BT121-A-V2-IAP - SILICON LABS - Datasheet.Directory

BT121 BLUETOOTH SMART READY MODULE

DATA SHEET

Wednesday, 25 September 2019

Document Version: 1.61

Silicon Labs

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Labs reserves the right to change products or specifications without notice and does not make any commitment

to update the information herein.

Silicon Labs’ products are not authorized for use as critical components in life support devices or systems.

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Information is subject to change without notice.

Silicon Labs

VERSION HISTORY

Date Edited

Comment

1.0

First release of document

1.1

Minor updates

1.2

Minor updates

1.3

Power consumption measurements

1.4

Revised power consumption measurements

1.41

FCC, IC, Japan and Korea certification info updated

1.42

Various corrections and edits, corrected front page +10dBm LE power

number and RF specification +9dBm both to the +7dBm setting used in the

module for regulatory compliance

1.43

Wake-up pin section added

1.44

Mass production part numbers added to ordering code list.

1.45

Typo corrections related to the note concerning I2C 2.

I2C 2 can be used only in Alt 2 configuration.

1.46

Certificates section under FCC separation between human body and antenna

changed from 9 mm to 7 mm.

SWD bus clarification : PA13 = SWDIO and PA14 = SWCLK

1.47

Altered outline and footprint drawings to render properly in PDF

1.48

Sleep mode current updated

1.49

Reset description elaborated, fixed I2C schematic, added number of

piconets, wake-up sources corrected

1.50

Fixed SPI slave select descriptions

1.51

SDK and SDA pins in Figure 21 corrected to SCL and SDA with correct

placement

1.52

Minor changes

1.53

Contact information updated

1.6

Added dimension details for the 8 center pads for programming and testing

Editorial and layout fixes

Silicon Labs

1.61

Corrected the maximum number of simultaneous connections

Corrected Bluetooth version compliance

 
                                                              Silicon Labs                                                       5 
 
TABLE OF CONTENTS 
 BT121 overview  7 
1 Key Features  7 
2 Typical applications  8 
3 Block diagram  8 
 Design guidelines  9 
1 PCB layout recommendations  9 
2 Power supply recommendations  9 
3 Software application related options  9 
4 Firmware updating related recommendations  9 
 Pin-out description  11 
1 Power, ground, reset, RF and boot loader pins  11 
2 GPIO pins  12 
 Power control  13 
1 Power supply requirements  13 
2 Power saving functionality  13 
3 Reset  14 
4 Recovery mode  15 
5 Clock signals  15 
 Interfaces  16 
1 GPIO  16 
2 UART  17 
3 I2C  17 
4 SPI 17 
5 ADC  17 
6 DAC  17 
7 Real-time clock  17 
8 Microcontroller programming interface  17 
 Antenna  18 
1 Effect on antenna matching of a plastic sheet placed near the antenna  18 
2 Effect on antenna matching of a metal sheet placed under the antenna  20 
3 Effect on antenna matching of a metal sheet placed against the end of the module  21 
4 Measured antenna efficiency  22 
5 Measured 2D radiation patterns  23 
6 Measured 3D radiation patterns  25 
 Bluetooth Stack Software  26 
 Host interface  27 

 
                                                              Silicon Labs                                                       6 
 
8.1 UART  27 
 Connection examples  28 
9.1 Connecting an external host using the UART interface  28 
9.2 Connecting an external device using SPI interface  29 
9.3 Connecting an external device using I2C interface  30 
 Electrical characteristics  31 
10.1 Absolute maximum ratings  31 
10.2 Recommended operating conditions  31 
10.3 Logic signal characteristics  32 
10.4 Power consumption  34 
 RF Characteristics  36 
11.1 Supported frequencies and channels  36 
11.2 Typical receiver sensitivity  36 
11.3 Transmitter output power  36 
11.4 Carrier frequency accuracy  36 
 Physical dimensions  37 
 Soldering recommendations  39 
13.1 Soldering profile example  40 
 Tape and reel packaging  41 
14.1 Reel material and dimensions  41 
14.2 Tape material and dimensions  41 
14.3 Tape and reel box dimensions  42 
14.4 Module orientation in tape  42 
 Certifications  43 
15.1 Bluetooth  43 
15.2 CE 43 
15.3 FCC  43 
15.4 IC 44 
15.5 MIC Japan  46 
15.6 KC (South-Korea)  46 
 Ordering information  47 
 Contact Information  48 
 
  

Silicon Labs 7

BT121 overview

BT121 is a Bluetooth Smart Ready module targeted for applications that require both Bluetooth Smart and

Classic connectivity. It can connect to legacy devices that only support Bluetooth SPP or Apple® iAP2 profiles

as well to devices that support Bluetooth Smart. BT121 integrates a high performance Bluetooth radio, a low-

power ARM Cortex micro-controller and a Bluegiga Bluetooth Smart Ready stack software marking it extremely

easy-to-use as no RF or Bluetooth software development is needed. BT121 can be used as a modem together

with a separate host MCU, but applications can also be embedded into the built-in ARM® Cortex® MCU with the

Bluegiga BGScriptTM scripting language.

1.1 Key Features

Bluetooth features

• Bluetooth 4.1 Smart Ready compliant

• Master and slave modes

• Up to 6 x BR/EDR connections

• Up to 7 x BLE connections

• 1 x BR/EDR + 6 x BLE connections

simultaneously

• Scatternet: 3 simultaneous piconets, 1 as

master + 2 as slaves

Radio features

• Integrated antenna

• TX Power

o +12 dBm with Bluetooth BR/EDR

o +8 dBm with Bluetooth LE

• RX Sensitivity

o -96 dBm

• 200-400 meter LoS range

Software features

• Integrated Bluetooth Smart Ready Stack

• SPP, iAP2, HID and GATT over BR Bluetooth

profiles

• Any GATT based Bluetooth Smart profile

• 1000 kbps throughput over SPP

• BGAPITM serial protocol API over UART for

network co-processor usage

• BGLIBTM host C library which implements

BGAPI serial protocol

• BGScriptTM scripting language for standalone

usage

• Profile ToolkitTM for creating GATT based

services

Hardware interfaces

• UART host interface

• 2 x SPI, UART and 2 x I2C peripheral interfaces

• Up to 22 x GPIO with interrupts

• 4 x 12-bit ADC

• Internal battery voltage measurement option

Microcontroller

• ARM Cortex M0

• 48 MHz

• 16kB RAM

• 128kB flash

Electrical characteristics

• Supply voltage: 2.2V to 3.6V

• Supply voltage: 2.4V to 3.6V when using ADC

Environmental and regulatory

• Temperature range: -40C to +85C

• Bluetooth, CE, FCC and IC, Japan and South-Korea

qualified

Dimensions:

