Synchronous Boost DC/DC Converter (Vout = 5V, Io = 2A, 1ch) BD1865GWL General Description Features Synchronous Boost DC/DC Converter Vout = 5V / Iomax = 2A Automatically PFM/PWM Transition. Efficiency: 90% @2A-5V (VIN=3.7V) Load Disconnect During Shutdown. Circuit Current: 66uA (Io=0mA, Typ). Adjustable Output Voltage: 4.9V - 5.2V Power Supply Voltage Range (Vo=5V, Ta=65C): Iomax = 2.0A: 3.2V - 4.5V. Iomax = 1.8A: 3.0V - 3.2V. Iomax = 1.5A: 2.7V - 3.0V. Iomax = 1.33A: 2.5V - 2.7V. UVLO Detection: 2.1V (Max.). Switching Frequency: 2.5MHz. Thermal Shutdown. 16-pin WLCSP. Short Circuit Protection Over Output Voltage Protection The BD1865GWL devices provide a power supply solution for products powered by single-cell Li-ion battery. Output currents can go as high as 2A while discharge it down to 3.2V. With the "MODE" pin, BD1865GWL provides mode selection of "PFM/PWM MODE" or "Mixing-PWM MODE". In "PFM/PWM MODE", the product switches automatically between PWM and PFM operation so that high efficiency is achievable over a wide range of load conditions. "Mixing-PWM MODE" can be prevented Audible Sound by switching noise at light loads. Typical Application Efficiency T=25, PFM/PWM mode Efficiency [%] 100 90 80 70 60 50 40 30 20 10 0 Applications Single-Cell Li-ion Battery-Powered Portable Products Tablet Terminal Device, Smartphone Package 16-pin WL-CSP package: UCSP50L1C W (Typ) x D (Typ) x H (Max): 1.6mm x 1.6mm x 0.57mm VIN=2.5V VIN=3.6V VIN=4.5V 1 10 100 Iout [mA] 1000 10000 Typical Application Circuit VIN L 0.47uH RFIL 110 CFIL 1uF OFF ON VIN LX EN LX FB MODE GND GND Figure. 1 Product structure : Silicon monolithic integrated circuit .www.rohm.com (c) 2015 ROHM Co., Ltd. All rights reserved. TSZ22111 * 14 * 001 BD1865GWL CIN 22uF LX LX GND VOUT PGND VOUT PGND DISCHG VOUT COUT 22uFx3 R1 330k CFB 2pF R2 62k Application Circuit (PFM/PWM mode) This product has no designed protection against radioactive rays 1/17 TSZ02201-0Q1Q0A900270-1-2 27. Jul. 2015 Rev. 002 BD1865GWL Pin Configuration TOP View 1 2 3 4 A MODE GND PGND PGND B EN TEST LX LX C VIN TESTC LX LX D FB DIS CHG VOUT VOUT Figure. 2 Pin Configuration Pin Description Pin No. Pin Name I/O Function Operation Mode Select Pin. MODE=Low : PFM/PWM MODE (Note 1) MODE=High: Mixing-PWM MODE Analog Ground. This terminal is used as the ground reference of the internal circuit. Power Ground. Enable Pin. EN=Low : Disable EN=High : Enable Inductor Connection Terminal. A1 MODE I A2, B2, C2 GND - A3, A4 PGND - B1 EN I B3, B4, C3, C4 LX I/O C1 VIN I Power Supply Input. D1 FB I D2 DISCHG I D3, D4 VOUT O Output Feedback Pin. Discharge Pin. For PFM/PWM mode, this terminal can be used as VOUT discharge. For (Note 1) Mixing-PWM mode, this terminal should be shorted to MODE. Boost Converter Output. (Note 1) Refer to "Application Information (P.10)" about MODE pin setting for Mixing-PWM mode. In addition, only during EN=L, the changing the operation mode is possible. Block Diagram VOUT OSC VIN VOUT UVLO Discharge DISCHG VIN Control Logic EN Gate Driver LX LX LX VIN LX MODE PGND TSD PGND Err.Amp. GND Figure. 3 www.rohm.com (c) 2015 ROHM Co., Ltd. All rights reserved. TSZ22111 * 15 * 001 FB Soft Start Functional Block Diagram 2/17 TSZ02201-0Q1Q0A900270-1-2 27. Jul. 2015 Rev.002 BD1865GWL Absolute Maximum Ratings (Ta = 25C) Parameter Symbol Rating Unit (Note 2) Pd 2.04 W Power Dissipation Operating Temperature Range Topr -40 to +85 C Storage Temperature Range Tstg -55 to +125 C VENMAX -0.3 to 7.0 V Maximum Applied Voltage: FB VFBMAX -0.3 to 7.0 V Maximum Applied Voltage: VOUT VOUTMAX -0.3 to 7.0 V Maximum Applied Voltage: DISCHG VDISMAX -0.3 to 7.0 V Maximum Applied Voltage: VIN VINMAX V Maximum Applied Voltage: LX VLXMAX V Maximum Applied Voltage: EN Maximum Applied Voltage: MODE VMODEMAX -0.3 to 7.0 -1.0 to 7.0 (DC) -3.2 to 8.0 (Pulse 10ns) -0.3 to 7.0 Maximum Applied Voltage: GND, PGND VGNDMAX GND V V (Note 2) This data is measured with ROHM evaluation board. (101.5 mm x 114.5 mm, 4-layer) Caution: Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit between pins or an open circuit between pins and the internal circuitry. Therefore, it is important to consider circuit protection measures, such as adding a fuse, in case the