NCV7321D12R2G - APTINA IMAGING - Datasheet.Directory

August, 2016 − Rev. 14 1Publication Order Number:

NCV7321/D

NCV7321

Stand-alone LIN Transceiver

Description

The NCV7321 is a fully featured local interconnect network (LIN)

transceiver designed to interface between a LIN protocol controller

and the physical bus. The transceiver is implemented in I3T

technology enabling both high−voltage analog circuitry and digital

functionality to co−exist on the same chip.

The NCV7321 LIN device is a member of the in−vehicle

networking (IVN) transceiver family.

The LIN bus is designed to communicate low rate data from control

devices such as door locks, mirrors, car seats, and sunroofs at the

lowest possible cost. The bus is designed to eliminate as much wiring

as possible and is implemented using a single wire in each node. Each

node has a slave MCU−state machine that recognizes and translates

the instructions specific to that function. The main attraction of the

LIN bus is that all the functions are not time critical and usually relate

to passenger comfort.

Features

•LIN−Bus Transceiver

♦LIN Compliant to Specification Revision 2.x (Backwards

Compatible to Version 1.3) and J2602

♦Bus Voltage $45 V

♦Transmission Rate 1 kbps to 20 kbps

♦Supports K−Line Bus Architecture

•Protection

♦Thermal Shutdown

♦Indefinite Short−Circuit Protection on Pins LIN and WAKE

Towards Supply and Ground

♦Load Dump Protection (45 V)

♦Bus Pins Protected Against Transients in an Automotive

Environment

•EMI Compatibility

♦Integrated Slope Control

•Modes

♦Normal Mode: LIN Transceiver Enabled, Communication via the

LIN Bus is Possible, INH Switch is On

♦Sleep Mode: LIN Transceiver Disabled, the Consumption from

VBB is Minimized, INH Switch is Off

♦Standby Mode: Transition Mode reached either after Power−up or

after a Wake−up Event, INH Switch is on

♦Wake−up Bringing the Component from Sleep Mode into Standby

Mode is Possible either by LIN Command or a Digital Signal on

WAKE Pin (e.g. External Switch)

Quality

•NCV Prefix for Automotive and Other Applications Requiring

Unique Site and Control Change Require− ments; AEC−Q100

Qualified and PPAP Capable

•These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS

Compliant

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PIN CONNECTIONS

DFN8 (Top View)

See detailed ordering and shipping information in the package

dimensions section on page 12 of this data sheet.

ORDERING INFORMATION

MARKING

DIAGRAMS

SOIC−8:

x = Specific Device Code

0 = NCV7321D10

1 = NCV7321D11

2 = NCV7321D12

DFN8:

y = Specific Device Code

2 = NCV7321MW2

F = Fab Location Code

= (NCV7321D11R2G only)

A = Assembly Location

L = Wafer Lot

Y = Year

W = Work Week

G= Pb−Free Package

NV7321−x

FALYW

SOIC−8

CASE 751

DFN8

CASE 506DG NV73

21−y

ALYWG

RxD

TxD

INH

LIN

VBB

GND

WAKE

SOIC−8 (Top View)

RxD

TxD

INH

LIN

VBB

GND

WAKE

(Note: Microdot may be in either location)

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RECOMMENDED OPERATING RANGES AND KEY TECHNICAL CHARACTERISTICS

Table 1. RECOMMENDED OPERATING RANGES AND KEY TECHNICAL CHARACTERISTICS

Symbol Parameter Min Typ Max Unit

VBB Nominal Battery Operating Voltage (Note 1) 5 12 27 V

Load Dump Protection 45

IBB_SLP Supply Current in Sleep Mode 20 mA

VLIN LIN Bus Voltage −45 45 V

VWAKE Operating DC Voltage on WAKE Pin 0 VBB V

Maximum Rating Voltage on WAKE Pin −35 45 V

VINH Operating DC Voltage on INH Pin 0 VBB V

V_Dig_IO Operating DC Voltage on Digital IO Pins (EN, RxD, TxD) 0 5.5 V

TJSD Junction Thermal Shutdown Temperature 150 165 185 °C

Tamb Operating Ambient Temperature −40 +125 °C

VESD Electrostatic Discharge Voltage (all pins) Human Body Model (Note 2) −4 +4 kV

Version NCV7321D11/D12/MW2; no filter on LIN

Electrostatic Discharge Voltage (LIN) System Human Body Model (Note 3) −10 +10 kV

VTRAN Version NCV7321D12/MW2;

Voltage transients (DCC method), pin LIN

According to SAE J2962−1, Class C (Note 4)

−85 +85 V

Functional operation above the stresses listed in the Recommended Operating Ranges is not implied. Extended exposure to stresses beyond

the Recommended Operating Ranges limits may affect device reliability.