• 11.0 mm x 13.9 mm x 2.2 mm (W x L x H)

Silicon Labs 8

1.2 Typical applications

BT121 can be used in a wide variety of applications such as cable replacement, HID devices, health and fitness,

PoS (point-of-sales), M2M connectivity, automotive aftermarket, industrial and home automation gateways and

others.

1.3 Block diagram

The block diagram for Bluegiga Bluetooth Smart Ready module BT121 is shown in below.

Figure 1 BT121 Bluetooth Smart Ready module block diagram

Silicon Labs 9

Design guidelines

Certain hardware related design guidelines should always be followed when developing applications based on

the BT121 module.

2.1 PCB layout recommendations

• All ground pads should be connected to a ground plane.

• The antenna layout should follow the example shown in Figure 2 below and avoid the designs shown

as crossed over.

• BT121 requires minimal free space around the module and only the white area marked in the PCB

picture series presented in Figure 2 below needs to be free of copper and components.

Figure 2 PCB layout recommendations for BT121 application boards

2.2 Power supply recommendations

The regulator used must be capable of supplying a peak current of 150 mA and the regulator must be of a type

stable with ceramic capacitors.

2.3 Software application related options

BT121 can be used either as a stand-alone solution by using the Bluegiga BGScript™ scripting language or

alternatively if the application software size or other factors require together with an external host processor by

using Bluegiga BGAPI™ commands. The decision on which approach to use is most often dictated by the limits

set by the internal memory of the BT121 module.

2.4 Firmware updating related recommendations

To enable firmware updating an external UART interface connection as shown in Figure 3 on the next page is

mandatory. BT121 firmware can be updated through the UART interface by holding the host MCU in reset state

which typically will free the UART lines to be used by the update interface.

Silicon Labs 10

Figure 3 BT121 firmware update via UART connection example

Silicon Labs 11

Pin-out description

This section contains a description of the BT121 pin-out. Each pin may have one or more functions which are

all listed in tables. The pin-out is shown in Figure 4 below.

Figure 4 BT121 pin-out (top view)

3.1 Power, ground, reset, RF and boot loader pins

Power supply, ground, reset signal, RF antenna input/output and boot loader related pins are listed in Table 1

below.

Pin / Pad

Function

Description

30,34

VDD

Module power supply input pins.

1, 2, 3, 13, 21,

31, 32, 33, 41

GND

Ground pin. These are all connected together internally but they should all be individually

connected directly to a solid ground plane with vias in close proximity to the pins. This requirement

concerns especially the antenna connections.

22,40

RESET

Module reset signal pins. Pulling RESET low will reset the internal processor of the module. These

connections have an internal pull-up and can be left floating if not needed. The RESET pin s forced

low internally on power-on. External reset sources should be open drain.

23,35

BOOT0

Boot mode pin of the microcontroller internal boot loader. This connection has an internal pull-

down and should be left floating or pulled low in normal operation.

If the Bluegiga DFU is overwritten or disabled, pulling BOOT0 high at reset will allow DFU to be

rewritten through the UART (serial port interface).

Table 1 Power, ground, reset, RF and boot loader pins

Silicon Labs 12

3.2 GPIO pins

General purpose I/O pins and their functions are listed below.

PERIPHERAL

FUNCTION

GPIO NAME

PA7

PA6

PA5

PA4

PB3

PB4

PB5

PB6

PB7

PB8

PB9

PB10

PB12

PB13

PB14

PB15

PA13

PA14

RTS

PA12

CTS

PA11

RX

PA10

TX

PA9

PIN NUMBER

4

5

6

7

8

9

10

11

12

14

15

16

17

18

19

20

24

25

26

37

27

36

28

38

29

39

DEFAULT

FUNCTION **

dc

RTS

CTS

RX

TX

5V TOLERANT

N

Y

UART ***

RTS

CTS

RX

TX

SPI 1

Alt.1

MOSI

MISO

SCK

Alt.2

SCK

MISO

MOSI

SPI 2

Alt.1

SCK

MISO

MOSI

Alt.2

SCK

MISO

MOSI

I2C 1

Alt.1

SCL

SDA

Alt.2

SCL

SDA

I2C 2

Alt.1

Alt.2

SCL

SDA

DAC output

AO2

AO1

ADC input

AIN7

AIN6

AIN5

AIN4

Interrupt

channel

7

6

5

4

3

4

5

6

7

8

9

10

12

13

14

15

13

14

12

11

10

9

Table 2 General purpose I/O pins and their functions

GPIO pins 36, 37, 38 and 39

** Default pin functions on production firmware / dc = disconnected, no need to pull up or down Reserved for production testing

*** UART can be used as a BGAPI™ host interface and DFU firmware updates Must be left unconnected

If the pins are set as GPIO rather than UART signals the DFU cannot work, see UART (Section 5.2 ) and recovery mode (Section 4.4 )

I2C 2 can be used only Alt. 2 configuration

Silicon Labs 13

Power control

4.1 Power supply requirements

BT121 is powered by a single power supply input (VDD). Nominal input voltage is 3.3 VDC and input voltage

range 2.2 V to 3.6 V. If the module’s internal ADC and/or DAC functions are used minimum allowed power

supply voltage is 2.4V.

The VDD supply should be capable of supplying a peak current of at least 150 mA even though the average

current consumption of BT121 will be much less than that. External high frequency bypass capacitors are not

needed because the module contains the necessary power supply filtering capacitors.

