0 XC2C256 CoolRunner-II CPLD R DS094 (v3.2) March 8, 2007 0 0 Product Specification Features Description * The CoolRunnerTM-II 256-macrocell device is designed for both high performance and low power applications. This lends power savings to high-end communication equipment and high speed to battery operated devices. Due to the low power stand-by and dynamic operation, overall system reliability is improved * * * Optimized for 1.8V systems - As fast as 5.7 ns pin-to-pin delays - As low as 13 A quiescent current Industry's best 0.18 micron CMOS CPLD - Optimized architecture for effective logic synthesis. Refer to the CoolRunnerTM-II family data sheet for architecture description. - Multi-voltage I/O operation -- 1.5V to 3.3V Available in multiple package options - 100-pin VQFP with 80 user I/O - 144-pin TQFP with 118 user I/O - 132-ball CP (0.5mm) BGA with 106 user I/O - 208-pin PQFP with 173 user I/O - 256-ball FT (1.0mm) BGA with 184 user I/O - Pb-free available for all packages Advanced system features - Fastest in system programming * 1.8V ISP using IEEE 1532 (JTAG) interface - IEEE1149.1 JTAG Boundary Scan Test - Optional Schmitt-trigger input (per pin) - Unsurpassed low power management * DataGATE enable (DGE) signal control - Two separate I/O banks - RealDigital 100% CMOS product term generation - Flexible clocking modes * Optional DualEDGE triggered registers * Clock divider (divide by 2,4,6,8,10,12,14,16) * CoolCLOCK - Global signal options with macrocell control * Multiple global clocks with phase selection per macrocell * Multiple global output enables * Global set/reset - Advanced design security - PLA architecture * Superior pinout retention * 100% product term routability across function block - Open-drain output option for Wired-OR and LED drive - Optional bus-hold, 3-state or weak pull-up on selected I/O pins - Optional configurable grounds on unused I/Os - Mixed I/O voltages compatible with 1.5V, 1.8V, 2.5V, and 3.3V logic levels * SSTL2-1, SSTL3-1, and HSTL-1 I/O compatibility - Hot pluggable This device consists of sixteen Function Blocks inter-connected by a low power Advanced Interconnect Matrix (AIM). The AIM feeds 40 true and complement inputs to each Function Block. The Function Blocks consist of a 40 by 56 P-term PLA and 16 macrocells which contain numerous configuration bits that allow for combinational or registered modes of operation. Additionally, these registers can be globally reset or preset and configured as a D or T flip-flop or as a D latch. There are also multiple clock signals, both global and local product term types, configured on a per macrocell basis. Output pin configurations include slew rate limit, bus hold, pull-up, open drain and programmable grounds. A Schmitt-trigger input is available on a per input pin basis. In addition to storing macrocell output states, the macrocell registers may be configured as "direct input" registers to store signals directly from input pins. Clocking is available on a global or Function Block basis. Three global clocks are available for all Function Blocks as a synchronous clock source. Macrocell registers can be individually configured to power up to the zero or one state. A global set/reset control line is also available to asynchronously set or reset selected registers during operation. Additional local clock, synchronous clock-enable, asynchronous set/reset and output enable signals can be formed using product terms on a per-macrocell or per-Function Block basis. A DualEDGE flip-flop feature is also available on a per macrocell basis. This feature allows high performance synchronous operation based on lower frequency clocking to help reduce the total power consumption of the device. Circuitry has also been included to divide one externally supplied global clock (GCK2) by eight different selections. This yields divide by even and odd clock frequencies. The use of the clock divide (division by 2) and DualEDGE flip-flop gives the resultant CoolCLOCK feature. DataGATE is a method to selectively disable inputs of the CPLD that are not of interest during certain points in time. (c) 2002-2007 Xilinx, Inc. All rights reserved. All Xilinx trademarks, registered trademarks, patents, and disclaimers are as listed at http://www.xilinx.com/legal.htm. All other trademarks and registered trademarks are the property of their respective owners. All specifications are subject to change without notice. DS094 (v3.2) March 8, 2007 Product Specification www.xilinx.com 1 XC2C256 CoolRunner-II CPLD R By mapping a signal to the DataGATE function, lower power can be achieved due to reduction in signal switching. Another feature that eases voltage translation is I/O banking. Two I/O banks are available on the CoolRunner-II 256 macrocell device that permit easy interfacing to 3.3V, 2.5V, 1.8V, and 1.5V devices. The CoolRunner-II 256 macrocell CPLD is I/O compatible with various I/O standards (see Table 1). This device is also 1.5V I/O compatible with the use of Schmitt-trigger inputs. for I/O standard voltages. The LVTTL I/O standard