LM4910
LM4910 Output Capacitor-less Stereo 35mW Headphone Amplifier
Literature Number: SNAS151G
January 2007
LM4910
Output Capacitor-less Stereo 35mW Headphone Amplifier
General Description
The LM4910 is an audio power amplifier primarily designed
for headphone applications in portable device applications. It
is capable of delivering 35mW of continuous average power
to a 32 load with less than 1% distortion (THD+N) from a
3.3VDC power supply.
The LM4910 utilizes a new circuit topology that eliminates
output coupling capacitors and half-supply bypass capacitors.
The LM4910 contains advanced pop & click circuitry which
eliminates noises caused by transients that would otherwise
occur during turn-on and turn-off.
Boomer audio power amplifiers were designed specifically to
provide high quality output power with a minimal amount of
external components. Since the LM4910 does not require any
output coupling capacitors, half-supply bypass capacitors, or
bootstrap capacitors, it is ideally suited for low-power portable
applications where minimal space and power consumption
are primary requirements.
The LM4910 features a low-power consumption shutdown
mode, activated by driving the shutdown pin with logic low.
Additionally, the LM4910 features an internal thermal shut-
down protection mechanism. The LM4910 is also unity-gain
stable and can be configured by external gain-setting resis-
tors.
Key Specifications
PSRR at f = 217Hz 65dB (typ)
Power Output at VDD = 3.3V, RL = 32Ω, and
THD 1%
35mW
(typ)
Shutdown Current 0.1µA (typ)
Features
Eliminates headphone amplifier output coupling
capacitors
Eliminates half-supply bypass capacitor
Advanced pop & click circuitry eliminates noises during
turn-on and turn-off
Ultra-low current shutdown mode
Unity-gain stable
2.2V - 5.5V operation
Available in space-saving MSOP, LLP, and SOIC
packages
Applications
Mobile Phones
PDAs
Portable electronics devices
Portable MP3 players
Typical Application
20030565
FIGURE 1. Typical Audio Amplifier Application Circuit
Boomer® is a registered trademark of National Semiconductor Corporation.
© 2007 National Semiconductor Corporation 200305 www.national.com
LM4910 Output Capacitor-less Stereo 35mW Headphone Amplifier
Connection Diagrams
MSOP/SO Package
20030502
Top View
Order Number LM4910MM or LM4910MA
See NS Package Number MUA08A or M08A
MSOP Marking
20030566
Top View
G - Boomer Family
C2 - LM4910MM
SO Marking
20030567
Top View
TT - Die Traceability
Bottom 2 lines - Part Number
LLP Package
20030595
Top View
Order Number LM4910LQ
See NS package Number LQB08A
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LM4910
Absolute Maximum Ratings (Note 2)
If Military/Aerospace specified devices are required,
please contact the National Semiconductor Sales Office/
Distributors for availability and specifications.
Supply Voltage (Note 9) 6.0V
Storage Temperature −65°C to +150°C
Input Voltage -0.3V to VDD + 0.3V
Power Dissipation (Note 3) Internally Limited
ESD Susceptibility Pin 6 (Note 10) 10kV
ESD Susceptibility (Note 4) 2000V
ESD Susceptibility (Note 5) 200V
Junction Temperature 150°C
Thermal Resistance
 θJC (MSOP) 56°C/W
 θJA (MSOP) 190°C/W
 θJC (SOP) 35°C/W
 θJA (SOP) 150°C/W
 θJC (LQ) 57°C/W
 θJA (LQ) 140°C/W
Operating Ratings
Temperature Range
TMIN TA TMAX −40°C T A 85°C
Supply Voltage (VDD) 2.2V VCC 5.5V
Electrical Characteristics VDD = 3.3V (Notes 1, 2)
The following specifications apply for VDD = 3.3V, AV = 1, and 32 load unless otherwise specified. Limits apply to TA = 25°C.