Careful design of the layout and proper component selection are necessary to prevent switching noise from

appearing on the supply line. Such disturbances can be caused by on-board charge pump converters (e.g.

RS232 level shifters). Charge pump based converters tend to have strong switching spikes which are difficult

to filter out and may degrade RF performance. A ferrite chip can be added in series with the supply line close

to the module supply pin to reduce RF interference through the supply line.

There is a total of about 1.5 µF of ceramic capacitors on the VDD line inside the module. When using low drop

linear regulators to generate a regulated supply voltage for the VDD line, the stability of the regulator with the

low ESR provided by these capacitors should be checked. Many linear regulators and some switched mode

ones too are not stable when used with ceramic output capacitors. The regulator datasheets usually have

recommendations for output capacitor ESR range or they contain a stability curve to help select components

properly. A regulator designated as “stable with ceramic capacitors” is recommended.

4.2 Power saving functionality

BT121 contains two configurable power saving modes. The internal RTC (Real Time Clock) is usually kept

always running to avoid the long wake-up time associated with the internal 32 kHz crystal oscillator. The RTC

is always available to wake up the module.

4.2.1 Power mode 1

Power mode 1 is a shallow sleep state with all clocks and peripherals running but with the processor core

stopped. It is used automatically and has no impact on module performance and does not require special

considerations in user applications. See Table 3 on next page.

4.2.2 Power mode 2

Power mode 2 is a deep sleep state, in which most peripheral devices and system clocks are powered down.

The UART interfaces cannot operate without clocks, and instant communications with the host are not possible.

A separate wake-up pin can be used to wake up the module, which will stay on as long as the wakeup pin is

held high. GPIO interrupts, activity on the radio and RTC interrupts can also cause a wake-up event. There is a

short wake-up delay due to the time required for the internal clocks to stabilize and because of this the module

processor is not instantly ready to receive data. See Table 3 on next page.

4.2.3 Wake-up pin functionality

This feature can be used to prevent to Bluetooth module from entering a sleep mode or alternatively can be

used to wake it up from a sleep mode. If the sleep modes have been enabled in the hardware configuration file

(see Bluetooth Smart Ready Configuration Guide) and use UART to communicate with the module, then this

feature must be enabled and the wake-up pin must be asserted before sending any data or BGAPI commands

to the module, and also kept asserted until the last byte has been transferred into the module over the UART.

Silicon Labs 14

The wake-up pin functionality can only be assigned to a single GPIO, but it is still possible to assign normal

GPIO interrupts to other pins. The difference between the wake-up pin and normal GPIO interrupts is that the

wake-up pin will not only generate the interrupt which wakes the module, but will also keep the module awake

as long as it is held in the asserted state. Normal GPIO interrupts can wake the module from any state but after

the interrupt event handler completes the module will return to sleep.

There is always a delay before the module wakes up. It is possible to measure the wake-up time by measuring

when flow control starts to work. Data should not be sent before the module has waken up to prevent data loss.

Monitor the RTS/CTS signal to detect when the module has waken up. There is no special command separately

to wake up the module.

Power

mode

CPU

clocks

CPU

core

Radio

Wakeup

delay

UART

Current

consumption *

Active

ON

Running

On

-

Active

10 - 20 mA

Power mode 1

ON

Sleep

On

< 1μs

Active

4 - 10 mA

Power mode 2

OFF

Stopped

On

< 7 μs

Off

50 - 100 μA

Table 3 Power modes with corresponding wakeup delays and current consumption

* Current consumption with radio inactive

The logic flow of the power saving modes in relation to each other is shown in Figure 5 below. It is to be noted

that the processor will not lose RAM contents regardless of the power mode used.

Figure 5 Power modes in relation to each other and to active mode

4.3 Reset

BT121 can be reset by several methods: by pulling the RESET pin low, by the internal system power-up reset

functionality or by the internal watchdog timer. The RESET pin is internally connected to a pull-up resistor with

a resistance of approximately 40 kohm. The RESET pin should be connected to a push-button, header or test

point to enable the use of the system recovery mode.

Silicon Labs 15

On an internal reset, the RESET pin will be briefly pulled low internally. It is recommended that an external reset

source is of an open drain type.

4.4 Recovery mode

Pulling the BOOT0 pin high at reset sets the BT121 module’s internal microcontroller into a recovery mode,

which allows the Bluegiga DFU to be rewritten to the module using the BGTOOL software. The BOOT0 pin

should be connected to a header or test point to enable DFU recovery. The pin is internally connected to a 10

kohm pull-down resistor.

4.5 Clock signals

BT121 generates all the required clock signals internally. The clocks used by the internal microcontroller and

external peripherals are synchronized to an internal 32.768 kHz crystal connected to the internal RTC. The

micro power RTC is always kept running when the module is supplied with power. It will take approximately two

seconds for the RTC oscillator to stabilize after power is connected. To avoid this delay it is recommended that

the power supply feed to the BT121 is not switched off but instead the module can be set into the lowest power

mode providing the smallest current consumption.

Silicon Labs 16

Interfaces

5.1 GPIO

BT121 contains a number of pins which can be configured to operate as general purpose digital I/O’s, analog

inputs or outputs or to be used in combination with various built-in functions. The module contains I2C, SPI,

UART, touch pad sensing and various timer functions. Most of the pins are 5V tolerant. All GPIO pins can drive

currents of up to +/- 8 mA (up to 20mA with relaxed voltage specifications).

5.1.1 GPIO interrupts

Any GPIO signal can be assigned an interrupt function. However, the module microcontroller has a limited

number of interrupt channels available for GPIO’s. The microcontroller has two separate GPIO ports, with the

external signals divided between the two. An interrupt can be assigned to a specific port signal number from

either port, but not for the same number on both ports simultaneously. The principle of GPIO interrupt

multiplexing on the Bluegiga Bluetooth Smart Ready module BT121 is shown in Figure 6 below.

Figure 6 GPIO interrupt multiplexing scheme

Silicon Labs 17

5.2 UART

There is one UART port available on the BT121. By default, it is used for BGAPI™ host interface but with

BGScript™ it can be used as an application UART. The UART supports all standard baud rates up to 4 Mbps.