is a general purpose EIA/JEDEC standard for 3.3V applications that use an LVTTL input buffer and Push-Pull output buffer. The LVCMOS standard is used in 3.3V, 2.5V, 1.8V applications. Both HSTL and SSTL I/O standards make use of a VREF pin for JEDEC compliance. CoolRunner-II CPLDs are also 1.5V I/O compatible with the use of Schmitt-trigger inputs Table 1: I/O Standards for XC2C256(1) Output VCCIO Input VCCIO Board Input Termination VREF Voltage VTT RealDigital Design Technology IOSTANDARD Attribute Xilinx CoolRunner-II CPLDs are fabricated on a 0.18 micron process technology which is derived from leading edge FPGA product development. CoolRunner-II CPLDs employ RealDigital, a design technique that makes use of CMOS technology in both the fabrication and design methodology. RealDigital design technology employs a cascade of CMOS gates to implement sum of products instead of traditional sense amplifier methodology. Due to this technology, Xilinx CoolRunner-II CPLDs achieve both high-performance and low power operation. LVTTL 3.3 3.3 N/A N/A LVCMOS33 3.3 3.3 N/A N/A LVCMOS25 2.5 2.5 N/A N/A 1.8 1.8 N/A N/A LVCMOS18 LVCMOS15 (2) 1.5 1.5 N/A N/A HSTL_1 1.5 1.5 0.75 0.75 SSTL2_1 2.5 2.5 1.25 1.25 SSTL3_1 3.3 3.3 1.5 1.5 (1)For information on Vref, see XAPP399. (2) LVCMOS15 requires Schmitt-trigger inputs. Supported I/O Standards The CoolRunner-II 256 macrocell features LVCMOS, LVTTL, SSTL and HSTL I/O implementations. See Table 1 100 ICC (mA) 75 50 25 0 0 50 100 150 200 250 Frequency (MHz) Figure 1: ICC vs Frequency Table 2: ICC vs Frequency (LVCMOS 1.8V TA = 25C)(1) Frequency (MHz) Typical ICC (mA) 0 30 50 70 100 120 150 170 190 220 240 0.021 11.68 19.40 27.01 38.18 45.54 56.32 63.37 70.40 80.90 88.03 Notes: 1. 16-bit up/down, resettable binary counter (one counter per function block). 2 www.xilinx.com DS094 (v3.2) March 8, 2007 Product Specification XC2C256 CoolRunner-II CPLD R Absolute Maximum Ratings Symbol Description Value Units VCC Supply voltage relative to ground -0.5 to 2.0 V VCCIO Supply voltage for output drivers -0.5 to 4.0 V VJTAG(2) JTAG input voltage limits -0.5 to 4.0 V VCCAUX JTAG input supply voltage -0.5 to 4.0 V VIN(1) Input voltage relative to ground -0.5 to 4.0 V VTS(1) Voltage applied to 3-state output -0.5 to 4.0 V TSTG(3) Storage Temperature (ambient) -65 to +150 C +150 C TJ Junction Temperature Notes: 1. Maximum DC undershoot below GND must be limited to either 0.5V or 10 mA, whichever is easiest to achieve. During transitions, the device pins may undershoot to -2.0v or overshoot to +4.5V, provided this over or undershoot lasts less than 10 ns and with the forcing current being limited to 200 mA. 2. Valid over commercial temperature range. 3. For soldering guidelines and thermal considerations, see the Device Packaging information on the Xilinx website. For Pb free packages, see XAPP427. Recommended Operating Conditions Symbol VCC VCCIO VCCAUX Parameter Min Max Units Commercial TA = 0C to +70C 1.7 1.9 V Industrial TA = -40C to +85C 1.7 1.9 V Supply voltage for output drivers @ 3.3V operation 3.0 3.6 V Supply voltage for output drivers @ 2.5V operation 2.3 2.7 V Supply voltage for output drivers @ 1.8V operation 1.7 1.9 V Supply voltage for output drivers @ 1.5V operation 1.4 1.6 V JTAG programming 1.7 3.6 V Supply voltage for internal logic and input buffers DC Electrical Characteristics (Over Recommended Operating Conditions) Symbol Parameter Test Conditions Typical Max. Units ICCSB Standby current Commercial VCC = 1.9V, VCCIO = 3.6V 33 150 A ICCSB Standby current Industrial VCC = 1.9V, VCCIO = 3.6V 54 300 A ICC Dynamic current f = 1 MHz - 410 A f = 50 MHz - 27 mA CJTAG JTAG input capacitance f = 1 MHz - 10 pF CCLK Global clock input capacitance f = 1 MHz - 12 pF CIO I/O capacitance f = 1 MHz - 10 pF IIL (2) Input leakage current VIN = 0V or VCCIO to 3.9V - +/-1 A (2) I/O High-Z leakage VIN = 0V or VCCIO to 3.9V - +/-1 A IIH Notes: 1. 16-bit up/down, resettable binary counter (one counter per function block) tested at VCC= VCCIO = 1.9V 2. See Quality and Reliability section of the CoolRunner-II family data sheet DS094 (v3.2) March 8, 2007 Product Specification www.xilinx.com 3 XC2C256 CoolRunner-II CPLD R LVCMOS 3.3V and LVTTL 3.3V DC Voltage Specifications Symbol Parameter Test Conditions Min. Max. Units VCCIO Input source voltage - 3.0 3.6 V VIH High level input voltage - 2 3.9 V VIL Low level input voltage - -0.3 0.8 V VOH High level output voltage IOH = -8 mA, VCCIO = 3V VCCIO - 0.4V - V IOH = -0.1 mA, VCCIO = 3V VCCIO - 0.2V - V IOL = 8 mA, VCCIO = 3V - 0.4 V IOL = 0.1 mA, VCCIO = 3V - 0.2 V VOL Low level output voltage LVCMOS 2.5V DC Voltage Specifications Symbol VCCIO Parameter Test Conditions Min. Max. Units - 2.3 2.7 V Input source voltage 0.3(1) VIH High level input voltage - 1.7 VIL Low level input voltage - -0.3 0.7 V VOH High level output voltage IOH = -8 mA, VCCIO = 2.3V VCCIO - 0.4V - V IOH = -0.1 mA, VCCIO = 2.3V VCCIO - 0.2V - V IOL = 8 mA, VCCIO = 2.3V - 0.4 V IOL = 0.1 mA, VCCIO = 2.3V - 0.2 V VOL Low level output voltage VCCIO + V (1) The VIH