Symbol Parameter Conditions LM4910 Units
(Limits)
Typ
(Note 6)
Limit
(Notes 7,
8)
IDD Quiescent Power Supply Current VIN = 0V, 32 Load 3.5 6 mA (max)
ISD Standby Current VSHUTDOWN = GND 0.1 1.0 µA (max)
VOS Output Offset Voltage 5 30 mV (max)
POOutput Power THD = 1% (max); f = 1kHz 35 30 mW (min)
THD+N Total Harmonic Distortion + Noise PO = 30mWrms; f = 1kHz 0.3 %
PSRR Power Supply Rejection Ratio VRIPPLE = 200mVp-p sinewave
Input terminated with 10 to ground
65 (f =
217Hz)
65 (f =
1kHz)
dB
VIH Shutdown Input Voltage High 1.5 V (min)
VIL Shutdown Input Voltage Low 0.4 V (max)
Electrical Characteristics VDD = 3V (Notes 1, 2)
The following specifications apply for VDD = 3V, AV = 1, and 32 load unless otherwise specified. Limits apply to TA = 25°C.
Symbol Parameter Conditions LM4910 Units
(Limits)
Typ
(Note 6)
Limit
(Notes 7,
8)
IDD Quiescent Power Supply Current VIN = 0V, 32 Load 3.3 6 mA (max)
ISD Standby Current VSHUTDOWN = GND 0.1 1.0 µA (max)
VOS Output Offset Voltage 5 30 mV (max)
POOutput Power THD = 1% (max); f = 1kHz 30 25 mW (min)
THD+N Total Harmonic Distortion + Noise PO = 25mWrms; f = 1kHz 0.3 %
PSRR Power Supply Rejection Ratio VRIPPLE = 200mVp-p sinewave
Input terminated with 10 to ground
65 (f = 217
Hz)
65 (f =
1kHz)
dB
VIH Shutdown Input Voltage High 1.5 V (min)
VIL Shutdown Input Voltage Low 0.4 V (max)
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LM4910
Electrical Characteristics VDD = 2.6V (Notes 1, 2)
The following specifications apply for VDD = 2.6V, AV = 1, and 32 load unless otherwise specified. Limits apply to TA = 25°C.
Symbol Parameter Conditions LM4910 Units
(Limits)
Typ
(Note 6)
Limit
(Notes 7,
8)
IDD Quiescent Power Supply Current VIN = 0V, 32 Load 3.0 mA (max)
ISD Standby Current VSHUTDOWN = GND 0.1 µA (max)
VOS Output Offset Voltage 5 mV (max)
POOutput Power THD = 1% (max); f = 1kHz 13 mW
THD+N Total Harmonic Distortion + Noise PO = 10mWrms; f = 1kHz 0.3 %
PSRR Power Supply Rejection Ratio VRIPPLE = 200mVp-p sinewave
Input terminated with 10 to ground
55 (f =
217Hz)
55 (f =
1kHz)
dB
Note 1: All voltages are measured with respect to the GND pin unless otherwise specified.
Note 2: Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for which the device is
functional but do not guarantee specific performance limits. Electrical Characteristics state DC and AC electrical specifications under particular test conditions
which guarantee specific performance limits. This assumes that the device is within the Operating Ratings. Specifications are not guaranteed for parameters
where no limit is given, however, the typical value is a good indication of device performance.
Note 3: The maximum power dissipation must be derated at elevated temperatures and is dictated by TJMAX, θJA, and the ambient temperature, TA. The maximum
allowable power dissipation is PDMAX = (TJMAX - TA)/ θJA or the number given in Absolute Maximum Ratings, whichever is lower. For the LM4910, see power
derating currents for more information.
Note 4: Human body model, 100pF discharged through a 1.5k resistor.
Note 5: Machine Model, 220pF-240pF discharged through all pins.
Note 6: Typicals are measured at 25°C and represent the parametric norm.
Note 7: Limits are guaranteed to National's AOQL (Average Outgoing Quality Level).
Note 8: Datasheet min/max specification limits are guaranteed by design, test, or statistical analysis.
Note 9: If the product is in shutdown mode and VDD exceeds 6V (to a max of 8V VDD) then most of the excess current will flow through the ESD protection circuits.
If the source impedance limits the current to a max of 10ma then the part will be protected. If the part is enabled when VDD is above 6V circuit performance will
be curtailed or the part may be permanently damaged.