IC is operated over the absolute maximum ratings. Recommended Operating Condition (Ta= -40C to +85C) Parameter Supply Voltage Symbol VIN Min Typ Max Unit 2.5 3.6 4.5 V Conditions Electrical Characteristics (Unless otherwise specified VIN=3.6V, Ta=25C, VOUT=5V) Parameter Symbol Min Typ Max Unit Conditions Shutdown Current (EN=0V) Ist - 0.1 1.0 A Quiescent Current 1 no switching (PFM /PWM MODE) ICC1 - 67 130 A Quiescent Current 2 no switching (Mixing PWM MODE) ICC2 - 300 600 A Switching Frequency Fsw 2.25 2.5 2.75 MHz Feedback Voltage VFB 0.79 0.80 0.81 V EN Input High VIH_EN 1.16 - 5.5 V EN Input Low VIL_EN -0.3 - 0.3 V EN Pull-down Resistance RPD_EN 0.5 1 1.5 M UVLO Detect Threshold VUVLO 2.00 2.05 2.10 V VIN falling. UVLO Release Threshold VUVLORLS 2.15 2.20 2.25 V VIN rising. Ramp up Time (Soft-Start) tSS 0.4 0.72 1.4 ms NMOS ON Resistance RONN - 39 - m PMOS ON Resistance RONP - 48 - m Switch Current Limit IOCP 5.1 - - A Over Voltage Protection VOVP - - 6.5 V Discharge Resistance RDISCHG 2.5 5 10 COUT 21 - - F Output Capacitor (Note 3) EN=0V,MODE=0V EN=VIN,MODE=0V, FB=1V, Io=0mA (not include SW) EN=VIN,MODE=VIN, FB=1V, Io=0mA (not include SW, Internal OSC ON) PWM operation PWM operation 10 - 95% Rise time. Rload=50ohm (Note 3) This value is the effective capacitance. It is required that the output capacitor value included the temperature and DC bias characteristics is higher than COUT(Min). www.rohm.com (c) 2015 ROHM Co., Ltd. All rights reserved. TSZ22111 * 15 * 001 3/17 TSZ02201-0Q1Q0A900270-1-2 27. Jul. 2015 Rev.002 BD1865GWL Typical Performance Curve (Unless otherwise specified VIN=3.6V, VOUT=5.058V, Ta=25) [BD1865GWL] Efficiency (Mixing-PWM mode) [BD1865GWL] Efficiency (PFM/PWM mode) Temp=25 , Vout=5.058V setting 100 100 90 90 80 80 70 70 Efficiency [%] Efficiency [%] Temp=25 , Vout=5.058V setting 60 50 40 VIN=2.5V 30 VIN=3.0V 20 10 60 50 40 VIN=2.5V 30 VIN=3.0V VIN=3.6V 20 VIN=3.6V VIN=4.5V 10 VIN=4.5V 0 0 1 10 Figure. 4 100 Iout [mA] 1000 1 10000 Efficiency (PFM/PWM mode) 10 Figure. 5 [BD1865GWL] Load Regulation 1000 10000 Efficiency (Mixing-PWM mode) [BD1865GWL] Load Regulation PFM/PWM mode, T=25 Mixing-PWM mode, T=25 5.20 5.20 5.15 5.15 Output Voltage [V] Output Voltage [V] 100 Iout [mA] 5.10 5.05 VIN=3.6V 5.00 VIN=4.5V VIN=2.5V 4.95 5.10 5.05 VIN=3.6V 5.00 VIN=4.5V VIN=2.5V 4.95 VIN=3.0V VIN=3.0V 4.90 4.90 0 500 Figure. 6 1000 1500 Iout [mA] 2000 2500 0 Load Regulation (PFM/PWM mode) 500 Figure. 7 [BD1865GWL] Line Regulation 1000 1500 Iout [mA] 2000 Load Regulation (Mixing-PWM mode) [BD1865GWL] Line Regulation Mixing-PWM mode, T=25 PFM/PWM mode, T=25 5.20 5.20 Io=100mA 5.15 Output Voltage [V] Output Voltage [V] 2500 Io=2A 5.10 5.05 5.00 Io=100mA 5.15 5.10 5.05 5.00 4.95 4.95 4.90 4.90 2.0 2.5 Figure. 8 3.0 3.5 Input Voltage [V] 4.0 4.5 2.0 5.0 Line Regulation (PFM/PWM mode) www.rohm.com (c) 2015 ROHM Co., Ltd. All rights reserved. TSZ22111 * 15 * 001 Figure. 4/17 2.5 9 3.0 3.5 Input Voltage [V] 4.0 4.5 5.0 Line Regulation (Mixing-PWM mode) TSZ02201-0Q1Q0A900270-1-2 27. Jul. 2015 Rev.002 BD1865GWL Typical Performance Curve (Cont'd) (Unless otherwise specified VIN=3.6V, VOUT=5.058V, Ta=25) NMOS On Resistance PMOS On Resistance T=25, Vout=5.058V 60 60 50 50 Ron [mohm] Ron [mohm] T=25, Vout=5.058V 40 30 40 30 20 20 10 10 0 0 2.0 2.5 Figure. 10 3.0 3.5 VIN [V] 4.0 4.5 2.0 5.0 2.5 PMOS ON Resistance Figure. 11 VOUT (200mV/dev.) VOUT (200mV/dev.) IOUT (500mA/dev.) IOUT (500mA/dev.) Figure. 12 Transient Response (PFM/PWM mode) Io=100mA to 2A (tRISE=250ns) Figure. VOUT (200mV/dev.) 14 3.5 VIN [V] 4.0 4.5 5.0 NMOS ON Resistance Transient Response (PFM/PWM mode) Io=2A to 100mA (tFALL=250ns) VOUT (200mV/dev.) IOUT (500mA/dev.) Figure. 13 3.0 IOUT (500mA/dev.) Transient Response (Mixing-PWM mode) Io = 100mA to 2A (tRISE=250ns) www.rohm.com (c) 2015 ROHM Co., Ltd. All rights reserved. TSZ22111 * 15 * 001 Figure. 5/17 15 Transient Response (Mixing-PWM mode) Io =2A to 100mA (tFALL=250ns) TSZ02201-0Q1Q0A900270-1-2 27. Jul. 2015 Rev.002 BD1865GWL Typical Performance Curve (Cont'd) (Unless otherwise specified VIN=3.6V, VOUT=5.058V, Ta=25) VOUT (50mV/dev.) VOUT (50mV/dev.) ICOIL (1A/dev.) ICOIL (1A/dev.) LX (3V/dev.) Figure. LX (3V/dev.) 16 Operation Waveform (PWM) Figure. 