout voltage is required. UDG-99137 Figure 1. Typical application 5V to 3.3V, 5A of the CAP voltage should the external load exceed the average current, which occurs during load and line transient conditions. The value of CAP also determines the startup time of the linear regulator. The voltage at CAP charges up with a time constant determined by the charge pump output impedance (typically 80k) and the value of the capacitor on CAP. Disabling the UCC3837 Grounding the CAP pin will remove the drive voltage and effectively disable the output voltage. The device used to short the output of CAP should have a very low leakage current when in the OPEN state, since even a few microamps will lower the charge pump voltage. An external voltage such as +12V may be tied to the CAP pin directly to insure a higher value of VOUT, which may be useful when a standard level MOSFET is used or when VDD is very low and the resulting VOUT voltage may need to be higher. With an external source applied to CAP, the maximum voltage at VOUT will be approximately 1V below the external source.The external +12V source should be decoupled to GND using a minimum of a 0.01F capacitor. A second method of disabling the UCC3837 is to place a short circuit across CCOMP. This will have an advantage of a quicker restart time as the voltage at CAP will not be completely discharged. The charge pump will be loaded down by the typical 40A charging current of the error amplifier with this configuration, resulting in a lower voltage at CAP. Compensating the Error Amplifier Choosing a Pass Element Using a MOSFET as an external pass element introduces a pole in the control loop that is a function of the UCC3837 output impedance, ROUT, typically 6.5k, and the MOSFET input gate capacitance. Fig. 3 indicates that in the normal operation of a linear regulator using a MOSFET, the gate capacitance can be predicted directly from the MOSFET characteristic charge curve, using the relationship: The UCC3837 is designed for use with an N-channel MOSFET pass element only. The designer may choose a logic level or standard gate level MOSFET depending on the input voltage, the required gate drive, and the available voltage at VOUT as discussed previously. MOSFET selection should be based on required dropout voltage and gate drive characteristics. A lower RDS(on) MOSFET is used when low dropout is required, but this type of MOSFET will have higher gate capacitance which may result in a slower transient response. C IN = Qgth Vgth This pole can be canceled by programming a zero frequency on the output of the UCC3837 error amplifier equal to the pole frequency. Therefore: A MOSFET used in linear regulation is typically operated at a gate voltage between the threshold voltage and the gate plateau voltage in order to maintain high gain. This 4 UCC1837 UCC2837 UCC3837 APPLICATION INFORMATION (cont.) For the application circuit shown in Fig. 1, the voltage at the error amplifier output will increase quickly by 400mV due to the 40A current through RCOMP. The error amplifier will then slew at approximately 50mV per microsecond as the 40A charges CCOMP. From the IRL2203N data sheet, the typical required gate voltage at room temperature, to deliver 5A is 2.6V. The threshold for the device is approximately 1.5V. From the gate charge curve for the IRL2203N, approximately 7nC charge is required to change the gate voltage from 1.5V to 2.6V. With 1.5mA gate drive current, the required time to charge the gate is therefore 4.7s. UDG-97046 Overcurrent Protection and Thermal Management: Figure 3. MOSFET turn-on characteristics. F POLE = Overcurrent protection is provided via the UCC3837's internal current amplifier and overcurrent comparator. If at any time the voltage across the current sense resistor crosses the comparator threshold, the UCC3837 begins to modulate the output driver at a 3% duty cycle. During the 3% on time, if the current forces 140mV across the sense amplifier, the UCC3837 will enter a constant output current mode. Fig. 4 illustrates the cyclical retry of the UCC3837 under fault conditions. Note that the initial fault time is longer than subsequent cycles due to the fact that the timing capacitor is completely discharged and must initially charge to the reset threshold of 0.5V. 1 2 * * C IN * ROUT F ZERO = F POLE = RCOMP CCOMP = 1 2 * * RCOMP * CCOMP 1 2 * * F POLE where CIN is the MOSFET input capacitance and ROUT is the output impedance of VOUT. The value of CCOMP should be large enough that parasitics connected to COMP do not effect the zero frequency. A minimum of 220pF is recommended. Transient Response The transient performance of a linear regulator built using the UCC3837 can be predicted by understanding the dynamics of the transient event. Consider a load transient on the application circuit of Fig. 1, where the output current steps from a low value to a high value. Initially, the output voltage will drop as a function of the output capacitors ESR times the load current change. In response to the decrease in feedback voltage at FB, the UCC3837 error amplifier will increase its charge current to a typical value of 40A. The output of the amplifier will therefore respond by first stepping the voltage proportional to 40A times RCOMP, and then ramping up proportional to 40A and the value of CCOMP. Dynamic response can therefore be improved by increasing RCOMP and decreasing CCOMP . The value of VOUT will increase the same amount as the increase in the error amplifier output. The UCC3837 output gate drive current, however, is internally limited to 1.5mA. The response of the voltage at the gate of the external pass element is therefore a function of the 1.5mA drive current and the external gate charge, as obtained from the MOSFET data sheet gate charge curve. UDG-97046 Figure 4. Load current, timing capacitor voltage and output voltage under fault conditions. 