Note 10: Human body model, 100pF discharged through a 1.5k resistor, Pin 6 to ground.
External Components Description
(Figure 1)
Components Functional Description
1. RIInverting input resistance which sets the closed-loop gain in conjunction with Rf. This resistor also forms a high-
pass filter with Ci at fc = 1/(2πRiCi).
2. CIInput coupling capacitor which blocks the DC voltage at the amplifier's input terminals. Also creates a high-pass
filter with Ri at fc = 1/(2πRiCi). Refer to the section Proper Selection of External Components, for an explanation
of how to determine the value of Ci.
3. RfFeedback resistance which sets the closed-loop gain in conjunction with Ri.
4. CSSupply bypass capacitor which provides power supply filtering. Refer to the Power Supply Bypassing section for
information concerning proper placement and selection of the supply bypass capacitor.
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LM4910
Typical Performance Characteristics
THD+N vs Frequency
20030506
THD+N vs Frequency
20030507
THD+N vs Frequency
20030508
THD+N vs Frequency
20030509
THD+N vs Frequency
20030510
THD+N vs Frequency
20030511
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LM4910
THD+N vs Output Power
20030516
THD+N vs Output Power
20030517
THD+N vs Output Power
20030515
THD+N vs Output Power
20030518
THD+N vs Output Power
20030519
THD+N vs Output Power
20030520
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LM4910
Output Power vs
Load Resistance
20030523
Output Power vs
Load Resistance
20030578
Output Power vs
Load Resistance
20030579
Output Power vs
Supply Voltage
20030580
Output Power vs
Supply Voltage
20030581
Power Dissipation vs
Output Power
20030530
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LM4910
Power Dissipation vs
Output Power
20030582
Power Dissipation vs
Output Power
20030529
Channel Separation
20030583
Power Supply Rejection Ratio
20030535
Power Supply Rejection Ratio
20030584
Power Supply Rejection Ratio
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LM4910
Open Loop Frequency Response
20030586
Noise Floor
20030587
Frequency Response vs
Input Capacitor Size
20030588
Supply Current vs
Supply Voltage
20030589
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LM4910
Application Information
ELIMINATING OUTPUT COUPLING CAPACITORS
Typical single-supply audio amplifiers that drive single-ended
(SE) headphones use a coupling capacitor on each SE out-
put. This output coupling capacitor blocks the half-supply
voltage to which the output amplifiers are typically biased and
couples the audio signal to the headphones. The signal return
to circuit ground is through the headphone jack's sleeve.
The LM4910 eliminates these output coupling capacitors.
Amp3 is internally configured to apply a bandgap referenced
voltage (VREF = 1.58V) to a stereo headphone jack's sleeve.
This voltage matches the quiescent voltage present on the
Amp1 and Amp2 outputs that drive the headphones. The
headphones operate in a manner similar to a bridge-tied-load
(BTL). The same DC voltage is applied to both headphone
speaker terminals. This results in no net DC current flow
through the speaker. AC current flows through a headphone
speaker as an audio signal's output amplitude increases on
the speaker's terminal.
The headphone jack's sleeve is not connected to circuit
ground. Using the headphone output jack as a line-level out-
put will place the LM4910's bandgap referenced voltage on a
plug's sleeve connection. This presents no difficulty when the
external equipment uses capacitively coupled inputs. For the
very small minority of equipment that is DC-coupled, the
LM4910 monitors the current supplied by the amplifier that
drives the headphone jack's sleeve. If this current exceeds
500mAPK, the amplifier is shutdown, protecting the LM4910
and the external equipment.
ELIMINATING THE HALF-SUPPLY BYPASS CAPACITOR
Typical single-supply audio amplifers are normally biased to
1/2VDD in order to maximize the output swing of the audio
signal. This is usually achieved with a simple resistor divider
network from VDD to ground that provides the proper bias
voltage to the amplifier. However, this scheme requires the
use of a half-supply bypass capacitor to improve the bias
voltage's stability and the amplifier's PSRR performance.
The LM4910 utilizes an internally generated, buffered
bandgap reference voltage as the amplifier's bias voltage.