1. Below 5 V on VBB in normal mode, the bus will either stay recessive or comply with the voltage level specifications and transition time

specifications a s required by SAE J2602. It is ensured by the battery monitoring circuit. Above 27 V on VBB, LIN communication is operational

(LIN pin toggling) but parameters cannot be guaranteed. For higher battery voltage operation above 27 V, LIN pull−up resistor must be

selected large enough to avoid clamping of LIN pin by voltage drop over external pull−up resistor and LIN pin min current limitation.

2. Equivalent to discharging a 100 pF capacitor through a 1.5 kW resistor conform to MIL STD 883 method 3015.7.

3. Equivalent to discharging a 150 pF capacitor through a 330 W resistor. System HBM levels are verified by an external test−house.

4. Direct Capacitor Coupling (DCC) method according to SAE J2962−1 specification, referring to ISO 7637−3 Slow Transient Pulse. Coupling

Capacitor 10 nF. Tested with no external protections. Verified by an external test house.

Table 2. THERMAL CHARACTERISTICS

Parameter Symbol Value Unit

Thermal characteristics, SOIC−8 (Note 5)

Thermal Resistance Junction−to−Air, Free air, 1S0P PCB (Note 6)

Thermal Resistance Junction−to−Air, Free air, 2S2P PCB (Note 7) RqJA

RqJA 125

75 °C/W

°C/W

Thermal characteristics, DFN8 (Note 5)

Thermal Resistance Junction−to−Air, Free air, 1S0P PCB (Note 6)

Thermal Resistance Junction−to−Air, Free air, 2S2P PCB (Note 7) RqJA

RqJA 140

47 °C/W

°C/W

5. Refer to ELECTRICAL CHARACTERISTICS, RECOMMENDED OPERATING RANGES and/or APPLICATION INFORMATION for Safe

Operating parameters.

6. Values based on test board according to EIA/JEDEC Standard JESD51−3, signal layer with 10% trace coverage.

7. Values based on test board according to EIA/JEDEC Standard JESD51−7, signal layers with 10% trace coverage.

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BLOCK DIAGRAM

LIN

NCV7321

GND

RxD

INH

Thermal

shutdown

TxD

COMP

Slope Control

Filter

POR

State

Wake−up

Control

WAKE

time−out

Osc

Figure 1. Block Diagram

−

VBB

TYPICAL APPLICATION

NCV7321

GND

INH

LIN

WAKE

RxD

TxD

Microcontroller

GND

VCC

bat

3.3/5V

VBAT

LIN

WAKE

GND

KL30

LIN−

BUS

KL31

ECU

Figure 2. Typical Application Diagram for a Master Node

VBB

Table 3. PIN DESCRIPTION

Pin Name Description

1 RxD Receive Data Output; Low in Dominant State; Open−Drain Output

2 EN Enable Input, Transceiver in Normal Operation Mode when High, Pull−down Resistor to GND

3 WAKE High Voltage Digital Input Pin to Apply Local Wake−up, Sensitive to Falling Edge, Pull−up Current Source to VBB

4 TxD Transmit Data Input, Low for Dominant State, Pull−down to GND (Switchable Strength for Wake−up Source Recognition)

5 GND Ground

6 LIN LIN Bus Output/Input

7 VBB Battery Supply Input

8 INH Inhibit Output, Switch Between INH and VBB can be Used to Control External Regulator or Pull−up Resistor on LIN Bus

− EP Exposed Pad. Recommended to connect to GND or left floating in application (DFN8 package only).

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Table 4. ABSOLUTE MAXIMUM RATINGS

Symbol Parameter Min Typ Max Unit

VBB Voltage on Pin VBB −0.3 +45 V

VLIN LIN Bus Voltage −45 +45 V

VWAKE DC Voltage on WAKE Pin −35 +45 V

VINH DC Voltage on INH Pin −0.3 VBB + 0.3 V

IINH DC Current from INH Pin 50 mA

V_Dig_IO DC Input Voltage on Pins (EN, RxD, TxD) −0.3 +45 V

TJMaximum Junction Temperature −40 +150 °C

VESD HBM (All Pins) (Note 8) −4 +4 kV

CDM (All Pins) (Note 9) −750 +750 V

Version NCV7321D10:

HBM (LIN, INH, VBB, WAKE) (Note 10)

System HBM (LIN, VBB, WAKE) (Note 11) −5

−5 +5

+5 kV

Version NCV7321D11/D12/MW2:

HBM (LIN, INH, VBB, WAKE) (Note 10)

System HBM (VBB, WAKE) (Note 12)

System HBM (LIN) (Note 12)

−8

−6

−10

+10

Version NCV7321D12/MW2:

Powered ESD (LIN), Contact/Air, 330 pF / 2 kW (Note 13)

Powered ESD (LIN), Air, 150 pF / 2 kW (Note 13) −15

−25 +15

+25 kV

VTRAN Version NCV7321D12/MW2;

Voltage transients (DCC method), pin LIN

According to SAE J2962−1, Class C (Note 14)

−85 +85 V

Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality

should not be assumed, damage may occur and reliability may be af fected.

