HLMP-AM64-144DD - Avago Technologies

HLMP-AG64/65, HLMP-AM64/65, HLMP-AB64/65

Precision Optical Performance Red Green and Blue

New 5mm Mini Oval LEDs

Data Sheet

Caution: INGaN devices are Class 1C HBM ESD sensitive per JEDEC Standard. Please observe appropriate

precautions during handling and processing. Refer to Application Note AN – 1142 for additional details.

Description

These Precision Optical Performance Oval LEDs are spe-

ci cally designed for full color/video and passenger infor-

mation signs. The oval shaped radiation pattern and high

luminous intensity ensure that these devices are excellent

for wide  eld of view outdoor applications where a wide

viewing angle and readability in sunlight are essential.

The package epoxy contains both UV-A and UV-B inhibi-

tors to reduce the e ects of long term exposure to direct

sunlight.

Features

 Well de ned spatial radiation pattern

 High brightness material

 Available in red, green and blue color

Red AlInGaP 626 nm

Green InGaN 525nm

Blue InGaN 470nm

 Superior resistance to moisture

 Stando Package

 Tinted and di used

 Typical viewing angle 30° x 70°

Applications

 Full color signs

Package Dimensions

Package drawing A

Package drawing B

Notes:

All dimensions in millimeters (inches).

5.20 ± 0.20

0.205 ± 0.008

8.70 ± 0.20

0.342 ± 0.008

2.54 ± 0.3

0.100 ± 0.012

1.00

0.038

3.80 ± 0.200

0.150 ± 0.008

min.

0.8

0.032

cathode lead

24.00

0.945

0.50 ± 0.10

0.020 ± 0.004

1.50 ± 0.15

0.0591 ± 0.006

11.70 ± 0.50

0.4606 ± 0.020

sq. typ.

8.70 ± 0.20

0.342 ± 0.008

5.20 ± 0.200

0.205 ± 0.008

24.00

0.945

0.70

0.028

0.8

0.032 0.50 ± 0.10

0.020 ± 0.004

sq. typ.

2.54 ± 0.3

0.100 ± 0.012

1.00

0.038

min.

cathode lead

max.

min.

0.70

0.028

max.

3.80 ± 0.200

0.150 ± 0.008

Device Selection Guide

Part Number

Color and Dominant

Wavelength d (nm) Typ

Luminous Intensity Iv

(mcd) at 20 mA-Min

Luminous Intensity Iv

(mcd) at 20 mA-Max Stando

Package

Drawing

HLMP-AG64-X10xx Red 626 1660 3500 No A

HLMP-AG65-X10xx Red 626 1660 3500 Yes B

HLMP-AM64-140xx Green 525 2900 6050 No A

HLMP-AM65-140xx Green 525 2900 6050 Yes B

HLMP-AB64-TW0xx Blue 470 800 1660 No A

HLMP-AB65-TW0xx Blue 470 800 1660 Yes B

Tolerance for each intensity limit is ± 15%.

Notes:

1. The luminous intensity is measured on the mechanical axis of the lamp package.

Part Numbering System

Note:

Please refer to AB 5337 for complete information about part numbering system.

Packaging Option

DD: Ammopack

ZZ: Flexi Ammopack

Color Bin Selection

0: Open distribution

Maximum Intensity Bin

0: No maximum intensity limit

Minimum Intensity Bin

Refer to Device Selection Guide.

Standoff/ Non Standoff

4: Non Standoff

5: Standoff

Color

G: Red 626

M: Green 525

B: Blue 470

Package

A: 5mm Mini Oval 30° x 70°

HLMP-A x 6x – x x x xx

Absolute Maximum Ratings

TA = 25°C

Parameter Red Green and Blue Unit

DC Forward Current [1] 50 30 mA

Peak Forward Current 100 [2] 100 [3] mA

Power Dissipation 120 116 mW

Reverse Voltage 5 (IR = 100 μA) 5 (IR = 10 μA) V

LED Junction Temperature 130 110 °C

Operating Temperature Range -40 to +100 -40 to +85 °C

Storage Temperature Range -40 to +100 -40 to +100 °C

Notes:

1. Derate linearly as shown in Figure 4 and Figure 8

2. Duty Factor 30%, frequency 1KHz.

3. Duty Factor 10%, frequency 1KHz.

Electrical / Optical Characteristics

TA = 25°C

Parameter Symbol Min. Typ. Max. Units Test Conditions

Forward Voltage

Red

Green

Blue

1.8

2.8

2.1

3.2

2.4

3.8

F = 20 mA

Reverse Voltage

Red

Green & blue

IF = 100 μA

IF = 10 μA

Dominant Wavelength [1]

Red

Green

Blue

d618

520

460

626

525

470

630

540

480

nm IF = 20 mA

Peak Wavelength

Red

Green

Blue

PEAK 634

516

464

nm Peak of Wavelength of

Spectral Distribution

at IF = 20 mA

Thermal Resistance RJ-PIN 240 °C/W LED Junction-to-Pin

Luminous E cacy [2]

Red

Green

Blue

V150

530

lm/W Emitted Luminous Power/

Emitted Radiant Power

Notes:

1. The dominant wavelength is derived from the chromaticity Diagram and represents the color of the lamp

2. The radiant intensity, Ie in watts per steradian, may be found from the equation Ie = IV/V where IV is the luminous intensity in candelas and V is

the luminous e cacy in lumens/watt.