RTS/CTS handshake scheme is supported and recommended for every application for reliable data transfer.

5.3 I2C

BT121 has up to two I2C ports available. Both support standard mode up to 100 kbps, fast modes up to 400

kbps and Fast Mode Plus with improved drive capability and clock stretching up to 1 Mbps.

5.4 SPI

BT121 has up to two SPI ports available. Both can be configured for frame sizes from 4 to 16 bits and clock

frequencies up to 18 MHz. Both ports provide internal CRC calculation. Software-controlled GPIO’s should be

used as slave select signals.

5.5 ADC

BT121 contains a 4-channel 12-bit ADC with multiple external input sources as well as an internal battery

measurement and temperature measurement possibility. ADC input voltage range is 0 to VDD.

5.5.1 Accessory functions of the ADC

In addition to the external ADC inputs an internal temperature sensor or internal supply voltage divider can be

selected as the input to ADC.

Power supply range when using internal ADC functions is 2.4 to 3.6 VDC.

5.6 DAC

BT121 contains a 2-channel 12-bit DAC, with two independent outputs. DAC output voltage range is 0 to VDD.

Power supply range when using internal DAC functions is 2.4 to 3.6 VDC.

5.7 Real-time clock

BT121 contains a real-time clock (RTC) with full calendar support and sub-second resolution. The RTC can be

used for periodic or specifically programmed wakeups. The RTC is clocked by an internal crystal oscillator which

is always on as long as power is supplied to the module.

5.8 Microcontroller programming interface

The preferred method of programming the BT121 is by using the Bluegiga DFU through the UART host interface.

A problem may occur if the DFU is disabled by disabling the UART or if the DFU is overwritten accidentally.

Then the DFU would need to be re-uploaded.

The two methods of DFU uploading are through the SWD interface (PA13 = SWDIO and PA14 = SWCKLK)

using an ARM serial debug adapter, or by forcing the BOOT0 signal high and by resetting the module to make

it boot into a recovery mode. Then the BGTool software can be used to recover the DFU through the UART

interface.

Silicon Labs 18

Antenna

The internal chip antenna on the BT121 uses the application board ground plane as part of the antenna, and

requires at least 20 mm of ground plane on both sides of the module to radiate with optimal efficiency. BT121

must be placed on the application board edge, preferably roughly in the middle of the board edge. The ground

plane can be internal to the application PCB, allowing components to be placed on both sides of the module

and on both sides of the application board. The module ground pads in the antenna end should be connected

to the main ground plane layer with vias in immediate proximity of the pins. Thermal reliefs on the ground pins

have a negligible effect on antenna performance. Typical antenna matching curves are shown in Figure 7

below.

Figure 7 Typical antenna matching

The antenna used on the BT121 is quite robust with regard to adverse effects of close-by metallic materials.

The PCB thickness will not affect the antenna operation significantly. The application board can be installed with

the PCB bottom side and the antenna edge directly against a plastic casing without adverse effects. On the

module top side, there should be at least 3 mm of clearance to the nearest object.

The antenna requires a 7.5 x 3.4 mm sized copper clearance in all layers, with no components or traces on the

opposite side of the PCB from the antenna. Sufficient metal clearance is mandatory because the antenna will

not function at all without a sufficient opening in the ground plane.

Any metal in close proximity of the antenna will prevent the antenna from radiating freely. It is recommended

not to place any metal or other conductive objects closer than 10 mm to the antenna except in the directions of

the application board ground planes.

A board cutout is not required for the antenna. In fact, a cutout would cause the antenna to be detuned which

in turn will degrade range significantly. The module is also not to be placed in a cut-out recess on the board

edge or in the middle of the board which has a central cutout.

On the following pages are examples on how plastic or metal sheets in several different orientations and

distances to the antenna effect antenna matching.

6.1 Effect on antenna matching of a plastic sheet placed near the antenna

As an example on how a plastic sheet placed in the vicinity of the module and/or antenna effect the antenna

matching we can examine Figure 8 below.

Violet curve: with thermal reliefs

Blue curve: without thermal reliefs

Silicon Labs 19

Figure 8 Proximity effect of a 3 mm plastic sheet on antenna matching with different placements

Blue curve

Plastic sheet under antenna touching PCB

Violet curve

Plastic sheet against antenna at module end

Yellow curve

Plastic sheets under antenna touching PCB

and against antenna at module end

Silicon Labs 20

6.2 Effect on antenna matching of a metal sheet placed under the antenna

As an example on how a metal sheet placed in the vicinity of the module and/or antenna effect the antenna

matching we can examine Figure 9 below.

Figure 9 Effect of a metal sheet placed under the antenna on antenna matching

Violet curve

Metal sheet under antenna touching PCB

Blue curve

Same as on the left but distance is 1 mm

Silicon Labs 21

6.3 Effect on antenna matching of a metal sheet placed against the end of the

module

As an example on how a metal sheet placed in the vicinity of the module and/or antenna effect the antenna

matching we can examine Figure 10 below.

Figure 10 Effect of a metal sheet placed under the antenna on antenna matching

Violet curve

Metal sheet against end of module end

Violet curve

Metal sheet at module end 5 mm distance

Silicon Labs 22

6.4 Measured antenna efficiency

The measured antenna efficiency as a function of frequency is shown in Figure 11 below.

Figure 11 Antenna efficiency related to frequency

Figure 12 Impact of the size of GND plane to the range of BT121

Silicon Labs 23

6.5 Measured 2D radiation patterns

Typical radiation patters of the BT121 module on the DKBT carrier board as 2D plots are shown below in Figure

13 (view from module side), Figure 14 (view from antenna end) and on the following page in Figure 15 (view

from above module).

Figure 13 Typical 2D radiation pattern for BT121 with view from module side

Figure 14 Typical 2D radiation pattern for BT121 with view from antenna end side

Silicon Labs 24

Figure 15 Typical 2D radiation pattern for BT121 with view from above module

Silicon Labs 25

6.6 Measured 3D radiation patterns

Typical radiation patters of the BT121 module on the DKBT carrier board as 3D plots are shown below. Figure

16 represents a radiation pattern from module end side opposite to antenna and Figure 17 from above the

module.