This bandgap reference voltage is not a direct function of
VDD and therefore is less susceptible to noise or ripple on the
power supply line. This allows for the LM4910 to have a stable
bias voltage and excellent PSRR performance even without
a half-supply bypass capacitor.
OUTPUT TRANSIENT ('CLICK AND POPS') ELIMINATED
The LM4910 contains advanced circuitry that virtually elimi-
nates output transients ('clicks and pops'). This circuitry pre-
vents all traces of transients when the supply voltage is first
applied or when the part resumes operation after coming out
of shutdown mode. The LM4910 remains in a muted condition
until there is sufficient input signal magnitude (>5mVRMS, typ)
to mask any remaining transient that may occur. Figure 2
shows the LM4910's lack of transients in the differential signal
(Trace B) across a 320 load. The LM4910's active-low SHUT-
DOWN pin is driven by the logic signal shown in Trace A.
Trace C is the VO1 output signal and Trace D is the VO3 output
signal.
To ensure optimal click and pop performance under low gain
configurations (less than 0dB), it is critical to minimize the RC
combination of the feedback resistor RF and stray input ca-
pacitance at the amplifier inputs. A more reliable way to lower
gain or reduce power delivered to the load is to place a current
limiting resistor in series with the load as explained in the
Minimizing Output Noise / Reducing Output Power sec-
tion.
20030592
FIGURE 2.
AMPLIFIER CONFIGURATION EXPLANATION
As shown in Figure 1, the LM4910 has three operational am-
plifiers internally. Two of the amplifier's have externally con-
figurable gain while the other amplifier is internally fixed at the
bias point acting as a unity-gain buffer. The closed-loop gain
of the two configurable amplifiers is set by selecting the ratio
of Rf to Ri. Consequently, the gain for each channel of the IC
is
AV = -(Rf/Ri)
By driving the loads through outputs VO1 and VO2 with VO3
acting as a buffered bias voltage the LM4910 does not require
output coupling capacitors. The typical single-ended amplifier
configuration where one side of the load is connected to
ground requires large, expensive output coupling capacitors.
A configuration such as the one used in the LM4910 has a
major advantage over single supply, single-ended amplifiers.
Since the outputs VO1, VO2, and VO3 are all biased at VREF =
1.58V, no net DC voltage exists across each load. This elim-
inates the need for output coupling capacitors that are re-
quired in a single-supply, single-ended amplifier configura-
tion. Without output coupling capacitors in a typical single-
supply, single-ended amplifier, the bias voltage is placed
across the load resulting in both increased internal IC power
dissipation and possible loudspeaker damage.
POWER DISSIPATION
Power dissipation is a major concern when designing a suc-
cessful amplifier. A direct consequence of the increased pow-
er delivered to the load by a bridge amplifier is an increase in
internal power dissipation. The maximum power dissipation
for a given application can be derived from the power dissi-
pation graphs or from Equation 1.
PDMAX = 4(VDD) 2 / (π2RL) (1)
It is critical that the maximum junction temperature TJMAX of
150°C is not exceeded. Since the typical application is for
headphone operation (32 impedance) using a 3.3V supply
the maximum power dissipation is only 138mW. Therefore,
power dissipation is not a major concern.
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LM4910
POWER SUPPLY BYPASSING
As with any amplifier, proper supply bypassing is important
for low noise performance and high power supply rejection.
The capacitor location on the power supply pins should be as
close to the device as possible.
Typical applications employ a 3.3V regulator with 10µF tan-
talum or electrolytic capacitor and a ceramic bypass capacitor
which aid in supply stability. This does not eliminate the need
for bypassing the supply nodes of the LM4910. A bypass ca-
pacitor value in the range of 0.1µF to 1µF is recommended
for CS.
MICRO POWER SHUTDOWN
The voltage applied to the SHUTDOWN pin controls the
LM4910's shutdown function. Activate micro-power shutdown
by applying a logic-low voltage to the SHUTDOWN pin. When
active, the LM4910's micro-power shutdown feature turns off
the amplifier's bias circuitry, reducing the supply current. The
trigger point is 0.4V(max) for a logic-low level, and 1.5V(min)
for a logic-high level. The low 0.1µA(typ) shutdown current is
achieved by applying a voltage that is as near as ground as
possible to the SHUTDOWN pin. A voltage that is higher than
ground may increase the shutdown current.