8. Equivalent to discharging a 100 pF capacitor through a 1.5 kW resistor conform to MIL STD 883 method 3015.7.

9. Charged device model test according to ESD STM5.3.1−1999.

10.Equivalent to discharging a 100 pF capacitor through a 1.5 kW resistor referenced to GND.

11.Equivalent t o discharging a 150 pF capacitor through a 330 W resistor. 220 nF filter on LIN pin. System HBM levels are verified by an external

test−house.

12.Equivalent to discharging a 150 pF capacitor through a 330 W resistor. No filter on LIN pin. System HBM levels are verified by an external

test−house.

13.Powered ESD test method according to SAE J2962−1 specification, referring to ISO 10605. Verified by an external test house.

14.Direct Capacitor Coupling (DCC) method according to SAE J2962−1 specification, referring to ISO 7637−3 Slow Transient Pulse. Coupling

Capacitor 10 nF. Tested with no external protections. Verified by an external test house.

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FUNCTIONAL DESCRIPTION

Overall Functional Description

LIN is a serial communication protocol that efficiently

supports the control of mechatronic nodes in distributed

automotive applications. The domain is class−A multiplex

buses with a single master node and a set of slave nodes.

The NCV7321 contains the LIN transmitter, LIN receiver,

power−on−reset (POR) circuits and thermal shutdown

(TSD). The LIN transmitter is optimized for the maximum

specified transmission speed of 20 kB with EMC

performance due to reduced slew rate of the LIN output.

The junction temperature is monitored via a thermal

shutdown circuit that switches the LIN transmitter of f when

temperature exceeds the TSD trigger level.

The NCV7321 has four operating states (unpowered

mode, standby mode, normal mode and sleep mode) that are

determined b y the supply voltage VBB, input signals EN and

WAKE and activity on the LIN bus.

OPERATING STATES

Sleep Mode

Normal modeStandby mode

Unpowered

Figure 3. State Diagram

LIN Wake−Up or Local Wake−Up

EN = High for t > T_enable

EN = Low for t > T_disable

− LIN Transceiver: OFF

− LIN Term: 30 kW

− INH Pin = High

− RxD: Low After a Wake−up/

Floating Otherwise

− TxD: Wake−up Source Flag

− LIN Transceiver: OFF

− LIN Term: Floating

− INH Pin: Floating

− RxD: Floating

− TxD: Weak Pull−down

− LIN Transceiver: OFF

− LIN Term: Current Source

− INH Pin: Floating

− RxD: Floating

− TxD: Weak Pull−down

− LIN Transceiver: ON

− LIN Term: 30 kW

− INH Pin: High

− RxD: Received LIN Data

− TxD: Weak Pull−down

Transmitter Input

(VBB Below Reset Level)

VBB Above Reset Level

Unpowered Mode

As long as VBB remains below its power−on−reset level,

the chip is kept in a safe unpowered state. LIN transmitter is

inactive, both LIN and INH pins are left floating and only a

weak pull−down is connected on pin TxD. Pin RxD remains

floating.

The unpowered state will be entered from any other state

when VBB falls below its power−on−reset level.

Standby Mode

Standby mode is a low−power mode, where LIN

transceiver remains inactive while INH pin is driven high to

activate an external voltage regulator – see Figure 2.

Depending on the transition which led to the standby mode,

pins RxD and TxD are configured differently during this

mode. A 30 kW resistor in series with a reverse−protection

diode is internally connected between LIN and VBB Pins.

Standby mode is entered in one of the following ways:

•After the voltage level at VBB pin rises above its

power−on−reset level. In this case, RxD Pin remains

high−impedant and the pull−down applied on pin TxD

remains weak.

•After a wake−up event is recognized while the chip was

in the sleep mode. Pin RxD is pulled low while pin

TxD signals the type of wake−up leading to the standby

mode – its pull−up remains weak for LIN wake−up and

it is switched to strong pull−down for the case of local

wake−up (i.e. wake−up via Pin WAKE).

While in the standby mode, the configuration of Pins RxD

and TxD remains unchanged, regardless the activity on

WAKE and LIN Pins – i.e. if additional wake−ups occur

during the standby mode, they have no influence on the chip

configuration.