Max value represents the JEDEC specification for LVCMOS25. The CoolRunner-II input buffer can tolerate up to 3.9V without physical damage. LVCMOS 1.8V DC Voltage Specifications Symbol VCCIO Parameter Test Conditions Min. Max. Units - 1.7 1.9 V Input source voltage + 0.3(1) V VIH High level input voltage - 0.65 x VCCIO VIL Low level input voltage - -0.3 0.35 x VCCIO V VOH High level output voltage IOH = -8 mA, VCCIO = 1.7V VCCIO - 0.45 - V IOH = -0.1 mA, VCCIO = 1.7V VCCIO - 0.2 - V IOL = 8 mA, VCCIO = 1.7V - 0.45 V IOL = 0.1 mA, VCCIO = 1.7V - 0.2 V VOL Low level output voltage VCCIO (1) The VIH Max value represents the JEDEC specification for LVCMOS18. The CoolRunner-II input buffer can tolerate up to 3.9V without physical damage. LVCMOS 1.5V DC Voltage Specifications(1) Symbol Test Conditions Min. Max. Units VCCIO Input source voltage - 1.4 1.6 V VT+ Input hysteresis threshold voltage - 0.5 x VCCIO 0.8 x VCCIO V - 0.2 x VCCIO 0.5 x VCCIO V VT- 4 Parameter www.xilinx.com DS094 (v3.2) March 8, 2007 Product Specification XC2C256 CoolRunner-II CPLD R Symbol VOH VOL Parameter High level output voltage Test Conditions Min. Max. Units IOH = -8 mA, VCCIO = 1.4V VCCIO - 0.45 - V IOH = -0.1 mA, VCCIO = 1.4V VCCIO - 0.2 - V IOL = 8 mA, VCCIO = 1.4V - 0.4 V IOL = 0.1 mA, VCCIO = 1.4V - 0.2 V Test Conditions Min. Max. Units Low level output voltage Notes: 1. Hysteresis used on 1.5V inputs. Schmitt Trigger Input DC Voltage Specifications Symbol Parameter VCCIO Input source voltage - 1.4 3.9 V VT+ Input hysteresis threshold voltage - 0.5 x VCCIO 0.8 x VCCIO V - 0.2 x VCCIO 0.5 x VCCIO V VT- SSTL2-1 DC Voltage Specifications Symbol Parameter Test Conditions Min. Typ Max. Units VCCIO Input source voltage - 2.3 2.5 2.7 V VREF(1) VTT(2) Input reference voltage - 1.15 1.25 1.35 V Termination voltage - VREF - 0.04 1.25 VREF + 0.04 V VIH High level input voltage - VREF + 0.18 - 3.9 V VIL Low level input voltage - -0.3 - VREF - 0.18 V VOH High level output voltage IOH = -8 mA, VCCIO = 2.3V VCCIO - 0.62 - - V VOL Low level output voltage IOL = 8 mA, VCCIO = 2.3V - - 0.54 V Notes: 1. VREF should track the variations in VCCIO, also peak to peak AC noise on VREF may not exceed 2% VREF 2. VTT of transmitting device must track VREF of receiving devices DS094 (v3.2) March 8, 2007 Product Specification www.xilinx.com 5 XC2C256 CoolRunner-II CPLD R SSTL3-1 DC Voltage Specifications Symbol Parameter Test Conditions Min. Typ Max. Units VCCIO Input source voltage - 3.0 3.3 3.6 V VREF(1) VTT(2) Input reference voltage - 1.3 1.5 1.7 V Termination voltage - VREF - 0.05 1.5 VREF + 0.05 V VIH High level input voltage - VREF + 0.2 - VCCIO + 0.3 V VIL Low level input voltage - -0.3 - VREF - 0.2 V VOH High level output voltage IOH = -8 mA, VCCIO = 3V VCCIO - 1.1 - - V VOL Low level output voltage IOL = 8 mA, VCCIO = 3V - - 0.7 V Notes: 1. VREF should track the variations in VCCIO, also peak to peak AC noise on VREF may not exceed 2% VREF 2. VTT of transmitting device must track VREF of receiving devices HSTL1 DC Voltage Specifications Symbol Parameter Test Conditions Min. Typ Max. Units VCCIO Input source voltage - 1.4 1.5 1.6 V VREF(1) VTT(2) Input reference voltage - 0.68 0.75 0.90 V Termination voltage - - VCCIO x 0.5 - V VIH High level input voltage - VREF + 0.1 - 1.9 V VIL Low level input voltage - -0.3 - VREF - 0.1 V VOH High level output voltage IOH = -8 mA, VCCIO = 1.7V VCCIO - 0.4 - - V VOL Low level output voltage IOL = 8 mA, VCCIO = 1.7V - - 0.4 V Notes: 1. VREF should track the variations in VCCIO, also peak-to-peak AC noise on VREF may not exceed 2% VREF 2. VTT of transmitting device must track VREF of receiving devices AC Electrical Characteristics Over Recommended Operating Conditions -6 Symbol Parameter -7 Min. Max. Min. Max. Units TPD1 Propagation delay single p-term - 5.7 - 6.7 ns TPD2 Propagation delay OR array - 6.0 - 7.5 ns TSUD Direct input register clock setup time 2.6 - 3.0 - ns TSU1 Setup time (single p-term) 2.4 - 2.8 - ns TSU2 Setup time (OR array) 2.7 - 3.3 - ns THD Direct input register hold time 0 - 0 - ns TH P-term hold time 0 - 0 - ns Clock to output - 4.5 - 6.0 ns TCO (1) Internal toggle rate - 450 - 300 MHz FSYSTEM1 (2) Maximum system frequency - 256 - 152 MHz FSYSTEM2 (2) FTOGGLE Maximum system frequency - 238 - 141 MHz FEXT1 (3) Maximum external frequency - 145 - 114 MHz FEXT2 (3) Maximum external frequency - 139 - 108 MHz 1.3 - 1.7 - ns TPSUD 6 Direct input register p-term clock setup time www.xilinx.com DS094 (v3.2) March 8, 2007 Product Specification XC2C256 CoolRunner-II CPLD R -6 Symbol Parameter -7 Min. Max. Min. Max. Units TPSU1 P-term clock setup time (single p-term) 1.2 - 1.5 - ns TPSU2 P-term clock setup time (OR array) 1.5 - 2.0 - ns TPHD Direct input register p-term clock hold time 1.1 - 1.2 - ns TPH P-term clock hold 1.0 - 1.0 - ns TPCO P-term clock to output - 6.5 - 7.3 ns TOE/TOD Global OE to output enable/disable - 5.6 - 7.0 ns TPOE/TPOD P-term OE to output enable/disable - 7.3 - 8.0 ns TMOE/TMOD Macrocell driven OE to output enable/disable - 7.4 - 9.9 ns TPAO P-term set/reset