Figure 16 Typical 3D radiation pattern for BT121 with view from module end opposite to antenna

Figure 17 Typical 3D radiation pattern for BT121 with view from above the module

Silicon Labs 26

Bluetooth Stack Software

Bluegiga's Bluetooth Smart Ready Software is a complete Bluetooth Smart Ready software stack for BT121

Bluetooth Smart Ready module. The software implements a full Bluetooth BR/EDR and LE compatible Bluetooth

Stack and L2CAP, RFCOMM, SMP and ATT protocols as well as Bluetooth SPP, HID, Apple iAP2, GATT over

BT profiles and any GATT based Bluetooth Smart profile.

The Bluetooth Smart Ready Software also is supported by a complete SDK for developing Bluetooth Smart

Ready applications using either an external host or BGAPITM serial protocol over UART or fully standalone

applications based on a simple scripting language called BGScriptTM.

Several profiles and software project examples are offered as part of the Bluetooth Smart Ready SDK to help

expedite the development of Bluetooth Smart Ready compatible end-user products.

The main parts of the Bluegiga Bluetooth Smart Ready software stack are shown below.

Figure 18 Bluegiga Bluetooth Smart Ready software stack

To learn more about the Bluetooth Smart Ready software stack, the SDK and the APIs please

read Bluetooth Smart Ready Software Getting Started Guide.

Silicon Labs 27

Host interface

8.1 UART

For applications where an external host such as MCU is used BT121 can be controlled over the UART interface

using the BGAPITM serial protocol.

For reliable communications can data transfer the hardware flow control RTS/CTS signals must be used in the

UART interface.

It is also recommended that the accuracy of the clock of the controlling host should be 1% or better for the

UART signaling to work reliably with speeds exceeding 115200 kbps (maximum baud rate is 4 Mbps).

Default UART settings are listed below:

Parameter

Default setting

UART baud rate

115200

RTS/CTS flow

control

Enabled

Data bits

8

Parity

None

Stop bits

1

Table 4 BT121 UART interface default settings

Silicon Labs 28

Connection examples

The following sections show how to connect a Bluegiga Bluetooth Smart Ready module with various external

devices using the UART, SPI and I2C interface.

9.1 Connecting an external host using the UART interface

The connection to an external host is done using the UART interface of the module. This interface is also used

for module reprogramming using the DFU method and thus an optional connector should be provided on the

application PCB to allow reprogramming if needed. A typical solution then is to hold the host in reset state which

will keep the UART pins of the host floating, allowing the interface to be used for programming the module by

using e.g. a PC and suitable software. See Figure 19 .

40

GND

PA7

PA6

PA5

PA4

PB3

PB4

PB5

PB6

PB7

GND

PA11

GND

VDD

PA9

PA10

PA12

PA14

PA13

BOOT0

RESET

GND

VDD

PA10

RESET

BOOT0

PA12

PA9

GND

PB8

PB9

PB10

PB12

PB13

PB14

1

2

3

4

5

6

7

8

9

10

11

12

13

14 15 16 17 18 19

PB15

20

RX

RTS

33

32

31

30

29

28

26

25

24

23

22

21

34

36

38

41

35

37

39

BT121

RESERVED FOR

PRODUCTION PROGRAMMING

TX

TOP VIEW

27

PA11 CTS

BT121

UART

3V3

EXTERNAL HOST

MICROPROCESSOR

3V3

RX

TX

RTS

CTS

VDD

VSS

HOST

UART

GND NC RX TX RTS CTS RST VDD

RESET

3V3

OPTIONAL CONNECTOR ON APPLICATION PCB

ALLOWS CONTROL AND REFLASH OF MODULE

FOR EXAMPLE FROM A PC

Figure 19 Connecting an external host with BT121 using UART

Silicon Labs 29

9.2 Connecting an external device using SPI interface

Bluegiga Bluetooth Smart Ready module BT121 contains two physical SPI peripherals (SPI 1 and SPI2) each

with alternative configurations (Alt 1 and Alt 2). All of the four optional configurations can be used to connect

different types of peripheral devices to the module. Pin configurations for the four SPI interface options are listed

in Table 2. An example of this type of interfacing is shown in Figure 20 below. In the example below a generic

EEPROM memory peripheral chip is connected to the BT121 using the SPI 1 Alt 2 option.

Figure 20 Connecting an external device with BT121 using SPI interface

Silicon Labs 30

9.3 Connecting an external device using I2C interface

Bluegiga Bluetooth Smart Ready module BT121 contains two physical I2C peripherals (I2C 1 and I2C 2). I2C 1

has two alternatives (Alt 1 and Alt 2) and I2C 2 one alternative (Alt 2). All of the three optional configurations can

be used to connect different types of peripheral devices with the module. Pin configurations for the three I2C

interface options are listed in Table 2. An example of this type of interfacing is shown in Figure 21 below. Note

the pull-up resistors on the SDA and SCL lines. The example shows the address/chip select lines of the generic

peripherals hardwired to VDD but in practice all or some of them would be wired to GPIO pins of the BT121

configured to work as chip select or address lines controlled by the application hardware. In the example below

a generic sensor chip is connected to the BT121 using the I2C 1 Alt 1 option.