Normal Mode

In normal mode, the full functionality of the LIN

transceiver is available. Data according the state of TxD

input are sent to the LIN bus while pin RxD reflects the

logical symbol received on the LIN bus – high−impedant for

recessive and Low for dominant. A 30 kW resistor in series

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with a reverse−protection diode is internally connected

between LIN and VBB pins.

To avoid that, due to a failure of the application (e.g.

software error), the LIN bus is permanently driven dominant

and thus blocking all subsequent communication, signal on

pin TxD passes through a timer, which releases the bus in

case TxD remains low for longer than T_TxD_timeout. The

transmission can continue once the TxD returns to High

logical level.

In case the junction temperature increases above the

thermal shutdown threshold, e.g. due to a short of the LIN

wiring to the battery, the transmitter is disabled and releases

LIN bus to recessive. Once the junction temperature

decreases back below the thermal shutdown release level,

the transmission can be enabled again – however, to avoid

thermal oscillations, first a High logical level on TxD must

be encountered before the transmitter is enabled.

As required by SAE J2602, the transceiver must behave

safely below its operating range – it shall either continue to

transmit correctly (according its specification) or remain

silent (transmit a recessive state regardless of the TxD

signal). A battery monitoring circuit in NCV7321

de−activates the transmitter in the normal mode if the VBB

level drops below MONL_VBB. Transmission is enabled

again when VBB reaches MONH_VBB. The internal logic

remains in the normal mode and the reception from the LIN

line is still possible even if the battery monitor disables the

transmission. Although the specifications of the monitoring

and power−on−reset levels are overlapping, it’s ensured by

the implementation that the monitoring level never falls

below the power−on−reset level.

Normal mode can be entered from either standby or sleep

mode when EN Pin is High for longer than T_enable. When

the transition is made from standby mode, TxD pull−down

is set to weak and RxD is put high−impedant immediately

after EN becomes High (before the expiration of T_enable

filtering time). This excludes signal conflicts between the

standby mode pin settings and the signals required to control

the chip in the normal mode (e.g. strong pull−down on TxD

after local wake−up vs. High logical level on TxD required

to send a recessive symbol on LIN).

Sleep Mode

Sleep mode provides extremely low current consumption.

The LIN transceiver is inactive and the battery consumption

is minimized. Pin INH is put to high−impedant state to

disable the external regulator and, in case of a master node,

the LIN termination – see Figure 2. Only a weak pull−up

current source is internally connected between LIN and

VBB Pins, in order to minimize current consumption even in

case of LIN short to GND.

Sleep mode can be entered from normal mode by

assigning Low logical level to pin EN for longer than

T_disable. The sleep mode can be entered even if a

permanent short occurs either on LIN or WAKE Pin.

If a wake−up event occurs during the transition between

normal and sleep mode (during the T_disable filtering time),

it will be regarded as valid wake−up and the chip will enter

standby mode with the appropriate setting of Pins RxD and

TxD.

Wake−up

Two types of wake−up events are recognized by NCV7321:

•Local wake−up – when a high−to−low transition on pin

WAKE is encountered and WAKE pin remains Low at

least during T_WAKE – see Figure 4.

•Remote (or LIN) wake−up – when LIN bus is

externally driven dominant during longer than

T_LIN_wake and a rising edge on LIN occurs

afterwards – see Figure 5.

Wake−up events can be exclusively detected in sleep mode

or during the transition from normal mode to sleep mode.

Due to timing tolerances, valid wake−up events beginning

shortly before normal−to−sleep mode transition can be also

sometimes regarded as valid wake−ups.

WAKE

VBB

Local Wake−up recognized

Sleep Mode Standby Mode

V_WAKE_th

T_WAKE

Figure 4. Local Wake−up Detection

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LIN recessive level

LIN

T_LIN_wake

Detection of Remote Wake−Up

Sleep Mode Standby Mode

LIN dominant level

T_to_stb

Figure 5. Remote (LIN) Wake−up Detection

VBB

40% VBB

60% VBB

ELECTRICAL CHARACTERISTICS

Definitions

All voltages are referenced to GND (Pin 5). Positive currents flow into the IC.

Table 5. DC CHARACTERISTICS (VBB = 5 V to 27 V; TJ = −40°C to +150°C; Bus Load = 500 W (VBB to LIN); unless otherwise

specified. Typical values are given at VBB = 12 V and TJ = 25°C, unless otherwise specified.)