0 0.5 1 1.5 2 2.5

FORWARD VOLTAGE - V

FORWARD CURRENT - mA

0.5

1.5

2.5

0 10 20 30 40 50

DC FORWARD CURRENT - mA

RELATIVE LUMINOUS INTENSITY

(NORMALIZED AT 20 mA)

0 20406080100

TA- AMBIENT TEMPERATURE - -C

IF MAX

- MAXIMUM FORWARD CURRENT - mA

0.2

0.4

0.6

0.8

550 600 650 700

WAVELENGTH - nm

RELATIVE INTENSITY

AlInGaP Red

Figure 1. Relative Intensity vs Wavelength Figure 2. Forward Current vs Forward Voltage

Figure 3. Relative Intensity vs Forward Current Figure 4. Maximum Forward Current vs Ambient Temperature

0.0

0.1

0.2

0.3

0.4

0.5

0.6

0.7

0.8

0.9

1.0

380 430 480 530 580 630

WAVELENGTH - nm

RELATIVE INTENSITY

GREENBLUE

0 1 2 3 4

FORWARD VOLTAGE -V

FORWARD CURRENT - mA

0.2

0.4

0.6

0.8

1.2

1.4

1.6

0 5 10 15 20 25 30 35

DC FORWARD CURRENT - mA

RELATIVE LUMINOUS INTENSITY

GREEN

BLUE

0 20 40 60 80 100

- AMBIENTTEMPERATURE - °C

IFmax - MAXIMUM FORWARD

CURRENT - mA

(NORMALIZE AT 20 mA)

-4

-2

0 5 10 15 20 25 30 35

GREEN

FORWARD CURRENT - mA

DOMINANT WAVELENGHT SHIFT - nm

BLUE

InGaN Blue and Green

Figure 5. Relative Intensity vs Wavelength Figure 6. Forward Current vs Forward Voltage

Figure 7. Relative Intensity vs Forward Current Figure 8. Maximum Forward Current vs Ambient Temperature

Figure 9. Relative dominant wavelength vs Forward Current

Figure 10. Radiation Pattern-Major Axis Figure 11. Radiation Pattern-Minor Axis

0.0

0.1

0.2

0.3

0.4

0.5

0.6

0.7

0.8

0.9

1.0

-90 -60 -30 0 30 60 90

ANGULAR DISPLACEMENT-DEGREE

NORMALIZED INTENSITY

0.0

0.1

0.2

0.3

0.4

0.5

0.6

0.7

0.8

0.9

1.0

-90 -60 -30 0 30 60 90

ANGULAR DISPLACEMENT - DEGREE

NORMALIZED INTENSITY

Green

Blue

Red

Green

Blue

Red

Green Color Bin Table

Bin

Min

Dom

Max

Dom Xmin Ymin Xmax Ymax

1 520.0 524.0 0.0743 0.8338 0.1856 0.6556

0.1650 0.6586 0.1060 0.8292

2 524.0 528.0 0.1060 0.8292 0.2068 0.6463

0.1856 0.6556 0.1387 0.8148

3 528.0 532.0 0.1387 0.8148 0.2273 0.6344

0.2068 0.6463 0.1702 0.7965

4 532.0 536.0 0.1702 0.7965 0.2469 0.6213

0.2273 0.6344 0.2003 0.7764

5 536.0 540.0 0.2003 0.7764 0.2659 0.6070

0.2469 0.6213 0.2296 0.7543

Tolerance for each bin limit is ± 0.5nm.

Blue Color Bin Table

Bin

Min

Dom

Max

Dom Xmin Ymin Xmax Ymax

1 460.0 464.0 0.1440 0.0297 0.1766 0.0966

0.1818 0.0904 0.1374 0.0374

2 464.0 468.0 0.1374 0.0374 0.1699 0.1062

0.1766 0.0966 0.1291 0.0495

3 468.0 472.0 0.1291 0.0495 0.1616 0.1209

0.1699 0.1062 0.1187 0.0671

4 472.0 476.0 0.1187 0.0671 0.1517 0.1423

0.1616 0.1209 0.1063 0.0945

5 476.0 480.0 0.1063 0.0945 0.1397 0.1728

0.1517 0.1423 0.0913 0.1327

Tolerance for each bin limit is ± 0.5nm

Note:

1. All bin categories are established for classi cation of products.

Products may not be available in all bin categories. Please contact

your Avago representative for further information.