17 Operation Waveform (PFM) Io = 1mA Io = 2A Reversed Current from VOUT to VIN (EN = L) VOUT (50mV/dev.) VOUT VIN Reversed Current [mA] VIN=3.6V, T=25 ICOIL (1A/dev.) LX (3V/dev.) 160 140 *When the VOUT voltage is higher than the VIN voltage, ther reversed current flows from VOUT terminal to VIN terminal via BG control Tr. 120 100 80 60 40 20 0 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0 VOUT [V] Figure. EN 18 Operation Waveform (Mixing-PWM) Io = 1mA Figure. (3V/dev.) EN VOUT (1V/dev.) Reversed Current from VOUT to VIN (EN = L) (3V/dev.) VOUT (1V/dev.) IIN (1A/dev.) IIN (1A/dev.) Figure. 19 20 Start-up Waveform (Soft-Start) Io = 0A www.rohm.com (c) 2015 ROHM Co., Ltd. All rights reserved. TSZ22111 * 15 * 001 Figure. 6/17 21 Shutdown Waveform Io = 0A TSZ02201-0Q1Q0A900270-1-2 27. Jul. 2015 Rev.002 BD1865GWL Detailed Description 1.) Start-up (SOFT START) After being enabled, BD1865GWL starts the Soft Start operation. First, high side switch MOS is turned on and the output voltage VOUT is lifted to the input voltage VIN level, applying restriction to current. (Current Restriction Operation) For this operation, up to around 1A external load is allowed. Then, the device starts switching operation and VOUT is risen up to setting voltage adjusting the output slew rate by DAC for Soft Start. (Soft Start Operation) This soft start operation is reset by EN, UVLO, TSD and SCP. Attention is necessary to change input rush current and start-up time by the output capacitor. EN "DISCHG" pin = GND, MODE Output Voltage is decayed by load and feedback resistor. VIN "DISCHG" pin = VOUT Discharge Tr. is active. VOUT BD1865GWL is turned off. Hi-side and Low-side MOS are OFF. Current Restriction Control Slew Rate Control Figure. 23 Start-up (Soft Start) and Shutdown Operation 2.) Discharge for Output Terminal (For PFM/PWM mode) In PFM/PWM mode, the discharge function is selectable as described below. DISCHG terminal is shorted to VOUT; the discharge Tr. in the device is active. VOUT terminal is always discharged when DC/DC converter is in standby state. DISCHG terminal is shorted to GND; the discharge Tr. in the device is inactive. VOUT terminal voltage is decayed by load and feedback resistor when DC/DC converter is turned off. In Mixing-PWM mode, DISCHG terminal is shorted to MODE terminal. 3.) Under Voltage Lock Out (UVLO) UVLO prevents malfunction of the internal circuit at the time of rising or dropping to a lower value of power supply voltage. If the VIN voltage becomes lower than 2.05V(Typ), the DC/DC converter is turned off. In order to cancel UVLO of VIN, it is necessary to set VIN more than 2.2V(Typ). 4.) Output Overvoltage Protection (OVP) BD1865GWL turns off the switching operation when the VOUT voltage becomes over VOVP. At that time, the VOUT terminal is not discharge (in the case that DISCHG terminal is shorted to VOUT). If the VOUT voltage becomes less than VOVP, movement returns it. 5.) Over Current Protection (OCP) BD1865GWL has the function to limit the switching current. OCP detector is active during low side MOS is in ON state. When the heavy load is connected such that the peak of switching current Ipeak is above OCP threshold, OCP function becomes active. ON-time of low side MOS is limited so that Ipeak does not exceed OCP threshold, and VOUT voltage decreases. 6.) Short Circuit Protect (SCP) BD1865GWL has Automatic reboot type Short Current Protect function. SCP is detected when the VOUT voltage becomes lower than VIN x 0.924(Typ). At that moment, the switching operation is turned off and VOUT terminal is discharged (in the case that DISCHG terminal is shorted to VOUT). Then, the device starts the Soft Start operation for reboot without distinction of the value of the load resistance. If the VOUT terminal is shorted to GND or the heavy load exceeding the specification value, the device keeps Current restriction state. www.rohm.com (c) 2015 ROHM Co., Ltd. All rights reserved. TSZ22111 * 15 * 001 7/17 TSZ02201-0Q1Q0A900270-1-2 27. Jul. 2015 Rev.002 BD1865GWL Detailed Description (Cont'd) VOUT terminal is shorted to ground SCP detect BD1865GWL turns off switching operation. VOUT (5V) VOUT (5V) Automatic Reboot (Soft Start) VIN x 0.75 VIN x 0.924 VIN Slew rate control VOUT decrease by OCP. 0V Time interval (usec order) Once DC/DC converter operation is turned off and VOUT terminal is discharged. Figure. 