There are a few ways to control the micro-power shutdown.
These include using a single-pole, single-throw switch, a mi-
croprocessor, or a microcontroller. When using a switch,
connect an external 100k pull-up resistor between the
SHUTDOWN pin and VDD. Connect the switch between the
SHUTDOWN pin and ground. Select normal amplifier opera-
tion by opening the switch. Closing the switch connects the
SHUTDOWN pin to ground, activating micro-power shut-
down. The switch and resistor guarantee that the SHUT-
DOWN pin will not float. This prevents unwanted state
changes. In a system with a microprocessor or microcon-
troller, use a digital output to apply the control voltage to the
SHUTDOWN pin. Driving the SHUTDOWN pin with active
circuitry eliminates the pull-up resistor.
SELECTING EXTERNAL COMPONENTS
Selecting proper external components in applications using
integrated power amplifiers is critical to optimize device and
system performance. While the LM4910 is tolerant of external
component combinations, consideration to component values
must be used to maximize overall system quality.
The LM4910 is unity-gain stable which gives the designer
maximum system flexibility. The LM4910 should be used in
low gain configurations to minimize THD+N values, and max-
imize the signal to noise ratio. Low gain configurations require
large input signals to obtain a given output power. Input sig-
nals equal to or greater than 1Vrms are available from sources
such as audio codecs. Very large values should not be used
for the gain-setting resistors. Values for Ri and Rf should be
less than 1M. Please refer to the section, Audio Power
Amplifier Design, for a more complete explanation of proper
gain selection
Besides gain, one of the major considerations is the closed-
loop bandwidth of the amplifier. To a large extent, the band-
width is dictated by the choice of external components shown
in Figure 1. The input coupling capacitor, Ci, forms a first order
high pass filter which limits low frequency response. This val-
ue should be chosen based on needed frequency response
and turn-on time.
SELECTION OF INPUT CAPACITOR SIZE
Amplifiying the lowest audio frequencies requires a high value
input coupling capacitor, Ci. A high value capacitor can be
expensive and may compromise space efficiency in portable
designs. In many cases, however, the headphones used in
portable systems have little ability to reproduce signals below
60Hz. Applications using headphones with this limited fre-
quency response reap little improvement by using a high
value input capacitor.
In addition to system cost and size, turn-on time is affected
by the size of the input coupling capacitor Ci. A larger input
coupling capacitor requires more charge to reach its quies-
cent DC voltage. This charge comes from the output via the
feedback Thus, by minimizing the capacitor size based on
necessary low frequency response, turn-on time can be min-
imized. A small value of Ci (in the range of 0.1µF to 0.39µF),
is recommended.
USING EXTERNAL POWERED SPEAKERS
The LM4910 is designed specifically for headphone opera-
tion. Often the headphone output of a device will be used to
drive external powered speakers. The LM4910 has a differ-
ential output to eliminate the output coupling capacitors. The
result is a headphone jack sleeve that is connected to VO3
instead of GND. For powered speakers that are designed to
have single-ended signals at the input, the click and pop cir-
cuitry will not be able to eliminate the turn-on/turn-off click and
pop. Unless the inputs to the powered speakers are fully dif-
ferential the turn-on/turn-off click and pop will be very large.
AUDIO POWER AMPLIFIER DESIGN
A 30mW/32 Audio Amplifier
Given:
Power Output 30mWrms
Load Impedance 32Ω
Input Level 1Vrms
Input Impedance 20k
A designer must first determine the minimum supply rail to
obtain the specified output power. By extrapolating from the
Output Power vs Supply Voltage graphs in the Typical Per-
formance Characteristics section, the supply rail can be
easily found.
Since 3.3V is a standard supply voltage in most applications,
it is chosen for the supply rail in this example. Extra supply
voltage creates headroom that allows the LM4910 to repro-
duce peaks in excess of 30mW without producing audible
distortion. At this time, the designer must make sure that the
power supply choice along with the output impedance does
no violate the conditions explained in the Power Dissipa-
tion section.