5 UCC1837 UCC2837 UCC3837 heat sink need only have adequate thermal mass to absorb the maximum steady state power dissipation and not the full short circuit power. With a 5.25V input and a maximum output current of 5A, the power dissipated in the MOSFET is given by: Fault time duration is controlled by the value of the timing capacitor, CT, according to the following equation: t FAULT = CT * 1. 5 - 0. 5 V (1) = CT * = 27.8 * 10 3 * CT I 36 * 10 -6 P = (V IN - V SENSE - VOUT ) * IOUT FAULT TIME (ms) Fig. 5 provides a plot of fault time vs. timing capacitance. The fault time duration is set based upon the load capacitance, load current, and the maximum output current. The "on" or fault time must be of sufficient duration to charge the load capacitance during a normal startup sequence or when recovering from a fault. If not, the charge accumulated on the output capacitance will be depleted by the load during the "off" time. The cycle will then repeat, preventing the output from turning on. (4) P = ( 5 . 25 - ( 5 * 0. 02) - 3 . 3) * 5 = 9 . 25W Given that the thermal resistivity of the MOSFET is specified as 1C/W for the TO-220 package style and assuming an ambient temperature of 50C and a case to heat sink resistivity of CS = 0.3C/W, the heat sink required to maintain a 125C junction temperature can be calculated as follows: 30 T J = T A + P ( JC + CS + SA ) 25 125 = 50 + 9 . 25 * (1 + 0.3 + SA ) 20 SA 6 . 8 C (5) W Based on this analysis, any heatsink with a thermal resistivity of 6.8 C/W or less should suffice. The current in the circuit of Fig. 1, under short circuit conditions, will be limited to 7A at a 3% duty cycle, resulting in a MOSFET power dissipation of only: 15 10 5 0 0 0.2 0.4 0.6 CT (uF) 0.8 COUT * VOUT [(5. 25 - 7 * (0 . 02)) * 7] * 0 . 03 = 1. 07W ) ] - IOUT * (R SENSE ) * IOUT * Duty (6) Using Printed Circuit Board Etch as a Sense Resistor Unitrode Design Note DN-71 discusses the use of printed circuit board copper etch as a low ohm sense resistor. This technique can easily be applied when using the UCC3837. The application circuit shown in Fig. 1 can be used as an example. This linear regulator is designed with a 5A average load current, demanding a 20m sense resistor to result in a 100mV current sense comparator signal for the UCC3837. The maximum ambient temperature of the linear regulator is 70C. (2) The minimum timing capacitor can be calculated by substituting equation (1) for tFAULT in equation (2) and solving for CT. CT (min) = P= IN (max ) Without switchmode protection, the short circuit power dissipation would be 35.8W, almost four times the nominal dissipation. To determine the minimum fault time, assume a maximum load current just less than the trip limit. This leaves the difference between the IMAX and ITRIP values as the current available to charge the output capacitance. The minimum required fault time can then be calculated as follows: COUT * VOUT I MAX - ITRIP [(V 1 Figure 5. Fault time vs. timing capacitance. t FAULT (min) = P= (3) Using DN-71, a 1 ounce outer layer etch of 0.05 inches wide and 1.57 inches long results in a resistance of 20m at an ambient temperature of 70C and an operating current of 5A. Because the resistivity of copper is a function of temperature, the current limit at lower temperatures will be higher, as shown in Fig. 6. 27 . 8 * 10 * (I MAX - ITRIP ) 3 Switchmode protection offers significant heat sinking advantages when compared to conventional, constant current solutions. Since the average power during a fault condition is reduced as a function of the duty cycle, the 6 UCC1837 UCC2837 UCC3837 APPLICATION INFORMATION 21 9 20 8 19 7 18 6 17 16 5 15 4 0 20 To illustrate the importance of these concepts, consider the effects of a 1.5" PCB trace located between the output capacitor and the UCC3837 feedback reference. A 0.07" wide trace of 1oz. copper results in an equivalent resistance of 10.4m. At a load current of 3A, 31.2mV is dropped across the trace, contributing almost 1% error to the DC regulation. Likewise, the inductance of the trace is approximately 3.24nH, resulting in a 91mV spike during the 100ns it takes the load current to slew from 200mA to 3A. SHORT CIRCUIT LIMIT 40 60 SHORT CIRCUIT CURRENT COPPER RESISTANCE [mW] RESISTANCE The dropout voltage of a linear regulator is often a key design parameter. Calculations of the dropout voltage of a linear regulator based on the UCC3837 Controller should consider all of the following: 80 AMBIENT TEMPERATURE [C] * Sense resistor drop, including temperature and tolerance effects, Figure 6. Copper resistance and short circuit limit for example resistor. * Path resistance drops on both the input and output voltages, Practical Considerations In order to achieve the expected performance, careful attention must be paid to circuit layout. The printed circuit board should be designed using a single point ground, referenced to the return of the output capacitor. All traces carrying high current should be made as