24 Current restriction control Output Voltage in SCP Operation 7.) Thermal Shutdown (TSD) BD1865GWL turns off the switching operation when the device temperature exceeds the threshold value for the device protection. After the device temperature falls below the threshold value, the device starts the Soft Start operation. 8.) Mixing PWM mode Mixing-PWM mode is possible to be High Efficiency and Audible Sound Human defection at light load using Mixing PWM controller. Mixing PWM controller is mixing frequency of 25kHz and 2.5MHz. Therefore, this can prevent the sound rumbles such as capacitor because a noise does not occur in audible range. www.rohm.com (c) 2015 ROHM Co., Ltd. All rights reserved. TSZ22111 * 15 * 001 8/17 TSZ02201-0Q1Q0A900270-1-2 27. Jul. 2015 Rev.002 BD1865GWL Reference Application Circuit VIN L 0.47uH CIN 22uF RFIL 110 EN MODE FB Figure. 25 LX BD1865GWL VIN CFIL 1uF VOUT COUT 22uFx3 DISCHG GND R1 330k CFB 2pF VOUT R2 62k PGND (PFM/PWM mode) Typical Application Circuit VIN L 0.47uH CIN 22uF RFIL 110 EN MODE CMODE 390pF FB LX BD1865GWL VIN CFIL 1uF VOUT COUT 22uFx3 DISCHG GND R1 330k VOUT CFB 2pF R2 62k PGND R3 560k R4 510k Figure. 26 (Mixing-PWM mode) Typical Application Circuit Reference BOM List VOUT = 5.058V setting. Name Area (mm) Height(Max) (mm) Rated Voltage Type Value Parts Number Manufacturer CIN Capacitor 22uF 2012 0.95 10V GRM219R61A226MEA0D COUT Capacitor 22uF x 3 2012 1.45 10V LMK212BBJ226MG-T TAIYO YUDEN CFB L Capacitor Inductor 2pF 0.47uH 0603 3225 0.33 1.2 50V - UMK063CK020CT PIFE32251B-R47MS-88 TAIYO YUDEN CYNTEC R1 Resistor 330k 1005 0.40 - MCR01MZPD3303 ROHM R2 Resistor 62k 1005 0.40 - MCR01MZPD6202 ROHM RFIL Resistor 110 1608 0.55 - MCR03MZPJ110 ROHM CFIL Capacitor 1uF 1005 0.55 16V EMK105BJ105KV TAIYO YUDEN MURATA R3 * Resistor 560k 1005 0.40 - MCR01MZPD5603 ROHM R4 * Resistor 510k 1005 0.40 - MCR01MZPD5103 ROHM Capacitor 390pF 1005 0.55 50V UMK105CH391JV-F TAIYO YUDEN CMODE * *Only for Mixing-PWM mode. www.rohm.com (c) 2015 ROHM Co., Ltd. All rights reserved. TSZ22111 * 15 * 001 9/17 TSZ02201-0Q1Q0A900270-1-2 27. Jul. 2015 Rev.002 BD1865GWL Application Information 1.) Output Voltage Setting BD1865GWL controls FB terminal become to 0.8V (Typ). The output voltage is adjustable from 4.9V ~ 5.2V by changing R1 and R2. The output voltage VOUT is calculated by Equation 1. The sum of R1 and R2 should be set up more than 100k. (1) 2.) MODE pin setting for Mixing-PWM mode For Mixing-PWM mode, it is required to supply the voltage that divided VOUT to MODE terminal as shown in Fig.24. R3, R4 and CMODE should be selected as satisfying Equation 2 and Equation 3. BD1865GWL VOUT DISCHG R3 MODE R4 CMODE Figure. 28 Voltage Dividing Circuit for MODE Terminal (Mixing-PWM mode) (2) (3) Reference Board Layout (PFM/PWM mode) TOP View GND RFIL CIN VIN CFIL R2 R1 CFB L www.rohm.com (c) 2015 ROHM Co., Ltd. All rights reserved. TSZ22111 * 15 * 001 29 COUT COUT COUT VOUT GND Figure. VIN Reference Board Layout (TOP Layer) 10/17 TSZ02201-0Q1Q0A900270-1-2 27. Jul. 2015 Rev.002 BD1865GWL Pin Equivalence Circuit Pin. No Pin Name Pin. No Pin equivalence circuit Pin Name Pin equivalence circuit VIN VIN 5M 10k 10k B1 EN D1 EN FB FB 1M GND GND GND GND 500 DISCHG VIN 10k A1 MODE D2 MODE DIS CHG PGND GND GND GND VOUT VIN C1 A3 A4 A2 VIN PGND GND PGND GND D3 D4 B2 B3 C2 C3 BG Control VOUT LX LX PGND www.rohm.com (c) 2015 ROHM Co., Ltd. All rights reserved. TSZ22111 * 15 * 001 11/17 TSZ02201-0Q1Q0A900270-1-2 27. Jul. 2015 Rev.002 BD1865GWL Thermal Derating Curve In the heat design, please operate it in the following condition. (Please consider the margin etc. because the following temperature is a guarantee temperature.) 1. Surrounding temperature Ta must be 85 or less. 2. Loss of IC must be permissible loss Pd or less. The allowable dissipation (Pd) characteristics are described below. *This data is measured with ROHM Evaluation board. (FR-4 / 4-layer / Size: 101.5mm x 114.5mm x 1.6mm / Copper Thickness: 2oz Outer, 1oz Inner ) 2500 2000 Pd [mW] 1500 1000 500 0 0 25 50 75 100 125 150 Ta [C] Figure. 