Once the power dissipation equations have been addressed,
the required differential gain can be determined from Equa-
tion 2.
(2)
From Equation 2, the minimum AV is 0.98; use AV = 1. Since
the desired input impedance is 20k, and with AV equal to 1,
a ratio of 1:1 results from Equation 1 for Rf to Ri. The values
are chosen with Ri = 20k and Rf = 20kΩ.
The last step in this design example is setting the amplifier's
−3dB frequency bandwidth. To achieve the desired ±0.25dB
pass band magnitude variation limit, the low frequency re-
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LM4910
sponse must extend to at least one-fifth the lower bandwidth
limit and the high frequency response must extend to at least
five times the upper bandwidth limit. The gain variation for
both response limits is 0.17dB, well within the ±0.25dB de-
sired limit. The results are an
fL = 100Hz/5 = 20Hz (3)
and an
fH = 20kHz x 5 = 100kHz (4)
As mentioned in the Selecting Proper External Compo-
nents section, Ri and Ci create a highpass filter that sets the
amplifier's lower bandpass frequency limit. Find the coupling
capacitor's value using Equation (3).
Ci 1/(2πR ifL) (5)
The result is
1/(2π*20kΩ*20Hz) = 0.397µF
Use a 0.39µF capacitor, the closest standard value.
The high frequency pole is determined by the product of the
desired frequency pole, fH, and the differential gain, AV. With
an AV = 1 and fH = 100kHz, the resulting GBWP = 100kHz
which is much smaller than the LM4910 GBWP of 11MHz.
This figure displays that if a designer has a need to design an
amplifier with higher differential gain, the LM4910 can still be
used without running into bandwidth limitations.
MINIMIZING OUTPUT NOISE / REDUCING OUTPUT POWER
20030568
FIGURE 3.
Output noise delivered to the load can be minimized with the
use of an external resistor, RSERIES, placed in series with each
load as shown in Figure 3. RSERIES forms a voltage divider
with the impedance of the headphone driver RL. As a result,
output noise is attenuated by the factor RL / (RL + RSERIES).
Figure 4 illustrates the relationship between output noise and
RSERIES for different loads. RSERIES also decreases output
power delivered to the load by the factor RL / (RL + RSERIES)
2. However, this may not pose a problem since most head-
phone applications require less than 10mW of output power.
Figure 5 illustrates output power (@1% THD+N) vs RSERIES
for different loads.
Figure 4 shows an optional resistor connected between the
amplifier output that drives the headphone jack sleeve and
ground. This resistor provides a ground path that supressed
power supply hum. This hum may occur in applications such
as notebook computers in a shutdown condition and con-
nected to an external powered speaker. The resistor's 100
value is a suggested starting point. Its final value must be de-
termined based on the tradeoff between the amount of noise
suppression that may be needed and minimizing the addi-
tional current drawn by the resistor (25mA for a 100 resistor
and a 5V supply).
ESD PROTECTION
As stated in the Absolute Maximum Ratings, pin 6 (Vo3) on
the LM4910 has a maximum ESD susceptibility rating of
10kV. For higher ESD voltages, the addition of a PCDN042
dual transil (from California Micro Devices), as shown in Fig-
ure 4, will provide additional protection.
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LM4910
20030594
FIGURE 4. The PCDN042 provides additional ESD protection beyond the 10kV shown in the Absolute Maximum Ratings
for the Vo3 output
Output Noise vs RSERIES
20030590
FIGURE 5.
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LM4910
Output Power vs RSERIES
20030591
FIGURE 6.
HIGHER GAIN AUDIO AMPLIFIER
20030593
FIGURE 7.
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LM4910
The LM4910 is unity-gain stable and requires no external
components besides gain-setting resistors, input coupling ca-
pacitors, and proper supply bypassing in the typical applica-
tion. However, if a very large closed-loop differential gain is
required, a feedback capacitor (Cf) may be needed as shown
in Figure 6 to bandwidth limit the amplifier. This feedback ca-
pacitor creates a low pass filter that eliminates possible high
frequency oscillations. Care should be taken when calculating
the -3dB frequency in that an incorrect combination of Rf and
Cf will cause frequency response roll off before 20kHz. A typ-
ical combination of feedback resistor and capacitor that will
not produce audio band high frequency roll off is Rf = 20k
and Cf = 25pF. These components result in a -3dB point of
approximately 320kHz.