to output valid - 7.5 - 8.1 ns TAO Global set/reset to output valid - 5.7 - 7.6 ns TSUEC Register clock enable setup time 2.8 - 3.1 - ns THEC Register clock enable hold time 0 - 0 - ns TCW Global clock pulse width High or Low 1.1 - 1.6 - ns TPCW P-term pulse width High or Low 6.0 - 7.5 - ns TAPRPW Asynchronous preset/reset pulse width (High or Low) 6.0 - 7.5 - ns TDGSU Set-up before DataGATE latch assertion 0 - 0 - ns TDGH Hold to DataGATE latch assertion 4.0 - 6.0 - ns TDGR DataGATE recovery to new data - 8.2 - 9.0 ns TDGW DataGATE low pulse width 2.5 - 3.5 - ns TCDRSU CDRST setup time before falling edge GCLK2 1.6 - 2.0 - ns Hold time CDRST after falling edge GCLK2 0 - 0 - ns Configuration time - 150 - 150 s TCDRH TCONFIG (4) Notes: 1. FTOGGLE is the maximum clock frequency to which a T-Flip Flop can reliably toggle (see the CoolRunner-II family data sheet for more information). 2. FSYSTEM1 (1/TCYCLE) is the internal operating frequency for a device fully populated with one 16-bit counter through one p-term per macrocell while FSYSTEM2 is through the OR array. 3. FEXT1 (1/TSU1+TCO) is the maximum external frequency using one p-term while FEXT2 is through the OR array. 4. Typical configuration current during TCONFIG is approximately 7.7 mA. DS094 (v3.2) March 8, 2007 Product Specification www.xilinx.com 7 XC2C256 CoolRunner-II CPLD R Internal Timing Parameters ( -6 Parameter(2) Symbol -7 Min. Max. Min. Max. Units Buffer Delays TIN Input buffer delay - 2.4 - 2.6 ns TDIN Direct data register input delay - 3.1 - 3.9 ns TGCK Global Clock buffer delay - 1.8 - 2.7 ns TGSR Global set/reset buffer delay - 2.0 - 3.5 ns TGTS Global 3-state buffer delay - 2.1 - 3.0 ns TOUT Output buffer delay - 2.3 - 2.6 ns TEN Output buffer enable/disable delay - 3.5 - 4.0 ns TCT Control term delay - 1.1 - 1.4 ns TLOGI1 Single P-term delay adder - 0.5 - 1.1 ns TLOGI2 Multiple P-term delay adder - 0.3 - 0.5 ns TPDI Input to output valid - 0.5 - 0.7 ns TSUI Setup before clock 1.3 - 1.8 - ns THI Hold after clock 0 - 0 - ns TECSU Enable clock setup time 0.8 - 1.8 - ns TECHO Enable clock hold time 0 - 0 - ns TCOI Clock to output valid - 0.4 - 0.7 ns TAOI Set/reset to output valid - 1.4 - 1.5 ns TCDBL Clock doubler delay - 0 - 0 ns TF Feedback delay - 1.7 - 3.0 ns TOEM Macrocell to global OE delay - 1.7 - 2.5 ns P-term Delays Macrocell Delay Feedback Delays I/O Standard Time Adder Delays 1.5V CMOS THYS15 Hysteresis input adder - 3.0 - 4.0 ns TOUT15 Output adder - 0.8 - 1.0 ns TSLEW15 Output slew rate adder - 4.0 - 5.0 ns I/O Standard Time Adder Delays 1.8V CMOS 8 THYS18 Hysteresis input adder - 2.0 - 3.0 ns TOUT18 Output adder - 0 - 0 ns TSLEW Output slew rate adder - 2.0 - 4.0 ns www.xilinx.com DS094 (v3.2) March 8, 2007 Product Specification XC2C256 CoolRunner-II CPLD R Internal Timing Parameters (Continued) -6 Parameter(2) Symbol -7 Min. Max. Min. Max. Units I/O Standard Time Adder Delays 2.5V CMOS TIN25 Standard input adder - 0.6 - 0.7 ns THYS25 Hysteresis input adder - 1.5 - 3.0 ns TOUT25 Output adder - 0.8 - 1.0 ns TSLEW25 Output slew rate adder - 3.0 - 4.0 ns I/O Standard Time Adder Delays 3.3V CMOS/TTL TIN33 Standard input adder - 0.5 - 0.7 ns THYS33 Hysteresis input adder - 1.2 - 3.0 ns TOUT33 Output adder - 1.2 - 1.6 ns TSLEW33 Output slew rate adder - 3.0 - 4.0 ns Input adder to TIN, TDIN, TGCK, TGSR,TGTS - 0.4 - 1.0 ns Output adder to TOUT - -0.5 - 0.0 ns Input adder to TIN, TDIN, TGCK, TGSR,TGTS - 0.4 - 1.0 ns Output adder to TOUT - -0.5 - 0.0 ns Input adder to TIN, TDIN, TGCK, TGSR,TGTS - 0.6 - 1.0 ns Output adder to TOUT - 0 - 0 ns I/O Standard Time Adder Delays HSTL, SSTL SSTL2-1 SSTL3-1 HSTL-1 Notes: 1. 1.5 ns input pin signal rise/fall. Switching Characteristics AC Test Circuit VCC VCC = VCCIO = 1.8V, T = 25oC 5.5 R1 Device Under Test 5.0 Test Point R2 CL TPD2 (ns) 4.5 R1 R2 CL 268 235 35 pF LVCMOS33 275 275 35 pF LVCMOS25 188 188 35pF LVCMOS18 112.5 112.5 35pF LVCMOS15 150 150 35pF Output Type LVTTL33 4.0 3.5 CL includes test fixtures and probe capacitance. 3.0 1 2 4 8 16 1.5 nsec maximum rise/fall times on inputs. DS_ACT_08_14_02 Figure 3: AC Load Circuit Number of Outputs Switching DS092_02_092302 Figure 2: Derating Curve for TPD DS094 (v3.2) March 8, 2007 Product Specification www.xilinx.com 9 XC2C256 CoolRunner-II CPLD R Typical I/V Output Curves The I/V curve illustrates the nominal amount of current that an I/O can source/sink at different voltage levels. 