ELECTRONICS
BERGSTIK™
Unshrouded Headers for Pin-in-Paste Processes
BERGSTIKTM UNSHROUDED HEADERS
FOR PIN-IN-PASTE PROCESSES
DESCRIPTION
BergStik™ is FCI’s brand for pin headers
in 2.54 mm (0.100”) pitch. The BergStik
product range includes straight, right angle,
surface mount and stacking headers. Three
new series are now being added, dedicated
to Pin-in-Paste soldering processes.
This brochure gives additional information
for the correct use of BergStik PIP
connectors in the application process.
PIN-IN-PASTE
Pin-in-Paste (PIP) technology allows the
use of TMT products in SMT manufacturing
processes. The connectors are automatically
or manually placed on the board, then
soldered in the same operation as the SMT
components. Despite this, the mechanical
strength of the TMT soldering is maintained
– still an important requirement for connectors
nowadays in many industrial or automotive
applications.
CONNECTOR DESIGN
These connectors meet the requirements of Pin-in-Paste processing in all aspects, including plastic material, housing design and pin length.
PLASTIC MATERIAL: BergStik PIP headers are moulded in high temperature thermoplastic and are able to withstand exposure
to 260°C peak temperature for 30 seconds maximum in a convection, infra-red or vapour phase reflow oven.
HOUSING DESIGN: a special housing has been developed for the double row straight product. A row of higher standoffs has
been placed in the longitudinal center axis, between both rows of pins for a good solder paste deposit around the pin. Please
follow the stencil design guidelines TA-894 and TA-897 below in order to avoid paste deposit under the standoffs.
APPLICATION DESIGN
GUIDELINES
The following application guidelines will
help you to achieve optimum results when
using Bergstik PiP in your process.
STENCIL DESIGN: the stencil design
is crucial for a good solder joint. It
determines the quantity of paste and
the position of the paste print on the
board. Each PCB hole has its own stencil
aperture with enough spacing in between
to allow separate solder deposits. This
prevents solder robbing from one hole
to another and guarantees the correct
quantity of solder paste for each hole.
The print position is slightly asymmetrical
so as to optimise the flow of molten
solder paste.
PASTE APPLICATION: the quantity of
paste for each hole depends on the
soldering process parameters and the
degree of hole filling.
For the squeegee, FCI recommends a
45° angle. You can use a smaller angle
for an even greater degree of hole filling.
The squeegee moves in parallel with the
shorter sides of the stencil apertures.
BOARD LAYOUT: Please use a hole of
1.00 +/– 0.05 mm for an optimum
paste deposit. For automatic pick-and-
place, lean towards the upper end of the
tolerance.
Refer also to TA-894 for further information.
TA - 897 TA - 894
BERGSTIKTM UNSHROUDED HEADERS
FOR PIN-IN-PASTE PROCESSES
FCI - Americas : 1 (800) 237 2374 - Europe : 33 1 39 49 21 83 - Asia/Pacific : 65 6549 6666
www.fciconnect.com
MATERIALS Housing: PCT
Colour: Black
Flammability rating: UL 94 V-O
Pins: Copper Alloy
Plating: Selective Gold or GXT or full tin over
1.27µm nickel
ELECTRICAL PERFORMANCE Insulation resistance: 5000 MΩmin
Dielectric withstanding voltage: 1500 V
MECHANICAL PERFORMANCE Pin retention to housing: 8.8 N min.
OPERATING TEMPERATURE RANGE -65°C to +130°C
ROHS INFORMATION This product is RoHS compliant according
to the European Union Directive 2002/95/IEC
REFERENCE INFORMATION File no. E66906
File no. LR46923
Product drawing: by 8-digit base part number
Product specification: BUS-12-019
TECHNICAL DATA
PART NUMBER
8-Digit Base Part Number
Straight
10076801 = Double Row
Plating
=Standard product = plastic bag
A= Tape reel with pick up cap
(call FCI for availability)
Double row =04 to 72
Plastic bag
Single row =03 to 36
Double row =03 to 72
Packaging
1= Gold 0.76 µm (30µ”) or GXT 0.76 µm (30µ”) PdNi
with gold flash on contact area tin on solder side
4= tin
Total
Positions LF
Pin Style Mating Solder OAL
015.84 2.50 10.8
02 6.75 2.50 11.5
Pin Style
lenght
8-Digit Base Part Number
Right angle
10082201 = Single row
10082202 = Double Row
Plating Packaging
1= Gold 0.76 µm (30µ”) or GXT 0.76 µm (30µ”) PdNi
with gold flash on contact area tin on solder side
4= tin
Total
Positions LF
Pin Style Mating Solder
03 5.84 3.00
04 6.75 3.00
Pin Style
lenght
BASICS+ SERVICE PROGRAM
BergStik is a part of the Basics+ product range.
The Basics+ Program is built around 2.54 mm and 2 mm pitch
connectors for board-to-board, wire-to-board and cable-to-
board applications.
Basics+ makes the entire product design-in-process very
simple, with easy-to-use product selection, technical hot-line,
fast sample service, and core range products.
Included are established, proven brands such as BergStik,
Dubox, Quickie, Minitek and BergCon PV.