Figure 21 Connecting to an I2C peripheral

SCL

SDA

Silicon Labs 31

Electrical characteristics

10.1 Absolute maximum ratings

Parameter

Min

Max

Unit

Storage temperature

-40

85

°C

VDD

-0.3

3.6

V

5V tolerant GPIO voltages

-0.3

5.5

V

Other terminal voltages

-0.3

VDD+0.3

V

Output current sourced or sunk by any GPIO pad

25

mA

Current on all GPIO pads combined

120

mA

Table 5 Absolute maximum ratings

10.2 Recommended operating conditions

Rating

Min

Max

Unit

Operating temperature range

-40

85

°C

VDD

2.2

3.6

V

VDD (when operating ADC or DAC)

2.4

3.6

V

Table 6 Recommend operating conditions

Silicon Labs 32

10.3 Logic signal characteristics

10.3.1 Digital I/O

Digital I/O pins

Min

Typ

Max

Unit

Input voltage levels

VIL input logic level low 1.7V ≤ VDD ≤ 3.6V

-0.3

-

0.3VDD

V

VIH input logic level high 1.7V ≤ VDD ≤ 3.6V

0.7 VDD

-

VDD + 0.3

V

Output voltage levels

VOL output logic level low, Vdd = 3.6 V, Iol = 7 mA

-

0.4

V

VOH output logic level high Vdd = 3.6 V, Ioh = -12 mA

VDD - 0.4

-

VDD

V

Table 7 Digital I/O pin electrical characteristics

10.3.2 Reset

Power-on Reset

Min

Typ

Max

Unit

Power on reset threshold (rising edge)

1.84

1.92

2.00

V

Power on reset threshold (falling edge)

1.80

1.88

1.96

V

RESET signal pulse width (pulled low)

1.5

-

ms

Table 8 Reset pin characteristics

10.3.3 ADC

Power-on Reset

Min

Typ

Max

Unit

ADC input impedance

-

50

kohm

ADC input voltage range

0

-

VDD

V

ADC differential nonlinearity error

-

0.7

1.3

LSB

ADC integral nonlinearity error

-

0.8

1.7

LSB

ADC offset error

-

1

2.8

LSB

ADC gain error

-

0.5

3

LSB

Table 9 ADC pin characteristics

Silicon Labs 33

10.3.4 DAC

Power-on Reset

Min

Typ

Max

Unit

DAC output load impedance

5

-

kohm

DAC output voltage range

0.2

-

VDD - 0.2

V

DAC differential nonlinearity

-

2

LSB

DAC integral nonlinearity

-

4

LSB

DAC offset error

-

12

LSB

DAC gain error

-

0.5

%

Table 10 DAC pin characteristics

Silicon Labs 34

10.4 Power consumption

Operation state

Current

Unit

Description

CPU active

14

mA

CPU active

RF idle

Power state 1 - RF idle

6.7

mA

CPU idle

RF idle

Power state 2 - RF idle

81

µA

CPU sleep

RF idle

Reset state

6-13

mA

Reset-signal held low

Continuous transmission -

BDR

92

mA

+12dBm, CPU active

Continuous transmission -

EDR

85

mA

+12dBm, CPU active

Table 11 Typical power consumption of different operating states

Operation state

Current

Unit

Description

Idle, not visible, not connectable

6.0

mA

Idle, visible, connectable

6.7

mA

Inquiry

38.7

mA

Connected, no data

11.1

mA

Connected, no data, sniff 1s

6.6

mA

Connected, continuous data

15.8

mA

115.2kbps over BGAPI

Connected, continuous data, 1s

sniff

7.2

mA

115.2kbps over BGAPI

Table 12 Typical power consumption, Classic Bluetooth (Master mode, CPU sleep disabled)

Operation state

Current

Unit

Description

Idle, visible, connectable

800

µA

Inquiry

33

mA

Connected, no data

5.1

mA

Silicon Labs 35

Connected, no data, sniff 1s

520

µA

Connected, continuous data

15.8

mA

115kbps over BGAPI*

Connected, continuous data,

sniff 1s

7.2

mA

115kbps over BGAPI*

Table 13 Typical power consumption, Classic Bluetooth (Master mode, CPU sleep enabled)

*sleep controlled by wakeup pin, in the constant UART data streaming test the CPU is not allowed to enter sleep

mode

Operation state

Current

Unit

Description

Advertising, not connectable

1.4

mA

108ms

Advertising, connectable

1.7

mA

108ms

Advertising, not connectable

242

µA

1000ms

Advertising, connectable

280

µA

1000ms

Table 14 Typical power consumption, Bluetooth Low Energy (CPU sleep enabled)

Silicon Labs 36

RF Characteristics

11.1 Supported frequencies and channels

Parameter

Min

Max

Unit

Frequency

2402

2480

MHz

Channels

0

78

CH #

Table 15 Supported frequencies and channels

11.2 Typical receiver sensitivity

Packet type

-40 to 85oC

Unit

DH1

-95

dBm

2DH1

-96

dBm

3DH3

-88

dBm

LE

-96

dBm

Table 16 Typical receiver sensitivity

11.3 Transmitter output power

Modulation type

Min

Typ

Max

Unit

BDR (1 Mbps)

10

12

14

dBm

EDR (2, 3 Mbps)

7

9

11

dBm

LE

5.5

7

8.5

dBm

Table 17 Transmitter output power at maximum setting

11.4 Carrier frequency accuracy

Parameter

Typ

Max

Bluetooth limit

(total error)

Unit

Variation between individual units

3

10

+/- 25

ppm

Variation with temperature (-40 to

+85oC)

9

15

+/- 25

ppm

Table 18 Carrier frequency accuracy

Silicon Labs 37

Physical dimensions

Figure 22 BT121 module physical dimensions

Figure 23 BT121 module recommended PCB pad pattern

Silicon Labs 38

The 8 center pins of the module are reserved for production programming and testing and should

be left unsoldered but despite of this unmasked traces and vias should NOT be placed under the

module in order to prevent short circuits.

Figure 24 BT121 module side view dimensions

Silicon Labs 39

Soldering recommendations

Bluegiga Bluetooth Smart Ready module BT121 is compatible with the industrial standard reflow profile for Pb-

free solders. The reflow profile to be used depends on the thermal mass of the entire populated application

PCB, heat transfer efficiency of the oven and on the particular type of solder paste used. Consult the datasheet

of the particular solder paste used for more detailed information regarding profile configurations.

The following recommendations for soldering the module are to ensure reliable solder joints and operation of

the module after soldering. Since the soldering profile used is process and layout dependent, the optimum

profile should be studied and decided case by case.

The following recommendation should be taken only as a starting point and should be adjusted according to

more detailed instructions of the solder paste and soldering equipment manufacturers.

• Check the recommended soldering profile configuration from the solder paste manufacturers

documentation.

• Avoid using more than one flow.

• Reliability of the solder joints and self-alignment of the component are dependent on the solder volume.

A minimum stencil thickness of 150 m is recommended.