3.3V 60 IO (Output Current mA) 50 2.5V 40 1.8V Iol 30 20 1.5V 10 0 0 .5 1.0 1.5 2.0 VO (Output Volts) 2.5 3.0 3.5 XC256_VoIo_all_020703 Figure 4: Typical I/V Curve for XC2C256 10 www.xilinx.com DS094 (v3.2) March 8, 2007 Product Specification XC2C256 CoolRunner-II CPLD R Pin Descriptions (Continued) Pin Descriptions 11 Function Block Macrocell VQ100 CP132 TQ144 PQ208 FT256 I/O Bank Function Block Macrocell VQ100 CP132 TQ144 PQ208 FT256 I/O Bank 1 1 - - - 2 B3 2 3 1 - - 136 196 A6 2 1 2 - - - 208 B4 2 3 2 - B5 135 195 D7 2 1(GSR) 3 99 A3 143 206 C4 2 3 3 - - 134 194 B7 2 1 4 - - 142 205 A2 2 3 4 - A5 - 193 E9 2 1 5 - - - 203 A3 2 3 5 93 - 133 192 A7 2 1 6 97 B4 140 202 A4 2 3 6 191 D8 2 1 7 - - - - - - 3 7 - - - - - - 1 8 - - - - - - 3 8 - - - - - - 1 9 - - - - - - 3 9 - - - - - - 1 10 - - - - - - 3 10 - - - - - - 1 11 - - - - - - 3 11 - - - - - - 1 12 96 - 139 201 B5 2 3 12 92 - - 189 B8 2 1 13 95 - 138 200 A5 2 3 13 - B6 - 188 C8 2 1 14 94 A4 137 199 E8 2 3 14 91 A6 132 187 A8 2 1 15 - - - 198 B6 2 3 15 - C7 - 186 E11 2 1 16 - C5 - 197 C7 2 3 16 90 B7 131 185 E10 2 2(GTS2) 1 1 A1 2 3 D3 2 4 1 8 E3 11 15 F2 2 2 2 - - - 4 C3 2 4 2 9 - 12 16 F3 2 2(GTS3) 3 2 B2 3 5 E3 2 4 3 10 E2 13 17 G4 2 2 4 - B1 4 6 B2 2 4 4 - E1 14 18 G3 2 2(GTS0) 5 3 C3 5 7 D4 2 4 5 11 F3 15 19 F5 2 2 6 - - - 8 D2 2 4 6 12 F2 16 20 G5 2 2 7 - - - - - - 4 7 - - - - - - 2 8 - - - - - - 4 8 - - - - - - 2 9 - - - - - - 4 9 - - - - - - 2 10 - - - - - - 4 10 - - - - - - 2 11 - - - - - - 4 11 - - - - - - 2(GTS1) 12 4 C2 6 9 E5 2 4 12 - F1 17 21 H2 2 2 13 - C1 7 10 B1 2 4 13 13 G1 - 22 H4 2 2 14 6 D2 9 12 E4 2 4 14 - - 18 23 H3 2 2 15 7 - 10 14 C1 2 4 15 - - - - H1 2 2 16 - D1 - - E2 2 4 16 - - - 25 H5 2 DS094 (v3.2) March 8, 2007 Product Specification www.xilinx.com C6 11 XC2C256 CoolRunner-II CPLD R Pin Descriptions (Continued) Function Block Pin Descriptions (Continued) Macrocell VQ100 CP132 TQ144 PQ208 FT256 I/O Bank Function Block Macrocell VQ100 CP132 TQ144 PQ208 FT256 I/O Bank 5 1 - L3 - 49 R1 1 7 1 - - - 37 K4 1 5 2 - - 33 48 N4 1 7 2 - - - 36 L2 1 5 3 - - - 47 N2 1 7 3 - - - 35 K3 1 5(GCK1) 4 23 L2 32 46 M3 1 7 4 - - - 34 L1 1 5 5 L1 31 45 P1 1 7 5 19 J2 26 32 K5 1 5(GCK0) 6 22 K3 30 44 M2 1 7 6 18 J1 25 31 K2 1 5 7 - - - - - - 7 7 - - - - - - 5 8 - - - - - - 7 8 - - - - - - 5 9 - - - - - - 7 9 - - - - - - 5 10 - - - - - - 7 10 - - - - - - 5 11 - - - - - - 7 11 17 H3 24 30 J4 1 5 12 - - - 43 L3 1 7 12 16 H2 23 29 K1 1 5 13 - - - 41 N1 1 7 13 15 H1 22 28 J3 1 5 14 - - 28 40 L4 1 7 14 14 G3 21 27 J2 1 5 15 - - - 39 M1 1 7 15 - G2 20 - J5 1 5 16 - K1 - 38 L5 1 7 16 - - 19 - J1 1 6 1 - M1 34 50 N3 1 8 1 - N4 44 64 R6 1 6 (CDRST) 2 24 M2 35 51 P2 1 8 2 - - 45 65 N6 1 8 3 - - 46 66 R3 1 6 3 - - - 54 P4 1 8 4 - - - 67 M6 1 6(GCK2) 4 27 N2 38 55 P5 1 8 5 - - 48 69 T3 1 6 5 - - - 56 R2 1 8 6 32 - 49 70 P6 1 6 6 - - - 57 T1 1 8 7 - - - - - - 6 7 - - - - - - 8 8 - - - - - - 6 8 - - - - - - 8 9 - - - - - - 6 9 - - - - - - 8 10 - - - - - - 6 10 - - - - - - 8 11 33 M5 50 71 T4 1 6 11 - - - - - - 8 12 34 N5 51 72 P7 1 6(DGE) 12 28 P2 39 58 T2 1 8 13 35 P5 52 73 T5 1 6 13 - M3 40 60 N5 1 8 14 36 M6 - 74 N7 1 6 14 29 N3 41 61 R4 1 8 15 37 N6 - 75 R7 1 6 15 - P3 42 62 M5 1 8 16 - - - 76 M7 1 6 16 30 M4 43 63 R5 1 12 www.xilinx.com DS094 (v3.2) March 8, 2007 Product Specification XC2C256 CoolRunner-II CPLD R Pin Descriptions (Continued) Function Block Pin Descriptions (Continued) Macrocell VQ100 CP132 TQ144 PQ208 FT256 I/O Bank Function Block Macrocell VQ100 CP132 TQ144 PQ208 FT256 9 1 78 C12 112 160 B13 2 11 1 - 9 2 79 B12 113 161 B14 2 11 2 - 9 3 - - - 162 C13 2 11 3 - 9 4 80 A12 114 163 A15 2 11 4 9 5 164 C12 2 11 9 6 81 C11 115 165 B12 2 9 7 - - - - - 9 8 - - - - 9 9 - - - 9 10 - - 9 11 - 9 12 9 - - B11 2 - 173 D11 2 A10 - 174 A11 2 - - - 175 D10 2 5 - C9 120 - B10 2 11 6 - - 121 - E12 2 - 11 7 - - - - - - - - 11 8 - - - - - - - - - 11 9 - - - - - - - - - - 11 10 - - - - - - - - 166 D13 2 11 11 85 A8 124 178 F12 2 82 B11 116 167 A14 2 11 12 86 B8 125 179 B9 2 13 - - 117 168 E13 2 11 13 87 C8 126 180 C9 2 9 14 - A11 118 169 A13 2 11 14 89 - 128 182 C10 2 9 15 - - 119 170 C11 2 11 15 - - 129 183 A9 2 9 16 - C10 - 171 A12 2 11 16 - - 130 184 D9 2 10 1 77 A13 111 159 A16 2 12 1 - - - 145 F15 2 10 2 76 B13 110 158 B15 2 12 2 - - 100 144 G14 2 10 3 74 C13 107 155 C14 2 12 3 - - - 143 E16 2 10 4 73 C14 106 154 G11 2 12 4 - - - 142 H12 2 10 5 72 D12 105 153 B16 2 12 5 - F12 - 140 F16 2 10 6 71 D13 104 152 D15 2 12 6 - F13 - 139 H16 2 10 7 - - - - - - 12 7 - - - - - - 10 8 - - - - - - 12 8 - - - - - - 10 9 - - - - - - 12 9 - - - - - - 10 10 - - - - - - 12 10 - - - - - - 10 11 151 E14 2 12 11 68 F14 98 138 G15 2 10 12 70 D14 103 150 C16 2 12 12 - G12 97 137 H13 2 10 13 - - - 149 F14 2 12 13 67 G13 96 136 G16 2 10 14 - E12 102 148 F13 2 12 14 66 - 95 135 H14 2 10 15 - - - 147 E15 2 12 15 65 - 94 134 H15 2 10 16 - E13 101 146 G13 2 12 16 - - - - J12 2 DS094 (v3.2) March 8, 2007 Product Specification www.xilinx.com B10 I/O Bank 13 XC2C256 CoolRunner-II CPLD R Pin Descriptions (Continued) Function Block Pin Descriptions (Continued) Macrocell VQ100 CP132 TQ144 PQ208 FT256 I/O Bank Function Block Macrocell VQ100 CP132 TQ144 PQ208 FT256 I/O Bank 13 1 - N13 75 107 R15 1 15 1 - - - 118 L15 1 13 2 53 N14 76 108 T16 1 15 2 - L14 83 119 L13 1 13 3 - M12 77 109 N14 1 15 3 - - - 120 M12 1 13 4 54 - - 110 R16 1 15 4 - - - 121 M16 1 13 5 - M13 78 111 N15 1 15 5 - - - 122 K14 1 13 6 55 - 79 112 M15 1 15 6 - - - 123 L16 1 13 7 - - - - - - 15 7 - - - - - - 13 8 - - - - - - 15 8 - - - - - - 13 9 - - - - - - 15 9 - - - - - - 13 10 - - - - - - 15 10 - - - - - - 13 11 - - - - - - 15 11 58 K13 85 125 K15 1 13 12 - M14 80 113 M13 1 15 12 59 K14 86 126 L12 1 13 13 56 - 81 114 P16 1 15 13 60 J12 