Symbol Parameter Conditions Min Typ Max Unit

VBB CURRENT CONSUMPTION

IBB_ON_rec VBB Consumption Normal Mode; LIN Recessive

VLIN = VBB = VINH = VWAKE 1.6 mA

IBB_ON_dom VBB Consumption Normal Mode; LIN Dominant

VBB = VINH = VWAKE 8 mA

IBB_STB VBB Consumption Standby Mode

VLIN = VBB = VINH = VWAKE 350 mA

IBB_SLP VBB Consumption Sleep Mode

VLIN = VBB = VINH = VWAKE 30 mA

IBB_SLP_18V VBB Consumption Sleep Mode, VBB < 18 V

VLIN = VBB = VINH = VWAKE

(Note 15)

20 mA

IBB_SLP_12V VBB Consumption Sleep Mode, VBB = 12 V, TJ < 85°C

VLIN = VBB = VINH = VWAKE

(Note 15)

10 mA

POR AND VBB MONITOR

PORH_VBB Power−on Reset High

Level on VBB VBB Rising 2 4.5 V

PORL_VBB Power−on Reset Low

Level on VBB VBB Falling 1.7 4 V

MONH_VBB Battery Monitoring

High Level VBB Rising 4.5 V

MONL_VBB Battery Monitoring Low

Level VBB Falling 3 V

LIN TRANSMITTER

VLIN_dom_LoSup LIN Dominant Output

Voltage TxD = Low; VBB = 7.3 V 1.2 V

15.Values based on design and characterization. Not tested in production.

16.The voltage drop in Normal mode between LIN and VBB pin is the sum of the diode drop and the drop at serial pull−up resistor . The drop

at the switch is negligible. See Figure 1.

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Table 5. DC CHARACTERISTICS (VBB = 5 V to 27 V; TJ = −40°C to +150°C; Bus Load = 500 W (VBB to LIN); unless otherwise

specified. Typical values are given at VBB = 12 V and TJ = 25°C, unless otherwise specified.)

Symbol UnitMaxTypMinConditionsParameter

LIN TRANSMITTER

VLIN_dom_HiSup LIN Dominant Output

Voltage TxD = Low; VBB = 18 V 2.0 V

VLIN_REC LIN Recessive Output

Voltage (Note 16) TxD = High; ILIN = 10 mAVBB − 1.5 VBB V

ILIN_lim Short Circuit Current

Limitation VLIN = VBB_max 40 200 mA

Rslave Internal Pull−up

Resistance 20 33 47 kW

CLIN Capacitance on Pin

LIN (Note 15) 20 30 pF

LIN RECEIVER

Vbus_dom Bus Voltage for

Dominant State 0.4 VBB

Vbus_rec Bus Voltage for

Recessive State 0.6 VBB

Vrec_dom Receiver Threshold LIN Bus Recessive − Dominant 0.4 0.6 VBB

Vrec_rec Receiver Threshold LIN Bus Dominant − Recessive 0.4 0.6 VBB

Vrec_cnt Receiver Centre

Voltage (Vrec_dom + Vrec_rec)/2 0.475 0.525 VBB

Vrec_hys Receiver Hysteresis (Vrec_rec − Vrec_dom) 0.05 0.175 VBB

ILIN_off_dom LIN Output Current,

Bus in Dominant State Normal Mode, Driver Off;

VBB = 12 V, VLIN = 0 V −1 mA

ILIN_off_dom_slp LIN Output Current,

Bus in Dominant State Sleep Mode, Driver Off;

VBB = 12 V, VLIN = 0 V −20 −15 −2 mA

ILIN_off_rec LIN Output Current,

Bus in Recessive State Driver Off;

VBB < 18 V; VBB < VLIN < 18 V 1mA

ILIN_no_GND Communication not

Affected VBB = GND = 12 V; 0 < VLIN < 18 V −1 1 mA

ILIN_no_VBB LIN Bus Remains

Operational VBB = GND = 0 V; 0 < VLIN < 18 V 5mA

PIN EN

Vil_EN Low Level Input

Voltage −0.3 0.8 V

Vih_EN High Level Input

Voltage 2.0 5.5 V

Rpd_EN Pull−down Resistance

to Ground 150 350 650 kW

PIN TxD

Vil_TxD Low Level Input

Voltage −0.3 0.8 V

Vih_TxD High Level Input

Voltage 2.0 5.5 V

Rpd_TxD Pull−down Resistor on

TxD Pin,

Corresponding to

“Weak Pull−down”

Normal Mode or Sleep Mode or

Standby Mode after Power up or

Standby Mode after LIN W ake−up

150 350 650 kW

15.Values based on design and characterization. Not tested in production.

16.The voltage drop in Normal mode between LIN and VBB pin is the sum of the diode drop and the drop at serial pull−up resistor . The drop

at the switch is negligible. See Figure 1.

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Table 5. DC CHARACTERISTICS (VBB = 5 V to 27 V; TJ = −40°C to +150°C; Bus Load = 500 W (VBB to LIN); unless otherwise

specified. Typical values are given at VBB = 12 V and TJ = 25°C, unless otherwise specified.)