• Aperture size of the stencil should be 1:1 with the pad size.

• A low residue, “no clean” solder paste should be used due to the low mounted height of the module.

• If the vias used on the application board have a diameter larger than 0.3 mm, it is recommended to

mask the via holes at the module side to prevent solder wicking through the via holes. Solders have a

habit of filling holes and leaving voids in the thermal pad solder junction, as well as forming solder balls

on the other side of the application board. These phenomena can in some cases cause problems.

Silicon Labs 40

13.1 Soldering profile example

As an example of a typical soldering profile please see an example of a generic example of a reflow profile

shown below. As stated in previous section soldering profiles are solder paste specific. Consult the manufacturer

of the paste used.

Figure 25 Reference reflow profile example

Silicon Labs 41

Tape and reel packaging

This section contains information regarding the tape and reel packaging and materials of packaging with

dimensions for the Bluegiga Bluetooth Smart Ready BT121 module.

14.1 Reel material and dimensions

• Reel material PS Conductive Black – surface resistance 103 ↔ 105

• Reel diameter 13”

• Reel color Black

Table 19 Reel dimensions

14.2 Tape material and dimensions

• Tape material PS Conductive Black – surface resistance 103 ↔ 105

Table 20 Tape dimensions

Symbol

Dimensions [mm]

D0

330.2

D1

100.0

W1

24.0

Symbol

Dimensions [mm]

P0

4.0

P1

16.0

D3

1.5

A0

11.3

B0

14.2

K0

2.7

W0

24.0

T

0.3

Silicon Labs 42

14.3 Tape and reel box dimensions

Table 21 Tape and reel box dimensions

14.4 Module orientation in tape

Figure 26 Module orientation in tape and feed direction

Symbol

Dimensions [mm]

W1

338

W2

344

W3

44

Silicon Labs 43

Certifications

15.1 Bluetooth

The Bluetooth declaration ID for BT121 hardware is: D027374

The Bluetooth declaration ID for Bluetooth Smart Ready software is: D027373

15.2 CE

BT121 is in conformity with the essential requirements and other relevant requirements of the R&TTE Directive

(1999/5/EC). The official DoC is downloadable from the product web sites (www.silabs.com).

15.3 FCC

This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions:

(1) this device may not cause harmful interference, and

(2) this device must accept any interference received, including interference that may cause undesired

operation.

Any changes or modifications not expressly approved by Bluegiga Technologies could void the user’s authority

to operate the equipment.

FCC RF Radiation Exposure Statement:

This equipment complies with FCC radiation exposure limits set forth for an uncontrolled environment. End

users must follow the specific operating instructions for satisfying RF exposure compliance. This transmitter

meets both portable and mobile limits as demonstrated in the RF Exposure Analysis. This transmitter must not

be co-located or operating in conjunction with any other antenna or transmitter except in accordance with FCC

multi-transmitter product procedures.

As long as the condition above is met, further transmitter testing will not be required. However, the OEM

integrator is still responsible for testing their end-product for any additional compliance requirements required

with this module installed (for example, digital device emissions, PC peripheral requirements, etc.).

OEM Responsibilities to comply with FCC Regulations

The BT121 Module has been certified for integration into products only by OEM integrators under the following

conditions:

• The antenna(s) must be installed such that a minimum separation distance of 7 mm is maintained

between the radiator (antenna) and all persons at all times.

• The transmitter module must not be co-located or operating in conjunction with any other antenna or

transmitter except in accordance with FCC multi-transmitter product procedures.

As long as the two conditions above are met, further transmitter testing will not be required. However, the OEM

integrator is still responsible for testing their end-product for any additional compliance requirements required

with this module installed (for example, digital device emissions, PC peripheral requirements, etc.).

IMPORTANT NOTE: In the event that these conditions cannot be met (for certain configurations or co-location

with another transmitter), then the FCC authorization is no longer considered valid and the FCC ID cannot be

used on the final product. In these circumstances, the OEM integrator will be responsible for re-evaluating the

end product (including the transmitter) and obtaining a separate FCC authorization.

Silicon Labs 44

End Product Labeling

The BT121 module is labeled with its own FCC ID. If the FCC ID is not visible when the module is installed

inside another device, then the outside of the device into which the module is installed must also display a label

referring to the enclosed module. In that case, the final end product must be labeled in a visible area with the

following:

“Contains Transmitter Module FCC ID: QOQBT121”

or

“Contains FCC ID: QOQBT121

The OEM integrator has to be aware not to provide information to the end user regarding how to install or

remove this RF module or change RF related parameters in the user manual of the end product.

15.4 IC

This radio transmitter (IC: 5123A-BGTBT121) has been approved by Industry Canada to operate with the

embedded chip antenna. Other antenna types are strictly prohibited for use with this device.

This device complies with Industry Canada’s license-exempt RSS standards. Operation is subject to the

following two conditions:

(1) This device may not cause interference; and

(2) This device must accept any interference, including interference that may cause undesired operation of the

device

RF Exposure Statement

Exception from routine SAR evaluation limits are given in RSS-102 Issue5. BT121 meets the given requirements

when the minimum separation distance to human body is less than equal to 20 mm. RF exposure or SAR

evaluation is not required when the separation distance is 20 mm or more. If the separation distance is less than

20 mm the OEM integrator is responsible for evaluating the SAR.

OEM Responsibilities to comply with IC Regulations

The BT121 Module has been certified for integration into products only by OEM integrators under the following

conditions:

• The antenna(s) must be installed such that a minimum separation distance of 20 mm is maintained

between the radiator (antenna) and all persons at all times.

• The transmitter module must not be co-located or operating in conjunction with any other antenna or

transmitter.

As long as the two conditions above are met, further transmitter testing will not be required. However, the OEM

integrator is still responsible for testing their end-product for any additional compliance requirements required

with this module installed (for example, digital device emissions, PC peripheral requirements, etc.).