30 www.rohm.com (c) 2015 ROHM Co., Ltd. All rights reserved. TSZ22111 * 15 * 001 Thermal Derating Curve 12/17 TSZ02201-0Q1Q0A900270-1-2 27. Jul. 2015 Rev.002 BD1865GWL Operational Notes 1.) Reverse Connection of Power Supply Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when connecting the power supply, such as mounting an external diode between the power supply and the IC's power supply pins. 2.) Power Supply Lines Design the PCB layout pattern to provide low impedance supply lines. Furthermore, connect a capacitor to ground at all power supply pins. Consider the effect of temperature and aging on the capacitance value when using electrolytic capacitors. 3.) Ground Voltage Ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition. However, pins that drive inductive loads (e.g. motor driver outputs, DC-DC converter outputs) may inevitably go below ground due to back EMF or electromotive force. In such cases, the user should make sure that such voltages going below ground will not cause the IC and the system to malfunction by examining carefully all relevant factors and conditions such as motor characteristics, supply voltage, operating frequency and PCB wiring to name a few. 4.) Ground Wiring Pattern When using both small-signal and large-current ground traces, the two ground traces should be routed separately but connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal ground caused by large currents. Also ensure that the ground traces of external components do not cause variations on the ground voltage. The ground lines must be as short and thick as possible to reduce line impedance. 5.) Thermal Consideration Should by any chance the power dissipation rating be exceeded the rise in temperature of the chip may result in deterioration of the properties of the chip. In case of exceeding this absolute maximum rating, increase the board size and copper area to prevent exceeding the Pd rating. 6.) Recommended Operating Conditions These conditions represent a range within which the expected characteristics of the IC can be approximately obtained. The electrical characteristics are guaranteed under the conditions of each parameter. 7.) Inrush Current When power is first supplied to the IC, it is possible that the internal logic may be unstable and inrush current may flow instantaneously due to the internal powering sequence and delays, especially if the IC has more than one power supply. Therefore, give special consideration to power coupling capacitance, power wiring, width of ground wiring, and routing of connections. 8.) Operation Under Strong Electromagnetic Field Operating the IC in the presence of a strong electromagnetic field may cause the IC to malfunction. 9.) Testing on Application Boards When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may subject the IC to stress. Always discharge capacitors completely after each process or step. The IC's power supply should always be turned off completely before connecting or removing it from the test setup during the inspection process. To prevent damage from static discharge, ground the IC during assembly and use similar precautions during transport and storage. 10.) Inter-pin Short and Mounting Errors Ensure that the direction and position are correct when mounting the IC on the PCB. Incorrect mounting may result in damaging the IC. Avoid nearby pins being shorted to each other especially to ground, power supply and output pin. Inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment) and unintentional solder bridge deposited in between pins during assembly to name a few. 11.) Unused Input Pins Input pins of an IC are often connected to the gate of a MOS transistor. The gate has extremely high impedance and extremely low capacitance. If left unconnected, the electric field from the outside can easily charge it. The small charge acquired in this way is enough to produce a significant effect on the conduction through the transistor and cause unexpected operation of the IC. So unless otherwise specified, unused input pins should be connected to the power supply or ground line. 12.) Regarding the Input Pin of the IC This monolithic IC contains P+ isolation and P substrate