Symbol UnitMaxTypMinConditionsParameter

PIN TxD

Ipd_TxD_Strong Pull−down Current on

TxD Pin Corresponding

to “Strong Pull−down”

Standby Mode after Local Wake−up 1.5 mA

PIN RxD

Iol_RxD Low Level Output

Current VRxD = 0.4 V, Normal Mode,

VLIN = 0 V 1.5 mA

Ioh_RxD High Level Output

Current VRxD = 5 V, Normal Mode,

VLIN = VBB −5 0 5 mA

PIN WAKE

V_wake_th WAKE Threshold

Voltage VBB − 3.3 VBB − 1.1 V

I_wake_pull−up Pull−up Current on Pin

WAKE VWAKE = 0 V −30 −15 −1 mA

I_wake_leak Leakage of Pin WAKE VWAKE = VBB −5 0 5 mA

PIN INH

Delta_VH High Level Voltage

Drop IINH = 15 mA, INH Active 0.05 0.35 0.75 V

I_leak Leakage Current Sleep Mode; VINH = 0 V −1 0 1 mA

THERMAL SHUTDOWN

TJSD Thermal Shutdown

Junction Temperature Temperature Rising 150 165 185 °C

TJSD_hyst Thermal Shutdown

Hysteresis 5°C

15.Values based on design and characterization. Not tested in production.

16.The voltage drop in Normal mode between LIN and VBB pin is the sum of the diode drop and the drop at serial pull−up resistor. The drop

at the switch is negligible. See Figure 1.

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Table 6. AC CHARACTERISTICS (VBB = 5 V to 27 V; TJ = −40°C to +150°C; unless otherwise specified. For the transmitter

parameters, the following bus loads are considered: L1 = 1 kW / 1 nF; L2 = 660 W / 6.8 nF; L3 = 500 W / 10 nF)

Symbol Parameter Conditions Min Typ Max Unit

LIN TRANSMITTER

D1 Duty Cycle 1 =

tBUS_REC(min) /

(2 x TBIT)

THREC(max) = 0.744 x VBB

THDOM(max) = 0.581 x VBB

TBIT = 50 ms

VBB = 7 V to 18 V

0.396 0.5

D2 Duty Cycle 2 =

tBUS_REC(max) /

(2 x TBIT)

THREC(min) = 0.422 x VBB

THDOM(min) = 0.284 x VBB

TBIT = 50 ms

VBB = 7.6 V to 18 V

0.5 0.581

D3 Duty Cycle 3 =

tBUS_REC(min) /

(2 x TBIT)

THREC(max) = 0.778 x VBB

THDOM(max) = 0.616 x VBB

TBIT = 96 ms

VBB = 7 V to 18 V

0.417 0.5

D4 Duty Cycle 4 =

tBUS_REC(max) /

(2 x TBIT)

THREC(min) = 0.389 x VBB

THDOM(min) = 0.251 x VBB

TBIT = 96 ms

VBB = 7.6 V to 18 V

0.5 0.590

Ttx_prop_down Propagation Delay of

TxD to LIN. TxD high

to low

(Note 17) 6ms

Ttx_prop_up Propagation Delay of

TxD to LIN. TxD low to

high

(Note 17) 6ms

T_fall LIN Falling Edge Normal Mode; VBB = 12 V 22.5 ms

T_rise LIN Rising Edge Normal Mode; VBB = 12 V 22.5 ms

T_sym LIN Slope Symmetry Normal Mode; VBB = 12 V −4 0 4 ms

LIN RECEIVER

Trec_prop_down Propagation Delay of

Receiver Falling Edge 0.1 6 ms

Trec_prop_up Propagation Delay of

Receiver Rising Edge 0.1 6 ms

Trec_sym Propagation Delay

Symmetry T rec_prop_down − Trec_prop_up −2 2ms

MODE TRANSITIONS AND TIMEOUTS

T_LIN_wake Duration of LIN

Dominant for Detection

of Wake−up via LIN bus

Sleep Mode 30 90 150 ms

T_to_stb Delay from LIN Bus

Dominant to Recessive

Edge to Entering of

Standby Mode after

Valid LIN Wake−up

Sleep Mode 10 ms

T_WAKE Duration of Low Level

on WAKE Pin for Local

W ake−up Detection

Sleep Mode 7 50 ms

T_enable Duration of High Level

on EN Pin for T ran−

sition to Normal Mode

Version NCV7321D10 2 5 10 ms

Version NCV7321D11/D12/MW2 2 7.5 18.5 ms

T_disable Duration of Low Level

on EN Pin for T ran−

sition to Sleep Mode

Version NCV7321D10 2 5 10 ms

Version NCV7321D11/D12/MW2 2 7.5 18.5 ms

T_TxD_timeout TxD Dominant

Time−Out Normal Mode, TxD = Low, Guaran−

tees Baudrate as Low as 1 kbps 15 50 ms

17.Values based on design and characterization. Not tested in production.