Intensity Bin Limit Table (1.2: 1 Iv Bin Ratio)

Bin

Intensity (mcd) at 20 mA

Min Max

T 800 960

U 960 1150

V 1150 1380

W 1380 1660

X 1660 1990

Y 1990 2400

Z 2400 2900

1 2900 3500

2 3500 4200

3 4200 5040

4 5040 6050

Tolerance for each bin limit is ± 15%

VF Bin Table (V at 20mA)

Bin ID Min Max

VD 1.8 2.0

VA 2.0 2.2

VB 2.2 2.4

Notes:

1. Tolerance for each bin limit is ±0.05V

2. VF binning only applicable to Red color.

Red Color Range

Min Dom

Max

Dom Xmin Ymin Xmax Ymax

618 630 0.6872 0.3126 0.6890 0.2943

0.6690 0.3149 0.7080 0.2920

Tolerance for each bin limit is ± 0.5nm

Relative Light Output vs Junction Temperature

Avago Color Bin on CIE 1931 Chromaticity Diagram

TJ - JUNCTION TEMPERATURE - °C

RELATIVE LIGHT OUTPUT

(NORMALIZED AT TJ = 25°C)

0.1

-40 -20 0 20 40 60 80 100 120 140

Red

Blue

Green

Green 5

Red

Blue

0.000

0.200

0.400

0.600

0.800

1.000

0.000 0.100 0.200 0.300 0.400 0.500 0.600 0.700 0.800

Precautions:

Lead Forming:

 The leads of an LED lamp may be preformed or cut to

length prior to insertion and soldering on PC board.

 For better control, it is recommended to use proper

tool to precisely form and cut the leads to applicable

length rather than doing it manually.

 If manual lead cutting is necessary, cut the leads after

the soldering process. The solder connection forms a

mechanical ground which prevents mechanical stress

due to lead cutting from traveling into LED package.

This is highly recommended for hand solder operation,

as the excess lead length also acts as small heat sink.

Soldering and Handling:

 Care must be taken during PCB assembly and soldering

process to prevent damage to the LED component.

 LED component may be e ectively hand soldered

to PCB. However, it is only recommended under

unavoidable circumstances such as rework. The closest

manual soldering distance of the soldering heat source

(soldering iron’s tip) to the body is 1.59mm. Soldering

the LED using soldering iron tip closer than 1.59mm

might damage the LED.

 ESD precaution must be properly applied on the

soldering station and personnel to prevent ESD

damage to the LED component that is ESD sensitive.

Do refer to Avago application note AN 1142 for details.

The soldering iron used should have grounded tip to

ensure electrostatic charge is properly grounded.

 Recommended soldering condition:

Wave

Soldering [1, 2]

Manual Solder

Dipping

Pre-heat temperature 105 °C Max. -

Preheat time 60 sec Max -

Peak temperature 260 °C Max. 260 °C Max.

Dwell time 5 sec Max. 5 sec Max

Note:

1. Above conditions refers to measurement with thermocouple

mounted at the bottom of PCB.

2. It is recommended to use only bottom preheaters in order to

reduce thermal stress experienced by LED.

 Wave soldering parameters must be set and maintained

according to the recommended temperature and dwell

time. Customer is advised to perform daily check on the

soldering pro le to ensure that it is always conforming

to recommended soldering conditions.

Note:

1. PCB with di erent size and design (component density) will have

di erent heat mass (heat capacity). This might cause a change in

temperature experienced by the board if same wave soldering

setting is used. So, it is recommended to re-calibrate the soldering

pro le again before loading a new type of PCB.

2. Avago Technologies’ AllnGaP high brightness LED are using high

e ciency LED die with single wire bond as shown below. Customer

is advised to take extra precaution during wave soldering to ensure

that the maximum wave temperature does not exceed 260°C and the

solder contact time does not exceeding 5sec. Over-stressing the LED

during soldering process might cause premature failure to the LED

due to delamination.

Avago Technologies LED con guration

Note: Electrical connection between bottom surface of LED die and

the lead frame is achieved through conductive paste.

 Any alignment  xture that is being applied during

wave soldering should be loosely  tted and should

not apply weight or force on LED. Non metal material

is recommended as it will absorb less heat during wave

soldering process.

 At elevated temperature, LED is more susceptible to

mechanical stress. Therefore, PCB must allowed to cool

down to room temperature prior to handling, which

includes removal of alignment  xture or pallet.

 If PCB board contains both through hole (TH) LED and

other surface mount components, it is recommended

that surface mount components be soldered on the

top side of the PCB. If surface mount need to be on the

bottom side, these components should be soldered

using re ow soldering prior to insertion the TH LED.