short and wide as possible in order to minimize parasitic resistance and inductance effects. * MOSFET resistance as a function of temperature and gate drive, including transient performance, * Ground path drops. UNITRODE CORPORATION 7 CONTINENTAL BLVD. * MERRIMACK, NH 03054 TEL. (603) 424-2410 FAX (603) 424-3460 7 PACKAGE OPTION ADDENDUM www.ti.com 18-Sep-2008 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Eco Plan (2) Qty UCC2837D ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR UCC2837DG4 ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR UCC2837DTR ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR UCC2837DTRG4 ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR UCC3837D ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR UCC3837DG4 ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR UCC3837DTR ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR UCC3837DTRG4 ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR Lead/Ball Finish MSL Peak Temp (3) (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 14-Jul-2012 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant UCC2837DTR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1 UCC3837DTR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1 Pack Materials-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 14-Jul-2012 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) UCC2837DTR SOIC D 8 2500 367.0 367.0 35.0 UCC3837DTR SOIC D 8 2500 367.0 367.0 35.0 Pack Materials-Page 2 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. All semiconductor products (also referred to herein as "components") are sold subject to TI's terms and conditions of sale supplied at the time of order acknowledgment. TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI's terms and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily performed. TI assumes no liability for applications assistance or the design of Buyers' products. Buyers are responsible for their products and applications using TI components. To minimize the risks associated with Buyers' products and applications, Buyers should provide adequate design and operating safeguards. TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or other intellectual property right relating to any combination, machine, or process in which TI components or services are used. Information published by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI. Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such altered documentation. Information of third parties may be subject to additional restrictions. Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service voids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice. TI is not responsible or liable for any such statements. Buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirements concerning its products, and any use of TI components in its applications, notwithstanding any applications-related information or support that may be provided by TI. Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards which anticipate dangerous consequences of failures, monitor failures and their consequences, lessen the likelihood of failures that might cause harm and take appropriate remedial actions. Buyer will fully indemnify TI and its representatives against any damages arising out of the use of any TI components in safety-critical applications. In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TI's goal is to help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and requirements. Nonetheless, such components are subject to these terms. No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the parties have executed a special agreement specifically governing such use. Only those TI components which TI has specifically designated as military grade or "enhanced plastic" are designed and intended for use in military/aerospace applications or environments. Buyer acknowledges and agrees that any military or aerospace use of TI components which have not been so designated is solely at the Buyer's risk, and that Buyer is solely responsible for compliance with all legal and regulatory requirements in connection with such use. TI has specifically designated certain components which meet ISO/TS16949 requirements, mainly for automotive use. Components which have not been so designated are neither designed nor intended for automotive use; and TI will not be responsible for any failure of such components to meet such requirements. Products Applications Audio www.ti.com/audio Automotive and Transportation www.ti.com/automotive Amplifiers amplifier.ti.com Communications and Telecom www.ti.com/communications Data Converters dataconverter.ti.com Computers and Peripherals www.ti.com/computers DLP(R) Products www.dlp.com Consumer Electronics www.ti.com/consumer-apps DSP dsp.ti.com Energy and Lighting www.ti.com/energy Clocks and Timers www.ti.com/clocks Industrial www.ti.com/industrial Interface interface.ti.com Medical www.ti.com/medical Logic logic.ti.com Security www.ti.com/security Power Mgmt power.ti.com Space, Avionics and Defense www.ti.com/space-avionics-defense Microcontrollers microcontroller.ti.com Video and Imaging www.ti.com/video RFID www.ti-rfid.com OMAP Applications Processors www.ti.com/omap TI E2E Community e2e.ti.com Wireless Connectivity www.ti.com/wirelessconnectivity Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265 Copyright (c) 2012, Texas Instruments Incorporated