REFERENCE DESIGN BOARD and LAYOUT GUIDELINES
MSOP & SO BOARDS
20030569
FIGURE 8.
(Note: RPU2 is not required. It is used for test measurement purposes only.)
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LM4910
LM4910 SO DEMO BOARD ARTWORK
Composite View
20030570
Silk Screen
20030571
Top Layer
20030572
Bottom Layer
20030573
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LM4910
LM4910 MSOP DEMO BOARD ARTWORK
Composite View
20030574
Silk Screen
20030575
Top Layer
20030576
Bottom Layer
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LM4910
LM4910 LLP DEMO BOARD ARTWORK
Composite View
20030597
Silk Screen
20030598
Top Layer
20030599
Bottom Layer
20030596
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LM4910
LM4910 Reference Design Boards
Bill of Materials
Part Description Qty Ref Designator
LM4910 Mono Reference Design Board 1
LM4910 Audio AMP 1 U1
Tantalum Cap 1µF 16V 10 1 Cs
Ceramic Cap 0.39µF 50V Z50 20 2 Ci
Resistor 20k 1/10W 5 4 Ri, Rf
Resistor 100k 1/10W 5 1 Rpu
Jumper Header Vertical Mount 2X1, 0.100 1 J1
PCB LAYOUT GUIDELINES
This section provides practical guidelines for mixed signal
PCB layout that involves various digital/analog power and
ground traces. Designers should note that these are only
"rule-of-thumb" recommendations and the actual results will
depend heavily on the final layout.
Minimization of THD
PCB trace impedance on the power, ground, and all output
traces should be minimized to achieve optimal THD perfor-
mance. Therefore, use PCB traces that are as wide as pos-
sible for these connections. As the gain of the amplifier is
increased, the trace impedance will have an ever increasing
adverse affect on THD performance. At unity-gain (0dB) the
parasitic trace impedance effect on THD performance is re-
duced but still a negative factor in the THD performance of
the LM4910 in a given application.
GENERAL MIXED SIGNAL LAYOUT RECOMMENDATION
Power and Ground Circuits
For two layer mixed signal design, it is important to isolate the
digital power and ground trace paths from the analog power
and ground trace paths. Star trace routing techniques (bring-
ing individual traces back to a central point rather than daisy
chaining traces together in a serial manner) can greatly en-
hance low level signal performance. Star trace routing refers
to using individual traces to feed power and ground to each
circuit or even device. This technique will require a greater
amount of design time but will not increase the final price of
the board. The only extra parts required may be some
jumpers.
Single-Point Power / Ground Connections
The analog power traces should be connected to the digital
traces through a single point (link). A "PI-filter" can be helpful
in minimizing high frequency noise coupling between the ana-
log and digital sections. Further, place digital and analog
power traces over the corresponding digital and analog
ground traces to minimize noise coupling.
Placement of Digital and Analog Components
All digital components and high-speed digital signal traces
should be located as far away as possible from analog com-
ponents and circuit traces.
Avoiding Typical Design / Layout Problems
Avoid ground loops or running digital and analog traces par-
allel to each other (side-by-side) on the same PCB layer.
When traces must cross over each other do it at 90 degrees.
Running digital and analog traces at 90 degrees to each other
from the top to the bottom side as much as possible will min-
imize capacitive noise coupling and cross talk.
Revision History
Rev Date Description
1.0 7/12/05 Released to the WEB.
1.1 01/16/07 Deleted the phrase “patent pending” on
page 1.
19 www.national.com
LM4910
Physical Dimensions inches (millimeters) unless otherwise noted
MSOP
Order Number LM4910MM
NS Package Number MUA08A
SO
Order Number LM4910MA
NS Package Number M08A
www.national.com 20
LM4910
LQ
Order Number LM4910LQ
NS Package Number LQB08A
21 www.national.com
LM4910
Notes
LM4910 Output Capacitor-less Stereo 35mW Headphone Amplifier
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