IMPORTANT NOTE: In the event that these conditions cannot be met (for certain configurations or co-location

with another transmitter), then the IC authorization is no longer considered valid and the IC ID cannot be used

on the final product. In these circumstances, the OEM integrator will be responsible for re-evaluating the end

product (including the transmitter) and obtaining a separate IC authorization

Silicon Labs 45

End Product Labeling

The BT121 module is labeled with its own IC ID. If the IC ID is not visible when the module is installed inside

another device, then the outside of the device into which the module is installed must also display a label

referring to the enclosed module. In that case, the final end product must be labeled in a visible area with the

following:

“Contains Transmitter Module IC: 5123A-BGTBT121”

or

“Contains IC: 5123A-BGTBT121

The OEM integrator has to be aware not to provide information to the end user regarding how to install or

remove this RF module or change RF related parameters in the user manual of the end product

15.4.1 IC (français)

Cet émetteur radio (IC : 5123A-BGTBT121) a reçu l'approbation d'Industrie Canada pour une exploitation avec

l'antenne puce incorporée. Il est strictement interdit d'utiliser d'autres types d'antenne avec cet appareil.

Le présent appareil est conforme aux CNR d’Industrie Canada applicables aux appareils radio exempts de

licence. L’exploitation est autorisée aux deux conditions suivantes :

1) l’appareil ne doit pas produire de brouillage;

2) l’utilisateur de l’appareil doit accepter tout brouillage radioélectrique subi, même si le brouillage est

susceptible d’en compromettre le fonctionnement.

Déclaration relative à l'exposition aux radiofréquences (RF)

Les limites applicables à l’exemption de l’évaluation courante du DAS sont énoncées dans le CNR 102, 5e

édition. L'appareil BT121 répond aux exigences données quand la distance de séparation minimum par rapport

au corps humain est inférieure ou égale à 20 mm. L'évaluation de l'exposition aux RF ou du DAS n'est pas

requise quand la distance de séparation est de 20 mm ou plus. Si la distance de séparation est inférieure à

20 mm, il incombe à l'intégrateur FEO d'évaluer le DAS.

Responsabilités du FEO ayant trait à la conformité avec les règlements IC

Le module BT121 a été certifié pour une intégration dans des produits uniquement par les intégrateurs FEO

dans les conditions suivantes :

• La ou les antennes doivent être installées de telle façon qu'une distance de séparation minimum de

20 mm soit maintenue entre le radiateur (antenne) et toute personne à tout moment.

• Le module émetteur ne doit pas être installé au même endroit ou fonctionner conjointement avec toute

autre antenne ou émetteur.

Dès lors que les deux conditions ci-dessus sont respectées, d'autres tests de l'émetteur ne sont pas

obligatoires. Cependant, il incombe toujours à l'intégrateur FEO de tester la conformité de son produit final vis-

à-vis de toute exigence supplémentaire avec ce module installé (par exemple, émissions de dispositifs

numériques, exigences relatives aux matériels périphériques PC, etc).

REMARQUE IMPORTANTE : S'il s'avère que ces conditions ne peuvent être respectées (pour certaines

configurations ou la colocation avec un autre émetteur), alors l'autorisation IC n'est plus considérée comme

valide et l'identifiant IC ne peut plus être employé sur le produit final. Dans ces circonstances, l'intégrateur FEO

aura la responsabilité de réévaluer le produit final (y compris l'émetteur) et d'obtenir une autorisation IC distincte.

Silicon Labs 46

Étiquetage du produit final

L'étiquette du module BT121 porte son propre identifiant IC. Si l'identifiant IC n'est pas visible quand le module

est installé à l'intérieur d'un autre appareil, l'extérieur de l'appareil dans lequel le module est installé doit aussi

porter une étiquette faisant référence au module qu'il contient. Dans ce cas, une étiquette comportant les

informations suivantes doit être collée sur une partie visible du produit final :

« Contient le module émetteur IC : 5123A-BGTBT121 »

ou

« Contient IC : 5123A-BGTBT121 »

L'intégrateur FEO doit être conscient de ne pas fournir d'informations à l'utilisateur final permettant d'installer

ou de retirer ce module RF ou de changer les paramètres liés aux RF dans le mode d'emploi du produit final.

15.5 MIC Japan

BT121 is certified in Japan with certification number 209-J00171.

Since September 1, 2014 it is allowed (and highly recommended) that a manufacturer who integrates a radio

module in their host equipment can place the certification mark and certification number (the same

marking/number as depicted on the label of the radio module) on the outside of the host equipment. The

certification mark and certification number must be placed close to the text in the Japanese language which is

provided below. This change in the Radio Law has been made in order to enable users of the combination of

host and radio module to verify if they are actually using a radio device which is approved for use in Japan.

当該機器には電波法に基づく、技術基準適合証明等を受けた特定無線設備を装着している。

Translation:

“This equipment contains specified radio equipment that has been certified to the Technical Regulation

Conformity Certification under the Radio Law.”

15.6 KC (South-Korea)

BT121 is certified in South-Korea with certification ID MSIP-CRM-BGT-BT121.

Silicon Labs 47

Ordering information

Product code

Description

BT121-A-V2

BT121 Bluetooth Smart Ready module with an integrated antenna.

Mass production version.

BT121-A-V2-iAP

BT121 Bluetooth Smart Ready module with an integrated antenna and Apple

iAP profile. This part number is only available to Apple MFI licenses.

Mass production version.

BT121-A-V1

BT121 Bluetooth Smart Ready module with an integrated antenna

Engineering sample. Not recommended for new designs.

BT121-A-V1-iAP

BT121 Bluetooth Smart Ready module with an integrated antenna and Apple

iAP profile. This part number is only available to Apple MFI licenses.

Engineering sample. Not recommended for new designs.

DKBT

Bluegiga Bluetooth Smart Ready Development kit

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intending to use the Silicon Labs products. Characterization data, available modules and peripherals, memory sizes and memory addresses refer to each specific device, and "Typical"

parameters provided can and do vary in different applications. Application examples described herein are for illustrative purposes only. Silicon Labs reserves the right to make changes

without further notice to the product information, specifications, and descriptions herein, and does not give warranties as to the accuracy or completeness of the included information.

Without prior notification, Silicon Labs may update product firmware during the manufacturing process for security or reliability reasons. Such changes will not alter the specifications or the

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