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tBUS_DOM(min)

LIN

THREC(max)

THREC(min)

THDOM(max)

THDOM(min)

tBUS_DOM(max)

tBUS_REC(max)

tBUS_REC(min)

tBIT tBIT

50%

Thresholds of

receiving node 1

Thresholds of

receiving node 2

TxD

Figure 6. LIN Transmitter Duty Cycle

Figure 7. LIN Transmitter Timing

50%

tBIT

TxD

LIN

ttx_prop_down

tBIT

ttx_prop_up

VBB

60% VBB

40% VBB

T_fall T_rise

LIN

60%

40%

60%

40%

100%

Figure 8. LIN Transmitter Rising and Falling Times

NCV7321

www.onsemi.com

50%

trec_prop_up

RxD

LIN

trec_prop_down

Figure 9. LIN Receiver Timing

60% VBB

40% VBB

VBB

DEVICE ORDERING INFORMATION

Part Number Description Temperature Range Package Shipping†

NCV7321D10G Stand−alone LIN

Transceiver −40°C to +125°CSOIC−8

(Pb−Free)

96 Tube / Tray

NCV7321D10R2G 3000 / Tape & Reel

NCV7321D11G Improved Stand−alone LIN

Transceiver 96 Tube / Tray

NCV7321D11R2G 3000 / Tape & Reel

NCV7321D12R2G

ESD Improved Stand−alone

LIN Transceiver −40°C to +125°C

SOIC−8

(Pb−Free) 3000 / Tape & Reel

NCV7321MW2R2G DFN8

Wettable Flank

(Pb−Free)

3000 / Tape & Reel

†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging

Specifications Brochure, BRD8011/D.

DFN8, 3x3, 0.65P

CASE 506DG

ISSUE A

DATE 28 APR 2016

SCALE 2:1

NOTES:

1. DIMENSIONING AND TOLERANCING PER

ASME Y14.5M, 1994.

2. CONTROLLING DIMENSION: MILLIMETERS.

3. DIMENSION b APPLIES TO PLATED TERMINAL

AND IS MEASURED BETWEEN 0.15 AND

0.30mm FROM THE TERMINAL TIP.

4. COPLANARITY APPLIES TO THE EXPOSED

PAD AS WELL AS THE TERMINALS.

ÉÉÉ

BOTTOM VIEW

0.10 B

0.05

CNOTE 3

0.10 C

PIN ONE

REFERENCE

TOP VIEW

2X 0.10 C

0.05 C

CSEATING

PLANE

SIDE VIEW

DIM MIN MAX

MILLIMETERS

A0.80 1.00

A1 0.00 0.05

A3 0.20 REF

b0.25 0.35

D3.00 BSC

D2 2.30 2.50

E3.00 BSC

E2 1.50 1.70

e0.65 BSC

L0.35 0.45

ÇÇ

0.60

2.56

1.70

0.40

0.65

PITCH

3.30

*For additional information on our Pb−Free strategy and soldering

details, please download the ON Semiconductor Soldering and

Mounting Techniques Reference Manual, SOLDERRM/D.

RECOMMENDED

DIMENSIONS: MILLIMETERS

DETAIL A

ALTERNATE TERMINAL

CONSTRUCTION

DETAIL A

NOTE 4

e/2

GENERIC

MARKING DIAGRAM*

XXXXXX= Specific Device Code

A = Assembly Location

L = Wafer Lot

Y = Year

W = Work Week

G= Pb−Free Package

*This information is generic. Please refer

to device data sheet for actual part

marking.

Pb−Free indicator, “G” or microdot “ G”,

may or may not be present.

XXXXXX

ALYWG

(Note: Microdot may be in either location)

SOLDERING FOOTPRINT*

0.30 TYP

MECHANICAL CASE OUTLINE

PACKAGE DIMENSIONS

ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries.

ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding

the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically

disclaims any and all liability, including without limitation special, consequential or incidental damages. ON Semiconductor does not convey any license under its patent rights nor the

rights of others.

98AON10527G

DOCUMENT NUMBER:

DESCRIPTION:

Electronic versions are uncontrolled except when accessed directly from the Document Repository.

Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.

PAGE 1 OF 1

DFN8 3X3, 0.65P

SOIC−8

CASE 751AZ

ISSUE B

DATE 18 MAY 2015

7.00

0.76

1.52

1.27

DIMENSIONS: MILLIMETERS

PITCH

*For additional information on our Pb−Free strategy and soldering

details, please download the ON Semiconductor Soldering and

Mounting Techniques Reference Manual, SOLDERRM/D.

SOLDERING FOOTPRINT*

RECOMMENDED

SCALE 1:1

NOTES:

1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994.