87 127 K16 1 13 14 - L12 82 115 N16 1 15 14 61 J13 88 128 J14 1 13 15 - - - 116 L14 1 15 15 63 H13 91 - J15 1 13 16 - L13 - 117 M14 1 15 16 64 H12 92 131 J13 1 14 1 52 P14 74 106 P15 1 16 1 - - - 90 P10 1 14 2 - - 71 103 P14 1 16 2 - - - 89 R10 1 14 3 50 P12 70 102 P13 1 16 3 - M8 - 88 T10 1 14 4 - M11 69 101 R13 1 16 4 - - - 87 R9 1 14 5 49 N11 - 100 N13 1 16 5 43 N8 60 86 N9 1 14 6 - P11 68 - R14 1 16 6 42 - 59 85 M8 1 14 7 - - - - - - 16 7 - - - - - - 14 8 - - - - - - 16 8 - - - - - - 14 9 - - - - - - 16 9 - - - - - - 14 10 - - - - - - 16 10 - - - - - - 14 11 - - - - - - 16 11 41 P8 58 84 T8 1 14 12 - - - 99 T15 1 16 12 40 M7 57 83 P8 1 14 13 - - 66 97 R12 1 16 13 39 N7 56 82 R8 1 14 14 46 P10 64 95 N11 1 16 14 - - - 80 T7 1 14 15 44 - - - M11 1 16 15 - - 54 78 N8 1 14 16 - P9 61 91 N10 1 16 16 - P6 53 77 T6 1 Notes: 1. GTS = global output enable, GSR = global reset/set, GCK = global clock, CDRST = clock divide reset, DGE = DataGATE enable. 2. GTS, GSR and GCK pins can be used for general purpose I/O. 14 www.xilinx.com DS094 (v3.2) March 8, 2007 Product Specification XC2C256 CoolRunner-II CPLD R XC2C256 JTAG, Power/Ground, No Connect Pins and Total User I/O Pin Type VQ100 CP132 TQ144 PQ208 FT256 TCK 48 M10 67 98 P12 TDI 45 M9 63 94 R11 TDO 83 B9 122 176 A10 TMS 47 N10 65 96 N12 VCCAUX (JTAG supply voltage) 5 D3 8 11 F4 Power internal (VCC) 26, 57 P1, K12, A2 1, 37, 84 1, 53, 124 P3, K13, D12, D5 Power Bank 1 I/O (VCCIO1) 20, 38, 51 J3, P7, G14, P13 27, 55, 73, 93 33, 59, 79, 92, 105, 132 J6, K6, L7, L8, J11, K11, L10, L9 Power Bank 2 I/O (VCCIO2) 88, 98 A14, C4, A7 109, 127, 141 26, 133, 157, 172, 181, 204 F7, F8, G6, H6, F10, F9, H11 21, 25, 31, 62, 69, 75, 84, 100 K2, N1, P4, N9, N12, J14, H14, E14, B14, A9, B3 29, 36, 47, 62, 72, 89, 90, 99, 108, 123, 144 13, 24, 42, 52, 68, 81, 93, 104, 129, 130, 141, 156, 177, 190, 207 F11, F6, G10, G7, G8, G9, H10, H7, H8, H9, J10, J7, J8, J9, K10, K7, K8, K9, L11, L6 No connects - - - - A1, C2, E6, D1, E1, G2, F1, G1, M4, T9, P9, M9, M10, T11, T12, T13, P11, T14, J16, K12, D16, G12, C15, D14, D6, C6, E7, C5 Total user I/O 80 106 118 173 184 Ground DS094 (v3.2) March 8, 2007 Product Specification www.xilinx.com 15 XC2C256 CoolRunner-II CPLD R Ordering Information Commercia l (C) Part Number Pin/Ball Spacing JC JA (C/Watt) (C/Watt) Package Type Package Body Dimensions I/O Industrial (I)(1) XC2C256-6VQ100C 0.5mm 43.1 10.9 Very Thin Quad Flat Pack 14mm x 14mm 80 C XC2C256-7VQ100C 0.5mm 43.1 10.9 Very Thin Quad Flat Pack 14mm x 14mm 80 C XC2C256-6CP132C 0.5mm 65.0 15.0 Chip Scale Package 8mm x 8mm 106 C XC2C256-7CP132C 0.5mm 65.0 15.0 Chip Scale Package 8mm x 8mm 106 C XC2C256-6TQ144C 0.5mm 37.2 7.2 Thin Quad Flat Pack 20mm x 20mm 118 C XC2C256-7TQ144C 0.5mm 37.2 7.2 Thin Quad Flat Pack 20mm x 20mm 118 C XC2C256-6PQ208C 0.5mm 36.9 9.7 Plastic Quad Flat Pack 28mm x 28mm 173 C XC2C256-7PQ208C 0.5mm 36.9 9.7 Plastic Quad Flat Pack 28mm x 28mm 173 C XC2C256-6FT256C 1.0mm 34.6 6.1 Fine Pitch Thin BGA 17mm x 17mm 184 C XC2C256-7FT256C 1.0mm 34.6 6.1 Fine Pitch Thin BGA 17mm x 17mm 184 C XC2C256-6VQG100C 0.5mm 43.1 10.9 Very Thin Quad Flat Pack; Pb-free 14mm x 14mm 80 C XC2C256-7VQG100C 0.5mm 43.1 10.9 Very Thin Quad Flat Pack; Pb-free 14mm x 14mm 80 C XC2C256-6CPG132C 0.5mm 65.0 15.0 Chip Scale Package; Pb-free 8mm x 8mm 106 C XC2C256-7CPG132C 0.5mm 65.0 15.0 Chip Scale Package; Pb-free 8mm x 8mm 106 C XC2C256-6TQG144C 0.5mm 37.2 7.2 Thin Quad Flat Pack; Pb-free 20mm x 20mm 118 C XC2C256-7TQG144C 0.5mm 37.2 7.2 Thin Quad Flat Pack; Pb-free 20mm x 20mm 118 C XC2C256-6PQG208C 0.5mm 36.9 9.7 Plastic Quad Flat Pack; Pb-free 28mm x 28mm 173 C XC2C256-7PQG208C 0.5mm 36.9 9.7 Plastic Quad Flat Pack; Pb-free 28mm x 28mm 173 C XC2C256-6FTG256C 1.0mm 34.6 6.1 Fine Pitch Thin BGA; Pb-free 17mm x 17mm 184 C XC2C256-7FTG256C 1.0mm 34.6 6.1 Fine Pitch Thin BGA; Pb-free 17mm x 17mm 184 C XC2C256-7VQ100I 0.5mm 43.1 10.9 Very Thin Quad Flat Pack 14mm x 14mm 80 I XC2C256-7CP132I 0.5mm 65.0 15.0 Chip Scale Package 8mm x 8mm 106 I XC2C256-7TQ144I 0.5mm 37.2 7.2 Thin Quad Flat Pack 20mm x 20mm 118 I XC2C256-7PQ208I 0.5mm 36.9 9.7 Plastic Quad Flat Pack 28mm x 28mm 173 I XC2C256-7FT256I 1.0mm 34.6 6.1 Fine Pitch Thin BGA 17mm x 17mm 184 I 16 www.xilinx.com DS094 (v3.2) March 8, 2007 Product Specification XC2C256 CoolRunner-II CPLD R Commercia l (C) Pin/Ball Spacing Part Number JC JA (C/Watt) (C/Watt) Package Type Package Body Dimensions I/O Industrial (I)(1) XC2C256-7VQG100I 0.5mm 43.1 10.9 Very Thin Quad Flat Pack; Pb-free 14mm x 14mm 80 I XC2C256-7CPG132I 0.5mm 65.0 15.0 Chip Scale Package; Pb-free 8mm x 8mm 106 I XC2C256-7TQG144I 0.5mm 37.2 7.2 Thin Quad Flat Pack; Pb-free 20mm x 20mm 118 I XC2C256-7PQG208I 0.5mm 36.9 9.7 Plastic Quad Flat Pack; Pb-free 28mm x 28mm 173 I XC2C256-7FTG256I 1.0mm 34.6 6.1 Fine Pitch Thin BGA; Pb-free 17mm x 17mm 184 I Notes: 1. C = Commercial (TA = 0C to +70C); I = Industrial (TA = -40C to +85C). Standard Example: XC2C128 -6 TQ 144 Pb-Free Example: XC2C128 C -6 TQ G 144 C Device Speed Grade Package Type Pb-Free Number of Pins Temperature