layers between adjacent elements in order to keep them isolated. P-N junctions are formed at the intersection of the P layers with the N layers of other elements, creating a parasitic diode or transistor. For example (refer to figure below): When GND > Pin A and GND > Pin B, the P-N junction operates as a parasitic diode. When GND > Pin B, the P-N junction operates as a parasitic transistor. www.rohm.com (c) 2015 ROHM Co., Ltd. All rights reserved. TSZ22111 * 15 * 001 13/17 TSZ02201-0Q1Q0A900270-1-2 27. Jul. 2015 Rev.002 BD1865GWL Operational Notes (Cont'd) Parasitic diodes inevitably occur in the structure of the IC. The operation of parasitic diodes can result in mutual interference among circuits, operational faults, or physical damage. Therefore, conditions that cause these diodes to operate, such as applying a voltage lower than the GND voltage to an input pin (and thus to the P substrate) should be avoided. Resistor Transistor (NPN) Pin A Pin B C E Pin A N P+ P N N P+ N Pin B B Parasitic Elements N P+ N P N P+ B N C E Parasitic Elements P Substrate P Substrate GND GND Parasitic Elements Parasitic Elements GND GND N Region close-by Figure xx. Example of monolithic IC structure 13.) Ceramic Capacitor When using a ceramic capacitor, determine the dielectric constant considering the change of capacitance with temperature and the decrease in nominal capacitance due to DC bias and others. 14.) Area of Safe Operation (ASO) Operate the IC such that the output voltage, output current, and power dissipation are all within the Area of Safe Operation (ASO). 15.) Thermal Shutdown Circuit(TSD) This IC has a built-in thermal shutdown circuit that prevents heat damage to the IC. Normal operation should always be within the IC's power dissipation rating. If however the rating is exceeded for a continued period, the junction temperature (Tj) will rise which will activate the TSD circuit that will turn OFF all output pins. When the Tj falls below the TSD threshold, the circuits are automatically restored to normal operation. Note that the TSD circuit operates in a situation that exceeds the absolute maximum ratings and therefore, under no circumstances, should the TSD circuit be used in a set design or for any purpose other than protecting the IC from heat damage. 16.) Over Current Protection Circuit (OCP) This IC incorporates an integrated overcurrent protection circuit that is activated when the load is shorted. This protection circuit is effective in preventing damage due to sudden and unexpected incidents. However, the IC should not be used in applications characterized by continuous operation or transitioning of the protection circuit. 17.) Disturbance light In a device where a portion of silicon is exposed to light such as in a WL-CSP, IC characteristics may be affected due to photoelectric effect. For this reason, it is recommended to come up with countermeasures that will prevent the chip from being exposed to light. www.rohm.com (c) 2015 ROHM Co., Ltd. All rights reserved. TSZ22111 * 15 * 001 14/17 TSZ02201-0Q1Q0A900270-1-2 27. Jul. 2015 Rev.002 BD1865GWL Ordering Information B D 1 8 6 5 G W L Package GWL : UCSP50L1C Part No. - E 2 Packaging and forming specification E2: Embossed tape and reel Footprint Dimensions (Optimize footprint dimensions to the board design and soldering condition) SD b3 e SE e www.rohm.com (c) 2015 ROHM Co., Ltd. All rights reserved. TSZ22111 * 15 * 001 Symbol Reference Value e 0.40 b3 0.20 SD 0.20 SE 0.20 (Unit: mm) 15/17 TSZ02201-0Q1Q0A900270-1-2 27. Jul. 2015 Rev.002 BD1865GWL Physical Dimension Tape and Reel Information Package Name UCSP50L1C (BD1865GWL) Lot No. 1.60.05 1PIN MARK 1865 0.10.05 0.57MAX 1.60.05 S 0.20.05 0.06 S 16- 0.200.05 0.05 A B A C B B A 1 0.20.05 2 3 P=0.4x3 D 4 P=0.4x3 (Unit: mm) < Tape and Reel Information > Tape Embossed carrier tape Quantity 3,000pcs/Reel Direction of feed E2 The direction is the pin 1 of product is at the upper left when you hold reel on the left hand and you pull out the tape on the right hand 1234 1234 Reel www.rohm.com (c) 2015 ROHM Co., Ltd. All rights reserved. TSZ22111 * 15 * 001 1234 1234 1pin 16/17 1234 1234 Direction of feed TSZ02201-0Q1Q0A900270-1-2 27. Jul. 2015 Rev.002 