 Recommended PC board plated through holes (PTH)

size for LED component leads.

LED component

lead size Diagonal

Plated through

hole diameter

0.45 x 0.45 mm

(0.018x 0.018 inch)

0.636 mm

(0.025 inch)

0.98 to 1.08 mm

(0.039 to 0.043 inch)

0.50 x 0.50 mm

(0.020x 0.020 inch)

0.707 mm

(0.028 inch)

1.05 to 1.15 mm

(0.041 to 0.045 inch)

 Over-sizing the PTH can lead to twisted LED after

clinching. On the other hand under sizing the PTH can

cause di culty inserting the TH LED.

Refer to Application Note 5334 for more information about soldering

and handling of high brightness TH LED lamps.

1.59mm

AlInGaP Device

CATHODE

InGaN Device

ANDOE

Example of Wave Soldering Temperature Pro le for TH LED

Recommended solder:

Sn63 (Leaded solder alloy)

SAC305 (Lead free solder alloy)

Flux: Rosin ﬂux

Solder bath temperature: 255°C ± 5°C

(maximum peak temperature = 260°C)

Dwell time: 3.0 sec - 5.0 sec

(maximum = 5sec)

Note: Allow for board to be suﬃciently

cooled to room temperature before

exerting mechanical force.

60 sec Max

TIME (sec)

260°C Max

105°C Max

TEMPERATURE (°C)

Ammo Packs Drawing

6.35 ± 1.30

0.250 ± 0.051

9.125 ± 0.625

0.3595 ± 0.0245

18.00 ± 0.50

0.7085 ± 0.0195

12.70 ± 0.30

0.500 ± 0.012

20.5 ± 1.00

0.8070 ± 0.0394

12.70 ± 1.00

0.500 ± 0.039

CATHODE

VIEW A - A

0.70 ± 0.20

0.276 ± 0.0075

4.00 ± 0.20

0.1575 ± 0.0075 TYP.

Note: All dimensions in millimeters (inches)

Packaging Label

(i) Avago Mother Label: (Available on packaging box of ammo pack and shipping box)

(1P) Item: Part Number

(1T) Lot: Lot Number

LPN:

(9D)MFG Date: Manufacturing Date

(P) Customer Item:

(V) Vendor ID:

DeptID: Made In: Country of Origin

(Q) QTY: Quantity

CAT: Intensity Bin

BIN: Refer to below information

(9D) Date Code: Date Code

STANDARD LABEL LS0002

RoHS Compliant

e3 max temp 260C

Packaging Box for Ammo Packs

Note: For InGaN device, the ammo pack packaging box contain ESD logo

LABEL ON THIS

SIDE OF BOX

FROM LEFT SIDE OF BOX

ADHESIVE TAPE MUST BE

FACING UPWARDS.

ANODE LEAD LEAVES

THE BOX FIRST.

For product information and a complete list of distributors, please go to our web site: www.avagotech.com

Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies in the United States and other countries.

AV02-1510EN - April 18, 2011

Acronyms and De nition:

BIN:

(i) Color bin only or VF bin only (Applicable for part

number with color bins but without VF bin OR part

number with VF bins and no color bin)

(ii) Color bin incorporated with VF Bin (Applicable for part

number that have both color bin and VF bin)

(ii) Avago Baby Label (Only available on bulk packaging)

Example:

(i) Color bin only or VF bin only

BIN: 2 (represent color bin 2 only)

BIN: VB (represent VF bin “VB” only)

(ii) Color bin incorporate with VF Bin

DISCLAIMER: AVAGO’S PRODUCTS AND SOFTWARE ARE NOT SPECIFICALLY DESIGNED, MANUFACTURED

OR AUTHORIZED FOR SALE AS PARTS, COMPONENTS OR ASSEMBLIES FOR THE PLANNING, CONSTRUCTION,

MAINTENANCE OR DIRECT OPERATION OF A NUCLEAR FACILITY OR FOR USE IN MEDICAL DEVICES OR APPLI-

CATIONS. CUSTOMER IS SOLELY RESPONSIBLE, AND WAIVES ALL RIGHTS TO MAKE CLAIMS AGAINST AVAGO

OR ITS SUPPLIERS, FOR ALL LOSS, DAMAGE, EXPENSE OR LIABILITY IN CONNECTION WITH SUCH USE.

BIN: 2VB

VB: VF bin “VB”

2: Color bin 2 only

(1P) PART #: Part Number

(1T) LOT #: Lot Number

(9D)MFG DATE: Manufacturing Date

C/O: Country of Origin

Customer P/N:

Supplier Code:

QUANTITY: Packing Quantity

CAT: Intensity Bin

BIN: Refer to below information

DATECODE: Date Code

RoHS Compliant

e3 max tem

260C

Lam

s Bab

Label