Range Device Speed Grade Package Type Number of Pins Temperature Range Device Part Marking R Device Type Package Speed Operating Range XC2Cxxx TQ144 This line not related to device part number 7C Part marking for non-chip scale package Figure 5: Sample Package with Part Marking Note: Due to the small size of chip scale packages, the complete ordering part number cannot be included on the package marking. Part marking on chip scale packages by line are: * * * Line 1 = X (Xilinx logo) then truncated part number Line 2 = Not related to device part number Line 3 = Not related to device part number DS094 (v3.2) March 8, 2007 Product Specification 1. Line 4 = Package code, speed, operating temperature, three digits not related to device part number. Package codes: C5 = CP132, C6 = CPG132. www.xilinx.com 17 XC2C256 CoolRunner-II CPLD I/O I/O I/O I/O I/O I/O I/O I/O I/O VCCIO2 I/O I/O I/O GND TDO I/O I/O I/O I/O I/O I/O I/O VCCIO2 VQ100 Top View 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 75 74 73 72 71 70 69 68 67 66 65 64 63 62 61 60 59 58 57 56 55 54 53 52 51 GND I/O I/O I/O I/O I/O GND I/O I/O I/O I/O I/O I/O GND I/O I/O I/O I/O VCC I/O I/O I/O I/O I/O VCCIO1 VCC I/O(2) I/O(5) I/O I/O GND I/O I/O I/O I/O I/O I/O VCCIO1 I/O I/O I/O I/O I/O I/O TDI I/O TMS TCK I/O I/O I/O(1) I/O(1) I/O(1) I/O(1) VAUX I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O VCCIO1 GND I/O(2) I/O(2) I/O(4) GND 100 99 98 97 96 95 94 93 92 91 90 89 88 87 86 85 84 83 82 81 80 79 78 77 76 GND I/O(3) R (1) - Global Output Enable (2) - Global Clock (3) - Global Set/Reset (4) - Clock Divide Reset (5) - Data Gate Figure 6: VQ100 Very Thin Quad Flat Pack 18 www.xilinx.com DS094 (v3.2) March 8, 2007 Product Specification 2 3 4 5 6 7 8 9 10 11 12 14 1 P VCC I/O(5) I/O GND I/O I/O VCCIO1 I/O I/O I/O I/O I/O VCCIO1 I/O N GND I/O(2) I/O I/O I/O I/O I/O I/O GND TMS I/O GND I/O I/O M I/O I/O(4) I/O I/O I/O I/O I/O I/O TDI TCK I/O I/O I/O I/O L I/O I/O(2) I/O I/O I/O I/O K I/O GND I/O(2) VCC I/O I/O J I/O I/O VCCIO1 I/O I/O GND H I/O I/O I/O I/O I/O GND G I/O I/O I/O I/O I/O VCCIO1 F I/O I/O I/O I/O I/O I/O E I/O I/O I/O I/O I/O GND D I/O I/O VAUX I/O I/O I/O C I/O I/O(1) I/O(1) VCCIO2 I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O B I/O I/O(1) GND I/O I/O I/O I/O I/O TDO I/O I/O I/O I/O GND A I/O(1) VCC I/O(3) I/O I/O I/O VCCIO2 I/O GND I/O I/O I/O I/O VCCIO2 CP132 Bottom View 13 XC2C256 CoolRunner-II CPLD R (1) - Global Output Enable (2) - Global Clock (3) - Global Set/Reset (4) - Clock Divide Reset (5) - DataGATE Enable Figure 7: CP132 Chip Scale Package DS094 (v3.2) March 8, 2007 Product Specification www.xilinx.com 19 XC2C256 CoolRunner-II CPLD VCC I/O(1) I/O(1) I/O I/O(1) I/O(1) I/O VAUX I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O 108 107 106 105 104 103 102 101 100 99 98 97 96 95 94 93 92 91 90 89 88 87 86 85 84 83 82 81 80 79 78 77 76 75 74 73 TQ144 Top View GND I/O I/O I/O I/O I/O I/O I/O I/O GND I/O I/O I/O I/O I/O VCCIO1 I/O I/O GND GND I/O I/O I/O I/O VCC I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O VCCIO1 VCCIO1 I/O I/O I/O I/O I/O I/O GND TDI I/O TMS I/O TCK I/O I/O I/O I/O GND VCC I/O(2) I/O(5) I/O I/O I/O I/O I/O I/O I/O GND I/O I/O I/O I/O I/O I/O I/O 37 38 39 40 41 42 43 44 45 46 47 48 49 50 51 52 53 54 55 56 57 58 59 60 61 62 63 64 65 66 67 68 69 70 71 72 VCCIO1 I/O GND I/O(2) I/O I/O(2) I/O I/O I/O(4) GND 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 144 143 142 141 140 139 138 137 136 135 134 133 132 131 130 129 128 127 126 125 124 123 122 121 120 119 118 117 116 115 114 113 112 111 110 109 GND I/O(3) I/O VCCIO2 I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O VCCIO2 I/O I/O I/O GND TDO I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O VCCIO2 R (1) - Global Output Enable (2) - Global Clock (3) - Global Set/Reset (4) - Clock Divide Reset (5) - DataGATE Enable Figure 8: TQ144 Thin Quad Flat Pack 20 www.xilinx.com DS094 (v3.2) March 8, 2007 Product Specification XC2C256 CoolRunner-II CPLD 208 207 206 205 204 203 202 201 200 199 198 197 196 195 194 193 192 191 190 189 188 187 186 185 184 183 182 181 180 179 178 177 176 175 174 173 172 171 170 169 168 167 166 165 164 163 162 161 160 159 158 157 I/O GND I/O(3) I/O VCCIO2 I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O GND I/O I/O I/O I/O I/O I/O I/O I/O VCCIO2 I/O I/O I/O GND TDO I/O I/O I/O VCCIO2 I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O VCCIO2 R 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 51 52 156 155 154 153 152 151 150 149 148 147 146 145 144 143 142 141 140 139 138 137 136 135 134 133 132 131 130 129 128 127 126 125 124 123 122 121 120 119 118 117 116 115 114 113 112 111 110 109 108 107 106 105 PQ208 Top View GND I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O GND I/O I/O I/O I/O I/O I/O I/O VCCIO2 VCCIO1 I/O GND GND I/O I/O I/O I/O VCC I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O VCCIO1 VCC I/O I/O(2) I/O I/O I/O(5) VCCIO1 I/O I/O I/O I/O I/O I/O I/O I/O GND I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O VCCIO1 I/O GND