BD1865GWL Revision History Revision Date Rev.001 Rev.002 15.Jun.2015 27.Jul.2015 Changes New Release. P.2 Add the note for "MODE" terminal to "Note 1". P.3 Add the measurement condition (board size) of Pd to "Note 2". P.7 3.) UVLO Add "(Typ)" to UVLO threshold value. P.7 5.) OCP Change the description about OCP function. P.7 6.) SCP Add "(Typ)" to SCP threshold value. P.8 8.)Mixing PWM mode Delete a part of description. P.10 1.) Output Voltage Setting Add the description about the value of R1 and R2. P.15 Revise the package name from "UCSP50L1" to "UCSP50L1C". www.rohm.com (c) 2015 ROHM Co., Ltd. All rights reserved. TSZ22111 * 15 * 001 17/17 TSZ02201-0Q1Q0A900270-1-2 27. Jul. 2015 Rev.002 Datasheet Notice Precaution on using ROHM Products 1. Our Products are designed and manufactured for application in ordinary electronic equipments (such as AV equipment, OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you intend to use our Products in devices requiring extremely high reliability (such as medical equipment (Note 1), transport equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or serious damage to property ("Specific Applications"), please consult with the ROHM sales representative in advance. Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any ROHM's Products for Specific Applications. (Note1) Medical Equipment Classification of the Specific Applications JAPAN USA EU CHINA CLASS CLASSb CLASS CLASS CLASS CLASS 2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which a failure or malfunction of our Products may cause. The following are examples of safety measures: [a] Installation of protection circuits or other protective devices to improve system safety [b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure 3. Our Products are designed and manufactured for use under standard conditions and not under any special or extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way responsible or liable for any damages, expenses or losses arising from the use of any ROHM's Products under any special or extraordinary environments or conditions. If you intend to use our Products under any special or extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of product performance, reliability, etc, prior to use, must be necessary: [a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents [b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust [c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2 [d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves [e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items [f] Sealing or coating our Products with resin or other coating materials [g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning residue after soldering [h] Use of the Products in places subject to dew condensation 4. The Products are not subject to radiation-proof design. 5. Please verify and confirm characteristics of the final or mounted products in using the Products. 6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied, confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect product performance and reliability. 7. De-rate Power Dissipation (Pd) depending on Ambient temperature (Ta). When used in sealed area, confirm the actual ambient temperature. 8. Confirm that operation temperature is within the specified range described in the product specification. 9. ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in this document. Precaution for Mounting / Circuit board design 1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product performance and reliability. 2. In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products, please consult with the ROHM representative in advance. For details, please refer to ROHM Mounting specification Notice-PGA-E (c) 2015 ROHM Co., Ltd. All rights reserved. Rev.001 Datasheet Precautions Regarding Application Examples and External Circuits 1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the characteristics of the Products and external components, including transient characteristics, as well as static characteristics. 