2. CONTROLLING DIMENSION: MILLIMETERS.

3. DIMENSION b DOES NOT INCLUDE DAMBAR PROTRUSION.

ALLOWABLE PROTRUSION SHALL BE 0.004 mm IN EXCESS OF

MAXIMUM MATERIAL CONDITION.

4. DIMENSION D DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS

OR GATE BURRS. MOLD FLASH, PROTRUSIONS OR GATE BURRS

SHALL NOT EXCEED 0.006 mm PER SIDE. DIMENSION E1 DOES

NOT INCLUDE INTERLEAD FLASH OR PROTRUSION. INTERLEAD

FLASH OR PROTRUSION SHALL NOT EXCEED 0.010 mm PER SIDE.

5. THE PACKAGE TOP MAY BE SMALLER THAN THE PACKAGE BOT

TOM. DIMENSIONS D AND E1 ARE DETERMINED AT THE OUTER

MOST EXTREMES OF THE PLASTIC BODY AT DATUM H.

6. DIMENSIONS A AND B ARE TO BE DETERMINED AT DATUM H.

7. DIMENSIONS b AND c APPLY TO THE FLAT SECTION OF THE LEAD

BETWEEN 0.10 TO 0.25 FROM THE LEAD TIP.

8. A1 IS DEFINED AS THE VERTICAL DISTANCE FROM THE SEATING

PLANE TO THE LOWEST POINT ON THE PACKAGE BODY.

SEATING

PLANE

DETAIL A

0.10 C

DIM MIN MAX

MILLIMETERS

h0.25 0.41

A--- 1.75

b0.31 0.51

L0.40 1.27

e1.27 BSC

c0.10 0.25

A1 0.10 0.25

0.25 A-B

b8X

TOP VIEW

SIDE VIEW

0.25 BSC

E1 3.90 BSC

E6.00 BSC

0.20 C

0.10 C

NOTE 6

NOTES 4&5

SIDE VIEW

END VIEW

E E1

0.10 C D

NOTES 3&7

NOTE 6

NOTE 8

A2 1.25 ---

D4.90 BSC

SEATING

PLANE

DETAIL A

45 CHAMFER5

NOTE 7

XXXXX = Specific Device Code

A = Assembly Location

L = Wafer Lot

Y = Year

W = Work Week

G= Pb−Free Package

GENERIC

MARKING DIAGRAM*

*This information is generic. Please refer

to device data sheet for actual part

marking. Pb−Free indicator, “G”, may

or not be present.

XXXXX

ALYWX

MECHANICAL CASE OUTLINE

PACKAGE DIMENSIONS

ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries.

ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding

the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically

disclaims any and all liability, including without limitation special, consequential or incidental damages. ON Semiconductor does not convey any license under its patent rights nor the

rights of others.

98AON34918E

DOCUMENT NUMBER:

DESCRIPTION:

Electronic versions are uncontrolled except when accessed directly from the Document Repository.

Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.

PAGE 1 OF 1

SOIC−8

www.onsemi.com

ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries.

ON Semiconductor owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of ON Semiconductor’s product/patent

coverage may be accessed at www.onsemi.com/site/pdf/Patent−Marking.pdf. ON Semiconductor reserves the right to make changes without further notice to any products herein.

ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability

arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.

Buyer is responsible for its products and applications using ON Semiconductor products, including compliance with all laws, regulations and safety requirements or standards,

regardless of any support or applications information provided by ON Semiconductor. “Typical” parameters which may be provided in ON Semiconductor data sheets and/or

specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer

application by customer’s technical experts. ON Semiconductor does not convey any license under its patent rights nor the rights of others. ON Semiconductor products are not

designed, intended, or authorized for use as a critical component in life support systems or any FDA Class 3 medical devices or medical devices with a same or similar classification

in a foreign jurisdiction or any devices intended for implantation in the human body. Should Buyer purchase or use ON Semiconductor products for any such unintended or unauthorized

application, Buyer shall indemnify and hold ON Semiconductor and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and

expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such

claim alleges that ON Semiconductor was negligent regarding the design or manufacture of the part. ON Semiconductor is an Equal Opportunity/Affirmative Action Employer. This

literature is subject to all applicable copyright laws and is not for resale in any manner.

PUBLICATION ORDERING INFORMATION

TECHNICAL SUPPORT

North American Technical Support:

Voice Mail: 1 800−282−9855 Toll Free USA/Canada

Phone: 011 421 33 790 2910

LITERATURE FULFILLMENT:

Email Requests to: orderlit@onsemi.com

ON Semiconductor Website: www.onsemi.com

Europe, Middle East and Africa Technical Support:

Phone: 00421 33 790 2910

For additional information, please contact your local Sales Representative

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