I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O VCCIO1 GND TDI I/O TMS I/O TCK I/O I/O I/O I/O I/O GND 53 54 55 56 57 58 59 60 61 62 63 64 65 66 67 68 69 70 71 72 73 74 75 76 77 78 79 80 81 82 83 84 85 86 87 88 89 90 91 92 93 94 95 96 97 98 99 100 101 102 103 104 VCC I/O I/O(1) I/O I/O(1) I/O I/O(1) I/O I/O(1) I/O VAUX I/O GND I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O GND I/O VCCIO2 I/O I/O I/O I/O I/O I/O VCCIO1 I/O I/O I/O I/O I/O I/O I/O I/O GND I/O I/O(2) I/O I/O(2) I/O I/O I/O I/O I/O(4) GND (1) - Global Output Enable (2) - Global Clock (3) - Global Set/Reset (4) - Clock Divide Reset (5) - DataGATE Enable Figure 9: PQ208 Quad Flat Package DS094 (v3.2) March 8, 2007 Product Specification www.xilinx.com 21 XC2C256 CoolRunner-II CPLD 12 11 10 9 8 7 6 5 I/O I/O I/O I/O TDO I/O I/O I/O I/O I/O I/O I/O I/O NC B I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O C I/O NC I/O I/O I/O I/O I/O I/O I/O I/O NC NC I/O(3) I/O NC I/O D NC I/O NC I/O VCC I/O I/O I/O I/O I/O NC VCC I/O(1) I/O(1) I/O NC E I/O I/O I/O I/O I/O I/O I/O I/O I/O NC NC I/O(1) I/O I/O(1) I/O NC F I/O I/O I/O I/O I/O GND GND I/O VAUX I/O I/O NC G I/O I/O I/O I/O NC I/O GND GND GND GND VCCIO2 I/O I/O I/O NC NC H I/O I/O I/O I/O I/O VCCIO2 GND GND GND GND VCCIO2 I/O I/O I/O I/O I/O J NC I/O I/O I/O I/O VCCIO1 GND GND GND GND VCCIO1 I/O I/O I/O I/O I/O K I/O I/O I/O VCC NC VCCIO1 GND GND GND GND VCCIO1 I/O I/O I/O I/O I/O L I/O I/O I/O I/O I/O GND GND I/O I/O I/O I/O I/O M I/O I/O I/O I/O I/O I/O NC NC I/O I/O I/O I/O NC I/O(2) I/O(2) I/O N I/O I/O I/O I/O TMS I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O P I/O I/O I/O I/O TCK NC I/O NC I/O I/O I/O I/O(2) I/O VCC I/O(4) I/O R I/O I/O I/O I/O I/O TDI I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O T I/O I/O NC NC NC NC I/O NC I/O I/O I/O I/O I/O I/O I/O(5) I/O VCCIO2 VCCIO2 VCCIO2 VCCIO2 VCCIO1 VCCIO1 VCCIO1 VCCIO1 FT256 Bottom View 1 13 I/O 2 14 I/O 3 15 A 4 16 R (1) - Global Output Enable (2) - Global Clock (3) - Global Set/Reset (4) - Clock Divide Reset (5) - DataGATE Enable Figure 10: FT256 Fine Pitch Thin BGA Warranty Disclaimer THESE PRODUCTS ARE SUBJECT TO THE TERMS OF THE XILINX LIMITED WARRANTY WHICH CAN BE VIEWED AT http://www.xilinx.com/warranty.htm. THIS LIMITED WARRANTY DOES NOT EXTEND TO ANY USE OF THE PRODUCTS IN AN APPLICATION OR ENVIRONMENT THAT IS NOT WITHIN THE SPECIFICATIONS STATED ON THE THEN-CURRENT XILINX DATA SHEET FOR THE PRODUCTS. PRODUCTS ARE NOT DESIGNED TO BE FAIL-SAFE AND ARE NOT WARRANTED FOR USE IN APPLICATIONS THAT POSE A RISK OF PHYSICAL HARM OR LOSS OF LIFE. USE OF PRODUCTS IN SUCH APPLICATIONS IS FULLY AT THE RISK OF CUSTOMER SUBJECT TO APPLICABLE LAWS AND REGULATIONS. 22 www.xilinx.com DS094 (v3.2) March 8, 2007 Product Specification XC2C256 CoolRunner-II CPLD R Additional Information Additional information is available for the following CoolRunner-II topics: * * * * * * XAPP784: Bulletproof CPLD Design Practices XAPP375: Timing Model XAPP376: Logic Engine XAPP378: Advanced Features XAPP382: I/O Characteristics XAPP389: Powering CoolRunner-II * XAPP399: Assigning VREF Pins To access these and all application notes with their associated reference designs, click the following link and scroll down the page until you find the document you want: CoolRunner-II Data Sheets and Application Notes Device Packages Revision History The following table shows the revision history for this document. Date Version Revision 05/09/02 1.0 Initial Xilinx release. 05/13/02 1.1 Updated AC Electrical Characteristics and added new parameters. 10/31/02 1.2 Corrected package user I/O, added Voltage Referenced DC tables. 03/17/03 2.0 Added Characterization numbers for product release and device part marking 04/02/03 2.1 Updated TSOL max from 260 to 220. Changed ICCSB units from mA to A. 01/26/04 2.2 Updated Device Part Marking. Updated links and Tsol. 02/26/04 2.3 Corrected Theta JC value on XC2C256-7TQ144. 08/03/04 2.4 Pb-free documentation 08/19/04 2.5 Changes to ICCSB maximum specifications in DC Electrical Characteristics table, on page 3. 10/01/04 2.6 Add Asynchronous Preset/Reset Pulse Width specification to AC Electrical Characteristics. 03/07/05 2.7 Removed -5 speed grade. Changes to Table 1, I/O Standards. 06/28/05 2.8 Move to Product Specification. Change to TIN25, TOUT25, TIN33, and TOUT33 for -7 speed grade. 03/20/06 2.9 Add Warranty Disclaimer. Add note to Pin Description table that GTS, GSR and GCK pins can be used for general purpose I/O. 5/20/06 3.0 Moved TCONFIG specification values from MIN column to MAX column, page 7. 02/15/07 3.1 Corrections to timing parameters tAOI, tPSUD, tPSU1, tPSU2, tPHD, tPCO, tPOE, tPAO, tAO, tSUEC, tCW, tCDRSU, and fTOGGLE for -6 speed grade. Corrections to tPSUD, tCW, and tCDRSU for the -7 speed grade. Values now match the software. There were no changes to silicon or characterization. Change to VIH specification for 2.5V and 1.8V LVCMOS. 03/08/07 3.2 Fixed typo in note for VIL for LVCMOS18; removed note for VIL for LVCMOS33. DS094 (v3.2) March 8, 2007 Product Specification www.xilinx.com 23