2. You agree that application notes, reference designs, and associated data and information contained in this document are presented only as guidance for Products use. Therefore, in case you use such information, you are solely responsible for it and you must exercise your own independent verification and judgment in the use of such information contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of such information. Precaution for Electrostatic This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron, isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control). Precaution for Storage / Transportation 1. Product performance and soldered connections may deteriorate if the Products are stored in the places where: [a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2 [b] the temperature or humidity exceeds those recommended by ROHM [c] the Products are exposed to direct sunshine or condensation [d] the Products are exposed to high Electrostatic 2. Even under ROHM recommended storage condition, solderability of products out of recommended storage time period may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is exceeding the recommended storage time period. 3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads may occur due to excessive stress applied when dropping of a carton. 4. Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of which storage time is exceeding the recommended storage time period. Precaution for Product Label QR code printed on ROHM Products label is for ROHM's internal use only. Precaution for Disposition When disposing Products please dispose them properly using an authorized industry waste company. Precaution for Foreign Exchange and Foreign Trade act Since concerned goods might be fallen under listed items of export control prescribed by Foreign exchange and Foreign trade act, please consult with ROHM in case of export. Precaution Regarding Intellectual Property Rights 1. All information and data including but not limited to application example contained in this document is for reference only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any other rights of any third party regarding such information or data. 2. ROHM shall not have any obligations where the claims, actions or demands arising from the combination of the Products with other articles such as components, circuits, systems or external equipment (including software). 3. No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any third parties with respect to the Products or the information contained in this document. Provided, however, that ROHM will not assert its intellectual property rights or other rights against you or your customers to the extent necessary to manufacture or sell products containing the Products, subject to the terms and conditions herein. Other Precaution 1. This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM. 2. The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written consent of ROHM. 3. In no event shall you use in any way whatsoever the Products and the related technical information contained in the Products or this document for any military purposes, including but not limited to, the development of mass-destruction weapons. 4. The proper names of companies or products described in this document are trademarks or registered trademarks of ROHM, its affiliated companies or third parties. Notice-PGA-E (c) 2015 ROHM Co., Ltd. All rights reserved. Rev.001 Datasheet General Precaution 1. Before you use our Pro ducts, you are requested to care fully read this document and fully understand its contents. ROHM shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny ROHM's Products against warning, caution or note contained in this document. 2. All information contained in this docume nt is current as of the issuing date and subj ect to change without any prior notice. Before purchasing or using ROHM's Products, please confirm the la test information with a ROHM sale s representative. 3. The information contained in this doc ument is provi ded on an "as is" basis and ROHM does not warrant that all information contained in this document is accurate an d/or error-free. ROHM shall not be in an y way responsible or liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or concerning such information. Notice - WE (c) 2015 ROHM Co., Ltd. All rights reserved. Rev.001